Light-emitting diode monomer, packaging method, light-emitting diode assembly and display

Abstract

The invention relates to the technical field of semiconductors, and particularly provides a light-emitting diode monomer, a packaging method, a light-emitting diode assembly and a displayer, the light-emitting diode monomer comprises a base, a plurality of light-emitting diode chips and a plurality of brightness enhancing parts, a bonding pad is arranged in the base, a plurality of containing bowls are arranged on the base, and the bottoms of the containing bowls are communicated to the bonding pad; at least one light-emitting diode chip is arranged in each containing bowl cup, the light-emitting diode chips are electrically connected with the bonding pads, and the light-emitting diode chips in the same containing bowl cup are single in color; each containing bowl cup is internally provided with the corresponding brightness enhancing piece. According to the light-emitting diode monomer, the packaging method, the assembly and the display, the product quality is effectively improved, the brightness improvement amplitude is ensured to be high, the overall brightness is improved, and the display effect of the display is better.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a light emitting diode monomer, a packaging method, a component and a display. Background Art

[0002] Light-emitting diode (LED) is a commonly used light-emitting device, which is widely used in various displays. With the development of science and technology and the progress of society, people have higher requirements for the quality of LED monomers. LED monomers are usually equipped with convex lenses, which focus and collimate the light from the LED chip. However, in conventional LED monomers, multiple LED chips usually share the same convex lens, which makes it unable to meet the use requirements when used in high-brightness occasions such as outdoor. Summary of the invention

[0003] The light-emitting diode monomer, packaging method and display provided by the embodiments of the present invention at least solve the problem of poor quality of conventional LED monomers, effectively improve product quality, ensure a high brightness increase to improve the overall brightness, and make the display effect of the display better.

[0004] In a first aspect, the present invention provides a light-emitting diode unit, comprising a base, wherein a solder pad is arranged in the base, and a plurality of accommodating bowls are arranged on the base, and the bottoms of the accommodating bowls are connected to the solder pad; a plurality of light-emitting diode chips, each of the accommodating bowls is provided with at least one light-emitting diode chip, the light-emitting diode chip is electrically connected to the solder pad, and the light-emitting diode chips in the same accommodating bowl have a single color; and a plurality of brightness enhancement components, each of the accommodating bowls is provided with the brightness enhancement component.

[0005] In one embodiment of the present invention, the light-emitting diode chip includes a red light chip, a green light chip and a blue light chip. Along the first direction, the red light chip, the green light chip and the blue light chip are sequentially arranged in independent accommodating bowl cups, and the centers of the red light chip, the green light chip and the blue light chip are aligned with the center of the corresponding brightness enhancement component; the cup mouth shape of each of the accommodating bowl cups is set to be an ellipse, and the short axis of the ellipse is axially parallel to the first direction.

[0006] In one embodiment of the present invention, the minor axis size of the ellipse is set to 0.750mm to 0.758mm, and the major axis size is set to 1.750mm to 1.760mm; the maximum height of the brightness enhancement component outside the accommodating bowl is a first height, and the first height is set to 0.65mm to 0.75mm.

[0007] In one embodiment of the present invention, the brightness enhancement member includes a first reinforcement body, which is arranged in the accommodating bowl and covers the light-emitting diode chip; a second reinforcement body, which is connected to the first reinforcement body, and the second reinforcement body is arranged on a side of the first reinforcement body away from the light-emitting diode chip and covers the light-emitting diode chip; wherein the first reinforcement body and the second reinforcement body are both formed by dispensing, and the thixotropic index of the first reinforcement body is smaller than the thixotropic index of the second reinforcement body.

[0008] In one embodiment of the present invention, the material of the first reinforcement includes epoxy resin; the material of the second reinforcement includes epoxy resin and fumed silica; wherein the mass fraction of the fumed silica is k%, 1≤k≤3.

[0009] In one embodiment of the present invention, the bowl and cup accommodating portion includes a bowl and cup recess; a bowl and cup protrusion, wherein the bowl and cup protrusion is arranged in the bowl and cup recess; wherein the height of the bowl and cup protrusion is smaller than the depth of the bowl and cup recess; and a bowl and cup accommodating portion, wherein the bowl and cup accommodating portion is arranged in the bowl and cup protrusion, and the cup bottom of the bowl and cup accommodating portion is connected to the welding pad; wherein the inner wall of the bowl and cup accommodating portion is inclined so that the cup mouth area of ​​the bowl and cup accommodating portion gradually decreases in the direction toward the welding pad.

[0010] In a second aspect, the present invention further provides a light-emitting diode packaging method, which is applied to a light-emitting diode monomer as described in any one of the above items, including arranging at least one light-emitting diode chip in each receiving bowl cup of a base; wherein a soldering pad is arranged in the base, and a plurality of the receiving bowl cups are arranged on the base, and the bottoms of the receiving bowl cups are connected to the soldering pad; the light-emitting diode chips in the same receiving bowl cup have a single color; the light-emitting diode chip is electrically connected to the soldering pad; a brightness enhancement component is arranged in each of the receiving bowl cups; and a light-emitting diode monomer is obtained.

[0011] In one embodiment of the present invention, a brightness enhancement member is provided in each of the accommodating bowls, including providing a first reinforcement body in each of the accommodating bowls, so that the first reinforcement body covers the light-emitting diode chip; and providing a second reinforcement body on a side of each of the first reinforcement bodies away from the light-emitting diode chip, so that the second reinforcement body is connected to the first reinforcement body and covers the light-emitting diode chip; wherein the thixotropic index of the first reinforcement body is smaller than the thixotropic index of the second reinforcement body.

