Wafer rolling brush rotary scrubbing device with contact force measurement and control function

Abstract

The invention discloses a wafer rolling brush rotary brushing device with contact force measurement and control, which comprises a rotary platform motor, a box body, a beam, a rolling brush motor, a rear pressure sensor, a micro module, a rolling brush motor shaft, a rolling brush and a front pressure sensor, the rotary platform motor is located at the bottom of the box body, one end of the beam is installed in the box body, and the other end of the beam is installed in the box body; the other end of the rear pressure sensor penetrates through the box body and is connected with the front pressure sensor, and the rear pressure sensor is connected with the beam and located in the box body. The rolling brush motor is located in the box body, the rotating shaft end of the rolling brush motor is connected with the end of the rolling brush motor shaft, the rolling brush motor shaft is connected with the rolling brush, and the other end of the rolling brush is connected with the connecting piece.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor wafer cleaning and drying, and in particular relates to a wafer roller brush rotating scrubbing device with contact force measurement and control. Background Art

[0002] With the continuous advancement of semiconductor technology, the integration of chips is getting higher and higher, the line width is constantly decreasing, and the quality requirements for wafers are becoming more and more stringent. For advanced semiconductor processes, such as nano-scale processes, the cleanliness requirements for the wafer surface are extremely high. Since the contaminants on the surface of the wafer will have a serious impact on the electrical properties of semiconductor devices, for example, metal impurities will form unnecessary conductive channels in the wafer, increase the risk of leakage, and reduce the insulation performance of the device; organic pollutants may cause the threshold voltage of the device to change, affecting its switching characteristics. Only through a thorough cleaning process can the interference of these impurities on the performance of the device be minimized to the greatest extent, so that the chip can work normally according to the design requirements and ensure that its performance indicators such as high speed and low power consumption can be achieved. In the many processes of wafer manufacturing, such as oxidation, diffusion, photolithography, etching, ion implantation, etc., each step may introduce new impurities or contaminants, which must be removed in time through the cleaning process to ensure the quality and performance of the chip, thereby improving the overall product yield. Improper cleaning will lead to residual contaminants on the surface of the wafer, surface damage or changes in surface characteristics, which may affect the process links such as photoresist coating and film deposition, and thus affect the manufacturing quality of the entire chip.

[0003] There are two main ways to clean wafers: dry cleaning and wet cleaning. Megasonic spray is an efficient way of wet cleaning, which combines megasonic energy with spray cleaning. The high-frequency sound waves (usually at the megahertz level) generated by the megasonic transducer are transmitted to the spray water flow through a specially designed nozzle. When the water flow with megasonic energy hits the surface of the wafer, the high-speed flow of the water flow and the high-frequency vibration of the megasonic waves work together to produce a strong mechanical impact force and a microscopic stirring effect. This effect can effectively remove various contaminants on the surface of the wafer, such as tiny particles, organic matter, metal impurities, etc.

[0004] After the wafer is cleaned, drying is also an indispensable step in the wafer manufacturing process. Many wafer manufacturing processes have strict requirements on the dryness of the wafer surface. The drying step is an important link to ensure that the wafer meets these process requirements. Since there will be residual moisture on the surface of the wafer after cleaning, if it is not dried in time, the moisture may cause corrosion, contamination or water stains on the wafer surface, affecting the performance and quality of the wafer. In addition, the drying process can also reduce the humidity on the wafer surface, thereby reducing the possibility of re-attachment of contaminants and ensuring the cleanliness of the wafer surface.

