Thin film capacitor and production method thereof

Abstract

The invention relates to a thin film capacitor and a production method, and relates to the field of capacitors. The plurality of capacitor cores are distributed in the cavity of the shell; the first annular polar plate is arranged on one side, far away from the bottom of the cavity, of the capacitor core and is used for connecting the capacitor core with the outside; the second annular polar plate is arranged on one side, close to the bottom of the cavity, of the capacitor core and is used for connecting the capacitor core with the outside; the heat dissipation plate is arranged on the side, away from the first annular polar plate, of the second annular polar plate and used for heat dissipation; and the glue injection piece is arranged in the cavity. The heat dissipation effect of the capacitor is improved.

Description

Technical Field

[0001] The present invention relates to the field of capacitors, and in particular to a film capacitor and a production method thereof. Background Art

[0002] A capacitor is an electronic component that can store electrical energy in an electric field. It consists of two conductors separated by an insulating medium and close to each other. It stores electrical energy by accumulating positive and negative charges on the two plates during the charging process and releases electrical energy during discharge.

[0003] At present, in the industrial field, especially with the rise of emerging industries such as new energy vehicles and smart grids, the use of capacitors is becoming more and more extensive, and the demand for capacitors is also increasing. The capacitor includes a shell, several capacitor cores for storing and releasing charges, and a connecting plate. The shell is preset with a cavity for placing the capacitor core, and the connecting plate is used to connect several capacitor cores. During the operation of the capacitor, the capacitor core generates heat, and the heat is transferred to the shell through the connecting plate for heat dissipation.

[0004] When the capacitor generates heat during operation, since the capacitor only relies on the outer shell to dissipate heat, when the capacitor runs for a long time, it is easy to cause slow heat dissipation, causing the temperature of the capacitor to become higher and higher. When the capacitor is in a high temperature environment, its performance will degrade and even cause accidents, and its safety is low. Summary of the invention

[0005] In order to improve the heat dissipation effect of a capacitor, the present invention provides a film capacitor and a production method.

[0006] In a first aspect, the present invention provides a thin film capacitor, which adopts the following technical solution: A film capacitor, comprising: A housing, pre-set with a cavity; A plurality of capacitor cores are provided and distributed in the cavity; A first annular electrode plate is arranged on a side of the capacitor core away from the bottom of the cavity; A second annular electrode plate is disposed on one side of the capacitor core close to the bottom of the cavity; A heat sink, disposed on a side of the second annular plate away from the first annular plate; A glue injection part is arranged in the cavity; The first annular plate and the second annular plate are both provided with a plurality of pins, a side of the first annular plate close to the second annular plate is provided with a plurality of fixing plates for fixing the pins, the inner side wall of the shell is provided with a plurality of placement grooves for placing the pins, and the outer side wall of the shell is provided with a plurality of heat dissipation grooves; A connecting plate connected to the heat sink is provided on one side of the first annular electrode plate close to the second annular electrode plate, a connecting groove for placing the connecting plate is provided on the second annular electrode plate, a plurality of fixing columns connected and fixed to the heat sink are provided on the connecting plate and the second annular electrode plate, a fixing hole for inserting and fixing the fixing column is provided on the heat sink, and a plate placement groove for placing the heat sink is provided on the outer shell.

[0007] By adopting the above technical solution, the first annular plate and the second annular plate respectively located on both sides of the capacitor core are connected to the outside world through pins, and heat is dissipated by means of a heat sink arranged on one side of the second annular plate. The heat dissipation groove on the circumferential outer wall of the shell can make the heat generated inside the capacitor dissipate and transfer to the outside more quickly, thereby enhancing the heat dissipation effect.

[0008] Optionally, several of the capacitor cores are arranged in a two-layer circular ring shape, and the first annular electrode plate and the second annular electrode plate are each provided with a plurality of U-shaped heat dissipation holes and circular heat dissipation holes for dissipating the heat of the capacitor cores, and the first annular electrode plate and the second annular electrode plate are each integrally provided with a plurality of welding strips for fixing the capacitor cores, and the U-shaped heat dissipation holes and the circular heat dissipation holes have corresponding welding strips, the capacitor core in the inner layer corresponds to the circular heat dissipation holes, and the capacitor core in the outer layer corresponds to two U-shaped heat dissipation holes.

[0009] By adopting the above technical solution, a number of capacitor cores are arranged in two layers of circular rings, a number of U-shaped and circular heat dissipation holes for heat dissipation of the capacitor cores are opened on the first annular plate and the second annular plate, and a number of welding strips for fixing the capacitor cores are integrally arranged, so that the U-shaped and circular heat dissipation holes correspond to the welding strips, and the welding strips realize the electrical connection between the first annular plate, the second annular plate and the capacitor core to ensure current conduction, reduce contact resistance, and enhance structural strength, assist heat conduction and facilitate heat dissipation, thereby realizing effective heat dissipation and firm fixation of the capacitor core.

[0010] Optionally, a central heat dissipation hole is provided on the first annular electrode plate and the second annular electrode plate, and the central heat dissipation hole is located between two adjacent U-shaped heat dissipation holes corresponding to the same capacitor core. Additional heat dissipation holes are provided on the first annular electrode plate and the second annular electrode plate, and the additional heat dissipation holes correspond to the gaps between adjacent capacitor cores. The first annular electrode plate is provided with a central positioning hole for the injection of the glue injection part and positioning.

[0011] By adopting the above technical solution, the first annular plate and the second annular plate are provided with a central heat dissipation hole and an additional heat dissipation hole, and the first annular plate is provided with a central positioning hole, which enhances the heat dissipation effect of the capacitor core, and provides positioning for the injection of the injection part through the central positioning hole. The heat dissipation holes on the first annular plate and the second annular plate accelerate heat convection and increase the heat dissipation area, thereby improving the heat dissipation efficiency of the capacitor, and improving the overall performance and assembly convenience.

[0012] In a second aspect, the present application provides a method for producing a thin film capacitor, which is applied to a thin film capacitor according to the first aspect, and adopts the following technical solution: Acquire capacitor benchmark information and production image information in a preset production area; Retrieving annular plate information based on capacitor reference information; Determine hole distribution information based on annular plate information; determining whether the production image information contains a preset stain feature; If the production image information contains a preset stain feature, the stain image is framed and selected according to the production image information; Determine a cutting adjustment position according to the hole position distribution information and the stain characteristics, and perform cutting based on the cutting adjustment position using a preset cutting and punching method to obtain the first annular electrode plate and the second annular electrode plate; If the production image information does not contain the preset stain features, the punching and cutting positions are determined according to the hole position distribution information, and cutting is performed based on the punching and cutting positions using a preset cutting and punching method to obtain the first annular electrode plate and the second annular electrode plate.

[0013] By adopting the above technical scheme, the annular electrode plate information is retrieved from the reference information to determine the hole distribution information and the type of punching, and then it is determined whether the production image information has stain characteristics. If there are stain characteristics, the cutting adjustment position is determined by analysis and the electrode plate is cut according to the preset cutting and punching method; if there are no stain characteristics, the punching cutting position is determined according to the hole distribution information and the first annular electrode plate and the second annular electrode plate are cut according to the preset cutting and punching method, ensuring that the first annular electrode plate and the second annular electrode plate can effectively assist the capacitor core in dissipating heat when the thin-film capacitor is subsequently formed, thereby improving the overall heat dissipation performance of the capacitor.

