A wet polishing apparatus and polishing control system

Abstract

The application provides a wet grinding and polishing device and a polishing control system, and belongs to the technical field of polishing devices. The polishing device comprises a polishing table, a polishing piece and a control assembly. The polishing piece has a working surface and a first channel, and the first channel is in communication with the control assembly. The control assembly comprises a control chamber and a movable block. The control chamber has a negative pressure port, an atmospheric pressure port, a cleaning port and a connecting port in communication with the first channel. The movable block is movably installed in the control chamber and has a second channel. One end of the second channel is in communication with the connecting port, and the other end is a butt joint end. In the case that the butt joint end is in communication with the atmospheric pressure port, the movable block can respond to the negative pressure port to realize the communication between the butt joint end and the negative pressure port, or the movable block can respond to the cleaning port to realize the communication between the butt joint end and the cleaning port. The application realizes the switching of the polishing device state under the driving of the negative pressure source and the cleaning assembly by setting the movement of the movable block, and simplifies the pipeline structure of the polishing device.

Description

Technical Field

[0001] This invention belongs to the field of polishing equipment technology, specifically relating to a wet grinding and polishing device and a polishing control system. Background Technology

[0002] In wet grinding and polishing, polishing agent is injected while the material is being ground and polished. Related technologies can be found in Chinese patent documents with publication numbers CN117506677A and CN117484368A. Generally, negative pressure adsorption is used to adhere and fix the material to a fixture. The fixture is connected to a corresponding negative pressure device. When the material needs to be changed, the negative pressure adsorption is released, allowing for quick removal of the material and rapid loading and unloading. Simultaneously, due to the negative pressure adsorption, grinding impurities may be adsorbed into the negative pressure channels inside the fixture during polishing. To ensure the stability of grinding and polishing quality, the fixture is periodically backwashed to clean the internal channels.

[0003] However, the need to achieve independent operation of negative pressure adsorption, material feeding, and backwashing leads to a more complex pipeline structure for the polishing equipment. Multiple control valves need to be linked to ensure independent operation of each state, resulting in increased equipment costs. Summary of the Invention

[0004] The purpose of this application is to provide a wet grinding and polishing apparatus and a polishing control system to solve the aforementioned technical problems existing in the prior art.

[0005] This application is implemented as follows:

[0006] In a first aspect, this application provides a wet grinding and polishing apparatus, including a polishing table, a polishing component, and a control component. The polishing component has a working surface and a first channel. The working surface is used to cooperate with the polishing table. One end of the first channel is located on the working surface, and the other end is connected to the control component. The control component includes a control chamber and a movable block. The control chamber has a negative pressure port, a normal pressure port, a cleaning port, and a connection port connected to the first channel. The movable block is movably installed in the control chamber along a first direction. The movable block has a second channel. One end of the second channel is connected to the connection port, and the other end is a docking end. When the docking end is connected to the normal pressure port, the movable block can respond to the negative pressure port to move towards the negative pressure port, thereby achieving connection between the docking end and the negative pressure port. Alternatively, the movable block can respond to the cleaning port to move towards the connection port, thereby achieving connection between the docking end and the cleaning port.

[0007] Secondly, embodiments of this application provide a wet grinding and polishing control system, including the polishing device provided in the first aspect embodiment, and further including a negative pressure source and a cleaning component, wherein the negative pressure source is connected to a negative pressure port and the cleaning component is connected to a cleaning port.

[0008] The technical solution adopted in this invention can achieve the following beneficial effects:

[0009] In this application, a control component is connected to the first channel. The movement of the movable block of the control component within the control chamber enables the first channel to connect with one of the negative pressure port, cleaning port, or normal pressure port, thereby achieving independent operation of material adsorption, unloading, and backwashing of the first channel. Furthermore, in the control component, the adsorption effect of the negative pressure source connected to the negative pressure port drives the movable block to move, connecting the first channel to the negative pressure source. The cleaning fluid introduced through the cleaning port drives the movable block to move, achieving flushing of the first channel. When the negative pressure source stops working and the cleaning fluid supply stops, the first channel connects to the normal pressure port, releasing the adsorption and fixation of the material, completing the unloading. There is no need to set up multiple control valves for coordinated control. In actual use, it is only necessary to start or stop the negative pressure source and introduce or stop the cleaning fluid supply according to actual needs to achieve the switching of negative pressure adsorption and backwashing operation, simplifying the pipeline structure of the polishing device, simplifying the operation steps, and reducing the control difficulty of the polishing device. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of the polishing control system provided in some embodiments of this application;

