Helmet refrigeration method using heat pipe and refrigeration helmet thereof

Abstract

The invention discloses a helmet refrigeration method utilizing a heat pipe and a refrigeration helmet thereof, which are characterized in that a low-temperature condition is created through a semiconductor refrigeration mode, and cold energy is transmitted into the helmet by utilizing the heat conduction principle of the heat pipe and the rapid heat transfer property of a phase change medium, so that the interior of the helmet is cooled. The cooling capacity is evenly distributed through the inherent structure of the heat pipe and the helmet, the heat pipe is small in occupied space, can be applied to various helmets and is wide in application range, meanwhile, the temperature of all points in the helmet and a cold and heat source temperature control area is effectively controlled and adjusted, the good cooling effect meeting the requirement of a user is achieved, the condensate water precipitation phenomenon is avoided, and a wearer feels comfortable.

Description

Technical Field

[0001] The invention relates to a helmet manufacturing technology, in particular to a helmet refrigeration method and a refrigeration helmet which adopts a semiconductor refrigeration principle and combines heat pipe heat transfer technology. Background Art

[0002] Helmets are widely used as necessary protective equipment for driving motorcycles, electric vehicles, bicycles and other life scenes, as well as necessary protective equipment for working scenes such as factories and construction sites. However, in summer or during high-intensity physical activities, helmets affect the heat dissipation of the human head. The head is the concentrated part of the human body's heat dissipation, and in this case, it will feel hot and stuffy. Therefore, there is a phenomenon that people are unwilling to wear helmets because they are not comfortable enough, which brings safety hazards.

[0003] In order to solve this problem, the designs represented by the cooling helmet with patent publication number CN103120434A and the cooling helmet with patent publication number CN105559229A both use liquid cooling to cool the helmet. The difference between the two lies in the preparation method of the refrigerant. However, there are obvious problems with the use of liquid cooling in helmets, such as the complexity of the process for handling the liquid cooling pipe in the narrow space of the helmet, the risk of leakage in the liquid cooling pipe, and a large amount of condensed water on the surface of the liquid cooling pipe that cannot be discharged.

[0004] Another example is a helmet with a refrigeration function represented by patent publication number CN114190641A and a refrigeration helmet with patent announcement number CN210043266U. Although semiconductor refrigeration and other methods are used to cool the helmet, the application method of semiconductor refrigeration only uses cold end radiation cooling. As a result, the cooling effect cannot be completely evenly distributed, resulting in uneven hot and cold inside the helmet. At the same time, the cold end of the semiconductor refrigeration plate is directly set in the helmet, which also has the problem of condensed water precipitation and inability to discharge. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the temperature inside the helmet cannot be effectively cooled when it is high. A helmet cooling method using a heat pipe and a cooling helmet thereof are provided. The method creates a low temperature condition by a semiconductor refrigeration method and transmits the cold energy to the helmet by a heat pipe, thereby avoiding the precipitation of condensed water, ensuring a uniform cooling effect, and effectively combining the helmet structure with the refrigeration system.

[0006] The above technical problems of the present invention are mainly solved by the following technical solutions: a helmet cooling method using a heat pipe, characterized in that a low temperature condition is created by a semiconductor refrigeration method, and the heat conduction principle of the heat pipe and the rapid heat transfer properties of the phase change medium are used to transfer the cold energy into the helmet, so that the inside of the helmet is cooled.

[0007] In the semiconductor refrigeration method, semiconductor refrigeration sheets and cold-end heat-conducting blocks are provided to transfer cold energy to a plurality of heat pipes, which distribute the cold energy according to the inherent structure inside the helmet, so that the inside of the helmet is evenly cooled.

[0008] In the semiconductor refrigeration method, semiconductor refrigeration sheets and cold-end heat-conducting blocks are provided to transfer cold energy to a plurality of heat pipes, which distribute the cold energy according to the inherent structure inside the helmet, so that the inside of the helmet is evenly cooled.

