Full-automatic CCD laminating machine alignment control method based on intelligent cruise

Abstract

The invention relates to the technical field of CCD laminating equipment control, in particular to a full-automatic CCD laminating machine alignment control method based on intelligent cruise. If the fitting working condition clustering result causing the abnormal fitting sub-model region to generate the simulated fitting dislocation amplitude shows that the fitting working condition clustering result is a class of fitting working condition results; if yes, geometric space volume adjustment is carried out on the pose error of the joint termination pose vector of the joint module based on the joint dislocation pattern array of the first-class joint abnormal area so as to control the joint transportation pose; if the fitting working condition clustering result shows that the fitting working condition is the second-class fitting working condition, the re-projection error rate of the final field coordinate point set relative to the first field coordinate point set when the current fitting workpiece and the fitting material are aligned and fitted is calculated, and a fitting workpiece conveying mechanism is controlled according to the optimal conveying rate determined by the re-projection error rate. According to the invention, the workpiece and the material of the full-automatic CCD laminating machine can be precisely aligned and controlled to be laminated, and the alignment accuracy of the production of the full-automatic CCD laminating machine is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of CCD laminating equipment control, and in particular to a fully automatic CCD laminating machine alignment control method based on intelligent cruise. Background Art

[0002] The fully automatic CCD laminating machine is a high-precision device that integrates advanced image processing technology. It is mainly used in the laminating process in industrial manufacturing. The CCD camera is used to monitor and guide the laminating process in real time to achieve high-precision alignment and laminating. In the automated manufacturing process, the laminating process is a key link in the production of many high-precision products, such as the assembly of display modules, touch screens, and camera modules. The laminating accuracy directly affects the quality and performance of the product, and the alignment control technology is the core to achieve high-precision laminating. However, existing fully automatic CCD bonding equipment has some defects in practical applications. For example, the bonding alignment control accuracy of transferring bonding materials to bonding workpieces is low, which makes it impossible to accurately align local features such as holes, slots and frames, and the fine alignment performance is poor; and the alignment control of existing CCD bonding machines still requires manual intervention and field testing to determine whether it is accurate, which is time-consuming and labor-intensive, and the traceability results of bonding errors caused by equipment alignment control have human intervention errors, making them unreliable; at the same time, it is difficult for existing CCD bonding machines to analyze and optimize the control states of different bonding control mechanisms based on the traceability results of bonding anomalies, which causes a sharp increase in the product bonding defect rate, increases the frequency of product bonding rework, and does not meet the high-quality product bonding requirements. Summary of the invention

[0003] The present invention overcomes the shortcomings of the prior art and provides a fully automatic CCD laminating machine alignment control method based on intelligent cruise.

[0004] To achieve the above object, the technical solution adopted by the present invention is: The first aspect of the present invention provides a positioning control method for a fully automatic CCD laminating machine based on intelligent cruise, comprising the following steps: S102: Obtaining a prescribed laminating and transporting range from a laminating material preparation area to a laminating workpiece transport area, assigning values ​​to calculate image frame data of the fully automatic CCD laminating machine capturing the current laminating workpiece and the laminating material based on the prescribed laminating and transporting range to construct a first field coordinate point set and a second field coordinate point set, calculating a coordinate control amount of the second field coordinate point set from the first field coordinate point set, and obtaining an accurate alignment control amount; S104: Based on the intelligent cruise technology, a control process is planned for the accurate alignment control amount and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain an abnormal bonding sub-model area of ​​a simulated bonding product, obtain a bonding module and a bonding workpiece transmission mechanism to generate a first-class bonding condition and a second-class bonding condition of simulated bonding dislocation in the abnormal bonding sub-model area, perform clustering operation, and obtain a bonding condition clustering result; S106: If the clustering result of the bonding working conditions that cause the abnormal bonding sub-model area to generate the simulated bonding misalignment amplitude shows a type of bonding working condition result, then the termination bonding posture vector of the bonding module and the bonding misalignment pattern array of the type of abnormal bonding area are obtained, and the posture error of the termination bonding posture vector is adjusted in geometric space volume based on the bonding misalignment pattern array to control the bonding transport posture, and a first alignment control scheme is obtained; S108: If the clustering result of the bonding conditions that cause the abnormal bonding sub-model area to produce a simulated bonding misalignment amplitude shows a second type of bonding condition, then calculate the reprojection error rate of the final field coordinate point set relative to the first field coordinate point set when the current bonding workpiece and the bonding material are aligned and bonded, and control the bonding workpiece transmission mechanism at the optimal transport rate determined according to the reprojection error rate to obtain a second alignment control scheme.

[0005] More specifically, the step S102 includes the following steps: Get the laminating workpiece transmission area and laminating material preparation area of ​​the fully automatic CCD laminating machine, and simultaneously get the travel range of the laminating module in the fully automatic CCD laminating machine; Based on the preset laminating and transporting range limit of the travel range, the laminating and transporting range limit is used as the constraint benchmark, and the laminating and transporting range is planned in the fully automatic CCD laminating machine until the constraint benchmark is reached, thereby obtaining the prescribed laminating and transporting range from the laminating material preparation area to the laminating workpiece transmission area; Capturing and photographing the bonded workpieces in the bonded workpiece transmission area by a CCD visual camera on the fully automatic CCD bonding machine to obtain image frame data of the current bonded workpieces; The real-time image frame data is extracted and calculated using a Sobel edge detection operator to obtain the bonding features of the current bonding workpiece, and the distribution point position of each bonding feature on the current bonding workpiece is obtained to obtain a bonding feature distribution map; Constructing a dimensional coordinate field that specifies the bonding transport range, assigning specific coordinates to the bonding feature distribution map based on the dimensional coordinate field, obtaining a field coordinate point of each bonding feature located in the bonding workpiece transport area, and marking it as a first field coordinate point set; Acquire image frame data of the laminating material on the laminating material preparation area, repeat the above-mentioned steps of feature extraction and coordinate assignment to process the image frame data of the laminating material, generate domain coordinate points where each laminating feature is located in the laminating material preparation area, and mark them as a second domain coordinate point set; Calculate the center point between the first domain coordinate point set and the second domain coordinate point set, and based on the center point, remove the centering of the corresponding fitting feature of the second domain coordinate point set from the first domain coordinate point set to generate a covariance matrix of the centralized domain coordinate point set; A singular value decomposition algorithm is introduced, and the second field coordinate point set is taken as the target point set. The singular values ​​of the covariance matrix are decomposed in the singular value decomposition algorithm based on the target point set to obtain the rotation matrix and translation vector of the second field coordinate point set from the first field coordinate point set. Based on the rotation matrix and the translation vector, the accurate alignment control amount of the bonding material from the bonding material preparation area to the bonding workpiece transmission area is determined.