[0012] Figure 2 This is a schematic diagram of the polishing apparatus provided in some embodiments of this application;

[0013] Figure 3 This is a schematic diagram showing the disassembled control components provided in some embodiments of this application;

[0014] Figure 4 This is a top view of the control components provided in some embodiments of this application;

[0015] Figure 5 This is an AA cross-section provided in some embodiments of this application. Figure 1 ;

[0016] Figure 6 This is an AA cross-section provided in some embodiments of this application. Figure 2 ;

[0017] Figure 7 Some embodiments of this application are related to Figure 6 Detailed image of point B;

[0018] Figure 8 This is an AA cross-section provided in some embodiments of this application. Figure 3 ;

[0019] Figure 9 This is an AA cross-section provided in some embodiments of this application. Figure 4 .

[0020] In the diagram: 100-Polishing part, 110-Working surface, 120-First channel, 200-Control component, 210-Control chamber, 211-Negative pressure port, 212-Normal pressure port, 213-Cleaning port, 214-Connection port, 215-Limiting part, 216-Moving chamber, 220-Moving block, 221-Second channel, 221a-First opening, 221b-Second opening, 222-Plug-in part, 223-Moving part, 230-Limiting block, 231-Third channel, 232-Fourth channel, 233-Mounting groove, 240-Elastic component, 250-First baffle, 260-Second baffle, 10-Negative pressure source, 20-Cleaning component, 21-Cleaning pump, 22-Reservoir tank, 30-Recovery tank, 40-Material. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more.

[0023] This application provides a wet grinding and polishing apparatus, see reference. Figure 1 and Figure 2As shown, the assembly includes a polishing table, a polishing component 100, and a control assembly 200. The polishing component 100 has a working surface 110 and a first channel 120. The working surface 110 is used to hold a material 40, which is the item to be polished. The working surface 110 cooperates with the polishing table to press the material 40 against the working surface 110 and the polishing table, and the polishing table is used to polish the material 40. The polishing table should be located below the polishing component 100. Figure 1 and Figure 2 The polishing station is not shown.

[0024] The control assembly 200 includes a control chamber 210 and a movable block 220. The control chamber 210 has a negative pressure port 211, a normal pressure port 212, a cleaning port 213, and a connection port 214 communicating with the first channel 120. The movable block 220 is movably mounted within the control chamber 210 along a first direction. Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, the movable block 220 has a second channel 221, one end of which is connected to the connection port 214, and the other end is a docking end. The negative pressure port 211 is used to connect to the negative pressure source 10, the cleaning port 213 is used to connect to the cleaning assembly 20 to introduce cleaning fluid into the second channel 221, and the atmospheric pressure port 212 is used to connect to the atmospheric environment.

[0025] One end of the first channel 120 is located on the working surface 110, and the other end is connected to the control component 200. When the first channel 120 is connected to the negative pressure source 10 via the control component 200, refer to... Figure 5 As shown, the polishing device operates in a negative pressure adsorption state, capable of adsorbing the material 40 on the working surface 110 under negative pressure, thereby fixing the material 40. With the first channel 120 connected to the external atmospheric environment via the control component 200, refer to... Figure 6 As shown, the polishing device is in the unloading state, which can release the negative pressure adsorption on the material 40, facilitating unloading. With the control component 200 and cleaning component 20 in the first channel 120, refer to... Figure 9 As shown, the polishing device is in the backwashing working state, and the cleaning component 20 introduces cleaning fluid into the first channel 120 to complete the rinsing of the first channel 120.

[0026] By changing the position of the movable block 220 within the control chamber 210, the connection of the control docking end to one of the negative pressure port 211, the normal pressure port 212, and the cleaning port 213 is controlled, thereby changing the working state of the polishing device. The negative pressure port 211, the normal pressure port 212, and the cleaning port 213 are independently set, allowing the polishing device to operate in multiple working states independently.