[0014] Optionally, a method for confirming the cutting adjustment position includes: Determine the stain position and stain area according to the stain image; Determine the amount of stain based on its location; Determine whether the number of stains is greater than 1; If the number of stains is greater than 1, the offset position is determined by a preset offset analysis method according to the hole position distribution information, and the offset position is used as the cutting adjustment position; If the number of stains is not greater than 1, determining the first electrode plate coverage and the first electrode plate punching position according to the hole position distribution information; Determining whether the stain area falls within the coverage of the first electrode plate; If the stain area falls within the coverage of the first electrode plate, the first electrode plate perforation area and the second electrode plate perforation area are determined according to the annular electrode plate information; Determining whether the stain area is smaller than the first plate perforation area; If the stain area is smaller than the first plate punching area, the cutting adjustment position is determined according to the stain position and the first plate punching position; If the stain area is not smaller than the first plate perforation area, the second cutting position is determined according to the judgment result of whether the stain area is smaller than the second plate perforation area and used as the cutting adjustment position or avoidance distance for control; If the stain area does not fall within the coverage of the first electrode plate, the punching position of the first electrode plate is used as the cutting adjustment position.

[0015] By adopting the above technical solution, the number of stains is analyzed. If the number of stains exceeds 1, the offset position is determined by offset analysis and used as the cutting adjustment position. If the number of stains is 1, the position and area of ​​the stains are analyzed, and it is selected to cover the stains and then continue punching or to adjust the punching position before continuing punching, to ensure that the punching position of the annular plate is accurate in the presence of stains, so that the subsequently assembled thin-film capacitor can effectively assist the capacitor core in heat dissipation with the help of these punchings, thereby maintaining good overall heat dissipation performance.

[0016] Optionally, the offset analysis method includes: Determine the comprehensive coverage of the plate, the punching distribution position and the hole distribution area according to the hole distribution information; Determine whether the stain location falls within the comprehensive coverage of the plate; If the stain position falls within the comprehensive coverage of the plate, the stain position is selected according to the stain area to obtain the stain selection position, and the stain positions other than the stain selection position are defined as the stain remaining position, the area corresponding to the stain selection position is defined as the stain selection area, and the area corresponding to the stain remaining position is defined as the stain remaining area; The punching distribution position is selected according to the stain selection area and the hole distribution area and used as the punching selection position; Calculate the distance between the rust selected position and the stain remaining position and use it as the rust separation distance value; Determine the remaining punching position according to the punching selected position and the distance value between the rust, and use the punching selected position and the remaining punching position as the cutting adjustment position; Determine the excess stain information according to the remaining position of the stain, the remaining position of the punch hole, and the remaining area of ​​the stain, and remove the stain using a preset stain removal method; If the stain position does not fall within the comprehensive coverage of the plate, the hole punching position is determined according to the hole distribution information, and the punching position is used as the cutting adjustment position.

[0017] By adopting the above technical solution, the offset analysis method is to improve the analysis of the rusted position and the position where the hole needs to be punched, so as to select the largest punching position that can cover the stain, and use this position as the cutting adjustment position for punching, so that the subsequent film capacitor can effectively assist the capacitor core to dissipate heat with the help of these punching holes, and maintain good overall heat dissipation performance.

[0018] Optional stain removal methods include: Retrieving the excess position and area of ​​the stain based on the excess stain information; Determine the type of excess stains based on production image information and excess stain locations; When the type of excess stain is a preset raised foreign body, the grinding position is determined according to the excess position of the stain; Controlling a preset grinding device to grind the grinding position; When the excess stain type is a preset rust type, the rust value is determined according to the excess stain area; Determine the laser value according to the rust value; Determine the removal path based on the excess location of the stain; Control the preset removal device to remove rust with the removal path and laser value.

[0019] By adopting the above technical solution, the type of excess stains is determined by producing image information. If it is a raised foreign body, it is ground; if it is rust, it is removed by laser, thereby achieving effective removal of different types of excess stains and effective treatment of different types of excess stains.

[0020] Optionally, the cutting and punching methods include: Determine the type of hole punching based on the annular plate information; Determine the circular hole cutting position, U hole cutting position and other hole cutting positions according to the punching type and punching position database; Determine the U-hole area and the circular hole area according to the punching type and the preset punching area database; Determine the number and length of U-hole welding bars according to the U-hole area; Determine the number and length of circular hole welding rods according to the circular hole area; Determine the number of U holes, circular holes and other holes based on the annular plate information; Determine the U-hole cutting path according to the U-hole welding bar position, the U-hole cutting position, the U-hole area, the number of U-holes, the number of round hole welding bars and the length of the round hole welding bars; Determine the circular hole cutting path according to the circular hole welding bar position, the circular hole cutting position, the circular hole welding bar length, the number of circular holes, the number of circular hole welding bars and the circular hole welding bar length; Determine the cutting paths of other holes according to the cutting positions of other holes and the number of other holes; The preset punching device is controlled to punch holes along a circular hole cutting path, a U hole cutting path and other hole cutting positions, and after the punching is completed, the hole is bent according to a preset bending method.

[0021] By adopting the above technical scheme, U-shaped heat dissipation holes, circular heat dissipation holes and other holes are cut in different paths, wherein the U-shaped heat dissipation holes and the circular heat dissipation holes have corresponding welding strips respectively, so as to realize precise punching processing of the annular plate, so that the hole distribution and specifications on the manufactured annular plate are reasonable, which can effectively assist the heat dissipation of the capacitor core, ensure that the film capacitor has good heat dissipation performance, and meet its heat dissipation needs during operation.

[0022] Optionally, the bending method includes: Retrieving model information based on capacitor reference information; Determine the bending position, bending angle and bending hardness according to the model information; Determine the bending force according to the bending angle and bending hardness; Controlling a preset bending device to bend the bending position with a bending force and a bending degree, and reacquiring production image information after bending; Determine whether the production image information contains a preset abnormal bending feature; If not, the bending is completed, and a preset clamping device is controlled to clamp the first annular electrode plate and the second annular electrode plate to a preset assembly area for assembly; If included, the split value is determined based on the production image information; Determine whether the crack value is less than a preset benchmark repair interval; If the crack value is less than the reference repair interval, the repair parameters are determined according to the crack value, and the preset welding device is controlled to perform repair with the repair parameters. After the repair, the preset clamping device is controlled to clamp the first annular electrode plate and the second annular electrode plate to a preset assembly area for assembly; If the crack value is not less than the reference repair interval, the preset clamping device is controlled to clamp the first annular electrode plate and the second annular electrode plate to a preset waste area.

[0023] By adopting the above technical solution, the bending parameters are determined according to the model information and the bending is performed. After bending, the production image information is reacquired. When there are abnormal bending features, the crack value is determined. When the crack value is less than the benchmark repair interval, the repair parameters are determined and the two plates are sent to the assembly area after welding and repair, thereby realizing effective control of the bending quality of the annular plates.

[0024] Optionally, the method further includes controlling a preset clamping device to clamp the first annular electrode plate and the second annular electrode plate to a preset assembly area for assembly: Controlling a preset welding device to weld the U-hole welding strip position and the circular hole welding strip position of the first annular electrode plate to the capacitor core; Controlling a preset manipulator to bring the second annular electrode plate into contact with the capacitor core, and obtaining assembly image information; Determine a spacing detection value according to the assembly image information; Determine the pin spacing value based on the annular plate information; Determine the spacing adjustment value according to the spacing detection value and the pin spacing value; Controlling a preset clamping device to rotate and adjust the second annular electrode plate by a spacing adjustment value; Controlling a preset welding device to weld the U-hole welding strip position and the circular hole welding strip position of the second annular electrode plate to the capacitor core; Obtaining a housing installation position of the housing and a heat sink top angle position of the heat sink; The housing assembly position is determined according to the housing installation position and the top angle position of the heat sink, and a preset clamping device is controlled to install and cover the housing at the housing installation position.