[0006] More specifically, the step S104 includes the following steps: Based on the intelligent cruise technology, the control process planning of the accurate alignment control quantity is carried out, and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain a simulated bonding finished product model. Based on the bonding task analysis of the fully automatic CCD bonding machine, the simulated bonding finished product model has a quantitative bonding misalignment area compared with the standard bonding finished product model, and the abnormal bonding sub-model area is obtained; At this time, multiple bonding conditions in which the bonding module generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area are obtained through the bonding production log, and are defined as a type of bonding condition; Acquire multiple bonding conditions in which the bonding workpiece transmission mechanism generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area, which are defined as Class II bonding conditions, and simultaneously acquire a bonding control strategy table for decisions when the bonding module outputs Class I bonding conditions and when the bonding workpiece transmission mechanism outputs Class II bonding conditions; A candidate sample set of fitting conditions is constructed based on multiple first-class fitting conditions and multiple second-class fitting conditions, a canopy center point of the candidate sample set is set according to the fitting control strategy table, and the Euclidean distance between each fitting condition in the candidate sample set and the canopy center point is calculated to generate a temporary cluster of the current canopy; Repeat the above steps of calculating the Euclidean distance between the fitting condition and the center point of the umbrella cover to calculate all the fitting conditions in the candidate sample set, and obtain all the current umbrella cover temporary clusters. Combine all the current umbrella cover temporary clusters to generate the fitting condition clustering result that causes the abnormal fitting sub-model area to produce a simulated fitting misalignment amplitude.

[0007] More specifically, the control process planning of the accurate alignment control amount based on the intelligent cruise technology and the construction of a three-dimensional simulation model of a fully automatic CCD bonding machine to perform simulation to obtain a simulated bonding finished product model, and the simulated bonding finished product model based on the bonding task analysis of the fully automatic CCD bonding machine has a quantitative bonding misalignment area compared with the standard bonding finished product model, and obtains an abnormal bonding sub-model area, which specifically includes the following steps: The accurate alignment control amount is automatically planned and calculated by intelligent cruise technology to obtain a transportation control process for transporting the bonding material from the bonding material preparation area to the bonding workpiece transmission area to align the bonding workpiece when the bonding module executes the accurate alignment control amount; Construct a three-dimensional simulation model of a fully automatic CCD laminating machine, input the transport control process into the three-dimensional simulation model of the fully automatic CCD laminating machine to perform alignment simulation between the laminating material and the laminating workpiece, and obtain a simulated laminating finished product model after the laminating alignment simulation is completed; Obtain the laminating task of the fully automatic CCD laminating machine, and construct a standard laminating product model according to the laminating task and the allowable laminating misalignment range of the standard laminating product model in accordance with the laminating task; Dividing the simulated bonding product model into N sub-model regions based on the bonding feature distribution map, calculating the quantitative bonding misalignment between the bonding material and the bonding workpiece in the simulated bonding product model compared with the standard bonding product model, and obtaining the simulated bonding misalignment amplitude of each sub-model region; Only the sub-model areas corresponding to the simulated fitting misalignment amplitude larger than the allowed fitting misalignment amplitude are extracted and marked as abnormal fitting sub-model areas.

[0008] More specifically, the step S106 includes the following steps: If the clustering result of the fitting condition that causes the abnormal fitting sub-model area to produce the simulated fitting misalignment amplitude shows a type of fitting condition result, then one or more sub-model areas that all show a type of fitting condition are obtained and marked as a type of abnormal fitting area; Obtain a bonding misalignment pattern array formed by one or more first-class bonding abnormal areas located in the simulated bonding product model, and simultaneously obtain a termination bonding posture vector when the bonding module aligns the bonding material onto the bonding workpiece; Constructing a geometric topological space, obtaining a fitting control error region formed between the termination fitting posture vector of the fitting module and the fitting misalignment pattern array of the simulated finished model, interpolating the fitting control error region in the geometric topological space with the fitting misalignment pattern array as a geometric interpolation control point until the termination fitting posture vector is touched, and obtaining a spatial volume of the fitting control error region associated with the fitting misalignment pattern array; The actual lamination alignment pattern of the lamination misalignment pattern array is obtained, and a standard lamination alignment pattern without lamination error in the lamination misalignment area is obtained through the lamination task, and the least square method is introduced to calculate the pattern drift between the actual lamination alignment pattern and the standard lamination alignment pattern; Eliminating the pattern drift to update the spatial volume of the bonding control error area to obtain a new spatial volume, calculating the volume deviation between the new spatial volume and the spatial volume to obtain a volume deviation value, and determining a standard bonding posture vector when the bonding module aligns the bonding material to the bonding workpiece according to the volume deviation value; The intelligent cruise technology is obtained to realize the preset fitting transport route of the standard fitting posture vector and the actual fitting transport route that terminates the fitting posture vector, and the fitting transport posture of the fitting module is controlled based on the route distance difference between the preset fitting transport route and the actual fitting transport route to obtain a first alignment control scheme.

[0009] More specifically, the step S108 includes the following steps: If the clustering result of the bonding condition that causes the simulated bonding misalignment amplitude in the abnormal bonding sub-model area shows a second-class bonding condition, the final frame image data of the current bonding workpiece and the bonding material when aligned and bonded is obtained by shooting with a CCD visual camera; Calculate and analyze the characteristic coordinates of the final frame image data based on the dimensional coordinate field to obtain a final field coordinate point set of the current bonded workpiece; Constructing a homography matrix, writing the final domain coordinate point set and the first domain coordinate point set into the homography matrix for linear homogeneous operation, and obtaining a homography matrix equation of the final domain coordinate point set-the first domain coordinate point set; Solving the homography matrix equation to obtain the reprojection error rate of each corresponding field coordinate between the final field coordinate point set and the first field coordinate point set, and determining the inertia force index that causes the bonded workpiece to deviate from the predetermined position at the current transport rate of the bonded workpiece transmission mechanism according to the reprojection error rate; The allowable inertia force index is preset. If the inertia force index is greater than the allowable inertia force index, a dynamics knowledge network is obtained based on big data, and at the same time, a transportation principle that fits the workpiece transmission mechanism is obtained; The rate of the allowable inertia force index generated under the premise of the transportation principle is analyzed through the dynamic knowledge network to obtain the optimal transportation rate, and the difference between the optimal transportation rate and the current transportation rate is calculated to obtain the transportation rate difference. Based on the transportation rate difference, the real-time transportation rate of the bonding workpiece conveying mechanism for conveying the bonding workpiece is controlled to obtain the second positioning control scheme.

