Heat dissipation case for high-performance computer

Abstract

The invention relates to the technical field of computer hosts, in particular to a heat dissipation case for a high-performance computer, which comprises a host case body, the host case body is of a rectangular sealed structure, a cooling bin of a U-shaped structure is formed in the host case body, a mounting groove is formed in the top of the host case body, a top plate is inserted in the mounting groove, and a mounting frame is fixedly mounted at the bottom of the top plate. A plurality of heat dissipation copper pipes are fixedly installed on the inner wall of the cooling bin. The mainframe box body is designed, an interlayer can be formed on the outer side of the mounting frame through the cooling bin in the mainframe box body, the cooling bin is matched with cooling liquid, so that the mainframe box body is always kept in a cooling state, the mainframe box body in the cooling state can cool air entering the mainframe box body, and meanwhile, the cooling effect is good. Part of hot air in the mainframe box body can be guided into the cooling liquid through cooperation of the exhaust pipe and the exhaust pipe, the hot air is exhausted after being cooled by the cooling liquid, and the temperature of air around the mainframe box body is further reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of computer host, and in particular to a heat dissipation chassis for high-performance computers. Background Art

[0002] The computer host is the main component of the computer, usually including the CPU, memory, graphics card, motherboard, hard disk, optical drive, power supply, chassis, cooling system and other input and output controllers and interfaces.

[0003] Computer hosts are divided into many categories according to their uses, and gaming computer hosts are one of the more common ones. In order to adapt to large-scale 3A games, the existing gaming computer hosts are generally configured with high configurations. They are a kind of high-performance computers commonly seen in daily life. The power consumption of their CPUs and graphics cards is generally large, so a large amount of heat is generated during use. Conventional computer hosts generally dissipate heat through fans, but are affected by the chassis itself, and the heat dissipation effect cannot meet the requirements. This situation will cause a large amount of heat to accumulate inside the chassis. In the prior art, some chassis use water cooling, which has a better cooling effect, but it can only cool the CPU and graphics card itself, and cannot cool other components such as the motherboard and power supply. After the gaming computer host has been running for a long time, it will still cause the host to overheat. Therefore, we propose a high-performance gaming computer host. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the background technology and to propose a heat dissipation chassis for high-performance computers.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a heat dissipation chassis for high-performance computers, including a mainframe case, the mainframe case is a rectangular sealed structure, a U-shaped cooling chamber is provided in the mainframe case, a mounting groove is provided on the top of the mainframe case, a top plate is inserted in the mounting groove, and a mounting frame is fixedly installed on the bottom of the top plate.

[0006] In the above-mentioned heat dissipation chassis for high-performance computers, a plurality of heat dissipation copper tubes are fixedly installed on the inner wall of the cooling bin, both ends of the heat dissipation copper tubes pass through the main chassis, the plurality of heat dissipation copper tubes are divided into two groups and are distributed in a straight line, and two symmetrically arranged air inlet slots are opened on one side of the main chassis, and a plurality of fixed brackets distributed in a straight line are fixedly installed on the inner wall of the air inlet slot, and the installation positions of the plurality of fixed brackets correspond one by one to the installation positions of the plurality of heat dissipation copper tubes, and a heat dissipation fan is fixedly installed on the fixed bracket.

[0007] In the above-mentioned heat dissipation chassis for high-performance computers, a movable groove is provided at the bottom of the inner wall of the cooling bin, a fixed tooth groove is provided on the inner wall of the movable groove, a C-shaped movable frame is provided in the cooling bin, the bottom of the movable frame is slidably connected to the movable groove, the bottom of the movable frame is rotatably installed with a driving gear located in the movable groove, the driving gear is meshed with the fixed tooth groove, a pushing ring is sleeved on the outer wall of the heat dissipation copper tube, several pushing rings on the outer walls of the heat dissipation copper tubes distributed in a straight line are fixedly connected by a connecting bracket, several fixedly connected pushing rings are fixedly connected to the movable frame, a rotating ring is rotatably installed on one side of the pushing ring, a stirring blade is fixedly installed on the outer wall of the rotating ring, and threads are provided on the outer wall of the heat dissipation copper tube and the inner ring wall of the rotating ring.

[0008] In the above-mentioned heat dissipation chassis for high-performance computers, placement grooves are opened on both sides of the main chassis, and the two placement grooves are respectively opened at the top of the two ends of the U-shaped cooling bin. A plurality of ventilation holes are opened at the bottom of the inner wall of the placement groove, and the ventilation holes are connected to the cooling bin. A fixed cover plate is inserted in the placement groove, and a water-absorbing cotton strip is inserted on the side of the fixed cover plate close to the corresponding placement groove.

