An OCS array optical switch and monitoring method thereof

Abstract

The present invention relates to the field of optical communication technology, and in particular to an OCS array optical switch and a monitoring method thereof. Signal light and first monitoring light are coupled by an input coupling module and then transmitted to an input MEMS chip. The input MEMS chip transmits the coupled light to a dichroic mirror, which separates the two light beams. The first monitoring light is transmitted to a monitoring sensor module. Similarly, the second monitoring light is transmitted to the monitoring sensor module. In the monitoring sensor module, it is determined whether the light spots of the first monitoring light and the second monitoring light fall at ideal positions. If it is found that they do not fall at the ideal position, the voltage value of the MEMS chip is adjusted to control the rotating mirror so that the monitoring light falls at an optimal point. At this time, the rotating angle of the rotating mirror causes the light incident on a specified channel to be emitted from a specified output port, thereby achieving the purpose of optical switch switching. The monitoring system can also realize real-time monitoring and correction of the optical path, solving the problem that the deflection of the rotating mirror in the MEMS chip causes performance degradation of the OCS system.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an OCS array optical switch and a monitoring method thereof. Background Art

[0002] Many optical cross-connect switches can be used to switch optical signals directly from one fiber to another, eliminating the need to convert the optical signals into intermediate electrical signals. Optical signal switching and routing can be performed by an optical circuit switch (OCS). An OCS is an all-optical switching matrix that routes optical signals from input ports to output ports. Optical signals can be switched from one path to another by repositioning one or more mirrors in a mirror array. An MxN array optical switch can achieve arbitrary pairings between M input channels and N output channels. Switching is performed entirely at the optical layer, without wavelength or electrical switching. This can significantly reduce the number of traditional switches required in data center networks and eliminate the expensive optoelectronic conversion required by circuit switches, resulting in significant cost and power savings, as well as reduced transmission latency. Advances in photonic integration technology have reduced the size, power consumption, and cost of OCS systems, while improving performance and flexibility. Furthermore, the growth of cloud computing and big data applications is driving the increasing demand for high-capacity, low-latency communications, further driving the development of OCS technology.

[0003] However, as the dimensions of OCS increase, the integration of micro-electromechanical systems (MEMS) chips becomes very high, resulting in very small spacing between rotating mirrors. Any slight displacement in the entire system may cause a sharp deterioration in performance such as channel insertion loss. During the operation of accessing customer signal light, the mirrors on the MEMS chip may shift in angle due to factors such as charge accumulation, or environmental factors such as vibration may cause channel performance to deteriorate, affecting usage.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by the present invention is how to solve the problem that the rotation angle of the rotating mirror in the MEMS chip drifts due to changes in environmental factors such as charge accumulation or vibration, thereby causing the performance of the OCS system to deteriorate.

[0006] The present invention adopts the following technical solutions:

[0007] In a first aspect, an OCS array optical switch is provided, comprising an input coupling module 1, an input MEMS chip 2, a dichroic mirror 3, a monitoring sensor module 4, an output MEMS chip 5, and an output coupling module 6;

[0008] The input coupling module 1, the input MEMS chip 2, the reflective surface of the dichroic mirror 3, the output MEMS chip 5 and the output coupling module 6 are coupled in sequence along the optical path, and the monitoring sensor module 4 is coupled to the transmissive surface of the dichroic mirror 3;

[0009] The input coupling module 1 is used to transmit the signal light and the first monitoring light to the input MEMS chip 2. The input MEMS chip 2 is used to transmit the signal light and the first monitoring light to the dichroic mirror 3. The dichroic mirror 3 is used to reflect the signal light to the output MEMS chip 5 and transmit the first monitoring light to the monitoring sensor module 4. The output MEMS chip 5 is used to transmit the signal light to the corresponding output port in the output coupling module 6.

[0010] The output coupling module 6 is used to transmit the second monitoring light to the output MEMS chip 5, and the output MEMS chip 5 is used to transmit the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 is used to transmit the second monitoring light to the monitoring sensor module 4;

[0011] The monitoring sensor module 4 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0012] Preferably, an input monitoring light source 7 is further included. The input coupling module 1 includes an input optical switch 11, an input wavelength division device 12, and an input collimator 13. The input monitoring light source 7 is coupled to the input end of the input optical switch 11, the output end of the input optical switch 11 is coupled to the monitoring end of the input wavelength division device 12, the signal end of the input wavelength division device 12 is used to receive the signal light, the common end of the input wavelength division device 12 is coupled to the input end of the input collimator 13, and the output end of the input collimator 13 is coupled to the input MEMS chip 2.

[0013] The input monitoring light source 7 is used to emit the first monitoring light, the input optical switch 11 is used to transmit the first monitoring light to the input wavelength division device 12, the input wavelength division device 12 is used to transmit the signal light and the first monitoring light to the input collimator 13, and the input collimator 13 is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip 2.

[0014] Preferably, an output monitoring light source 8 is further included. The output coupling module 6 includes an output optical switch 61, an output wavelength division device 62, and an output collimator 63. The output monitoring light source 8 is coupled to the input end of the output optical switch 61. The output end of the output optical switch 61 is coupled to the monitoring end of the output wavelength division device 62. The signal end of the output wavelength division device 62 is used to output the signal light. The common end of the output wavelength division device 62 is coupled to the output end of the output collimator 63. The input end of the output collimator 63 is coupled to the output MEMS chip 5.

[0015] The output monitoring light source 8 is used to emit the second monitoring light, the output optical switch 61 is used to transmit the second monitoring light to the output wavelength division device 62, the output wavelength division device 62 is used to transmit the second monitoring light to the output collimator 63, and the output collimator 63 is used to transmit the second monitoring light to the output MEMS chip 5.

