Film storage mechanism, flipping mechanism, flipping device and conveying system

Abstract

This application discloses a wafer storage mechanism, a flipping mechanism, a flipping device, and a transfer system, relating to the field of semiconductor equipment. The wafer storage mechanism includes multiple limiting ends, each movable in a direction from the center region to the edge region of the storage mechanism, and each limiting end has multiple layers of limiting grooves on its side facing the center region, each used to limit multiple wafers. The flipping mechanism includes a flipping component, a first clamping end, and a second clamping end, the first and second clamping ends being connected to the flipping component and respectively, and can be relatively close to or far from each other. The first clamping end has multiple layers of first clamping grooves, and the second clamping end has multiple layers of second clamping grooves, the multiple layers of first clamping grooves and the multiple layers of second clamping grooves being respectively correspondingly arranged for clamping multiple wafers. The flipping device includes the above-mentioned wafer storage mechanism and flipping mechanism. The transfer system includes the above-mentioned flipping device. This application can at least solve problems such as low wafer flipping and transfer efficiency.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment, specifically relating to a wafer storage mechanism, a flipping mechanism, a flipping device, and a transmission system. Background Technology

[0002] Compared to tank-type cleaning machines, single-wafer cleaning machines offer better cleaning results but lower efficiency because they clean individual wafers. This necessitates minimizing cycle time in single-wafer cleaning machines to increase overall efficiency. Furthermore, single-wafer cleaning machines require a 180-degree wafer flip to clean the back side of the wafer. Existing wafer flipping devices can only flip one wafer at a time, resulting in low flipping efficiency and impacting overall process efficiency. Summary of the Invention

[0003] The purpose of this application is to provide a storage mechanism, a flipping mechanism, a flipping device, and a transmission system that can at least solve problems such as low flipping efficiency.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] This application provides a wafer storage mechanism, including: a plurality of limiting ends, each of the limiting ends being movable in the direction from the middle region to the edge region of the wafer storage mechanism, and each of the limiting ends having a multi-layer limiting groove on the side facing the middle region, the multi-layer limiting groove being used to limit multiple wafers respectively.

[0006] This application embodiment also provides a flipping mechanism, including: a flipping component, a first clamping end and a second clamping end, wherein the first clamping end and the second clamping end are both connected to the flipping component, and the first clamping end and the second clamping end can be relatively close to or far away from each other;

[0007] The first clamping end is provided with multiple layers of first clamping grooves, and the second clamping end is provided with multiple layers of second clamping grooves. The multiple layers of first clamping grooves and the multiple layers of second clamping grooves are respectively arranged to clamp multiple wafers.

[0008] The flipping component is used to drive the first clamping end and the second clamping end to flip, and through the first clamping end and the second clamping end, drive multiple wafers to flip.

[0009] This application embodiment also provides a flipping device, including the above-described wafer storage mechanism and flipping mechanism;

[0010] The flipping mechanism is used to flip multiple wafers on the wafer storage mechanism.

[0011] This application embodiment also provides a transmission system for transmitting wafers in a wafer storage cassette to a process chamber. The transmission system includes: a front transmission device, a rear transmission device, and the aforementioned flipping device.

[0012] The front-end transmission device has multiple first pickup ends, which are respectively used to pick up multiple wafers from the wafer storage box and transmit the multiple wafers to the flipping device;

[0013] The flipping device is used to flip the wafer;

[0014] The rear transmission device has multiple second pickup ends, which are respectively used to pick up multiple wafers after being flipped from the flipping device and transmit the multiple wafers after being flipped to the process chamber.

[0015] In this embodiment, the wafer storage mechanism can simultaneously hold multiple wafers through multiple limiting slots, facilitating the placement and removal of wafers and enabling subsequent simultaneous flipping of multiple wafers. Based on the above configuration, the wafer storage mechanism in this embodiment can store multiple wafers at once, which can improve the efficiency of subsequent wafer flipping to a certain extent and lay the foundation for high-efficiency wafer transfer. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the flipping device and wafer disclosed in the embodiments of this application;

[0017] Figure 2 This is a schematic diagram of the structure of the flipping mechanism disclosed in the embodiments of this application;

[0018] Figure 3 This is a schematic diagram of the structure of the first clamping block or the second clamping block disclosed in the embodiments of this application;

[0019] Figure 4 This is a schematic diagram of the wafer storage mechanism and wafer structure disclosed in the embodiments of this application;

[0020] Figure 5 This is a schematic diagram of the structure of the chip storage mechanism disclosed in the embodiments of this application;