[0027] In the embodiments provided in this application, when the docking end is connected to the normal pressure port 212, the movable block 220 can respond to the negative pressure port 211 to move toward the negative pressure port 211, thereby realizing the connection between the docking end and the negative pressure port 211; or the movable block 220 can respond to the cleaning port 213 to move toward the connection port 214, thereby realizing the connection between the docking end and the cleaning port 213.

[0028] The movable block 220 responds to the negative pressure port 211, meaning that under the suction action of the negative pressure source 10 connected to the negative pressure port 211, the movable block 220 can be driven to move within the control chamber 210, thereby changing the position of the movable block 220, so that the docking end and the negative pressure port 211 are connected, and the polishing device changes from the material feeding working state to the negative pressure adsorption working state.

[0029] The movable block 220 responds to the cleaning port 213 in that, under the action of the cleaning component 20 connected to the cleaning port 213, the cleaning component 20 will introduce cleaning fluid into the control chamber 210 through the cleaning port 213. The flow of the cleaning fluid drives the movable block 220 to move, changing the position of the movable block 220 so that the docking end is connected to the cleaning port 213, and the first channel 120 is rinsed. The polishing device changes from the material feeding working state to the backwashing working state.

[0030] When negative pressure adsorption of material 40 is required, the negative pressure source 10 connected to the negative pressure port 211 can be activated to adsorb the moving block 220, switching the polishing device from the feeding state to the negative pressure adsorption state. When rinsing of the first channel 120 is required, the cleaning component 20 connected to the cleaning port 213 can be activated to introduce cleaning fluid into the control chamber 210, switching the polishing device from the feeding state to the backwashing state.

[0031] Switching to negative pressure adsorption or backwashing mode only requires starting the corresponding equipment, such as negative pressure source 10 or cleaning component 20. There is no need to set up multiple control valves for linkage, which helps to simplify the pipeline structure of the polishing device, simplify the operation steps, and reduce the control difficulty of the polishing device.

[0032] After the negative pressure source 10 or the cleaning component 20 is turned off, the movable block 220 needs to be driven to connect its mating end with the atmospheric pressure port 212 to facilitate the next state switch of the polishing device. In some embodiments, the position of the movable block 220 can be directly adjusted by electric control to drive the movable block 220 to the position where it mates with the atmospheric pressure port 212.

[0033] In other embodiments of this application, a reset structure can be provided to drive the movable block 220 to reset, thereby switching the polishing device from a negative pressure adsorption working state or a backwashing working state to a material feeding state. (See reference...) Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, the negative pressure port 211 and the cleaning port 213 are arranged along the first direction, and an elastic element 240 is connected between the movable block 220 and the control chamber 210. When the elastic element 240 is in its natural state, the docking end is connected to the normal pressure port 212, and the cleaning port 213 is connected to the space around the elastic element 240. At this time, both the negative pressure source 10 and the cleaning assembly 20 are in the closed state.

[0034] When material 40 needs to be adsorbed, the negative pressure source 10 is activated, and the movable block 220 moves in response to the negative pressure port 211, simultaneously compressing the elastic element 240. When the material 40 is polished and needs to be unloaded, the negative pressure source 10 is turned off. Since the elastic element 240 is in a compressed state, the compressed elastic element 240 can drive the movable block 220 to move and reset, so that the docking end of the movable block 220 can be connected to the normal pressure port 212.

[0035] When rinsing of the first channel 120 of the polished part 100 is required, the cleaning assembly 20 is activated. The movable block 220 moves in response to the cleaning port 213, simultaneously stretching the elastic element 240. After the cleaning assembly 20 is activated, cleaning fluid is introduced into the control chamber 210 through the cleaning port 213. As the amount of cleaning fluid in the control chamber 210 increases, it pushes the movable block 220 located in the control chamber 210 to move. The cleaning port 213 communicates with the space surrounding the elastic element 240. As the amount of cleaning fluid increases, this space gradually expands, thereby causing the elastic element 240 within this space to stretch. After rinsing of the first channel 120 is completed, the cleaning assembly 20 is turned off. Since the elastic element 240 is in a stretched state, the stretched elastic element 240 can drive the movable block 220 to move and reset, allowing the mating end of the movable block 220 to communicate with the atmospheric pressure port 212.