[0016] Preferably, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44, and a control unit 45; the first beam alignment screen 41 is used to receive the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 is used to capture the spot position of the first monitoring light on the first beam alignment screen 41;

[0017] The second beam alignment screen 42 is used to receive the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 is used to acquire the spot position of the second monitoring light on the second beam alignment screen 42;

[0018] The first beam alignment screen 41 is preset with an ideal position of the first monitoring light spot, and the second beam alignment screen 42 is preset with an ideal position of the second monitoring light spot;

[0019] The control unit 45 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the position of the light spot on the first light beam alignment screen 41 and the position of the light spot on the second light beam alignment screen 42, until the position of the light spot on the first light beam alignment screen 41 falls at the ideal position of the light spot of the first monitoring light, and the position of the light spot on the second light beam alignment screen 42 falls at the ideal position of the light spot of the second monitoring light.

[0020] Preferably, the first beam alignment screen 41 and the input MEMS chip 2 are mirror-symmetrical with respect to the dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41;

[0021] The second beam alignment screen 42 and the output MEMS chip 5 are mirror-symmetrical about the dichroic mirror 3 , so that the image of each rotating mirror in the output MEMS chip 5 in the dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42 .

[0022] Preferably, the first monitoring light and the second monitoring light are both infrared light.

[0023] In a second aspect, a monitoring method for an OCS array optical switch is provided. The monitoring method is applicable to the OCS array optical switch according to the first aspect, comprising:

[0024] The input coupling module 1 transmits the signal light and the first monitoring light to the input MEMS chip 2. The input MEMS chip 2 transmits the signal light and the first monitoring light to the dichroic mirror 3. The dichroic mirror 3 reflects the signal light to the output MEMS chip 5 and transmits the first monitoring light to the monitoring sensor module 4. The output MEMS chip 5 transmits the signal light to the corresponding output port in the output coupling module 6.

[0025] The output coupling module 6 transmits the second monitoring light to the output MEMS chip 5, the output MEMS chip 5 transmits the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 transmits the second monitoring light to the monitoring sensor module 4;

[0026] The monitoring sensor module 4 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0027] Preferably, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44 and a control unit 45; the monitoring method further includes:

[0028] The first beam alignment screen 41 receives the first monitoring light from the dichroic mirror 3 , and the first image acquisition unit 43 acquires the spot position of the first monitoring light on the first beam alignment screen 41 ;

[0029] The second beam alignment screen 42 receives the second monitoring light from the dichroic mirror 3 , and the second image acquisition unit 44 acquires the spot position of the second monitoring light on the second beam alignment screen 42 ;

[0030] The ideal position of the light spot of the first monitoring light is preset on the first light beam alignment screen 41, and the ideal position of the light spot of the second monitoring light is preset on the second light beam alignment screen 42;

[0031] The control unit 45 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the position of the light spot on the first light beam alignment screen 41 and the position of the light spot on the second light beam alignment screen 42, until the position of the light spot on the first light beam alignment screen 41 falls at the ideal position of the light spot of the first monitoring light and the position of the light spot on the second light beam alignment screen 42 falls at the ideal position of the light spot of the second monitoring light.

[0032] Preferably, the preset ideal position of the first monitoring light spot on the first light beam alignment screen 41 includes:

[0033] receiving the first monitoring light and the signal light through a first channel, and monitoring the insertion loss of the first channel;

[0034] When the insertion loss of the first channel is minimum, the spot position of the first monitoring light of the first light beam aligned with the screen 41 recorded by the first image acquisition unit 43 is the ideal position of the spot of the first monitoring light corresponding to the first channel.

[0035] Preferably, the monitoring method further includes: the control unit 45 pre-processing the spot position of the first monitoring light on the first light beam alignment screen 41, specifically including:

[0036] Obtaining grayscale values ​​ρ(x, y) of all pixel points at the position of the light spot of the first monitoring light on the first beam alignment screen 41, where x and y are the coordinates of the pixel points in the two-dimensional plane;

[0037] Traverse all the pixels at the spot position, multiply the horizontal coordinate x of each pixel by the grayscale value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the x-center coordinate;

[0038] Traverse all the pixels at the spot position, multiply the vertical coordinate y of each pixel by the grayscale value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to obtain the pixel product result, and accumulate the pixel product results corresponding to all pixels to obtain the numerator value of the y center of gravity coordinate;

[0039] Traverse all the pixels at the spot position, multiply the grayscale value ρ(x, y) of each pixel by the area of ​​the unit pixel dσ and add them up to get the denominator value;

[0040] Divide the numerator of the x-center coordinate by the denominator to get the horizontal coordinate x of the center of gravity of the spot. 重心 ; Divide the numerator of the y-center coordinate by the denominator to obtain the horizontal coordinate y of the center of gravity of the light spot 重心 , to obtain the coordinates of the center of gravity of the spot (x 重心 ,y 重心 ).

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The present invention couples the signal light and the first monitoring light through the input coupling module 1 and transmits them to the input MEMS chip 2. The input MEMS chip 2 then transmits the coupled light to the dichroic mirror 3. The dichroic mirror 3 separates the two beams of light, and the first monitoring light is transmitted to the monitoring sensor module 4, and the signal light is transmitted to the output port. Similarly, the second monitoring light is also transmitted to the monitoring sensor module 4. In the monitoring sensor module 4, image recognition and algorithm analysis are used to determine whether the light spots of the first monitoring light and the second monitoring light fall at the ideal position. If it is found that they are not at the ideal position during the monitoring process, the rotating mirror can be controlled by adjusting the voltage value of the corresponding MEMS chip so that the monitoring light falls at the optimal point. At this time, it means that the rotation angle of the rotating mirror can just make the light incident from the specified channel be emitted from the specified output port, achieving the purpose of optical switching, thereby realizing the monitoring and correction of the optical path, and can play a role in real-time monitoring of the equipment operation, avoiding the problem of performance degradation of the OCS system due to the deflection of the rotating mirror in the MEMS chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 1 is a schematic structural diagram of an MxN array optical switch provided by an embodiment of the present invention;