[0010] The second aspect of the present invention provides a fully automatic CCD laminating machine alignment control system based on intelligent cruise, the fully automatic CCD laminating machine alignment control system includes a memory and a processor, the memory stores a fully automatic CCD laminating machine alignment control method program based on intelligent cruise, when the fully automatic CCD laminating machine alignment control method program is executed by the processor, any one of the steps of the fully automatic CCD laminating machine alignment control method is implemented.

[0011] The present invention solves the technical defects existing in the background technology, and the beneficial technical effects of the present invention are: Based on the intelligent cruise technology, the control process planning of the accurate alignment control quantity is carried out, and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain an abnormal bonding sub-model area of ​​the simulated bonding product, obtain a bonding module and a bonding workpiece transmission mechanism in the abnormal bonding sub-model area to produce a type I bonding condition and a type II bonding condition of simulated bonding misalignment, and perform clustering operations to obtain a bonding condition clustering result; if the bonding condition clustering result that causes the abnormal bonding sub-model area to produce a simulated bonding misalignment amplitude shows a type I bonding condition result, then the termination bonding posture vector of the bonding module and a type I bonding condition are obtained. The bonding misalignment pattern array of the abnormal area, based on the bonding misalignment pattern array, performs geometric space volume adjustment on the posture error of the termination bonding posture vector to control the bonding transportation posture, and obtains the first alignment control scheme; if the clustering result of the bonding condition that causes the abnormal bonding sub-model area to produce the simulated bonding misalignment amplitude shows a second type of bonding condition, then calculate the reprojection error rate of the final domain coordinate point set relative to the first domain coordinate point set when the current bonding workpiece and the bonding material are aligned and bonded, and control the bonding workpiece transmission mechanism according to the optimal transportation rate determined by the reprojection error rate, and obtain the second alignment control scheme. The present invention can accurately align and control the workpiece and material bonding process of the fully automatic CCD bonding machine to eliminate the alignment bonding error between the workpiece and the material, effectively improve the alignment accuracy of the production of the fully automatic CCD bonding machine, optimize the product bonding quality, and reduce the rework rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without paying creative work.

[0013] Figure 1 The process of a fully automatic CCD laminating machine alignment control method based on intelligent cruise is shown Figure 1 ; Figure 2The process of a fully automatic CCD laminating machine alignment control method based on intelligent cruise is shown Figure 2 ; Figure 3 The system framework diagram of a fully automatic CCD laminating machine alignment control system based on intelligent cruise is shown. DETAILED DESCRIPTION

[0014] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0015] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0016] The first aspect of the present invention provides a fully automatic CCD laminating machine alignment control method based on intelligent cruise control, such as Figure 1 As shown, the following steps are included: S102: Obtaining a prescribed laminating and transporting range from a laminating material preparation area to a laminating workpiece transport area, assigning values ​​to calculate image frame data of the fully automatic CCD laminating machine capturing the current laminating workpiece and the laminating material based on the prescribed laminating and transporting range to construct a first field coordinate point set and a second field coordinate point set, calculating a coordinate control amount of the second field coordinate point set from the first field coordinate point set, and obtaining an accurate alignment control amount; S104: Based on the intelligent cruise technology, a control process is planned for the accurate alignment control amount and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain an abnormal bonding sub-model area of ​​a simulated bonding product, obtain a bonding module and a bonding workpiece transmission mechanism to generate a first-class bonding condition and a second-class bonding condition of simulated bonding dislocation in the abnormal bonding sub-model area, perform clustering operation, and obtain a bonding condition clustering result; S106: If the clustering result of the bonding working conditions that cause the abnormal bonding sub-model area to generate the simulated bonding misalignment amplitude shows a type of bonding working condition result, then the termination bonding posture vector of the bonding module and the bonding misalignment pattern array of the type of abnormal bonding area are obtained, and the posture error of the termination bonding posture vector is adjusted in geometric space volume based on the bonding misalignment pattern array to control the bonding transport posture, and a first alignment control scheme is obtained; S108: If the clustering result of the bonding conditions that cause the abnormal bonding sub-model area to produce a simulated bonding misalignment amplitude shows a second type of bonding condition, then calculate the reprojection error rate of the final field coordinate point set relative to the first field coordinate point set when the current bonding workpiece and the bonding material are aligned and bonded, and control the bonding workpiece transmission mechanism at the optimal transport rate determined according to the reprojection error rate to obtain a second alignment control scheme.

[0017] More specifically, the step S102 includes the following steps: Get the laminating workpiece transmission area and laminating material preparation area of ​​the fully automatic CCD laminating machine, and simultaneously get the travel range of the laminating module in the fully automatic CCD laminating machine; Based on the preset laminating and transporting range limit of the travel range, the laminating and transporting range limit is used as the constraint benchmark, and the laminating and transporting range is planned in the fully automatic CCD laminating machine until the constraint benchmark is reached, thereby obtaining the prescribed laminating and transporting range from the laminating material preparation area to the laminating workpiece transmission area; Capturing and photographing the bonded workpieces in the bonded workpiece transmission area by a CCD visual camera on the fully automatic CCD bonding machine to obtain image frame data of the current bonded workpieces; The real-time image frame data is extracted and calculated using a Sobel edge detection operator to obtain the bonding features of the current bonding workpiece, and the distribution point position of each bonding feature on the current bonding workpiece is obtained to obtain a bonding feature distribution map; Constructing a dimensional coordinate field that specifies the bonding transport range, assigning specific coordinates to the bonding feature distribution map based on the dimensional coordinate field, obtaining a field coordinate point of each bonding feature located in the bonding workpiece transport area, and marking it as a first field coordinate point set; Acquire image frame data of the laminating material on the laminating material preparation area, repeat the above-mentioned steps of feature extraction and coordinate assignment to process the image frame data of the laminating material, generate domain coordinate points where each laminating feature is located in the laminating material preparation area, and mark them as a second domain coordinate point set; Calculate the center point between the first domain coordinate point set and the second domain coordinate point set, and based on the center point, remove the centering of the corresponding fitting feature of the second domain coordinate point set from the first domain coordinate point set to generate a covariance matrix of the centralized domain coordinate point set; A singular value decomposition algorithm is introduced, and the second field coordinate point set is taken as the target point set. The singular values ​​of the covariance matrix are decomposed in the singular value decomposition algorithm based on the target point set to obtain the rotation matrix and translation vector of the second field coordinate point set from the first field coordinate point set. Based on the rotation matrix and the translation vector, the accurate alignment control amount of the bonding material from the bonding material preparation area to the bonding workpiece transmission area is determined.

