Integrated heat dissipation system of power supply host

Abstract

The invention discloses an integrated heat dissipation system of a power supply host, which belongs to the technical field of heat dissipation of the power supply host, and is characterized in that the integrated heat dissipation system comprises a shell, the inner wall of the shell is provided with a micro turbofan, the bottom of the micro turbofan is in bolted connection with a temperature control mechanism, and the inner wall of the shell is provided with a heat conduction assembly; the surface of the heat conduction assembly is in bolted connection with a semiconductor cooling mechanism, and the right side of the semiconductor cooling mechanism is bonded with a heat pipe, so that the problems of large noise, complex structure, high cost, poor universality and the like existing in an existing power supply host heat dissipation scheme which mainly adopts air cooling, liquid cooling and the like and can meet certain heat dissipation requirements are solved; a traditional heat dissipation mode, such as increasing the number of fans or a heat pipe heat conduction technology, has an effect, but has the defects of high power consumption, noise pollution, large size, unsuitability for small equipment and the like, lacks flexibility and is difficult to meet the efficient heat dissipation requirement of a compact electronic product.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of a power supply host, and in particular to an integrated heat dissipation system of a power supply host. Background Art

[0002] The heat dissipation technology of the power supply host is diverse and constantly developing. Traditional methods include natural convection and fan forced convection heat dissipation, each of which has its own applicable scenarios. However, with the advancement of technology, it can no longer meet the needs. In recent years, liquid cooling and heat pipe heat dissipation technologies have emerged, and new heat dissipation materials have also emerged. Heat dissipation technology is diversified and efficient, and has broad prospects in the future. Against this background, the present invention proposes an integrated heat dissipation system for the power supply host, which aims to solve the problems of low heat dissipation efficiency, complex structure, and inconvenient maintenance in the prior art. Through an integrated design, the system realizes the close integration of the heat dissipation component and the power supply host, which not only improves the heat dissipation efficiency, but also simplifies the structure of the heat dissipation system and reduces maintenance costs. In addition, the integrated heat dissipation system of the present invention also has good compatibility and can adapt to power supply hosts of different power and sizes, meeting the market demand for efficient and miniaturized power supply host heat dissipation solutions.

[0003] Traditional radiators are prone to dust when dissipating heat. After long-term use, dust accumulates inside, which will affect the internal parts of the host and the heat dissipation efficiency. The integrated heat dissipation system of the present invention is designed with a dust-proof structure to effectively prevent dust from entering the radiator. By optimizing the vent design of the radiator, the smoothness of air flow is increased, while the chance of dust intrusion is reduced. In addition, the surface of the radiator is treated with a special coating to further enhance the dust-proof effect, ensure the long-term and efficient operation of the radiator, and extend the service life of the power host.

[0004] The existing patent (Announcement No.: CN220820613U) discloses a computer host radiator, including a host body and a heat dissipation base, the front end and the lower end of the wing side of the host body are both provided with heat dissipation holes, and a No. 1 magnetic suction frame is fixedly arranged on the outer surface around the two heat dissipation holes, and a No. 2 magnetic suction frame is magnetically arranged at the front end of the two No. 1 magnetic suction frames. This device is used in conjunction with a suction fan, a filter cloth, a No. 1 magnetic suction frame, a No. 2 magnetic suction frame and a filter screen. When in use, the suction fan sucks air, and the wind body enters the heat dissipation hole through the filter screen and then passes through the host body into the protective box. The protective plate is internally provided with a filter cloth to block the dust in the wind body, and part of the dust outside is blocked on the filter screen. However, although the patent design solves the dust problem to a certain extent, its structure is complex, which increases the manufacturing cost and maintenance difficulty. In contrast, the integrated heat dissipation system of the present invention has obvious advantages in dust prevention and heat dissipation efficiency. Through the integrated design, the system not only simplifies the structure of the radiator, but also effectively improves the dust prevention performance through the optimized vent design and special coating treatment. In addition, this system has good compatibility and can adapt to power supply hosts of different power and sizes, which makes it have a wider range of applications in the market and meets the needs of more users.