[0021] Figure 6 This is a schematic diagram of the structure of the carrier component disclosed in the embodiments of this application;

[0022] Figure 7 This is a schematic diagram of the structure of the support component disclosed in the embodiments of this application without the cover;

[0023] Figure 8 This is a disassembly diagram of the carrier component disclosed in an embodiment of this application;

[0024] Figure 9 This is a schematic diagram of the structure of the driving component disclosed in the embodiments of this application;

[0025] Figure 10 This is a schematic diagram of the structure of the limiting block disclosed in the embodiments of this application;

[0026] Figure 11 This is a schematic diagram of the structure of the elastic sleeve disclosed in the embodiments of this application;

[0027] Figure 12 This is a schematic diagram of a structure in which all of the limiting ends disclosed in the embodiments of this application are in a retracted state;

[0028] Figure 13 This is a schematic diagram of a structure in which all of the limiting ends disclosed in the embodiments of this application are in an extended state;

[0029] Figure 14 This is a schematic diagram of the layout of the transfer system disclosed in this application, which transfers wafers between the wafer storage box and the process chamber.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - Tilting mechanism; 110 - Base; 120 - First rotating block; 130 - Second rotating block;

[0032] 140 - First clamping assembly; 141 - First clamping arm; 142 - First clamping block; 1421 - First clamping groove; 143 - First pressure plate;

[0033] 150 - Second clamping assembly; 151 - Second clamping arm; 152 - Second clamping block; 1521 - Second clamping groove; 153 - Second pressure plate;

[0034] 200-film storage institution;

[0035] 210-Bearing component; 211-Mounting base; 2111-Fixing plate; 2112-Annular component; 2113-Cover; 2114-Receiving cavity; 212-Drive component; 2121-Linear drive component; 2122-Connecting rod; 213-Limiting component; 2131-Limiting groove;

[0036] 220 - Sealing assembly; 221 - Flexible sleeve; 222 - Fastening sleeve; 230 - Base; 240 - Leveling assembly;

[0037] 300 - Front-end transmission device;

[0038] 400 - Rear transmission device;

[0039] 500-film storage box;

[0040] 600 - Process Chamber;

[0041] MN - First axis; PQ - Second axis. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0043] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0044] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0045] refer to Figures 1 to 14 This application discloses a flipping device for flipping a wafer, enabling the wafer to be flipped to a desired angle, such as 45°, 90°, or 180°. The disclosed flipping device includes a flipping mechanism 100 and a wafer storage mechanism 200, wherein the flipping mechanism 100 is used to flip the wafer on the wafer storage mechanism 200.

[0046] In some embodiments, the wafer can be transferred to the storage mechanism 200 via a wafer transfer mechanism, flipped by a preset angle by a flipping mechanism 100, and then transferred away by the wafer transfer mechanism. To improve the flipping and subsequent wafer transfer efficiency, the flipping mechanism 100 in this embodiment can flip multiple wafers at once, and the storage mechanism 200 can store multiple wafers at once. Compared with some devices that can only flip and store single wafers, the flipping device in this embodiment has higher flipping efficiency.

[0047] To enable temporary storage of multiple wafers, the wafer storage mechanism 200 has multiple limiting ends. Each limiting end has a multi-layer limiting groove 2131 on one side facing the central region of the wafer storage mechanism 200. The multi-layer limiting groove 2131 is used to limit the multiple wafers respectively.

[0048] In some embodiments, each limiting groove 2131 has two through sides and a support platform at the bottom to support the wafer; the sidewalls of the limiting groove 2131 can limit the edge of the wafer. Based on this, stable support for the wafer can be ensured, and the wafer can be effectively prevented from moving randomly.

[0049] For example, the longitudinal section of the support stage can be trapezoidal. This design can reduce the contact area between the support stage and the wafer. When the support stage and the wafer move relative to each other, the friction can be reduced to a certain extent, avoiding wear on the wafer or causing the wafer to move.

[0050] Considering the stacked arrangement of multiple wafers and their temporary storage via the wafer storage mechanism 200, the limiting end needs to be able to move appropriately during the wafer transfer process to avoid interference and ensure that the limiting end does not touch the wafer during the transfer process. After the wafer transfer is completed, the limiting end needs to support and limit the wafer.

[0051] Based on the above, each limiting end in this embodiment can move in the direction from the middle region to the edge region of the wafer storage mechanism 200 to facilitate wafer avoidance and support.