[0018] It should be noted that the bonding features include holes, slots and frames. Fully automatic CCD bonding machines usually use bonding modules such as bonding robots to automatically absorb and transport bonding materials to the top of the workpiece for alignment and bonding. However, some existing fully automatic CCD bonding machines transport the bonding workpiece in a random placement state, that is, the placement and direction of the workpiece on the transmission mechanism are not fixed, and the control performance of the bonding module is low, making it difficult for the bonding module to automatically align the bonding material according to the randomly placed workpiece, reducing the alignment and bonding accuracy of the bonding material on the workpiece. In this regard, the method obtains the bonding workpiece transmission area and the bonding material preparation area of ​​the full-automatic CCD bonding machine. Since the bonding process is to transfer the bonding material from the bonding material preparation area to the bonding workpiece in the bonding workpiece transmission area for alignment, the bonding module has a specified bonding transportation range, that is, a certain appropriate activity range of the bonding module after the two areas are merged; since there are certain bonding feature alignment requirements between some bonding materials and bonding workpieces, for example, a certain hole position on the workpiece needs to be aligned with the corresponding hole position of the same size on the material, it is necessary to ensure that all bonding features are aligned before alignment bonding is performed. Therefore, the method distributes the bonding features of the material and the workpiece captured by the CCD vision camera in the dimensional coordinate field to assign coordinate values ​​to each bonding feature, and the coordinate point set between the material and the workpiece is the amount that the bonding module needs to drive the bonding material to perform alignment control, so it is necessary to further align and calculate the two sets of coordinate point sets. During the bonding process, the bonding workpiece transmission mechanism will intermittently stop the workpiece in the designated bonding area to wait for the material to be transported for bonding. In this process, the workpiece is relatively still and the material is relatively active. Therefore, it is necessary to use the first field coordinate point set representing the bonding workpiece as the target point set to calculate the positioning control amount of the second field point set representing the bonding material. The determination of the positioning control amount complies with the operating criteria of the fully automatic CCD bonding machine, effectively improving the calculation accuracy of the positioning control amount.

[0019] It should be noted that, since there is global displacement interference of coordinates in the process of calculating the displacement of the second domain point set to align the first domain coordinate point set in the dimensional coordinate field, this interference can be eliminated by removing the centering of the fitting features corresponding to the first domain coordinate point set and the second domain coordinate point set, ensuring that subsequent calculations focus on the rotation and relative relationship between coordinates, and providing a reliable basis for the subsequent singular value decomposition algorithm to calculate the translation vector of the alignment. The matrix captures the linear relationship between the second domain coordinate point set and the first domain coordinate point set, and is the key basis for the calculation of the rotation matrix. This method can accurately calculate the alignment control amount of the fully automatic CCD bonding machine, so that the bonding materials can be more accurately aligned and bonded in the case of randomly transmitted and placed bonding workpieces, reducing the bonding error caused by the randomness of position or direction alignment, solving the problem of insufficient automatic control bonding accuracy of traditional CCD bonding machines, and greatly improving the product bonding qualification rate.

[0020] More specifically, the step S104 includes the following steps: Based on the intelligent cruise technology, the control process planning of the accurate alignment control quantity is carried out, and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain a simulated bonding finished product model. Based on the bonding task analysis of the fully automatic CCD bonding machine, the simulated bonding finished product model has a quantitative bonding misalignment area compared with the standard bonding finished product model, and the abnormal bonding sub-model area is obtained; At this time, multiple bonding conditions in which the bonding module generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area are obtained through the bonding production log, and are defined as a type of bonding condition; Acquire multiple bonding conditions in which the bonding workpiece transmission mechanism generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area, which are defined as Class II bonding conditions, and simultaneously acquire a bonding control strategy table for decisions when the bonding module outputs Class I bonding conditions and when the bonding workpiece transmission mechanism outputs Class II bonding conditions; A candidate sample set of fitting conditions is constructed based on multiple first-class fitting conditions and multiple second-class fitting conditions, a canopy center point of the candidate sample set is set according to the fitting control strategy table, and the Euclidean distance between each fitting condition in the candidate sample set and the canopy center point is calculated to generate a temporary cluster of the current canopy; Repeat the above steps of calculating the Euclidean distance between the fitting condition and the center point of the umbrella cover to calculate all the fitting conditions in the candidate sample set, and obtain all the current umbrella cover temporary clusters. Combine all the current umbrella cover temporary clusters to generate the fitting condition clustering result that causes the abnormal fitting sub-model area to produce a simulated fitting misalignment amplitude.

[0021] It should be noted that after calculating the accurate alignment control amount, the fully automatic CCD laminating machine can be accurately aligned and controlled. However, when the fully automatic CCD laminating machine has errors in laminating materials on the workpiece and deviations and other abnormalities under the premise of running the accurate alignment control amount, it means that the fully automatic CCD laminating machine has a control error. The control error of the fully automatic CCD laminating machine may be caused by a control error in the laminating module responsible for transporting the laminating material, or by a transport control error in the laminating workpiece transport mechanism responsible for transporting the laminating workpiece. Therefore, it is necessary to determine the cause of the working condition of the area with laminating abnormalities on the finished film model. To this end, the method first constructs a three-dimensional simulation model of a fully automatic CCD laminating machine to perform a simulation of accurate alignment control quantity to verify and locate the sub-model area with laminating abnormalities; then, the center point of the umbrella cover is set based on the laminating control strategy table decided when outputting a type of laminating condition and a type of laminating condition. According to this clustering basis, the type of laminating condition representing the laminating module when a laminating misalignment occurs in the abnormal laminating sub-model area and the type of laminating condition of the laminating workpiece transmission mechanism are clustered to the center point of the umbrella cover to form an umbrella-shaped current umbrella cover temporary clustering cluster, which represents a highly affiliated set of laminating conditions when a laminating misalignment occurs in the abnormal laminating sub-model area, and is the basis for determining different control errors of the fully automatic CCD laminating machine. This method can be used to cluster the bonding conditions that lead to the bonding deviation of the material on the workpiece, so that the causes of erroneous control conditions in the bonding and alignment process can be highly restored in a clustering manner, thereby improving the accuracy and intelligence of subsequent control analysis and alignment bonding control of the fully automatic CCD bonding machine, and eliminating the product bonding defect rate under different control errors.