[0025] By adopting the above technical scheme, the welding device is controlled to weld the U-hole and the circular hole welding strip position of the first annular plate to the capacitor core, and then the second annular plate is abutted against the capacitor core by a manipulator to obtain assembly image information, and the spacing detection value is determined by the information, and the spacing adjustment value is determined in combination with the pin spacing value in the annular plate information. Finally, the second annular plate is rotated and adjusted according to this value, and the U-hole and the circular hole welding strip position are welded to the capacitor core, and the shell is installed and covered according to the shell installation position, thereby ensuring the structural stability of the capacitor and the reliability of the electrical connection, and laying a foundation for good heat dissipation and overall performance stability.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. When producing the plate, determine whether there are stains. If there are stains and the number or area is large, re-determine the punching position, punch and cover part of the stains to reduce the stain area. After punching and covering part of the stains, first determine the type of the remaining stains. If it is a raised foreign body, grind it, if it is rust, remove it with laser, so that the subsequent film capacitor can effectively assist the capacitor core to dissipate heat with the help of these punches, and maintain good overall heat dissipation performance; 2. After removing the stains, punch holes in different paths and bend them after punching, so as to improve the production quality of the capacitor and improve the heat dissipation effect after punching; 3. After the plate is manufactured, it is assembled with other components to complete the production of the film capacitor, thereby ensuring the structural stability and electrical connection reliability of the capacitor, laying the foundation for good heat dissipation and overall performance stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is an overall exploded schematic diagram of a thin film capacitor according to an embodiment of the present application; Figure 2 It is an exploded schematic diagram of a first annular plate and a second annular plate of a heat sink of a thin film capacitor according to an embodiment of the present application.

[0028] The names of the parts indicated by the numerical labels in the above drawings are as follows: 1. Shell; 2. Capacitor core; 3. First annular plate; 4. Second annular plate; 5. Heat sink; 6. Glue injection part; 7. Pin; 8. Fixing plate; 9. Placement groove; 10. Connecting plate; 11. Connecting groove; 12. Fixing column; 13. Fixing hole; 14. Plate placement groove; 15. U-shaped heat dissipation hole; 16. Circular heat dissipation hole; 17. Welding strip; 18. Center heat dissipation hole; 19. Additional heat dissipation hole; 20. Center positioning hole; 21. Heat dissipation groove. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] Reference Figure 1, the embodiment of the present application discloses a film capacitor, comprising: a housing 1, a capacitor core 2, a first annular plate 3, a second annular plate 4, and a heat sink 5. Several capacitor cores 2 are provided, evenly distributed in the cavity of the housing 1, and several capacitor cores 2 are arranged in two layers of annular shapes. The first annular plate 3 is arranged on one side of the capacitor core 2, and the second annular plate 4 is arranged on the side of the capacitor core 2 away from the first annular plate 3. Several fixing plates 8 are distributed in an annular manner on the side of the first annular plate 3 facing the second annular plate 4. The sides of the first annular plate 3 and the second annular plate 4 are provided with several pins 7 for connecting to the outside world. The pins 7 of the first annular plate 3 face the side away from the second annular plate 4. The pins 7 of the first annular plate 3 are welded to the fixing plate 8, and the pins 7 of the second annular plate 4 face the side of the first annular plate 3. The fixing plate 8 integrally provided on the first annular plate 3 facilitates the fixing of the pins 7. In this embodiment, 18 capacitor cores 2 are provided, 6 in the inner layer and 12 in the outer layer.

[0031] Reference Figure 1 and Figure 2 , U-shaped heat dissipation holes 15 and circular heat dissipation holes 16 are provided on the first annular plate 3 and the second annular plate 4 for dissipating heat from the capacitor core 2. The inner capacitor core 2 corresponds to the circular heat dissipation hole 16, and the outer capacitor core 2 corresponds to two U-shaped heat dissipation holes 15, thereby achieving heat dissipation of the capacitor core 2. The first annular plate 3 and the second annular plate 4 are both integrally provided with a plurality of welding strips 17 for fixing the capacitor core 2, and the U-shaped heat dissipation holes 15 and the circular heat dissipation holes 16 are both corresponding to welding strips 17, wherein one welding strip 17 corresponding to the U-shaped heat dissipation hole 15 is distributed on one side of the first annular plate 3 and the second annular plate 4 close to the edge, and the four welding strips 17 corresponding to the circular heat dissipation hole 16 are evenly spaced and distributed in the circular heat dissipation hole 16, thereby achieving an effective combination of heat dissipation and fixing functions. A plurality of central heat dissipation holes 18 are provided on the first annular plate 3 and the second annular plate 4, and the central heat dissipation hole 18 is located between two adjacent U-shaped heat dissipation holes 15 corresponding to the same capacitor core 2, further enhancing the heat dissipation effect. Several additional heat dissipation holes 19 are also provided on the two plates, and the additional heat dissipation holes 19 correspond to the gaps between adjacent capacitor cores 2. A central positioning hole 20 for positioning is provided in the middle of the first annular plate 3. In this embodiment, there are 6 circular heat dissipation holes 16, 24 U-shaped heat dissipation holes 15, 12 central heat dissipation holes 18, 6 additional heat dissipation holes 19, and 1 central positioning hole 20 on the first annular plate 3, and 26 U-shaped heat dissipation holes 15, 13 central heat dissipation holes 18, and 4 additional heat dissipation holes 19 on the second annular plate 4.

[0032] Reference Figure 1 and Figure 2A connecting plate 10 is integrally provided on one side of the first annular plate 3 close to the second annular plate 4, and the connecting plate 10 is L-shaped. A connecting groove 11 is provided on the second annular plate 4 for placing a vacant portion of the connecting plate 10 away from the first annular plate, and a plurality of fixing columns 12 are welded to the connecting plate 10 and the side of the second annular plate 4 away from the first annular plate 3. A fixing hole 13 is provided on the heat sink 5 for inserting the fixing column 12, so that the heat sink 5 is installed and fixed on the connecting plate 10 and the second annular plate 4. The heat sink 5 has a heat dissipation function to ensure that the heat generated by the capacitor during operation can be dissipated in time, thereby ensuring its stable performance.

[0033] Reference Figure 1 and Figure 2 The housing 1 is provided with a cavity for placing the capacitor core 2, the first annular plate 3 and the second annular plate 4. The housing 1 is also provided with a plate placement groove 14 for placing the heat sink 5. The plate placement groove 14 is connected to the cavity. Figure 1 and Figure 2 The circumferential inner wall of the housing 1 is provided with a plurality of placement grooves 9, which are used to place the pins 7 of the first annular plate 3 and the second annular plate 4. The circumferential outer wall of the housing 1 is provided with a plurality of heat dissipation grooves 21, which are arranged in sequence with the placement grooves 9. The heat dissipation grooves 21 and the placement grooves 9 can meet the placement requirements of the pins 7 and enhance the heat dissipation effect of the housing 1.

[0034] Reference Figure 1 and Figure 2 The injection piece 6 is injected into the cavity to fix and seal the internal components of the capacitor and enhance the stability and protection performance of the capacitor.

[0035] Based on the same inventive concept, an embodiment of the present invention provides a method for detecting a thin film capacitor, comprising: Step 100: Acquire capacitor reference information and production image information in a preset production area.

[0036] The capacitor reference information refers to the basic parameter information of the capacitor, which is obtained through pre-input. The capacitor reference information includes the annular plate information, model information, shell installation position and heat sink top angle position. The production area refers to the area where capacitors are produced. The production area should be pre-set by the staff. The production image information refers to the image in the production area, which is obtained through the camera preset in the production area.

[0037] Step 101: Retrieve annular plate information based on capacitor reference information.

[0038] The annular plate information refers to the parameter information of the first annular plate 3 and the second annular plate 4, and the annular plate information includes hole position distribution information, hole type, number of U holes, number of round holes, number of other holes, pin spacing value, first plate hole area, second plate hole area, pin length information and pin position information. The annular plate information is obtained by retrieving the annular plate information from the capacitor reference information.

[0039] Step 102: Determine hole distribution information according to the annular plate information.

[0040] The hole distribution information refers to the distribution information of the holes on the first annular plate 3 and the second annular plate 4. The hole distribution information includes the punching cutting position, the first plate coverage and the first plate punching position, the plate comprehensive coverage, the punching distribution position, the hole distribution area, the hole punching position and the number of each hole. The punching type refers to the type of hole on the first annular plate 3 and the second annular plate 4. The punching types include U-shaped heat dissipation holes, circular heat dissipation holes and other circular holes. There are two different sizes of holes in other circular holes. The hole distribution information and the punching type are obtained by retrieving the hole distribution information and the punching type from the annular plate information.