[0009] In the semiconductor refrigeration method, a sensor is set in the helmet to obtain the temperature and humidity data at the location, and a controller is aggregated to monitor the dew point temperature in the helmet, and a program for controlling the air supply temperature and the refrigeration power of the semiconductor refrigeration plate is executed.

[0010] In the aforementioned helmet cooling method using a heat pipe, preferably, an independent ventilation cabin is provided at the hot end of the semiconductor refrigeration plate, the ventilation cabin is provided with an air inlet and a heat dissipation outlet, and heat exchange is performed on the heat dissipation fins by forced ventilation through an axial flow fan.

[0011] In the aforementioned helmet cooling method using a heat pipe, preferably, the working conditions of the cold end and the hot end are changed by switching the positive and negative poles of the power supply of the semiconductor refrigeration plate, thereby achieving the interchangeability of cooling and heating functions.

[0012] A cooling helmet made by a helmet cooling method using a heat pipe is characterized in that it includes a full-helmet structural shell, a cushion layer and an inner liner are sequentially arranged in the shell, and a heat pipe is laid between the cushion layer and the inner liner; a cold and hot source temperature control module is arranged at the rear of the shell, and the temperature control module includes a module box, and the module box is divided into a mutually independent heat conduction cabin, a ventilation cabin, and a power cabin by a semiconductor refrigeration sheet and a rib plate in the box.

[0013] A heat conduction block cooperating with the semiconductor refrigeration sheet is arranged in the heat conduction cabin, and one end of the heat pipe is connected to the heat conduction block; a heat dissipation fin cooperating with the semiconductor refrigeration sheet is arranged in the ventilation cabin, and an axial flow fan is arranged in cooperation with the heat dissipation fin.

[0014] In the aforementioned cooling helmet, preferably, the inner side of the buffer layer is provided with a groove for accommodating the heat pipe; and the inner liner is provided with a hollow portion corresponding to the heat pipe.

[0015] In the aforementioned refrigeration helmet, preferably, the temperature control module is provided with a controller, and the controller combines with several sensors to obtain temperature and humidity data to complete temperature control. The temperature and humidity data obtained by the controller at least include the temperature and humidity inside the helmet, the temperature and humidity of the ventilation cabin, and the temperature and humidity of the heat transfer cabin.

[0016] In the aforementioned cooling helmet, preferably, the heat pipe is a flat tube structure and has a curvature radius that matches the buffer layer.

[0017] In the aforementioned cooling helmet, preferably, the heat conductive block is provided with a heat conductive groove cooperating with the heat pipe, and at least three surfaces of the heat pipe are tightly matched with the heat conductive groove.

[0018] In the aforementioned refrigeration helmet, preferably, the module box (200) is an independent rectangular box body, which is connected and matched with the shell in a modular assembly manner, or the matching parts of the module box and the shell together form a rectangular box body structure.

[0019] In the aforementioned refrigeration helmet, preferably, a controller and a power supply are provided in the power supply compartment, and the controller and the power supply are isolated by a control cover.

[0020] This technical solution adopts the method of semiconductor refrigeration combined with heat pipes to transfer the cold energy from the cold and heat source temperature control module installed at the rear of the shell to the helmet to achieve the purpose of uniform cooling inside the helmet. The heat pipe can make full use of the heat conduction principle and the rapid heat transfer properties of the phase change medium. The heat pipe can quickly transfer the semiconductor refrigeration capacity to the helmet. Its thermal conductivity exceeds that of other known metals and is an efficient heat transfer method.

[0021] This solution designs heat pipes and other required component structures according to the shape of the helmet and its internal structure, and uses multiple heat pipes for heat conduction to enhance the cooling effect and ensure the uniformity of the cooling area. The cold end of the semiconductor cooling plate of this device uses a heat conduction block to ensure that the cold capacity of the semiconductor cooling is stably, reliably and effectively transferred to the heat pipe, and then transported to the helmet. At the hot end on the other side of the semiconductor cooling plate, the heat is taken out of the helmet by the heat dissipation fins through the axial flow fan, thereby ensuring that the operating temperature of the hot end always meets the use requirements.

