Electronic component resin packaging device

By designing a resin packaging device for electronic components including conveyor belts, cleaning rollers, resin treatment systems and multi-motor auxiliary mechanisms, the problems of slow cooling speed and single function in the prior art are solved, and more efficient packaging and more flexible adaptability are achieved.

CN119965102AInactive Publication Date: 2025-05-09GUIZHOU TAIJINDA ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510177017.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2025-05-09
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing electronic component resin packaging devices have slow cooling speed and single functions, resulting in low packaging efficiency.

Method used

An electronic component resin packaging device including a device body, a packaging device and an auxiliary mechanism is designed. The device body realizes continuous packaging and cleaning of components through a conveyor belt and cleaning roller; the packaging device ensures the flowability and quality of the resin through a resin storage tank, a vacuum pump, agitating system and heating wire; the auxiliary mechanism enables the injection head to be packaged on components of different positions and sizes through multiple motors and screw systems.

Benefits of technology

It improves the packaging efficiency and cooling speed of components, enhances the applicability and flexibility of the device, and can adapt to components of different sizes and packaging needs.

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Abstract

The invention discloses an electronic component resin packaging device, and relates to the technical field of electronic component resin packaging, the electronic component resin packaging device comprises a device main body, the upper end of the device main body is provided with a packaging device, the packaging device is internally provided with an auxiliary mechanism, and the device main body comprises a cleaning roller, a transmission shaft and a conveyor belt; supporting legs are fixedly connected to the bottom end of the device body, a stand column is fixedly connected to the top of one end of the device body, a conveying roller is arranged in the conveying belt, and the two ends of the conveying roller are in shaft connection with the device body. By arranging the conveying belt, continuous packaging of components is facilitated, the components can automatically advance to the bottom of the injection head, packaging is facilitated, a first motor drives a third bevel gear to rotate, a conveying roller is driven to rotate, the conveying belt runs, the third bevel gear drives a transmission shaft to rotate, and the transmission shaft drives a cleaning roller to rotate; and the surface of the conveying belt is cleaned through a cleaning roller, and the use applicability of the device is improved.
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Description

Technical Field

[0001] The invention relates to the technical field of electronic component resin packaging, and in particular to an electronic component resin packaging device. Background Art

[0002] With the rapid development of electronic technology, electronic components have been widely used in various electronic devices. In order to protect electronic components from the influence of the external environment, such as humidity, dust, mechanical damage, etc., and to improve their electrical insulation and heat dissipation performance, it is usually necessary to encapsulate the electronic components. Resin encapsulation has become one of the common methods of electronic component encapsulation because of its advantages such as good sealing, insulation and chemical corrosion resistance.

[0003] Patent publication number CN111081602A discloses a resin packaging device for electronic components, including a base, a sealing box is fixedly installed on the top of the base, a loading box is fixedly installed on the top of the sealing box, a vacuum pump is fixedly installed on the left side of the sealing box, two electric push rods are fixedly installed on the top wall of the inner cavity of the sealing box, the bottoms of the two electric push rods are fixedly connected to the movable plate, and a flow pipe that penetrates the sealing box and extends to between the two electric push rods is fixedly installed on the bottom of the loading box.

[0004] In order to solve the problem of slow cooling speed of the existing packaging device, the existing technology is to set up a water tank, a water pump and a condenser, so that water can be pumped to the condenser, the condenser cools the water, and then transported to the inside of the workbench, which has a cooling effect on the workbench, thereby cooling the packaging box containing electronic components. However, the existing device has a relatively single function, which leads to the problem of low efficiency of the device during packaging. Summary of the invention

[0005] The object of the present invention is to provide a resin packaging device for electronic components to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is: A resin packaging device for electronic components comprises a device body, a packaging device is arranged at the upper end of the device body, and an auxiliary mechanism is arranged inside the packaging device.

[0007] The device body includes a cleaning roller, a transmission shaft, and a conveyor belt. The bottom end of the device body is fixedly connected to a support leg, the top of one end of the device body is fixedly connected to a column, a conveyor roller is arranged inside the conveyor belt, both ends of the conveyor roller are connected to the device body shaft, and one end of the device body is fixedly connected to a first motor.

