Chip cold and hot impact testing device and testing method thereof

Abstract

The invention discloses a chip cold and hot impact testing device and a testing method thereof, relates to the technical field of chip performance detection, and solves the problems that in the prior art, chips cannot be subjected to comprehensive and uniform cold and hot impact due to the fact that the chips are partially covered by a clamp, and the temperature of each chip is difficult to keep consistent when the chips are subjected to batch testing, so that the testing efficiency is improved. Therefore, the technical problem is solved. Comprising a testing cylinder used for providing cold and hot temperatures, a moving part is arranged in the testing cylinder, and a clamping mechanism used for dynamically clamping a chip body is arranged on the moving part; the clamping mechanism comprises a plurality of mounting seats, a first clamping mechanism, a second clamping mechanism and a linkage mechanism; and the mounting seats are uniformly distributed on the moving part. According to the chip testing device, the chips can be dynamically clamped conveniently, so that the chips can be comprehensively and uniformly subjected to hot and cold impact testing, and the temperature of each chip cannot have a large temperature difference when the chips are subjected to batch testing, so that the testing effect can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip performance detection, and in particular to a chip thermal shock testing device and a testing method thereof. Background Art

[0002] With the rapid development of integrated circuit technology, the application scenarios of chips are becoming increasingly complex. From consumer electronics to aerospace, automotive electronics and other fields, chips need to maintain stability and reliability in extreme temperature environments. Hot and cold shock testing is a key means to evaluate the ability of chips to withstand sudden temperature changes. It simulates the environment in which the chip experiences alternating extreme high and low temperatures in a short period of time (for example, rapid switching from -55°C to 125°C) to verify the thermal expansion coefficient matching of the internal materials of the chip (such as silicon substrate, metal interconnect layer, packaging material, etc.), the fatigue resistance of the solder joint connection, and the mechanical integrity of the packaging structure. During the hot and cold shock process of the chip, different materials will induce internal stress due to differences in thermal expansion coefficients, which may lead to defects such as delamination, cracks, and solder joint fractures. If not fully tested, such defects may gradually accumulate in actual use of the product, causing functional failure or even catastrophic consequences. Therefore, hot and cold shock testing is an indispensable part of chip reliability verification.

[0003] Existing hot and cold shock test devices usually use a fixture to fix the chip. However, the contact surface between the fixture and the chip will form a physical fitting area (such as the fixture base or side wall). This part of the area is covered during the test, which will cause the following problems: the heat exchange in the fitting area is only indirectly transmitted through the fixture, and the temperature change rate is significantly reduced compared with other areas of the chip directly exposed to the hot and cold media; the local area where the chip contacts the fixture (such as the bottom pad or edge pin) may not be fully tested because it is not directly exposed to the temperature shock environment, and these areas are often stress concentration points and prone to potential defects. In addition, in order to improve the test efficiency, the existing technology often places multiple chips in parallel in the same test chamber for batch testing. Because multiple chips are distributed in different positions, it is not easy to keep the temperature of each chip consistent when performing cold shock or thermal shock, resulting in inconsistent actual temperature shock conditions for the same batch of chips. Summary of the invention

[0004] The purpose of the present invention is to provide a chip thermal shock testing device and a testing method thereof, which solves the problem in the prior art that the chip cannot be fully and evenly subjected to thermal shock because the chip is partially covered by a fixture, and the temperature of each chip is not easy to keep consistent when the chips are batch tested, thus affecting the test effect.

[0005] The purpose of the present invention can be achieved through the following technical solutions: A first aspect of the present invention provides a chip hot and cold shock testing device, comprising a test cylinder for providing hot and cold temperatures, a moving part being arranged in the test cylinder, and a clamping mechanism for dynamically clamping a chip body being arranged on the moving part; the clamping mechanism comprises a mounting seat, a first clamping mechanism, a second clamping mechanism and a linkage mechanism, a plurality of the mounting seats are evenly distributed on the moving part, the first clamping mechanism and the second clamping mechanism are both mounted on the mounting seat, the first clamping mechanism is used to clamp both sides of the chip body, the linkage mechanism is mounted in the mounting seat, the linkage mechanism is used to control the second clamping mechanism to clamp the other two sides of the chip body, and when the linkage mechanism drives the second clamping mechanism to clamp the chip body, the first clamping mechanism is linked to be separated from the chip body.

[0006] As a further solution of the present invention: the moving part includes a lower annular plate, an upper annular plate, a cylinder and a connecting part, the clamping mechanism is arranged on the top of the lower annular plate, the upper annular plate is located above the lower annular plate, and the lower annular plate is connected to the upper annular plate through a connecting part, the cylinder is installed at the bottom of the test tube, and the cylinder is used to control the lifting and lowering of the lower annular plate.

