Robot system, aligner, and alignment method for semiconductor substrate

Abstract

In this robot system (100), a control unit (23) performs position determination control without stopping the rotation of a mounting unit (21) for detecting a mark (112), and performs alignment control in a state in which the rotation of the mounting unit (21) is not stopped and the direction of rotation of the mounting unit (21) is maintained after determining the position (P2) of the mark (112).

Description

Technical Field

[0001] The present disclosure relates to a robot system, an aligner, and an alignment method for a semiconductor substrate. Background Art

[0002] Conventionally, there is a known aligner for aligning a semiconductor substrate. For example, Japanese Patent Application Laid-Open No. 2021-44548 discloses an aligner for aligning a semiconductor substrate having a notch on the outer periphery.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-44548

[0004] Here, although it is not clearly recorded in Japanese Patent Gazette No. 2021-44548, it can be considered that in the existing aligner such as that recorded in Japanese Patent Gazette No. 2021-44548, after the carrier portion carrying the semiconductor substrate is rotated in order to detect the position of the notch, the rotation of the carrier portion is temporarily stopped, and then the detection data for determining the position of the notch is analyzed. After the position of the notch is determined, the carrier portion is rotated in a direction close to the alignment position when observed from the position of the notch, so that the position of the notch is located at the alignment position as the target position. Therefore, it can be considered that in the existing aligner such as that recorded in Japanese Patent Gazette No. 2021-44548, in order to temporarily stop the rotation of the carrier portion and change the rotation direction of the carrier portion, it is necessary to slow down and accelerate the rotation of the carrier portion, so that the time required for aligning the semiconductor substrate as a whole is likely to be prolonged. Therefore, a structure that can shorten the time required for aligning the semiconductor substrate as a whole is desired. Summary of the invention

[0005] The present disclosure is made to solve the above-mentioned problems, and one of the objects of the present disclosure is to provide a robot system, an aligner, and a semiconductor substrate alignment method that can shorten the time required for aligning a semiconductor substrate as a whole.

[0006] In order to achieve the above-mentioned purpose, the robot system involved in the first aspect of the present disclosure comprises: a substrate transport robot, which transports a semiconductor substrate having a mark formed on the outer periphery for circumferential positioning; and an aligner, which is used to align the semiconductor substrate, the aligner comprising: a loading portion, which rotates around a rotation axis while loading the semiconductor substrate; a detection portion, which detects the mark of the semiconductor substrate loaded on the loading portion and rotating around the rotation axis; and a control portion, which performs position determination control and alignment control, the position determination control determines the position of the mark based on the detection result of the mark by the detection portion, the alignment control rotates the loading portion to align the semiconductor substrate based on the determined position of the mark, the control portion performs the position determination control without stopping the rotation of the loading portion for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the loading portion and maintaining the rotation direction of the loading portion.

[0007] In the robot system involved in the first aspect of the present disclosure, as described above, the control unit performs position determination control without stopping the rotation of the carrier unit for detecting the mark, and after determining the position of the mark, performs alignment control without stopping the rotation of the carrier unit and maintaining the rotation direction of the carrier unit. Thus, from the start of the rotation of the carrier unit for detecting the mark until the mark is located at the alignment position, the carrier unit is continuously rotated in the same direction without stopping, so that the time for decelerating and accelerating the rotation of the carrier unit can be shortened compared to the case where the rotation of the carrier unit is temporarily stopped, the case where the rotation direction of the carrier unit is changed midway, etc. As a result, the time required for aligning the semiconductor substrate as a whole can be shortened.

[0008] In order to achieve the above-mentioned purpose, the aligner involved in the second aspect of the present disclosure is an aligner for aligning a semiconductor substrate having a mark for circumferential positioning formed on the outer periphery, the aligner comprising: a loading portion, which rotates around a rotation axis while loading the semiconductor substrate; a detection portion, which detects the mark of the semiconductor substrate loaded on the loading portion and rotating around the rotation axis; and a control portion, which performs position determination control and alignment control, the position determination control determines the position of the mark based on the detection result of the mark by the detection portion, the alignment control rotates the loading portion to align the semiconductor substrate based on the determined position of the mark, the control portion performs the position determination control without stopping the rotation of the loading portion for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the loading portion and maintaining the rotation direction of the loading portion.

[0009] In the aligner involved in the second aspect of the present disclosure, as described above, similar to the robot system involved in the first aspect, the control unit performs position determination control without stopping the rotation of the carrier for detecting the mark, and after determining the position of the mark, the alignment control is performed without stopping the rotation of the carrier and maintaining the rotation direction of the carrier. As a result, similar to the robot system involved in the first aspect, the time required to decelerate and accelerate the rotation of the carrier can be shortened compared to the case where the rotation of the carrier is temporarily stopped or the rotation direction of the carrier is changed midway. As a result, similar to the robot system involved in the first aspect, the time required for aligning the semiconductor substrate as a whole can be shortened.

[0010] In order to achieve the above-mentioned purpose, the third aspect of the present disclosure involves an alignment method for a semiconductor substrate, which is an alignment method for a semiconductor substrate having a mark for circumferential positioning formed on the outer periphery, and the above-mentioned alignment method comprises: detecting the mark of the semiconductor substrate placed on a carrying part and rotating around a rotation axis; determining the position of the mark based on the detection result of the mark without stopping the rotation of the carrying part used to detect the mark; and after determining the position of the mark, rotating the carrying part based on the determined position of the mark to align the semiconductor substrate without stopping the rotation of the carrying part and maintaining the rotation direction of the carrying part.