[0005] In the existing wafer production and processing equipment, the cleaning and drying of wafers often cannot be precisely controlled due to the force, resulting in excessive force during the cleaning process causing damage to the wafer. For example, the existing scheme application number is: 202410172328.5, applicant: Huahai Qingke Co., Ltd. A wafer processing device is provided for vertically scrubbing a wafer, the wafer includes a first surface carrying a circuit element, the wafer processing device includes a box; the support assembly vertically supports and drives the wafer to rotate; the roller brush is horizontally arranged in the box and can scrub the surface of the wafer; the spraying assembly includes a first sprayer and a second sprayer, the first sprayer and the second sprayer are used to spray cleaning liquid onto the first surface, the second sprayer sprays the cleaning liquid toward the top area of ​​the first surface, and the landing point of the cleaning liquid sprayed by the second sprayer on the wafer is higher than the landing point of the cleaning liquid sprayed by the first sprayer on the wafer, and the top area is the area above the area covered by the cleaning liquid sprayed by the first sprayer. According to a wafer processing device of an embodiment of the present invention, the first sprayer can spray the cleaning liquid on the top area of ​​the wafer, so as to ensure that the surface of the wafer is moistened and no contaminants adhere. The technical disadvantage is that the roller brush of the roller brush cleaning device is installed horizontally, and the pressure of contact with the wafer surface cannot be directly adjusted. Summary of the invention

[0006] The object of the present invention is to solve the above-mentioned problem and to provide a wafer roller brush rotating brushing device with contact force measurement and control, which can detect the contact pressure between the roller brush and the wafer through a pressure sensor and adjust it accordingly.

[0007] To solve the above technical problems, the technical solution of the present invention is: a wafer roller brush rotating brushing device with contact force measurement and control, including a rotating platform motor, a box, a beam, a roller brush motor, a rear pressure sensor, a micro-module, a roller brush motor shaft, a roller brush and a front pressure sensor, the rotating platform motor is located at the bottom of the box, one end of the beam is installed in the box, and the other end passes through the box and is connected to the front pressure sensor, the rear pressure sensor is connected to the beam and is located in the box; the roller brush motor is located in the box, the shaft end of the roller brush motor is connected to the end of the roller brush motor shaft, the roller brush motor shaft is connected to the roller brush, and the other end of the roller brush is connected to the connecting piece.

[0008] Preferably, the box body includes a bottom plate, an upper plate and side plates, the bottom plate and the upper plate are respectively located at two ends of the side plates to form a box body structure, and the bottom plate, the upper plate and the side plates are connected and fixed by screws.

[0009] Preferably, a rotating platform is installed on the rotating platform motor, the rotating platform motor cooperates with the shaft hole of the rotating platform and is tightened and fixed by side screws, and the rotating platform and the base plate are positioned by pins and connected and fixed by screws.

[0010] Preferably, a linear module, a module motor, a module mounting plate, a beam mounting plate and a rib plate are installed on the side panels inside the box; the linear module is respectively connected and fixed to the side panels and the module mounting plate by screws, the module mounting plate is connected and fixed to the beam mounting plate by screws, and the beam mounting plate is installed in parallel in the box; the rib plate is connected and fixed to the module mounting plate and the beam mounting plate by screws, and the beam mounting plate is connected and fixed to the beam by screws.

[0011] Preferably, a roller brush motor mounting seat, a rear sensor mounting seat and a front sensor mounting seat are provided on the beam, and the rear sensor mounting seat and the front sensor mounting seat are respectively connected to two micro modules, and the upper side of the roller brush motor mounting seat and the rear pressure sensor are positioned by pins and fixed by screws; the rear pressure sensor and the rear sensor mounting seat are positioned by pins and fixed by screws; the rear sensor mounting seat and the beam mounting plate are positioned by steps and fixed by screws.

[0012] Preferably, the roller brush motor and the roller brush motor shaft are connected by a key and fixed by a pin, a roller brush motor coupling is provided between the roller brush motor shaft and the roller brush, and the roller brush motor shaft and the roller brush are connected and fixed by the roller brush motor coupling; a roller brush connecting shaft is fixedly provided at the other end of the roller brush, the roller brush and the roller brush connecting shaft are connected by a square hole, a bearing is sleeved at the end of the roller brush connecting shaft, and the roller brush connecting shaft and the bearing are connected by an interference fit through an axial hole; the bearing is installed in a bearing seat, the bearing and the bearing seat are connected by an axial hole, and the bearing seat is connected to the micro module; a bearing cover is installed on the bearing seat, and the bearing seat and the bearing cover are connected and fixed by screws.