[0005] In view of the above problems, existing patents have provided solutions, while the existing power host heat dissipation solutions mostly adopt air cooling, liquid cooling, etc., which can meet certain heat dissipation requirements, but have problems such as high noise, complex structure, high cost, and poor versatility. Although traditional heat dissipation methods such as increasing the number of fans or heat pipe heat conduction technology are effective, they bring disadvantages such as high power consumption, noise pollution, large volume and unsuitable for small devices, and lack of flexibility, making it difficult to meet the efficient heat dissipation requirements of compact electronic products. In view of these problems, the present invention proposes a new integrated heat dissipation system, which effectively solves the shortcomings of traditional heat dissipation methods through innovative heat dissipation materials and structural design. The system adopts advanced heat conduction materials and combines a unique heat sink layout to achieve efficient heat dissipation while maintaining a low noise level. In addition, the design of the system takes into account miniaturization and modularization, so that it can be easily integrated into power hosts of various sizes, thereby greatly improving its applicability and market competitiveness. By reducing the number of fans and optimizing the air duct design, the system also significantly reduces power consumption and reduces the impact on the environment. In short, the integrated heat dissipation system of the present invention not only ensures heat dissipation efficiency, but also takes into account cost control, maintenance convenience and environmental friendliness, providing a new direction for the development of power host heat dissipation technology.

[0006] To this end, an integrated heat dissipation system for a power supply host is proposed. Summary of the invention

[0007] The purpose of the present invention is to provide an integrated heat dissipation system for a power supply host, which can solve the existing power supply host heat dissipation solutions that mostly use air cooling, liquid cooling, etc., which can meet certain heat dissipation requirements, but have problems such as high noise, complex structure, high cost, and poor versatility. Although traditional heat dissipation methods such as increasing the number of fans or heat pipe heat conduction technology are effective, they bring disadvantages such as high power consumption, noise pollution, and large volume that is not suitable for small devices, and lack flexibility, making it difficult to meet the problem of efficient heat dissipation requirements of compact electronic products. The integrated heat dissipation system of this invention effectively improves the heat dissipation efficiency and significantly reduces the noise level by adopting a new type of heat dissipation material and an optimized heat dissipation structure design. The heat dissipation material in the system has high thermal conductivity and can quickly transfer heat from the heat source to the heat sink, and the layout of the heat sink is carefully designed to maximize the heat dissipation area and improve the heat dissipation efficiency. In addition, the system also adopts a modular design, so that the heat dissipation module can be easily integrated with other components of the power supply host, thereby adapting to power supplies of different sizes and shapes to meet the heat dissipation requirements of compact electronic products. By reducing the number of fans and optimizing the air duct design, this system not only reduces power consumption, but also reduces noise pollution to the environment, achieving a high-efficiency, low-noise, and low-power cooling solution.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an integrated heat dissipation system for a power supply host, comprising a shell, a micro-turbo fan is arranged on the inner wall of the shell, a temperature control mechanism is bolted to the bottom of the micro-turbo fan, a heat conduction component is arranged on the inner wall of the shell, a semiconductor cooling mechanism is bolted to the surface of the heat conduction component, a heat pipe is bonded to the right side of the semiconductor cooling mechanism, an electronic component is arranged on the inner wall of the shell, and a heat conductive silicone pad is bonded to the front side of the electronic component; the micro-turbo fan effectively discharges the internal heat through the airflow generated by its high-speed rotation, and the temperature control mechanism automatically adjusts the fan speed according to the feedback of the temperature sensor to achieve the best heat dissipation effect. The heat conduction component is made of a material with a high thermal conductivity coefficient to ensure that the heat can be quickly transferred from the electronic component to the shell, and the semiconductor cooling mechanism further reduces the heat transferred through the heat conduction component to achieve more efficient cooling. The heat pipe serves as a bridge connecting the semiconductor cooling mechanism and the shell. The working fluid inside it evaporates after absorbing heat at the hot end, transfers to the cold end through phase change, and then condenses to release heat, thereby realizing rapid heat transfer. The thermal conductive silicone pad on the front side of the electronic component ensures good contact between the electronic component and the shell, reduces thermal resistance, and improves the overall heat dissipation efficiency. The design of the entire system aims to provide an efficient, stable, and low-noise heat dissipation solution for the power host through the combination of multiple heat dissipation technologies.