[0052] Specifically, during the process of placing multiple wafers into the wafer storage mechanism 200, multiple limiting ends need to be moved toward the edge region before wafer placement to provide sufficient placement space for the multiple wafers; when the multiple wafers are placed in the corresponding positions, the multiple limiting ends move toward the central region, that is, the multiple limiting ends contract, so that the multi-layer limiting groove 2131 of each limiting end can be engaged with the edge of the multiple wafers, thereby achieving support and limiting of the wafers.

[0053] It should be noted here that after the multiple limiting ends move towards the edge area to provide sufficient placement space for multiple wafers, a front-mounted robotic arm can be used to place or remove the wafers. Specifically, when placing wafers, after the multiple limiting ends move to the edge area, the front-mounted robotic arm descends and then moves the multiple limiting ends towards the center area, thereby clamping the wafers through the multiple limiting ends; when removing wafers, the rear-mounted robotic arm first lifts the wafer, and then the multiple limiting ends move towards the edge area so that the rear-mounted robotic arm can remove the wafers.

[0054] For example, when the wafer storage mechanism 200 is circular in shape, the direction from the central region to the edge region can be regarded as the radial direction of the wafer storage mechanism 200; of course, when the wafer is placed in the wafer storage mechanism 200, the direction from the central region to the edge region can also be regarded as the radial direction of the wafer.

[0055] In this embodiment, the wafer storage mechanism 200 can simultaneously hold multiple wafers through multiple limiting slots 2131, facilitating the placement and removal of wafers and enabling subsequent simultaneous flipping of multiple wafers. Based on the above configuration, the wafer storage mechanism in this embodiment can store multiple wafers at once, which can improve the efficiency of subsequent wafer flipping to a certain extent and lay the foundation for high-efficiency wafer transfer.

[0056] In some embodiments, the wafer storage mechanism 200 may include a carrier component 210 for carrying multiple wafers. The carrier component 210 may include a mounting base 211, a plurality of drive components 212, and a plurality of limiting members 213 as limiting ends. The mounting base 211 is a base mounting component that provides a mounting foundation for the drive components 212 and the limiting members 213. The drive components 212 provide driving force for the movement of the limiting members 213. The limiting members 213 support and limit the wafers.

[0057] Specifically, multiple drive components 212 are respectively disposed on the mounting base 211, and multiple limiting members 213 are respectively connected to the multiple drive components 212. The drive components 212 are used to drive the limiting members 213 to move in the direction from the central region to the edge region.

[0058] Based on the above configuration, during the wafer placement process, multiple driving components 212 first drive multiple limiting members 213 to move towards the edge region to make way for multiple wafers; after the multiple wafers reach the preset position, the multiple driving components 212 drive multiple limiting members 213 to move towards the central region so that the multiple wafers can be supported and limited by the multi-layer limiting grooves 2131 provided at the limiting end of each limiting member 213.

[0059] For example, the carrying component 210 may include three driving components 212 and three limiting members 213. Each limiting member 213 is connected to the corresponding driving component 212 to form a limiting pair. The three limiting pairs are arranged non-uniformly in the circumferential direction of the chip storage mechanism 200. For example, the angle between the first and second limiting pairs is 150°, the angle between the second and third limiting pairs is 60°, and the angle between the third and first limiting pairs can be 150°. Of course, other asymmetrical arrangements can also be used. In addition, the three limiting pairs can also be arranged symmetrically in the circumferential direction of the chip storage mechanism 200, that is, the angle between two adjacent limiting pairs is 120°. It should be noted that when the three limiting pairs are arranged non-uniformly in the circumferential direction of the chip storage mechanism 200, the space between two of the limiting pairs can be larger, thereby providing more space for the robot to transfer chips and effectively preventing the robot from colliding with the chip storage mechanism 200. When the three limit pairs are evenly arranged in the circumferential direction of the wafer storage mechanism 200, the edge of the wafer can be subjected to more uniform force through the three limit pairs, which is beneficial to improving the stability of wafer storage.

[0060] In some embodiments, the drive assembly 212 may include a linear drive member 2121 and a connecting rod 2122, wherein the connecting rod 2122 connects the corresponding linear drive member 2121 and the limiting member 213, and the linear drive member 2121 can drive the limiting member 213 to move through the connecting rod 2122. For example, the linear drive member 2121 may be a cylinder, a hydraulic cylinder, an electric cylinder, etc.

[0061] Optionally, a fixing block may be provided at the end of the connecting rod 2122 away from the linear drive member 2121, and the limiting member 213 may be installed to the fixing block by screws.