[0007] As a further solution of the present invention: the mounting seat includes a main shell, a first sub-shell with a first through groove and a second sub-shell with a second through groove, the main shell is installed on the top of the lower annular plate, the two first sub-shells and the two second sub-shells are symmetrically arranged on the opposite side walls of the main shell, and the main shell is connected to the first sub-shell and the second sub-shell, and the first through groove and the second through groove are respectively opened on the top of the first sub-shell and the second sub-shell.

[0008] As a further solution of the present invention: the test cylinder includes an upper annular shell, a lower annular shell, a cylinder and a bracket, the cylinder is a hollow structure with an opening at the top, the upper annular shell and the lower annular shell are fixedly installed on the outside of the cylinder from top to bottom in sequence, and the inner cavity of the cylinder is respectively connected to the inner cavity of the upper annular shell and the lower annular shell, the cross-section of the upper annular plate and the lower annular plate is the same as the inner cross-section of the cylinder, a plurality of brackets are circumferentially arranged at the bottom of the lower annular shell, and the upper annular shell and the lower annular shell are respectively provided with heating elements and cooling elements uniformly distributed circumferentially.

[0009] As a further solution of the present invention: the first clamping mechanism includes a first clamping plate, an L-shaped plate, a guide rod and a first spring, the two guide rods are symmetrically arranged in the first sub-shell, and one end of the guide rod extends into the main shell, one end of the L-shaped plate is connected to the first clamping plate, the first clamping plate is in contact with the side wall of the chip body, the other end of the L-shaped plate passes through the first through groove, and the L-shaped plate is slidably connected to the guide rod, the first spring is mounted on the guide rod, and the two ends of the first spring are respectively connected to the inner wall of the first sub-shell and the side wall of the L-shaped plate.

[0010] As a further solution of the present invention: the second clamping mechanism includes a second clamping plate, a T-shaped plug-in block, a plug-in shell, a second spring and a movable plate, the bottom end of the movable plate passes through the second through slot and extends into the second sub-shell, the plug-in shell is installed on the top of the movable plate, the T-shaped plug-in block is slidably plugged into the plug-in shell, and the T-shaped plug-in block and the plug-in shell are connected by a second spring, and the second clamping plate is installed at one end of the T-shaped plug-in block.

[0011] As a further solution of the present invention: the linkage mechanism includes a cross column, a connecting rod, a push block, a driving mechanism and a rotating rod with opposite threads at both ends. The rotating rod is rotatably installed between the two second sub-shells, the movable plate is threadedly sleeved with the rotating rod near the two ends, the two cross columns are symmetrically installed on the side walls of the movable plate, the push block is slidably sleeved with the guide rod, the two ends of the connecting rod are respectively hinged to the ends of the cross column and the push block, the driving mechanism is installed on the lower annular plate, and the driving mechanism is used to control the forward and reverse rotation of the rotating rod.

[0012] As a further solution of the present invention: the driving mechanism includes a U-shaped plate, a motor, a toothed disc, a first spur gear, a driving bevel gear and a driven bevel gear, the driven bevel gear is coaxially connected to one end of a rotating rod through a pin shaft, the driving bevel gear is meshed with the driven bevel gear, and the driving bevel gear is rotatably connected to the top of the lower annular plate through a rotating pin, the first spur gear is fixedly sleeved on the rotating pin, the U-shaped plate is installed at the bottom of the lower annular plate, the motor is installed on the upper surface of the horizontal part of the U-shaped plate, and the output shaft of the motor passes through the lower annular plate and is coaxially connected to the toothed disc, and the toothed disc is meshed with the first spur gear.

[0013] As a further solution of the present invention: a spoiler mechanism is installed on the toothed disc, and the spoiler mechanism includes a rotating shaft, blades, a second spur gear and an inner gear ring. Multiple rotating shafts are installed on the top of the toothed disc for circumferential rotation, the second spur gear is fixedly sleeved on the rotating shaft, the inner gear ring is meshed with the second spur gear, and the inner gear ring is connected to the top of the lower annular plate through a support rod.