[0009] The temperature control mechanism includes a control block, a temperature detector and a detection probe. The top of the detection probe is bolted to the bottom of the temperature detector, the top of the temperature detector is bolted to the bottom of the control block, and the top of the control block is bolted to the bottom of the micro-turbo fan. The control block has a built-in intelligent control chip, which can analyze the data provided by the temperature detector in real time and automatically adjust the fan speed according to the preset temperature threshold. When the detected temperature exceeds the set value, the control block will send an instruction to the fan to increase its speed, thereby improving the heat dissipation efficiency; conversely, when the temperature is lower than the set value, the control block will reduce the fan speed to reduce energy consumption and noise. The temperature detector uses a high-precision sensor to ensure the accuracy and response speed of temperature measurement, and the detection probe is responsible for transmitting the real-time temperature of the electronic components to the temperature detector. The design of the entire temperature control mechanism ensures the intelligent response and efficient operation of the heat dissipation system, ensuring that the power supply host can maintain the best performance and stability under various working environments.

[0010] Preferably, the heat-conducting component includes a connecting tube and a heat-dissipating fin, the heat-dissipating fin is sleeved on the surface of the connecting tube, and the semiconductor cooling mechanism is sleeved on the surface of the connecting tube. The connecting tube of the heat-conducting component is usually made of a high thermal conductivity material, such as copper or aluminum, to ensure that heat can be quickly transferred from the heating element of the power supply host to the heat-dissipating fin. The shape and arrangement of the heat-dissipating fins are carefully designed to maximize the heat dissipation area and air circulation efficiency, thereby improving the heat dissipation performance. The semiconductor cooling mechanism utilizes the thermoelectric effect to absorb heat through the reverse flow of current, further enhancing the heat dissipation effect. This integrated heat dissipation system achieves precise control of the temperature of the power supply host and efficient heat dissipation by comprehensively applying a variety of heat dissipation technologies, ensuring the stability and reliability of the power supply host under long-term high-load operation.

[0011] Preferably, the semiconductor cooling mechanism comprises a heat-conducting block, a temperature control end and a semiconductor controller, wherein the semiconductor controller is electrically fused to the temperature control end, the left side of the temperature control end is bonded to the front side of the heat-conducting block, the right side of the temperature control end is bonded to the left side of the heat pipe, and the heat-conducting block is sleeved on the surface of the connecting pipe. The semiconductor controller is the core of the entire cooling mechanism, which adjusts the magnitude and direction of the current according to the signal fed back by the temperature control end, thereby controlling the intensity of the thermoelectric effect. The temperature control end is equipped with a highly sensitive temperature sensor, which can monitor the temperature change of the heat-conducting block in real time and transmit the data to the semiconductor controller. When it is detected that the temperature exceeds the preset threshold, the semiconductor controller will start the cooling program, and through the flow of reverse current, the heat-conducting block absorbs heat, thereby reducing the temperature of the power supply host. This intelligent control mechanism ensures that even when the ambient temperature is high or the power supply host is heavily loaded, it can respond quickly and maintain the normal operating temperature of the device.

[0012] Preferably, the surface of the heat pipe is sleeved with a limit assembly, and the rear side of the limit assembly is bolted to the inner wall of the shell. The function of the limit assembly is to ensure that the heat pipe remains stable during operation and prevent it from being displaced in a high temperature or vibration environment. By being tightly bolted to the inner wall of the shell, the limit assembly can effectively fix the position of the heat pipe, while allowing the heat pipe to expand and contract freely within a certain range to adapt to the physical size changes caused by temperature changes. In addition, the design of the limit assembly also takes into account the heat dissipation efficiency, and its material and structural design are intended to minimize the impact on the heat dissipation performance of the heat pipe, ensuring that the heat pipe can efficiently transfer heat from the power supply host to the shell, and then dissipate it into the environment through the shell. This design not only improves the reliability of the heat dissipation system, but also extends the service life of the power supply host.

[0013] Preferably, a fixing rod is bolted to the front side of the micro-turbo fan, and an insert is bolted to the front side of the fixing rod. The micro-turbo fan achieves a stable connection between the fan and the power supply host casing through the combination of the fixing rod and the insert. This design not only ensures the stability of the fan during operation, but also facilitates subsequent maintenance and replacement. The design of the insert allows the fan to be quickly disassembled when needed, while the fixing rod ensures that the fan will not be displaced due to vibration during operation, thereby ensuring the efficient operation of the fan and the overall performance of the cooling system. In addition, the structural design of the micro-turbo fan focuses on the principles of aerodynamics, achieving maximum air volume output with minimal noise and energy consumption, further improving the cooling efficiency and operating stability of the power supply host.