[0009] In the above-mentioned heat dissipation chassis for high-performance computers, arc-shaped water receiving grooves are fixedly installed on both sides of the main chassis and below the placement grooves. A water inlet hole is opened on the inner wall of the water receiving groove, and the water inlet hole is connected to the cooling chamber. A sealing plug is inserted in the water inlet hole.

[0010] In the above-mentioned heat dissipation chassis for high-performance computers, two symmetrically arranged U-shaped exhaust ducts are fixedly installed on the inner wall of the main chassis, the exhaust ducts pass through the main chassis and extend into the cooling bin, a heat dissipation bin is opened in the top plate, a U-shaped exhaust duct is fixedly installed in the heat dissipation bin, an exhaust fan is fixedly installed in the exhaust duct, both ends of the exhaust duct pass through the top plate, and one end of the exhaust duct away from the cooling bin is inserted into one end of the exhaust duct.

[0011] In the above-mentioned heat dissipation chassis for high-performance computers, a lifting slot is provided on the inner wall of the cooling bin, a lifting slider is slidably installed in the lifting slot, one side of the lifting slider extends out of the lifting slot and a bellows is fixedly installed, one end of the bellows is fixedly connected to an end of the exhaust pipe extending into the cooling bin, and an extension pipe with a U-shaped structure is fixedly installed on the end of the bellows away from the exhaust pipe.

[0012] In the above-mentioned heat dissipation chassis for high-performance computers, a number of obliquely arranged air inlets are provided at both ends of the outer wall of the main chassis, and the air inlets pass through the main chassis. A push plate is provided at one end of the outer wall of the main chassis, and the installation position of the push plate is consistent with the opening position of the air inlet. Two symmetrically arranged electric cylinders are fixedly installed in the main chassis, and the telescopic ends of the electric cylinders pass through the main chassis and are fixedly connected to the push plates.

[0013] Compared with the existing technology, the advantages of the heat dissipation chassis for high-performance computers are: the present invention designs a mainframe case, and a cooling chamber in the mainframe case can form a sandwich layer on the outside of the mounting frame, and the mainframe case itself is always kept in a cooling state with the help of the coolant. The mainframe case in the cooling state can cool the air entering it, and at the same time, with the help of the exhaust pipe and the exhaust pipe, part of the hot air in the mainframe case can be introduced into the coolant, and the hot air is discharged after being cooled by the coolant, further reducing the temperature of the air around the mainframe case, so that the air sucked into the mainframe case maintains a lower temperature, thereby improving the cooling effect of the mainframe case. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the mainframe case in the present invention.

[0015] Figure 2 It is a three-dimensional cross-sectional structural schematic diagram of the mainframe case in the present invention.

[0016] Figure 3 The present invention Figure 2 Schematic diagram of the local enlarged structure at point A in the middle.

[0017] Figure 4 It is a schematic diagram of a partial three-dimensional cutaway structure of the cooling bin in the present invention.

[0018] Figure 5 The present invention Figure 4 Schematic diagram of the local enlarged structure at point B in the middle.

[0019] Figure 6 It is a schematic diagram of a partial three-dimensional cutaway structure of a mainframe case in the present invention.

[0020] Figure 7 The present invention Figure 6 Schematic diagram of the local enlarged structure at point C in the middle.

[0021] Figure 8 The present invention Figure 6 Schematic diagram of the local enlarged structure at point D in the middle.

[0022] Fig. 9 The present invention Figure 6 Schematic diagram of the local enlarged structure at point E in the middle.

[0023] Fig.10 It is a schematic diagram of a partial plan cross-sectional structure of the cooling bin in the present invention.

[0024] Fig.11 The present invention Fig.10 Schematic diagram of the local enlarged structure at F in the middle.

[0025] In the figure: 1. mainframe; 2. cooling chamber; 101. mounting slot; 3. top plate; 301. mounting frame; 201. heat dissipation copper tube; 102. air inlet slot; 103. fixed bracket; 104. cooling fan; 202. moving slot; 203. fixed tooth slot; 204. moving frame; 205. driving gear; 206. pushing ring; 207. rotating ring; 4. placement slot; 401. vent; 402. fixed cover plate; 403. absorbent cotton strip; 404. water receiving slot; 405. water inlet hole; 406. sealing plug; 105. exhaust duct; 302. cooling chamber; 303. exhaust duct; 304. exhaust fan; 208. lifting slide slot; 209. lifting slider; 210. bellows; 211. extension pipe; 106. air inlet; 107. pushing plate; 108. electric cylinder. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] Reference Figure 1-Figure 11 A heat dissipation chassis for high-performance computers includes a mainframe case 1, which is a rectangular sealed structure. A U-shaped cooling chamber 2 is provided in the mainframe case 1. A mounting groove 101 is provided on the top of the mainframe case 1. A top plate 3 is inserted in the mounting groove 101. A mounting frame 301 is fixedly installed on the bottom of the top plate 3. The mounting frame 301 is used to install components such as a motherboard and a graphics card. During installation, the installed mounting frame 301 is inserted into the mainframe case 1 together with the top plate 3 through the mounting groove 101. The cooling chamber 2 is used to cool the mainframe case 1.