[0013] Preferably, the micro-module includes a front micro-module and a rear micro-module, the front sensor mounting seat is connected to the front pressure sensor and is connected to the front micro-module on both sides; the roller brush motor is fixed to the roller brush motor mounting seat by screws, and the left and right outer sides of the roller brush motor mounting seat are fixed to the rear micro-module by screws; the rear micro-module and the left and right inner sides of the rear sensor mounting seat are positioned by steps and are fixed by screws.

[0014] Preferably, the side panels include a left side panel, a right side panel, a front side panel and a rear side panel, which are connected and have a rectangular cross-section, and the linear module is respectively fixed to the left side panel and the module mounting plate by screws.

[0015] Preferably, the front side panel is provided with a waterproof window, a waterproof cover, a water baffle, a water spray pipe, a water spray pipe mounting seat and a nozzle; the water baffle is placed in the waterproof window and fixed to the beam by screws; the upper and lower parts of the water baffle are connected and fixed to the waterproof cover by screws; the waterproof cover is connected and fixed to the upper and lower parts of the waterproof window by screws; the water spray pipe is connected and fixed to the water spray pipe mounting seat by screws, and the water spray pipe is fixed to the nozzle by threaded connection.

[0016] Preferably, the left and right outer sides of the bearing seat are connected and fixed to the front micro-module by screws, and the upper side of the bearing seat and the front pressure sensor are positioned by pins and connected and fixed by screws; the front pressure sensor and the front sensor mounting seat are positioned by pins and connected and fixed by screws; the front sensor mounting seat and the beam are positioned by pins and connected and fixed by screws and nuts; the front micro-module and the left and right inner sides of the front pressure sensor mounting seat are positioned by steps and connected and fixed by screws; the front side panel and the waterproof window and the sprinkler pipe mounting seat are positioned by grooves and connected and fixed by screws.

[0017] The beneficial effects of the present invention are:

[0018] 1. The wafer roller brush rotating brushing device with contact force measurement and control provided by the present invention can detect the contact pressure between the roller brush and the wafer by adopting a front pressure sensor and a rear pressure sensor, thereby adjusting the position of the roller brush, thereby protecting the wafer from damage during the cleaning process and improving the processing quality of the product.

[0019] 2. The present invention performs three-dimensional control on the position of the roller brush by rotating the platform motor, the module motor and the roller brush motor, thereby increasing the scope of the wafer cleaning of the present invention and greatly increasing the practicality.

[0020] 3. The roller brush contact force measurement and control device adopted in the present invention can control the contact force between the roller brush and the wafer surface in real time by controlling the lifting and lowering of the roller brush, so as to explore the influence of different contact forces on the surface quality of the wafer, ensure the surface quality of the wafer while improving the yield of the wafer after cleaning.

[0021] 4. The present invention adds micro-modules to the front and rear sensor structures. The micro-modules on both sides limit the freedom of the sensor in other directions, so that the S-shaped sensor only has micro-movements in the up and down directions. The measured pressure is more accurate, which improves the accuracy of the contact force between the roller brush and the wafer, and the data can better guide experiments and production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a wafer roller brush rotating scrubbing device with contact force measurement and control according to the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the roller brush of the present invention;

[0025] Figure 4 The present invention Figure 3 A schematic diagram comparing the structures of the front view, left view and right view;

[0026] Figure 5 The present invention Figure 4 Schematic diagram of the cross-sectional structure of BB.