[0008] Both ends of the cleaning roller are connected to the main shaft of the device, and one end is fixedly connected to the first bevel gear, the output shaft of the first motor is fixedly connected to the third bevel gear, one end of the third bevel gear is fixedly connected to the conveying roller, and both ends of the transmission shaft are fixedly connected to the second bevel gear, the bottom end of the transmission shaft is connected to the third bevel gear gear through the second bevel gear, and the cleaning roller is connected to the transmission shaft gear through the first bevel gear.

[0009] A further improvement of the technical solution of the present invention is that: a resin storage tank is fixedly connected to one point on the top of the packaging device, a vacuum pump is fixedly connected to another point on the top of the packaging device, an exhaust pipe is fixedly connected to the input end of the vacuum pump, and one end of the exhaust pipe is fixedly connected to the resin storage tank.

[0010] A further improvement of the technical solution of the present invention is that: a feed port is fixedly connected to the top of the resin storage tank, a second motor is fixedly connected to the center of the top of the resin storage tank, an output shaft of the second motor is fixedly connected to a stirring shaft, a stirring rod is fixedly connected to the upper end of the stirring shaft, and a heating wire is fixedly connected to the inner wall of the resin storage tank.

[0011] A further improvement of the technical solution of the present invention is that: an injection pump is fixedly connected to another point on the top of the packaging device, the input end of the injection pump is fixedly connected to a connecting tube, one end of the connecting tube is fixedly connected to a resin storage tank, and the output end of the injection pump is fixedly connected to a transmission tube.

[0012] A further improvement of the technical solution of the present invention is that a material delivery hose is fixedly connected to the bottom end of the transmission tube, a flow controller is fixedly connected to the bottom end of the material delivery hose, an injection head is fixedly connected to the bottom end of the flow controller, and a first slide is provided on the inner walls on both sides of the packaging device.

[0013] A further improvement of the technical solution of the present invention is that the auxiliary mechanism includes a third motor, a sliding rod, a movable seat, a mounting seat, and a lifting seat. The third motor is fixedly connected to the packaging device, and the output shaft of the third motor is fixedly connected to the first screw rod, one end of the first screw rod is connected to the shaft of the packaging device, and both ends of the sliding rod are fixedly connected to the packaging device.

[0014] A further improvement of the technical solution of the present invention is that: the first screw rod passes through the movable seat and is threadedly connected to the movable seat, the sliding rod passes through the movable seat and is movably connected to the movable seat, the outer diameter size of the movable seat and the inner diameter size of the first slideway match each other, the movable seat is movably connected to the packaging device through the first screw rod and the sliding rod, a fourth motor is fixedly connected to one end of the movable seat, a second slideway is provided on one side of the movable seat, the output shaft of the fourth motor is fixedly connected to the second screw rod, one end of the second screw rod is connected to the movable seat shaft, the second screw rod passes through the mounting seat and is threadedly connected to the mounting seat, the mounting seat is movably connected to the movable seat through the fourth motor, a third slideway is provided on one side of the mounting seat, and a fifth motor is fixedly connected to the top of the mounting seat.

[0015] A further improvement of the technical solution of the present invention is that: the output shaft of the fifth motor is fixedly connected to a third screw rod, the bottom end of the third screw rod is connected to the mounting seat shaft, the third screw rod passes through the lifting seat and is threadedly connected to the lifting seat, the lifting seat is movably connected to the mounting seat through the third screw rod, and one end of the injection head is fixedly connected to the lifting seat.

[0016] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art: 1. The present invention provides an electronic component resin packaging device, which adopts the cooperation of a device body, a supporting leg, a column, a cleaning roller, a first bevel gear, a transmission shaft, a second bevel gear, a conveyor belt, a conveyor roller, a third bevel gear, and a first motor. The conveyor belt is provided to facilitate the continuous packaging of components, so that the components can automatically move to the bottom of the injection head for easy packaging. The third bevel gear is driven to rotate by the first motor, which drives the conveyor roller to rotate and the conveyor belt to operate. The transmission shaft is driven to rotate by the third bevel gear, and the transmission shaft drives the cleaning roller to rotate. The surface of the conveyor belt is cleaned by the cleaning roller, thereby increasing the applicability of the device.