[0012] In one embodiment of the present invention, a second reinforcement is arranged on a side of each of the first reinforcements away from the light-emitting diode chip, so that the second reinforcement is connected to the first reinforcement and covers the light-emitting diode chip, including applying reinforcement glue on a side of each of the first reinforcements away from the light-emitting diode chip to obtain a first body to be cured; wherein the material of the reinforcement glue comprises epoxy resin and fumed silica, and the mass fraction of the fumed silica is k%, 1≤k≤3; the first body to be cured is arranged inverted to obtain an inverted second body to be cured; the second body to be cured is baked according to preset baking conditions to obtain the second reinforcement; wherein the preset baking conditions include baking temperature and baking time, the baking temperature is set to 130 to 150°C, and the baking time is set to 4 to 5 hours.

[0013] In a third aspect, the present invention further provides a light emitting diode assembly, comprising a bracket, on which a plurality of light emitting diode monomers as described in any one of the above items are arranged.

[0014] In a fourth aspect, the present invention further provides a light emitting diode display, comprising at least one light emitting diode monomer as described in any one of the above.

[0015] The above technical solution of the present invention has the following beneficial effects compared with the prior art:

[0016] The light-emitting diode monomer described in the present invention effectively improves the brightness improvement of the light-emitting diode chip in the accommodating bowl cup by arranging multiple accommodating bowl cups on the base and providing a brightness enhancement component for each accommodating bowl cup, thereby ensuring high brightness and uniformity of the monomer, and further ensuring good display effect and high quality of the corresponding display, and is particularly suitable for outdoor environments with direct sunlight. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without creative work. In the drawings:

[0018] Figure 1 It is a structural schematic diagram of an LED monomer in the prior art.

[0019] Figure 2 It is a schematic diagram of the cross-sectional structure of an LED monomer in the prior art.

[0020] Figure 3 It is a perspective structural diagram of a light emitting diode monomer in a preferred embodiment of the present invention.

[0021] Figure 4 It is a schematic diagram of the cross-sectional structure of the base in the preferred embodiment of the present invention.

[0022] Figure 5 It is a schematic structural diagram of a light emitting diode monomer in a preferred embodiment of the present invention.

[0023] Figure 6 It is a schematic diagram of the structure of accommodating bowls and cups in a preferred embodiment of the present invention.

[0024] Figure 7 It is a schematic cross-sectional structural diagram of a light emitting diode monomer in a preferred embodiment of the present invention.

[0025] Figure 8 It is a schematic cross-sectional view of a bowl and cup accommodating device in a preferred embodiment of the present invention.

[0026] Fig. 9 It is a schematic flow chart of a light emitting diode packaging method in a preferred embodiment of the present invention.

[0027] Fig.10 It is a schematic diagram of the partial structure of the light emitting diode assembly in the preferred embodiment of the present invention.

[0028] Fig.11 It is a schematic diagram of the structure of an electronic device in a preferred embodiment of the present invention.

[0029] The above drawings include the following reference numerals:

[0030] 01. bowl cup; 02. convex lens; 03. red light LED chip; 04. green light LED chip; 05. blue light LED chip; D1. first direction; D2. second direction; D3. third direction; 10. base; 11. bowl cup storage; 111. bowl cup recess; 112. bowl cup protrusion; 113. bowl cup storage part; 20. bracket; 21. solder pad; 30. light emitting diode chip; 31. red light chip; 32. green light chip; 33. blue light chip; 40. brightness enhancement member; 41. first reinforcement body; 42. second reinforcement body; 501. computing unit; 502. ROM; 503. RAM; 504. bus; 505. I / O interface; 506. input unit; 507. output unit; 508. storage unit; 509. communication unit. DETAILED DESCRIPTION

[0031] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0032] Reference Figure 1 and Figure 2 As shown, a light-emitting diode monomer used in a conventional outdoor LED display is shown, and the light-emitting diode monomer includes an LED chip set in a bowl 01. Generally speaking, the LED chips of the light-emitting diode monomer include a red light LED chip 03, a green light LED chip 04, and a blue light LED chip 05. The three chips can emit red light, green light, and blue light respectively, thereby forming three primary colors. Through the principle of additive color mixing, for example, red light plus green light can be superimposed into yellow light, and red light plus blue light can be superimposed into finished red light, etc., a wide color gamut range can be covered.

[0033] Brightness is one of the important criteria for measuring the quality of LED displays, which directly affects the visibility of the display under ambient light. In order to improve the overall brightness, a convex lens 02 is also provided in the bowl 01 of the LED unit, and the convex lens 02 is covered on the LED chip. The convex lens 02 focuses and collimates the light emitted by each LED chip, thereby improving the brightness of the overall display and ensuring that the quality of the LED display meets the use requirements.

[0034] Although the convex lens 02 can improve the brightness to a certain extent, the brightness improvement is limited. Taking the light-emitting diode monomer shown in the figure as an example, the red LED chip 03, the green LED chip 04 and the blue LED chip 05 are all set in the same bowl 01, and the same convex lens 02 is used to focus and collimate the light. This results in a certain difference in the position of each LED chip relative to the convex lens 02. The position difference will lead to different lens angles, which in turn will lead to differences in the brightness improvement of the convex lens 02.

[0035] For example, the green LED chip 04 is arranged in the center, and the other two LED chips are arranged on both sides of the green LED chip 04. In this case, the brightness of the green LED chip 04 is increased the most, while the brightness of the two LED chips on both sides of the green LED chip 04 is slightly increased. According to the detection of the researchers, in the above case, the brightness of the green LED chip 04 is increased by about 50%, while the brightness of the other two LED chips is increased by about 30%.

[0036] On this basis, the quality of outdoor LED displays using such LED monomers is relatively poor. On the one hand, the low brightness increase will result in relatively low overall brightness. In an outdoor environment with direct sunlight, insufficient display brightness will result in blurred images and poor display effects. On the other hand, due to the differences in the brightness increase of each LED chip, the brightness will be uneven, further affecting the display effect.

