High-precision low-noise cooling system and water cooler

Abstract

The invention relates to a high-precision low-noise cooling system and a water cooler, the cooling system comprises a refrigeration part and a heat dissipation part, and the refrigeration part comprises a first cooling plate; a second cooling plate; the first semiconductor chilling plate is provided with a first hot end and a first cold end, the first cold end faces the first cooling plate, the first hot end faces the second cooling plate, and a runner outlet of the first cooling plate communicates with the equipment to be subjected to constant temperature so as to provide a cooling medium towards the equipment to be subjected to constant temperature; the heat dissipation part communicates with the flow channel inlet of the second cooling plate so as to provide a cooling medium towards the second cooling plate. The first hot end can increase the temperature of the second cooling plate, the first cold end can reduce the temperature of the first cooling plate, and the cooling medium can be cooled in the first cooling plate and then supplied to the to-be-constant-temperature equipment to achieve the cooling function. The heat dissipation part can provide the cooling medium through the flow channel inlet facing the second cooling plate, so that the first hot end can dissipate heat stably, and the first cooling plate can provide the cooling medium with high temperature stability for the equipment to be subjected to constant temperature.

Description

Technical Field

[0001] The present application relates to the field of high-precision cooling technology, and in particular, to a high-precision, low-noise cooling system and a water cooler. Background Art

[0002] High-precision water chillers are mainly used to provide a stable cooling water source for precision equipment to ensure that the temperature of the equipment is maintained within a specific range during operation. In related technologies, water chillers usually use basic components such as compressors, condensers, evaporators, and expansion valves to achieve heat transfer and cooling effects through the circulation of refrigerants. Although these devices can meet the needs of temperature control to a certain extent, they have problems such as large size, large vibration, and high noise. In addition, they have large temperature fluctuations in applications in the high-precision field and cannot meet the needs of some high-precision equipment. Summary of the invention

[0003] The purpose of the present disclosure is to provide a high-precision, low-noise cooling system and a water chiller to at least partially solve the problems existing in the related art.

[0004] According to a first aspect of the present disclosure, a high-precision and low-noise cooling system is provided, comprising a refrigeration unit and a heat dissipation unit. The refrigeration unit comprises: A first cooling plate having a flow channel formed therein; A second cooling plate having a flow channel therein; and The first semiconductor cooling plate has a first hot end and a first cold end, wherein the first cold end faces the first cooling plate, and the first hot end faces the second cooling plate. Among them, the flow channel outlet of the first cooling plate is designed to be connected to the device to be thermostatically controlled through a first pipeline to provide cooling medium to the device to be thermostatically controlled; the heat dissipation part is connected to the flow channel inlet of the second cooling plate through a second pipeline to provide cooling medium to the second cooling plate.

[0005] Optionally, the number of the second cooling plates and the number of the first semiconductor refrigeration plates are two respectively, the two second cooling plates are respectively located on both sides of the first cooling plate, and the two first semiconductor refrigeration plates are respectively located between the first cooling plate and the corresponding second cooling plates. Preferably, the flow channel inlet of the first cooling plate is designed to be connected to the temperature-controlled equipment through a third pipeline to receive the cooling medium after heat exchange; the flow channel outlet of the second cooling plate is connected to the heat dissipation part through a fourth pipeline, so that the cooling medium after heat exchange in the second cooling plate flows to the heat dissipation part.

[0006] Optionally, it also includes a first control unit, the first pipeline is provided with a first temperature sensor, the first control unit controls the cooling power of the first semiconductor refrigeration plate according to the measurement value of the first temperature sensor, preferably, the first pipeline is provided with a pressure regulator and a pressure sensor, the pressure sensor is connected to the first control unit, preferably, the first pipeline is provided with a flow meter.

[0007] Optionally, a heat conducting medium is provided between the first semiconductor refrigeration sheet and the first cooling plate and the second cooling plate, respectively. Preferably, the heat conducting medium is heat conducting silicone grease, or an indium sheet, or a tin sheet, or a copper sheet. Alternatively, the first cold end of the first semiconductor refrigeration sheet is in contact with the first cooling plate, and the first hot end of the first semiconductor refrigeration sheet is in contact with the second cooling plate.