[0062] To facilitate the installation of the linear drive unit 2121, in this embodiment, a receiving cavity 2114 can be provided near the central region of the mounting base 211. The linear drive units 2121 of the multiple drive components 212 are respectively disposed within the receiving cavity 2114, and their respective connecting rods 2122 protrude from the sidewall of the receiving cavity 2114. Based on this arrangement, on the one hand, the receiving cavity 2114 provides installation space for the multiple linear drive units 2121; on the other hand, the receiving cavity 2114 can surround the multiple linear drive units 2121, thus separating them from the wafer supported and limited by the limiting member 213. This effectively alleviates the problem of particle contamination of the wafer caused by the linear drive units 2121 during movement, thereby improving product yield.

[0063] To further prevent particles generated by the linear drive 2121 from leaking from the receiving cavity 2114, the chip storage mechanism 200 may also include a sealing assembly 220 to seal the position of the receiving cavity 2114 through which the connecting rod 2122 protrudes, thereby ensuring the sealing performance of the receiving cavity 2114 and meeting the movement requirements of the connecting rod 2122.

[0064] The sealing assembly 220 may include an elastic sleeve 221 and a fastening sleeve 222. One end of the elastic sleeve 221 is connected to the side wall of the receiving cavity 2114, and the other end of the elastic sleeve 221 is connected to the fastening sleeve 222. The elastic sleeve 221 and the fastening sleeve 222 are respectively sleeved on the outside of the connecting rod 2122, and the fastening sleeve 222 is fixed to the connecting rod 2122. Based on this configuration, a sealed connection between the connecting rod 2122 and the side wall of the receiving cavity 2114 can be achieved through the elastic sleeve 221 and the fastening sleeve 222, preventing particles generated by the linear drive 2121 from leaking from the receiving cavity 2114 and causing contamination of the wafer. Simultaneously, during the movement of the connecting rod 2122, the fastening sleeve 222 can move with the connecting rod 2122, while the elastic sleeve 221 undergoes elastic deformation to adapt to the movement of the connecting rod 2122, thus ensuring both sealing performance and avoiding interference with the movement of the connecting rod 2122.

[0065] For example, the sidewall of the receiving cavity 2114 may have multiple through holes, through which multiple connecting rods 2122 protrude. Additionally, both ends of the elastic sleeve 221 may have threaded structures, which engage with the threaded holes in the sidewall of the fastening sleeve 222 and the receiving cavity 2114 respectively, facilitating assembly and disassembly. The elastic sleeve 221 may be a corrugated pipe; other forms of deformable tubing may also be used, without specific limitations.

[0066] In addition, the side wall of the fastening sleeve 222 may be provided with a threaded hole, and a screw is provided in the threaded hole. By turning the screw, the end of the screw can be pressed against the connecting rod 2122 to achieve a tight connection between the fastening sleeve 222 and the connecting rod 2122.

[0067] In some embodiments, the mounting base 211 may include a fixing disk 2111, an annular member 2112, and a cover 2113. The annular member 2112 is located at the center of the fixing disk 2111, and the cover 2113 is detachably connected to the end of the annular member 2112 facing away from the fixing disk 2111. Thus, the fixing disk 2111, the annular member 2112, and the cover 2113 together form a receiving cavity 2114. To prevent the mounting base 211 from interfering with the wafer supported by the limiting member 213, the top surface of the cover 2113 is lower than the lowest supporting surface of the limiting member 213 for the wafer, thereby preventing the wafer from contacting the cover 2113.

[0068] For example, the fixed disk 2111 may have an annulus on its edge and a disk in its center, and multiple connecting ribs connect the disk and the annulus to ensure a stable connection between the disk and the annulus; the annular component 2112 may be an annular cylinder, one end of which is connected to the disk and the disk seals one end of the annular cylinder; the other end of the annular cylinder is sealed by a cover 2113 to ensure the airtightness of the receiving cavity 2114, which is a sealed cavity formed by the disk, the annular cylinder and the cover 2113.

[0069] In addition, the disk can have multiple openings. Some of these openings are wiring holes, such as for sensor wiring to detect linear drive mechanisms, while others are clearance holes to avoid parts of the linear drive mechanism, such as pneumatic connectors.

[0070] The side wall of the annular part 2112 is provided with multiple threaded through holes, and the connecting rod 2122 passes through the corresponding threaded through hole to the receiving cavity 2114 so as to connect with the limiting part 213.

[0071] In addition, the fastening sleeve 222 may be provided with internal threads, and the two ends of the elastic sleeve 221 are respectively provided with external threads, so that the elastic sleeve 221 is threadedly connected to the fastening sleeve 222 and the annular part 2112 respectively, so as to facilitate disassembly and assembly.