[0011] In the semiconductor substrate alignment method involved in the third aspect of the present disclosure, as described above, the position of the mark is determined based on the detection result of the mark without stopping the rotation of the carrier for detecting the mark, and after the position of the mark is determined, the carrier is rotated based on the determined position of the mark to align the semiconductor substrate without stopping the rotation of the carrier and maintaining the rotation direction of the carrier. Thus, from the start of the rotation of the carrier for detecting the mark to the mark being located at the alignment position, the carrier is continuously rotated in the same direction without stopping, so that the time for decelerating and accelerating the rotation of the carrier can be shortened compared with the case where the position of the mark is determined after the rotation of the carrier for detecting the mark is stopped, the case where the rotation of the carrier is temporarily stopped, and the case where the rotation direction of the carrier is changed midway. As a result, as with the robot system involved in the first aspect, the time required for aligning the semiconductor substrate as a whole can be shortened.

[0012] According to the present disclosure, as described above, it is possible to provide a robot system, an aligner, and a method for aligning a semiconductor substrate that can shorten the time required for aligning a semiconductor substrate as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a perspective view showing the overall structure of a robot system according to one embodiment of the present disclosure.

[0014] Figure 2 This is a schematic diagram showing a state before the placement section is rotated for detecting a mark in the aligner according to one embodiment of the present disclosure.

[0015] Figure 3 It is a schematic diagram showing a state where a mark and a detection unit overlap in a plan view in the aligner according to one embodiment of the present disclosure.

[0016] Figure 4 It is a diagram for explaining the positioning control and alignment control of the aligner according to one embodiment of the present disclosure.

[0017] Figure 5 This is a schematic diagram showing a state in which a mark is located at an alignment position in the aligner according to one embodiment of the present disclosure.

[0018] Figure 6 This is a schematic diagram for explaining the rotation direction of the placement portion of the aligner according to one embodiment of the present disclosure.

[0019] Figure 7 This is a process of aligning a semiconductor substrate using an aligner according to one embodiment of the present disclosure.

[0020] Figure 8 It is a schematic diagram showing an aligner according to a first modified example of the present disclosure.

[0021] Fig. 9 It is a schematic diagram showing a semiconductor substrate according to a second modification example of the present disclosure.

[0022] Fig.10 It is a schematic diagram for explaining the rotation direction of the placement portion of the aligner according to the third modification example of the present disclosure.

[0023] Fig.11 It is a diagram for explaining the positioning control and alignment control of the aligner according to the fourth modification example of the present disclosure. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present disclosure will be described based on the drawings.

[0025] [Structure of the robot system]

[0026] Reference Figure 1 to Figure 6 , the structure of a robot system 100 involved in one embodiment of the present disclosure is described.

[0027] (Overall structure of the robot system)

[0028] like Figure 1As shown, the robot system 100 includes a substrate transport robot 10 for transporting a semiconductor substrate 110, and an aligner 20 for aligning the semiconductor substrate 110. For the semiconductor substrate 110, a mark 112 for circumferential positioning is formed on a part of the outer peripheral portion 111. Only one mark 112 is provided on the semiconductor substrate 110. The mark 112 is a notch. In addition, the alignment of the semiconductor substrate 110 is performed to correct the action of substrate transport performed by the robot system 100. The action of substrate transport performed by the robot system 100 is, for example, an action of picking up the semiconductor substrate 110 by the robot system 10, an action of placing the semiconductor substrate 110 by the robot system 10, etc.

[0029] The substrate transport robot 10 includes a hand 11 that holds a semiconductor substrate 110 and a robot arm 12 to which the hand 11 is attached at a front end. The substrate transport robot 10 is, for example, a horizontal multi-joint robot.

[0030] The aligner 20 includes a mounting portion 21 that rotates around a rotation axis 90 while mounting a semiconductor substrate 110. The semiconductor substrate 110 is adsorbed to the mounting portion 21 so as to be rotatable while the semiconductor substrate 110 is mounted on the mounting portion 21, or a mounting surface of the mounting portion 21 is processed to generate a frictional force with the semiconductor substrate 110. In this case, the center of gravity or center of the semiconductor substrate 110 mounted on the mounting portion 21 may be offset from the rotation axis 90 of the mounting portion 21.

[0031] The aligner 20 includes a detection unit 22 that detects a mark 112 of a semiconductor substrate 110 that is placed on a placement unit 21 and rotated around a rotation axis 90. The detection unit 22 includes a light emitting unit that emits light for detection, and a light receiving unit that receives light emitted from the light emitting unit. The light emitting unit and the light receiving unit are arranged so as to sandwich the outer peripheral portion 111 of the semiconductor substrate 110. In a state where the semiconductor substrate 110 rotates around the rotation axis 90 by rotating the placement unit 21, the detection unit 22 detects the mark 112 formed on the outer peripheral portion 111 of the semiconductor substrate 110 based on whether the light receiving unit receives light emitted from the light emitting unit. That is, the detection unit 22 is a transmission type sensor. Only one detection unit 22 is provided in the aligner 20. In addition, the detection unit 22 may be, for example, a reflection type sensor, or a camera having an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor).

[0032] The aligner 20 includes a control unit 23 for controlling the rotation of the mounting unit 21. The control unit 23 includes, for example, a processor such as a CPU (Central Processing Unit) and a memory for storing information. The control unit 23 may be a control unit dedicated to the aligner 20 or may also serve as a control unit for controlling the robot 10.