[0036] The movable block 220 can be automatically reset using the elastic element 240, eliminating the need for additional control structures. During the use of the polishing device, the movable block 220 in the control component 200 can automatically adjust its position according to whether the negative pressure source 10 and the cleaning component 20 are activated, thereby coordinating with the switching of the polishing device's working state.

[0037] In some preferred embodiments of this application, the mating end includes a first opening 221a and a second opening 221b, both openings being connected to the second channel 221, as shown in the reference. Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown. The first opening 221a is used to connect with the negative pressure port 211 and the cleaning port 213, and the second opening 221b is used to connect with the normal pressure port 212.

[0038] When the second opening 221b is connected to the atmospheric pressure port 212, the first opening 221a is sealed to the control chamber 210. The first opening 221a needs to be sealed to ensure that the first channel 120 of the polished part 100 is connected to the external atmospheric pressure environment through the movable block 220, facilitating material unloading. When the first opening 221a is connected to the negative pressure port 211 or the cleaning port 213, the second opening 221b is sealed to the control chamber 210 to ensure that the first channel 120 of the polished part 100 is connected to the negative pressure source 10 or the cleaning assembly 20 through the movable block 220.

[0039] The sealing fit between the first opening 221a or the second opening 221b and the control chamber 210 means that the opening is blocked by the inner wall of the control chamber 210, or by other components in the control chamber 210, so as to form a sealing effect.

[0040] In some specific embodiments of this application, reference is made to Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, a limit block 230 is fixed inside the control chamber 210, which divides the control chamber 210 into two parts. The negative pressure port 211 is located at one end of the limit block 230, while the movable block 220, elastic element 240, normal pressure port 212, cleaning port 213 and connection port 214 are all located at the other end of the limit block 230.

[0041] The limiting block 230 is provided with a third channel 231 and a fourth channel 232. The fourth channel 232 passes through the limiting block 230 along the first direction. The control chambers 210 located at both ends of the limiting block 230 can be connected through the fourth channel 232. The third channel 231 is connected to the negative pressure port 211 at one end and to the fourth channel 232 at the other end.

[0042] The elastic element 240 is located between the movable block 220 and the limiting block 230. The movable block 220 can be inserted into the fourth channel 232 and, under the suction of the negative pressure source 10 connected to the negative pressure port 211, moves toward the negative pressure port 211 so that the opening of the third channel 231 connected to the fourth channel 232 aligns with the mating end of the movable block 220, thus connecting the second channel 221 and the third channel 231.

[0043] The movable block 220 is inserted into the fourth channel 232, which is connected to the negative pressure port 211. Therefore, under the suction of the negative pressure source 10, the movable block 220 can be driven to move towards the negative pressure port 211 within the fourth channel 232. Simultaneously, since one end of the third channel 231 is located on the inner wall of the fourth channel 232, before the mating end of the movable block 220 connects to the third channel 231, the peripheral sidewall of the movable block 220 blocks the opening of the third channel 231. This ensures that the negative pressure source 10 can smoothly perform negative pressure suction on the movable block 220 located within the fourth channel 232, controlling the movement position of the movable block 220.

[0044] When the docking end of the movable block 220 moves to connect with the third channel 231, the third channel 231, the second channel 221 and the first channel 120 are connected to form a negative pressure channel, and the negative pressure source 10 performs negative pressure adsorption on the material 40 through this channel.

[0045] By setting a third channel 231 and a fourth channel 232 in the limiting block 230, the fourth channel 232 is used to restrict the movement direction of the movable block 220. At the same time, it is also ensured that at least part of the surface of the movable block 220 is exposed to the suction action of the negative pressure source 10, so that the movable block 220 can move its position under the suction action of the negative pressure source 10.

[0046] In some preferred embodiments, the fourth channel 232 is provided with a corresponding limiting structure. After the movable block 220 moves to its docking end and connects with the third channel 231, the movable block 220 and the limiting structure limit each other, preventing the movable block 220 from continuing to move toward the negative pressure port 211. This avoids the situation where the movable block 220 moves too far, causing the docking end to connect with the third channel 231 and then misalign.