[0041] Step 103: Determine whether the production image information contains a preset stain feature.

[0042] The stain feature refers to the feature of stains on the surface when producing the first annular plate 3 and the second annular plate 4. The stain feature is preset by the staff. By judging whether the production image information contains the preset stain feature, it is determined whether punching and cutting can be performed directly.

[0043] Step 1030: If the production image information contains a preset stain feature, a stain image is selected according to the production image information.

[0044] The stain image refers to a photo of the stain. If the production image information contains a preset stain feature, it means that there is a stain that needs to be removed, and then the image that meets the stain feature is selected from the production image information by the stain feature, thereby obtaining the stain image.

[0045] Step 104: determining a cutting adjustment position according to the hole position distribution information and the stain characteristics, and performing cutting based on the cutting adjustment position with a preset cutting and punching method to obtain the first annular electrode plate 3 and the second annular electrode plate 4 .

[0046] The cutting adjustment position refers to the cutting position after the first annular plate 3 and the second annular plate 4 are cut and adjusted. The cutting adjustment position is determined by analyzing the hole position distribution information and the stain image. The method for confirming the cutting adjustment position is steps 200 to 305, and based on the cutting adjustment position, cutting is performed with a preset cutting and punching method to obtain the first annular plate 3 and the second annular plate 4. The cutting and punching method refers to the cutting method for punching holes in the first annular plate 3 and the second annular plate 4. The cutting and punching method is steps 500 to 509.

[0047] Step 1031: If the production image information does not contain the preset stain feature, the punching and cutting positions are determined according to the hole position distribution information, and the first annular electrode plate 3 and the second annular electrode plate 4 are cut based on the punching and cutting positions using a preset cutting and punching method.

[0048] The punching and cutting position refers to the position where the first annular plate 3 and the second annular plate 4 are punched and cut. If the production image information does not contain the preset stain feature, it means that there is no stain and the punching and cutting can be performed normally. Then, the punching and cutting position is retrieved from the hole position distribution information to obtain the punching and cutting position, and the first annular plate 3 and the second annular plate 4 are cut by the preset cutting and punching method based on the punching and cutting position.

[0049] In step 104, in order to further ensure the rationality of the cutting adjustment position, it is necessary to further analyze and calculate the cutting adjustment position. The method for confirming the cutting adjustment position includes: Step 200: Determine the stain position and stain area according to the stain image.

[0050] The stain position refers to the position of the stain identified in the production image information, and the stain position includes the positions corresponding to all stains. The stain area refers to the area of ​​the stain identified in the production image information, and the stain area includes the areas corresponding to all stain positions. A coordinate system is established in the copper busbar image, and the stain position and stain area are determined by the position and area covered by the stain feature in the coordinate system.

[0051] Step 201: Determine the number of stains according to the stain positions.

[0052] The number of stains is determined by analyzing and calculating the number of each stain in the stain position.

[0053] Step 202: Determine whether the number of stains is greater than 1.

[0054] By judging whether the number of stains is greater than 1, it is determined whether there are multiple stains.

[0055] Step 2020: If the number of stains is greater than 1, the offset position is determined according to the hole distribution information using a preset offset analysis method, and the offset position is used as the cutting adjustment position.

[0056] The offset position refers to the position corresponding to the offset from the original reference position when punching. If the number of stains is greater than 1, it means that there are multiple stains, then the offset position is determined by a preset offset analysis method according to the hole position distribution information, and the offset position is used as the cutting adjustment position. The offset analysis method refers to a method for offsetting the punching position from the original reference position due to the appearance of stains when punching. The offset analysis method is steps 300 to 305.

[0057] Step 2021: If the number of stains is not greater than 1, determine the first electrode plate coverage and the first electrode plate punching position according to the hole distribution information.

[0058] The first electrode plate coverage refers to the area covered by the production material of the first annular electrode plate 3 during the production process. The first electrode plate punching position refers to the position where the first annular electrode plate 3 needs to be punched during the production process. If the number of stains is not greater than 1, it means that there is only one stain, then the first electrode plate coverage and the first electrode plate punching position are retrieved from the hole position distribution information, thereby obtaining the first electrode plate coverage and the first electrode plate punching position.

[0059] Step 203: Determine whether the stain area falls within the coverage range of the first electrode plate.

[0060] By judging whether the stain area falls within the coverage range of the first electrode plate, it is determined whether the first annular electrode plate 3 is affected.

[0061] Step 2030: If the stain area falls within the coverage of the first electrode plate, the first electrode plate perforation area and the second electrode plate perforation area are determined according to the annular electrode plate information.

[0062] The first plate perforation area refers to the coverage area of ​​the U-shaped heat dissipation holes 15, the circular heat dissipation holes 16, the central heat dissipation holes 18, the additional heat dissipation holes 19 and the central positioning hole 20 on the first annular plate 3. The second plate perforation area refers to the coverage area of ​​the U-shaped heat dissipation holes 15, the central heat dissipation holes 18 and the additional heat dissipation holes 19 on the second annular plate 4. If the stain area falls within the coverage range of the first plate, it means that the stain has an impact on the production of the first annular plate 3, and the first plate perforation area and the second plate perforation area are retrieved through the annular plate information.

[0063] Step 204: Determine whether the stain area is smaller than the first plate perforation area.

[0064] By judging whether the stain area is smaller than the punching area of ​​the first electrode plate, it is determined whether the stain can be removed by punching.

[0065] Step 2040: If the stain area is smaller than the first plate hole area, the cutting adjustment position is determined according to the stain position and the first plate hole position.

[0066] If the stain area is smaller than the punching area of ​​the first electrode plate, it means that the stain can be covered by punching. Then, position analysis is performed based on the stain position and the punching position of the first electrode plate, and all punching areas are compared in size. The punching position that covers the stain the most is used as the cutting adjustment position.

[0067] Step 2041: If the stain area is not smaller than the first plate perforation area, determine the second cutting position based on the judgment result of whether the stain area is smaller than the second plate perforation area and use it as the cutting adjustment position or avoidance distance for control.

[0068] If the stain area is not smaller than the punching area of ​​the first electrode plate, it means that the stain is too large and cannot be covered by the punching. Then, based on the judgment result of whether the stain area is smaller than the punching area of ​​the second electrode plate, the second cutting position is determined and used as the cutting adjustment position or avoidance distance for control. The specific judgment method is steps 205 to 206.

[0069] Step 205: When the stain area is smaller than the second plate punching area, the second cutting position is determined according to the annular plate information, and the second cutting position is defined as the cutting adjustment position.

[0070] The second cutting position refers to the cutting position when the second annular plate 4 is punched. When the stain area is smaller than the punching area of ​​the second plate, it means that the hole position of the second annular plate 4 can cover the stain, and the second cutting position is retrieved through the annular plate information and defined as the cutting adjustment position.

[0071] Step 206: When the stain area is not smaller than the second plate perforation area, a preset offset analysis method is used for processing.

[0072] When the stain area is not smaller than the second plate hole area, it means that the hole of the second annular plate 4 cannot cover the stain, and the preset offset analysis method is used for processing.

[0073] Step 2031: If the stain area does not fall within the coverage of the first electrode plate, the punching position of the first electrode plate is used as the cutting adjustment position.

[0074] If the stain area does not fall within the coverage of the first electrode plate, it means that the stain does not affect the production of the electrode plate, and the punching position of the first electrode plate is used as the cutting adjustment position.

[0075] In step 206 and step 220, in order to cover a part of the stain by punching holes, it is necessary to further analyze and calculate the positions of the punching holes. The offset analysis method includes: Step 300: Determine the comprehensive coverage of the plate, the hole distribution positions and the hole distribution area according to the hole distribution information.