[0033] (Position determination control by control unit)

[0034] like Figure 2 and Figure 3 As shown, the control unit 23 performs position determination control to determine the position P2 of the mark 112 based on the detection result of the mark 112 by the detection unit 22. Specifically, the control unit 23 rotates the mounting unit 21 so that the detection unit 22 detects the mark 112. Figure 4 As shown, the control unit 23 obtains data D of the detection result of the mark 112 by the detection unit 22 while rotating the placing unit 21. The control unit 23 analyzes the data D obtained while rotating the placing unit 21 one by one in the order of acquisition until the position P2 of the mark 112 is determined. That is, the control unit 23 performs the position determination control without stopping the rotation of the placing unit 21 for detecting the mark 112.

[0035] In addition to the uniform rotation portion D1 detected during the uniform rotation of the placing portion 21 in the data D, the control portion 23 also uses the accelerated rotation portion D2 detected during the acceleration of the rotation of the placing portion 21 to perform position determination control. Specifically, after the placing portion 21 starts to rotate, the control portion 23 increases the rotation speed V of the placing portion 21 until it reaches the prescribed rotation speed Vp, and after the rotation speed V of the placing portion 21 reaches the prescribed rotation speed Vp, the placing portion 21 is uniformly rotated until the position P2 of the mark 112 is determined. The control portion 23 continuously obtains the data D from the start of the rotation of the placing portion 21 until the position P2 of the mark 112 is determined. The data D only includes the uniform rotation portion D1 and the accelerated rotation portion D2. In addition, the data D for detecting the mark 112 only needs to be an amount for rotating the placing portion 21 360 degrees, so the rotation angle of the placing portion 21 corresponding to the uniform rotation portion D1 is less than 360 degrees. That is, the control unit 23 performs the position determination control using the accelerated rotation portion D2 in addition to the uniform rotation portion D1 detected while the placing unit 21 is uniformly rotated less than 360 degrees in the data D.

[0036] In addition to the uniform rotation portion D1 in the data D, the control unit 23 performs position determination control using the accelerated rotation portion D2 in which the time interval dT of the linear interpolation for analyzing the data D is adjusted according to the magnitude of the rotation speed of the mounting unit 21. Specifically, in addition to the uniform rotation portion D1 in the data D, the control unit 23 performs position determination control using the accelerated rotation portion D2 in which the time interval dT of the linear interpolation is adjusted to gradually decrease as the rotation speed of the mounting unit 21 increases. That is, for the uniform rotation portion D1 in the data D used for position determination control, linear interpolation is performed at a constant time interval dT. On the other hand, for the accelerated rotation portion D2 in the data D used for position determination control, the time interval dT of the linear interpolation in the accelerated rotation portion D2 is adjusted so that the rotation angle of the mounting unit 21 per unit time corresponding to the uniform rotation portion D1 and the rotation angle of the mounting unit 21 per unit time corresponding to the accelerated rotation portion D2 are substantially equal.

[0037] (Alignment control by control unit)

[0038] The control unit 23 performs alignment control to rotate the mounting unit 21 so as to align the semiconductor substrate 110 based on the determined position P2 of the mark 112. Figure 3 and Figure 5 As shown, after determining the position P2 of the mark 112, the control unit 23 rotates the placement unit 21 until the mark 112 is located at the alignment position P3. The alignment position P3 is the target position of the mark 112 in the alignment control.

[0039] After determining the position P2 of the mark 112, the control unit 23 performs alignment control without stopping the rotation of the placement unit 21 and maintaining the rotation direction of the placement unit 21. Figure 2 , Figure 3 as well as Figure 5 As shown in FIG. 1 , from the time when the placement unit 21 starts rotating in order to detect the mark 112 by the detection unit 22 until the mark 112 is located at the alignment position P3, the control unit 23 continuously rotates the placement unit 21 in the same direction. Figure 2 , Figure 3 as well as Figure 5 , an example in which the placement portion 21 is rotated in the clockwise direction is shown.

[0040] The control unit 23 performs alignment control after the position P2 of the mark 112 is determined and after the mounting unit 21 is rotated at least approximately 180 degrees from the rotation for starting the determination of the position P2 of the mark 112, when performing eccentricity analysis control for analyzing the offset, that is, eccentricity, of the center of gravity or center of the semiconductor substrate 110 relative to the rotation axis 90 of the mounting unit 21. Specifically, when the eccentricity analysis control is required, even after the position P2 of the mark 112 is determined, the alignment control is not performed until the mounting unit 21 is rotated at least approximately 180 degrees required for the eccentricity analysis control from the rotation for starting the determination of the position P2 of the mark 112. In addition, the eccentricity analysis control is performed based on the detection data of approximately 180 degrees of the outer peripheral portion 111 of the semiconductor substrate 110 to detect the center of gravity or center of the semiconductor substrate 110. The information of the center of gravity or center of the semiconductor substrate 110 obtained by the eccentricity analysis control is used to correct the substrate conveying action performed by the robot system 100.