[0014] A second aspect of the present invention provides a chip thermal shock test method, which is applied to the above-mentioned chip thermal shock test device, and comprises the following steps: Step 1: Clamp the two sides of the chip body using the first clamping mechanism on the mounting seat, so that the chip body is suspended and positioned above the mounting seat; Step 2: Control the moving part to drive the positioned chip body to move downward along the test cylinder to the maximum stroke, so that the chip body corresponds to the cooling area in the test cylinder, start the linkage mechanism to drive the second clamping mechanism to clamp the chip body, and at the same time, link the first clamping mechanism to separate from the chip body, and then control the second clamping mechanism and the first clamping mechanism to reset, and repeat this process to dynamically clamp the chip body; Step 3: Control the moving part to drive the chip body that has completed the cold shock to move upward along the test barrel, so that the chip body corresponds to the heating area in the test barrel, and start the linkage mechanism to dynamically clamp the chip body, so as to perform thermal shock on the chip body; Step 4: Continue to control the moving part to rise to the maximum stroke, so that the chip body that has completed the hot and cold shock rises above the test tube, and the chip body can be removed for subsequent performance testing.

[0015] Beneficial effects of the present invention: 1. In the present invention, a plurality of chip bodies to be tested are conveniently mounted on a moving part through a clamping mechanism, and the moving part is controlled to drive the chip body to slide into a test cylinder, so that a closed cavity is conveniently isolated between the moving part and the test cylinder. By adjusting the position of the moving part, the isolated cavity corresponds to the cooling or heating area of ​​the test cylinder, thereby facilitating and quickly switching the chip between hot and cold shocks.

[0016] 2. In the present invention, the first clamping mechanism is used to conveniently clamp the two sides of the chip body to be tested, thereby completing the installation and positioning of the chip body. During the hot and cold shock, the linkage mechanism is used not only to conveniently control the movement of the second clamping mechanism and clamp the other two sides of the chip body using the second clamping mechanism, but also to link the first clamping mechanism to separate from the chip body when the chip body is clamped by the second clamping mechanism, and then the linkage mechanism is used to control the second clamping mechanism and the first clamping mechanism to reset, so that the first clamping mechanism and the second clamping mechanism take turns to clamp and position the chip body, thereby realizing dynamic clamping of the chip body. Since the first clamping mechanism and the second clamping mechanism are not always in contact with the chip body, it is convenient to conduct comprehensive and uniform hot and cold shock tests on the chip body, which is beneficial to improving the test effect.

[0017] 3. In the present invention, when the position of the second clamping mechanism is reciprocatedly adjusted by the linkage mechanism, the linkage spoiler mechanism facilitates the disturbance of the air in the cooling or heating area in the test cylinder, so that the temperature at each position in the cooling or heating area can be kept as uniform as possible, so that the temperatures of the various chip bodies tested in the same batch will not be different due to different distribution positions when they experience cold and hot shocks, which is beneficial to improve the effect of chip batch testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 It is a three-dimensional diagram of a chip thermal shock testing device of the present invention; Figure 2 It is a three-dimensional diagram of a chip thermal shock test device of the present invention when in use; Figure 3 It is a three-dimensional diagram of the connection part between the lower annular plate and the clamping mechanism in a chip thermal shock test device of the present invention; Figure 4 It is a three-dimensional diagram of a chip thermal shock test device of the present invention after the test tube is removed; Figure 5 It is a three-dimensional diagram of the connection part between the chip body and the clamping mechanism in a chip thermal shock test device of the present invention; Figure 6 It is a three-dimensional diagram of a chip thermal shock test device of the present invention after the top of the mounting seat is opened; Figure 7 It is a three-dimensional diagram after the second clamping mechanism in a chip thermal shock testing device of the present invention is decomposed; Figure 8 It is a stereoscopic diagram of the connection part between the spoiler mechanism and the toothed disk in a chip thermal shock test device of the present invention; Fig. 9 It is a three-dimensional diagram of a mounting seat in a chip thermal shock testing device of the present invention; Fig.10 It is a three-dimensional diagram of a chip thermal shock testing device after an upper annular plate and a lower annular plate are separated.

[0020] In the figure: 1, test cylinder; 11, upper annular shell; 12, lower annular shell; 13, cylinder; 14, bracket; 2, moving part; 21, lower annular plate; 22, upper annular plate; 23, cylinder; 24, connecting part; 241, cylindrical protrusion; 242, docking rod; 243, locking knob; 3, chip body; 4, clamping mechanism; 41, mounting seat; 411, main shell; 412, first through groove; 413, first sub-shell; 414, second through groove; 415, second sub-shell; 42, first clamping mechanism; 421, first clamping plate; 422, L-shaped plate; 4221, first cover plate; 423, guide Rod; 424, first spring; 43, second clamping mechanism; 431, second clamping plate; 432, T-shaped plug block; 433, plug shell; 434, second spring; 435, moving plate; 4351, second cover plate; 44, linkage mechanism; 441, cross column; 442, connecting rod; 443, push block; 444, driving mechanism; 4441, U-shaped plate; 4442, motor; 4443, toothed disc; 4444, first spur gear; 4445, active bevel gear; 4446, driven bevel gear; 445, rotating rod; 5, spoiler mechanism; 51, rotating shaft; 52, blade; 53, second spur gear; 54, inner ring gear. DETAILED DESCRIPTION