[0017] 2. The present invention provides a resin packaging device for electronic components, which adopts a packaging device, a resin storage tank, a feeding port, a second motor, a stirring shaft, a stirring rod, a heating wire, a vacuum pump, and an exhaust pipe. The resin storage tank can store the resin for packaging. The second motor drives the stirring shaft to rotate, which drives the stirring rod to stir the resin to prevent the local concentration of the resin from being too high and causing solidification. The resin storage tank is heated by the heating wire to reduce the viscosity of the resin, making it easier to flow and reducing the bubbles inside the resin. The gas generated by the heated resin can be extracted from the inside of the resin storage tank by the vacuum pump, and the inside of the resin storage tank can be evacuated to allow the bubbles in the resin to escape under the action of negative pressure, thereby facilitating the injection of the resin.

[0018] 3. The present invention provides an electronic component resin packaging device, which adopts the cooperation of an injection pump, a connecting pipe, a transmission pipe, a feed hose, a flow controller, and an injection head. The setting of the injection pump can extract the preheated resin in the resin storage tank and transport it to the injection head. The setting of the feed hose facilitates the transmission of the resin when the position of the injection head is adjusted. The setting of the flow controller can accurately control the flow of the resin, thereby facilitating the device to package electronic components with different packaging requirements.

[0019] 4. The present invention provides an electronic component resin packaging device, which adopts the cooperation of an auxiliary mechanism, a third motor, a first screw rod, a slide rod, a movable seat, a second slide, a fourth motor, a second screw rod, a mounting seat, a third slide, a fifth motor, a third screw rod, a lifting seat, and an ultraviolet irradiation lamp. The first screw rod is driven to rotate by the third motor to drive the movable seat to move left and right within the range of the first slide. The second screw rod is driven to rotate by the fourth motor to drive the mounting seat to move back and forth within the range of the second slide. The third screw rod is driven to rotate by the fifth motor to drive the lifting seat to rise and fall within the range of the third slide, so that the injection head can inject at any point within the range of motion, so that the device can package components of different sizes and packaging requirements, thereby increasing the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the main structure of the device of the present invention; Figure 3 It is a schematic diagram of the transmission shaft structure of the present invention; Figure 4 It is a schematic diagram of the internal structure of the resin storage tank of the present invention; Figure 5 It is a schematic diagram of the internal structure of the packaging device of the present invention; Figure 6 It is a schematic diagram of the lifting seat structure of the present invention.

[0021] In the figure: 1, device body; 11, support leg; 12, column; 13, cleaning roller; 14, first bevel gear; 15, transmission shaft; 16, second bevel gear; 17, conveyor belt; 18, conveyor roller; 19, third bevel gear; 110, first motor; 2, packaging device; 21, resin storage tank; 22, feed port; 23, second motor; 24, stirring shaft; 25, stirring rod; 26, heating wire; 27, vacuum pump; 28, exhaust pipe; 29, Injection pump; 210, connecting pipe; 211, transmission pipe; 212, feed hose; 213, flow controller; 214, injection head; 215, first slide; 3, auxiliary mechanism; 31, third motor; 32, first screw rod; 33, slide rod; 34, moving seat; 35, second slide; 36, fourth motor; 37, second screw rod; 38, mounting seat; 39, third slide; 310, fifth motor; 311, third screw rod; 312, lifting seat. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below in conjunction with embodiments: Example 1 like Figure 1-6 As shown, the present invention provides an electronic component resin packaging device, including a device body 1, a packaging device 2 is arranged at the upper end of the device body 1, an auxiliary mechanism 3 is arranged inside the packaging device 2, the device body 1 includes a cleaning roller 13, a transmission shaft 15, and a conveyor belt 17, the bottom end of the device body 1 is fixedly connected with a support leg 11, the top of one end of the device body 1 is fixedly connected with a column 12, a conveyor roller 18 is arranged inside the conveyor belt 17, both ends of the conveyor roller 18 are connected to the device body 1 axis, one end of the device body 1 is fixedly connected with a first motor 110, both ends of the cleaning roller 13 are connected to the device body 1 axis, and one end is fixedly connected with a first bevel gear 14, the output shaft of the first motor 110 is fixedly connected with a third bevel gear 19, and the third bevel gear One end of 19 is fixedly connected to the conveying roller 18, and the two ends of the transmission shaft 15 are fixedly connected with the second bevel gear 16. The bottom end of the transmission shaft 15 is gear-connected with the third bevel gear 19 through the second bevel gear 16. The cleaning roller 13 is gear-connected with the transmission shaft 15 through the first bevel gear 14. The continuous packaging of components is facilitated by setting the conveyor belt 17, so that the components can automatically move to the bottom of the injection head 214 for easy packaging. The third bevel gear 19 is driven to rotate by the first motor 110, which drives the conveying roller 18 to rotate and makes the conveyor belt 17 run. The transmission shaft 15 is driven to rotate by the third bevel gear 19, and the transmission shaft 15 drives the cleaning roller 13 to rotate. The surface of the conveyor belt 17 is cleaned by the cleaning roller 13, thereby increasing the applicability of the device.