[0045] Figure 2 This is a schematic structural diagram of an OCS array optical switch provided by an embodiment of the present invention;

[0046] Figure 3 is a structural diagram of an input coupling module provided by an embodiment of the present invention;

[0047] Figure 4 This is a schematic diagram of the specific structure of an input coupling module provided by an embodiment of the present invention;

[0048] Figure 5 1 is a schematic structural diagram of an output coupling module provided by an embodiment of the present invention;

[0049] Figure 6 This is a schematic diagram of the specific structure of an output coupling module provided by an embodiment of the present invention;

[0050] Figure 7 1 is a schematic structural diagram of a monitoring sensor module provided by an embodiment of the present invention;

[0051] Figure 8 This is a structural schematic diagram of a beam alignment screen provided by an embodiment of the present invention;

[0052] Figure 9 1 is a structural diagram of an image acquisition unit provided by an embodiment of the present invention;

[0053] Figure 10 The present invention provides a flow chart of a method for monitoring an OCS array optical switch.

[0054] Throughout the drawings, like reference numerals denote like structures, wherein:

[0055] Input coupling module 1, input optical switch 11, input wavelength division device 12, input collimator 13, input MEMS chip 2, dichroic mirror 3, monitoring sensor module 4, first beam alignment screen 41, second beam alignment screen 42, first image acquisition unit 43, second image acquisition unit 44, control unit 45, output MEMS chip 5, output coupling module 6, output optical switch 61, output wavelength division device 62, output collimator 63, input monitoring light source 7, output monitoring light source 8. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0057] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as meaning open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0058] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "multiple" means two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the description purposes of the same type of individuals, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0059] When describing some embodiments, the expressions “coupled”, “coupled” and “connected” and their derivatives may be used. For example, when describing some embodiments, the term “connected” may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term “coupled” may be used to indicate that two or more components are in direct physical or electrical contact. However, the term “connected” or “coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other, such as “optical coupling”, “wireless connection”, etc. The embodiments disclosed herein are not necessarily limited to the contents of the present invention.

[0060] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0061] Example 1:

[0062] Before describing this embodiment in detail, an MxN optical switch is first introduced. In one embodiment, Figure 1 As shown, it includes M input ports and N output ports, and a MEMS chip is provided inside. There are multiple rotating mirrors in the MEMS chip, and the rotation angle of each rotating mirror can be controlled separately. By controlling the rotation angle of the rotating mirror of the MEMS chip, it is possible to output the optical signal input from any input port from any output port. With the increase in the dimension of the array optical switch OCS (currently there are several hundred dimensions), the integration of MEMS chips is very high. Among them, the spacing between each rotating mirror is very small. A slight displacement in the entire system may cause a sharp degradation of performance such as channel insertion loss. Therefore, it becomes very difficult to achieve accurate channel switching, but it is also very important. In addition, during operation, the rotating mirror may drift due to factors such as charge accumulation, or changes in environmental factors such as vibration may cause the rotation angle of the rotating mirror in the MEMS chip to change slightly, resulting in degradation of system performance.

[0063] In order to solve the above problems, an OCS array optical switch is proposed in this embodiment. Figure 2 As shown, it includes an input coupling module 1, an input MEMS chip 2, a dichroic mirror 3, a monitoring sensor module 4, an output MEMS chip 5 and an output coupling module 6; the input coupling module 1, the input MEMS chip 2, the reflective surface of the dichroic mirror 3, the output MEMS chip 5 and the output coupling module 6 are coupled in sequence along the optical path, and the monitoring sensor module 4 is coupled with the transmission surface of the dichroic mirror 3; the input coupling module 1 is used to transmit the signal light and the first monitoring light to the input MEMS chip 2, the input MEMS chip 2 is used to transmit the signal light and the first monitoring light to the dichroic mirror 3, and the dichroic mirror 3 is used to reflect the signal light to the output MEMS chip 5, and The first monitoring light is transmitted to the monitoring sensor module 4; the output MEMS chip 5 is used to transmit the signal light to the corresponding output port in the output coupling module 6; the output coupling module 6 is used to transmit the second monitoring light to the output MEMS chip 5, and the output MEMS chip 5 is used to transmit the second monitoring light to the dichroic mirror 3, and the dichroic mirror 3 is used to transmit the second monitoring light to the monitoring sensor module 4; the monitoring sensor module 4 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0064] Among them, the input coupling module 1 is used to couple the received signal light and the first monitoring light into a beam of light, and the output coupling module 6 receives the second monitoring light; the first monitoring light and the second monitoring light are both infrared light, and the dichroic mirror 3 can reflect the signal light and completely transmit the first monitoring light and the second monitoring light to the monitoring sensor module 4.

[0065] The first monitoring light enters the input coupling module 1 along with the signal light, passes through the input MEMS chip 2, and is then transmitted by the dichroic mirror 3 to the monitoring sensor module 4. By analyzing the spot position of the first monitoring light, the monitoring sensor module 4 can determine the accuracy of the input MEMS chip 2's optical path adjustment. For example, if the spot position deviates from the expected position, it indicates that the angle of the transfer mirror in the input MEMS chip 2 may be off. The monitoring sensor module 4 will then send a command to adjust the angle of the transfer mirror in the input MEMS chip 2. The second monitoring light is transmitted from the output coupling module 6 through the output MEMS chip 5 to the dichroic mirror 3, and then transmitted by the dichroic mirror 3 to the monitoring sensor module 4. Similarly, based on the spot position of the second monitoring light, the monitoring sensor module 4 determines whether the output MEMS chip 5 has accurately adjusted the optical path, and then adjusts the angle of the transfer mirror in the output MEMS chip 5. By precisely controlling the driving voltage of the MEMS chip, the transfer mirror in the MEMS chip rotates, enabling a beam incident from any input port to be switched to exit from any output port, achieving M-dimensional optical path switching. Through this feedback adjustment mechanism based on monitoring the position of the light spot, the entire optical switch system can accurately adjust the optical path in real time to ensure that the signal light is accurately transmitted to the target output port.