[0008] Optionally, the heat dissipation portion includes at least one cooling module connected in series, the cooling module includes a heat exchange element and a refrigeration source for cooling the heat exchange element, and the heat exchange element is used to provide a cooling medium toward its downstream.

[0009] Optionally, the heat exchange element of at least one of the at least one cooling module comprises a third cooling plate having a flow channel, the cooling source comprises a second semiconductor cooling plate having a second hot end and a second cold end, the second cold end faces the third cooling plate, Among them, the flow channel outlet of the third cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the fifth pipeline to provide cooling medium; the flow channel inlet of the third cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the sixth pipeline to receive the cooling medium after heat exchange.

[0010] Optionally, a second control unit is further included, the fifth pipeline is provided with a second temperature sensor, and the second control unit controls the cooling power of the second semiconductor refrigeration plate according to the measurement value of the second temperature sensor.

[0011] Optionally, the heat exchange element of at least one of the at least one cooling module comprises a fourth cooling plate having a flow channel, the cooling source comprises a compressor cooling assembly, and the compressor cooling assembly is connected to the fourth cooling plate. Among them, the flow channel outlet of the fourth cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the seventh pipeline to provide cooling medium; the flow channel inlet of the fourth cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the eighth pipeline to receive the cooling medium after heat exchange.

[0012] Optionally, a third control unit is further included, the seventh pipeline is provided with a heater, and a third temperature sensor is provided at a position of the seventh pipeline downstream of the heater, and the third control unit controls the heating power of the heater according to the measurement value of the third temperature sensor.

[0013] According to a second aspect of the present disclosure, a water chiller is provided, comprising the above-mentioned high-precision and low-noise cooling system.

[0014] By using the above technical solution, when the first semiconductor refrigeration plate is powered on, the first hot end can increase the temperature of the second cooling plate, the first cold end can reduce the temperature of the first cooling plate, and the cooling medium can be supplied to the device to be thermostatically controlled through the first pipeline after cooling in the first cooling plate to realize the cooling function. Compared with the traditional components such as compressors, condensers, evaporators and expansion valves, when providing cooling medium for the device to be thermostatically controlled, the compressor and the cooling fan are usually accompanied by large noise, which will have a negative impact on the normal operation and operating environment of the equipment for high-precision equipment that needs to operate in a low-noise environment. By designing the refrigeration unit to include the first semiconductor refrigeration plate, the impact of noise can be effectively reduced. In addition, when the cooling system is working, the heat dissipation unit can provide cooling medium to the flow channel inlet of the second cooling plate through the second pipeline, so that the first hot end can stably dissipate heat through the cooling medium in the second cooling plate, thereby making the cooling effect of the first cooling plate better, that is, improving the cooling capacity of the refrigeration unit to meet the needs of large-load cooling. In addition, good and stable heat dissipation of the first hot end can ensure stable and accurate temperature reduction of the first cold end, so that the first cooling plate can provide a cooling medium with high temperature stability to the temperature-controlled device to meet precise temperature control.

[0015] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 is a schematic diagram of a high-precision and low-noise cooling system exemplarily shown according to the present disclosure; Figure 2 yes Figure 1 A detailed schematic diagram of a high-precision, low-noise cooling system is shown in FIG. 1 , wherein the internal components of a refrigeration unit are shown in detail; Figure 3 yes Figure 1 A detailed schematic diagram of a high-precision, low-noise cooling system is shown in FIG. 1 , wherein the internal components of another refrigeration unit are shown in detail; Figure 4 yes Figure 1 A detailed schematic diagram of a high-precision, low-noise cooling system is shown in FIG. 1 , wherein the internal components of a cooling module are shown in detail; Figure 5 yes Figure 1 A detailed schematic diagram of a high-precision, low-noise cooling system is shown in FIG. 1 , wherein the internal composition of another cooling module is shown in detail.