[0047] In some preferred embodiments of this application, reference is made to Figure 3 As shown, the movable block 220 includes a plug-in portion 222 and a moving portion 223, wherein the cross-sectional dimension of the moving portion 223 is larger than the cross-sectional dimension of the plug-in portion 222. (Reference) Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, at least part of the insertion portion 222 is located within the fourth channel 232, and the circumferential sidewall of the insertion portion 222 is in contact with the circumferential sidewall of the fourth channel 232. The moving portion 223 is located at one end of the limiting block 230 near the connection port 214, and the circumferential sidewall of the moving portion 223 is in contact with the inner wall of the control chamber 210. The elastic member 240 is fixed between the moving portion 223 and the limiting block 230.

[0048] The moving part 223 has a large cross-sectional dimension. Located outside the fourth channel 232, it cannot be inserted into it. The size difference between the moving part 223 and the insertion part 222 restricts the range of motion of the movable block 220. After the moving part 223 abuts against the limiting part 215, the insertion part 222 moves to its extreme position, closest to the negative pressure port 211. By adjusting the position of the mating end on the movable block 220, when the moving part 223 is in a limiting engagement with the limiting block 230, the mating end communicates with the third channel 231. At this time, under the suction effect of the negative pressure source 10 and the limiting effect of the limiting block 230, the position of the movable block 220 is stable, which helps maintain the stability of the negative pressure adsorption state of the polishing device.

[0049] Furthermore, the larger size of the movable part 223 facilitates the installation of the elastic element 240. As the insertion part 222 moves within the fourth channel 232, the distance between the movable part 223 and the limiting block 230 changes, thereby stretching or compressing the elastic element 240.

[0050] When it is necessary to adsorb material 40, the negative pressure source 10 is started and the cleaning component 20 is turned off. The negative pressure source 10 draws the plug part 222 located in the fourth channel 232 through the negative pressure port 211. The plug part 222 drives the movable block 220 to move along the first direction toward the negative pressure port 211 until the docking end of the movable block 220 is connected to the third channel 231, and the polishing device is in a negative pressure adsorption state.

[0051] When the first channel 120 of the polished part 100 needs to be rinsed, the cleaning assembly 20 is activated, the negative pressure source 10 is turned off, and the cleaning assembly 20 injects cleaning fluid into the control chamber 210 through the cleaning port 213, which corresponds to the space where the elastic member 240 is located. The moving part 223 and the limiting block 230 define the installation space of the elastic member 240, and the part of the control chamber 210 where the elastic member 240 is located is defined as the movable chamber 216, as shown in the reference. Figure 6 , Figure 8 and Figure 9 As shown, the cleaning fluid is directly injected into the movable chamber 216. As the amount of cleaning fluid increases, the movable chamber 316 around the elastic member 240 is filled. The two ends of the elastic member 240 are the limiting block 230 and the moving part 223, respectively. Since the limiting block 230 is fixed, as the amount of cleaning fluid increases, the cleaning fluid will drive the moving part 223 to move away from the limiting block 230, expand the movable chamber 216, and stretch the elastic member 240 until the docking end is connected to the cleaning port 213. The cleaning fluid enters the first channel 120 through the docking end for rinsing. The cleaning fluid will no longer fill the movable chamber 216 around the elastic member 240. The position of the moving block 220 is stable, and the backwashing state of the polishing assembly is stable.

[0052] When the mating end includes a first opening 221a and a second opening 221b, the first opening 221a is disposed on the insertion portion 222 to facilitate communication between the first opening 221a and the third channel 231. The second opening 221b may be located on the insertion portion 222 or on the moving portion 223. In some embodiments of this application, reference is made to... Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown, the second opening 221b is located on the moving part 223, which facilitates the independent operation and switching of the three states of the polishing device. The first opening 221a can be sealed by the inner wall of the fourth channel 232, and the second opening 221b can be sealed by the inner wall of the control chamber 210.

[0053] refer to Figure 4 As shown, the cleaning port 213 and the atmospheric pressure port 212 can be respectively located on the radial sides of the control chamber 210. Correspondingly, the first opening 221a and the second opening 221b can face different directions, thereby avoiding the situation where the first opening 221a and the second opening 221b are incorrectly connected to the ports of the control chamber 210.

[0054] In some embodiments of this application, the end of the limiting block 230 near the moving part 223 is provided with a mounting groove 233, and the elastic member 240 is installed in the mounting groove 233 to improve the installation stability of the elastic member 240. In some specific embodiments, the elastic member 240 can be a spring, which is sleeved on the outside of the insertion part 222.