[0021] The technical scheme of the present invention will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] like Figure 1-Figure 10 The present invention is a chip hot and cold shock testing device, comprising a test tube 1 for providing hot and cold temperatures, a moving part 2 is arranged in the test tube 1, and a clamping mechanism 4 for dynamically clamping a chip body 3 is arranged on the moving part 2; the clamping mechanism 4 comprises a mounting seat 41, a first clamping mechanism 42, a second clamping mechanism 43 and a linkage mechanism 44, a plurality of mounting seats 41 are evenly distributed on the moving part 2, the first clamping mechanism 42 and the second clamping mechanism 43 are both mounted on the mounting seat 41, the first clamping mechanism 42 is used to clamp the two sides of the chip body 3, the linkage mechanism 44 is mounted in the mounting seat 41, the linkage mechanism 44 is used to control the second clamping mechanism 43 to clamp the other two sides of the chip body 3, and when the linkage mechanism 44 drives the second clamping mechanism 43 to clamp the chip body 3, the first clamping mechanism 42 is linked to separate from the chip body 3.

[0023] It should be noted that, when in use, the moving member 2 is controlled to rise to the maximum stroke along the test barrel 1, and the two sides of each chip body 3 to be tested in the same batch are clamped one by one by using the multiple first clamping mechanisms 42, and then the moving member 2 is controlled to descend to the maximum stroke, so that the clamped chip body 3 corresponds to the cooling area in the test barrel 1, and the chip body 3 can be cold-shocked, and the moving member 2 is controlled to drive the chip body 3 to rise a set distance, so that the chip body 3 corresponds to the heating area in the test barrel 1, and the chip body 3 can be thermally shocked; When the chip body 3 is subjected to cold shock and heat shock, the linkage mechanism 44 is started to drive the two second clamping mechanisms 43 to move toward each other, thereby clamping the other two sides of the chip body 3. After the second clamping mechanism 43 clamps the chip body 3, it will link the first clamping mechanism 42 to separate from the chip body 3, and then control the second clamping mechanism 43 and the first clamping mechanism 42 to reset. This can be repeated to dynamically clamp the chip body 3, so that the chip body 3 can be fully and evenly subjected to cold and heat shock, which is beneficial to improving the test effect.

[0024] like Figure 4 and Fig.10 As shown, the moving part 2 includes a lower annular plate 21, an upper annular plate 22, a cylinder 23 and a connecting member 24. The clamping mechanism 4 is arranged on the top of the lower annular plate 21, the upper annular plate 22 is located above the lower annular plate 21, and the lower annular plate 21 is connected to the upper annular plate 22 through the connecting member 24. The cylinder 23 is installed at the bottom of the test tube 1, and the cylinder 23 is used to control the lifting and lowering of the lower annular plate 21.

[0025] It should be noted that the connecting member 24 in this embodiment includes a docking rod 242 with a cylindrical protrusion 241 and a locking knob 243. A plurality of docking rods 242 are evenly distributed circumferentially at the top of the lower annular plate 21 near the edge. The cylindrical protrusion 241 is coaxially connected to the top of the docking rod 242. The cross section of the cylindrical protrusion 241 is smaller than the cross section of the docking rod 242. A through hole for the cylindrical protrusion 241 to pass through is circumferentially provided at the top of the upper annular plate 22. An external thread is provided on the outer wall of the cylindrical protrusion 241 near the top. An internal thread matching the external thread is provided in the locking knob 243. The locking knob 243 is threadedly sleeved with the cylindrical protrusion 241. In order to ensure the sealing between the cylindrical protrusion 241 and the through hole, an O-ring matching the cylindrical protrusion 241 is provided in the through hole. Loosening the locking knob 243 to separate it from the cylindrical protrusion 241 can facilitate the separation of the upper annular plate 22 and the lower annular plate 21. After the upper annular plate 22 is separated, it is not easy to hinder the disassembly and assembly of the chip body 3, which is conducive to improving the disassembly and assembly efficiency of the chip body 3.

[0026] like Figure 3 and Fig. 9As shown, the mounting seat 41 includes a main shell 411, a first sub-shell 413 with a first through groove 412, and a second sub-shell 415 with a second through groove 414. The main shell 411 is installed on the top of the lower annular plate 21, and the two first sub-shells 413 and the two second sub-shells 415 are symmetrically arranged on the opposite side walls of the main shell 411, and the main shell 411 is connected to the first sub-shell 413 and the second sub-shell 415, and the first through groove 412 and the second through groove 414 are respectively opened at the top of the first sub-shell 413 and the second sub-shell 415.