[0017] Description of Reference Numerals 1-heat dissipation unit; 101-cooling module; 11-third cooling plate; 12-second semiconductor refrigeration sheet; 13-second temperature sensor; 14-fourth cooling plate; 15-compressor refrigeration assembly; 16-heater; 17-third temperature sensor; 2-refrigeration unit; 21-first cooling plate; 22-second cooling plate; 23-first semiconductor refrigeration sheet; 24-first temperature sensor; 25-pressure regulator; 26-pressure sensor; 27-flow meter; 28-heat transfer medium; 3-equipment to be kept at constant temperature; 41-first pipeline; 42-second pipeline; 43-third pipeline; 44-fourth pipeline; 45-fifth pipeline; 46-sixth pipeline; 47-seventh pipeline; 48-eighth pipeline; 51-first control unit; 52-second control unit; 53-third control unit. DETAILED DESCRIPTION

[0018] The specific embodiments of the present disclosure are described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.

[0019] In the present disclosure, unless otherwise stated, directional words such as "upper" and "lower" may be based on the orientation of related components when used in combination. For example, a heat exchange component is used to provide cooling medium toward its "downstream". The "lower" here is based on the equipment to be kept at a constant temperature. The position close to the equipment to be kept at a constant temperature is the downstream, and conversely, the position away from the equipment to be kept at a constant temperature is the upstream.

[0020] In the present disclosure, the terms "first", "second", etc. are used to distinguish one element from another element, and do not have order and importance. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0021] In order to better understand the technical solution of the present disclosure, it is necessary to explain here that according to the law of conservation of heat, when the cooling module (refrigeration part 2 and heat dissipation part 1) is working, the amount of heat absorbed from the cooling medium will be released in other positions in the cooling module. Therefore, if the heat released in the cooling module cannot be well dissipated, it will affect the cooling function of the cooling module, thereby affecting the cooling capacity and the stability of the cooling temperature (large fluctuation). Based on this point, the present disclosure provides a cooling system with high temperature control accuracy, specifically: Reference Figure 1-Figure 5 The present disclosure exemplarily shows a high-precision, low-noise cooling system, including a refrigeration unit 2 and a heat dissipation unit 1. The refrigeration unit 2 includes a first cooling plate 21 with a flow channel opened inside, a second cooling plate 22 with a flow channel opened inside, and a first semiconductor refrigeration plate 23 with a first hot end and a first cold end, the first cold end faces the first cooling plate 21, and the first hot end faces the second cooling plate 22, so that the first cooling plate 21 can be cooled down and the second cooling plate 22 can be heated up. Among them, the flow channel outlet of the first cooling plate 21 is designed to be connected to the device to be thermostatically controlled 3 through the first pipeline 41 to provide a cooling medium to the device to be thermostatically controlled 3. The heat dissipation unit 1 is connected to the flow channel inlet of the second cooling plate 22 through the second pipeline 42 to provide a cooling medium to the second cooling plate 22.

[0022] Here, the semiconductor cooling sheet refers to a sheet material that generates a hot end and a cold end after being powered on. The hot end and the cold end can be connected to the ceramic sheet respectively so that the temperature control effect of the hot end and the cold end acts on the ceramic sheet, and the temperature of the cooling plate can be adjusted by turning the ceramic sheet toward the corresponding cooling plate. Of course, the aforementioned ceramic sheet can also be replaced by other materials, as long as it can act on the corresponding cooling plate with the heat of the hot end and the cold end. Even in some embodiments, the hot end and the cold end can be directly attached to the corresponding cooling plate to change its temperature. Since its working principle is well known to those skilled in the art, it will not be introduced too much here. It should be noted that in the embodiment of the present disclosure, the number of the first semiconductor cooling sheet 23 can be multiple, and the first hot end and the first cold end of the multiple first semiconductor cooling sheets 23 are oriented in the same direction to improve the cooling effect of the refrigeration unit 2.

[0023] The present disclosure does not limit the cooling medium, which can be gas, cooling water, cooling oil, etc. In the embodiment provided by the present disclosure, the cooling medium is cooling water. The first cooling plate 21 and the second cooling plate 22 are respectively provided with flow channels, so that the cooling medium flowing in the flow channels can exchange heat with the first cooling plate 21 and the second cooling plate 22 to absorb or release heat.