[0022] The air intake of the ventilation system of this solution can enter through the heat dissipation louvers and specially designed air inlet vents, and be blown out through the heat dissipation vents after completing heat exchange with the heat dissipation fins.

[0023] In order to ensure the cooling effect of the helmet and the effective operation of the semiconductor refrigeration system, this device is equipped with several sensors, all of which have temperature and humidity monitoring and data transmission functions, and all kinds of data are uniformly fed into the controller for processing. The setting of the sensor can monitor the dew point temperature inside the helmet and the surface temperature of the heat pipe to avoid the precipitation of condensed water, and simultaneously detect the cold end and hot end temperature of the semiconductor refrigeration plate, feedback control the air supply temperature and the refrigeration power of the semiconductor refrigeration plate, and prevent the refrigeration plate from being damaged due to overcooling or overheating, thereby ensuring and improving the cooling effect inside the helmet.

[0024] Compared with the prior art, the beneficial effects of the present invention are: utilizing semiconductor refrigeration combined with the heat pipe heat transfer principle to cool the inside of the helmet, evenly distributing the cold through the heat pipe and the inherent structure of the helmet, the heat pipe occupies a small space, can be applied to various types of helmets, and has a wide range of adaptability. At the same time, the temperature of each point inside the helmet and the temperature control zone of the cold and hot sources can be effectively controlled and adjusted to achieve a good cooling effect that meets the user's requirements, and there is no condensation water precipitation phenomenon, making the wearer feel comfortable. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The present invention is a schematic diagram of the overall cross-sectional structure of a refrigeration helmet.

[0026] Figure 2 yes Figure 1 Schematic diagram of the local enlarged structure at point A in the middle.

[0027] Figure 3 It is a refrigeration principle diagram of the present invention.

[0028] Figure 4 It is a structural schematic diagram of a temperature control module of the present invention.

[0029] Figure 5 It is a schematic diagram of a heat pipe structure of the present invention.

[0030] Figure 6 It is a schematic diagram of the local structure of the matching parts of a heat conducting block and a heat pipe of the present invention.

[0031] Figure 7 It is a schematic diagram of the structure of an inner liner liner of the present invention.

[0032] Figure 8 It is a schematic structural diagram of an external embodiment of the present invention.

[0033] In the figure: 1-shell, 2-temperature control module, 201-controller, 202-power supply, 203-axial flow fan, 204-heat dissipation fins, 205-semiconductor refrigeration sheet, 206-heat conduction block, 207-air inlet, 208-heat dissipation vent, 209-hot end sensor, 210-heat pipe sensor, 211-helmet sensor, 212-ventilation cabin, 213-heat conduction cabin, 214-insulation layer, 3-heat pipe, 4-buffer layer, 5-buffer layer, 501-hollow part, 6-breathing hole, 7-goggles. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0035] The present embodiment provides a helmet cooling method using a heat pipe, the principle of which is: to create a low temperature condition by means of a semiconductor refrigeration method, and to transfer the cold energy to the inside of the helmet by means of the heat conduction principle of the heat pipe 3 and the rapid heat transfer property of the phase change medium, so that the inside of the helmet is cooled down.

[0036] In the semiconductor refrigeration method of the helmet refrigeration method of this embodiment, the semiconductor refrigeration sheet 205 and its cold end heat conducting block 206 are provided to transfer the cold energy to the multiple heat pipes 3, such as Figure 1 As shown, multiple heat pipes 3 are distributed according to the inherent structure inside the helmet, so that the helmet can be evenly cooled.

[0037] In the semiconductor cooling mode of the helmet cooling method of this embodiment, the heat is discharged through the axial flow fan 203 by setting the semiconductor cooling plate 205 and the hot end heat dissipation fins 204, thereby ensuring the operating temperature of the hot end.