[0076] The plate comprehensive coverage refers to the area that the first annular plate 3 and the second annular plate 4 need to cover on the material. The hole distribution position refers to the distribution of all the holes that need to be punched. The hole distribution area refers to the area corresponding to all the hole repairs that need to be punched. The plate comprehensive coverage, hole distribution position and hole distribution area are retrieved from the hole distribution information.

[0077] Step 301: Determine whether the stain position falls within the comprehensive coverage of the electrode plate.

[0078] By judging whether the location of the stain falls within the comprehensive coverage of the plate, it is determined whether the stain needs to be removed.

[0079] Step 3010: If the stain position falls within the comprehensive coverage of the plate, the stain position is selected according to the stain area to obtain the stain selection position, and the stain position except the stain selection position is used as the stain remaining position, the area corresponding to the stain selection position is defined as the stain selection area, and the area corresponding to the stain remaining position is defined as the stain remaining area.

[0080] The stain selection position refers to the position selected for punching among the various stain positions. The stain selection area refers to the area corresponding to the stain at the position for punching. The stain remaining area refers to the area of ​​each stain position corresponding to the remaining stain positions after removing the stain selection position from the stain position. The stain remaining position refers to the stain position other than the stain selection position as the stain remaining position. If the stain position falls within the comprehensive coverage range of the plate, it means that the position of the stain has an impact on the production of the first annular plate 3 and the second annular plate 4. Then, the stain position is analyzed by the stain area to select the stain with the largest area within the punchable range, and the position corresponding to the stain with the largest area is taken as the stain selection position, and the stain position other than the stain selection position is taken as the stain remaining position, the area corresponding to the stain selection position is defined as the stain selection area, and the area corresponding to the stain remaining position is defined as the stain remaining area.

[0081] Step 302: Select the punching distribution position according to the stain selection area and the hole distribution area and use it as the punching selection position.

[0082] The punching selection position refers to the position that is re-selected for punching due to stains. The stain selection area and the hole distribution area are analyzed to select the punching position that can reduce the stain area the most, and this punching position is used as the punching selection position.

[0083] Step 303: Calculate the distance between the rust selected position and the stain remaining position and use it as the rust separation distance value.

[0084] The rust separation distance value refers to the distance between the rust selection position and the remaining stain position. The distance between the rust selection position and the remaining stain position is calculated to obtain the difference, and this difference is used as the rust separation distance value.

[0085] Step 304: Determine the remaining punching positions according to the punching selected positions and the rust distance value, and use the punching selected positions and the remaining punching positions as cutting adjustment positions.

[0086] The remaining punching position refers to the remaining punching position after the punching selection position is determined. The remaining punching position is obtained by analyzing and calculating the distance between the punching selection position and the rust, and the punching selection position and the remaining punching position are used as the cutting adjustment position.

[0087] Step 305: Determine the redundant stain information according to the residual stain position, the residual punching position, and the residual stain area, and remove the excess stain using a preset stain removal method.

[0088] Excess stain information refers to the area and position of the remaining stains except for the stains covered by the holes. The excess stain information includes the excess stain position and the excess stain area. The excess neural network model is obtained by the staff inputting different remaining stain positions, remaining hole positions, and remaining stain areas in advance and training. The different remaining stain positions, remaining hole positions, and remaining stain areas are input into the preset excess neural network model for training and analysis to obtain the excess stain information, and the stains are removed by the preset stain removal method. The stain removal method refers to a method for processing stains on the first annular plate 3 and the second annular plate 4. The stain removal method is steps 400 to 407.

[0089] Step 3011: If the stain position does not fall within the comprehensive coverage of the electrode plate, the hole punching position is determined according to the hole distribution information, and the punching position is used as the cutting adjustment position.

[0090] If the stain position does not fall within the comprehensive coverage of the electrode plate, it means that the stain will not affect the production of the first annular electrode plate 3 and the second annular electrode plate 4, then the hole punching position is retrieved through the hole distribution information, and the punching position is used as the cutting adjustment position.

[0091] In step 305, in order to prevent the stains from affecting the production of the capacitor, the stains on the plate need to be treated. The stain removal method includes: Step 400: Retrieve the excess stain position and excess stain area based on the excess stain information.

[0092] The excess stain position and the excess stain area are retrieved through the excess stain information, thereby obtaining the excess stain position and the excess stain area.

[0093] Step 401: Determine the type of excess stains based on the production image information and the excess stain positions.

[0094] The types of excess stains refer to the types of stains on the production materials. The types of excess stains include uneven raised foreign matter on the surface and rust on the surface. The types of excess stains corresponding to the stains in different production image information are stored in the type database. The type database is pre-set by the staff and will not be described here. The production image information corresponding to the excess position of the stain is input into the preset type database to obtain the types of excess stains.

[0095] Step 402: When the type of the excess stain is a preset protruding foreign body, the grinding position is determined according to the excess position of the stain.

[0096] Raised foreign matter refers to an object that appears higher than the normal surface at the excess stain position in the production image reflected by the production image information. The grinding position refers to the specific position where the raised foreign matter needs to be removed by the grinding process. When the excess stain type is the preset raised foreign matter, it means that an uneven raised foreign matter appears on the surface, and the excess stain position is used as the grinding position.

[0097] Step 403: Control a preset grinding device to grind the grinding position.

[0098] The grinding device is a surface grinder, which is pre-set by the staff. The grinding device is controlled to grind the grinding position to eliminate the protruding foreign matter.

[0099] Step 404: When the excess stain type is a preset rust type, a rust value is determined according to the excess stain area.

[0100] Rust type refers to the type of rust on the plate, and the rust type is preset by the staff. Rust value refers to the numerical index of the degree of surface rust. The rust database stores rust values ​​corresponding to different excess stain areas. The rust database is preset by the staff and will not be described here. When the excess stain type is the preset rust type, it means it is a stain, and the excess stain area is input into the preset rust database to obtain the rust value.

[0101] Step 405: Determine the laser value according to the rust value.

[0102] Laser value refers to the laser parameter for removing rust. The laser database stores the laser values ​​corresponding to different rust values. The laser database is pre-set by the staff and will not be described here. The rust value is input into the laser database to obtain the laser value.

[0103] Step 406: Determine a removal path according to the excess positions of the stains.

[0104] The removal path refers to the path for removing rust. The path neural network model is obtained by pre-inputting different excess stain positions and training by the staff. The excess stain positions are input into the preset path neural network model for training and analysis to obtain the removal path.

[0105] Step 407: Control the preset removal device to remove the rust using the removal path and laser value.

[0106] The removal device is a laser rust remover, which is pre-set by the staff. The laser rust remover is controlled to remove the rust on the plate with the removal path and laser value.

[0107] In step 104 and step 1031, in order to further complete the production of the capacitor plate, the cutting and punching method includes: Step 500: Determine the type of hole according to the annular plate information.

[0108] The punching type refers to the type of holes on the first annular plate 3 and the second annular plate 4, and the punching types include U-shaped heat dissipation holes, circular heat dissipation holes and other circular holes, and the other circular holes include central heat dissipation holes 18, additional heat dissipation holes 19 and central positioning holes 20. The hole distribution information and the punching type are obtained by retrieving the hole distribution information and the punching type from the annular plate information.

[0109] Step 501: Determine the circular hole cutting position, the U hole cutting position and the other hole cutting positions according to the punching type and the punching position database.

[0110] The punching position database stores the cutting positions corresponding to different punching types, including circular hole cutting positions, U-hole cutting positions and other hole cutting positions, which are determined by different punching types. The punching position database is pre-set by the staff. The circular hole cutting position refers to the cutting position of the circular heat dissipation hole on the first annular plate 3 and the second annular pole. The U-hole cutting position refers to the cutting position of the U-shaped heat dissipation hole on the first annular plate 3 and the second annular pole. Other hole cutting positions refer to the cutting positions of the center positioning hole 20, the additional heat dissipation hole 19 and the center heat dissipation hole 18 on the first annular plate 3 and the second annular pole.