[0024] By using the above technical solution, when the first semiconductor cooling plate 23 is powered on, the first hot end can increase the temperature of the second cooling plate 22, the first cold end can reduce the temperature of the first cooling plate 21, and the cooling medium can be supplied to the temperature-controlled device 3 through the first pipeline 41 after cooling in the first cooling plate 21 to realize the cooling function. Compared with the traditional components such as the compressor, condenser, evaporator and expansion valve, when providing the cooling medium for the temperature-controlled device 3, the compressor and the cooling fan are usually accompanied by a large noise, which will have a negative impact on the normal operation and operating environment of the equipment for high-precision equipment that needs to operate in a low-noise environment. By designing the refrigeration unit 2 to include the first semiconductor cooling plate 23, the impact of noise can be effectively reduced. In addition, when the high-precision low-noise cooling system is working, the heat dissipation unit 1 can provide the cooling medium to the flow channel inlet of the second cooling plate 22 through the second pipeline 42, so that the first hot end can stably dissipate heat through the cooling medium in the second cooling plate 22, thereby making the refrigeration effect of the first cooling plate 21 better, that is, improving the refrigeration capacity of the refrigeration unit 2 to meet the large-load refrigeration needs. In addition, good and stable heat dissipation at the first hot end can ensure stable and accurate temperature reduction at the first cold end, so that the first cooling plate 21 can provide a cooling medium with high temperature stability to the temperature-controlled device 3 to meet precise temperature control.

[0025] Reference Figure 2 and Figure 3 In order to further improve the refrigeration capacity of the refrigeration unit 2, in the embodiment of the present disclosure, the number of the second cooling plates 22 and the number of the first semiconductor refrigeration plates 23 can be two respectively, the two second cooling plates 22 can be respectively located on both sides of the first cooling plate 21, and the two first semiconductor refrigeration plates 23 can be respectively located between the first cooling plate 21 and the corresponding second cooling plate 22.

[0026] Reference Figure 2 and Figure 3In the embodiment of the present disclosure, the flow channel inlet of the first cooling plate 21 can be designed to be connected to the device to be thermostatically controlled 3 through the third pipeline 43 to receive the cooling medium after heat exchange. The flow channel outlet of the second cooling plate 22 can be connected to the heat dissipation part 1 through the fourth pipeline 44, so that the cooling medium after heat exchange in the second cooling plate 22 can flow to the heat dissipation part 1. With such a design, a closed loop for the circulation of the cooling medium can be formed between the first cooling plate 21 and the device to be thermostatically controlled 3, that is, the cooling medium flows to the device to be thermostatically controlled 3 for heat exchange after cooling through the first cooling plate 21, and the cooling medium after heat exchange can flow back to the first cooling plate 21 for cooling again to enter the device to be thermostatically controlled 3 again. Similarly, the cooling medium from the heat dissipation part 1 can flow back to the heat dissipation part 1 for cooling again after absorbing heat in the second cooling plate 22, so as to enter the downstream second cooling plate 22 again. This circulation design of the cooling medium can reduce the demand for cooling medium, reuse it, and reduce costs.

[0027] It should be noted that a pump body (not shown in the figure) and a box body (not shown in the figure) may be provided in the closed loop of the cycle to replenish the cooling medium in time and provide power for the flow of the cooling medium.

[0028] Reference Figure 3 In some embodiments, the high-precision low-noise cooling system may further include a first control unit 51, and the first pipeline 41 may be provided with a first temperature sensor 24. The first control unit 51 may control the cooling power of the first semiconductor refrigeration plate 23 according to the measurement value of the first temperature sensor 24, thereby further improving the temperature stability of the cooling medium provided by the refrigeration unit 2 to the temperature-controlled device 3, as well as the flexibility and accuracy of the control. Specifically, during operation, the first control unit 51 may actively control the cooling power of the first semiconductor refrigeration plate 23 by comparing the temperature feedback from the first temperature sensor 24 with the cooling temperature set by the high-precision low-noise cooling system, so that the temperature of the cooling medium output by the refrigeration unit 2 is extremely stable.

[0029] Reference Figure 2 In some other embodiments, the first pipeline 41 may be provided with a pressure regulator 25 and a pressure sensor 26, and the pressure sensor 26 is connected to the first control unit 51. With such a design, the first control unit 51 can control the pressure regulator 25 to adjust the pressure of the cooling medium in real time according to the measured value fed back by the pressure sensor 26, so that the refrigeration unit 2 can meet the cooling demand of the temperature-controlled device 3.