[0066] For example, the first monitoring light and the signal light input from the input port M are transmitted to the monitoring sensor module 4, and the signal light is reflected to the output MEMS chip 5 and output from the output port N on the output coupling module 6; the second monitoring light input from the output port N is transmitted to the monitoring sensor module 4 through the output MEMS chip 5 and the dichroic mirror 3. The ideal spot position of the first monitoring light and the ideal spot position of the second monitoring light corresponding to the channel MN (i.e., the input light enters from the M port and the output light exits from the N port) are preset in the monitoring sensor module 4. At this time, the spot position of the first monitoring light is compared with the spot position of the first monitoring light. By comparing the ideal spot position of the light, the rotation angle of the rotating mirror in the input MEMS chip 2 is adjusted until the spot position of the first monitoring light reaches the ideal spot position of the first monitoring light. Similarly, the rotation angle of the rotating mirror in the output MEMS chip 5 is adjusted until the spot position of the second monitoring light reaches the ideal spot position of the second monitoring light. In this way, for the MN channel, the signal light transmitted from the input end M can be ideally output from the output end N, achieving the purpose of real-time monitoring of the MN channel in the optical switching switch. The same can be achieved for monitoring any other channels. The specific details are not explained in detail in this embodiment. How to obtain the ideal spot positions of the first monitoring light and the second monitoring light corresponding to each channel will be described in detail below.

[0067] In order to couple the signal light with the first monitoring light, for multiple input ends, in one embodiment, as shown in FIG. Figure 3 As shown, the OCS array optical switch further includes an input monitoring light source 7. The input coupling module 1 includes an input optical switch 11, an input wavelength division device 12, and an input collimator 13. The input monitoring light source 7 is coupled to the input end of the input optical switch 11, and the output end of the input optical switch 11 is coupled to the monitoring end of the input wavelength division device 12. The signal end of the input wavelength division device 12 is used to receive the signal light. The common end of the input wavelength division device 12 is coupled to the input end of the input collimator 13, and the output end of the input collimator 13 is coupled to the input MEMS chip 2. The input monitoring light source 7 is used to emit the first monitoring light. The input optical switch 11 is used to transmit the first monitoring light to the input wavelength division device 12. The input wavelength division device 12 is used to transmit the signal light and the first monitoring light to the input collimator 13. The input collimator 13 is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip 2.

[0068] In one embodiment, Figure 4As shown, the input wavelength division device 12 is typically composed of a tapered beam splitter used in communications, which achieves energy splitting by fused tapering of two optical fibers to generate optical exchange. Alternatively, a prism-based splitter device can be used, coated with a spectroscopic coating to achieve different splitting ratios. In this example, devices with 3:97 and 1:99 splitting ratios are used. The light obtained by combining the first monitoring light and the signal light comprises 97% signal light and 3% first monitoring light.

[0069] In one embodiment, the input optical switch 11 is a 1xM optical switch, serving as an optical switching device, with a single COM port as input and M output ports. This allows light to enter through the COM port and exit through any of the M output ports. It can also be used in reverse, with the M output ports serving as light inputs and the COM port serving as light outputs. The 1xM optical switch in this embodiment can utilize a MEMS optical switch, which offers significant advantages in terms of large port counts. Increasing the number of ports in a MEMS optical switch essentially only increases the cost of the optical fiber, while the cost of the optical chip remains largely the same.

[0070] In one embodiment, the input collimator 13 includes M collimating lens units, which can ensure that the M light beams can be accurately incident on the input MEMS chip 2 after passing through the input collimator 13 .

[0071] In the input coupling module 1, the input monitoring light source 7 first generates a first monitoring light beam, which is received by the input optical switch 11 and transmitted to the monitoring terminal of the input wavelength division device 12. Simultaneously, external signal light enters the signal terminal of the input wavelength division device 12. The input wavelength division device 12 couples the signal light and the first monitoring light beam, transmitting the coupled optical signal to its common terminal, which then transmits the coupled optical signal to the input collimator 13. The input collimator 13 collimates the coupled optical signal, converting it into parallel light, and then transmits the collimated signal light and the first monitoring light beam to the input MEMS chip 2.

[0072] The input monitoring coupling module 1 ensures the accuracy of the rotation angle of the rotating mirror in the input MEMS chip 2, but the light beam cannot be collimated and emitted into the collimated optical fiber of the target output port after being reflected by the output MEMS chip 5. In this case, the output coupling module 6 is required. Figure 5 and Figure 6As shown, the OCS array optical switch further includes an output monitoring light source 8. The output coupling module 6 includes an output optical switch 61, an output wavelength division device 62, and an output collimator 63. The output monitoring light source 8 is coupled to the input end of the output optical switch 61, and the output end of the output optical switch 61 is coupled to the monitoring end of the output wavelength division device 62. The signal end of the output wavelength division device 62 is used to output the signal light. The common end of the output wavelength division device 62 is coupled to the output end of the output collimator 63, and the input end of the output collimator 63 is coupled to the output MEMS chip 5. The output monitoring light source 8 is used to emit the second monitoring light. The output optical switch 61 is used to transmit the second monitoring light to the output wavelength division device 62. The output wavelength division device 62 is used to transmit the second monitoring light to the output collimator 63. The output collimator 63 is used to transmit the second monitoring light to the output MEMS chip 5.