[0111] Step 502: Determine the U-hole area and the circular hole area according to the punching type and a preset punching area database.

[0112] The punching area database stores the areas that need to be punched corresponding to different punching types, including U-hole area and circular hole area. U-hole area refers to the area that needs to be punched for a U-shaped heat dissipation hole. Circular hole area refers to the area that needs to be punched for a circular heat dissipation hole. Enter the punching type into the punching area database to obtain the U-hole area and circular hole area.

[0113] Step 503: Determine the number and length of the U-hole welding bars according to the U-hole area.

[0114] The number of U-hole welding strips refers to the number of welding strips 17 on the U-shaped heat dissipation hole. The U-hole welding strip 17 refers to the length of the welding strip 17 on the U-shaped heat dissipation hole. The number of U-hole welding strips and the length of U-hole welding strips corresponding to different U-hole areas are stored in the U-hole database. The U-hole database is pre-set by the staff and will not be described here. The U-hole area is input into the preset U-hole database to obtain the number of U-hole welding strips and the length of U-hole welding strips.

[0115] Step 504: Determine the number and length of the circular hole welding rods according to the circular hole area.

[0116] The number of circular hole welding strips refers to the number of welding strips 17 on the circular heat dissipation hole. The length of the circular hole welding strip refers to the length of the welding strip 17 on the circular heat dissipation hole. The circular hole database stores the number of circular hole welding strips and the length of circular hole welding strips corresponding to different circular hole areas. The circular hole database is preset by the staff and will not be described here. The circular hole area is input into the preset circular hole database to obtain the number of circular hole welding strips and the length of circular hole welding strips.

[0117] Step 505: Determine the number of U holes, the number of round holes, and the number of other holes according to the annular plate information.

[0118] The number of U holes refers to the number of U-shaped heat dissipation holes on the first annular plate 3 and the second annular plate 4. The number of round holes refers to the number of round heat dissipation holes on the first annular plate 3 and the second annular plate 4. The number of other holes refers to the number of other round holes on the first annular plate 3 and the second annular plate 4. The number of U holes, the number of round holes, and the number of other holes are retrieved through the annular plate information to obtain the number of U holes, the number of round holes, and the number of other holes.

[0119] Step 506: Determine the U-hole cutting path according to the U-hole welding bar position, the U-hole cutting position, the U-hole area, the number of U-holes, the number of round hole welding bars and the length of the round hole welding bars.

[0120] The U-hole cutting path refers to the cutting path when cutting a U-shaped heat dissipation hole. The U-hole cutting database stores U-hole cutting paths corresponding to different U-hole welding bar positions, U-hole cutting positions, U-hole areas, U-hole numbers, round hole welding bar numbers, and round hole welding bar lengths. The U-hole cutting database is pre-set by the staff and will not be described here. The U-hole welding bar position, U-hole cutting position, U-hole area, U-hole number, round hole welding bar number, and round hole welding bar length are input into the preset U-hole cutting database to obtain the U-hole cutting path.

[0121] Step 507: Determine the circular hole cutting path according to the circular hole welding bar position, the circular hole cutting position, the circular hole welding bar length, the number of circular holes, the number of circular hole welding bars and the circular hole welding bar length.

[0122] The circular hole cutting path refers to the cutting path when cutting a circular heat dissipation hole. The circular hole cutting database stores circular hole cutting paths corresponding to different circular hole welding bar positions, circular hole cutting positions, circular hole welding bar lengths, circular hole numbers, circular hole numbers, and circular hole welding bar lengths. The circular hole cutting database is pre-set by the staff and will not be described here. The circular hole welding bar position, circular hole cutting position, circular hole welding bar length, circular hole number, circular hole number, and circular hole welding bar length are input into the circular hole cutting database to obtain the circular hole cutting path.

[0123] Step 508: Determine other hole cutting paths according to other hole cutting positions and other hole quantities.

[0124] The other hole cutting path refers to the cutting path when cutting other circular holes. The other hole cutting database stores the other hole cutting paths corresponding to different other hole cutting positions and other hole numbers. The other hole cutting database is pre-set by the staff and will not be described here. The other hole cutting positions and other hole numbers are input into the preset other hole cutting database to obtain the other hole cutting paths.

[0125] Step 509: Control the preset punching device to punch holes along the circular hole cutting path, the U-hole cutting path and other hole cutting positions, and bend the holes according to the preset bending method after the punching is completed.

[0126] The punching device is a laser punching machine, which is pre-set by the staff. The laser punching machine is controlled to punch holes in a circular hole cutting path, a U-hole cutting path and other hole cutting positions, so as to obtain U-shaped heat dissipation holes, circular heat dissipation holes and other circular holes. After the punching is completed, the holes are bent in a preset bending method. The bending method refers to the production of the fixing plate 8 on the first annular plate 3. The bending method is steps 600 to 605.

[0127] In step 509, in order to further complete the production of the first annular plate 3 and the second annular plate 4 in the capacitor, the bending method includes: Step 600: Retrieve model information based on capacitor reference information.

[0128] The capacitor reference information includes the model information, so the model information is retrieved through the capacitor reference information.

[0129] Step 601: Determine the bending position, bending angle and bending hardness according to the model information.

[0130] The bending position refers to the position of the first annular plate 3 where a specific bending operation is required. The bending angle refers to the angle formed by the bending portion before and after the bending when the first annular plate 3 is bent. The bending hardness refers to the ability of the material to resist deformation during the bending operation. The model information includes the bending position, the bending angle and the bending hardness, so that the bending position, the bending angle and the bending hardness can be retrieved through the model information.

[0131] Step 602: Determine the bending force according to the bending angle and the bending hardness.

[0132] The bending force refers to the magnitude of the force required to make the object reach a specific bending angle and overcome the bending hardness of the object itself during the bending operation when manufacturing the first annular electrode plate 3. The bending forces corresponding to different bending angles and bending hardnesses are stored in the force database. The force database is pre-set by the staff and will not be described here. The bending angle and bending hardness are input into the preset force database to obtain the bending force.

[0133] Step 603: Control a preset bending device to bend the bending position with a bending force and a bending degree, and reacquire production image information after bending.

[0134] The bending device is a CNC bending machine, which is pre-set by the staff. The CNC bending machine is controlled to bend the bending position with a bending force and a bending degree, so as to obtain the fixing plate 8 of the first annular plate 3, and the production image information is re-obtained after bending.

[0135] Step 604: Determine whether the production image information contains a preset abnormal bending feature.

[0136] Abnormal bending features refer to the characteristic performance that does not meet the normal bending process requirements and quality standards of the capacitor plate. The abnormal bending features are preset by the staff. By judging whether the production image information contains the preset abnormal bending features, it is determined whether the bending is standard.

[0137] Step 6040: If not included, complete the bending, and control the preset welding device to weld the pin 7 to the first annular plate 3 and the second annular plate 4 respectively, and control the preset clamping device to clamp the first annular plate 3 and the second annular plate 4 to the preset assembly area for assembly.

[0138] The welding device is a welder, which is pre-set by the staff. The clamping device is a manipulator, which is pre-set by the staff. The assembly area refers to the area where the film capacitor is assembled, which is pre-set by the staff. The pin length information refers to the length of the pin 7 of the first annular plate 3 and the second annular plate 4. The pin position information refers to the welding position of the pin 7 of the first annular plate 3 and the second annular plate 4. If it is not included, it indicates the bending standard, then the bending is completed, the pin length information and the pin position information are retrieved according to the annular plate information, the pin 7 length of the first annular plate 3 and the second annular plate 4 is determined according to the pin length information, the welder is controlled to weld the welding strip 17 corresponding to the first annular plate 3 to the corresponding pin 7 welding position of the first annular plate 3, and the welder is controlled to weld the welding strip 17 corresponding to the second annular plate 4 to the corresponding pin 7 welding position of the second annular plate 4. After the welding is completed, the manipulator is controlled to clamp the first annular plate 3 and the second annular plate 4 to the preset assembly area for assembly.