[0030] Reference Figure 2 In the embodiment of the present disclosure, the first pipeline 41 may also be provided with a flow meter 27. The flow meter 27 may monitor the flow of the cooling medium in the first pipeline 41 in real time, and adjust the flow in cooperation with the aforementioned pump body, etc., so that the refrigeration unit 2 may meet the cooling needs of the temperature-controlled device 3.

[0031] It should be noted here that, in some embodiments, the second control unit and the third control unit mentioned below may be the same control unit as the first control unit 51 to simplify the system structure.

[0032] Reference Figure 2 and Figure 3 In the embodiment of the present disclosure, a heat conducting medium 28 may be provided between the first semiconductor refrigeration sheet 23 and the first cooling plate 21 and the second cooling plate 22. The heat conducting medium 28 may improve the thermal conductivity between the first semiconductor refrigeration sheet 23 and the first cooling plate 21 and the second cooling plate 22, thereby greatly improving the cooling efficiency of the high-precision and low-noise cooling system.

[0033] The present disclosure does not limit the specific material of the heat-conducting medium 28. In the embodiments of the present disclosure, the heat-conducting medium 28 may be thermal grease, or indium sheet, or tin sheet, or copper sheet. Compared with traditional thermal grease, indium sheet, tin sheet, and copper sheet have better thermal conductivity, thereby improving the cooling efficiency of the high-precision low-noise cooling system.

[0034] In addition, in some other embodiments, in order to improve the thermal conductivity between the first semiconductor refrigeration sheet 23 and the first cooling plate 21 and the second cooling plate 22, the first cold end of the first semiconductor refrigeration sheet 23 can be mutually attached to (directly contacted with) the first cooling plate 21, and the first hot end of the first semiconductor refrigeration sheet 23 can be mutually attached to (directly contacted with) the second cooling plate 22, specifically, the ceramic sheets of the first hot end and the second hot end can be mutually attached to (directly contacted with) the corresponding cooling plates, so as to achieve better thermal conductivity. Alternatively, the thermal conductive sheet can also be directly constructed as an integral part with the corresponding cooling plate, which is not limited by the present disclosure.

[0035] The present disclosure does not limit the composition of the heat dissipation unit 1. In the embodiment of the present disclosure, the heat dissipation unit 1 may include at least one cooling module 101 connected in series (when the number of cooling modules 101 is one, it is directly connected in series with the refrigeration unit 2). The cooling module 101 may include a heat exchanger and a refrigeration source for cooling the heat exchanger. The heat exchanger is used to provide a cooling medium toward its downstream, and specifically can be used to provide a cooling medium toward the heat exchanger or refrigeration unit 2 located downstream. With such a design, when the number of cooling modules 101 is multiple, the cooling module 101 located at the most upstream can provide a cooling medium for heat dissipation to the cooling module 101 located downstream, so that the cooling module 101 located downstream can provide a cooling medium with a more stable temperature to the cooling module 101 located downstream, and so on, the effects are superimposed in sequence, until the cooling module 101 at the most downstream can provide a cooling medium with extremely high temperature stability to the refrigeration unit 2, that is, provide extremely stable heat dissipation to the refrigeration unit 2, so that the refrigeration unit 2 can provide a cooling medium with extremely high temperature stability to the temperature-controlled device 3, meeting the high-precision temperature control requirements.

[0036] The present disclosure does not limit the specific structures of the heat exchange element and the refrigeration source. Figure 4 In the illustrated embodiment, the heat exchange element of at least one of the at least one cooling module 101 may include a third cooling plate 11 having a flow channel, and the cooling source may include a second semiconductor cooling plate 12 having a second hot end and a second cold end, and the second cold end may face the third cooling plate 11, so as to reduce the temperature of the third cooling plate 11. The flow channel outlet of the third cooling plate 11 may be connected to the cooling module 101 or the refrigeration unit 2 located downstream thereof through the fifth pipeline 45 to provide a cooling medium. The flow channel inlet of the third cooling plate 11 may be connected to the cooling module 101 or the refrigeration unit 2 located downstream thereof through the sixth pipeline 46 to receive the cooling medium after heat exchange. With such a design, when the second semiconductor cooling plate 12 is powered on, its second hot end may cool the third cooling plate 11, thereby cooling the cooling medium, and causing the cooled cooling medium to flow to the downstream cooling module 101 or the refrigeration unit 2 through the fifth pipeline 45, and after heat exchange in the downstream cooling module 101 or the refrigeration unit 2, the cooling medium flows back to the third cooling plate 11 through the sixth pipeline 46 to form a circulation loop.