[0037] To solve the above problems, refer to Figure 3 As shown, the present invention provides a light emitting diode monomer, including a base 10, a pad 21, a plurality of light emitting diode chips 30 and a plurality of brightness enhancement members 40.

[0038] The base 10 is mainly used to install the light-emitting diode chip 30. The material, shape and structure of the base 10 itself belong to the prior art. Considering the requirements for insulation, preferably, the material of the base 10 is set to PPA (polyphthalamide).

[0039] A pad 21 is provided inside the base 10, and its material is a conductive metal, such as copper and / or iron, to achieve electrical connection of the light-emitting diode chip 30. The pad 21 includes a pin, and the pin is divided into a positive electrode and a negative electrode. The pad 21 is electrically connected to an external component, such as a circuit board, through the pin. Preferably, the two types of pins are arranged on both sides of the base 10 to avoid contact.

[0040] In order to facilitate mass production, the pads 21 are usually arranged on the bracket 20. Each bracket 20 is provided with a plurality of pads 21 in an array. During production, the base 10 is first formed on the pads 21, and then corresponding operations are performed on the base 10, such as installing the light emitting diode chip 30.

[0041] Reference Figure 4 As shown, a receiving bowl 11 is provided on the base 10, and the light-emitting diode chip 30 is installed through the receiving bowl 11. There are multiple receiving bowls 11, and the bottom of each receiving bowl 11 is connected to the pad 21, so that the light-emitting diode chip 30 and the pad 21 are electrically connected.

[0042] The light emitting diode chip 30 itself belongs to the prior art, which converts electrical energy into light energy through semiconductor materials. Different light emitting diode chips 30 can emit light of different colors, such as red light, green light or blue light.

[0043] At least one LED chip 30 is disposed in each receiving bowl 11 of the base 10. When a plurality of LED chips 30 are disposed in the same receiving bowl 11, the LED chips 30 in the same receiving bowl 11 have a single color.

[0044] A brightness enhancement member 40 is disposed in each receiving bowl 11 of the base 10. The brightness enhancement member 40 covers the corresponding light-emitting diode chip 30. On the one hand, the brightness enhancement member 40 can play a packaging and protection effect on the light-emitting diode chip 30; on the other hand, the brightness enhancement member 40 can focus and collimate the divergent light emitted by the light-emitting diode chip 30, thereby achieving the effect of improving the brightness.

[0045] Those skilled in the art can set different brightness enhancement members 40 according to actual needs, such as convex lenses, Fresnel lenses, etc. Taking the convex lens as an example, due to the structure of the convex lens being thick in the middle and thin at the edges, the divergent light can be focused and collimated after refraction and concentrated to a specific area, thereby improving the brightness.

[0046] Preferably, the brightness enhancement member 40 is made of a transparent material to prevent its color from affecting the light of the light emitting diode chip 30. Preferably, the brightness enhancement member 40 is made of an epoxy resin material.

[0047] Preferably, only one LED chip 30 is provided in each accommodating bowl cup 11, and the center of the LED chip 30 is aligned with the center of the brightness enhancement member 40 to ensure that the best brightness enhancement range can be achieved and the best brightness enhancement effect can be ensured.

[0048] When a plurality of LED chips 30 of the same color are arranged in the same receiving bowl 11 of the base 10, technicians in this field can adjust the position of the LED chip 30 or the structure of the corresponding brightness enhancement component 40 according to actual needs, so that the brightness enhancement range and brightness thereof match those of the LED chips 30 in other receiving bowls 11.

[0049] Those skilled in the art can set a molding method of the brightness enhancement member 40 according to actual needs. For example, the brightness enhancement member 40 can be prepared by dispensing or molding.

[0050] As the number of accommodating bowls and cups 11 on the base 10 increases, each LED chip 30 can be arranged in a different accommodating bowl and cup 11, and an independent brightness enhancement component 40 can be configured for at least part of the LED chips 30, thereby improving the brightness enhancement range of the LED chips 30.

[0051] Taking the light-emitting diode monomers of the three primary colors of red, green and blue as an example, simple adjustments can be made, including controlling the brightness increase of the three colors of light within a similar range, thereby effectively improving the brightness uniformity of the light-emitting diode monomers.

[0052] When the LED chip 30 and the brightness enhancement member 40 correspond one to one and their centers are aligned, the brightness enhancement can be increased to about 100%. This not only ensures the brightness uniformity, but also effectively improves the overall brightness, making the display effect of the corresponding LED display better, especially suitable for outdoor environments with direct sunlight.

[0053] When producing a light-emitting diode monomer, first, fix the corresponding light-emitting diode chip 30 in the accommodating bowl 11. For example, the light-emitting diode chip 30 and the pad 21 are fixedly connected by a solid crystal adhesive. Secondly, the positive and negative electrodes of the light-emitting diode chip 30 are electrically connected to the positive and negative electrodes of the pad 21. Preferably, welding is adopted to achieve electrical connection and conduction between the two using bonding wires and solid crystal adhesive. Finally, a brightness enhancement component 40 capable of focusing and collimating the light is provided in the accommodating bowl 11 to obtain a light-emitting diode monomer.

[0054] The light-emitting diode monomer described in the present invention effectively improves the brightness improvement of the light-emitting diode chip 30 in the accommodating bowl cup 11 by arranging multiple accommodating bowl cups 11 on the base 10 and providing a brightness enhancement component 40 for each accommodating bowl cup 11, thereby ensuring high brightness and uniformity of the monomer, thereby ensuring good display effect and high quality of the corresponding display, and is particularly suitable for outdoor environments with direct sunlight.

