Variable-frequency temperature adjusting device and temperature adjusting garment

Abstract

The invention provides a variable-frequency temperature adjusting device and thermoregulation clothes, and belongs to the technical field of thermoregulation, the variable-frequency temperature adjusting device comprises a plurality of temperature adjusting assemblies, each temperature adjusting assembly comprises a semiconductor chilling plate, each semiconductor chilling plate is fixedly connected with two parallel positioning strips, each positioning strip is provided with an air chamber in the length direction, and the air chambers are communicated with the semiconductor chilling plates. Each air chamber is provided with an opening, the openings of the two air chambers are oppositely arranged, a flexible film is arranged in each opening, when air is introduced into the air chambers, the flexible films can deform and form a raised part, and the raised part can shield a part of the semiconductor chilling plate on one side of the semiconductor chilling plate. When the temperature difference between the target area and the surrounding environment is too large, a thermal insulation layer can be formed between the target area and the surrounding environment, so that the situation that the heat exchange speed of the target area and the surrounding environment is too high is avoided, and then it is guaranteed that the temperature of the target area can be controlled within the required range.

Description

Technical Field

[0001] The invention relates to the technical field of temperature regulation, in particular to a variable frequency temperature regulation device and a temperature regulation garment. Background Art

[0002] Temperature regulation is an important part of production and life. Common temperature control devices include air conditioners and heat exchangers. These large temperature control devices are not applicable in many scenarios, such as temperature control clothing. Semiconductor refrigeration chip is an electronic device that uses the Peltier Effect of semiconductor materials to achieve cooling or heating. Its core structure consists of N-type and P-type semiconductor materials, which are connected by electrodes and sandwiched between two ceramic substrates. Semiconductor refrigeration chips can be miniaturized and have the function of variable frequency temperature regulation, so they are more suitable for special scenarios such as temperature control clothing. However, there are shortcomings in relying solely on semiconductor refrigeration chips for temperature regulation. The main manifestation is that if the temperature difference between the two sides is too large, the heat transfer speed is also very fast, resulting in the inability of the semiconductor refrigeration chip to control the temperature within the required range. Summary of the invention

[0003] In order to address the deficiencies in the prior art, the present invention provides a variable frequency temperature control device and a temperature control suit. When the temperature difference between the target area and the surrounding environment is too large, a temperature insulation layer can be formed between the target area and the surrounding environment, thereby avoiding excessively fast heat exchange between the target area and the surrounding environment, thereby ensuring that the temperature of the target area can be controlled within the required range.

[0004] In order to achieve the above object, the specific scheme adopted by the present invention is: The present invention provides a variable frequency temperature control device, comprising a plurality of temperature control components, wherein the temperature control components include a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate is fixedly connected to two mutually parallel positioning strips, wherein an air chamber is opened along the length direction of the positioning strip, wherein the air chamber is provided with an opening, and the openings of the two air chambers are arranged opposite to each other, wherein a flexible membrane is provided in the opening, wherein the flexible membrane can be deformed and form a bulge when gas is passed into the air chamber, and wherein the bulge can cover a portion of the semiconductor refrigeration plate on one side of the semiconductor refrigeration plate.

[0005] Preferably, the semiconductor refrigeration plate is rectangular, and the two positioning strips are respectively fixedly connected to the two long sides of the semiconductor refrigeration plate, the first short side of the semiconductor refrigeration plate is fixedly connected to the first mounting strip, and the first mounting strip is fixedly provided with a conductive wire, and the conductive wire is used to supply power to the semiconductor refrigeration plate.

[0006] Preferably, two electrodes are provided on the first short side of the semiconductor refrigeration plate, a receiving groove is opened on the surface of the first mounting strip along the length direction, the receiving groove is connected with two threading holes, and the threading holes correspond to the electrodes, the conductive wire is connected to the electrode through the end power supply wire, and the end power supply wire passes through the threading hole.

[0007] Preferably, an air guide hole connected to the air chamber is provided on the positioning bar, the first mounting bar is fixedly connected to the second mounting bar, a through hole is provided in the middle portion of the second mounting bar along the length direction, the through hole is connected to two air supply channels that pass through the first mounting bar and the second mounting bar, the air supply channels are correspondingly connected to the air guide holes, and the air supply channels are staggered with the accommodating groove.

[0008] Preferably, the positioning bar is fixedly connected to a first connecting plate, and the first connecting plate is parallel to the semiconductor refrigeration plate, the first mounting bar is fixedly connected to two extension plates, connecting plates are fixedly provided on the extension plates, the extension plates are in corresponding contact with the first connecting plate, and the connecting plates are fixedly connected to the first connecting plate.