[0037] It should be noted that, in this embodiment, the second hot end of the second semiconductor cooling plate 12 can dissipate heat through the cooling medium from the upstream cooling module 101. However, when it is located at the most upstream, it can be cooled by adding a fan or the like.

[0038] Reference Figure 4In an embodiment of the present disclosure, the high-precision low-noise cooling system may further include a second control unit 52, and the fifth pipeline 45 may be provided with a second temperature sensor 13. The second control unit 52 may control the cooling power of the second semiconductor refrigeration plate 12 according to the measurement value of the second temperature sensor 13, so that the third cooling plate 11 may provide a cooling medium with a more stable temperature to the downstream cooling module 101 or the refrigeration unit 2, thereby improving the temperature control stability of the high-precision low-noise cooling system.

[0039] In addition to the aforementioned embodiments, in some other embodiments, refer to Figure 5 , the heat exchange element of at least one of the at least one cooling module 101 may include a fourth cooling plate 14 having a flow channel, and the cooling source may include a compressor cooling assembly 15, and the compressor cooling assembly 15 may be connected to the fourth cooling plate 14 to reduce the temperature of the fourth cooling plate 14. The flow channel outlet of the fourth cooling plate 14 may be connected to the cooling module 101 or the refrigeration unit 2 located downstream thereof through the seventh pipeline 47 to provide a cooling medium. The flow channel inlet of the fourth cooling plate 14 may be connected to the cooling module 101 or the refrigeration unit 2 located downstream thereof through the eighth pipeline 48 to receive the cooling medium after heat exchange. Figure 4 and Figure 5 The difference between the illustrated embodiments lies in the different types of cooling sources. Other effects can be found above and will not be described in detail here.

[0040] and Figure 4 The embodiment shown is different in that Figure 5 In the illustrated embodiment, the high-precision, low-noise cooling system may further include a third control unit 53, the seventh pipeline 47 may be provided with a heater 16, and a third temperature sensor 17 may be provided at a position downstream of the heater 16 of the seventh pipeline 47, and the third control unit 53 may control the heating power of the heater 16 according to the measurement value of the third temperature sensor 17, so that the fourth cooling plate 14 may provide a temperature-stable cooling medium to the cooling module 101 or the refrigeration unit 2 downstream thereof, thereby improving the temperature control stability and accuracy of the high-precision, low-noise cooling system.

[0041] It should be noted that a flow meter, a pump body, a pressure sensor, a pressure regulator, etc. may also be provided in the cooling module 101. The specific effects thereof may be referred to in the refrigeration unit 2, and no further introduction will be given here.

[0042] When the cooling source of the cooling module 101 is a compressor cooling assembly 15, it may include components such as a compressor, a condenser, an evaporator, and an expansion valve, and needs to be cooled by a fan when providing cooling medium for the temperature-controlled device 3. The compressor and the cooling fan are usually accompanied by a large noise, which has a negative impact on the normal operation and operating environment of the high-precision equipment that needs to operate in a low-noise environment. Therefore, the length of the aforementioned pipeline can be designed to keep the cooling module 101 as far away from the temperature-controlled device 3 as possible.

[0043] According to a second aspect of the present disclosure, a water cooler is provided, comprising the aforementioned high-precision and low-noise cooling system. Since the water cooler has all the beneficial effects of the aforementioned high-precision and low-noise cooling system, they are not described in detail here.

[0044] In addition to water chillers, the aforementioned high-precision, low-noise cooling system can be applied to all temperature control equipment, such as constant temperature rooms, etc.