[0027] It should be noted that the first through slot 412 is used to facilitate the first clamping mechanism 42 to slide along the first auxiliary housing 413 , and the second through slot 414 is used to facilitate the second clamping mechanism 43 to slide along the second auxiliary housing 415 .

[0028] like Figure 1-Figure 2 and Figure 4 As shown, the test cylinder 1 includes an upper annular shell 11, a lower annular shell 12, a cylinder 13 and a bracket 14. The cylinder 13 is a hollow structure with an opening at the top. The upper annular shell 11 and the lower annular shell 12 are fixedly installed on the outside of the cylinder 13 from top to bottom, and the inner cavity of the cylinder 13 is connected with the inner cavity of the upper annular shell 11 and the lower annular shell 12 respectively. The cross-section of the upper annular plate 22 and the lower annular plate 21 is the same as the inner cross-section of the cylinder 13. A plurality of brackets 14 are circumferentially arranged at the bottom of the lower annular shell 12. The upper annular shell 11 and the lower annular shell 12 are respectively provided with heating elements and cooling elements uniformly distributed circumferentially.

[0029] It should be noted that the curved side walls of the upper annular plate 22 and the lower annular plate 21 are provided with sealing rings adapted to the inner wall of the cylinder 13 to ensure that a closed area can be isolated when the upper annular plate 22 and the lower annular plate 21 are both located inside the cylinder 13. When the cylinder 23 drives the lower annular plate 21 to descend to the maximum stroke, the closed area between the upper annular plate 22 and the lower annular plate 21 is connected to the lower annular shell 12. At this time, a cold shock test can be performed. The cylinder 23 drives the lower annular plate 21 to rise a set distance (not the maximum stroke), and the closed area between the upper annular plate 22 and the lower annular plate 21 is connected to the upper annular shell 11. At this time, a thermal shock test can be performed. The heating element in this embodiment can be an electric heating tube, and the cooling element can be a refrigerator. The electric heating tube performs heating and the refrigerator performs cooling. This is a prior art and will not be elaborated here.

[0030] like Figure 3 , Figure 5-Figure 6 and Fig. 9As shown, the first clamping mechanism 42 includes a first clamping plate 421, an L-shaped plate 422, a guide rod 423 and a first spring 424. The two guide rods 423 are symmetrically arranged in the first sub-shell 413, and one end of the guide rod 423 extends into the main shell 411. One end of the L-shaped plate 422 is connected to the first clamping plate 421, and the first clamping plate 421 is in contact with the side wall of the chip body 3. The other end of the L-shaped plate 422 passes through the first through groove 412, and the L-shaped plate 422 is slidably connected to the guide rod 423. The first spring 424 is sleeved on the guide rod 423, and the two ends of the first spring 424 are respectively connected to the inner wall of the first sub-shell 413 and the side wall of the L-shaped plate 422.

[0031] It should be noted that by pulling the two L-shaped plates 422 to slide back and forth along the first through groove 412, the first spring 424 can be compressed to store force. After loosening the L-shaped plates 422, the first spring 424 is reset, thereby facilitating the two first clamping plates 421 to clamp the two sides of the chip body 3, thereby facilitating the clamping and positioning of the chip body 3. In this embodiment, the two sides of the L-shaped plate 422 are respectively provided with a first cover plate 4221 for always covering the first through groove 412, so as to prevent the first spring 424 from being affected by hot and cold shocks and affecting its service life.

[0032] like Figure 5-Figure 7 and Fig. 9 As shown, the second clamping mechanism 43 includes a second clamping plate 431, a T-shaped plug block 432, a plug shell 433, a second spring 434 and a movable plate 435. The bottom end of the movable plate 435 passes through the second through slot 414 and extends into the second sub-shell 415. The plug shell 433 is installed on the top of the movable plate 435. The T-shaped plug block 432 is slidably plugged into the plug shell 433, and the T-shaped plug block 432 and the plug shell 433 are connected by the second spring 434. The second clamping plate 431 is installed at one end of the T-shaped plug block 432.

[0033] It should be noted that, in the initial state, the second spring 434 in the plug shell 433 is in a compressed and force-accumulated state, and at this time the second clamping plate 431 is not in contact with the chip body 3. When the movable plate 435 is controlled to approach the chip body 3 along the second through groove 414, the second clamping plate 431 will come into contact with the chip body 3. As the second clamping plate 431 continues to approach, the T-shaped plug block 432 will slide relative to the plug shell 433 and further compress the second spring 434. Since the second spring 434 itself is in a force-accumulated state in the initial state, when the second clamping plate 431 is in contact with the chip body 3, the movable plate 435 only needs to continue to move a short stroke to clamp the chip body 3. In this embodiment, second cover plates 4351 for always covering the second through groove 414 are respectively provided on both sides of the movable plate 435.