[0023] Example 2 like Figure 1-6As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, a top point of the packaging device 2 is fixedly connected to a resin storage tank 21, another top point of the packaging device 2 is fixedly connected to a vacuum pump 27, an input end of the vacuum pump 27 is fixedly connected to an exhaust pipe 28, one end of the exhaust pipe 28 is fixedly connected to the resin storage tank 21, a top point of the resin storage tank 21 is fixedly connected to a feed port 22, a top center of the resin storage tank 21 is fixedly connected to a second motor 23, an output shaft of the second motor 23 is fixedly connected to a stirring shaft 24, an upper end of the stirring shaft 24 is fixedly connected to a stirring rod 25, and the inner wall of the resin storage tank 21 is fixedly connected to the inner wall of the resin storage tank 21. A heating wire 26 is fixedly connected, and the resin storage tank 21 can store the resin for packaging. The second motor 23 drives the stirring shaft 24 to rotate, driving the stirring rod 25 to stir the resin to prevent the local concentration of the resin from being too high and causing solidification. The resin storage tank 21 is heated by the heating wire 26, which can reduce the viscosity of the resin, making it easier to flow and reduce the bubbles inside the resin. The gas generated by the heated resin can be extracted from the inside of the resin storage tank 21 by the vacuum pump 27, and the inside of the resin storage tank 21 can be evacuated to allow the bubbles in the resin to escape under the action of negative pressure, thereby facilitating the injection of the resin.

[0024] Example 3 like Figure 1-6 As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, an injection pump 29 is fixedly connected to another point on the top of the packaging device 2, and the input end of the injection pump 29 is fixedly connected to a connecting pipe 210, one end of the connecting pipe 210 is fixedly connected to the resin storage tank 21, and the output end of the injection pump 29 is fixedly connected to a transmission pipe 211, and the bottom end of the transmission pipe 211 is fixedly connected to a feeding hose 212, and the bottom end of the feeding hose 212 is fixedly connected to a flow controller 213, and the bottom end of the flow controller 213 is fixedly connected to an injection head 214, and a first slide 215 is provided on the inner walls on both sides of the packaging device 2, and the preheated resin in the resin storage tank 21 can be extracted and transported to the injection head 214 through the setting of the injection pump 29, and the transmission of the resin when the position of the injection head 214 is adjusted is facilitated by the setting of the feeding hose 212, and the flow of the resin can be accurately controlled by the setting of the flow controller 213, so that the device can be convenient for packaging electronic components with different packaging requirements.