[0073] In one embodiment, the input monitoring light source 7 and the output monitoring light source 8 both use laser diodes to provide high-brightness monochromatic light, with common wavelengths including 850 nm, 980 nm, and 1064 nm.

[0074] Similarly, the output coupling module 6 differs from the input coupling module 1 in that it includes N output wavelength division devices 62 and N output collimators 63. The monitoring terminals of the output wavelength division devices 62 receive the second monitoring light, while the common terminals of the output wavelength division devices 62 receive the signal light from the output MEMS chip 5 and output it through the signal terminals of the output wavelength division devices 62. The common terminals of the output wavelength division devices 62 are also used to transmit the second monitoring light received at their monitoring terminals to the output MEMS chip 5. The operating principles of the output optical switch 61, the output wavelength division devices 62, and the output collimators 63 are described in the above embodiment and will not be further elaborated here.

[0075] In this embodiment, only one monitoring light source is required at both the input and output ends, eliminating the need for an M-dimensional light source array, significantly reducing costs. Furthermore, as the dimensionality increases, only the number of channels of the input optical switch 11 or the output optical switch 61 needs to be increased, eliminating the need for additional light sources. Multiple light sources and optical switches can also be used to increase the number of channels monitored simultaneously, achieving a balance between efficiency and cost. Furthermore, the monitoring light and the signal light in this embodiment are completely co-routed, eliminating the need for additional monitoring light path debugging and achieving higher accuracy. Furthermore, the first monitoring light is already coupled with the signal light before entering the input collimator 13, eliminating the need for additional optical components in the optical path between the input wavelength division device 12 and the input collimator 13, thus reducing the working distance of the input collimator 13.

[0076] In order to analyze the spot positions of the first monitoring light and the second monitoring light, in one embodiment, Figure 7 As shown, the monitoring sensor module 4 includes a first beam alignment screen 41, a second beam alignment screen 42, a first image acquisition unit 43, a second image acquisition unit 44, and a control unit 45. The first beam alignment screen 41 is used to receive the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 is used to acquire the spot position of the first monitoring light on the first beam alignment screen 41. The second beam alignment screen 42 is used to receive the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 is used to acquire the spot position of the second monitoring light on the second beam alignment screen 42. The first beam alignment screen 41 is preset with an ideal spot position of the first monitoring light, and the second beam alignment screen 42 is preset with an ideal spot position of the second monitoring light. The control unit 45 is used to adjust the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot positions on the first beam alignment screen 41 and the second beam alignment screen 42, respectively, until the spot position on the first beam alignment screen 41 falls within the ideal spot position of the first monitoring light, and the spot position on the second beam alignment screen 42 falls within the ideal spot position of the second monitoring light.

[0077] The control unit 45 also needs to be connected to the control ends of the input MEMS chip 2 and the output MEMS chip 5 (not shown in the figure), and controls the driving voltages of the input MEMS chip 2 and the output MEMS chip 5 to control the rotation of each mirror.

[0078] In one embodiment, the first beam alignment screen 41 and the input MEMS chip 2 are mirror-symmetrical about the dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41; the second beam alignment screen 42 and the output MEMS chip 5 are mirror-symmetrical about the dichroic mirror 3, so that the image of each rotating mirror in the output MEMS chip 5 in the dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42.

[0079] When the first monitoring light is transmitted through the dichroic mirror 3, it will illuminate the first light beam alignment screen 41. Figure 8As shown, the first beam alignment screen 41 is preset with the ideal position of the first monitor light spot for each channel (i.e., the position of the cross; each cross position corresponds to the ideal position of the first monitor light in a particular channel). This ideal position is the position the system expects the first monitor light for that channel to reach during normal operation and serves as a reference for determining whether the first monitor light is on the correct transmission path. Similar to the first beam alignment screen 41, the second beam alignment screen 42 receives the second monitor light transmitted from the dichroic mirror 3 and provides a display surface for the second monitor light spot. The second beam alignment screen 42 also has the ideal position of the second monitor light spot preset on it. This position is the position the system expects the second monitor light for that channel to appear during normal operation and is used to measure the accuracy of the second monitor light transmission.

[0080] In one embodiment, Figure 9 As shown, the main task of the first image acquisition unit 43 is to capture the position of the light spot formed by the first monitoring light on the first beam alignment screen 41. By using image acquisition technology, the actual position information of the light spot on the first beam alignment screen 41 can be accurately captured, providing the system with specific data about the current position of the first monitoring light, allowing the system to determine whether the first monitoring light has deviated. The second image acquisition unit 44 is responsible for capturing the position of the light spot of the second monitoring light on the second beam alignment screen 42. Through its image acquisition function, it can convert the actual position information of the light spot of the second monitoring light into data that can be processed by the system, providing a basis for the system to determine the transmission status of the second monitoring light. In one embodiment, both the first image acquisition unit 43 and the second image acquisition unit 44 can be cameras.

[0081] The control unit 45 is responsible for adjusting the rotation angles of the rotating mirrors in the input MEMS chip 2 and the output MEMS chip 5 according to the light spot position information provided by the first image acquisition unit 43 and the second image acquisition unit 44 .

[0082] When the entire system is in operation, the first monitoring light and the second monitoring light will respectively reach the corresponding beam alignment screen through their respective paths. The first image acquisition unit 43 and the second image acquisition unit 44 will continuously monitor and collect their spot position information on their respective beam alignment screens. The control unit 45 compares and analyzes the collected information with the preset ideal position. When deviations are found, the control unit 45 fine-tunes the optical path by adjusting the rotation angles of the rotating mirrors in the input MEMS chip 2 and the output MEMS chip 5. The feedback and adjustment mechanism will continue to cycle until the spot positions of the first monitoring light and the second monitoring light accurately fall at their respective ideal positions, ensuring that the signal light can be accurately transmitted to the corresponding output port.