[0034] like Figure 3 and Figure 5-Figure 6As shown, the linkage mechanism 44 includes a transverse column 441, a connecting rod 442, a push block 443, a driving mechanism 444 and a rotating rod 445 with opposite threads at both ends. The rotating rod 445 is rotatably installed between the two second sub-shells 415, and the movable plate 435 is threadedly sleeved with the rotating rod 445 near the two ends. The two transverse columns 441 are symmetrically installed on the side wall of the movable plate 435, the push block 443 is slidably sleeved with the guide rod 423, and the two ends of the connecting rod 442 are respectively hinged to the ends of the transverse column 441 and the push block 443, and the driving mechanism 444 is installed on the lower annular plate 21, and the driving mechanism 444 is used to control the forward and reverse rotation of the rotating rod 445.

[0035] It should be noted that when the rotating rod 445 rotates forward, it drives the two movable plates 435 to move toward each other. During the movement, the cross column 441 is used to drive the hinged connecting rod 442, so that the two push blocks 443 slide back to back along the guide rod 423. As the movable plate 435 moves, when the reaction force provided by the second spring 434 can enable the second clamping plate 431 to clamp the chip body 3, the push block 443 is in contact with the L-shaped plate 422. As the movable plate 435 moves further, the push block 443 will push the L-shaped plate 422 to slide, thereby separating the first clamping plate 421 from the chip body 3. The reversal of the rotating rod 445 will cause the movable plate 435 to slide back to back and reset. This process can be repeated to allow the first clamping plate 421 and the second clamping plate 431 to clamp the chip body 3 in turn.

[0036] like Figure 4-Figure 6 and Figure 8 As shown, the driving mechanism 444 includes a U-shaped plate 4441, a motor 4442, a toothed disc 4443, a first spur gear 4444, a driving bevel gear 4445 and a driven bevel gear 4446, the driven bevel gear 4446 is coaxially connected to one end of the rotating rod 445 through a pin shaft, the driving bevel gear 4445 is meshed with the driven bevel gear 4446, and the driving bevel gear 4445 is rotatably connected to the top of the lower annular plate 21 through a rotating pin, the first spur gear 4444 is fixedly sleeved on the rotating pin, the U-shaped plate 4441 is installed at the bottom of the lower annular plate 21, the motor 4442 is installed on the upper surface of the horizontal part of the U-shaped plate 4441, and the output shaft of the motor 4442 passes through the lower annular plate 21 and is coaxially connected to the toothed disc 4443, and the toothed disc 4443 is meshed with the first spur gear 4444.

[0037] It should be noted that the piston rod of the cylinder 23 is connected to the bottom of the U-shaped plate 4441. The motor 4442 in this embodiment is a stepping motor, and its rotation direction and rotation angle can be controlled (in addition to the prior art, no further details are given here), so as to facilitate the control of the toothed disc 4443 to reciprocate at a set angle. During the rotation process, the first spur gear 4444 engaged with it is driven to rotate, so that the rotating pin drives the active bevel gear 4445 to rotate, and then drives the driven bevel gear 4446 to make the pin shaft drive the rotating rod 445 to reciprocate.

[0038] like Figure 3 and Figure 8 As shown, a spoiler mechanism 5 is installed on the toothed disc 4443, and the spoiler mechanism 5 includes a rotating shaft 51, blades 52, a second spur gear 53 and an inner gear ring 54. Multiple rotating shafts 51 are installed on the top of the toothed disc 4443 in a circumferentially rotatable manner, the second spur gear 53 is fixedly sleeved on the rotating shaft 51, the inner gear ring 54 is meshed with the second spur gear 53, and the inner gear ring 54 is connected to the top of the lower annular plate 21 through a support rod.

[0039] It should be noted that when the toothed disc 4443 reciprocates, it will drive the rotating shaft 51 to reciprocate and orbit. During the orbit, the second spur gear 53 is meshed with the fixed inner gear ring 54, so that the toothed disc 4443 can reciprocate and link the rotating shaft 51 to achieve reciprocating self-rotation during the reciprocating revolution. The blades 52 are used to stir the airflow in a comprehensive and uniform manner, so that the temperature at each position in the cooling or heating area can be kept as uniform as possible, so that the temperatures of the chip bodies 3 tested in the same batch will not be different due to different distribution positions when they experience cold and hot shocks, which is beneficial to improve the effect of chip batch testing.