[0029] A plurality of heat dissipation copper tubes 201 are fixedly installed on the inner wall of the cooling bin 2, and both ends of the heat dissipation copper tubes 201 pass through the mainframe case 1. The plurality of heat dissipation copper tubes 201 are divided into two groups and are distributed in a straight line. Two symmetrically arranged air inlet slots 102 are provided on one side of the mainframe case 1. A plurality of fixed brackets 103 distributed in a straight line are fixedly installed on the inner wall of the air inlet slot 102. The installation positions of the plurality of fixed brackets 103 correspond one by one to the installation positions of the plurality of heat dissipation copper tubes 201 respectively. A heat dissipation fan 104 is fixedly installed on the fixed bracket 103. When heat is generated in the mainframe case 1, the mainframe case 1 itself can be cooled by the coolant filled in the cooling bin 2 to avoid the temperature of the mainframe case 1 being too high. When the temperature of the coolant in the cooling bin 2 rises, the coolant can be cooled by the heat dissipation copper tubes 201 to ensure the cooling effect of the coolant. The fixed bracket 103 is used to install the heat dissipation fan 104. The heat dissipation fan 104 can further improve the heat dissipation effect of the heat dissipation copper tube 201.

[0030] A movable groove 202 is provided at the bottom of the inner wall of the cooling bin 2, and a fixed tooth groove 203 is provided on the inner wall of the movable groove 202. A movable frame 204 of a C-shaped structure is arranged in the cooling bin 2, and the bottom of the movable frame 204 is slidably connected with the movable groove 202. A driving gear 205 is rotatably installed at the bottom of the movable frame 204 and is located in the movable groove 202. The driving gear 205 is meshed with the fixed tooth groove 203. A pushing ring 206 is sleeved on the outer wall of the heat dissipation copper tube 201. Several pushing rings 206 on the outer walls of the heat dissipation copper tubes 201 distributed in a straight line are fixedly connected by connecting brackets. Several fixedly connected pushing rings 206 are fixedly connected to the movable frame 204. A rotating ring 207 is rotatably installed on one side of the pushing ring 206. A stirring blade is fixedly installed on the outer wall of the rotating ring 207. Threads are provided on the outer wall of the tube 201 and on the inner wall of the rotating ring 207. A driving motor with forward and reverse rotation functions is fixedly installed in the movable frame 204. The driving motor drives the driving gear 205 to rotate back and forth. The cooperation between the driving gear 205 and the fixed tooth groove 203 can drive the movable frame 204 to move back and forth in the movable groove 202. The movement of the movable frame 204 can drive the pushing ring 206 and the rotating ring 207 to move back and forth along the corresponding heat dissipation copper tube 201. In the process of the movement of the rotating ring 207, the rotating ring 207 can be rotated through the threads on the inner wall of the rotating ring 207 and the outer wall of the heat dissipation copper tube 201, and the stirring blades can be driven to rotate. The rotation of the stirring blades can stir the coolant to make the coolant flow, thereby further improving the heat dissipation effect.

[0031] Placement slots 4 are provided on both sides of the main chassis 1, and the two placement slots 4 are respectively provided on the top of both ends of the U-shaped cooling bin 2. A plurality of ventilation holes 401 are provided on the bottom of the inner wall of the placement slot 4, and the ventilation holes 401 are connected with the cooling bin 2. A fixed cover plate 402 is inserted in the placement slot 4, and a water-absorbing cotton strip 403 is inserted on the side of the fixed cover plate 402 close to the corresponding placement slot 4. The placement slot 4 is used to place the water-absorbing cotton strip 403. When the coolant in the cooling bin 2 is heated, a certain degree of evaporation will occur, and the steam generated by the evaporation will rise and enter the placement slot 4 through the ventilation holes 401. The steam entering the placement slot 4 will be absorbed by the water-absorbing cotton strip 403. When the water-absorbing cotton strip 403 absorbs a specified amount of coolant, the fixed cover plate 402 is removed and replaced with another dry water-absorbing cotton strip 403. The replaced water-absorbing cotton strip 403 can continue to be used after drying.