[0041] The control unit 23 determines the rotation direction of the placement unit 21 for detecting the mark 112 by the detection unit 22 based on the relationship between the position P1 of the detection unit 22 relative to the placement unit 21 before the placement unit 21 rotates and the alignment position P3. Figure 6 As shown, the control unit 23 determines the rotation of the carrier 21 for detecting the mark 112 by the detection unit 22 to be a direction close to the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the carrier 21 before the rotation of the carrier 21. That is, when the detection unit 22 is closer to the alignment position P3 of the carrier 21 in the clockwise direction when viewed from the position P1 of the carrier 21 before the rotation of the carrier 21, the carrier 21 is continuously rotated in the clockwise direction from the start of the rotation of the carrier 21 for detecting the mark 112 by the detection unit 22 until the mark 112 is located at the alignment position P3. In other words, Figure 6 In the case where the semiconductor substrate 110 is regarded as a clock, when the position P1 of the detection unit 22 is at the 6 o'clock direction, if the alignment position P3 is within the range from the 0 o'clock direction to the 6 o'clock direction, the carrier 21 is continuously rotated in the counterclockwise direction. In addition, when the detection unit 22 before the carrier 21 rotates is closer to the alignment position P3 in the counterclockwise direction relative to the position P1 of the carrier 21, the carrier 21 is continuously rotated in the counterclockwise direction from the start of the rotation of the carrier 21 for detecting the mark 112 by the detection unit 22 until the mark 112 is at the alignment position P3. In other words, Figure 6In the case where the semiconductor substrate 110 is regarded as a clock, when the position P1 of the detection part 22 is at the 6 o'clock direction, if the alignment position P3 is within the range between the 6 o'clock direction and the 12 o'clock direction, the mounting part 21 is continuously rotated in the clockwise direction.

[0042] [Alignment method of semiconductor substrate]

[0043] Reference Figure 7 , a method for aligning the semiconductor substrate 110 is described.

[0044] like Figure 7 As shown, in step S1 , the mark 112 of the semiconductor substrate 110 placed on the placement portion 21 and rotated around the rotation axis 90 is detected.

[0045] Next, in step S2, the position P2 of the mark 112 is determined based on the detection result of the mark 112 without stopping the rotation of the placing unit 21 for detecting the mark 112. Step S2 is not started after step S1 is completed, but is performed substantially in parallel with step S1.

[0046] Next, in step S3 , after the position P2 of the mark 112 is determined, the placement unit 21 is rotated to align the semiconductor substrate 110 based on the determined position P2 of the mark 112 without stopping the rotation of the placement unit 21 and maintaining the rotation direction of the placement unit 21 .

[0047] [Effects of Embodiment]

[0048] In this embodiment, the following effects can be obtained.

[0049] (Effects of robotic system and aligner)

[0050] In the present embodiment, the control unit 23 performs position determination control without stopping the rotation of the carrier unit 21 for detecting the mark 112, and after determining the position P2 of the mark 112, performs alignment control without stopping the rotation of the carrier unit 21 and maintaining the rotation direction of the carrier unit 21. Thus, from the time when the carrier unit 21 is rotated to detect the mark 112 until the mark 112 is located at the alignment position P3, the carrier unit 21 is not stopped but is continuously rotated in the same direction, so that the time for decelerating and accelerating the rotation of the carrier unit 21 can be shortened compared to the case where the rotation of the carrier unit 21 is temporarily stopped or the rotation direction of the carrier unit 21 is changed midway. As a result, the time required for aligning the semiconductor substrate 110 as a whole can be shortened.

[0051] In addition, in the present embodiment, in addition to the uniform rotation portion D1 detected during the uniform rotation of the placing portion 21 in the data D of the detection result of the detection portion 22 on the mark 112, the control portion 23 also uses the accelerated rotation portion D2 detected during the acceleration of the rotation of the placing portion 21 to perform the position determination control. Thus, the rotation angle range of the placing portion 21 for obtaining the uniform rotation portion D1 required for the position determination control can be narrowed corresponding to the use of the accelerated rotation portion D2 in the position determination control. As a result, compared with the case where the accelerated rotation portion D2 is not used in the position determination control, the time required for the position determination control can be shortened, and thus the time required for the overall alignment of the semiconductor substrate 110 can be further shortened.

[0052] In addition, in the present embodiment, the control unit 23 performs the position determination control using the accelerated rotation portion D2 in addition to the uniform rotation portion D1 detected during the period of uniformly rotating the mounting portion 21 less than 360 degrees in the data D. Thus, the rotation angle range of the mounting portion 21 for obtaining the uniform rotation portion D1 can be narrowed compared to the case where the uniform rotation portion D1 is 360 degrees or more. As a result, the time required for the position determination control can be shortened compared to the case where the uniform rotation portion D1 is 360 degrees or more, and thus the time required for the overall alignment of the semiconductor substrate 110 can be further shortened.

[0053] In addition, in the present embodiment, the control unit 23 performs position determination control by using the accelerated rotation portion D2 in which the time interval of the linear interpolation for analyzing the data D is adjusted according to the magnitude of the rotation speed of the mounting portion 21, in addition to the uniform rotation portion D1 in the data D. Thus, if the time interval dT of the linear interpolation is adjusted for the accelerated rotation portion D2 so that the rotation angle of the mounting portion 21 per unit time corresponding to the uniform rotation portion D1 and the rotation angle of the mounting portion 21 per unit time corresponding to the accelerated rotation portion D2 are substantially equal, the accuracy of the linear interpolation can be made equal between the uniform rotation portion D1 and the accelerated rotation portion D2. As a result, even when the accelerated rotation portion D2 is used in addition to the uniform rotation portion D1 in the position determination control, a decrease in the accuracy of the position determination control can be suppressed.

[0054] In addition, in the present embodiment, the control unit 23 performs position determination control by using the accelerated rotation portion D2 adjusted so that the time interval dT of linear interpolation gradually decreases as the rotation speed of the mounting portion 21 increases, in addition to the uniform rotation portion D1 in the data D. Thus, the time interval dT of linear interpolation can be adjusted for the accelerated rotation portion D2 so that the rotation angle of the mounting portion 21 per unit time corresponding to the uniform rotation portion D1 and the rotation angle of the mounting portion 21 per unit time corresponding to the accelerated rotation portion D2 are substantially equal, and thus the accuracy of linear interpolation can be reliably made equal between the uniform rotation portion D1 and the accelerated rotation portion D2. As a result, even when the accelerated rotation portion D2 is used in addition to the uniform rotation portion D1 in the position determination control, a decrease in the accuracy of the position determination control can be reliably suppressed.