[0072] In some embodiments, the wafer storage mechanism 200 may further include a base 230 and a plurality of leveling components 240, wherein the plurality of leveling components 240 are respectively connected between the mounting base 211 and the base 230 for leveling the mounting base 211 to ensure the horizontality of the multiple wafers carried by the carrier component 210.

[0073] The leveling assembly 240 may include an adjusting screw and a locking nut, wherein the adjusting screw is connected between the base 230 and the mounting base 211. Exemplarily, the adjusting screw may be fixedly connected to the base 230 and threadedly connected to the mounting base 211. By rotating the adjusting screw, the distance between a portion of the mounting base 211 and the base 230 can be changed. Thus, by using multiple adjusting screws, leveling of the mounting base 211 can be achieved to ensure the horizontality of the mounting base 211, thereby ensuring the horizontality of the wafer. Alternatively, the adjusting screw may be fixedly connected to the mounting base 211 and threadedly connected to the base 230, which also achieves leveling of the mounting base 211.

[0074] After leveling is complete, tighten the lock nut to lock the adjusting screw and prevent it from rotating accidentally and affecting the levelness of the wafer.

[0075] This application also discloses a flipping mechanism 100, which includes a flipping component, a first clamping end, and a second clamping end. Both the first and second clamping ends are connected to the flipping component, and the first and second clamping ends can be relatively close to or far apart. The flipping component is used to drive the first and second clamping ends to flip, and to drive multiple wafers to flip through the first and second clamping ends. Specifically, when it is necessary to clamp the wafers, the first and second clamping ends are initially far apart to avoid collision with the wafers and damage. When the distance between them is greater than the diameter of the wafers, the wafers on the wafer storage mechanism 200 can be clamped, thereby driving the wafers to move through the first and second clamping ends via the flipping component, and achieving a flipping at a preset angle.

[0076] To achieve the one-time flipping of multiple wafers, this application embodiment redesigns the first clamping end and the second clamping end. Specifically, the first clamping end is provided with multiple layers of first clamping grooves 1421, and the second clamping end is provided with multiple layers of second clamping grooves 1521. The multiple layers of first clamping grooves 1421 and the multiple layers of second clamping grooves 1521 are respectively provided correspondingly. In this way, when the first clamping end and the second clamping end are relatively close, the edges of multiple wafers can be respectively entered into the corresponding layers of first clamping grooves 1421 and second clamping grooves 1521, thereby achieving clamping and limiting of multiple wafers, so as to facilitate the one-time flipping of multiple wafers by the flipping mechanism 100.

[0077] It should be noted that before the flipping, multiple wafers are temporarily stored on the wafer storage mechanism 200, and there is a certain gap between two adjacent wafers. Thus, when designing the first clamping end and the second clamping end, there is also a certain gap between two adjacent layers of the first clamping groove 1421, and there is also a certain gap between two adjacent layers of the second clamping groove 1521, so as to accommodate the relative positional relationship between the multiple wafers.

[0078] In some embodiments, the flipping component may include a base 110, a first rotating block 120, and a second rotating block 130. The first rotating block 120 is rotatably disposed on the base 110 about a first axis MN, and the second rotating block 130 is rotatably disposed on the first rotating block 120 along a second axis PQ perpendicular to the first axis MN. Additionally, the flipping mechanism 100 may also include a first clamping assembly 140 and a second clamping assembly 150, respectively disposed on the second rotating block 130, and the two may be relatively close to or far apart. The first axis MN may extend horizontally, and the second axis PQ may form a certain angle with the horizontal direction. For example, the first rotating block 120 may be a 45° rotating block, and the second rotating block 130 may be a 180° rotating block.

[0079] Based on the above configuration, when the first rotating block 120 rotates around the first axis MN, it can drive the second rotating block 130, the first clamping component 140 and the second clamping component 150 to rotate together around the first axis MN. This process can cause the wafer held by the first clamping component 140 and the second clamping component 150 to be released from the wafer storage mechanism 200, thereby providing sufficient space for wafer flipping to avoid interference during wafer flipping.

[0080] When the second rotating block 130 rotates around the second axis PQ, it can drive the first clamping component 140 and the second clamping component 150 to rotate together around the second axis PQ. This process can enable the wafers clamped by the first clamping component 140 and the second clamping component 150 to achieve a preset angle of rotation, such as rotating 180°.

[0081] After the wafer flipping process is completed, the first rotating block 120 drives the second rotating block 130, the first clamping assembly 140 and the second clamping assembly 150 to rotate in opposite directions around the first axis MN, so as to place the flipped wafer back into the wafer storage mechanism 200.

