Foldable circuit structure based on bi-material 3D printing and manufacturing method thereof

Abstract

The invention discloses a foldable circuit structure based on bi-material 3D printing and a manufacturing method thereof, and the method comprises the steps: dividing the foldable circuit structure into a plurality of circuit modules, and constructing a bi-material-based 3D printing model of each circuit module through computer aided design software; a magnet and an electronic element embedding groove are added in the 3D printing model, an optimal path of a circuit groove is planned by utilizing an improved Deckstra algorithm, and then a deformable area is designed by adopting a free form deformation three-dimensional structure design method; printing all circuit modules, respectively embedding magnets and electronic components into magnet and electronic component embedding grooves, and adding conductive materials in circuit grooves to connect circuits; the circuit modules are connected through the magnets to obtain a foldable circuit structure. According to the invention, traditional welding and assembling processes are simplified, modular expansion and function integration are supported, the method is widely applicable to wearable equipment, medical equipment and intelligent electronic products, and the method has high production efficiency, customizability and maintenance convenience.

Description

Technical Field

[0001] The present invention belongs to the technical field of additive manufacturing (3D printing), and relates to a foldable circuit structure and a manufacturing method thereof, and in particular to a foldable circuit structure and a manufacturing method thereof based on dual-material 3D printing. Background Art

[0002] With the development of human-computer interaction, smart wearables and flexible electronic products, how to integrate circuits and smart components into deformable flexible structures has become an important trend in the design of modern technology products. At present, most traditional flexible electronic products use processes such as laser cutting and electroplating, which require multiple complex steps in the production process, including precision welding, assembly and testing, which increases manufacturing costs and technical barriers.

[0003] Although existing manufacturing methods can achieve a certain degree of circuit integration and structural deformation, they still have the following limitations:

[0004] (1) Complex multi-process flow: It requires multiple steps, which is not only time-consuming but also requires extremely high processing precision;

[0005] (2) Limited material selection: It is difficult to combine soft and hard materials in the same product, resulting in insufficient mechanical properties or flexibility of the product;

[0006] (3) Difficult maintenance: Traditionally manufactured flexible electronic devices are often difficult to modularly disassemble and reuse. Summary of the invention

[0007] In order to solve the above technical problems, the present invention overcomes the shortcomings of the prior art and provides a foldable circuit structure based on dual-material 3D printing and a manufacturing method thereof. The method integrates flexible materials and rigid supports through dual-material 3D printing and modular design to achieve the structural strength and deformability of the product. The present invention covers four major steps: design, printing, embedding electronic components and assembly, which simplifies the production process of smart devices and has the advantages of high efficiency, modularity and low cost.

[0008] The technical solution adopted by the present invention is as follows:

[0009] A method for manufacturing a foldable circuit structure based on dual-material 3D printing, comprising the following steps:

[0010] S1. Divide the foldable circuit structure into several circuit modules, and construct a dual-material 3D printing model of each circuit module through computer-aided design software;

[0011] S2. Add magnets and electronic components to the 3D printed model of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slot, and then use the free form deformation 3D structure design method (FFD algorithm) to design the deformable area;

[0012] S3. Use dual-material 3D printing equipment to print all circuit modules according to the 3D printing model;

[0013] S4. embedding the magnet and the electronic component into the magnet and electronic component embedding grooves respectively, and adding conductive materials to the circuit groove to connect the circuit;

[0014] S5. Connect each circuit module through magnets to obtain a foldable circuit structure.

[0015] Furthermore, the optimal path of the circuit slot is planned by using the improved Dijkstra algorithm, and the specific steps are as follows:

[0016] 1) Convert the magnets and electronic components embedded in the slots into several nodes, select a node as the starting point, set the node initial distance, predecessor node and priority queue;

[0017] 2) Use Dijkstra algorithm to plan circuit slots and add a path crossing detection mechanism;

[0018] 3) If the path is detected to be crossed, the crossing processing strategy is executed; otherwise, the node shortest path information is updated;

[0019] 4) Adopt heuristic evaluation mechanism to guide the path to avoid intersection areas, and dynamically adjust the route weight according to the generated path to adapt to complex layout;

[0020] 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path.