[0055] Reference Figure 5 As shown, in the light emitting diode monomer of the present invention, in some embodiments, the light emitting diode chip 30 includes a red light chip 31, a green light chip 32 and a blue light chip 33. Along the first direction D1, the red light chip 31, the green light chip 32 and the blue light chip 33 are sequentially arranged in the independent accommodating bowl 11.

[0056] It can be understood that in the present embodiment, three accommodating cups 11 are disposed on the base 10 , and the three accommodating cups 11 are disposed sequentially along the first direction D1 , and each accommodating cup 11 is provided with a single-color light-emitting diode chip 30 .

[0057] Preferably, the base 10 is configured as a rectangular parallelepiped structure, the length of the base 10 is parallel to the first direction D1, the width of the base 10 is parallel to the second direction D2, and the height of the base 10 is parallel to the third direction D3.

[0058] The three primary colors can be formed by setting the red light chip 31, the green light chip 32 and the blue light chip 33. The three chips can adjust the channel intensity, and different colors are superimposed through the additive color mixing principle, thereby achieving a wide color gamut range.

[0059] The channel intensity can be represented by a numerical range, for example, it is represented by an integer from 0 to 255. At this time, the channel intensity corresponding to red light is (255, 0, 0). On this basis, 256*256*256, about 16.78 million colors, can be obtained.

[0060] Preferably, the centers of the red light chip 31, the green light chip 32 and the blue light chip 33 are all set to be aligned with the centers of the corresponding brightness enhancement components 40. On the basis of improving the brightness enhancement range by setting an independent brightness enhancement component 40 for the light-emitting diode chip 30, the brightness enhancement range effect can be optimized, thereby ensuring that the brightness and quality of the light-emitting diode monomer are high.

[0061] The green light chip 32 is arranged between the red light chip 31 and the blue light chip 33 because the wavelength of green light is about 555nm in the visible spectrum, and the human eye is most sensitive to light of this wavelength. On this basis, the green light chip 32 is arranged between the red light chip 31 and the blue light chip 33 to optimize the display clarity and color balance, so as to enhance the viewing experience of the human eye.

[0062] The viewing angle range is also one of the important quality criteria of an LED display. The viewing angle range of an LED display is related to the light emitting angle of the LED monomer.

[0063] Considering that outdoor LED displays are usually hung high for people to watch, there is a certain distance between the viewer and the display, and the number of viewers is relatively large. In this case, the viewing angle requirement for the LED display in the height direction is not high, but the viewing angle requirement for the LED display in the horizontal direction is relatively high to ensure the display consistency of the display when viewed from left to right.

[0064] However, the cup mouth shape of conventional LED monomers is usually round, resulting in a limited light-emitting angle of the corresponding convex lens, which is difficult to meet the needs of outdoor use. For example, the light-emitting angle of conventional displays in the horizontal direction is about 80°, while the light-emitting angle of outdoor displays in the horizontal direction is usually higher than 80°.

[0065] To increase the luminous angle, refer to Figure 5 As shown, in some embodiments of the light emitting diode monomer described in the present invention, the shape of the mouth of each receiving bowl cup 11 is set to be an ellipse, and the short axis of the ellipse is axially parallel to the first direction D1.

[0066] On the one hand, the accommodating bowl 11 has an elliptical mouth shape, and a plane perpendicular to the third direction D3 is taken to intercept the corresponding brightness enhancement member 40, and the resulting cross-sectional shape is also an ellipse. Taking a convex lens as an example, the convex lens has a larger radius of curvature in the long axis direction of the ellipse, and the surface is relatively flat. This makes the divergence of the light in the long axis direction of the ellipse enhanced when it is refracted, so that the corresponding display can obtain a larger luminous angle. On this basis, the display consistency of the display is higher when viewed from left to right, and the display effect is better.

[0067] On the other hand, the minor axis size of the ellipse can be flexibly adjusted for different bases 10. For example, the minor axis size is set to be equal to the diameter size of a conventional circle, that is, the luminous angle can be increased in the horizontal direction of the display corresponding to the major axis of the ellipse, while ensuring that the luminous angle in the height direction of the display corresponding to the minor axis remains unchanged. Alternatively, the minor axis size can be reduced to improve space utilization.

[0068] In the light emitting diode monomer, the quality of the brightness enhancement member 40 will also affect the quality of the light emitting diode monomer. In the prior art, the brightness enhancement member 40 is usually prepared by dispensing or molding.

[0069] Taking the molding of convex lenses as an example, the convex lenses are usually pressed and molded using a mold. However, in order to ensure production efficiency, when producing light-emitting diode monomers, batch operations are usually required on the bracket 20. Each bracket 20 usually includes hundreds or thousands of light-emitting diode monomers, and each light-emitting diode monomer on the bracket 20 needs to be matched with a mold, and at the same time, a convex lens is molded in each accommodating bowl 11.

[0070] Faced with a large number of LED monomers, the bracket 20 cannot ensure that each LED monomer is in the same plane, and there will be a gap between the mold and the base 10. This causes the molding glue for preparing the convex lens to overflow from the gap between the mold and the base 10 when the molding mold is used. The quality of the monomer with glue overflow does not meet the production requirements and is a defective product. The existence of defective products will affect the overall production yield.

[0071] When using conventional glue dispensing to prepare the brightness enhancement part 40, quality problems will also exist. Specifically, conventional glue is usually suitable for multiple chips and has high fluidity. In the light-emitting diode monomer described in the present invention, the volume of the bowl cup 11 is relatively reduced. Under the premise of small volume and high fluidity, glue diffusion is prone to occur when using conventional glue to prepare the brightness enhancement part 40. The quality of monomers that cannot be aggregated and formed does not meet the production requirements and is a defective product. The presence of defective products will affect the overall production yield.