[0027] Description of reference numerals: 401, rotating platform motor; 402, rotating platform; 403, sealing ring; 404, bottom plate; 405, upper plate; 406, side plate; 407, linear module; 408, module motor; 409, module mounting plate; 410, beam mounting plate; 411, beam; 412, beam protection cover; 413, rib plate; 414, roller brush motor; 415, roller brush motor mounting seat; 416, rear pressure sensor; 417, rear sensor mounting seat; 418, micro module; 419, roller brush motor shaft; 420 , roller brush motor coupling; 421, roller brush; 422, roller brush connecting shaft; 423, bearing; 424, bearing seat; 425, bearing cover; 426, front pressure sensor; 427, front sensor mounting seat; 428, waterproof window; 429, waterproof cover; 430, water baffle; 431, water spray pipe; 432, water spray pipe mounting seat; 433, nozzle; 4061, left side panel; 4062, right side panel; 4063, front side panel; 4064, rear side panel; 4181, front micro module; 4182, rear micro module. DETAILED DESCRIPTION

[0028] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0029] like Figures 1 to 5 As shown, the present invention provides a wafer roller brush rotating scrubbing device with contact force measurement and control, including a rotating platform motor 401, a box, a beam 411, a roller brush motor 414, a rear pressure sensor 416, a micro module 418, a roller brush motor shaft 419, a roller brush 421 and a front pressure sensor 426. The rotating platform motor 401 is located at the bottom of the box, one end of the beam 411 is installed in the box, and the other end passes through the box and is connected to the front pressure sensor 426. The rear pressure sensor 416 is connected to the beam 411 and is located in the box. The roller brush motor 414 is located in the box, the shaft end of the roller brush motor 414 is connected to the end of the roller brush motor shaft 419, the roller brush motor shaft 419 is connected to the roller brush 421, and the other end of the roller brush 421 is connected to the connecting piece.

[0030] The box body includes a bottom plate 404, an upper plate 405 and a side plate 406. The bottom plate 404 and the upper plate 405 are respectively located at two ends of the side plate 406 to form a box body structure. The bottom plate 404, the upper plate 405 and the side plate 406 are connected and fixed by screws.

[0031] The rotating platform 402 is installed on the rotating platform motor 401. The rotating platform motor 401 cooperates with the shaft hole of the rotating platform 402 and is tightened and fixed by side screws. The rotating platform 402 and the base plate 404 are positioned by pins and connected and fixed by screws.

[0032] During operation, the rotating platform motor 401 can drive the rotating platform 402 to rotate, thereby driving the bottom plate 404 to move, causing the box to move, and finally causing the beam 411 installed on the box to move synchronously, moving the roller brush 421 onto the wafer to be cleaned.

[0033] The side plate 406 inside the box is equipped with a linear module 407, a module motor 408, a module mounting plate 409, a beam mounting plate 410 and a rib plate 413. The linear module 407 is connected and fixed to the side plate 406 and the module mounting plate 409 by screws, respectively. The module mounting plate 409 is connected and fixed to the beam mounting plate 410 by screws. The beam mounting plate 410 is installed in parallel in the box. The rib plate 413 is connected and fixed to the module mounting plate 409 and the beam mounting plate 410 by screws, and the beam mounting plate 410 is connected and fixed to the beam 411 by screws.

[0034] In this embodiment, the module motor 408 controls the linear module 407 to move, and the linear module 407 drives the beam mounting plate 410 to move, thereby causing the beam 411 to move.

[0035] The beam 411 is provided with a roller brush motor mounting seat 415, a rear sensor mounting seat 417 and a front sensor mounting seat 427, the rear sensor mounting seat 417 and the front sensor mounting seat 427 are respectively connected to two micro modules 418, the upper side of the roller brush motor mounting seat 415 is positioned with the rear pressure sensor 416 by pins and fixed by screws. The rear pressure sensor 416 is positioned with the rear sensor mounting seat 417 by pins and fixed by screws. The rear sensor mounting seat 417 is positioned with the beam mounting plate 410 by steps and fixed by screws.