[0083] Because the input monitoring light source 7 and the output monitoring light source 8 used in this embodiment are single light sources, there is only one light spot on each alignment screen, making it very easy to identify and locate. If an array light source is used, light spots are prone to overlap, resulting in misjudgment of light spot positions. This embodiment can avoid this situation.

[0084] In this embodiment, the input coupling module 1 couples the signal light and the first monitoring light and transmits them to the input MEMS chip 2. The input MEMS chip 2 then transmits the coupled light to the dichroic mirror 3. The dichroic mirror 3 separates the two light beams, with the first monitoring light transmitted to the monitoring sensor module 4 and the signal light transmitted to the output port. Similarly, the second monitoring light is also transmitted to the monitoring sensor module 4. In the monitoring sensor module 4, image recognition and algorithm analysis are used to determine whether the light spots of the first monitoring light and the second monitoring light fall at the ideal position. If it is found that they are not at the ideal position during the monitoring process, the rotating mirror can be controlled by adjusting the voltage value of the corresponding MEMS chip to make the monitoring light fall at the optimal point. At this time, the rotating mirror angle just allows the light incident from the designated channel to be emitted from the designated output port, achieving the purpose of optical switching, thereby realizing optical path monitoring and correction, and can play a role in real-time monitoring of equipment operation, avoiding the problem of performance degradation of the OCS system due to deflection of the rotating mirror in the MEMS chip.

[0085] Example 2:

[0086] In order to further illustrate the OCS array optical switch proposed in Example 1, a monitoring method for the OCS array optical switch is proposed in this embodiment. Figure 10 As shown, including:

[0087] Step 101: The input coupling module 1 transmits the signal light and the first monitoring light to the input MEMS chip 2. The input MEMS chip 2 transmits the signal light and the first monitoring light to the dichroic mirror 3. The dichroic mirror 3 reflects the signal light to the output MEMS chip 5 and transmits the first monitoring light to the monitoring sensor module 4. The output MEMS chip 5 transmits the signal light to the corresponding output port of the output coupling module 6.

[0088] Among them, reference Figure 3 and Figure 4 The input monitoring light source 7 emits the first monitoring light, the input optical switch 11 transmits the first monitoring light to the input wavelength division device 12, the input wavelength division device 12 transmits the signal light and the first monitoring light to the input collimator 13, and the input collimator 13 collimates the signal light and the first monitoring light and transmits them to the input MEMS chip 2.

[0089] Step 102 : the output coupling module 6 transmits the second monitoring light to the output MEMS chip 5 , the output MEMS chip 5 transmits the second monitoring light to the dichroic mirror 3 , and the dichroic mirror 3 transmits the second monitoring light to the monitoring sensor module 4 .

[0090] Among them, reference Figure 5 and Figure 6 The output monitoring light source 8 emits the second monitoring light, the output optical switch 61 transmits the second monitoring light to the output wavelength division device 62, the output wavelength division device 62 transmits the second monitoring light to the output collimator 63, and the output collimator 63 transmits the second monitoring light to the output MEMS chip 5.

[0091] Step 103: The monitoring sensor module 4 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

[0092] Among them, reference Figure 7 The first beam alignment screen 41 receives the first monitoring light from the dichroic mirror 3, and the first image acquisition unit 43 acquires the spot position of the first monitoring light on the first beam alignment screen 41; the second beam alignment screen 42 receives the second monitoring light from the dichroic mirror 3, and the second image acquisition unit 44 acquires the spot position of the second monitoring light on the second beam alignment screen 42; an ideal position of the spot of the first monitoring light is preset on the first beam alignment screen 41, and an ideal position of the spot of the second monitoring light is preset on the second beam alignment screen 42; the control unit 45 adjusts the rotation angle of the input MEMS chip 2 and the rotation angle of the output MEMS chip 5 according to the spot position on the first beam alignment screen 41 and the spot position on the second beam alignment screen 42, respectively, until the spot position on the first beam alignment screen 41 falls at the ideal position of the spot of the first monitoring light, and the spot position on the second beam alignment screen 42 falls at the ideal position of the spot of the second monitoring light.

[0093] In one embodiment, presetting the ideal position of the first monitoring light spot on the first light beam alignment screen 41 includes: receiving the first monitoring light and the signal light through a first channel (the first here has no special meaning and can be any one), and monitoring the insertion loss of the first channel; when the insertion loss of the first channel is a minimum, recording the position of the first monitoring light spot on the first light beam alignment screen 41 through the first image acquisition unit 43 as the ideal position of the first monitoring light spot corresponding to the first channel.

[0094] Among them, reference Figure 8 , the ideal position of each light spot on the first beam alignment screen 41 and the second beam alignment screen 42 needs to be known (such as Figure 8 The monitoring method further includes: placing the first beam alignment screen 41 at a position that is mirror-symmetrical to the input MEMS chip 2 with respect to the dichroic mirror 3, so that the image of each rotating mirror in the input MEMS chip 2 in the dichroic mirror 3 coincides with the center of each cross on the first beam alignment screen 41; and placing the second beam alignment screen 42 at a position that is mirror-symmetrical to the output MEMS chip 5 with respect to the dichroic mirror 3, so that the image of each rotating mirror in the output MEMS chip 5 in the dichroic mirror 3 coincides with the center of each cross on the second beam alignment screen 42.