[0139] Step 6041: If included, determine the split value based on the production image information.

[0140] The crack value refers to the degree of cracking after bending. The cracking database stores the cracking values ​​corresponding to the cracking states of different production image information. If it is included, it means that there is a problem after bending. The cracking state of the bending position in the production image information is analyzed, and the cracking state is input into the preset cracking database to determine the cracking value.

[0141] Step 605: Determine whether the crack value is less than a preset reference repair interval.

[0142] The reference repair interval refers to the numerical range within which cracks can be repaired after bending. The reference repair interval is preset by the staff. Whether the crack value is less than the preset reference repair interval is determined to determine whether the repair is possible.

[0143] Step 6050: If the crack value is less than the reference repair interval, the repair parameters are determined according to the crack value, and the preset welding device is controlled to perform repair with the repair parameters. After the repair, the preset clamping device is controlled to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset assembly area for assembly.

[0144] The repair parameter refers to the amount of solution used for repair. The repair parameters corresponding to different crack values ​​are stored in the repair database. The repair database is pre-set by the staff and will not be described here. If the crack value is less than the reference repair interval, it means that the repair is possible, and the crack value is entered into the preset repair database to obtain the repair parameters.

[0145] Step 6051: If the crack value is not less than the reference repair interval, control the preset clamping device to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset waste area.

[0146] The waste area refers to the area where discarded parts are placed, which is pre-set by the staff. If the crack value is not less than the reference repair interval, it means that it cannot be repaired, and the robot is controlled to clamp the first annular plate 3 and the second annular plate 4 to the preset waste area.

[0147] In step 6050, in order to further complete the production of the capacitor, the parts need to be assembled, and the step of controlling the preset clamping device to clamp the first annular electrode plate 3 and the second annular electrode plate 4 to the preset assembly area for assembly is also included: Step 700 : Control a preset welding device to weld the U-hole welding strip position and the round hole welding strip position of the first annular electrode plate 3 to the capacitor core 2 .

[0148] The welder is controlled to weld the U-hole welding strip position and the round hole welding strip position of the first annular electrode plate 3 to the capacitor core 2 .

[0149] Step 701: Control a preset robot arm to bring the second annular electrode plate 4 into contact with the capacitor core 2, and obtain assembly image information.

[0150] The assembly image information refers to a picture obtained by detecting the assembly area, and the assembly image information is obtained by a camera preset in the assembly area. The preset manipulator is controlled to place the second annular plate 4 and the capacitor core 2 in contact with each other, with the pins 7 spaced apart from each other, and the assembly image information is obtained through the camera.

[0151] Step 702: Determine a spacing detection value according to the assembly image information.

[0152] A coordinate system is established in the assembly image information, and the distance between the first annular plate 3 and the pins 7 in the second annular plate 4 in the coordinate system is analyzed to obtain a spacing, and the spacing is used as a spacing detection value.

[0153] Step 703: Determine the pin spacing value according to the annular plate information.

[0154] The pin spacing value refers to the standard spacing between the pins 7 in the first annular plate 3 and the second annular plate 4. The annular plate information includes the pin spacing value, so the pin spacing value is retrieved through the annular plate information.

[0155] Step 704: Determine a spacing adjustment value according to the spacing detection value and the pin spacing value.

[0156] The spacing adjustment value refers to the value that needs to be adjusted to the current spacing in order to make the actual spacing reach the pin spacing value. The difference between the spacing detection value and the pin spacing value is obtained by analyzing and calculating the spacing detection value and the pin spacing value, and this difference is defined as the spacing adjustment value.

[0157] Step 705: Control the preset clamping device to rotate and adjust the second annular electrode plate 4 according to the spacing adjustment value.

[0158] The robot is controlled to rotate and adjust the second annular electrode plate 4 according to the spacing adjustment value, so that the spacing between the pins 7 is adjusted until it reaches the required position.

[0159] Step 706 : Control a preset welding device to weld the U-hole welding strip position and the round hole welding strip position of the second annular electrode plate 4 to the capacitor core 2 .

[0160] The welder is controlled to weld the U-hole welding strip position and the round hole welding strip position of the second annular electrode plate 4 to the capacitor core 2 .

[0161] Step 707 : obtaining the housing installation position of the housing 1 and the heat sink vertex angle position of the heat sink 5 .

[0162] The shell installation position refers to the specific position where the shell 1 is installed and fixed, and the shell 1 is connected to the installation groove and the heat sink 5. The shell installation position is obtained by taking a photo of the shell 1 in real time through a camera preset in the assembly area, and the shell installation position is obtained by analyzing the preset fixed angle features of the shell 1. The fixed angle features of the shell 1 refer to the position and morphological features of the four fixed angles on the shell 1, and the fixed angle features of the shell 1 are pre-set by the staff. The top angle position of the heat sink refers to the specific position of the four top corners of the heat sink 5 in the product assembly space. The top angle position of the heat sink is obtained by taking a photo of the heat sink 5 in real time through a camera preset in the assembly area, and the top angle position of the heat sink is obtained by analyzing the position of the preset top angle features of the heat sink 5 in the picture. The top angle features refer to the position and morphological features of the four top corners on the heat sink 5, and the top angle features are pre-set by the staff.

[0163] Step 708: Determine the assembly position of the housing 1 according to the housing installation position and the top angle position of the heat sink, and control the preset clamping device to install and cover the housing 1 at the housing installation position.

[0164] The housing 1 assembly position refers to the specific position where the housing 1 is covered with the heat sink 5. The housing 1 assembly position is obtained by analyzing the four vertex angles of the heat sink and the mounting grooves of the housing installation position, and the manipulator is controlled to install and cover the housing 1 at the housing installation position, thereby completing the assembly.

[0165] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A film capacitor, characterized in that: include: The housing (1) is provided with a cavity; A plurality of capacitor cores (2) are provided and distributed in the cavity; A first annular electrode plate (3) arranged on a side of the capacitor core (2) away from the bottom of the cavity; A second annular electrode plate (4) is arranged on a side of the capacitor core (2) close to the bottom of the cavity; A heat sink (5) is arranged on a side of the second annular electrode plate (4) away from the first annular electrode plate (3); A glue injection part (6) is arranged in the cavity; The first annular plate (3) and the second annular plate (4) are both provided with a plurality of pins (7); a plurality of fixing plates (8) for fixing the pins (7) are provided on a side of the first annular plate (3) close to the second annular plate (4); a plurality of placement grooves (9) for placing the pins (7) are provided on the inner side wall of the housing (1); and a plurality of heat dissipation grooves (21) are provided on the outer side wall of the housing (1); A connecting plate (10) connected to the heat sink (5) is provided on one side of the first annular plate (3) close to the second annular plate (4); a connecting groove (11) for placing the connecting plate (10) is provided on the second annular plate (4); a plurality of fixing columns (12) connected and fixed to the heat sink (5) are provided on the connecting plate (10) and the second annular plate (4); fixing holes (13) for inserting and fixing the fixing columns (12) are provided on the heat sink (5); and a plate placement groove (14) for placing the heat sink (5) is provided on the housing (1).

2. A film capacitor according to claim 1, characterized in that: A plurality of the capacitor cores (2) are arranged in a two-layer annular shape; the first annular plate (3) and the second annular plate (4) are each provided with a plurality of U-shaped heat dissipation holes (15) and circular heat dissipation holes (16) for dissipating heat from the capacitor core (2); the first annular plate (3) and the second annular plate (4) are each integrally provided with a plurality of welding strips (17) for fixing the capacitor core (2); the U-shaped heat dissipation holes (15) and the circular heat dissipation holes (16) are each provided with corresponding welding strips (17); the capacitor core (2) in the inner layer corresponds to the circular heat dissipation hole (16), and the capacitor core (2) in the outer layer corresponds to two of the U-shaped heat dissipation holes (15).