[0036] The roller brush motor 414 is connected to the roller brush motor shaft 419 by a key and fixed by a pin. A roller brush motor coupling 420 is provided between the roller brush motor shaft 419 and the roller brush 421. The roller brush motor shaft 419 and the roller brush 421 are connected and fixed by the roller brush motor coupling 420. A roller brush connecting shaft 422 is fixedly provided at the other end of the roller brush 421. The roller brush 421 and the roller brush connecting shaft 422 are connected by a square hole. A bearing 423 is sleeved at the end of the roller brush connecting shaft 422. The roller brush connecting shaft 422 and the bearing 423 are connected by an interference fit through an axial hole. The bearing 423 is installed in a bearing seat 424. The bearing 423 and the bearing seat 424 are connected by an axial hole. The bearing seat 424 is connected to the micro module. A bearing cover 425 is installed on the bearing seat 424. The bearing seat 424 and the bearing cover 425 are connected and fixed by screws.

[0037] In actual use, the roller brush motor 414 drives the roller brush motor shaft 419 to rotate during operation, and then drives the roller brush 421 to move through the roller brush motor coupling 420 to complete the cleaning of the wafer.

[0038] The micromodule 418 includes a front micromodule 4181 and a rear micromodule 4182. The front sensor mounting seat 427 is connected to the front pressure sensor 426 and is connected to the front micromodule 4181 on both sides. The rear sensor mounting seat 417 is connected to the rear pressure sensor 416 and is connected to the rear micromodule 4182 on both sides. Specifically, the roller brush motor 414 is connected and fixed to the roller brush motor mounting seat 415 by screws, and the left and right outer sides of the roller brush motor mounting seat 415 are connected and fixed to the rear micromodule 4182 by screws. The rear micromodule 4182 is positioned by steps and connected and fixed to the left and right inner sides of the rear sensor mounting seat 417 by screws. In this embodiment, the micromodule 418 is an existing mature technology product, which is a miniature linear module, and its model is TGN5H-25 (the guide rail width is 5mm and the guide rail length is 25mm).

[0039] The side panel 406 includes a left side panel 4061, a right side panel 4062, a front side panel 4063 and a rear side panel 4064. The left side panel 4061, the right side panel 4062, the front side panel 4063 and the rear side panel 4064 are connected and have a rectangular cross-section. The linear module 407 is respectively fixed to the left side panel 4061 and the module mounting plate 409 by screws.

[0040] A rectangular through hole is provided on the front side plate 4063, and the beam 411 is passed through the through hole. When the linear module 407 is in operation, the beam 411 moves up and down in the through hole.

[0041] The front side plate 4063 is provided with a waterproof window 428, a waterproof cover 429, a water baffle 430, a water spray pipe 431, a water spray pipe mounting seat 432 and a spray head 433. The water baffle 430 is placed in the waterproof window 428 and is connected and fixed to the beam 411 by screws. The upper and lower parts of the water baffle 430 are connected and fixed to the waterproof cover 429 by screws. The waterproof cover 429 is connected and fixed to the upper and lower parts of the waterproof window 428 by screws. The water spray pipe 431 is connected and fixed to the water spray pipe mounting seat 432 by screws, and the water spray pipe 431 is connected and fixed to the spray head 433 by threaded connection.

[0042] During use, the water spray pipe 431 is connected to an existing water pump with cleaning fluid through a pipeline to provide cleaning fluid to the spray head 433 .

[0043] The left and right outer sides of the bearing seat 424 are connected and fixed to the front micro module 4181 by screws, and the upper side of the bearing seat 424 is positioned with the front pressure sensor 426 by pins and connected and fixed by screws. The front pressure sensor 426 is positioned with the front sensor mounting seat 427 by pins and connected and fixed by screws. The front sensor mounting seat 427 is positioned with the beam 411 by pins and connected and fixed by screws and nuts. The front micro module 4181 is positioned with the left and right inner sides of the front pressure sensor mounting seat 426 by steps and connected and fixed by screws. The front side plate 4063 is positioned with the waterproof window 428 and the water spray pipe mounting seat 432 by grooves and connected and fixed by screws.