[0038] In the semiconductor refrigeration mode of the helmet cooling method of this embodiment, multi-point sensors are set in the helmet to obtain the temperature and humidity data of the respective points, and the controller 201 is summarized to monitor the dew point temperature in the helmet, and execute procedures such as controlling the air supply temperature and controlling the cooling power of the semiconductor refrigeration plate.

[0039] In the helmet cooling method of this embodiment, an independent ventilation cabin 212 is provided at the hot end of the semiconductor cooling plate 205. The ventilation cabin 212 is provided with an air inlet 207 and a heat dissipation vent 208. The heat exchange of the heat dissipation fins 204 is performed through forced ventilation by the axial flow fan 203.

[0040] The above schemes are all explained based on summer working conditions. This method and the helmet made according to this method should have the corresponding operating logic of winter working conditions. By switching the positive and negative poles of the power supply of the semiconductor refrigeration plate 205, the cold end is in a heating condition and the hot end is in a cooling condition, that is, the cold end and hot end conditions are changed. Combined with the monitoring of the sensor and the adjustment of the controller, the heating effect inside the helmet can be achieved.

[0041] This embodiment is a refrigeration helmet made by the above-mentioned helmet refrigeration method using heat pipes, such as Figure 1 As shown, it includes a full-face helmet structure shell 1, in which a cushion layer 4 and an inner liner 5 are arranged in sequence, a heat pipe 3 is laid between the cushion layer 4 and the inner liner 5, and a cold and hot source temperature control module 2 is arranged at the rear of the shell 1.

[0042] The housing 1 is made of carbon fiber, glass fiber and other materials. A breathing hole 6 is provided at the lower front end of the helmet. The helmet is also equipped with goggles 7. Figure 8 shown.

[0043] The cushion layer 4 is made of materials such as EPS, which can be squeezed and deformed when the helmet is impacted, absorb the impact force, and reduce the damage to the head. EPS and other materials are molded lightweight materials and are also easy to process. In order to meet the demand for uniform cooling, the cushion layer 4 is provided with a groove for accommodating the heat pipe 3. The heat pipe 3 is laid in the groove and is flush with the surface of the cushion layer 4. The heat pipe 3 is a flat tube structure and has a curvature radius that matches the cushion layer 4. Figure 5 As shown. The cushion layer 4 has both a protective function and a heat preservation function, so that the cold energy of the heat pipe 3 is radiated to the inside of the helmet. In actual production, the heat pipe 3 can be bent and formed at one time according to the inherent structure of the cushion layer 4. Consider laying multiple pipes, matching the corresponding curvature radius and bending to ensure the installation effect.

[0044] The inner liner 5 can be made of velvet or other materials to improve wearing comfort, and the hollow portion 501 of the inner liner liner 5 can be appropriately set. Figure 2 , Figure 7 As shown, the range of the hollow portion 501 is flexible, and the main principle is to avoid strong obstruction to the heat dissipation of the heat pipe 3.

[0045] By means of the above-mentioned buffer pad layer 4 and the inner liner pad layer 5, the overall structure ensures the uniformity of cooling of the heat pipe 3.

[0046] See also Figure 4 The temperature control module 2 of this embodiment is a rectangular parallelepiped with rounded corners as a whole, and can be installed as an assembled module in the helmet shell 1. Of course, the matching parts of the module box 200 and the shell 1 can also be designed to jointly form a rectangular box structure, that is, the module box 200 part structure is integrated with the helmet shell 1 to be formed in one piece.

[0047] The temperature control module 2 includes a module box 200, which is divided into a mutually independent heat-conducting cabin 213, a ventilation cabin 212, and a power cabin by a semiconductor cooling sheet 205 and a rib plate inside the box. During production, the semiconductor cooling sheet 205 is arranged between the heat-conducting cabin 213 and the ventilation cabin 212, and the separation between the two cabins should be strengthened with insulation materials to prevent the loss of heat and cold. The number of semiconductor cooling sheets 205 can be set according to actual needs, for example, 1 sheet, 2 sheets, etc.