[0022] More specifically, the control process planning of the accurate alignment control amount based on the intelligent cruise technology and the construction of a three-dimensional simulation model of a fully automatic CCD bonding machine to perform simulation to obtain a simulated bonding finished product model, and the simulated bonding finished product model based on the bonding task analysis of the fully automatic CCD bonding machine has a quantitative bonding misalignment area compared with the standard bonding finished product model, and obtains an abnormal bonding sub-model area, which specifically includes the following steps: The accurate alignment control amount is automatically planned and calculated by intelligent cruise technology to obtain a transportation control process for transporting the bonding material from the bonding material preparation area to the bonding workpiece transmission area to align the bonding workpiece when the bonding module executes the accurate alignment control amount; Construct a three-dimensional simulation model of a fully automatic CCD laminating machine, input the transport control process into the three-dimensional simulation model of the fully automatic CCD laminating machine to perform alignment simulation between the laminating material and the laminating workpiece, and obtain a simulated laminating finished product model after the laminating alignment simulation is completed; Obtain the laminating task of the fully automatic CCD laminating machine, and construct a standard laminating product model according to the laminating task and the allowable laminating misalignment range of the standard laminating product model in accordance with the laminating task; Dividing the simulated bonding product model into N sub-model regions based on the bonding feature distribution map, calculating the quantitative bonding misalignment between the bonding material and the bonding workpiece in the simulated bonding product model compared with the standard bonding product model, and obtaining the simulated bonding misalignment amplitude of each sub-model region; Only the sub-model areas corresponding to the simulated fitting misalignment amplitude larger than the allowed fitting misalignment amplitude are extracted and marked as abnormal fitting sub-model areas.

[0023] It should be noted that the intelligent cruise technology is a dynamic adjustment and optimization method based on artificial intelligence algorithms. It can automatically analyze the deviations that occur during the bonding process and automatically adjust the position and angle of the bonding machine according to real-time feedback, which can greatly improve the bonding accuracy of the fully automatic CCD bonding machine to implement accurate alignment control. However, some existing fully automated CCD bonding machines still use physical bonding tests for testing after obtaining accurate alignment control. This not only consumes a lot of materials and workpieces to provide testing, but also the alignment bonding error detection and traceability of the fully automatic CCD bonding machine still requires manual intervention. There are large human detection errors, which greatly reduces the detection efficiency of the control error of the fully automatic CCD bonding machine under the premise of accurate alignment control, increases a lot of manpower and material output costs, and is difficult to ensure the accuracy of the error traceability of the control results of the fully automatic CCD bonding machine. Therefore, this method simulates the transportation control process of the accurate alignment control quantity planned by the intelligent cruise technology by constructing a three-dimensional simulation model of the fully automatic CCD laminating machine, so as to obtain a simulated laminating finished product model. The simulated laminating finished product model reflects the laminating production accuracy of the fully automatic CCD laminating machine based on the intelligent cruise technology to the maximum extent, and indirectly reflects whether the current fully automatic CCD laminating machine has laminating production errors. This method divides the simulated laminating finished product model into N sub-model areas to facilitate the refined calculation of laminating misalignment and improve the traceability accuracy of laminating errors; then calculate the simulated laminating misalignment amplitude of each sub-model area compared to the standard laminating finished product model. If the simulated laminating misalignment amplitude is greater than the allowable laminating misalignment amplitude, it means that there is a local laminating offset between the material and the workpiece in this area, so this area is an abnormal laminating sub-model area. This method can be used to simulate and test the current fully automatic CCD laminating machine based on the use of accurate alignment control quantity under the support of intelligent cruise technology, so as to locate the area with laminating abnormalities through simulated laminating finished products, replacing the high-cost and tedious steps of traditional manual intervention and field testing, saving time and effort, and improving the error tracing accuracy of the control results of the fully automatic CCD laminating machine, providing a reliable and credible analysis data basis for the subsequent control error judgment of the fully automatic CCD laminating machine.

[0024] More specifically, the step S106 is as follows: Figure 2 As shown, the specific steps include: S202: If the clustering result of the fitting condition that causes the abnormal fitting sub-model region to generate the simulated fitting misalignment amplitude shows a type of fitting condition result, one or more sub-model regions that all show a type of fitting condition are obtained and marked as a type of abnormal fitting region; S204: obtaining a bonding misalignment pattern array formed by one or more first-class bonding abnormal areas located in the simulated bonding product model, and obtaining a termination bonding posture vector when the bonding module aligns the bonding material onto the bonding workpiece; S206: constructing a geometric topological space, obtaining a fitting control error region formed between the termination fitting posture vector of the fitting module and the fitting misalignment pattern array of the simulated finished model, interpolating the fitting control error region in the geometric topological space with the fitting misalignment pattern array as a geometric interpolation control point until the termination fitting posture vector is touched, and obtaining a spatial volume of the fitting control error region associated with the fitting misalignment pattern array; S208: obtaining an actual lamination alignment pattern where the lamination misalignment pattern array is located, obtaining a standard lamination alignment pattern where no lamination error occurs in the lamination misalignment region through the lamination task, and introducing a least square method to calculate a pattern drift amount between the actual lamination alignment pattern and the standard lamination alignment pattern; S210: Eliminating the pattern drift to update the spatial volume of the bonding control error area to obtain a new spatial volume, calculating the volume deviation between the new spatial volume and the spatial volume to obtain a volume deviation value, and determining a standard bonding posture vector when the bonding module aligns the bonding material to the bonding workpiece according to the volume deviation value; S212: Acquire the preset fitting transport route for realizing the standard fitting posture vector and the actual fitting transport route for terminating the fitting posture vector using the intelligent cruise technology, control the fitting transport posture of the fitting module based on the route distance difference between the preset fitting transport route and the actual fitting transport route, and obtain a first alignment control scheme.