[0032] On both sides of the main chassis 1 and below the placement slot 4, there are fixedly installed water receiving slots 404 with an arc-shaped structure, and a water inlet hole 405 is opened on the inner wall of the water receiving slot 404. The water inlet hole 405 is communicated with the cooling bin 2, and a sealing plug 406 is inserted in the water inlet hole 405. The water receiving slot 404 is used to receive the coolant overflowed after the absorbent cotton strip 403 absorbs the overload. After the water receiving slot 404 receives the coolant, the coolant can be returned to the cooling bin 2 through the water inlet hole 405 by pulling out the sealing plug 406. The water receiving slot 404 and the water inlet hole 405 can conveniently replenish the coolant in the cooling bin 2.

[0033] Two symmetrically arranged U-shaped exhaust ducts 105 are fixedly installed on the inner wall of the mainframe case 1, the exhaust duct 105 passes through the mainframe case 1 and extends into the cooling bin 2, a heat dissipation bin 302 is opened in the top plate 3, a U-shaped exhaust duct 303 is fixedly installed in the heat dissipation bin 302, an exhaust fan 304 is fixedly installed in the exhaust duct 303, both ends of the exhaust duct 303 pass through the top plate 3, one end of the exhaust duct 105 away from the cooling bin 2 is inserted into one end of the exhaust duct 303, when the top plate 3 is inserted into the mounting groove 101, the exhaust duct 105 will be plugged into the corresponding exhaust duct 303, when the high-performance computer host is running, the exhaust fan 304 is operated to rotate, so that the hot air generated in the mainframe case 1 can be extracted and discharged into the exhaust duct 105, and the hot air discharged into the exhaust duct 105 will enter the cooling bin 2 under the continuous action of the exhaust fan 304, so as to avoid the accumulation of hot air in the mainframe case 1.

[0034] A lifting slot 208 is provided on the inner wall of the cooling bin 2, and a lifting slider 209 is slidably installed in the lifting slot 208. The lifting slot 208 extends from one side of the lifting slider 209 and a bellows 210 is fixedly installed. One end of the bellows 210 is fixedly connected to the end of the exhaust pipe 105 extending into the cooling bin 2, and an extension pipe 211 of a U-shaped structure is fixedly installed on the end of the bellows 210 away from the exhaust pipe 105. The hot air entering the exhaust pipe 105 will eventually be discharged into the coolant in the cooling bin 2 through the bellows 210 and the extension pipe 211, and the hot air will be cooled by the coolant. The lifting slider 209 is an electric slider, which can drive the bellows 210 to fold or extend, and simultaneously drive the extension pipe 211 to rise and fall in the cooling bin 2. An induction module is installed on the outer wall of the extension pipe 211, which can be automatically adjusted according to the height of the coolant in the cooling bin 2, so that the end of the extension pipe 211 away from the bellows 210 is always inserted into the coolant.

[0035] Both ends of the outer wall of the main engine case 1 are provided with a plurality of inclined air inlets 106, which pass through the main engine case 1. A push plate 107 is provided at one end of the outer wall of the main engine case 1, and the installation position of the push plate 107 is consistent with the opening position of the air inlet 106. Two symmetrically arranged electric cylinders 108 are fixedly installed in the main engine case 1. The telescopic ends of the electric cylinders 108 pass through the main engine case 1 and are fixedly connected to the push plates 107. The air inlets 106 are used for taking in and exhausting air into and out of the main engine case 1. The electric cylinders 108 can drive the push plates 107 to move back and forth by telescoping. The reciprocating movement of the push plates 107 and the air inlets 106 can push the hot air in the main engine case 1, thereby further improving the hot air exhaust efficiency.

[0036] It is further explained that the above-mentioned fixed connection should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be welding, gluing, or one-piece molding, etc., which are conventional means well known to those skilled in the art.

[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A heat dissipation chassis for a high-performance computer, comprising a mainframe chassis (1), characterized in that: The mainframe case (1) is a rectangular sealed structure, a U-shaped cooling chamber (2) is provided in the mainframe case (1), a mounting groove (101) is provided on the top of the mainframe case (1), a top plate (3) is inserted in the mounting groove (101), and a mounting frame (301) is fixedly installed on the bottom of the top plate (3).