[0082] Additionally, the first rotating block 120 can be connected to the first rotating drive component for transmission, so that the first rotating block 120 can be driven to rotate around the first axis MN by the first rotating drive component. For example, the first rotating drive component can be a motor, such as a servo motor, etc. Of course, other components can also be used, which are not specifically limited here.

[0083] The first rotating block 120 may include a second rotating drive component, and the second rotating block 130 is connected to the second rotating drive component for transmission, so that the second rotating block 130 is driven to rotate around the second axis PQ by the second rotating drive component. For example, the second rotating drive component may be a motor, such as a servo motor, etc. Of course, other components may also be used, which are not specifically limited here.

[0084] The second rotating block 130 may include a clamping drive member having two drive ends connected to the first clamping assembly 140 and the second clamping assembly 150 respectively, so as to drive the first clamping assembly 140 to move closer or further away from each other. For example, the clamping drive member may be a clamping cylinder, but it may also be other components, which are not specifically limited here.

[0085] In some embodiments, the first clamping assembly 140 may include a first clamping arm 141 and a first clamping block 142 as a first clamping end, wherein one end of the first clamping arm 141 is connected to the second rotating block 130, and the first clamping block 142 is connected to the end of the first clamping arm 141 opposite to the second rotating block 130; correspondingly, the second clamping assembly 150 may include a second clamping arm 151 and a second clamping block 152 as a second clamping end, wherein one end of the second clamping arm 151 is connected to the second rotating block 130, and the second clamping block 152 is connected to the end of the second clamping arm 151 opposite to the second rotating block 130; and the first clamping block 142 has multiple layers of first clamping grooves 1421 on the side facing the second clamping block 152, and the second clamping block 152 has multiple layers of second clamping grooves 1521 on the side facing the first clamping block 142, and the multiple layers of first clamping grooves 1421 and the multiple layers of second clamping grooves 1521 are respectively arranged opposite to each other.

[0086] Based on the above configuration, when the first clamping arm 141 and the second clamping arm 151 are relatively close, the first clamping block 142 and the second clamping block 152 can be relatively close, so that the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 can respectively accommodate the edge of the wafer. That is, each first clamping groove 1421 is inserted into a local edge of a wafer, and the corresponding second clamping groove 1521 is inserted into the edge of other areas of the same wafer. Thus, the multi-layer first clamping groove 1421 and the corresponding second clamping groove 1521 cooperate with each other to achieve the limiting of the multi-layer wafer. When the first clamping arm 141 and the second clamping arm 151 are relatively far apart, the first clamping block 142 and the second clamping block 152 can be relatively far apart, so that the multi-layer first clamping groove 1421 and the multi-layer second clamping groove 1521 are respectively far away from the edge of the wafer, thereby realizing the release of the wafer.

[0087] For example, the first clamping assembly 140 may further include a first pressure plate 143, which is mounted to the first clamping arm 141 by screws, and a first clamping block 142 is disposed between the first pressure plate 143 and the first clamping arm 141, so as to firmly fix the first clamping block 142 on the first clamping arm 141 by the first pressure plate 143.

[0088] Similarly, the second clamping assembly 150 may also include a second pressure plate 153, which is installed to the second clamping arm 151 by screws, and a second clamping block 152 is disposed between the second pressure plate 153 and the second clamping arm 151, so that the second clamping block 152 is firmly fixed to the second clamping arm 151 by the second pressure plate 153.

[0089] Based on the above-mentioned flipping device, this application embodiment also discloses a transmission system for transmitting wafers in the wafer storage box 500 to the process chamber 600. The disclosed transmission system includes a front transmission device 300, a rear transmission device 400, and the above-mentioned flipping device.

[0090] The front-end transfer device 300 has multiple first pickup ends, each used to pick up multiple wafers from the wafer storage cassette 500 and transfer them to the flipping device. Specifically, the multiple first pickup ends can place multiple wafers in the wafer storage mechanism 200 and support and limit them through multiple limiting members 213. During the wafer placement process, the multiple limiting members 213 are first moved towards the edge region to provide sufficient space for the wafers; the front-end transfer device 300 carries the multiple wafers between the multiple limiting members 213, at which point the multiple limiting members 213 move towards the central region until each limiting member 213 engages with a wafer to support and limit its movement.

[0091] The flipping device is used to flip the wafer.

[0092] The rear transfer device 400 has multiple second pickup ends, each used to pick up multiple flipped wafers from the flipping device and transfer them to the process chamber 600. Specifically, the multiple second pickup ends can pick up multiple wafers from the wafer storage mechanism 200 and transfer them. During the wafer retrieval process, the rear transfer device 400 is first moved to the location of the wafer and picks it up. Then, multiple limiting members 213 move towards the edge area to release the limiting of the wafer, and the rear transfer device 400 removes the wafer.