[0072] To solve the above problems, refer to Figure 7As shown, in the light emitting diode monomer described in the present invention, in some embodiments, the brightness enhancement member 40 includes a first reinforcement body 41 and a second reinforcement body 42 formed by dispensing.

[0073] The first reinforcement 41 is disposed in the accommodating bowl 11 and covers the LED chip 30 to achieve packaging and protection of the LED chip 30. The second reinforcement 42 is connected to the first reinforcement 41, and the second reinforcement 42 is disposed on a side of the first reinforcement 41 away from the LED chip 30 and covers the LED chip 30 to achieve focusing and collimation of light. The thixotropic index of the first reinforcement 41 is smaller than that of the second reinforcement 42.

[0074] By molding the brightness enhancement member 40 in sections, the molding rate can be effectively improved and the molding quality can be guaranteed. The thixotropic index is the ratio of the low-speed viscosity to the high-speed viscosity, also known as the TI value.

[0075] Taking epoxy resin glue as an example, when the thixotropic index is low, the fluidity of epoxy resin glue is high, and vice versa. By selecting a material with a low thixotropic index as the first reinforcement 41, the material can be fully diffused and formed during preparation, so as to evenly fill the accommodating bowl 11, reduce bubbles and gaps, and protect the internal light-emitting diode chip 30.

[0076] Selecting a material with a high thixotropic index as the second reinforcement 42 can prevent the material from diffusing during the molding process and causing the material to be unable to aggregate and mold. The combination of the two can take into account both high production efficiency and molding rate, ensure high product quality, and save the production cost of defective products.

[0077] Furthermore, in some embodiments of the light-emitting diode monomer of the present invention, the material of the first reinforcement body 41 includes epoxy resin, and the material of the second reinforcement body 42 includes epoxy resin and fumed silica.

[0078] Epoxy resin has the advantages of strong adhesion, good chemical stability, good electrical insulation, etc., and is particularly suitable for use as the brightness enhancement member 40 to achieve packaging and insulation protection of the light-emitting diode chip 30. Preferably, non-thixotropic epoxy resin glue is selected as the material for preparing the first reinforcement 41, and its thixotropic index is about 1, which has good fluidity and is easy to dispense.

[0079] Fumed silica is a thixotropic agent that forms a hydrogen bond network through the surface silanol group, which can significantly increase the thixotropic index. The mass fraction of fumed silica is k%, 1≤k≤3.

[0080] Among them, the mass fraction of added fumed silica should not be too small. When the mass fraction is too small, less than 1%, the fluidity is still relatively high, and it is difficult to ensure a high molding rate. At the same time, the mass fraction should not be too large. When the mass fraction is too large, greater than 3%, the fluidity is too low, glue pulling is easy to occur, and it is difficult to ensure a high molding rate. When its mass fraction is set to 1% to 3%, it has the characteristics of high viscosity and not easy to flow without external shearing, which can ensure a high molding rate.

[0081] Table 1 below shows the preparation effects of fumed silica with different mass fractions.

[0082] Table 1 Preparation effect of fumed silica with different mass fractions

[0083]

[0084] According to the data in Table 1, without the addition of fumed silica, the thixotropic index of non-thixotropic epoxy resin glue is relatively low, resulting in excessive fluidity and difficulty in molding.

[0085] When adding fumed silica with a mass fraction of less than 1%, taking fumed silica with a mass fraction of 0.9% as an example, the thixotropic index increases, but the reduction in fluidity is limited, resulting in the molding rate still unable to meet production needs.

[0086] When adding 1% to 2% by mass of fumed silica, the thixotropic index increases, which reduces the fluidity and effectively improves the molding rate.

[0087] When adding 2% to 2.5% mass fraction of fumed silica, the thixotropic index remains between 3 and 3.5. At this time, the fluidity can meet production needs and the molding rate can reach 98%.

[0088] When adding 2.5% to 3% by mass of fumed silica, the thixotropic index further increases. At this time, the fluidity is too low and it is relatively viscous. There are certain glue pulling problems during dispensing, which leads to a lower molding rate, but it can still meet production needs.

[0089] When adding fumed silica with a mass fraction greater than 3%, taking fumed silica with a mass fraction of 3.2% as an example, the thixotropic index is relatively too high, the glue pulling problem is relatively serious, the molding rate is reduced, and it cannot meet production needs.

[0090] Those skilled in the art can set the mass fraction of the specific added fumed silica according to actual needs, for example, the mass fraction can be set to 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2.0%, 2.1%, 2.2%, 2.3%, 2.4%, 2.5%, 2.6%, 2.7%, 2.8%, 2.9%, 3.0%, etc.

[0091] Preferably, modified fumed silica is selected. Modified fumed silica is obtained by physically or chemically treating native hydrophilic fumed silica to change its surface properties or functional structure, thereby effectively improving its dispersibility and mechanical properties.

[0092] Reference Figure 6 and Figure 7 As shown, the light emitting diode monomer of the present invention, in some embodiments, has an elliptical short axis size L d Set to 0.750mm (millimeter) to 0.758mm, major axis dimension L c The minor axis size L of the ellipse is preferably 1.750 mm to 1.760 mm. d Set to 0.754mm, long axis dimension L c Set to 1.755mm.

[0093] It can be understood that, when the shape of the cup mouth of the bowl 11 is fixed, the volume of the brightness enhancement member 40 is mainly affected by its height, that is, its size in the third direction D3. By properly controlling the size of the brightness enhancement member 40 in the third direction D3, the quality of the light-emitting diode monomer can be optimized, taking into account a large light-emitting angle and high brightness.