2. A heat dissipation chassis for a high-performance computer according to claim 1, characterized in that: A plurality of heat dissipation copper tubes (201) are fixedly mounted on the inner wall of the cooling chamber (2), both ends of the heat dissipation copper tubes (201) pass through the mainframe case (1), the plurality of heat dissipation copper tubes (201) are divided into two groups and are distributed in a straight line, one side of the mainframe case (1) is provided with two symmetrically arranged air inlet slots (102), a plurality of fixed brackets (103) are fixedly mounted on the inner wall of the air inlet slot (102) and are distributed in a straight line, the installation positions of the plurality of fixed brackets (103) respectively correspond one to one with the installation positions of the plurality of heat dissipation copper tubes (201), and a heat dissipation fan (104) is fixedly mounted on the fixed bracket (103).

3. A heat dissipation chassis for a high-performance computer according to claim 2, characterized in that: The bottom of the inner wall of the cooling bin (2) is provided with a movable groove (202), the inner wall of the movable groove (202) is provided with a fixed tooth groove (203), a movable frame (204) of a C-shaped structure is arranged in the cooling bin (2), the bottom of the movable frame (204) is slidably connected to the movable groove (202), a driving gear (205) is rotatably installed at the bottom of the movable frame (204) and is located in the movable groove (202), the driving gear (205) is meshed with the fixed tooth groove (203), and the heat dissipation copper tube (201 ) is sleeved on the outer wall of a plurality of heat dissipation copper tubes (201), the plurality of heat dissipation copper tubes (201) on the outer walls of which are distributed in a straight line are fixedly connected to each other via a connecting bracket, the plurality of fixedly connected heat dissipation copper tubes (201) are fixedly connected to the movable frame (204), a rotating ring (207) is rotatably mounted on one side of the heat dissipation ring (206), a stirring blade is fixedly mounted on the outer wall of the rotating ring (207), and threads are provided on the outer wall of the heat dissipation copper tube (201) and the inner ring wall of the rotating ring (207).

4. The heat dissipation chassis for a high-performance computer according to claim 1, characterized in that: The main housing (1) is provided with placement grooves (4) on both sides, and the two placement grooves (4) are respectively provided at the top of both ends of the U-shaped cooling bin (2). The bottom of the inner wall of the placement groove (4) is provided with a plurality of ventilation holes (401), and the ventilation holes (401) are connected to the cooling bin (2). A fixed cover plate (402) is inserted into the placement groove (4), and a water-absorbing cotton strip (403) is inserted on one side of the fixed cover plate (402) close to the corresponding placement groove (4).

5. A heat dissipation chassis for a high-performance computer according to claim 4, characterized in that: Water receiving grooves (404) with circular arc structures are fixedly installed on both sides of the mainframe case (1) and below the placement groove (4); a water inlet hole (405) is opened on the inner wall of the water receiving groove (404); the water inlet hole (405) is connected to the cooling chamber (2); and a sealing plug (406) is inserted into the water inlet hole (405).

6. The heat dissipation chassis for high-performance computers according to claim 1, characterized in that: Two symmetrically arranged U-shaped exhaust ducts (105) are fixedly installed on the inner wall of the mainframe case (1); the exhaust duct (105) passes through the mainframe case (1) and extends into the cooling chamber (2); a heat dissipation chamber (302) is provided in the top plate (3); a U-shaped exhaust duct (303) is fixedly installed in the heat dissipation chamber (302); an exhaust fan (304) is fixedly installed in the exhaust duct (303); both ends of the exhaust duct (303) pass through the top plate (3); and one end of the exhaust duct (105) away from the cooling chamber (2) is inserted into one end of the exhaust duct (303).

7. A heat dissipation chassis for a high-performance computer according to claim 6, characterized in that: A lifting slot (208) is provided on the inner wall of the cooling bin (2), a lifting slider (209) is slidably installed in the lifting slot (208), one side of the lifting slider (209) extends out of the lifting slot (208) and is fixedly installed with a bellows (210), one end of the bellows (210) is fixedly connected to one end of the exhaust pipe (105) extending into the cooling bin (2), and an extension pipe (211) with a U-shaped structure is fixedly installed on one end of the bellows (210) away from the exhaust pipe (105).

8. The heat dissipation chassis for high-performance computers according to claim 1, characterized in that: Both ends of the outer wall of the mainframe case (1) are provided with a plurality of obliquely arranged air inlets (106), the air inlets (106) passing through the mainframe case (1), a push plate (107) is provided at one end of the outer wall of the mainframe case (1), the installation position of the push plate (107) is consistent with the opening position of the air inlet (106), two symmetrically arranged electric cylinders (108) are fixedly installed in the mainframe case (1), the telescopic ends of the electric cylinders (108) pass through the mainframe case (1) and are fixedly connected to the push plate (107).

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