[0093] For example, the first pickup end and the second pickup end can each be a gripper, a suction cup, or other component, and the specific form is not limited.

[0094] It should be noted that both the front-end transmission device 300 and the rear-end transmission device 400 can pick up and transmit multiple wafers. Their specific structures are not included in the scope of protection of the embodiments of this application, and existing technologies can be used. They will not be described in detail here.

[0095] The operation of the transmission system in this embodiment is as follows:

[0096] When the forward transfer device 300 retrieves multiple wafers from the wafer storage cassette 500 and transfers them to the wafer storage mechanism 200 of the flipping device, multiple linear drive members 2121 are in an extended state, and correspondingly, multiple limiting members 213 are in an expanded state to provide sufficient placement space for the wafers. In addition, the first rotating block 120 of the flipping mechanism 100 forms a 45° angle with the horizontal plane to prevent interference with the wafer transfer. When the forward transfer device 300 places multiple wafers at a preset distance (e.g., 1mm to 9mm) above the support surface of the limiting member 213 (i.e., the bottom wall of the limiting groove 2131), multiple linear drive members 2121 retract simultaneously. At the same time, the forward transfer device 300 continues to descend until the multiple wafers are placed on the support surface of the limiting member 213. The forward transfer device 300 then retracts.

[0097] The flipping device is activated, and the first rotating block 120 rotates from a position at a 45° angle to the horizontal plane to a position at a 0° angle to the horizontal plane. At this time, the first clamping assembly 140 and the second clamping assembly 150 are located on both sides of the wafer. The first clamping assembly 140 and the second clamping assembly 150 move closer to each other and clamp the wafer. Multiple linear drive members 2121 extend, causing multiple limiting members 213 to move completely outside the edge of the wafer to prevent the limiting members 213 from contacting the wafer and causing damage. The first rotating block 120 rotates from a position at a 0° angle to the horizontal plane to a position at a 45° angle to lift the wafer. The second rotating block 130 drives the wafer to flip 180°. The first rotating block 120 rotates from a position at a 45° angle to the horizontal plane to a position at a 0° angle to lower the wafer. Multiple linear drive members 2121 retract, causing multiple limiting members 213 to clamp the wafer, thereby placing multiple wafers in the wafer storage mechanism 200.

[0098] When the rear transfer device 400 retrieves wafers from the wafer storage mechanism 200 of the flipping device, the rear transfer device 400 first supports the multiple wafers on the wafer storage mechanism 200. Then, multiple linear drive members 2121 switch to the extended state, and correspondingly, multiple limiting members 213 switch to the expanded state. The rear transfer device 400 carries the multiple wafers away from the wafer storage mechanism 200 and transfers the multiple wafers to the process chamber 600 for processing.

[0099] In summary, the flipping device in this application embodiment can temporarily store and flip multiple wafers, and avoid misalignment during the handling of multiple wafers, thereby improving the efficiency of wafer flipping and transmission while ensuring the integrity of multiple wafers.

[0100] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A chip storage mechanism, characterized in that, include: Multiple limiting ends, each of the limiting ends being movable in the direction from the middle region to the edge region of the wafer storage mechanism (200), and each of the limiting ends having a multi-layer limiting groove (2131) on the side facing the middle region, the multi-layer limiting groove (2131) being used to limit multiple wafers respectively; The chip storage mechanism (200) includes a mounting base (211), a linear drive (2121), a connecting rod (2122), and a limiting member (213) serving as the limiting end. The mounting base (211) has a receiving cavity (2114) located near the central region. The linear drive (2121) is located inside the receiving cavity (2114). The connecting rod (2122) is connected between the linear drive (2121) and the limiting member (213), and the connecting rod (2122) extends through the side wall of the receiving cavity (2114).

2. The chip storage mechanism according to claim 1, characterized in that, The chip storage mechanism (200) includes a support component (210), which includes the mounting base (211), a plurality of drive components (212) and a plurality of limiting members (213). Multiple drive components (212) are respectively disposed on the mounting base (211), and multiple limiting members (213) are respectively connected to the multiple drive components (212). The drive components (212) are used to drive the limiting members (213) to move in the direction from the central region to the edge region.

3. The chip storage mechanism according to claim 2, characterized in that, Each of the drive components (212) includes the linear drive element (2121) and the connecting rod (2122); Each of the multiple drive components (212) has a linear drive element (2121) disposed within the receiving cavity (2114), and each of the connecting rods (2122) extends through the side wall of the receiving cavity (2114).