[0014] Preferably, a fixing bracket is plugged into the surface of the plug block, a mounting rod is bolted to the front side of the fixing bracket, and the front side of the mounting rod is bolted to the inner wall of the outer shell. This multi-level connection method ensures a firm connection between the fan assembly and the power host outer shell, while providing sufficient flexibility to accommodate outer shells of different sizes and shapes. The design of the fixing bracket not only increases the stability of the connection, but also allows the fan to be fine-tuned within a certain range to achieve optimal airflow distribution and heat dissipation effects. The provision of the mounting rod further strengthens the fixation of the fan assembly, ensuring that the fan will not be displaced due to vibration or impact during the operation of the power host, thereby maintaining the continuity and reliability of the heat dissipation efficiency. In addition, this structural design also facilitates the rapid replacement and maintenance of the fan, greatly reducing the complexity and cost of subsequent maintenance.

[0015] Preferably, the surface of the connecting pipe is bolted with an annular block, the rear side of the annular block is bolted with a connecting assembly, and the rear side of the connecting assembly is bolted to the inner wall of the shell. This design makes the connection between the connecting pipe and the shell more stable, and the setting of the annular block allows the connecting pipe to be fine-tuned within a certain range to meet the connection requirements of different lengths and angles. The addition of the connecting assembly further enhances the fixing effect of the connecting pipe and the shell, ensuring that the connecting pipe will not be displaced due to vibration or impact during the operation of the power host, thereby maintaining the overall stability and reliability of the heat dissipation system. In addition, this structural design also facilitates the rapid replacement and maintenance of the connecting pipe, greatly reducing the complexity and cost of subsequent maintenance. In the connecting assembly, a sealing ring is specially designed to ensure that the connection between the connecting pipe and the shell has good sealing performance. The use of the sealing ring effectively prevents the intrusion of air and dust, thereby protecting the internal electronic components from pollution and extending the service life of the power host. At the same time, the design of the sealing ring also reduces the decrease in heat dissipation efficiency caused by environmental factors, ensuring the efficient operation of the heat dissipation system. In addition, the material selection of the sealing ring takes into account high temperature resistance and aging resistance to adapt to the long-term stable operation of the power host in different working environments.

[0016] Preferably, the right side of the housing is bolted with a limit frame, and the inner wall of the limit frame is plugged with a filter assembly. The filter assembly is composed of a multi-layer filter screen, which can effectively intercept dust and impurities and keep the internal air clean. This design not only improves the service life of the fan, but also ensures the stable operation of the internal circuit of the power supply host. The existence of the limit frame makes the installation and replacement of the filter assembly simple and quick, and the user can easily perform daily cleaning and maintenance work, thereby extending the service life of the entire heat dissipation system. At the front end of the power supply host, a detachable air inlet cover is designed, which is provided with a plurality of ventilation holes. The size and distribution of these ventilation holes are carefully designed to ensure the smoothness of air circulation while reducing the entry of dust and particulate matter. The detachability of the air inlet cover allows the user to easily clean the ventilation holes to prevent dust accumulation from affecting the heat dissipation effect. In addition, the edge of the cover is designed with a sealing strip to ensure that it fits tightly with the housing in the closed state, prevent air leakage, and further improve the heat dissipation efficiency. At the rear end of the heat dissipation system, the housing of the power supply host is designed with an air outlet, and its design also takes into account the optimization of air flow. The shape and position of the air outlets have been calculated to ensure that hot air can be discharged quickly while reducing the thermal impact on the surrounding environment. The edges of the air outlets are also sealed to prevent air backflow and ensure effective heat dissipation.