[0009] Preferably, a second connecting piece is fixedly connected between the two positioning strips, and the second connecting piece is fixedly connected to the second short side of the semiconductor refrigeration sheet.

[0010] Preferably, the second mounting bar is fixedly connected to a third connecting plate, and the third connecting plate is parallel to the semiconductor refrigeration plate, the first connecting plate and the second connecting plate are provided with a plurality of main connecting holes, the third connecting plate is provided with a plurality of secondary connecting holes, and two adjacent temperature control components are connected by a plurality of connecting lines, and the connecting lines can pass through the main connecting holes and / or the secondary connecting holes.

[0011] Preferably, the positioning strip is fixedly connected with an extension portion, and the extension portion is in contact with one side of the semiconductor cooling plate.

[0012] Preferably, a heat-conducting cladding is provided on the semiconductor refrigeration plate.

[0013] The present invention also provides a temperature regulating clothing, including a clothing body, the clothing body is made of a temperature regulating material, the temperature regulating material includes two covering layers, and a plurality of the above-mentioned variable frequency temperature regulating devices are arranged between the two covering layers.

[0014] When the temperature difference between the target area and the surrounding environment is small, the present invention uses a semiconductor refrigeration sheet to control the temperature of the target area within a required range by cooling or heating. When the temperature difference between the target area and the surrounding environment is too large, the flexible membrane can be expanded and a bulge can be formed by passing air into the air chamber, thereby forming a thermal insulation layer between the target area and the surrounding environment, thereby avoiding excessively fast heat exchange between the target area and the surrounding environment, thereby ensuring that the temperature of the target area can be controlled within the required range. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a structural schematic diagram of the temperature control component.

[0017] Figure 2 It is a schematic diagram of the structure of the first mounting bar and the second mounting bar.

[0018] Figure 3 It is a structural diagram of the positioning bar.

[0019] Figure 4 It is a schematic diagram of the state when the flexible film expands to form a bulge.

[0020] Figure 5 It is a structural schematic diagram of the temperature regulating material.

[0021] Figure 6 It is a schematic diagram of the structure of a temperature regulating suit.

[0022] Figure numerals: 1-semiconductor refrigeration plate, 2-thermal conductive blanket, 3-positioning strip, 4-first connecting plate, 5-second connecting plate, 6-main connecting hole, 7-air guide hole, 8-extension portion, 9-first mounting strip, 10-accommodating groove, 11-electrode, 12-threading hole, 13-second mounting strip, 14-third connecting plate, 15-secondary connecting hole, 16-through hole, 17-conductive wire, 18-extension plate, 19-connecting plate, 20-gas transmission channel, 21-air chamber, 22-flexible membrane, 23-raised portion, 24-covering layer, 25-temperature regulating component, 26-garment body. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] like Figure 1 , Figure 3 and Figure 4 As shown, the present invention first provides a variable frequency temperature control device, including multiple temperature control components 25, the temperature control component 25 includes a semiconductor refrigeration plate 1, the semiconductor refrigeration plate 1 is fixedly connected to two mutually parallel positioning strips 3, an air chamber 21 is opened on the positioning strip 3 along the length direction, the air chamber 21 is provided with an opening, and the openings of the two air chambers 21 are arranged opposite to each other, a flexible membrane 22 is provided in the opening, when gas is passed into the air chamber 21, the flexible membrane 22 can be deformed and form a protrusion 23, and the protrusion 23 can cover a part of the semiconductor refrigeration plate 1 on one side of the semiconductor refrigeration plate 1.