[0025] Example 4 like Figure 1-6As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the auxiliary mechanism 3 includes a third motor 31, a slide rod 33, a movable seat 34, a mounting seat 38, and a lifting seat 312, the third motor 31 is fixedly connected to the packaging device 2, the output shaft of the third motor 31 is fixedly connected to the first screw rod 32, one end of the first screw rod 32 is connected to the axis of the packaging device 2, both ends of the slide rod 33 are fixedly connected to the packaging device 2, the first screw rod 32 passes through the movable seat 34 and is threadedly connected to the movable seat 34, the slide rod 33 passes through the movable seat 34 and is threadedly connected to the movable seat 34 The movable seat 34 is movably connected, the outer diameter of the movable seat 34 is matched with the inner diameter of the first slideway 215, the movable seat 34 is movably connected to the packaging device 2 through the first screw rod 32 and the slide rod 33, one end of the movable seat 34 is fixedly connected to the fourth motor 36, one side of the movable seat 34 is provided with a second slideway 35, the output shaft of the fourth motor 36 is fixedly connected to the second screw rod 37, one end of the second screw rod 37 is connected to the shaft of the movable seat 34, the second screw rod 37 passes through the mounting seat 38 and is threadedly connected to the mounting seat 38, and the mounting seat 38 is connected to the fourth motor 36. The machine 36 is movably connected to the moving seat 34, a third slideway 39 is provided on one side of the mounting seat 38, a fifth motor 310 is fixedly connected to the top of the mounting seat 38, a third screw rod 311 is fixedly connected to the output shaft of the fifth motor 310, a bottom end of the third screw rod 311 is axially connected to the mounting seat 38, the third screw rod 311 penetrates the lifting seat 312 and is threadedly connected to the lifting seat 312, the lifting seat 312 is movably connected to the mounting seat 38 through the third screw rod 311, one end of the injection head 214 is fixedly connected to the lifting seat 312, and is driven by the third motor 31 The first screw rod 32 rotates, driving the movable seat 34 to move left and right within the range of the first slide 215. The second screw rod 37 is driven to rotate by the fourth motor 36, driving the mounting seat 38 to move forward and backward within the range of the second slide 35. The third screw rod 311 is driven to rotate by the fifth motor 310, driving the lifting seat 312 to move up and down within the range of the third slide 39, so that the injection head 214 can inject at any point within the range of motion, so that the device can package components of different sizes and packaging requirements, thereby increasing the applicability of the device.

[0026] The working principle of the electronic component resin packaging device is described in detail below.

[0027] like Figure 1-6As shown, when in use, the components to be packaged are placed on the upper end of the conveyor belt 17, and the conveyor belt 17 carries the components to the bottom of the injection head 214, and the cleaning roller 13 can clean the surface of the conveyor belt 17, and the resin for packaging is stored in the resin storage tank 21, and the stirring shaft 24 is driven to rotate by the second motor 23, driving the stirring rod 25 to stir the resin to prevent the local concentration of the resin from being too high and causing solidification. The resin storage tank 21 is heated by the heating wire 26, which can reduce the viscosity of the resin, making it easier to flow, and can reduce the bubbles inside the resin. The gas generated by the heated resin can be extracted from the inside of the resin storage tank 21 by the vacuum pump 27, and the inside of the resin storage tank 21 can be evacuated to make The bubbles in the resin escape under the action of negative pressure, which facilitates the injection of the resin. The preheated resin inside the resin storage tank 21 is extracted by the injection pump 29 and transported to the injection head 214. The flow rate of the resin can be accurately controlled by the setting of the flow controller 213. The first screw rod 32 is driven to rotate by the third motor 31, and the moving seat 34 is driven to move left and right within the range of the first slide 215. The second screw rod 37 is driven to rotate by the fourth motor 36, and the mounting seat 38 is driven to move forward and backward within the range of the second slide 35. The third screw rod 311 is driven to rotate by the fifth motor 310, and the lifting seat 312 is driven to rise and fall within the range of the third slide 39, so that the injection head 214 can inject anywhere within the range of motion.

[0028] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. An electronic component resin encapsulation device, comprising a device body (1), characterized in that: A packaging device (2) is provided at the upper end of the device body (1), and an auxiliary mechanism (3) is provided inside the packaging device (2).

2. The device body (1) comprises a cleaning roller (13), a transmission shaft (15), and a conveyor belt (17); the bottom end of the device body (1) is fixedly connected to a support leg (11); the top end of one end of the device body (1) is fixedly connected to a column (12); a conveyor roller (18) is arranged inside the conveyor belt (17); both ends of the conveyor roller (18) are connected to the shaft of the device body (1); and one end of the device body (1) is fixedly connected to a first motor (110); Both ends of the cleaning roller (13) are connected to the shaft of the device body (1), and one end is fixedly connected to a first bevel gear (14); the output shaft of the first motor (110) is fixedly connected to a third bevel gear (19); one end of the third bevel gear (19) is fixedly connected to a conveying roller (18); both ends of the transmission shaft (15) are fixedly connected to a second bevel gear (16); the bottom end of the transmission shaft (15) is gear-connected to the third bevel gear (19) via the second bevel gear (16); and the cleaning roller (13) is gear-connected to the transmission shaft (15) via the first bevel gear (14).