[0095] Theoretically, the spacing and size of the crosses on the beam alignment screen only need to be consistent with the size of the array on the MEMS chip. However, since light incident on the dichroic mirror 3 at different angles will produce a small offset when transmitted to the beam alignment screen, in one embodiment, the offset can be calculated based on the refractive index, thickness and incident angle of the dichroic mirror 3 to correct the ideal position of the beam alignment screen. At the same time, due to tolerances generated during the installation and debugging process, the ideal position on the beam alignment screen and the mirror image position may also be offset. The ideal position of the monitoring light spot can be calibrated by designing an optical power feedback system. That is, by monitoring the insertion loss of different channels of the OCS and finding the minimum value of the insertion loss, it means that the mirror has rotated to the optimal angle. At this time, the monitoring light spot position on the beam alignment screen recorded by the camera is the ideal alignment position of the channel. The calibrated ideal light spot position can correct the various errors mentioned above, and the final ideal position is recorded.

[0096] In one embodiment, the light spots imaged by the first monitoring light and the second monitoring light on the first beam alignment screen 41 and the second beam alignment screen 42, respectively, are generally irregular in shape and unevenly distributed in brightness, while the ideal imaging position is a fixed point. Therefore, it is necessary to convert the irregular light spots into specific points through an image processing algorithm. In one embodiment, the monitoring method further comprises: the control unit 45 pre-processes the light spot position of the first monitoring light on the first beam alignment screen 41, specifically comprising: obtaining the grayscale values ​​ρ(x, y) of all pixel points of the light spot of the first monitoring light on the first beam alignment screen 41 at the first beam alignment screen 41, where x and y are the coordinates of the pixel point in the two-dimensional plane; multiplying the horizontal coordinate x of each pixel point by the grayscale value ρ(x, y) of the pixel point, and then multiplying by the area of ​​the unit pixel point. dσ, get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the x-center coordinate; multiply the vertical coordinate y of each pixel by the grayscale value ρ(x,y) of the pixel, and then multiply it by the area of ​​the unit pixel dσ to get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the y-center coordinate; multiply the grayscale value ρ(x,y) of each pixel by the area of ​​the unit pixel dσ and add them to get the denominator value; divide the numerator value of the x-center coordinate by the denominator value to get the horizontal coordinate x of the center of gravity of the light spot 重心 ; Divide the numerator of the y-center coordinate by the denominator to obtain the horizontal coordinate y of the center of gravity of the light spot 重心 , to obtain the coordinates of the center of gravity of the spot (x 重心 ,y 重心 ).

[0097] Among them, the coordinates of the center of gravity of the spot (x 重心 ,y 重心 ) is expressed as:

[0098]

[0099] After obtaining the center of gravity of the light spot, the center of gravity can be compared with the ideal position point to adjust the rotation angles of the rotating mirrors in the input MEMS chip 2 and the output MEMS chip 5 respectively to eliminate the deviation of their respective rotating mirrors.

[0100] The specific structure of the OCS array optical switch will not be described in detail in this embodiment.

[0101] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An OCS array optical switch, characterized in that: It includes an input coupling module (1), an input MEMS chip (2), a color separation mirror (3), a monitoring sensor module (4), an output MEMS chip (5), and an output coupling module (6); The input coupling module (1), the input MEMS chip (2), the reflective surface of the dichroic mirror (3), the output MEMS chip (5), and the output coupling module (6) are coupled in sequence along the optical path, and the monitoring sensor module (4) is coupled to the transmission surface of the dichroic mirror (3); The input coupling module (1) is used to transmit the signal light and the first monitoring light to the input MEMS chip (2); the input MEMS chip (2) is used to transmit the signal light and the first monitoring light to the dichroic mirror (3); the dichroic mirror (3) is used to reflect the signal light to the output MEMS chip (5) and transmit the first monitoring light to the monitoring sensor module (4); the output MEMS chip (5) is used to transmit the signal light to the corresponding output port in the output coupling module (6); The output coupling module (6) is used to transmit the second monitoring light to the output MEMS chip (5), the output MEMS chip (5) is used to transmit the second monitoring light to the dichroic mirror (3), and the dichroic mirror (3) is used to transmit the second monitoring light to the monitoring sensor module (4); The monitoring sensor module (4) is used to adjust the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port; The monitoring sensor module (4) comprises a first light beam alignment screen (41), a second light beam alignment screen (42), a first image acquisition unit (43), a second image acquisition unit (44) and a control unit (45); the first light beam alignment screen (41) is used to receive the first monitoring light from the dichroic mirror (3), and the first image acquisition unit (43) is used to acquire the spot position of the first monitoring light on the first light beam alignment screen (41); The second light beam alignment screen (42) is used to receive the second monitoring light from the dichroic mirror (3), and the second image acquisition unit (44) is used to acquire the spot position of the second monitoring light on the second light beam alignment screen (42); The first light beam alignment screen (41) is preset with an ideal position of the light spot of the first monitoring light, and the second light beam alignment screen (42) is preset with an ideal position of the light spot of the second monitoring light; The control unit (45) is used to adjust the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) according to the light spot position on the first light beam alignment screen (41) and the light spot position on the second light beam alignment screen (42), respectively, until the light spot position on the first light beam alignment screen (41) falls on the ideal position of the light spot of the first monitoring light, and the light spot position on the second light beam alignment screen (42) falls on the ideal position of the light spot of the second monitoring light.

2. The OCS array optical switch according to claim 1, wherein: It also includes an input monitoring light source (7), the input coupling module (1) includes an input optical switch (11), an input wavelength division device (12) and an input collimator (13), the input monitoring light source (7) is coupled to the input end of the input optical switch (11), the output end of the input optical switch (11) is coupled to the monitoring end of the input wavelength division device (12), the signal end of the input wavelength division device (12) is used to receive the signal light, the common end of the input wavelength division device (12) is coupled to the input end of the input collimator (13), and the output end of the input collimator (13) is coupled to the input MEMS chip (2); The input monitoring light source (7) is used to emit the first monitoring light, the input optical switch (11) is used to transmit the first monitoring light to the input wavelength division device (12), the input wavelength division device (12) is used to transmit the signal light and the first monitoring light to the input collimator (13), and the input collimator (13) is used to collimate the signal light and the first monitoring light and then transmit them to the input MEMS chip (2).