[0055] In addition, in the present embodiment, the control unit 23 determines the rotation direction of the mounting unit 21 for detecting the mark 112 by the detection unit 22 based on the relationship between the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates and the alignment position P3 which is the target position of the mark 112 in the alignment control. Thus, based on the relationship between the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates and the alignment position P3, the rotation direction of the mounting unit 21 can be determined in such a manner that the rotation angle range of the mounting unit 21 until the mark 112 is located at the alignment position P3 becomes smaller in the alignment control performed after the position determination control. As a result, compared with the case where the rotation direction of the mounting unit 21 is determined without considering the relationship between the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates and the alignment position P3, the time required for the alignment control can be shortened, and thus the time required for the overall alignment of the semiconductor substrate 110 can be further shortened.

[0056] In addition, in the present embodiment, the control unit 23 rotates the mounting unit 21 for detecting the mark 112 by the detection unit 22 in a direction approaching the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates. Thus, compared with the case where the mounting unit 21 is rotated in a direction away from the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates, the rotation angle range of the mounting unit 21 until the mark 112 is located at the alignment position P3 can be narrowed in the alignment control performed after the position determination control. As a result, compared with the case where the mounting unit 21 is rotated in a direction away from the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the mounting unit 21 before the mounting unit 21 rotates, the time required for the alignment control can be shortened, and thus the time required for the overall alignment of the semiconductor substrate 110 can be further shortened.

[0057] In addition, in the present embodiment, when performing eccentricity analysis control for analyzing the offset, that is, eccentricity, of the center of gravity or center of the semiconductor substrate 110 relative to the rotation axis 90 of the mounting portion 21, the control portion 23 performs alignment control after the position P2 of the mark 112 is determined and after the mounting portion 21 is rotated at least approximately 180 degrees from the rotation for determining the position P2 of the mark 112. Thus, when eccentricity analysis control is required, even after the position P2 of the mark 112 is determined, alignment control is not performed until the mounting portion 21 is rotated at least approximately 180 degrees required for eccentricity analysis control from the rotation for determining the position P2 of the mark 112, thereby enabling reliable eccentricity analysis control. In addition, the rotation of the mounting portion 21 for position determination control and the rotation of the mounting portion 21 for eccentricity analysis control can be made common, so that the time required for aligning the semiconductor substrate 110 as a whole can be further shortened.

[0058] In addition, in the present embodiment, the mark 112 is a notch. Thus, the time required for aligning the entire semiconductor substrate 110 in which the mark 112 is a notch can be shortened.

[0059] (Effect of Alignment Method for Semiconductor Substrate)

[0060] In the present embodiment, the position P2 of the mark 112 is determined based on the detection result of the mark 112 without stopping the rotation of the placing part 21 for detecting the mark 112, and after the position P2 of the mark 112 is determined, the placing part 21 is rotated based on the determined position P2 of the mark 112 without stopping the rotation of the placing part 21 and maintaining the rotation direction of the placing part 21 to align the semiconductor substrate 110. Thus, the placing part 21 is continuously rotated in the same direction without stopping from the time when the placing part 21 is rotated for detecting the mark 112 until the mark 112 is located at the alignment position P3, so that the time for decelerating and accelerating the rotation of the placing part 21 can be shortened compared with the case where the rotation of the placing part 21 is temporarily stopped or the rotation direction of the placing part 21 is changed midway. As a result, the time required for aligning the semiconductor substrate 110 as a whole can be shortened, similar to the effect of the robot system 100 and the aligner 20.

[0061] [Modifications]

[0062] All points of the embodiments disclosed this time should be considered as examples and not limitations of the present invention. The scope of the present disclosure is not limited by the description of the above embodiments, but is indicated by the claims, and includes the meaning equivalent to the claims and all changes (modifications) within the scope thereof.

[0063] For example, in the above-mentioned embodiment, an example is shown in which only one detection unit 22 is provided in the aligner 20, but the present disclosure is not limited thereto. Figure 8 As shown in the first modified example of the aligner 220, two or more detection units 22 may be provided in the aligner 220. Thus, compared with the case where only one detection unit 22 is provided in the aligner 220, the rotation angle of the placement unit 21 for detecting the mark 112 can be reduced, so the time required for the position determination control can be shortened. Figure 8 , an example is shown in which two detection units 22 are provided at an interval of approximately 180 degrees around the rotation axis 90 .

[0064] In addition, in the above embodiment, an example in which the mark 112 is a notch is shown, but the present disclosure is not limited to this. Fig. 9 As in the semiconductor substrate 210 of the second modified example shown in FIG. 1 , the mark 212 may be a positioning flat edge. Thus, the time required for aligning the entire semiconductor substrate 210 in which the mark 212 is a positioning flat edge can be reliably shortened.