[0017] Overall, the design of this integrated cooling system takes into account cooling efficiency, maintenance convenience, and long-term reliability, providing an efficient and stable cooling solution for the power host. The material selection of the cooling system has also been carefully considered, using high-temperature resistant and corrosion-resistant alloy materials to cope with the heat generated by the power host during long-term operation and possible chemical erosion. In addition, the shape and arrangement of the heat sink are optimized to maximize the heat dissipation area and improve the heat exchange efficiency. The use of the heat sink and the fan ensures that the power host can remain in a suitable operating temperature range even under high-load working conditions. The design concept of the overall cooling system is simple and efficient, which not only meets the performance requirements but also takes into account cost control, making this integrated cooling system an ideal choice for the power host.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. This application sets a temperature control mechanism and uses the aluminum alloy shell to absorb the heat. The high-performance DC brushless motor micro-turbo fan starts in time under the precise monitoring and control of the temperature control mechanism. With the help of thermal conductive silicone pads and heat pipes to transfer heat, it can quickly take away the heat of the circuit board, improve the heat dissipation efficiency, and allow the power supply host to run at low temperature when fully loaded, extending the life. It also optimizes the heat dissipation design, reduces noise, simplifies installation, enhances product portability and compatibility, and adapts to a variety of power supply hosts; the aluminum alloy shell used in the heat dissipation system not only has good thermal conductivity, but also its lightweight characteristics help to reduce the overall weight, making the power supply host more portable. At the same time, the corrosion resistance of the aluminum alloy shell also improves the durability of the heat dissipation system and adapts to various harsh working environments. The use of a DC brushless motor micro-turbo fan not only increases the speed and air volume of the fan, but also reduces wear and noise due to its brushless design, extending the service life of the fan, while maintaining a low operating noise, providing users with a quieter working environment. The combination of thermal conductive silicone pads and heat pipes ensures efficient heat transfer from the circuit board to the radiator, reduces thermal resistance, and improves heat dissipation efficiency, allowing the power supply host to maintain a low temperature even under high-load working conditions. The design of the overall cooling system takes into account the convenience of installation, allowing users to easily install the cooling system on different power supply hosts without complex tools or expertise, greatly improving product compatibility and user experience.

[0019] 2. This application sets a semiconductor cooling mechanism. The additional semiconductor cooling mechanism and the heat-conducting component can quickly cool down, make up for the shortcomings of traditional heat dissipation under extreme working conditions and high loads, achieve more precise temperature control, enhance the stability and reliability of the heat dissipation system, and ensure the efficient operation of the power supply host in a complex environment, reflecting the innovative trend of active regulation of heat dissipation technology. The introduction of the semiconductor cooling mechanism enables the heat dissipation system to respond quickly and effectively reduce the temperature of key components when facing high loads or extreme temperature conditions. This active cooling mechanism achieves dynamic temperature regulation by precisely controlling the current direction and size of the semiconductor material, thereby avoiding the hysteresis effect that may exist in traditional heat dissipation methods. In addition, the addition of the cooling mechanism not only improves the stability of the power supply host in a high temperature environment, but also reduces the performance fluctuations caused by temperature fluctuations, ensuring the performance consistency of the power supply host during long-term operation. Through this innovative heat dissipation technology, the integrated heat dissipation system of the power supply host can better adapt to the high requirements of modern electronic equipment for heat dissipation performance, providing users with a more stable and reliable power supply solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is an overall structural diagram of the integrated heat dissipation system of the power supply host of the present invention; Figure 2 A front view of the micro-turbo fan of the present invention; Figure 3 It is a structural diagram of the temperature control mechanism of the present invention; Figure 4 is a structural diagram of the fixing frame of the present invention; Figure 5 It is a structural diagram of the limiting assembly of the present invention; Figure 6 It is a structural diagram of the semiconductor cooling mechanism of the present invention; Figure 7 It is a structural diagram of the limiting frame of the present invention; Figure 8 It is a schematic diagram of the process of the integrated heat dissipation system of the power host of the present invention.