3. The OCS array optical switch according to claim 1, wherein: It also includes an output monitoring light source (8), the output coupling module (6) includes an output optical switch (61), an output wavelength division device (62) and an output collimator (63), the output monitoring light source (8) is coupled to the input end of the output optical switch (61), the output end of the output optical switch (61) is coupled to the monitoring end of the output wavelength division device (62), the signal end of the output wavelength division device (62) is used to output the signal light, the common end of the output wavelength division device (62) is coupled to the output end of the output collimator (63), and the input end of the output collimator (63) is coupled to the output MEMS chip (5); The output monitoring light source (8) is used to emit the second monitoring light, the output optical switch (61) is used to transmit the second monitoring light to the output wavelength division device (62), the output wavelength division device (62) is used to transmit the second monitoring light to the output collimator (63), and the output collimator (63) is used to transmit the second monitoring light to the output MEMS chip (5).

4. The OCS array optical switch according to claim 1, wherein: The first beam alignment screen (41) and the input MEMS chip (2) are mirror-symmetrical about the dichroic mirror (3), so that the image of each rotating mirror in the input MEMS chip (2) in the dichroic mirror (3) coincides with the center of each cross on the first beam alignment screen (41); The second light beam alignment screen (42) and the output MEMS chip (5) are mirror-symmetrical about the dichroic mirror (3), so that the image of each rotating mirror in the output MEMS chip (5) in the dichroic mirror (3) coincides with the center of each cross on the second light beam alignment screen (42).

5. The OCS array optical switch according to claim 1, wherein: The first monitoring light and the second monitoring light are both infrared light.

6. A method for monitoring an OCS array optical switch, characterized in that: The monitoring method is applicable to the OCS array optical switch according to any one of claims 1 to 5, comprising: The input coupling module (1) transmits the signal light and the first monitoring light to the input MEMS chip (2); the input MEMS chip (2) transmits the signal light and the first monitoring light to the dichroic mirror (3); the dichroic mirror (3) reflects the signal light to the output MEMS chip (5) and transmits the first monitoring light to the monitoring sensor module (4); the output MEMS chip (5) transmits the signal light to the corresponding output port in the output coupling module (6); The output coupling module (6) transmits the second monitoring light to the output MEMS chip (5), the output MEMS chip (5) transmits the second monitoring light to the dichroic mirror (3), and the dichroic mirror (3) transmits the second monitoring light to the monitoring sensor module (4); The monitoring sensor module (4) adjusts the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) according to the spot position of the first monitoring light and the spot position of the second monitoring light, so that the signal light is transmitted to the corresponding output port.

7. The method for monitoring an OCS array optical switch according to claim 6, wherein: The monitoring sensor module (4) comprises a first light beam alignment screen (41), a second light beam alignment screen (42), a first image acquisition unit (43), a second image acquisition unit (44) and a control unit (45); the monitoring method further comprises: The first light beam alignment screen (41) receives the first monitoring light from the dichroic mirror (3), and the first image acquisition unit (43) acquires the spot position of the first monitoring light on the first light beam alignment screen (41); The second light beam alignment screen (42) receives the second monitoring light from the dichroic mirror (3), and the second image acquisition unit (44) acquires the spot position of the second monitoring light on the second light beam alignment screen (42); Presetting an ideal position of the light spot of the first monitoring light on the first light beam alignment screen (41), and presetting an ideal position of the light spot of the second monitoring light on the second light beam alignment screen (42); The control unit (45) adjusts the rotation angle of the input MEMS chip (2) and the rotation angle of the output MEMS chip (5) according to the light spot position on the first light beam alignment screen (41) and the light spot position on the second light beam alignment screen (42), respectively, until the light spot position on the first light beam alignment screen (41) falls on the ideal position of the light spot of the first monitoring light, and the light spot position on the second light beam alignment screen (42) falls on the ideal position of the light spot of the second monitoring light.

8. The method for monitoring an OCS array optical switch according to claim 7, wherein: The step of presetting the ideal position of the light spot of the first monitoring light on the first light beam alignment screen (41) comprises: receiving the first monitoring light and the signal light through a first channel, and monitoring the insertion loss of the first channel; When the insertion loss of the first channel is at a minimum value, the spot position of the first monitoring light on the first light beam alignment screen (41) recorded by the first image acquisition unit (43) is the ideal position of the spot of the first monitoring light corresponding to the first channel.

9. The method for monitoring an OCS array optical switch according to claim 7, wherein: The monitoring method further comprises: the control unit (45) pre-processing the light spot position of the first monitoring light on the first light beam alignment screen (41), specifically comprising: Obtaining the grayscale values ​​of all pixel points at the positions of the light spot of the first monitoring light on the first light beam alignment screen (41) on the first light beam alignment screen (41) , where x and y are the coordinates of the pixel point in the two-dimensional plane; The horizontal coordinate x of each pixel and the gray value of the pixel Multiply by the area of ​​the unit pixel , get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the x-center coordinate; The vertical coordinate y of each pixel and the gray value of the pixel Multiply by the area of ​​the unit pixel , get the pixel product result, and accumulate the pixel product results corresponding to all pixels to get the numerator value of the y center of gravity coordinate; The gray value of each pixel Multiply by the area of ​​the unit pixel Then add them up to get the denominator value; Divide the numerator of the x-center coordinate by the denominator to get the horizontal coordinate x of the center of gravity of the spot. 重心 ; Divide the numerator of the y-center coordinate by the denominator to obtain the horizontal coordinate y of the center of gravity of the light spot 重心 , to obtain the coordinates of the center of gravity of the light spot (x 重心 ,y 重心 ).

Images