[0065] In addition, in the above-mentioned embodiment, an example is shown in which the control unit 23 performs alignment control after determining the position P2 of the mark 112 and after the mounting unit 21 rotates at least approximately 180 degrees from the rotation for determining the position P2 of the mark 112, while performing eccentricity analysis control for analyzing the offset, that is, eccentricity, of the center of gravity or center of the semiconductor substrate 110 relative to the rotation axis 90 of the mounting unit 21, but the present disclosure is not limited to this. In the present disclosure, the control unit may perform alignment control after determining the position of the mark without performing eccentricity analysis control for analyzing the offset, that is, eccentricity, of the center of gravity or center of the semiconductor substrate relative to the rotation axis of the mounting unit, regardless of whether the mounting unit rotates at least approximately 180 degrees from the rotation for determining the position of the mark.

[0066] In addition, in the above-mentioned embodiment, the control unit 23 determines the rotation direction of the placing unit 21 for detecting the mark 112 by the detection unit 22 to be the direction close to the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the placing unit 21 before the placing unit 21 rotates, but the present disclosure is not limited to this. In the present disclosure, as Fig.10As in the third modified example shown in the figure, if the control unit 23 determines the rotation direction of the carrier 21 for detecting the mark 112 by the detection unit 22 based on the relationship between the position P1 of the detection unit 22 relative to the carrier 21 before the carrier 21 rotates and the alignment position P3, the rotation direction of the carrier 21 may be determined according to which of the three or more regions the alignment position P3 is located, rather than determining the rotation direction of the carrier 21 according to which of the two regions the alignment position P3 is located, as in the case where the rotation direction of the carrier 21 is determined as a direction close to the alignment position P3 when viewed from the position P1 of the detection unit 22 relative to the carrier 21 before the carrier 21 rotates. In addition, in Fig.10 In the third modified example shown in FIG. 1 , the rotation direction of the placement unit 21 is determined according to which of the four regions the alignment position P3 of the placement unit 21 is located. Fig.10 In the embodiment, when the semiconductor substrate 110 is regarded as a clock, when the position P1 of the detection unit 22 is in the 6 o'clock direction, if the alignment position P3 is in the range between the 0 o'clock direction and the 4 o'clock direction, or in the range between the 6 o'clock direction and the 8 o'clock direction, the carrier 21 is continuously rotated in the counterclockwise direction, and if the alignment position P3 of the semiconductor substrate 110 is in the range between the 4 o'clock direction and the 6 o'clock direction, or in the range between the 8 o'clock direction and the 12 o'clock direction, or in the range between the 4 o'clock direction and the 6 o'clock direction, the carrier 21 is continuously rotated in the clockwise direction.

[0067] In addition, in the above embodiment, an example is shown in which the control unit 23 determines the rotation direction of the placing unit 21 for detecting the mark 112 by the detection unit 22 based on the relationship between the position P1 of the detection unit 22 relative to the placing unit 21 before the placing unit 21 rotates and the alignment position P3, but the present disclosure is not limited to this. In the present disclosure, the control unit may determine the rotation direction of the placing unit for detecting the mark by the detection unit without based on the relationship between the position of the detection unit relative to the placing unit before the placing unit rotates and the alignment position.

[0068] In addition, in the above-mentioned embodiment, an example is shown in which the control unit 23 performs position determination control by using the accelerated rotation portion D2 adjusted so that the time interval dT of the linear interpolation gradually decreases as the rotation speed of the mounting unit 21 increases, in addition to the uniform rotation portion D1 in the data D. That is, an example is shown in which the control unit 23 performs position determination control by using the accelerated rotation portion D2 adjusted so that the time interval dT of the linear interpolation for analyzing the data D is gradually decreased according to the magnitude of the rotation speed of the mounting unit 21, in addition to the uniform rotation portion D1 in the data D, but the present disclosure is not limited thereto. In the present disclosure, in addition to the uniform rotation portion in the data, the control unit may perform position determination control by using the accelerated rotation portion not adjusted so that the time interval of the linear interpolation for analyzing the data is gradually decreased as the rotation speed of the mounting unit increases. That is, in addition to the uniform rotation portion in the data, the control unit may perform position determination control by using the accelerated rotation portion not adjusting the time interval of the linear interpolation for analyzing the data according to the magnitude of the rotation speed of the mounting unit.

[0069] In addition, in the above embodiment, the data D only includes the uniform rotation part D1 and the accelerated rotation part D2, and the control unit 23 uses the uniform rotation part D1 and the accelerated rotation part D2 in the data D to perform position determination control, but the present disclosure is not limited to this. In the present disclosure, Fig.11 As shown in the fourth modification example, when the data D includes the decelerated rotation portion D3 in addition to the uniform rotation portion D1 and the accelerated rotation portion D2, the control unit 23 may use the decelerated rotation portion D3 detected during the period of decelerating the rotation of the placement unit 21 in addition to the uniform rotation portion D1 and the accelerated rotation portion D2 in the data D to perform the position determination control. Thus, when the data D includes the decelerated rotation portion D3 in addition to the uniform rotation portion D1 and the accelerated rotation portion D2, the rotation angle range of the placement unit 21 for obtaining the uniform rotation portion D1 required for the position determination control can be narrowed corresponding to the use of the decelerated rotation portion D3 in the position determination control. As a result, when the data D includes the decelerated rotation portion D3, the time required for the position determination control can be shortened compared to the case where the decelerated rotation portion D3 is not used in the position determination control, and thus the time required for the overall alignment of the semiconductor substrate 110 can be further shortened.

[0070] In addition, in the above-mentioned embodiment, an example is shown in which the control unit 23 performs position determination control using the accelerated rotation portion D2 in addition to the uniform rotation portion D1 detected during the period when the placing unit 21 is uniformly rotated less than 360 degrees in the data D, but the present disclosure is not limited to this. In the present disclosure, in addition to the uniform rotation portion detected during the period when the placing unit is uniformly rotated more than 360 degrees in the data, the control unit may also perform position determination control using the accelerated rotation portion.