[0021] Furthermore, the cross-processing strategy includes the following three strategies:

[0022] 1) Replan the route to avoid intersections;

[0023] 2) By increasing the weight of the cross path, the path is optimized in subsequent calculations;

[0024] 3) Layer the paths at the physical level and avoid crossing by setting different layers.

[0025] Furthermore, the path intersection detection mechanism is specifically as follows: each time the distance from the current node to the adjacent node is calculated, it is detected whether the new path and the existing path will intersect.

[0026] Furthermore, the deformable area is designed by using the free-form deformation three-dimensional structure design method, and the specific steps are:

[0027] 1) Select the target area that needs to be deformed in the 3D printing model and generate a control point grid in the target area;

[0028] 2) Define the multi-resolution influence range of the control point and set the weight of the control point;

[0029] 3) Set deformation parameters for control points and adjust deformation intensity and direction;

[0030] 4) Use interpolation algorithm to diffuse the displacement of control points to the entire target area, making the deformation smooth and natural;

[0031] 5) Dynamically adjust the weight of the control point so that the weight of the control point is dynamically updated according to the distance the control point moves;

[0032] 6) Set up a real-time feedback mechanism to display the deformation effect in real time.

[0033] Furthermore, in step S1, the design process of the 3D printing model also includes: designing the ratio of flexible materials and hard materials, and controlling the thickness and distribution of the materials through pixelation technology.

[0034] Furthermore, in step S2, the hard material is embedded into the flexible material by printing layer by layer, and the circuit groove, magnet and electronic component embedding groove are printed at the same time.

[0035] Furthermore, in step S3, the conductive material is conductive ink or conductive glue.

[0036] A foldable circuit structure based on dual-material 3D printing is manufactured using the above method.

[0037] Furthermore, in step S1, the design process of the 3D printing model also includes: designing the ratio of flexible materials and hard materials, and controlling the thickness and distribution of the materials through pixelation technology.

[0038] Furthermore, in step S2, the hard material is embedded into the flexible material by printing layer by layer, and the circuit groove, magnet and electronic component embedding groove are printed at the same time.

[0039] Furthermore, in step S3, the conductive material is conductive ink or conductive glue.

[0040] A foldable circuit structure based on dual-material 3D printing is manufactured using the above method.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] (1) Process simplification: By integrating the three steps of design, printing, and assembly into the 3D printing equipment, there is no need for complex processes such as welding and cutting, which greatly reduces the difficulty and cost of production.

[0043] (2) Combination of flexibility and rigidity: Using dual-material 3D printing technology, a rigid support structure is embedded on a flexible substrate, which not only ensures the flexible deformable function but also provides the necessary mechanical strength, making it suitable for complex application scenarios.

[0044] (3) Modular design: Through magnetic connection, the electronic components and circuit modules are detachable and reusable, with high scalability and maintainability, suitable for equipment with long-term use or functional expansion.

[0045] (4) Rapid response and customization: Users can quickly customize designs according to their needs. Through simple operations, they can customize and quickly produce intelligent products to meet personalized needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 This is a flow chart of a method for manufacturing a foldable circuit structure based on dual-material 3D printing in an embodiment of the present invention.

[0047] Figure 2 A schematic diagram of designing a software interface and planning magnet and electronic component embedding slots and circuit slots through CAD in an embodiment of the present invention.

[0048] Figure 3 It is a connection demonstration diagram of the deformation circuit in an embodiment of the present invention.

[0049] Figure 4 This is a flow chart of automated preparation of 3D printed models in an embodiment of the present invention.

[0050] Figure 5 This is a diagram of a practical application example of the foldable circuit structure in an embodiment of the present invention.

[0051] Figure 6 Schematic diagram showing different modules of the foldable circuit structure in an embodiment of the present invention.

[0052] Figure 7 The figure is a flowchart of manufacturing a foldable desk lamp according to an embodiment of the present invention. DETAILED DESCRIPTION

[0053] The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific examples.