[0048] Specifically, a heat-conducting block 206 cooperating with the semiconductor refrigeration sheet 205 is arranged in the heat-conducting cabin 213, and one end of the heat pipe 3 is connected to the heat-conducting block 206. A heat-dissipating fin 204 cooperating with the semiconductor refrigeration sheet 205 and an axial flow fan 203 cooperating with the heat-dissipating fin 204 are arranged in the ventilation cabin 212. The heat-conducting block 206 is made of a material with good thermal conductivity, such as aluminum alloy and copper. The heat-conducting block 206 is used to transfer the cooling capacity to the heat pipe 3 to the maximum extent, and then send it into the helmet. The heat-conducting block 206 is provided with corresponding heat-conducting grooves according to the number of heat pipes 3. The heat pipes 3 are laid in the heat-conducting grooves, such as Figure 6As shown in the example, the heat conducting block 206 is provided with a plurality of heat conducting grooves matched with the heat pipes 3, and each heat pipe 3 has three surfaces tightly matched with the heat conducting grooves.

[0049] Effective heat-conducting materials such as heat-conducting silica gel are applied between the semiconductor cooling sheet 205, the heat-conducting block 206 and the heat pipe 3 to ensure the heat transfer effect. The rest of the heat-conducting chamber 213 is completely filled with heat-insulating materials to avoid energy loss.

[0050] A power source 202 is arranged in the power source compartment. The power source can be in the form of a rechargeable lithium battery or the like. The power source can also be concealed as a whole, with a charging interface reserved on the outside. The interface can facilitate continuous power supply from an external power source when the helmet is used for a long time. A power source compartment cover is arranged on the outside of the power source compartment to facilitate battery replacement. When the battery is concealed as a whole with a reserved charging interface, the power source compartment cover may not be arranged. A controller 201 is arranged on the inside of the power source compartment. A control cover is arranged between the controller 201 and the power source 202 to play an isolation role.

[0051] The controller 201 combines the temperature and humidity data obtained by the sensors arranged in multiple places to realize the temperature control function of the cooling helmet. The temperature and humidity data obtained by the controller at least include the current temperature and humidity that the user is directly exposed to, which is obtained by the sensor 211 inside the helmet, the temperature and humidity of the ventilation cabin 212 is obtained by the heat pipe sensor 210, and the temperature and humidity of the heat conduction cabin 213 is obtained by the hot end sensor 209.

[0052] During operation, the cold energy of the semiconductor refrigeration plate 205 is transferred to the heat pipe 3, completing the preparation and transportation of cold energy, thereby achieving the purpose of helmet cooling; the outdoor air in the ventilation cabin 212 enters from the air inlet 207 at the bottom or from the surroundings of the side heat dissipation vents 208, and after heat exchange with the heat dissipation fins 204 at one end of the semiconductor refrigeration plate 205, it is blown out of the heat dissipation vent 208 through the axial flow fan 203, thereby completing the heat dissipation of the hot end of the refrigeration plate.

[0053] The above embodiment is described using summer conditions, but the method and the helmet produced thereby should have the corresponding operating logic for winter conditions. As long as the positive and negative poles of the power supply of the semiconductor refrigeration plate 205 are switched, the cold end is in a heating condition and the hot end is in a cooling condition, combined with the monitoring of the sensor and the adjustment of the controller 201, the heating effect inside the helmet can be achieved. The details will not be elaborated here.

[0054] The above embodiments are for the purpose of explaining the present invention, but not for limiting the present invention. For example, the helmet in the present embodiment is described as a full-face helmet structure shell 1, but it can be a half-face helmet, a 3 / 4-face helmet, an off-road helmet, etc. The embodiments described are only part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work inspired by the present invention belong to the scope of protection of the present invention.