3. The electronic component resin encapsulation device according to claim 1, characterized in that: A top point of the packaging device (2) is fixedly connected to a resin storage tank (21), another top point of the packaging device (2) is fixedly connected to a vacuum pump (27), an input end of the vacuum pump (27) is fixedly connected to an exhaust pipe (28), and one end of the exhaust pipe (28) is fixedly connected to the resin storage tank (21).

4. The electronic component resin encapsulation device according to claim 2, characterized in that: A feeding port (22) is fixedly connected to a top of the resin storage tank (21); a second motor (23) is fixedly connected to the center of the top of the resin storage tank (21); an output shaft of the second motor (23) is fixedly connected to a stirring shaft (24); a stirring rod (25) is fixedly connected to the upper end of the stirring shaft (24); and a heating wire (26) is fixedly connected to the inner wall of the resin storage tank (21).

5. The electronic component resin encapsulation device according to claim 1, characterized in that: Another point on the top of the packaging device (2) is fixedly connected to an injection pump (29), an input end of the injection pump (29) is fixedly connected to a connecting tube (210), one end of the connecting tube (210) is fixedly connected to a resin storage tank (21), and an output end of the injection pump (29) is fixedly connected to a transmission tube (211).

6. The electronic component resin encapsulation device according to claim 4, characterized in that: The bottom end of the transmission tube (211) is fixedly connected to a material delivery hose (212), the bottom end of the material delivery hose (212) is fixedly connected to a flow controller (213), the bottom end of the flow controller (213) is fixedly connected to an injection head (214), and first slideways (215) are provided on the inner walls on both sides of the packaging device (2).

7. The electronic component resin encapsulation device according to claim 1, characterized in that: The auxiliary mechanism (3) comprises a third motor (31), a slide rod (33), a movable seat (34), a mounting seat (38), and a lifting seat (312); the third motor (31) is fixedly connected to the packaging device (2); an output shaft of the third motor (31) is fixedly connected to a first screw rod (32); one end of the first screw rod (32) is connected to a shaft of the packaging device (2); and both ends of the slide rod (33) are fixedly connected to the packaging device (2).

8. The electronic component resin encapsulation device according to claim 6, characterized in that: The first screw rod (32) passes through the movable seat (34) and is threadedly connected to the movable seat (34); the slide rod (33) passes through the movable seat (34) and is movably connected to the movable seat (34); the outer diameter of the movable seat (34) and the inner diameter of the first slideway (215) are mutually matched; the movable seat (34) is movably connected to the packaging device (2) through the first screw rod (32) and the slide rod (33); a fourth motor (36) is fixedly connected to one end of the movable seat (34); and a motor (36) is provided on one side of the movable seat (34). A second slideway (35) is provided, the output shaft of the fourth motor (36) is fixedly connected to a second screw rod (37), one end of the second screw rod (37) is connected to the shaft of the movable seat (34), the second screw rod (37) passes through the mounting seat (38) and is threadedly connected to the mounting seat (38), the mounting seat (38) is movably connected to the movable seat (34) through the fourth motor (36), a third slideway (39) is provided on one side of the mounting seat (38), and a fifth motor (310) is fixedly connected to the top of the mounting seat (38).

9. The electronic component resin encapsulation device according to claim 7, characterized in that: The output shaft of the fifth motor (310) is fixedly connected to a third screw rod (311); the bottom end of the third screw rod (311) is connected to the shaft of the mounting seat (38); the third screw rod (311) passes through the lifting seat (312) and is threadedly connected to the lifting seat (312); the lifting seat (312) is movably connected to the mounting seat (38) via the third screw rod (311); and one end of the injection head (214) is fixedly connected to the lifting seat (312).

Citation Information

Patent Citations

  • Electronic component resin packaging device and packaging method thereof

    CN111081602A