[0054] The present invention provides a method for manufacturing a foldable circuit structure based on dual-material 3D printing, comprising:

[0055] S1. The foldable circuit structure is divided into several circuit modules, and a dual-material 3D printing model of each circuit module is constructed by computer-aided design software; the 3D printing model uses two types of materials, flexible material and hard material. During the model construction process, the ratio of flexible material and hard material is designed according to actual needs, and the material thickness and distribution are controlled by pixelation technology.

[0056] S2. Add magnets and electronic components to the 3D printed model of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slot, and then use the free-form deformation 3D structure design method to design the deformable area;

[0057] The optimal path of the circuit slot is planned by using the improved Dijkstra algorithm, and the specific steps are as follows:

[0058] 1) Convert the magnets and electronic components embedded in the slots into several nodes, select a node as the starting point, set the node initial distance, predecessor node and priority queue;

[0059] 2) Use Dijkstra algorithm to plan circuit slots and add a path crossing detection mechanism;

[0060] 3) If the path is detected to be crossed, the crossing processing strategy is executed; otherwise, the node shortest path information is updated;

[0061] 4) Adopt heuristic evaluation mechanism to guide the path to avoid intersection areas, and dynamically adjust the route weight according to the generated path to adapt to complex layout;

[0062] 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path.

[0063] The path intersection detection mechanism is specifically as follows: each time the distance from the current node to the adjacent node is calculated, it is detected whether the new path and the existing path will intersect.

[0064] The cross-processing strategy includes the following three strategies:

[0065] 1) Replan the route to avoid intersections;

[0066] 2) By increasing the weight of the cross path, the path is optimized in subsequent calculations;

[0067] 3) Layer the paths at the physical level and avoid crossing by setting different layers.

[0068] The method for designing a deformable region using a free-form deformation three-dimensional structure design method comprises the following specific steps:

[0069] 1) Select the target area that needs to be deformed in the 3D printing model and generate a control point grid in the target area;

[0070] 2) Define the multi-resolution influence range of the control point and set the weight of the control point;

[0071] 3) Set deformation parameters for control points and adjust deformation intensity and direction;

[0072] 4) Use interpolation algorithm to diffuse the displacement of control points to the entire target area, making the deformation smooth and natural;

[0073] 5) Dynamically adjust the weight of the control point so that the weight of the control point is dynamically updated according to the distance the control point moves;

[0074] 6) Set up a real-time feedback mechanism to display the deformation effect in real time.

[0075] S3. Use dual-material 3D printing equipment to print all circuit modules according to the 3D printing model; specifically: embed the hard material into the flexible material by layer-by-layer printing, and print out the circuit groove, magnet and electronic component embedding groove at the same time.

[0076] S4. embedding the magnet and the electronic component into the magnet and electronic component embedding grooves respectively, and adding conductive ink or conductive glue in the circuit groove to connect the circuit;

[0077] S5. Connect each circuit module through magnets to obtain a foldable circuit structure.

[0078] Example 1

[0079] A method for manufacturing a foldable circuit structure based on dual-material 3D printing, the flow chart of which is as follows Figure 1 As shown, the following steps are included:

[0080] S1. Figure 2As shown, the foldable circuit structure is divided into several circuit modules, and a dual-material 3D printing model of each circuit module is constructed through computer-aided design software (CAD). Magnets and electronic components are added to the 3D printing model of each circuit module, the circuit slot path is planned, and the deformable area is designed; wherein, the design process of the 3D printing model also includes: adjusting the ratio of flexible materials and hard materials according to specific needs, and controlling the material thickness and distribution through pixelation technology; after adding magnets and electronic components to the 3D printing model, the improved Dijkstra algorithm is used to plan the optimal path of the circuit slot to ensure that the circuits do not cross each other, and then the free-form deformation three-dimensional structure design method is used to design the deformable area according to needs. The above steps are all completed through automated design software. Through the automated design software, users can quickly input design parameters and model quantity, automatically generate a 3D printing model of a deformable structure, and directly output the slice file for printing through software calculation and optimization. The automated process simplifies the operation steps and is suitable for large-scale production and personalized customization. The automatic design flow chart is shown in Figure 3 shown.