[0045] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0046] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0047] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A high-precision, low-noise cooling system, characterized in that: Including cooling part and heat dissipation part, The refrigeration unit comprises: A first cooling plate having a flow channel formed therein; A second cooling plate having a flow channel therein; and The first semiconductor cooling plate has a first hot end and a first cold end, wherein the first cold end faces the first cooling plate, and the first hot end faces the second cooling plate. Among them, the flow channel outlet of the first cooling plate is designed to be connected to the device to be thermostatically controlled through a first pipeline to provide cooling medium to the device to be thermostatically controlled; the heat dissipation part is connected to the flow channel inlet of the second cooling plate through a second pipeline to provide cooling medium to the second cooling plate.

2. The high-precision, low-noise cooling system according to claim 1, characterized in that: The number of the second cooling plates and the number of the first semiconductor refrigeration plates are two respectively, the two second cooling plates are respectively located on both sides of the first cooling plate, and the two first semiconductor refrigeration plates are respectively located between the first cooling plate and the corresponding second cooling plates. Preferably, the flow channel inlet of the first cooling plate is designed to be connected to the temperature-controlled equipment through a third pipeline to receive the cooling medium after heat exchange; the flow channel outlet of the second cooling plate is connected to the heat dissipation part through a fourth pipeline, so that the cooling medium after heat exchange in the second cooling plate flows to the heat dissipation part.

3. The high-precision, low-noise cooling system according to claim 1, characterized in that: It also includes a first control unit, the first pipeline is provided with a first temperature sensor, the first control unit controls the cooling power of the first semiconductor refrigeration plate according to the measurement value of the first temperature sensor, preferably, the first pipeline is provided with a pressure regulator and a pressure sensor, the pressure sensor is connected to the first control unit, preferably, the first pipeline is provided with a flow meter.

4. The high-precision, low-noise cooling system according to claim 1, characterized in that: A heat conducting medium is provided between the first semiconductor refrigeration sheet and the first cooling plate and the second cooling plate, respectively. Preferably, the heat conducting medium is heat conducting silicone grease, or an indium sheet, or a tin sheet, or a copper sheet. Alternatively, the first cold end of the first semiconductor refrigeration sheet is in contact with the first cooling plate, and the first hot end of the first semiconductor refrigeration sheet is in contact with the second cooling plate.

5. The high-precision, low-noise cooling system according to any one of claims 1 to 4, characterized in that: The heat dissipation part includes at least one cooling module connected in series, wherein the cooling module includes a heat exchange element and a cooling source for cooling the heat exchange element, and the heat exchange element is used to provide a cooling medium toward its downstream.

6. The high-precision, low-noise cooling system according to claim 5, characterized in that: The heat exchange element of at least one of the at least one cooling module comprises a third cooling plate having a flow channel, the cooling source comprises a second semiconductor cooling plate having a second hot end and a second cold end, the second cold end faces the third cooling plate, Among them, the flow channel outlet of the third cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the fifth pipeline to provide cooling medium; the flow channel inlet of the third cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the sixth pipeline to receive the cooling medium after heat exchange.

7. The high-precision, low-noise cooling system according to claim 6, characterized in that: It also includes a second control unit, the fifth pipeline is provided with a second temperature sensor, and the second control unit controls the cooling power of the second semiconductor refrigeration plate according to the measurement value of the second temperature sensor.

8. The high-precision, low-noise cooling system according to claim 5, characterized in that: The heat exchange element of at least one of the at least one cooling module comprises a fourth cooling plate having a flow channel, the cooling source comprises a compressor cooling assembly, and the compressor cooling assembly is connected to the fourth cooling plate, Among them, the flow channel outlet of the fourth cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the seventh pipeline to provide cooling medium; the flow channel inlet of the fourth cooling plate is connected to the cooling module or the refrigeration part located downstream thereof through the eighth pipeline to receive the cooling medium after heat exchange.

9. The high-precision, low-noise cooling system according to claim 8, characterized in that: The system further includes a third control unit. The seventh pipeline is provided with a heater. A third temperature sensor is provided at a position of the seventh pipeline downstream of the heater. The third control unit controls the heating power of the heater according to a measurement value of the third temperature sensor.

10. A water cooling machine, characterized in that: A high-precision, low-noise cooling system comprising any one of claims 1-9.

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