[0071] In addition, in the above-mentioned embodiment, an example is shown in which the control unit 23 performs position determination control using the accelerated rotation portion D2 detected during the period of accelerating the rotation of the placing unit 21 in addition to the uniform rotation portion D1 detected during the period of uniform rotation of the placing unit 21 in the data D of the detection result of the detection unit 22 for the mark 112, but the present disclosure is not limited to this. In the present disclosure, the control unit may perform position determination control using only the uniform rotation portion detected during the period of uniform rotation of the placing unit, instead of using the accelerated rotation portion detected during the period of accelerating the rotation of the placing unit in the data of the detection result of the detection unit for the mark.

[0072] In addition, in the above embodiment, an example is shown in which the detection unit 22 detects the mark 112 of the semiconductor substrate 110, and the control unit 23 determines the position P2 of the mark 112 based on the detection result of the mark 112 by the detection unit 22, but the present disclosure is not limited to this. In the present disclosure, it is also possible to configure that the detection unit detects a defect of the semiconductor substrate in addition to the mark of the semiconductor substrate, and the control unit determines the position of the defect based on the detection result of the defect by the detection unit in addition to determining the position of the mark based on the detection result of the mark by the detection unit.

[0073] The functions of the elements disclosed in this specification can be performed using circuits or processing circuits, which include general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), existing circuits, and / or combinations thereof that are configured or programmed to perform the disclosed functions. The processor includes transistors and other circuits and is therefore considered to be a processing circuit or circuit. In the present disclosure, a circuit, unit, or mechanism is hardware that performs the listed functions, or is hardware that is programmed to perform the listed functions. The hardware may be the hardware disclosed in this specification, or it may be other known hardware that is programmed or configured to perform the listed functions. In the case where the hardware is a processor that is considered to be a type of circuit, the circuit, mechanism, or unit is a combination of hardware and software, and the software is used to constitute the hardware and / or processor.

[0074] [Way]

[0075] It should be understood by those skilled in the art that the above-described exemplary embodiments are specific examples of the following aspects.

[0076] (Item 1)

[0077] A robot system, characterized in that

[0078] The above-mentioned robot system has:

[0079] a substrate transport robot that transports a semiconductor substrate having a mark formed on the outer periphery for positioning in the circumferential direction; and

[0080] an aligner, used for aligning the semiconductor substrate,

[0081] The above aligner has:

[0082] A mounting portion that rotates around a rotation axis while mounting the semiconductor substrate;

[0083] a detection unit that detects the mark of the semiconductor substrate that is placed on the placement unit and rotated around the rotation axis; and

[0084] a control unit that performs position determination control and alignment control, wherein the position determination control determines the position of the mark based on the detection result of the mark by the detection unit, and the alignment control rotates the mounting unit to align the semiconductor substrate based on the determined position of the mark,

[0085] The control unit performs the position determination control without stopping the rotation of the carrier unit for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the carrier unit and maintaining the rotation direction of the carrier unit.

[0086] (Item 2)

[0087] The robot system according to item 1 is characterized in that:

[0088] The control unit performs the position determination control using an accelerated rotation portion detected during the period of accelerating the rotation of the placing portion in addition to the uniform rotation portion detected during the period of uniform rotation of the placing portion in the data of the detection result of the mark by the detection unit.

[0089] (Item 3)

[0090] The robot system according to item 2 is characterized in that:

[0091] The control unit performs the position determination control using the accelerated rotation portion in addition to the uniform rotation portion detected during the uniform rotation of the placing unit less than 360 degrees in the data.

[0092] (Item 4)

[0093] The robot system according to item 2 or 3, characterized in that:

[0094] The control unit performs the position determination control using a decelerated rotation portion detected during the deceleration of the rotation of the placement unit in addition to the uniform rotation portion and the accelerated rotation portion in the data.

[0095] (Item 5)

[0096] The robot system according to any one of items 2 to 4, characterized in that:

[0097] The control unit performs the position determination control by using the accelerated rotation portion obtained by adjusting a time interval of the linear interpolation for analyzing the data according to a rotation speed of the placement unit in addition to the uniform rotation portion in the data.

[0098] (Item 6)

[0099] The robot system according to item 5 is characterized in that:

[0100] The control unit performs the position determination control by using, in addition to the uniform rotation portion in the data, the accelerated rotation portion adjusted so that the time interval of the linear interpolation gradually decreases as the rotation speed of the placement unit increases.

[0101] (Item 7)

[0102] The robot system according to any one of items 1 to 6, characterized in that:

[0103] The control unit determines a rotation direction of the placement unit for detecting the mark by the detection unit based on a relationship between a position of the detection unit relative to the placement unit before the placement unit rotates and an alignment position, which is a target position of the mark in the alignment control.

[0104] (Item 8)

[0105] The robot system according to item 7 is characterized in that:

[0106] The control unit determines a rotation direction of the placement unit for detecting the mark by the detection unit to be a direction close to the alignment position when viewed from a position of the detection unit relative to the placement unit before the placement unit is rotated.

[0107] (Item 9)

[0108] The robot system according to any one of items 1 to 8, characterized in that:

[0109] In the case of eccentricity analysis control for analyzing the displacement, i.e., eccentricity, of the center of gravity or center of the semiconductor substrate relative to the rotation axis of the supporting portion, the control portion performs the alignment control after the position of the mark is determined and after the supporting portion has rotated at least approximately 180 degrees from the rotation started for determining the position of the mark.