[0021] In the figure, 1. shell; 2. temperature control mechanism; 201. control block; 202. temperature detector; 203. detection probe; 3. semiconductor cooling mechanism; 301. heat conductive block; 302. temperature control end; 303. semiconductor controller; 4. heat conductive component; 401. connecting pipe; 402. heat dissipation fin; 5. micro turbo fan; 6. heat pipe; 7. electronic component; 8. thermal conductive silicone pad; 9. limit component; 10. fixing rod; 11. plug-in block; 12. fixing bracket; 13. mounting rod; 14. ring block; 15. connection component; 16. limit bracket; 17. filter component. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-8 , the present invention provides a technical solution: An integrated heat dissipation system for a power supply host comprises a shell 1, an inner wall of the shell 1 is provided with a micro-turbo fan 5, a temperature control mechanism 2 is bolted to the bottom of the micro-turbo fan 5, a heat conduction component 4 is provided on the inner wall of the shell 1, a semiconductor cooling mechanism 3 is bolted to the surface of the heat conduction component 4, a heat pipe 6 is bonded to the right side of the semiconductor cooling mechanism 3, an electronic component 7 is provided on the inner wall of the shell 1, and a heat conductive silicone pad 8 is bonded to the front side of the electronic component 7; The temperature control mechanism 2 includes a control block 201, a temperature detector 202 and a detection probe 203. The top of the detection probe 203 is hinged to the bottom of the temperature detector 202, the top of the temperature detector 202 is bolted to the bottom of the control block 201, and the top of the control block 201 is bolted to the bottom of the micro-turbo fan 5.

[0024] In this embodiment: by setting the temperature control mechanism 2, when the power supply host runs and causes the internal temperature to rise, the aluminum alloy shell 1 with an integrated molding and a thickness of about 1.5mm-2.0mm can quickly absorb and conduct heat, and the high-performance DC brushless motor micro-turbo fan 5 with a built-in diameter of 40mm and a rotation speed of up to 7000RPM is timely started under the precise monitoring and control of the temperature control mechanism 2 composed of the control block 201, the temperature detector 202 and the detection probe 203. With the help of the thermal conductive silicone pad 8, the electronic component 7 and the heat pipe 6 are tightly fitted. The heat pipe 6 transfers heat efficiently by virtue of its pure copper material and optimized design, thereby quickly taking away the heat accumulated on the electronic component 7, significantly improving the heat dissipation efficiency, so that the shell 1 can maintain a low temperature even under full load, extending the life of the equipment, and optimizing the overall heat dissipation design, reducing the noise level, simplifying the installation process, and improving the portability and compatibility of the product. It is suitable for power supply hosts of various specifications. By setting the semiconductor cooling mechanism 3, the additional semiconductor cooling mechanism 3 further improves the heat dissipation performance, which is connected with the thermal conductive group The effective cooperation of the components 4 can quickly cool down the temperature, effectively making up for the shortcomings of traditional heat dissipation methods under extreme working conditions or high loads, achieving more accurate temperature control, further enhancing the stability and reliability of the heat dissipation system, and providing a solid guarantee for the continuous and efficient operation of the housing 1 under complex environments. It also reflects the innovative development trend of heat dissipation technology in active regulation. When the power supply host starts to run, the internal electronic components 7 generate heat, and the aluminum alloy housing 1 quickly absorbs and conducts the heat generated by the internal electronic components 7. After the internal temperature of the aluminum alloy housing 1 rises, the built-in high-performance DC brushless motor micro-turbo fan 5 is started to accelerate air circulation and help heat dissipation. The thermal conductive silicone pad 8 fits tightly on the electronic component 7 to facilitate auxiliary heat conduction. The heat pipe 6 can conduct heat and further disperse the heat. The semiconductor cooling mechanism 3 cooperates with the thermal conductive component 4 to further improve the heat dissipation efficiency and provide additional cooling capacity under extreme working conditions or high loads, so that the housing 1 can maintain a low operating temperature even when it is fully loaded.

[0025] Specifically, Figure 6 As shown, the heat-conducting component 4 includes a connecting tube 401 and a heat-dissipating fin 402 . The heat-dissipating fin 402 is sleeved on the surface of the connecting tube 401 , and the semiconductor cooling mechanism 3 is sleeved on the surface of the connecting tube 401 .

[0026] Specifically, Figure 6 As shown, the semiconductor cooling mechanism 3 includes a heat conductive block 301, a temperature control end 302 and a semiconductor controller 303. The semiconductor controller 303 is electrically fused to the temperature control end 302. The left side of the temperature control end 302 is bonded to the front side of the heat conductive block 301. The right side of the temperature control end 302 is bonded to the left side of the heat pipe 6. The heat conductive block 301 is sleeved on the surface of the connecting pipe 401.