[0081] The specific steps of using the improved Dijkstra algorithm to plan the optimal path direction of the circuit slot are as follows:

[0082] 1) Import module design drawing:

[0083] Import the design of the circuit module into Grasshopper to ensure the visualization of the layout of circuit slots and components.

[0084] Use CAD drawings or graphic files to define the start, end, and obstacle locations to help the Dijkstra algorithm identify constraints in path planning.

[0085] 2) Create nodes and connections:

[0086] The circuit slot path is divided into multiple nodes to represent key points on the path.

[0087] Connections (edges) are established between each node, and each edge is given a weight based on distance or path complexity.

[0088] 3) Initialize the weight matrix:

[0089] Use the Matrix tool in Grasshopper to set a weight matrix for each node and the edges between adjacent nodes.

[0090] Make sure the weight matrix reflects the distance of the path and the difficulty of circumventing obstacles to help the Dijkstra algorithm identify the optimal path.

[0091] 4) Set the start and end points:

[0092] By specifying the start and end nodes in GH, the starting and ending points of the circuit slot path are clearly defined.

[0093] Using GH's parameter component, the start and end nodes are passed to the calculation module of Dijkstra's algorithm.

[0094] 5) Implement Dijkstra's algorithm:

[0095] Import the optimized Dijkstra algorithm script component into Grasshopper, traverse the nodes in a loop, and calculate the shortest path.

[0096] For each node, check its weight (distance) to other adjacent nodes and update the shortest path information from the start point to the end point.

[0097] Integrate the path intersection detection mechanism into the algorithm: every time the path is updated, check whether the new path intersects with the existing path. If so, increase the weight of the path or recalculate it.

[0098] 6) Path optimization and adjustment:

[0099] By heuristic evaluation and dynamic adjustment of strategies, the path selection is ensured to avoid intersections and obstacles as much as possible.

[0100] The path weights are dynamically updated in GH, and the weights are adjusted according to the intersection of the paths to ensure that the generated paths are reasonable in terms of physical layout.

[0101] 7) Output the optimal path:

[0102] The resulting optimal path is exported to the curve or polyline component of GH for visualization in Rhino software.

[0103] Mark the location and direction of the circuit slot on the final path to ensure that the circuit design meets the requirements.

[0104] The cross-processing strategy includes the following three strategies:

[0105] 1) Replan the route to avoid intersections;

[0106] 2) By increasing the weight of the cross path, the path is optimized in subsequent calculations;

[0107] 3) At the physical level, avoid crossing by layering the wiring.

[0108] The method for designing a deformable region using a free-form deformation three-dimensional structure design method comprises the following specific steps:

[0109] 1) Select the target deformable area:

[0110] Select the area to be deformed from the imported model.

[0111] Use components such as "SubSurface" or "Cull Pattern" to extract the parts of the model that need to be deformed, ensuring that the FFD algorithm is only applied to this area.

[0112] 2) Generate control point grid:

[0113] Generates a grid of control points within the target area, which will be used to drive the deformation.

[0114] Use the "Divide Surface" or "Populate Geometry" component to divide the model surface into a uniform grid and generate control points. The density of control points can be adjusted according to the area size and deformation requirements.

[0115] 3) Define the multi-resolution influence range of the control point:

[0116] Set multi-resolution influence ranges of control points to achieve flexible deformation control at different scales.

[0117] Use the "Distance" component to calculate the distance from the control point to the model point, and set the weight according to the distance. The weight is high in the close range and low in the long distance range.

[0118] 4) Dynamically adjust the weight of control points:

[0119] The weights of the control points are adjusted dynamically to ensure that areas close to the control points are more significantly affected, while areas farther away are gradually affected less.

[0120] The script for optimizing the FFD algorithm described above recalculates the weights of the control points in each iteration so that the weights are dynamically updated based on the distance the control points move.

[0121] 5) Set deformation parameters:

[0122] Use the Number Slider component to set the deformation parameters such as translation, rotation or scaling for the control point.

[0123] Sliders allow real-time adjustment of deformation strength and direction, allowing for fine-grained control over deformation effects in subsequent operations.

[0124] 6) Apply interpolation to calculate deformation effect:

[0125] Using the interpolation algorithm, the displacement of the control point is diffused to the entire deformation area, ensuring that the influence of the control point achieves a smooth transition within the target area.