Claims

1. A method for cooling a helmet using a heat pipe, characterized in that: A low temperature condition is created by semiconductor refrigeration, and the heat conduction principle of the heat pipe (3) and the rapid heat transfer property of the phase change medium are used to transfer the cold energy into the helmet, so that the temperature inside the helmet is reduced; In the semiconductor refrigeration method, a semiconductor refrigeration sheet (205) and a cold end heat conducting block (206) are provided to transfer cold energy to a plurality of heat pipes, which distribute the cold energy according to the inherent structure inside the helmet, so that the inside of the helmet is evenly cooled; In the semiconductor refrigeration method, heat is discharged through an axial flow fan (203) by arranging a semiconductor refrigeration sheet and its hot end heat dissipation fins (204), thereby ensuring the operating temperature of the hot end; In the semiconductor refrigeration method, a sensor is set in the helmet to obtain the temperature and humidity data of the point, and the controller (201) is summarized to monitor the dew point temperature in the helmet, and execute the program of controlling the air supply temperature and the refrigeration power of the semiconductor refrigeration plate.

2. A method for cooling a helmet using a heat pipe according to claim 1, characterized in that The hot end of the semiconductor refrigeration plate (205) is provided with an independent ventilation cabin (212), and the ventilation cabin is provided with an air inlet (207) and a heat dissipation outlet (208), and heat exchange is performed on the heat dissipation fins (204) through forced ventilation by an axial flow fan (203).

3. A method for cooling a helmet using a heat pipe according to claim 1, characterized in that: By switching the positive and negative poles of the power supply of the semiconductor refrigeration plate (205), the cold end and hot end working conditions are changed, thereby achieving the exchange of cooling and heating functions.

4. A cooling helmet made by the helmet cooling method using a heat pipe as claimed in any one of claims 1 to 3, characterized in that: The invention comprises a full-face helmet structure shell (1), wherein a cushion layer (4) and an inner liner (5) are sequentially arranged in the shell, and a heat pipe (3) is laid between the cushion layer and the inner liner; a cold and hot source temperature control module (2) is arranged at the rear of the shell, and the temperature control module comprises a module box (200), and the module box is divided into mutually independent heat conduction cabin (213), ventilation cabin (212), and power cabin by a semiconductor cooling sheet (205) and a rib plate in the box; A heat conduction block (206) cooperating with the semiconductor refrigeration sheet is provided in the heat conduction cabin, and one end of the heat pipe is connected to the heat conduction block; a heat dissipation fin (204) cooperating with the semiconductor refrigeration sheet is provided in the ventilation cabin, and an axial flow fan (203) is provided in cooperation with the heat dissipation fin.

5. A cooling helmet according to claim 4, characterized in that: The inner side of the buffer pad layer (4) is provided with a groove for accommodating the heat pipe (3); and the inner liner pad (5) is provided with a hollow portion (501) corresponding to the heat pipe.

6. A cooling helmet according to claim 4, characterized in that: The temperature control module (2) is provided with a controller (201), which combines with a plurality of sensors to obtain temperature and humidity data to complete temperature control. The temperature and humidity data obtained by the controller at least includes the temperature and humidity inside the helmet, the temperature and humidity of the ventilation cabin (212), and the temperature and humidity of the heat transfer cabin (213).

7. A refrigeration helmet according to claim 4 or 5, characterized in that: The heat pipe (3) is a flat tube structure and has a curvature radius that matches the buffer pad layer (4).

8. A cooling helmet according to claim 7, characterized in that: The heat conducting block (206) is provided with a heat conducting groove that matches the heat pipe (3), and at least three surfaces of the heat pipe are tightly matched with the heat conducting groove.

9. A cooling helmet according to claim 4, characterized in that: The module box (200) is an independent rectangular parallelepiped box body, which is connected and matched with the housing (1) in a modular assembly manner, or the matching parts of the module box and the housing (1) together form a rectangular parallelepiped box body structure.

10. A refrigeration helmet according to claim 4 or 6, characterized in that: A controller (201) and a power supply (202) are arranged in the power supply compartment, and the controller and the power supply are isolated from each other by a control cover.

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