[0044] During use of the present invention, after the wafer to be cleaned is placed at the existing processing position, the rotating platform 402 drives the roller brush 421 to rotate to above the wafer, and the module motor 408 is started to drive the roller brush 421 to move downward to contact the wafer. When the roller brush 421 presses down on the wafer, the pressure is fed back to the rear pressure sensor 416 and the front pressure sensor 426. After reaching the preset pressure, the roller brush 421 stops moving downward, the roller brush motor 414 drives the roller brush to rotate, and at the same time the water pump is started, and the nozzle 433 sprays cleaning liquid to brush the surface of the wafer. After cleaning is completed, the water pump stops, the roller brush 414 stops rotating, the roller brush 414 rises to the initial position, and the rotating platform 402 rotates to the initial position, and cleaning is completed.

[0045] When the present invention is used, the operation process of the pressure sensor is as follows:

[0046] In the natural state, the rear pressure sensor 416 and the front pressure sensor 426 are calibrated to zero. When the roller brush 414 presses down on the wafer, the wafer reacts to the roller brush 414, and the force is transmitted to the rear pressure sensor 416 and the front pressure sensor 426. When the combined force reaches the preset pressure, the roller brush 414 stops moving downward and brushes the wafer surface with the preset pressure. The micro module 418 allows the bearing seat 424 and the roller brush motor mounting seat 415 to only move up and down, limiting their left and right movement and front and back movement, so that the reaction force acts more accurately on the rear pressure sensor 416 and the front pressure sensor 426.

[0047] Those skilled in the art will appreciate that the embodiments described herein are intended to help readers understand the principles of the present invention, and should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific variations and combinations that do not deviate from the essence of the present invention based on the technical revelations disclosed by the present invention, and these variations and combinations are still within the protection scope of the present invention.

Claims

1. A wafer roller brush rotating scrubbing device with contact force measurement and control, characterized in that: The invention comprises a rotating platform motor (401), a box, a beam (411), a roller brush motor (414), a rear pressure sensor (416), a micro module (418), a roller brush motor shaft (419), a roller brush (421) and a front pressure sensor (426), wherein the rotating platform motor (401) is located at the bottom of the box; one end of the beam (411) is installed in the box, and the other end passes through the box and is connected to the front pressure sensor (426); the rear pressure sensor (416) is connected to the beam (411) and is located in the box; the roller brush motor (414) is located in the box, the rotating shaft end of the roller brush motor (414) is connected to the end of the roller brush motor shaft (419), the roller brush motor shaft (419) is connected to the roller brush (421), and the other end of the roller brush (421) is connected to a connecting piece.

2. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The box body comprises a bottom plate (404), an upper plate (405) and a side plate (406); the bottom plate (404) and the upper plate (405) are respectively located at two ends of the side plate (406) to form a box body structure; the bottom plate (404), the upper plate (405) and the side plate (406) are connected and fixed by screws.

3. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The rotating platform motor (401) is mounted with a rotating platform (402). The rotating platform motor (401) cooperates with the shaft hole of the rotating platform (402) and is tightened and fixed by side screws. The rotating platform (402) and the base plate (404) are positioned by pins and connected and fixed by screws.

4. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: A linear module (407), a module motor (408), a module mounting plate (409), a beam mounting plate (410) and a rib plate (413) are installed on the side plate (406) inside the box body; the linear module (407) is respectively connected and fixed to the side plate (406) and the module mounting plate (409) by screws; the module mounting plate (409) is connected and fixed to the beam mounting plate (410) by screws; the beam mounting plate (410) is installed in parallel in the box body; the rib plate (413) is connected and fixed to the module mounting plate (409) and the beam mounting plate (410) by screws; the beam mounting plate (410) is connected and fixed to the beam (411) by screws.

5. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The beam (411) is provided with a roller brush motor mounting seat (415), a rear sensor mounting seat (417) and a front sensor mounting seat (427); the rear sensor mounting seat (417) and the front sensor mounting seat (427) are respectively connected to two micro modules; the upper side of the roller brush motor mounting seat (415) and the rear pressure sensor (416) are positioned by pins and fixed by screws; the rear pressure sensor (416) and the rear sensor mounting seat (417) are positioned by pins and fixed by screws; the rear sensor mounting seat (417) and the beam mounting plate (410) are positioned by steps and fixed by screws.

6. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The roller brush motor (414) and the roller brush motor shaft (419) are connected by a key and fixed by a pin; a roller brush motor coupling (420) is provided between the roller brush motor shaft (419) and the roller brush (421); the roller brush motor shaft (419) and the roller brush (421) are connected and fixed by the roller brush motor coupling (420); a roller brush connecting shaft (422) is fixedly provided at the other end of the roller brush (421); the roller brush (421) and the roller brush connecting shaft (422) are connected by a square hole. The end of the roller brush connecting shaft (422) is sleeved with a bearing (423), and the roller brush connecting shaft (422) and the bearing (423) are connected by interference fit through an axial hole; the bearing (423) is installed in a bearing seat (424), and the bearing (423) and the bearing seat (424) are connected by matching through an axial hole, and the bearing seat (424) is connected to the micro module; a bearing cover (425) is installed on the bearing seat (424), and the bearing seat (424) and the bearing cover (425) are connected and fixed by screws.

7. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 5 is characterized in that: The micromodule (418) comprises a front micromodule (4181) and a rear micromodule (4182); the front sensor mounting seat (427) is connected to the front pressure sensor (426) and is connected to the front micromodule (4181) on both sides; the roller brush motor (414) is connected and fixed to the roller brush motor mounting seat (415) by screws, and the left and right outer sides of the roller brush motor mounting seat (415) are connected and fixed to the rear micromodule (4182) by screws; the rear micromodule (4182) and the left and right inner sides of the rear sensor mounting seat (417) are positioned by steps and are connected and fixed by screws.

8. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The side plate (406) includes a left side plate (4061), a right side plate (4062), a front side plate (4063) and a rear side plate (4064); the left side plate (4061), the right side plate (4062), the front side plate (4063) and the rear side plate (4064) are connected and have a rectangular cross-section; the linear module (407) is respectively connected and fixed to the left side plate (4061) and the module mounting plate (409) by screws.

9. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1 is characterized in that: The front side plate (4063) is provided with a waterproof window (428), a waterproof cover (429), a water baffle (430), a water spray pipe (431), a water spray pipe mounting seat (432) and a spray head (433); the water baffle (430) is placed in the waterproof window (428) and is connected and fixed to the beam (411) by screws; the upper and lower parts of the water baffle (430) are connected and fixed to the waterproof cover (429) by screws; the waterproof cover (429) is connected and fixed to the upper and lower parts of the waterproof window (428) by screws; the water spray pipe (431) is connected and fixed to the water spray pipe mounting seat (432) by screws; and the water spray pipe (431) is connected and fixed to the spray head (433) by threaded connection.

10. The wafer roller brush rotating scrubbing device with contact force measurement and control according to claim 1, characterized in that: The left and right outer sides of the bearing seat (424) are connected and fixed to the front micro module (4181) by screws, and the upper side of the bearing seat (424) is positioned with the front pressure sensor (426) by pins and connected and fixed by screws; the front pressure sensor (426) and the front sensor mounting seat (427) are positioned with pins and connected and fixed by screws; the front sensor mounting seat (427) and the beam (411) are positioned with pins and connected and fixed by screws and nuts; the left and right inner sides of the front micro module (4181) and the front pressure sensor mounting seat (426) are positioned with steps and connected and fixed by screws; the front side plate (4063) and the waterproof window (428) and the water spray pipe mounting seat (432) are positioned with grooves and connected and fixed by screws.

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