[0040] The embodiment of the present invention provides a chip thermal shock test method, comprising the following steps: Step 1: Use the first clamping mechanism 42 on the mounting seat 41 to clamp the two sides of the chip body 3 so that the chip body 3 is suspended and positioned above the mounting seat 41; Step 2: Control the moving part 2 to drive the positioned chip body 3 to move downward along the test tube 1 to the maximum stroke, so that the chip body 3 corresponds to the cooling area in the test tube 1, start the linkage mechanism 44 to drive the second clamping mechanism 43 to clamp the chip body 3, and at the same time, link the first clamping mechanism 42 to separate from the chip body 3, and then control the second clamping mechanism 43 and the first clamping mechanism 42 to reset, and repeat this process to dynamically clamp the chip body 3; Step 3: Control the moving part 2 to drive the chip body 3 that has completed the cold shock to move upward along the test tube 1, so that the chip body 3 corresponds to the heating area in the test tube 1, and start the linkage mechanism 44 to dynamically clamp the chip body 3, so as to perform thermal shock on the chip body 3; Step 4: Continue to control the moving part 2 to rise to the maximum stroke, so that the chip body 3 that has completed the thermal shock rises to the top of the test tube 1, and the chip body 3 is removed to perform subsequent performance testing.

[0041] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A chip thermal shock test device, comprising a test tube (1) for providing thermal shocks, characterized in that: A moving part (2) is arranged in the test cylinder (1), and a clamping mechanism (4) for dynamically clamping a chip body (3) is arranged on the moving part (2); the clamping mechanism (4) comprises a mounting seat (41), a first clamping mechanism (42), a second clamping mechanism (43) and a linkage mechanism (44); a plurality of mounting seats (41) are evenly distributed on the moving part (2); the first clamping mechanism (42) and the second clamping mechanism (43) are both mounted on the mounting seat (41); the first clamping mechanism (42) is used to clamp two sides of the chip body (3); the linkage mechanism (44) is mounted in the mounting seat (41); the linkage mechanism (44) is used to control the second clamping mechanism (43) to clamp the other two sides of the chip body (3); and when the linkage mechanism (44) drives the second clamping mechanism (43) to clamp the chip body (3), the first clamping mechanism (42) is linked to separate from the chip body (3).

2. A chip thermal shock test device according to claim 1, characterized in that: The moving member (2) comprises a lower annular plate (21), an upper annular plate (22), a cylinder (23) and a connecting member (24); the clamping mechanism (4) is arranged on the top of the lower annular plate (21); the upper annular plate (22) is located above the lower annular plate (21); and the lower annular plate (21) is connected to the upper annular plate (22) via the connecting member (24); the cylinder (23) is installed at the bottom of the test cylinder (1); and the cylinder (23) is used to control the lifting and lowering of the lower annular plate (21).

3. A chip thermal shock test device according to claim 2, characterized in that: The mounting seat (41) comprises a main housing (411), a first auxiliary housing (413) with a first through slot (412), and a second auxiliary housing (415) with a second through slot (414); the main housing (411) is mounted on the top of the lower annular plate (21); the two first auxiliary housings (413) and the two second auxiliary housings (415) are symmetrically arranged at opposite side walls of the main housing (411); the main housing (411) is connected to the first auxiliary housing (413) and the second auxiliary housing (415); the first through slot (412) and the second through slot (414) are respectively opened on the top of the first auxiliary housing (413) and the second auxiliary housing (415).

4. A chip thermal shock test device according to claim 2, characterized in that: The test cylinder (1) comprises an upper annular shell (11), a lower annular shell (12), a cylinder (13) and a bracket (14); the cylinder (13) is a hollow structure with an open top; the upper annular shell (11) and the lower annular shell (12) are fixedly mounted on the outer side of the cylinder (13) in sequence from top to bottom; the inner cavity of the cylinder (13) is communicated with the inner cavities of the upper annular shell (11) and the lower annular shell (12) respectively; the cross-sections of the upper annular plate (22) and the lower annular plate (21) are the same as the inner cross-section of the cylinder (13); a plurality of brackets (14) are circumferentially arranged at the bottom of the lower annular shell (12); and the upper annular shell (11) and the lower annular shell (12) are respectively provided with heating elements and cooling elements uniformly distributed in the circumference.