[0025] It should be noted that if the clustering result of the bonding conditions that cause the abnormal bonding sub-model area to produce a simulated bonding misalignment amplitude shows a type of bonding condition result, it means that the local bonding abnormality between the material and the workpiece is caused by improper control of the transportation posture of the bonding module. Therefore, it is necessary to accurately correct the bonding transportation posture of the bonding module. In view of this, this method obtains the bonding misalignment pattern array formed by a type of abnormal bonding area and the terminal bonding posture vector when the bonding module aligns the bonding material to the bonding workpiece. The analysis based on the two is because the bonding misalignment pattern array is the embodiment of the alignment error of the bonding module, and the terminal bonding posture vector is the final form presentation when the bonding module aligns the array. From another perspective, it is explained that the terminal bonding posture vector is an incorrect posture, which is an important analytical premise for the correction control of the bonding transportation posture. The wrong termination fitting posture vector causes a certain spatial fitting error volume between the fitting module and the fitting misalignment pattern array. It can be understood that the existence of the spatial fitting error volume leads to the appearance of the fitting misalignment pattern array. Therefore, the method first constructs a geometric space volume based on the fitting control error region associated with the above-mentioned fitting misalignment pattern array in a geometric topological space, and updates the space volume by eliminating the pattern drift between the actual fitting alignment pattern where the fitting misalignment pattern array is located and the standard fitting alignment pattern in the fitting misalignment region that does not produce a fitting error. The position of the termination fitting posture vector after the spatial volume is updated is the standard fitting posture vector, which realizes the fitting posture vector restoration effect based on the elimination of the fitting misalignment pattern array, and improves the accuracy of posture correction control for the purpose of eliminating fitting errors. Then there is also a difference in the fitting transportation route between the standard fitting posture vector and the termination fitting posture vector, and this difference represents the control amount required for correction of the fitting transportation posture of the fitting module.

[0026] It should be noted that the laminating posture vector includes the laminating direction, laminating pressure and laminating position of the laminating module. This method can be used to correct the laminating transportation posture of the laminating module based on the error elimination analysis between the pattern error of the laminating area and the termination laminating posture vector of the laminating module, effectively improve the alignment control accuracy of the laminating module, reduce the laminating deviation between the material and the workpiece caused by improper alignment control of the laminating module, minimize the rework rate, and improve the product laminating quality and efficiency.

[0027] More specifically, the step S108 includes the following steps: If the clustering result of the bonding condition that causes the simulated bonding misalignment amplitude in the abnormal bonding sub-model area shows a second-class bonding condition, the final frame image data of the current bonding workpiece and the bonding material when aligned and bonded is obtained by shooting with a CCD visual camera; Calculate and analyze the characteristic coordinates of the final frame image data based on the dimensional coordinate field to obtain a final field coordinate point set of the current bonded workpiece; Constructing a homography matrix, writing the final domain coordinate point set and the first domain coordinate point set into the homography matrix for linear homogeneous operation, and obtaining a homography matrix equation of the final domain coordinate point set-the first domain coordinate point set; Solving the homography matrix equation to obtain the reprojection error rate of each corresponding field coordinate between the final field coordinate point set and the first field coordinate point set, and determining the inertia force index that causes the bonded workpiece to deviate from the predetermined position at the current transport rate of the bonded workpiece transmission mechanism according to the reprojection error rate; The allowable inertia force index is preset. If the inertia force index is greater than the allowable inertia force index, a dynamics knowledge network is obtained based on big data, and at the same time, a transportation principle that fits the workpiece transmission mechanism is obtained; The rate of the allowable inertia force index generated under the premise of the transportation principle is analyzed through the dynamic knowledge network to obtain the optimal transportation rate, and the difference between the optimal transportation rate and the current transportation rate is calculated to obtain the transportation rate difference. Based on the transportation rate difference, the real-time transportation rate of the bonding workpiece conveying mechanism for conveying the bonding workpiece is controlled to obtain the second positioning control scheme.

[0028] It should be noted that if the clustering result of the fitting conditions that cause the simulated fitting misalignment amplitude in the abnormal fitting sub-model area shows a Class II fitting condition, it means that the local fitting abnormality between the material and the workpiece may be due to the fact that the transportation speed of the fitting workpiece transmission mechanism is too fast, causing the workpiece to move forward a certain distance under the action of high-speed inertia, causing the workpiece to deviate from the predetermined fitting area. Therefore, it is necessary to adjust and control the transportation speed of the fitting workpiece transmission mechanism. This method uses a CCD visual camera to capture the final frame image data when the current bonding workpiece and the bonding material are aligned and bonded, so as to construct the final field coordinate point set of the current bonding workpiece, and the final field coordinate point set represents the coordinates of the final landing position of the current bonding workpiece after displacement under the influence of the inertia of the bonding workpiece transmission mechanism. There must be a coordinate misalignment deviation between these final field coordinate points and the first field coordinate points of accurate alignment control. Therefore, this method constructs a homography matrix to perform coordinate linear homogeneous operations on the final field coordinate point set and the first field coordinate point set, and solves the homography matrix equation of the final field coordinate point set-the first field coordinate point set to obtain the coordinate misalignment deviation of the two, that is, the reprojection error rate. Compared with traditional control methods, the operation is faster and simpler, which ensures the calculation accuracy of the coordinate misalignment deviation during the bonding workpiece transportation displacement, and makes the transportation rate adjustment of the bonding workpiece transmission mechanism more reasonable and reliable. The reprojection error rate can be used to further determine the inertia force index that causes the bonding workpiece to deviate from the predetermined position at the current transportation rate of the bonding workpiece transmission mechanism. When the inertia force index is greater than the allowable inertia force index, it means that the alignment and bonding deviation generated at the current transportation rate of the bonding workpiece transmission mechanism does not meet the production requirements and is not allowed; therefore, the real-time transportation rate of the bonding workpiece transmission mechanism to transport the bonding workpiece needs to be adjusted and controlled based on the optimal transportation rate of the allowable inertia force index. This method can reasonably and accurately adjust and control the transportation rate of the bonding workpiece transmission mechanism that transports the workpiece on the fully automatic CCD bonding machine, thereby avoiding the phenomenon of inertial displacement of the workpiece caused by excessively high speed, eliminating the situation where the alignment and bonding deviation is caused by the wrong landing point of the workpiece, improving the alignment and bonding control accuracy of the fully automatic CCD bonding machine, optimizing the continuous alignment stability and bonding reliability of the product, reducing the frequency of product rework, and greatly improving the economic benefits.