[0094] For the sake of distinction, the dimension of the second reinforcement body 42 in the third direction D3 is recorded as the first height H1, and the first height H1 is set to 0.65 mm to 0.75 mm. Preferably, the first height H1 is set to 0.7 mm. When the second reinforcement body 42 is set to a conventional convex lens structure, a plane perpendicular to the first direction D1 or the second direction D2 is taken for interception, and the obtained cross-sectional shape is an arcuate shape.

[0095] Among them, the first height H1 should not be too small. When the first height H1 is too small and less than 0.65mm, although the horizontal luminous angle can meet the requirements, the brightness improvement is relatively low, resulting in the brightness failing to meet the requirements. At the same time, the first height H1 should not be too large. When the first height H1 is too large and greater than 0.75mm, the horizontal luminous angle cannot meet the requirements. When the first height H1 is set to 0.65mm to 0.75mm, both the high horizontal luminous angle and the brightness can be taken into account. Those skilled in the art can control the first height H1 by adjusting the amount of glue dispensed.

[0096] Table 2 below shows the effects of convex lenses with different first heights H1.

[0097] Table 2 Effects of convex lenses with different first heights H1

[0098]

[0099] According to the data in Table 2, when using Figure 1 In the case of the conventional light-emitting diode monomer shown, not only is the improvement of the chip brightness limited, but also the light-emitting angle of the display in the horizontal direction is relatively low.

[0100] When the cup mouth shape of the accommodating bowl cup 11 is set to an ellipse, the major axis size of the ellipse is set to 1.755mm, the minor axis size is set to 0.754mm, and the first height H1 is set to 0.6mm, although the horizontal luminous angle of the display is effectively improved, the brightness improvement of each chip is limited and it is difficult to meet the quality requirements.

[0101] When the first height H1 is set to 0.65 mm to 0.75 mm, both the light emitting angle and the brightness can meet the quality requirements. Among them, when the first height H1 is set to 0.7 mm, the effect is the best.

[0102] When the first height H1 is set to 0.8 mm, although the brightness is effectively improved, the light-emitting angle of the display in the horizontal direction is relatively small, which makes it difficult to meet the quality requirements.

[0103] Those skilled in the art can set the specific first height H1 according to actual needs. For example, the first height H1 can be set to 0.65 mm, 0.66 mm, 0.67 mm, 0.68 mm, 0.69 mm, 0.70 mm, 0.71 mm, 0.72 mm, 0.73 mm, 0.74 mm, 0.75 mm, etc.

[0104] In the prior art, conventional LED monomers usually use a single bowl cup structure when accommodating glue. This single bowl cup structure lacks partitions, which causes the glue to easily spread along the cup surface before curing, resulting in defects. In order to solve the above problems, refer to Figure 8 As shown, the light emitting diode monomer described in the present invention, in some embodiments, the accommodating bowl 11 includes a bowl concave portion 111, a bowl convex portion 112 and a bowl accommodating portion 113.

[0105] The bowl cup recess 111 is arranged on the base 10 so as to prepare the bowl cup protrusion 112. The bowl cup protrusion 112 is arranged in the bowl cup recess 111. It can be understood that the height of the bowl cup protrusion 112 (i.e., the dimension TB of the bowl cup protrusion 112 in the third direction D3) is smaller than the depth of the bowl cup recess 111 (i.e., the dimension AB of the bowl cup recess 111 in the third direction D3). The bowl cup receiving portion 113 is arranged in the bowl cup protrusion 112, and the cup bottom of the bowl cup receiving portion 113 is connected to the welding pad 21.

[0106] By setting this structure, the bowl cup recess 111 and the bowl cup receiving portion 113 form a cup-in-cup structure. On this basis, the epoxy resin glue can be confined in the bowl cup receiving portion 113 to prevent it from spreading. Compared with the conventional single bowl cup structure, the double bowl cup structure of the cup-in-cup can prevent the epoxy resin glue in the bowl cup receiving portion 113 from migrating outward due to gravity or surface tension. In conjunction with the second reinforcement 42, it can effectively improve production efficiency and molding rate, ensure high product quality, and save the production cost of defective products.

[0107] Preferably, in the third direction D3, the size of the first reinforcement body 41 is the same as the size of the bowl and cup receiving portion 113 to ensure a good confinement effect.

[0108] Further, see Figure 8 As shown, in some embodiments of the light-emitting diode monomer of the present invention, the inner wall of the bowl-cup accommodating portion 113 is inclined so that the cup opening area of ​​the bowl-cup accommodating portion 113 gradually decreases in the direction toward the pad 21. By setting this structure, it is possible to effectively cooperate with the non-thixotropic epoxy resin glue with high fluidity to fully diffuse and form, realize uniform filling of the accommodating bowl 11, reduce bubbles and gaps, and realize protection of the internal light-emitting diode chip 30.

[0109] Reference Fig. 9 As shown, the present invention also provides a light emitting diode packaging method, which is applied to the light emitting diode monomer as described in any one of the above embodiments. The light emitting diode packaging method comprises:

[0110] At least one light emitting diode chip 30 is disposed in each receiving cup 11 of the base 10 .

[0111] The light emitting diode chip 30 is electrically connected to the pad 21 .

[0112] A brightness enhancement member 40 is provided in each receiving bowl 11 .

[0113] A light emitting diode monomer is obtained.

[0114] A solder pad 21 is disposed in the base 10 , and a plurality of accommodating cups 11 are disposed on the base 10 , and the bottoms of the accommodating cups 11 are connected to the solder pad 21 ; the light emitting diode chips 30 in the same accommodating cup 11 have a single color.