5. A chip thermal shock test device according to claim 3, characterized in that: The first clamping mechanism (42) comprises a first clamping plate (421), an L-shaped plate (422), a guide rod (423) and a first spring (424); the two guide rods (423) are symmetrically arranged in the first sub-shell (413), and one end of the guide rod (423) extends into the main shell (411); one end of the L-shaped plate (422) is connected to the first clamping plate (421); the first clamping plate (421) is in contact with the side wall of the chip body (3); the other end of the L-shaped plate (422) passes through the first through groove (412), and the L-shaped plate (422) is slidably sleeved with the guide rod (423); the first spring (424) is sleeved on the guide rod (423), and the two ends of the first spring (424) are respectively connected to the inner wall of the first sub-shell (413) and the side wall of the L-shaped plate (422).

6. A chip thermal shock test device according to claim 5, characterized in that: The second clamping mechanism (43) comprises a second clamping plate (431), a T-shaped plug block (432), a plug shell (433), a second spring (434) and a movable plate (435); the bottom end of the movable plate (435) passes through the second through slot (414) and extends into the second auxiliary housing (415); the plug shell (433) is mounted on the top of the movable plate (435); the T-shaped plug block (432) is slidably plugged into the plug shell (433); the T-shaped plug block (432) and the plug shell (433) are connected via the second spring (434); and the second clamping plate (431) is mounted on one end of the T-shaped plug block (432).

7. A chip thermal shock test device according to claim 6, characterized in that: The linkage mechanism (44) comprises a cross column (441), a connecting rod (442), a push block (443), a driving mechanism (444) and a rotating rod (445) with opposite threads at both ends. The rotating rod (445) is rotatably mounted between the two second auxiliary housings (415). The movable plate (435) is threadedly sleeved with the rotating rod (445) at positions close to both ends. The two cross columns (441) are symmetrically mounted on the side walls of the movable plate (435). The push block (443) is slidably sleeved with the guide rod (423). The two ends of the connecting rod (442) are respectively hinged to the ends of the cross column (441) and the push block (443). The driving mechanism (444) is mounted on the lower annular plate (21), and the driving mechanism (444) is used to control the forward and reverse rotation of the rotating rod (445).

8. A chip thermal shock test device according to claim 7, characterized in that: The driving mechanism (444) comprises a U-shaped plate (4441), a motor (4442), a toothed disc (4443), a first spur gear (4444), a driving bevel gear (4445) and a driven bevel gear (4446), wherein the driven bevel gear (4446) is coaxially connected to one end of a rotating rod (445) via a pin shaft, the driving bevel gear (4445) meshes with the driven bevel gear (4446), and the driving bevel gear (4445) is connected to the driven bevel gear (4446) via a rotating pin. The top of the lower annular plate (21) is rotatably connected, the first spur gear (4444) is fixedly sleeved on the rotating pin, the U-shaped plate (4441) is installed at the bottom of the lower annular plate (21), the motor (4442) is installed on the upper surface of the horizontal part of the U-shaped plate (4441), and the output shaft of the motor (4442) passes through the lower annular plate (21) and is coaxially connected to the toothed disc (4443), and the toothed disc (4443) is meshed with the first spur gear (4444).

9. A chip thermal shock test device according to claim 8, characterized in that: The toothed disc (4443) is provided with a spoiler mechanism (5), the spoiler mechanism (5) comprising a rotating shaft (51), blades (52), a second spur gear (53) and an inner gear ring (54), the plurality of rotating shafts (51) being rotatably mounted on the top of the toothed disc (4443), the second spur gear (53) being fixedly sleeved on the rotating shaft (51), the inner gear ring (54) being meshed with the second spur gear (53), and the inner gear ring (54) being connected to the top of the lower annular plate (21) via a support rod.

10. A chip thermal shock test method, applied to a chip thermal shock test device as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: using a first clamping mechanism (42) on the mounting seat (41) to clamp two sides of the chip body (3), so that the chip body (3) is suspended and positioned above the mounting seat (41); Step 2: Control the moving part (2) to drive the positioned chip body (3) to move downward along the test tube (1) to the maximum stroke, so that the chip body (3) corresponds to the cooling area in the test tube (1), start the linkage mechanism (44) to drive the second clamping mechanism (43) to clamp the chip body (3), and at the same time, link the first clamping mechanism (42) to separate from the chip body (3), and then control the second clamping mechanism (43) and the first clamping mechanism (42) to reset, and repeat this process to dynamically clamp the chip body (3); Step 3: Control the moving part (2) to drive the chip body (3) that has completed the cold shock to move upward along the test tube (1), so that the chip body (3) corresponds to the heating area in the test tube (1), and start the linkage mechanism (44) to dynamically clamp the chip body (3), so that the chip body (3) can be thermally shocked; Step 4: Continue to control the moving part (2) to rise to the maximum stroke, so that the chip body (3) that has completed the hot and cold shock rises to the top of the test tube (1), and remove the chip body (3) to perform subsequent performance testing on it.

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