[0029] The second aspect of the present invention provides a fully automatic CCD laminating machine alignment control system based on intelligent cruise control, such as Figure 3 As shown, the fully automatic CCD laminating machine alignment control system includes a memory 31 and a processor 32. The memory 31 stores a fully automatic CCD laminating machine alignment control method program based on intelligent cruise. When the fully automatic CCD laminating machine alignment control method program is executed by the processor 32, any one of the steps of the fully automatic CCD laminating machine alignment control method is implemented.

[0030] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A fully automatic CCD laminating machine alignment control method based on intelligent cruise, characterized in that: The following steps are involved: S102: Obtaining a prescribed laminating and transporting range from a laminating material preparation area to a laminating workpiece transport area, assigning values ​​to calculate image frame data of the fully automatic CCD laminating machine capturing the current laminating workpiece and the laminating material based on the prescribed laminating and transporting range to construct a first field coordinate point set and a second field coordinate point set, calculating a coordinate control amount of the second field coordinate point set from the first field coordinate point set, and obtaining an accurate alignment control amount; S104: Based on the intelligent cruise technology, a control process is planned for the accurate alignment control amount and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain an abnormal bonding sub-model area of ​​a simulated bonding product, obtain a bonding module and a bonding workpiece transmission mechanism to generate a first-class bonding condition and a second-class bonding condition of simulated bonding dislocation in the abnormal bonding sub-model area, perform clustering operation, and obtain a bonding condition clustering result; S106: If the clustering result of the bonding working conditions that cause the abnormal bonding sub-model area to generate the simulated bonding misalignment amplitude shows a type of bonding working condition result, then the termination bonding posture vector of the bonding module and the bonding misalignment pattern array of the type of abnormal bonding area are obtained, and the posture error of the termination bonding posture vector is adjusted in geometric space volume based on the bonding misalignment pattern array to control the bonding transport posture, and a first alignment control scheme is obtained; S108: If the clustering result of the bonding conditions that cause the abnormal bonding sub-model area to produce a simulated bonding misalignment amplitude shows a second type of bonding condition, then calculate the reprojection error rate of the final field coordinate point set relative to the first field coordinate point set when the current bonding workpiece and the bonding material are aligned and bonded, and control the bonding workpiece transmission mechanism at the optimal transport rate determined according to the reprojection error rate to obtain a second alignment control scheme.

2. According to claim 1, a fully automatic CCD laminating machine alignment control method based on intelligent cruise is characterized in that: The step S102 specifically includes the following steps: Get the laminating workpiece transmission area and laminating material preparation area of ​​the fully automatic CCD laminating machine, and simultaneously get the travel range of the laminating module in the fully automatic CCD laminating machine; Based on the preset laminating and transporting range limit of the travel range, the laminating and transporting range limit is used as the constraint benchmark, and the laminating and transporting range is planned in the fully automatic CCD laminating machine until the constraint benchmark is reached, thereby obtaining the prescribed laminating and transporting range from the laminating material preparation area to the laminating workpiece transmission area; Capturing and photographing the bonded workpieces in the bonded workpiece transmission area by a CCD visual camera on the fully automatic CCD bonding machine to obtain image frame data of the current bonded workpieces; The real-time image frame data is extracted and calculated using a Sobel edge detection operator to obtain the bonding features of the current bonding workpiece, and the distribution point position of each bonding feature on the current bonding workpiece is obtained to obtain a bonding feature distribution map; Constructing a dimensional coordinate field that specifies the bonding transport range, assigning specific coordinates to the bonding feature distribution map based on the dimensional coordinate field, obtaining a field coordinate point of each bonding feature located in the bonding workpiece transport area, and marking it as a first field coordinate point set; Acquire image frame data of the laminating material on the laminating material preparation area, repeat the above-mentioned steps of feature extraction and coordinate assignment to process the image frame data of the laminating material, generate domain coordinate points where each laminating feature is located in the laminating material preparation area, and mark them as a second domain coordinate point set; Calculate the center point between the first domain coordinate point set and the second domain coordinate point set, and based on the center point, remove the centering of the corresponding fitting feature of the second domain coordinate point set from the first domain coordinate point set to generate a covariance matrix of the centralized domain coordinate point set; A singular value decomposition algorithm is introduced, and the second field coordinate point set is taken as the target point set. The singular values ​​of the covariance matrix are decomposed in the singular value decomposition algorithm based on the target point set to obtain the rotation matrix and translation vector of the second field coordinate point set from the first field coordinate point set. Based on the rotation matrix and the translation vector, the accurate alignment control amount of the bonding material from the bonding material preparation area to the bonding workpiece transmission area is determined.

3. According to claim 1, a fully automatic CCD laminating machine alignment control method based on intelligent cruise is characterized in that: The step S104 specifically includes the following steps: Based on the intelligent cruise technology, the control process planning of the accurate alignment control quantity is carried out, and a three-dimensional simulation model of a fully automatic CCD bonding machine is constructed to perform simulation, so as to obtain a simulated bonding finished product model. Based on the bonding task analysis of the fully automatic CCD bonding machine, the simulated bonding finished product model has a quantitative bonding misalignment area compared with the standard bonding finished product model, and the abnormal bonding sub-model area is obtained; At this time, multiple bonding conditions in which the bonding module generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area are obtained through the bonding production log, and are defined as a type of bonding condition; Acquire multiple bonding conditions in which the bonding workpiece transmission mechanism generates corresponding simulated bonding misalignment amplitudes in the abnormal bonding sub-model area, which are defined as Class II bonding conditions, and simultaneously acquire a bonding control strategy table for decisions when the bonding module outputs Class I bonding conditions and when the bonding workpiece transmission mechanism outputs Class II bonding conditions; A candidate sample set of fitting conditions is constructed based on multiple first-class fitting conditions and multiple second-class fitting conditions, a canopy center point of the candidate sample set is set according to the fitting control strategy table, and the Euclidean distance between each fitting condition in the candidate sample set and the canopy center point is calculated to generate a temporary cluster of the current canopy; Repeat the above steps of calculating the Euclidean distance between the fitting condition and the center point of the umbrella cover to calculate all the fitting conditions in the candidate sample set, and obtain all the current umbrella cover temporary clusters. Combine all the current umbrella cover temporary clusters to generate the fitting condition clustering result that causes the abnormal fitting sub-model area to produce a simulated fitting misalignment amplitude.