[0115] In some embodiments of the light emitting diode packaging method of the present invention, a brightness enhancement member 40 is provided in each receiving bowl 11, including:

[0116] A first reinforcement body 41 is disposed in each accommodating cup 11 , so that the first reinforcement body 41 covers the light emitting diode chip 30 .

[0117] A second reinforcement body 42 is disposed on a side of each first reinforcement body 41 facing away from the LED chip 30 , so that the second reinforcement body 42 is connected to the first reinforcement body 41 and covers the LED chip 30 .

[0118] The thixotropic index of the first reinforcement 41 is smaller than the thixotropic index of the second reinforcement 42 .

[0119] Furthermore, in some embodiments of the light emitting diode packaging method of the present invention, a second reinforcement body 42 is disposed on a side of each first reinforcement body 41 away from the light emitting diode chip 30, so that the second reinforcement body 42 is connected to the first reinforcement body 41 and covers the light emitting diode chip 30, comprising:

[0120] A reinforcing glue is applied to the side of each first reinforcing body 41 away from the light emitting diode chip 30 to obtain a first body to be cured. The reinforcing glue comprises epoxy resin and fumed silica, and the mass fraction of the fumed silica is k%, 1≤k≤3.

[0121] The first body to be cured is placed upside down to obtain an inverted second body to be cured.

[0122] The second body to be cured is baked according to preset baking conditions to obtain a second reinforcement body 42. The preset baking conditions include baking temperature and baking time. The baking temperature is set to 130 to 150° C., and the baking time is set to 4 to 5 hours.

[0123] Reference Fig.10 As shown, the present invention further provides a light emitting diode assembly, including a bracket 20, on which a plurality of light emitting diode monomers as described in any one of the above embodiments are arranged.

[0124] The present invention further provides a light emitting diode display, comprising at least one light emitting diode monomer as described in any one of the above embodiments.

[0125] The present invention also provides a non-transitory machine-readable medium storing a computer program, wherein the computer program, when executed by a processor of a computer, is used to enable the computer to execute the light emitting diode packaging method described in any one of the above embodiments.

[0126] The present invention further provides a computer program product, including a computer program, wherein when the computer program is executed by a processor of a computer, the computer is used to enable the computer to execute the light emitting diode packaging method described in any one of the above embodiments.

[0127] Reference Fig.11 As shown, the present invention also provides an electronic device, including at least one processor and a memory connected to the at least one processor. The memory stores a computer program that can be executed by the at least one processor, and when the at least one processor executes the computer program, the electronic device executes the light emitting diode packaging method described in any one of the above embodiments.

[0128] The structural block diagram of the electronic device that can be used as the server or client of an embodiment of the present invention will now be described, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples, and are not intended to limit the implementation of the present invention described and / or required herein.

[0129] Reference Fig.11 As shown, the electronic device includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 into a random access memory (RAM) 503. In RAM503, various programs and data required for the operation of the electronic device can also be stored. The computing unit 501, ROM502, and RAM503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0130] Multiple components in the electronic device are connected to the I / O interface 505, including: an input unit 506, an output unit 507, a storage unit 508, and a communication unit 509. The input unit 506 can be any type of device that can input information to the electronic device, and the input unit 506 can receive input digital or character information, and generate key signal input related to user settings and / or function control of the electronic device. The output unit 507 can be any type of device that can present information, and can include but is not limited to a display, a speaker, a video / audio output terminal, a vibrator, and / or a printer. The storage unit 508 can include but is not limited to a disk, an optical disk. The communication unit 509 allows the electronic device to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks, and can include but is not limited to a modem, a network card, an infrared communication device, and / or a wireless communication transceiver, such as a Bluetooth device, a WiFi device, a WiMax device, a cellular communication device, and / or the like.

[0131] The computing unit 501 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a CPU, a graphics processing unit (GPU), various special artificial intelligence (AI) computing units, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above. For example, in some embodiments, the method embodiments of the present invention may be implemented as a computer program, which is tangibly contained in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on an electronic device via ROM 502 and / or a communication unit 509. In some embodiments, the computing unit 501 may be configured to perform the above-described method in any other appropriate manner (e.g., by means of firmware).

[0132] The computer programs for implementing the methods of the embodiments of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer programs are executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer programs may be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0133] In the context of an embodiment of the present invention, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or apparatus. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable signal medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, or infrared systems, devices, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media may include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0134] Working principle:

[0135] First, the red light chip 31 , the green light chip 32 and the blue light chip 33 are fixed in the corresponding bowl-cup accommodating portion 113 by using a bonding adhesive so as to be fixedly connected to the pad 21 .

[0136] Next, the positive and negative electrodes of the red chip 31 , the green chip 32 , and the blue chip 33 are welded to the positive and negative electrodes of the pads 21 by using bonding wires and a bonding adhesive.

[0137] Then, non-thixotropic epoxy resin glue is applied to each bowl and cup receiving portion 113. The bowl and cup receiving portion 113 is fully filled with non-thixotropic epoxy resin glue with good fluidity so that the non-thixotropic epoxy resin glue and the bowl and cup receiving portion 113 are flush in the third direction D3. After the glue application is completed, the first reinforcement body 41 is obtained by baking at 130°C to 150°C for 90 min to 120 min.

[0138] Finally, a reinforcing glue is applied to the side of each first reinforcing body 41 away from the light-emitting diode chip 30 to obtain a first body to be cured, which is then inverted and baked at 130° C. to 150° C. for 4 to 5 hours to obtain a finished product.

[0139] It should be noted that the term "including" and its variations used in the embodiments of the present invention are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "multiple" mentioned in the embodiments of the present invention are illustrative and not restrictive. Those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more".

[0140] The various steps described in the method implementation methods provided by the embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method implementation methods may include additional steps and / or omit the steps shown. The scope of protection of the present invention is not limited in this respect.