3. A film capacitor according to claim 2, characterized in that: The first annular plate (3) and the second annular plate (4) are provided with a central heat dissipation hole (18), the central heat dissipation hole (18) being located between two adjacent U-shaped heat dissipation holes (15) corresponding to the same capacitor core (2); the first annular plate (3) and the second annular plate (4) are provided with additional heat dissipation holes (19), the additional heat dissipation holes (19) corresponding to the gaps between adjacent capacitor cores (2); the first annular plate (3) is provided with a central positioning hole (20) for the injection of the glue injection component (6) and for positioning.

4. A method for producing a film capacitor, characterized in that: Applicable to a film capacitor according to claim 3: Acquire capacitor benchmark information and production image information in a preset production area; Retrieving annular plate information based on capacitor reference information; Determine hole distribution information based on annular plate information; determining whether the production image information contains a preset stain feature; If the production image information contains a preset stain feature, the stain image is framed and selected according to the production image information; The cutting adjustment position is determined according to the hole position distribution information and the stain characteristics, and based on the cutting adjustment position, cutting is performed using a preset cutting and punching method to obtain the first annular electrode plate (3) and the second annular electrode plate (4); if the production image information does not contain the preset stain characteristics, the punching cutting position is determined according to the hole position distribution information, and based on the punching cutting position, cutting is performed using a preset cutting and punching method to obtain the first annular electrode plate (3) and the second annular electrode plate (4).

5. The method for producing a film capacitor according to claim 4, characterized in that: The method for confirming the cutting adjustment position includes: Determine the stain position and stain area according to the stain image; Determine the amount of stain based on its location; Determine whether the number of stains is greater than 1; If the number of stains is greater than 1, the offset position is determined by a preset offset analysis method according to the hole distribution information, and the offset position is used as the cutting adjustment position; If the number of stains is not greater than 1, determining the first electrode plate coverage and the first electrode plate punching position according to the hole position distribution information; Determining whether the stain area falls within the coverage of the first electrode plate; If the stain area falls within the coverage of the first electrode plate, the first electrode plate perforation area and the second electrode plate perforation area are determined according to the annular electrode plate information; Determining whether the stain area is smaller than the first plate perforation area; If the stain area is smaller than the first plate punching area, the cutting adjustment position is determined according to the stain position and the first plate punching position; If the stain area is not smaller than the first plate perforation area, the second cutting position is determined according to the judgment result of whether the stain area is smaller than the second plate perforation area and used as the cutting adjustment position or avoidance distance for control; If the stain area does not fall within the coverage of the first electrode plate, the punching position of the first electrode plate is used as the cutting adjustment position.

6. The method for producing a film capacitor according to claim 5, characterized in that: The offset analysis methods include: Determine the comprehensive coverage of the plate, the punching distribution position and the hole distribution area according to the hole distribution information; Determine whether the stain location falls within the comprehensive coverage of the plate; If the stain position falls within the comprehensive coverage of the plate, the stain position is selected according to the stain area to obtain the stain selection position, and the stain positions other than the stain selection position are defined as the stain remaining position, the area corresponding to the stain selection position is defined as the stain selection area, and the area corresponding to the stain remaining position is defined as the stain remaining area; The punching distribution position is selected according to the stain selection area and the hole distribution area and used as the punching selection position; Calculate the distance between the rust selected position and the stain remaining position and use it as the rust separation distance value; Determine the remaining punching position according to the punching selected position and the distance value between the rust, and use the punching selected position and the remaining punching position as the cutting adjustment position; Determine the excess stain information according to the remaining position of the stain, the remaining position of the punch hole, and the remaining area of ​​the stain, and remove the stain using a preset stain removal method; If the stain position does not fall within the comprehensive coverage of the plate, the hole punching position is determined according to the hole distribution information, and the punching position is used as the cutting adjustment position.

7. The method for producing a film capacitor according to claim 6, characterized in that: Stain removal methods include: Retrieving the excess position and excess area of ​​the stain based on the excess stain information; Determine the type of excess stains based on production image information and excess stain locations; When the type of excess stain is a preset raised foreign body, the grinding position is determined according to the excess position of the stain; Controlling a preset grinding device to grind the grinding position; When the excess stain type is a preset rust type, the rust value is determined according to the excess stain area; Determine the laser value according to the rust value; Determine the removal path based on the excess location of the stain; Control the preset removal device to remove rust with the removal path and laser value.

8. The method for producing a film capacitor according to claim 4, characterized in that: Cutting and punching methods include: Determine the type of hole punching based on the annular plate information; Determine the circular hole cutting position, U hole cutting position and other hole cutting positions according to the punching type and punching position database; Determine the U-hole area and the circular hole area according to the punching type and the preset punching area database; Determine the number and length of U-hole welding bars according to the U-hole area; Determine the number and length of circular hole welding rods according to the circular hole area; Determine the number of U holes, circular holes and other holes based on the annular plate information; Determine the U-hole cutting path according to the U-hole welding bar position, the U-hole cutting position, the U-hole area, the number of U-holes, the number of round hole welding bars and the length of the round hole welding bars; Determine the circular hole cutting path according to the circular hole welding bar position, the circular hole cutting position, the circular hole welding bar length, the number of circular holes, the number of circular hole welding bars and the circular hole welding bar length; Determine the cutting paths of other holes according to the cutting positions of other holes and the number of other holes; The preset punching device is controlled to punch holes along a circular hole cutting path, a U hole cutting path and other hole cutting positions, and after the punching is completed, the hole is bent according to a preset bending method.

9. The method for producing a film capacitor according to claim 8, characterized in that: Bending methods include: Retrieving model information based on capacitor reference information; Determine the bending position, bending angle and bending hardness according to the model information; Determine the bending force according to the bending angle and bending hardness; Controlling a preset bending device to bend the bending position with a bending force and a bending degree, and reacquiring production image information after bending; Determine whether the production image information contains a preset abnormal bending feature; If not, the bending is completed, and a preset clamping device is controlled to clamp the first annular electrode plate (3) and the second annular electrode plate (4) to a preset assembly area for assembly; If included, the split value is determined based on the production image information; Determine whether the crack value is less than a preset benchmark repair interval; If the crack value is less than the reference repair interval, a repair parameter is determined according to the crack value, a preset welding device is controlled to perform repair according to the repair parameter, and after the repair, a preset clamping device is controlled to clamp the first annular electrode plate (3) and the second annular electrode plate (4) to a preset assembly area for assembly; If the crack value is not less than the reference repair interval, a preset clamping device is controlled to clamp the first annular electrode plate (3) and the second annular electrode plate (4) to a preset waste area.

10. The method for producing a film capacitor according to claim 9, characterized in that: The method further comprises the step of controlling a preset clamping device to clamp the first annular plate (3) and the second annular plate (4) to a preset assembly area for assembly: Controlling a preset welding device to weld the U-hole welding strip position and the circular hole welding strip position of the first annular electrode plate (3) to the capacitor core (2); Controlling a preset manipulator to bring the second annular electrode plate (4) into contact with the capacitor core (2), and acquiring assembly image information; Determine a spacing detection value according to the assembly image information; Determine the pin spacing value based on the annular plate information; Determine the spacing adjustment value according to the spacing detection value and the pin spacing value; Controlling a preset clamping device to rotate and adjust the second annular electrode plate (4) according to the spacing adjustment value; Controlling a preset welding device to weld the U-hole welding strip position and the circular hole welding strip position of the second annular electrode plate (4) to the capacitor core (2); Obtaining the housing installation position of the housing (1) and the heat sink top angle position of the heat sink (5); The assembly position of the housing (1) is determined according to the housing installation position and the top angle position of the heat sink, and a preset clamping device is controlled to install and cover the housing (1) at the housing installation position.

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