4. The method for controlling the alignment of a fully automatic CCD laminating machine based on intelligent cruise according to claim 3 is characterized in that: The control process planning of the accurate alignment control amount based on the intelligent cruise technology and the construction of a three-dimensional simulation model of a fully automatic CCD bonding machine to perform simulation to obtain a simulated bonding finished product model, and the simulated bonding finished product model based on the bonding task analysis of the fully automatic CCD bonding machine has a quantitative bonding misalignment area compared with the standard bonding finished product model, and obtains an abnormal bonding sub-model area, which specifically includes the following steps: The accurate alignment control amount is automatically planned and calculated by intelligent cruise technology to obtain a transportation control process for transporting the bonding material from the bonding material preparation area to the bonding workpiece transmission area to align the bonding workpiece when the bonding module executes the accurate alignment control amount; Construct a three-dimensional simulation model of a fully automatic CCD laminating machine, input the transport control process into the three-dimensional simulation model of the fully automatic CCD laminating machine to perform alignment simulation between the laminating material and the laminating workpiece, and obtain a simulated laminating finished product model after the laminating alignment simulation is completed; Obtain the laminating task of the fully automatic CCD laminating machine, and construct a standard laminating product model according to the laminating task and the allowable laminating misalignment range of the standard laminating product model in accordance with the laminating task; Dividing the simulated bonding product model into N sub-model regions based on the bonding feature distribution map, calculating the quantitative bonding misalignment between the bonding material and the bonding workpiece in the simulated bonding product model compared with the standard bonding product model, and obtaining the simulated bonding misalignment amplitude of each sub-model region; Only the sub-model areas corresponding to the simulated fitting misalignment amplitude larger than the allowed fitting misalignment amplitude are extracted and marked as abnormal fitting sub-model areas.

5. The method for controlling the alignment of a fully automatic CCD laminating machine based on intelligent cruise according to claim 1, characterized in that: The step S106 specifically includes the following steps: If the clustering result of the fitting condition that causes the abnormal fitting sub-model area to produce the simulated fitting misalignment amplitude shows a type of fitting condition result, then one or more sub-model areas that all show a type of fitting condition are obtained and marked as a type of abnormal fitting area; Obtain a bonding misalignment pattern array formed by one or more bonding abnormal areas of the same type located in the simulated bonding product model, and simultaneously obtain a termination bonding posture vector when the bonding module aligns the bonding material onto the bonding workpiece; Constructing a geometric topological space, obtaining a fitting control error region formed between the termination fitting posture vector of the fitting module and the fitting misalignment pattern array of the simulated finished model, interpolating the fitting control error region in the geometric topological space with the fitting misalignment pattern array as a geometric interpolation control point until the termination fitting posture vector is touched, and obtaining a spatial volume of the fitting control error region associated with the fitting misalignment pattern array; The actual lamination alignment pattern of the lamination misalignment pattern array is obtained, and a standard lamination alignment pattern without lamination error in the lamination misalignment area is obtained through the lamination task, and the least square method is introduced to calculate the pattern drift between the actual lamination alignment pattern and the standard lamination alignment pattern; Eliminating the pattern drift to update the spatial volume of the bonding control error area to obtain a new spatial volume, calculating the volume deviation between the new spatial volume and the spatial volume to obtain a volume deviation value, and determining a standard bonding posture vector when the bonding module aligns the bonding material to the bonding workpiece according to the volume deviation value; The intelligent cruise technology is obtained to realize the preset fitting transport route of the standard fitting posture vector and the actual fitting transport route that terminates the fitting posture vector, and the fitting transport posture of the fitting module is controlled based on the route distance difference between the preset fitting transport route and the actual fitting transport route to obtain a first alignment control scheme.

6. The method for controlling the alignment of a fully automatic CCD laminating machine based on intelligent cruise according to claim 1, characterized in that: The step S108 specifically includes the following steps: If the clustering result of the bonding condition that causes the simulated bonding misalignment amplitude in the abnormal bonding sub-model area shows a second-class bonding condition, the final frame image data of the current bonding workpiece and the bonding material when aligned and bonded is obtained by shooting with a CCD visual camera; Calculate and analyze the characteristic coordinates of the final frame image data based on the dimensional coordinate field to obtain a final field coordinate point set of the current bonded workpiece; Constructing a homography matrix, writing the final domain coordinate point set and the first domain coordinate point set into the homography matrix for linear homogeneous operation, and obtaining a homography matrix equation of the final domain coordinate point set-the first domain coordinate point set; Solving the homography matrix equation to obtain the reprojection error rate of each corresponding field coordinate between the final field coordinate point set and the first field coordinate point set, and determining the inertia force index that causes the bonded workpiece to deviate from the predetermined position at the current transport rate of the bonded workpiece transmission mechanism according to the reprojection error rate; The allowable inertia force index is preset. If the inertia force index is greater than the allowable inertia force index, a dynamics knowledge network is obtained based on big data, and at the same time, a transportation principle that fits the workpiece transmission mechanism is obtained; The rate of the allowable inertia force index generated under the premise of the transportation principle is analyzed through the dynamic knowledge network to obtain the optimal transportation rate, and the difference between the optimal transportation rate and the current transportation rate is calculated to obtain the transportation rate difference. Based on the transportation rate difference, the real-time transportation rate of the bonding workpiece conveying mechanism for conveying the bonding workpiece is controlled to obtain the second positioning control scheme.

7. A fully automatic CCD laminating machine alignment control system based on intelligent cruise, characterized in that: The fully automatic CCD laminating machine alignment control system includes a memory and a processor. The memory stores a fully automatic CCD laminating machine alignment control method program based on intelligent cruise. When the fully automatic CCD laminating machine alignment control method program is executed by the processor, the fully automatic CCD laminating machine alignment control method steps as described in any one of claims 1-6 are implemented.

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