[0141] The term "embodiment" in this specification refers to specific features, structures or characteristics described in conjunction with the embodiment that can be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. The various embodiments in this specification are described in a related manner, and the same or similar parts between the various embodiments refer to each other. In particular, for the device, equipment, and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts refer to the partial description of the method embodiment.

[0142] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of protection. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the attached claims.

Claims

1. A light emitting diode monomer, characterized in that: include: A base, wherein a solder pad is disposed in the base, and a plurality of accommodating bowls and cups are disposed on the base, and the bottoms of the accommodating bowls and cups are connected to the solder pad; A plurality of light-emitting diode chips, each of the accommodating bowls is provided with at least one light-emitting diode chip, the light-emitting diode chip is electrically connected to the pad, and the light-emitting diode chips in the same accommodating bowl have a single color; and, A plurality of brightness enhancement components are provided in each of the accommodating bowls or cups.

2. The light emitting diode monomer according to claim 1, characterized in that: The light emitting diode chip comprises a red chip, a green chip and a blue chip. Along the first direction, the red chip, the green chip and the blue chip are sequentially arranged in the independent accommodating bowl cups, and the centers of the red chip, the green chip and the blue chip are aligned with the centers of the corresponding brightness enhancement members; The shape of the cup mouth of each accommodating bowl and cup is set to be an ellipse, and the minor axis of the ellipse is axially parallel to the first direction.

3. The light emitting diode monomer according to claim 2, characterized in that: The minor axis size of the ellipse is set to 0.750 mm to 0.758 mm, and the major axis size is set to 1.750 mm to 1.760 mm; The maximum height of the brightness enhancement member disposed outside the accommodating bowl and cup is a first height, and the first height is set to be 0.65 mm to 0.75 mm.

4. The light emitting diode monomer according to any one of claims 1 to 3, characterized in that: The brightness enhancement member comprises: A first reinforcement body, which is disposed in the accommodating bowl and covers the light-emitting diode chip; a second reinforcement body, the second reinforcement body being connected to the first reinforcement body, the second reinforcement body being arranged on a side of the first reinforcement body away from the light emitting diode chip, and covering the light emitting diode chip; The first reinforcement and the second reinforcement are both formed by dispensing, and the thixotropic index of the first reinforcement is smaller than that of the second reinforcement.

5. The light emitting diode monomer according to claim 4, characterized in that: The material of the first reinforcement body includes epoxy resin; The material of the second reinforcement includes epoxy resin and fumed silica; Wherein, the mass fraction of the fumed silica is k%, 1≤k≤3.

6. The light emitting diode monomer according to any one of claims 1 to 3, characterized in that: The accommodating bowl and cup comprises: concave portion of bowl; a bowl-cup convex portion, the bowl-cup convex portion being arranged in the bowl-cup concave portion; wherein the height of the bowl-cup convex portion is less than the depth of the bowl-cup concave portion; A bowl and cup accommodating portion, wherein the bowl and cup accommodating portion is arranged in the bowl and cup convex portion, and the cup bottom of the bowl and cup accommodating portion is connected to the welding pad; wherein the inner wall of the bowl and cup accommodating portion is inclined so that the cup mouth area of ​​the bowl and cup accommodating portion gradually decreases along the direction toward the welding pad.

7. A light emitting diode packaging method, applied to the light emitting diode monomer according to any one of claims 1 to 6, characterized in that: include: At least one light-emitting diode chip is arranged in each accommodating bowl cup of the base; wherein a soldering pad is arranged in the base, a plurality of the accommodating bowl cups are arranged on the base, and the bottoms of the accommodating bowl cups are connected to the soldering pads; the light-emitting diode chips in the same accommodating bowl cup have a single color; Electrically connecting the light emitting diode chip to the pad; A brightness enhancement member is provided in each of the accommodating bowls and cups; A light emitting diode monomer is obtained.

8. The light emitting diode packaging method according to claim 7, characterized in that: A brightness enhancement member is provided in each of the accommodating bowls and cups, including: A first reinforcement body is arranged in each of the accommodating bowls, so that the first reinforcement body covers the light-emitting diode chip; A second reinforcement body is arranged on a side of each of the first reinforcement bodies away from the light emitting diode chip, so that the second reinforcement body is connected to the first reinforcement body and covers the light emitting diode chip; Wherein, the thixotropic index of the first reinforcement is smaller than the thixotropic index of the second reinforcement.

9. The light emitting diode packaging method according to claim 8, characterized in that: A second reinforcement body is arranged on a side of each of the first reinforcement bodies away from the light emitting diode chip, so that the second reinforcement body is connected to the first reinforcement body and covers the light emitting diode chip, comprising: Applying reinforcing glue on the side of each first reinforcing body away from the light-emitting diode chip to obtain a first body to be cured; wherein the reinforcing glue comprises epoxy resin and fumed silica, and the mass fraction of the fumed silica is k%, 1≤k≤3; Inverting the first body to be cured to obtain an inverted second body to be cured; The second body to be solidified is baked according to preset baking conditions to obtain the second reinforcement body; wherein the preset baking conditions include baking temperature and baking time, the baking temperature is set to 130 to 150° C., and the baking time is set to 4 to 5 hours.

10. A light emitting diode assembly, characterized in that: It comprises a bracket, on which a plurality of light-emitting diode monomers as claimed in any one of claims 1 to 6 are arranged, or a plurality of light-emitting diode monomers obtained by the light-emitting diode packaging method as claimed in any one of claims 7 to 9.

11. A light emitting diode display, characterized in that: The method comprises at least one light emitting diode monomer according to any one of claims 1 to 6, or comprises at least one light emitting diode monomer obtained by the light emitting diode packaging method according to any one of claims 7 to 9.

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