[0126] Using "Mesh Warp" in GH, the interpolation calculation between the control point positions and the model points is applied to the entire mesh to generate a continuous deformation effect.

[0127] 7) Realize real-time feedback mechanism:

[0128] By using the "Preview" component in GH, the deformation results are displayed in real time, allowing users to observe the effects instantly when adjusting control points.

[0129] Adjusting control points and slider parameters provides immediate feedback to the model, allowing users to instantly evaluate and fine-tune deformation effects.

[0130] 8) Export the deformation model:

[0131] Use "Bake" to save the final deformed model to Rhino software for further design or exporting 3D printing files.

[0132] Export the model to a format supported by 3D printing (such as STL) and complete the optimized deformation area design.

[0133] S2. Figure 4 As shown, dual-material 3D printing equipment is used to print all circuit modules according to the 3D printing model; specifically, the method includes: printing flexible materials (such as TPU, TPE, etc.) and hard materials (such as PLA, PETG, etc.) layer by layer, and embedding the hard materials into the flexible materials to achieve the elastic deformability and mechanical strength of the product. In this process, the circuit groove, magnet and electronic component embedding groove are also formed synchronously.

[0134] S3. After printing is completed, the magnets and electronic components are embedded in the magnet and electronic component embedding slots respectively, and conductive ink or conductive glue is added in the circuit slot to connect the circuit to realize the electrical function; the magnets are used for modular physical connection and circuit connection, and the modules are combined by magnetic force to realize the detachable and expandable functions.

[0135] S4. Connect each circuit module through magnets to obtain a foldable circuit structure. Each module is assembled into a complete system through magnetic connection to ensure stable connection of electrical and mechanical structures. According to needs, users can disassemble and replace different modules to achieve rapid expansion and customization of functions. Finally, functional testing is carried out to ensure that the product can still work normally under multiple deformation states.

[0136] The present invention simplifies the production process. By introducing dual-material 3D printing technology, the manufacturing process of deformable intelligent circuits is simplified, and the dependence on welding, cutting and other processes is reduced; the manufacturing efficiency and product performance are improved. By embedding hard materials in flexible materials, it is ensured that the product has sufficient mechanical strength while being flexible and deformable to adapt to a variety of application scenarios; the present invention designs a system based on magnetic module connection, so that the product can still be disassembled, assembled and expanded after the circuit is embedded, further improving the maintainability and scalability of the product; the present invention reduces manufacturing costs and simplifies the production process, so that non-professional users can also easily design and manufacture intelligent deformable electronic products, and has good popularity and market prospects.

[0137] like Figure 5 As shown, the present invention can be widely applied to the following specific scenarios:

[0138] 1. Smart desktop devices: By using deformable circuit design and modular installation, we can create products such as desktop lamps and smart speakers that can adapt to deformation, allowing users to adjust the shape of the device according to their needs.

[0139] 2. Wearable electronic devices: Embed sensors and displays in flexible circuits to create stretchable and bendable wearable devices such as smart bracelets and smart gloves to meet the personalized needs of different users.

[0140] 3. Medical and health equipment: Manufacture intelligent flexible medical equipment, combined with deformable design, to provide patients with personalized medical testing and rehabilitation products.

[0141] 4. Foldable electronic devices: Through modular assembly and folding design, smart players, mobile phones and other devices with portability and functional expandability are manufactured.

[0142] Example 2

[0143] like Figure 6-7 As shown, a fast folding desk lamp is manufactured based on the method in Example 1, and its manufacturing process includes the following steps:

[0144] a) Input model: The user inputs the file in the supported format (such as STL, STEP, etc.), such as Figure 2 (a);

[0145] b) Geometry analysis: read and generate the mesh data of the model to ensure that the attributes of each face and voxel are presented;

[0146] c) Slot generation: The user selects a point on the model surface and enters a radius. The system automatically uses Boolean operations (such as difference, intersection, etc.) to cut off a part of the model and create a slot. Figure 2 (b);