[0025] The variable frequency temperature regulating device of the present invention is suitable for scenes where large-scale environmental temperature control equipment such as air conditioners cannot be used, such as temperature regulating clothing. When in use, the area that needs to control the temperature is called the target area, and the area outside the target area is called the surrounding environment. The variable frequency temperature regulating device of the present invention is arranged between the target area and the surrounding environment, and the semiconductor refrigeration sheet 1 is used to cool or heat the target area, thereby controlling the temperature in the target area. When the temperature difference between the target area and the surrounding environment is small, the semiconductor refrigeration sheet 1 can efficiently cool or heat, and control the temperature in the target area within the required range. When the temperature difference between the target area and the surrounding environment is too large, the heat transfer speed between the target area and the surrounding environment is very fast. At this time, even if the semiconductor refrigeration sheet 1 is fully operated, it may not be possible to stabilize the temperature of the target area within the required range. In order to solve this problem, the present invention fixes two positioning strips 3 at the edge of the semiconductor refrigeration sheet 1, and then sets an air chamber 21 and a flexible film 22 on the positioning strip 3. When the temperature difference between the target area and the surrounding environment is too large, gas can be introduced into the air chamber 21. The gas can use space, and the gas can stretch the flexible film 22 to form a bulge 23. The bulge 23 can be attached to the semiconductor refrigeration sheet 1 and cover a part of the semiconductor refrigeration sheet 1. Because the semiconductor refrigeration sheet 1 is located between the target area and the surrounding environment, the bulge 23 formed by the flexible film 22 in the multiple temperature control components 25 can form a temperature insulation layer between the target area and the surrounding environment, and the weak thermal conductivity of air is used to avoid rapid heat exchange between the target area and the surrounding environment. On this basis, the semiconductor refrigeration sheet 1 continues to cool or heat in the target area, and can still control the temperature in the target area within the required range. In addition, because the semiconductor cooling sheet 1 itself can change the working state by changing the magnitude of the input current, that is, it has a frequency conversion function, the variable frequency temperature control device of the present invention can flexibly adjust the temperature control mode.

[0026] It should also be noted that the above-mentioned target area and surrounding environment have different practical meanings in different usage scenarios. For example, for a temperature-regulating suit, the target area is the internal area, that is, the area where the user is located, and the surrounding environment is the environment outside the temperature-regulating suit; for a small refrigerator, the target area is the internal area for storing items, and the surrounding environment is the environment outside the refrigerator. In addition, the semiconductor refrigeration sheet 1 is a prior art, and its specific structure, power supply method and working principle are not described here. The flexible film 22 can be made of rubber material, which is also a commonly used flexible material.

[0027] When the temperature difference between the target area and the surrounding environment is small, the present invention uses the semiconductor refrigeration sheet 1 to control the temperature of the target area within the required range by cooling or heating. When the temperature difference between the target area and the surrounding environment is too large, the flexible membrane 22 can be expanded and a bulge 23 can be formed by passing air into the air chamber 21, thereby forming a thermal insulation layer between the target area and the surrounding environment, thereby avoiding excessively fast heat exchange between the target area and the surrounding environment, thereby ensuring that the temperature of the target area can be controlled within the required range.

[0028] Further, such as Figure 2 As shown, the semiconductor cooling sheet 1 is rectangular, and the two positioning bars 3 are respectively fixedly connected to the two long sides of the semiconductor cooling sheet 1, and the first short side of the semiconductor cooling sheet 1 is fixedly connected to the first mounting bar 9, and the first mounting bar 9 is fixedly provided with a conductive wire 17, which is used to supply power to the semiconductor cooling sheet 1. By providing the first mounting bar 9, it is convenient to deploy the conductive wire 17, especially when the present invention is applied to a temperature regulating suit, because the shape of the temperature regulating suit is constantly changing, by fixing the conductive wire 17 on the first mounting bar 9, the conductive wire 17 can be reinforced to achieve protection of the conductive wire 17.

[0029] Furthermore, two electrodes 11 are provided on the first short side of the semiconductor refrigeration plate 1, and a receiving groove 10 is provided on the surface of the first mounting bar 9 along the length direction. The receiving groove 10 is connected to two threading holes 12, and the threading holes 12 are corresponding to the electrodes 11. The conductive wire 17 is connected to the electrode 11 through the end power supply line, and the end power supply line passes through the threading hole 12. On this basis, the semiconductor refrigeration plates 1 of multiple temperature adjustment components 25 can share a conductive wire 17, and multiple semiconductor refrigeration plates 1 can be connected in parallel or in series according to actual needs. When the series mode is adopted, a discontinuity point can be set on the part of the conductive wire 17 on the first mounting bar 9, and the conductive wires 17 on both sides of the discontinuity point are respectively connected to the two electrodes 11 of the semiconductor refrigeration plate 1 through the end power supply line. When the parallel mode is adopted, the conductive wire 17 consists of two wire assemblies, and the two wires are respectively connected to the two electrodes 11 of the semiconductor refrigeration plate 1 through the end power supply line. The specific principles of series and parallel connection belong to conventional technology and will not be repeated here. In order to enable the semiconductor refrigerator 1 to achieve cooling and heating functions and ensure that the temperature in the target area can be controlled within the required range, the power supply can be supplied to the semiconductor refrigerator 1 through the commutator, and the working state of the semiconductor refrigerator 1 can be changed by changing the direction of the current. The structure and principle of the commutator and the different working states that can be achieved by the semiconductor refrigerator 1 when currents in different directions are passed through are common knowledge in the field and will not be elaborated here.