[0055] In some preferred embodiments, reference Figure 6 and Figure 7 As shown, a first baffle 250 and a second baffle 260 are connected to the atmospheric pressure port 212. One end of the first baffle 250 and the second baffle 260 are fixed to the edge of the atmospheric pressure port 212, and the other end extends toward the control chamber 210. The first baffle 250 is set near the connection port 214, and the second baffle 260 is set near the negative pressure port 211.

[0056] With the second opening 221b mating with the atmospheric pressure port 212, both the first baffle 250 and the second baffle 260 extend through the mating end into the second channel 221, as shown in the reference. Figure 6 and Figure 7 As shown. When the first baffle 250 and the second baffle 260 are not subjected to compression, there is a gap between them to ensure that the mating end can smoothly communicate with the external environment through the atmospheric pressure port 212.

[0057] When the movable block 220 responds to the negative pressure port 211, both the first baffle 250 and the second baffle 260 can be pressed against the inner wall of the control chamber 210 under the drive of the movable block 220, and the position of the movable block 220 changes from... Figures 6 to 5 At this time, the first baffle 250 can seal the atmospheric pressure port 212, further improving the sealing effect on the atmospheric pressure port 212.

[0058] When the movable block 220 responds to the cleaning port 213, both the first baffle 250 and the second baffle 260 can be pressed against the inner wall of the control chamber 210 under the drive of the movable block 220, and the position of the movable block 220 changes from... Figures 6 to 7 Then Figure 8 The second baffle 260 seals the normal pressure port 212, improving the sealing effect on the normal pressure port 212.

[0059] The second opening 221b has a gradually expanding structure. Along the axial direction of the second opening 221b and in a direction away from the second channel 221, the diameter of the second opening 221b gradually increases. (Refer to...) Figure 7 As shown. During the movement of the movable block 220, the gradually expanding structure of the second opening 221b can serve as a receiving space for the first baffle 250 or the second baffle 260, gradually squeezing the baffle, making the movement of the movable block 220 smoother.

[0060] refer to Figure 8 As shown, the control chamber 210 has a limiting part 215, which is located between the cleaning port 213 and the connection port 214. When the docking end is connected to the cleaning port 213, the limiting part 215 cooperates with the movable block 220 to prevent the movable block 220 from continuing to stretch the elastic member 240 in response to the cleaning port 213, so as to avoid the movable block 220 from continuing to move and causing the docking end to be misaligned with the cleaning port 213, or the movable block 220 being unstable in position, resulting in an unstable backwashing state of the polishing device.

[0061] This application also provides a wet grinding and polishing control system, including the polishing device provided in any of the above embodiments, and further including a negative pressure source 10 and a cleaning component 20. The negative pressure source 10 is connected to a negative pressure port 211, and the cleaning component 20 is connected to a cleaning port 213.

[0062] refer to Figure 1 As shown, the cleaning assembly 20 generally includes a cleaning pump 21 and a liquid storage tank 22. The liquid storage tank 22 stores cleaning fluid. By turning on the cleaning pump 21, the cleaning fluid in the liquid storage tank 22 is pumped into the first channel 120.

[0063] In some preferred embodiments, a recovery tank 30 is also provided between the negative pressure source 10 and the control component 200. When the material 40 is polished, some polishing liquid and impurities will be adsorbed to the negative pressure source 10 along with the adsorption of the negative pressure source 10. With the recovery tank 30 provided, the polishing liquid and impurities will be stored in the recovery tank 30 under the action of gravity, thereby avoiding affecting the normal use of the negative pressure source 10.

[0064] In some polishing control systems, when polishing material 40, the polishing part 100 rotates on its own axis and also revolves around the polishing table, improving polishing efficiency and effect. The polishing part 100 is connected to a drive motor and coupling to ensure stable connection between the polishing part 100 and the control component 200 during its rotation.