[0027] Specifically, Figure 5 As shown, a limiting component 9 is sleeved on the surface of the heat pipe 6 , and the rear side of the limiting component 9 is bolted to the inner wall of the housing 1 .

[0028] In this embodiment: the connecting pipe 401 of the heat conducting component 4 cooperates with the heat dissipating fins 402 to increase the contact area with the air, and can effectively dissipate heat to the surrounding environment, and the semiconductor cooling mechanism 3 is mounted on the connecting pipe 401, and the semiconductor controller 303 can be used to accurately adjust the temperature based on the feedback of the temperature control end 302, and the heat conducting block 301 can quickly conduct heat. The synergistic effect of the three further improves the overall heat dissipation efficiency, and the limiting component 9 on the surface of the heat pipe 6 ensures the stability of the heat pipe 6 during operation, prevents it from being displaced or damaged due to vibration or other external factors, and ensures the continuous and efficient operation of the heat dissipation system.

[0029] Specifically, Figure 3 , Figure 4 As shown, a fixing rod 10 is bolted to the front side of the micro-turbo fan 5 , and an insert block 11 is bolted to the front side of the fixing rod 10 .

[0030] Specifically, Figure 3 , Figure 4 As shown, a fixing frame 12 is inserted into the surface of the insert block 11 , a mounting rod 13 is bolted to the front side of the fixing frame 12 , and the front side of the mounting rod 13 is bolted to the inner wall of the housing 1 .

[0031] In this embodiment: the micro-turbo fan 5 is stably installed in the housing 1 through the connection between the fixing rod 10, the plug block 11, the fixing frame 12 and the mounting rod 13. It can not only effectively withstand the vibration and centrifugal force generated by the micro-turbo fan 5 when it runs at high speed, ensuring its smooth operation, but also facilitate the installation and disassembly of the micro-turbo fan 5, facilitate the maintenance and inspection of the equipment, and reduce maintenance costs and time.

[0032] Specifically, Figure 5 As shown, an annular block 14 is bolted to the surface of the connecting pipe 401 , a connecting assembly 15 is bolted to the rear side of the annular block 14 , and the rear side of the connecting assembly 15 is bolted to the inner wall of the housing 1 .

[0033] Specifically, Figure 7 As shown, a limit frame 16 is bolted to the right side of the housing 1 , and a filter assembly 17 is inserted into the inner wall of the limit frame 16 .

[0034] In this embodiment: the annular block 14 on the connecting pipe 401 is connected to the connecting component 15, which enhances the fixing strength and stability of the heat conducting component 4 in the outer shell 1. The limiting frame 16 on the right side of the outer shell 1 cooperates with the filter component 17. The filter component 17 can effectively block foreign matter such as dust and impurities from entering the heat dissipation system and prevent them from accumulating on components such as the heat dissipation fins 402 and the heat pipes 6, thereby reducing the risk of heat dissipation performance degradation and equipment failure due to dust accumulation, and extending the maintenance cycle and service life of the equipment.

[0035] Working principle: During the use of the shell 1, by setting the temperature control mechanism 2, when the power supply host is running and the internal temperature rises, the aluminum alloy shell 1 with an integrated molding and a thickness of about 1.5mm-2.0mm can quickly absorb and conduct heat, and the built-in high-performance DC brushless motor micro-turbo fan 5 with a diameter of 40mm and a rotation speed of up to 7000RPM is timely started under the precise monitoring and control of the temperature control mechanism 2 composed of the control block 201, the temperature detector 202 and the detection probe 203. With the help of the thermal conductive silicone pad 8, the electronic component 7 and the heat pipe 6 are tightly fitted. The heat pipe 6 transfers heat efficiently by virtue of its pure copper material and optimized design, thereby quickly taking away the heat accumulated on the electronic component 7, significantly improving the heat dissipation efficiency, so that the shell 1 can maintain a low temperature even under full load, extending the life of the equipment, and at the same time optimizing the overall heat dissipation design, reducing the noise level, simplifying the installation process, and improving the portability and compatibility of the product, and being suitable for shells 1 of various specifications. By setting the semiconductor cooling mechanism 3, the additional semiconductor cooling mechanism 3 further improves the heat dissipation performance, which is achieved through Effective cooperation with the heat-conducting component 4 can achieve rapid cooling, effectively make up for the shortcomings of traditional heat dissipation methods under extreme working conditions or high loads, achieve more accurate temperature control, further enhance the stability and reliability of the heat dissipation system, and provide a solid guarantee for the continuous and efficient operation of the housing 1 under complex environments. It also reflects the innovative development trend of heat dissipation technology in active regulation. When the power supply host starts to run, the internal electronic components 7 generate heat, and the aluminum alloy housing 1 quickly absorbs and conducts the heat generated by the internal electronic components 7. After the internal temperature of the aluminum alloy housing 1 rises, the built-in high-performance DC brushless motor micro-turbo fan 5 is started to accelerate air circulation and help heat dissipation. The thermal conductive silicone pad 8 fits tightly on the electronic component 7 to facilitate auxiliary heat conduction. The heat pipe 6 can conduct heat and further disperse the heat. The semiconductor cooling mechanism 3 cooperates with the heat-conducting component 4 to further improve the heat dissipation efficiency and provide additional cooling capacity under extreme working conditions or high loads, so that the housing 1 can maintain a low operating temperature even when it is fully loaded.