[0030] like Figure 3As shown, in order to facilitate the introduction of air into the air chamber 21 in the multiple temperature control components 25, an air guide hole 7 connected to the air chamber 21 is provided on the positioning strip 3, the first mounting strip 9 is fixedly connected to the second mounting strip 13, and a through hole 16 is provided in the middle of the second mounting strip 13 along the length direction. The through hole 16 is connected to two air delivery channels 20 that pass through the first mounting strip 9 and the second mounting strip 13. The air delivery channels 20 are correspondingly connected to the air guide hole 7, and the air delivery channels 20 are staggered with the receiving groove 10. On this basis, an air pipe can be arranged between two adjacent temperature control components 25, and the two ends of the air pipe are respectively connected to the through holes 16 on the second mounting strip 13 in the two temperature control components 25, so as to connect the through holes 16 in the multiple temperature control components 25 to form an air supply channel. After the air is input into the air supply channel, the air can enter the air chamber 21 from the air supply channel through the air delivery channel 20 and the air guide hole 7, thereby expanding the flexible membrane 22 to form a bulge 23. Multiple temperature control components 25 can supply air at the same time, which is easier to control, does not require too many pipelines, and is easier to install. Further, the two ends of the air pipe can be connected to a joint or a contraction section, and the joint or contraction section can be inserted into the through hole 16 and then bonded and fixed.

[0031] In order to realize the interconnection of multiple temperature control components 25, so as to facilitate the application of the variable frequency temperature control device of the present invention in various scenarios, the positioning bar 3 is fixedly connected with the first connecting piece 4, and the first connecting piece 4 is parallel to the semiconductor refrigeration plate 1, and the first mounting bar 9 is fixedly connected with two extension plates 18, and the extension plate 18 is fixedly provided with a connecting plate 19, the extension plate 18 is in contact with the first connecting piece 4, and the connecting plate 19 is fixedly connected to the first connecting piece 4. A second connecting piece 5 is fixedly connected between the two positioning bars 3, and the second connecting piece 5 is fixedly connected to the second short side of the semiconductor refrigeration plate 1. The second mounting bar 13 is fixedly connected with the third connecting piece 14, and the third connecting piece 14 is parallel to the semiconductor refrigeration plate 1. A plurality of main connecting holes 6 are provided on the first connecting piece 4 and the second connecting piece 5, and a plurality of secondary connecting holes 15 are provided on the third connecting piece 14. Two adjacent temperature control components 25 are connected by a plurality of connecting lines, and the connecting lines can pass through the main connecting hole 6 and / or the secondary connecting hole 15. The first mounting bar 9 can be fixedly connected to the two positioning bars 3 by the extension plate 18 and the connection plate 19, so that the temperature control assembly 25 is connected as a whole, which makes it easier to connect multiple temperature control assemblies 25. Furthermore, based on the main connection hole 6 and the auxiliary connection hole 15, two adjacent temperature control assemblies 25 can be bundled together by connecting wires, and the connection process is simpler. After the connection, the two adjacent temperature control assemblies 25 can be relatively movable, making the variable frequency temperature control device more flexible as a whole, so that it is easy to be applied in various scenarios, such as temperature control clothing.

[0032] In order to ensure that the raised portion 23 generated after the flexible membrane 22 is deformed can cover a part of the semiconductor refrigeration plate 1, it is necessary to accurately control the relative position of the positioning strip 3 and the semiconductor refrigeration plate 1 to achieve this effect. The positioning strip 3 is fixedly connected with an extension portion 8, and the extension portion 8 fits one side of the semiconductor refrigeration plate 1. An L-shaped space is formed between the extension portion 8 and the positioning strip 3. The long side of the semiconductor refrigeration plate 1 is placed in the space, and the semiconductor refrigeration plate 1 is in contact with the positioning strip 3 and the extension portion 8 at the same time, so that the accuracy of the relative position between the positioning strip 3 and the semiconductor refrigeration plate 1 can be guaranteed. On this basis, the air chamber 21 can be opened on the extension portion 8. Furthermore, the raised portion 23 is located on the side of the semiconductor refrigeration plate 1 facing the target area, because the temperature in the target area is more stable, and the life of the flexible membrane 22 will not be reduced due to overcooling or overheating.

[0033] In order to protect the semiconductor refrigeration chip 1 and prevent the semiconductor refrigeration chip 1 from being damaged and causing the temperature adjustment function to be impaired, a heat conductive cladding 2 is provided on the semiconductor refrigeration chip 1. The heat conductive cladding 2 can be made of metal material, which will not affect the cooling and heating functions of the semiconductor refrigeration chip 1 on the one hand, and can also protect the semiconductor refrigeration chip 1 on the other hand.