[0065] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0066] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A wet grinding and polishing apparatus, characterized in that, The device includes a polishing table, a polishing component, and a control assembly. The polishing component has a working surface and a first channel. The working surface is used to cooperate with the polishing table. One end of the first channel is located on the working surface, and the other end is connected to the control assembly. The control component includes a control chamber and a movable block. The control chamber has a negative pressure port, a normal pressure port, a cleaning port, and a connection port communicating with the first channel. The movable block is movably installed in the control chamber along a first direction. The movable block has a second channel, one end of which is connected to the connection port, and the other end is a docking end. When the docking end is connected to the normal pressure port, the movable block can respond to the negative pressure port to move toward the negative pressure port, thereby connecting the docking end and the negative pressure port. Alternatively, the movable block can respond to the cleaning port to move toward the connection port, thereby connecting the docking end and the cleaning port. The negative pressure port and the cleaning port are arranged along a first direction, and an elastic element is connected between the movable block and the control chamber; When the elastic element is in its natural state, the mating end is connected to the normal pressure port, the cleaning port is connected to the space around the elastic element, and the movable block can compress the elastic element in response to the negative pressure port or stretch the elastic element in response to the cleaning port. A limit block is fixed in the control chamber, which divides the control chamber into two parts. The negative pressure port is located at one end of the limit block, and the movable block, the elastic element, the normal pressure port, the cleaning port and the connection port are all located at the other end of the limit block. The limiting block is provided with a third channel and a fourth channel. The fourth channel penetrates the limiting block along the first direction. One end of the third channel is connected to the negative pressure port, and the other end is connected to the fourth channel. The elastic element is located between the movable block and the limiting block. The movable block can be inserted into the fourth channel and moves toward the negative pressure port under the suction of the negative pressure source connected to the negative pressure port, so that the opening of the third channel connected to the fourth channel aligns with the docking end of the movable block, connecting the second channel and the third channel.

2. The wet grinding and polishing apparatus according to claim 1, characterized in that, The docking end includes a first opening and a second opening, the first opening being used to dock with the negative pressure port and the cleaning port, and the second opening being used to dock with the normal pressure port; When the second opening is connected to the atmospheric pressure port, the first opening is sealed to the control chamber; when the first opening is connected to the negative pressure port or the cleaning port, the second opening is sealed to the control chamber.

3. The wet grinding and polishing apparatus according to claim 1, characterized in that, The movable block includes a plug-in portion and a movable portion. The cross-sectional dimension of the movable portion is larger than that of the plug-in portion. At least a portion of the plug-in portion is located in the fourth channel, and the circumferential sidewall of the plug-in portion contacts and engages with the circumferential sidewall of the fourth channel. The movable portion is located at the end of the limiting block near the connection port, and the circumferential sidewall of the movable portion contacts and engages with the inner wall of the control chamber. The elastic element is fixed between the movable portion and the limiting block.

4. The wet grinding and polishing apparatus according to claim 3, characterized in that, The limiting block has a mounting groove at its end near the moving part, and the elastic element is installed in the mounting groove.

5. The wet grinding and polishing apparatus according to claim 2, characterized in that, A first baffle and a second baffle are connected to the atmospheric pressure port. One end of the first baffle and the second baffle are fixed to the edge of the atmospheric pressure port, and the other end extends toward the control chamber. The first baffle is located near the connection port, and the second baffle is located near the negative pressure port. When the second opening is connected to the atmospheric pressure port, both the first baffle and the second baffle extend through the connection end into the second channel; When the movable block responds to the negative pressure port, both the first baffle and the second baffle can be pressed against the inner wall of the movable block and the control chamber under the drive of the movable block, and the first baffle can seal the normal pressure port; When the movable block responds to the cleaning port, both the first and second baffles can be pressed against the inner wall of the movable block and the control chamber under the drive of the movable block, and the second baffle can seal the atmospheric pressure port.

6. The wet grinding and polishing apparatus according to claim 5, characterized in that, The second opening has a gradually expanding structure, and its diameter gradually increases along the axial direction of the second opening and in a direction away from the second channel.

7. The wet grinding and polishing apparatus according to claim 1, characterized in that, The control chamber has a limiting part located between the cleaning port and the connection port. When the docking end is in communication with the cleaning port, the limiting part cooperates with the movable block to prevent the movable block from stretching the elastic element in response to the cleaning port.

8. A wet grinding and polishing control system, characterized in that, The polishing apparatus according to any one of claims 1-7 further includes a negative pressure source and a cleaning component, wherein the negative pressure source is connected to the negative pressure port and the cleaning component is connected to the cleaning port.

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