[0147] d) Circuit slot generation: When the user determines the position of the electronic components and the magnets, the system uses the Dijkstra algorithm to plan the optimal path and automatically generates a non-intersecting circuit slot path. This eliminates the need for users to manually design circuits, improving production efficiency. Figure 2 (c);

[0148] e) Deformable structure generation: When all slots are calculated, the user selects the position that needs to be deformed, and the system uses the FFD deformation algorithm to perform local or overall deformation control on the 3D geometry, such as Figure 2 (d);

[0149] f) Users design modules with different functions through software, including control module, output module, sensor module, energy supply module and deformation module. All modules are made by 3D printing. Figure 6 ;

[0150] g) Users can choose a paint pen or syringe to apply conductive ink in the circuit slots of each module, such as Figure 7 (c);

[0151] h) After the conductive ink dries, the user directly embeds the magnets and electronic components into the previously reserved slots, such as Figure 7 (d);

[0152] i) After that, you only need to assemble the required modules using magnets and then you can use them. Figure 7 (e).

[0153] Those skilled in the art will readily appreciate other embodiments of the present application after considering the description and practicing the contents disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The description and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the claims.

[0154] It should be understood that the present application is not limited to the calculation flow scheme described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is limited only by the attached claims.

Claims

1. A method for manufacturing a foldable circuit structure based on dual-material 3D printing, characterized in that: The following steps are involved: S1. Divide the foldable circuit structure into several circuit modules, and construct a dual-material 3D printing model of each circuit module through computer-aided design software; S2. Add magnets and electronic components to the 3D printed model of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slot, and then use the free-form deformation 3D structure design method to design the deformable area; S3. Use dual-material 3D printing equipment to print all circuit modules according to the 3D printing model; S4. embedding the magnet and the electronic component into the magnet and electronic component embedding grooves respectively, and adding conductive materials to the circuit groove to connect the circuit; S5. Connect each circuit module through magnets to obtain a foldable circuit structure.

2. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that: The optimal path of the circuit slot is planned by using the improved Dijkstra algorithm, and the specific steps are as follows: 1) Convert the magnets and electronic components embedded in the slots into several nodes, select a node as the starting point, set the node initial distance, predecessor node and priority queue; 2) Use Dijkstra algorithm to plan circuit slots and add a path crossing detection mechanism; 3) If the path is detected to be crossed, the crossing processing strategy is executed; Otherwise, update the node shortest path information; 4) Adopt heuristic evaluation mechanism to guide the path to avoid intersection areas, and dynamically adjust the route weight according to the generated path to adapt to complex layout; 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path.

3. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 2, characterized in that: The cross-processing strategy includes the following three strategies: 1) Replan the route to avoid intersections; 2) By increasing the weight of the cross path, the path is optimized in subsequent calculations; 3) Layer the paths at the physical level and avoid crossing by setting different layers.

4. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 2, characterized in that: The path intersection detection mechanism is specifically as follows: each time the distance from the current node to the adjacent node is calculated, it is detected whether the new path and the existing path will intersect.

5. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that: The method for designing a deformable region using a free-form deformation three-dimensional structure design method comprises the following specific steps: 1) Select the target area that needs to be deformed in the 3D printing model and generate a control point grid in the target area; 2) Define the multi-resolution influence range of the control point and set the weight of the control point; 3) Set deformation parameters for control points and adjust deformation intensity and direction; 4) Use interpolation algorithm to diffuse the displacement of control points to the entire target area, making the deformation smooth and natural; 5) Dynamically adjust the weight of the control point so that the weight of the control point is dynamically updated according to the distance the control point moves; 6) Set up a real-time feedback mechanism to display the deformation effect in real time.

6. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that: In step S1, the design process of the 3D printing model also includes: designing the ratio of flexible materials and hard materials, and controlling the thickness and distribution of the materials through pixelation technology.

7. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that: In step S2, the hard material is embedded into the flexible material by layer-by-layer printing, and the circuit groove, magnet and electronic component embedding groove are printed at the same time.

8. The method for manufacturing a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that: In step S3, the conductive material is conductive ink or conductive glue.

9. A foldable circuit structure based on dual-material 3D printing, characterized in that: Prepared by the method according to any one of claims 1 to 8.

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