[0034] like Figure 5 and Figure 6 As shown, the present invention further provides a temperature regulating clothing, including a clothing body 26, the clothing body 26 is made of a temperature regulating material, the temperature regulating material includes two covering layers 24, and a plurality of the above-mentioned variable frequency temperature regulating devices are arranged between the two covering layers 24. In the temperature regulating material, the covering layer 24 can be made of conventional clothing fabrics, such as polyester and nylon. On the basis of setting two covering layers 24, when the flexible membrane 22 is deformed to form a protrusion 23, the protrusion 23 is restricted by the covering layer 24 and can extend to the middle of the semiconductor refrigeration plate 1, thereby covering more areas on the semiconductor refrigeration plate 1, thereby improving the performance of the thermal insulation layer. The specific form of the clothing body 26 is determined according to actual needs. For example, in Figure 6 In the figure, the garment body 26 is a coat.

[0035] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0036] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. Frequency conversion temperature regulating device, characterized in that: The thermostat comprises a plurality of thermostat components, wherein the thermostat components comprise a semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is fixedly connected with two mutually parallel positioning strips, wherein an air chamber is provided on the positioning strip along the length direction, wherein the air chamber is provided with an opening, and the openings of the two air chambers are arranged opposite to each other, wherein a flexible film is provided in the opening, and when gas is introduced into the air chamber, the flexible film can be deformed and form a bulge, and the bulge can cover a part of the semiconductor refrigeration sheet on one side of the semiconductor refrigeration sheet; The semiconductor refrigeration sheet is rectangular, and the two positioning bars are respectively fixedly connected to the two long sides of the semiconductor refrigeration sheet, and the first short side of the semiconductor refrigeration sheet is fixedly connected to the first mounting bar, and the first mounting bar is fixedly provided with a conductive wire, and the conductive wire is used to supply power to the semiconductor refrigeration sheet; Two electrodes are provided on the first short side of the semiconductor refrigeration plate, and a receiving groove is opened on the surface of the first mounting strip along the length direction. The receiving groove is connected with two threading holes, and the threading holes are corresponding to the electrodes. The conductive wire is connected to the electrode through the end power supply line, and the end power supply line passes through the threading hole.

2. The variable frequency temperature regulating device according to claim 1, characterized in that: The positioning bar is provided with an air guide hole connected to the air chamber, the first mounting bar is fixedly connected to the second mounting bar, a through hole is provided in the middle of the second mounting bar along the length direction, the through hole is connected with two air delivery channels that pass through the first mounting bar and the second mounting bar, the air delivery channels are correspondingly connected with the air guide holes, and the air delivery channels are staggered with the accommodating groove.

3. The variable frequency temperature regulating device according to claim 2, characterized in that: The positioning bar is fixedly connected with a first connecting plate, and the first connecting plate is parallel to the semiconductor refrigeration plate. The first mounting bar is fixedly connected with two extension plates, and connecting plates are fixedly arranged on the extension plates. The extension plates are in corresponding contact with the first connecting plate, and the connecting plates are fixedly connected with the first connecting plate.

4. The variable frequency temperature regulating device according to claim 3, characterized in that: A second connecting piece is fixedly connected between the two positioning bars, and the second connecting piece is fixedly connected to the second short side of the semiconductor refrigeration sheet.

5. The variable frequency temperature regulating device according to claim 4, characterized in that: The second mounting bar is fixedly connected to a third connecting plate, and the third connecting plate is parallel to the semiconductor refrigeration plate. The first connecting plate and the second connecting plate are provided with a plurality of main connecting holes, and the third connecting plate is provided with a plurality of secondary connecting holes. Two adjacent temperature control components are connected by a plurality of connecting lines, and the connecting lines can pass through the main connecting holes and / or the secondary connecting holes.

6. The variable frequency temperature regulating device according to claim 1, characterized in that: The positioning strip is fixedly connected with an extension portion, and the extension portion is in contact with one side of the semiconductor cooling plate.

7. The variable frequency temperature regulating device according to claim 1, characterized in that: The semiconductor refrigeration sheet is covered with a heat-conducting cladding.

8. Temperature regulating clothing, characterized in that: The garment comprises a clothing body, the clothing body is made of a temperature regulating material, the temperature regulating material comprises two covering layers, and a plurality of variable frequency temperature regulating devices as described in any one of claims 1 to 7 are arranged between the two covering layers.

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