[0036] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated heat dissipation system for a power supply host, comprising a housing (1), characterized in that: The inner wall of the housing (1) is provided with a micro-turbo fan (5), the bottom of the micro-turbo fan (5) is bolted with a temperature control mechanism (2), the inner wall of the housing (1) is provided with a heat conduction component (4), the surface of the heat conduction component (4) is bolted with a semiconductor cooling mechanism (3), the right side of the semiconductor cooling mechanism (3) is bonded with a heat pipe (6), the inner wall of the housing (1) is provided with an electronic component (7), and the front side of the electronic component (7) is bonded with a heat conduction silicone pad (8); The temperature control mechanism (2) comprises a control block (201), a temperature monitor (202) and a detection probe (203); the top of the detection probe (203) is bolted to the bottom of the temperature monitor (202); the top of the temperature monitor (202) is bolted to the bottom of the control block (201); and the top of the control block (201) is bolted to the bottom of the micro-turbo fan (5).

2. The integrated heat dissipation system of a power supply host according to claim 1, characterized in that: The heat conduction component (4) comprises a connecting tube (401) and a heat dissipation fin (402); the heat dissipation fin (402) is sleeved on the surface of the connecting tube (401); and the semiconductor cooling mechanism (3) is sleeved on the surface of the connecting tube (401).

3. The integrated heat dissipation system of a power supply host according to claim 2, characterized in that: The semiconductor cooling mechanism (3) comprises a heat conducting block (301), a temperature control end (302) and a semiconductor controller (303); the semiconductor controller (303) is electrically connected to the temperature control end (302); the left side of the temperature control end (302) is bonded to the front side of the heat conducting block (301); the right side of the temperature control end (302) is bonded to the left side of the heat pipe (6); and the heat conducting block (301) is sleeved on the surface of the connecting pipe (401).

4. The integrated heat dissipation system of a power supply host according to claim 1, characterized in that: A limiting component (9) is sleeved on the surface of the heat pipe (6), and the rear side of the limiting component (9) is bolted to the inner wall of the outer shell (1).

5. The integrated heat dissipation system of a power supply host according to claim 1, characterized in that: A fixing rod (10) is bolted to the front side of the micro-turbo fan (5), and an insert block (11) is bolted to the front side of the fixing rod (10).

6. The integrated heat dissipation system of a power supply host according to claim 5, characterized in that: A fixing frame (12) is inserted into the surface of the insert block (11), a mounting rod (13) is bolted to the front side of the fixing frame (12), and the front side of the mounting rod (13) is bolted to the inner wall of the housing (1).

7. The integrated heat dissipation system of a power supply host according to claim 3, characterized in that: An annular block (14) is bolted to the surface of the connecting pipe (401), a connecting assembly (15) is bolted to the rear side of the annular block (14), and the rear side of the connecting assembly (15) is bolted to the inner wall of the outer shell (1).

8. The integrated heat dissipation system of a power supply host according to claim 1, characterized in that: The right side of the housing (1) is bolted to a limiting frame (16), and the inner wall of the limiting frame (16) is plugged with a filter assembly (17).

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