4. The chip storage mechanism according to claim 1, characterized in that, The chip storage mechanism (200) further includes a sealing assembly (220), which includes an elastic sleeve (221) and a fastening sleeve (222). One end of the elastic sleeve (221) is connected to the side wall of the receiving cavity (2114), and the other end of the elastic sleeve (221) is connected to the fastening sleeve (222). The elastic sleeve (221) and the fastening sleeve (222) are respectively sleeved on the outside of the connecting rod (2122), and the fastening sleeve (222) is fixedly connected to the connecting rod (2122).

5. The chip storage mechanism according to claim 4, characterized in that, The mounting base (211) includes a fixing plate (2111), an annular component (2112), and a cover (2113). The annular component (2112) is located in the middle of the fixed disk (2111), and the cover (2113) is detachably connected to the end of the annular component (2112) away from the fixed disk (2111). The fixed disk (2111), the annular component (2112), and the cover (2113) together form the receiving cavity (2114).

6. The chip storage mechanism according to claim 5, characterized in that, The annular component (2112) has multiple threaded through holes on its side wall, and the connecting rod (2122) passes through the corresponding threaded through hole to exit the receiving cavity (2114). The fastening sleeve (222) is provided with an internal thread, and the two ends of the elastic sleeve (221) are respectively provided with external threads. The elastic sleeve (221) is threadedly connected to the fastening sleeve (222) and the annular part (2112).

7. The chip storage mechanism according to claim 1, characterized in that, The chip storage mechanism (200) also includes a base (230) and multiple leveling components (240). Multiple leveling components (240) are respectively connected between the mounting base (211) and the base (230) for leveling the mounting base (211).

8. A flipping device, characterized in that, The wafer storage mechanism (200) according to any one of claims 1 to 7, and the flipping mechanism (100) for flipping multiple wafers on the wafer storage mechanism (200), characterized in that the flipping mechanism (100) includes: a flipping component, a first clamping end and a second clamping end, the first clamping end and the second clamping end are both connected to the flipping component, and the first clamping end and the second clamping end can be relatively close to or far away from each other; The first clamping end is provided with multiple layers of first clamping grooves (1421), and the second clamping end is provided with multiple layers of second clamping grooves (1521). The multiple layers of first clamping grooves (1421) and the multiple layers of second clamping grooves (1521) are respectively provided for clamping multiple wafers. The flipping component is used to drive the first clamping end and the second clamping end to flip, and through the first clamping end and the second clamping end, drive multiple wafers to flip.

9. The flipping device according to claim 8, characterized in that, The flipping component includes a base (110), a first rotating block (120), and a second rotating block (130); The first rotating block (120) is rotatably disposed on the base (110) around the first axis (MN); The second rotating block (130) is rotatably disposed on the first rotating block (120) about a second axis (PQ) perpendicular to the first axis (MN); The flipping mechanism (100) further includes a first clamping component (140) and a second clamping component (150), the first clamping component (140) and the second clamping component (150) being respectively disposed on the second rotating block (130), and the two being relatively close to or far apart.

10. The flipping device according to claim 9, characterized in that, The first clamping assembly (140) includes a first clamping arm (141) and a first clamping block (142) as the first clamping end. One end of the first clamping arm (141) is connected to the second rotating block (130), and the first clamping block (142) is connected to the end of the first clamping arm (141) away from the second rotating block (130). The second clamping assembly (150) includes a second clamping arm (151) and a second clamping block (152) as the second clamping end. One end of the second clamping arm (151) is connected to the second rotating block (130) and is correspondingly disposed with the first clamping arm (141). The second clamping block (152) is connected to the end of the second clamping arm (151) that is away from the second rotating block (130). The first clamping block (142) has multiple layers of the first clamping groove (1421) on the side facing the second clamping block (152), and the second clamping block (152) has multiple layers of the second clamping groove (1521) on the side facing the first clamping block (142).

11. A transfer system for transferring wafers from a wafer storage cassette (500) to a process chamber (600), characterized in that, The transmission system includes: a front transmission device (300), a rear transmission device (400), and a flipping device as described in any one of claims 8 to 10; The front-end transmission device (300) has a plurality of first pickup ends, which are respectively used to pick up a plurality of wafers from the wafer storage box (500) and transmit the plurality of wafers to the flipping device; The flipping device is used to flip the wafer; The rear transfer device (400) has a plurality of second pickup ends, which are respectively used to pick up multiple wafers after flipping from the flipping device and transfer the multiple wafers after flipping to the process chamber (600).

Images