[0110] (Item 10)

[0111] The robot system according to any one of items 1 to 9, characterized in that:

[0112] The above mark is a notch.

[0113] (Item 11)

[0114] The robot system according to any one of items 1 to 9, characterized in that:

[0115] The above mark is the positioning flat edge.

[0116] (Item 12)

[0117] An aligner is an aligner for aligning a semiconductor substrate having a mark formed on the outer periphery for circumferential positioning, characterized in that:

[0118] The above aligner has:

[0119] A mounting portion that rotates around a rotation axis while mounting the semiconductor substrate;

[0120] a detection unit that detects the mark of the semiconductor substrate that is placed on the placement unit and rotated around the rotation axis; and

[0121] a control unit that performs position determination control and alignment control, wherein the position determination control determines the position of the mark based on the detection result of the mark by the detection unit, and the alignment control rotates the mounting unit to align the semiconductor substrate based on the determined position of the mark,

[0122] The control unit performs the position determination control without stopping the rotation of the carrier unit for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the carrier unit and maintaining the rotation direction of the carrier unit.

[0123] (Item 13)

[0124] A method for aligning a semiconductor substrate is a method for aligning a semiconductor substrate having a mark formed on the outer periphery for circumferential positioning, characterized in that:

[0125] The semiconductor substrate alignment method comprises:

[0126] detecting the mark of the semiconductor substrate placed on a placement portion and rotating about a rotation axis;

[0127] without stopping the rotation of the placing portion for detecting the mark, determining the position of the mark based on the detection result of the mark; and

[0128] After the position of the mark is determined, the placement unit is rotated based on the determined position of the mark to align the semiconductor substrate without stopping the rotation of the placement unit and maintaining the rotation direction of the placement unit.

Claims

1. A robot system, characterized in that: The robot system comprises: a substrate transport robot that transports a semiconductor substrate having a mark formed on the outer periphery for positioning in the circumferential direction; and an aligner, for aligning the semiconductor substrate, The aligner has: A mounting portion that rotates around a rotation axis while mounting the semiconductor substrate; a detection unit that detects the mark of the semiconductor substrate that is placed on the placement unit and rotates around the rotation axis; as well as a control unit that performs position determination control and alignment control, wherein the position determination control determines the position of the mark based on the detection result of the mark by the detection unit, and the alignment control rotates the mounting unit to align the semiconductor substrate based on the determined position of the mark, The control unit performs the position determination control without stopping the rotation of the carrier unit for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the carrier unit and maintaining the rotation direction of the carrier unit.

2. The robot system according to claim 1, characterized in that: The control unit performs the position determination control using an accelerated rotation portion detected during the accelerated rotation of the placing portion in addition to the uniform rotation portion detected during the uniform rotation of the placing portion in the data of the detection result of the mark by the detection unit.

3. The robot system according to claim 2, characterized in that: The control unit performs the position determination control using the accelerated rotation portion in addition to the uniform rotation portion detected during the uniform rotation of the placement unit less than 360 degrees in the data.

4. The robot system according to claim 2, characterized in that: The control unit performs the position determination control using a decelerated rotation portion detected during deceleration of the rotation of the placement unit in addition to the uniform rotation portion and the accelerated rotation portion in the data.

5. The robot system according to claim 2, characterized in that: The control unit performs the position determination control by using the accelerated rotation portion in which the time interval of the linear interpolation for analyzing the data is adjusted according to the magnitude of the rotation speed of the placement unit, in addition to the uniform rotation portion in the data.

6. The robot system according to claim 5, characterized in that: The control unit performs the position determination control using, in addition to the uniform rotation portion in the data, the accelerated rotation portion adjusted so that the time interval of the linear interpolation gradually decreases as the rotation speed of the placement unit increases.

7. The robot system according to claim 1, characterized in that: The control unit determines a rotation direction of the placement unit for detecting the mark by the detection unit based on a relationship between a position of the detection unit relative to the placement unit before the placement unit rotates and an alignment position which is a target position of the mark in the alignment control.

8. The robot system according to claim 7, characterized in that: The control unit determines the rotation direction of the placement unit for the detection unit to detect the mark as a direction close to the alignment position when viewed from the position of the detection unit relative to the placement unit before the placement unit rotates.

9. The robot system according to claim 1, characterized in that: In the case of eccentricity analysis control for analyzing the offset, i.e., eccentricity, of the center of gravity or center of the semiconductor substrate relative to the rotation axis of the supporting portion, the control portion performs the alignment control after the position of the mark is determined and after the supporting portion has rotated at least approximately 180 degrees from the rotation started for determining the position of the mark.

10. The robot system according to claim 1, characterized in that: The mark is a notch.

11. The robot system according to claim 1, characterized in that: The mark is the positioning flat edge.

12. An aligner for aligning a semiconductor substrate having a mark formed on the outer periphery for circumferential positioning, characterized in that: The aligner has: A mounting portion that rotates around a rotation axis while mounting the semiconductor substrate; a detection unit that detects the mark of the semiconductor substrate that is placed on the placement unit and rotates around the rotation axis; as well as a control unit that performs position determination control and alignment control, wherein the position determination control determines the position of the mark based on the detection result of the mark by the detection unit, and the alignment control rotates the mounting unit to align the semiconductor substrate based on the determined position of the mark, The control unit performs the position determination control without stopping the rotation of the carrier unit for detecting the mark, and after determining the position of the mark, performs the alignment control without stopping the rotation of the carrier unit and maintaining the rotation direction of the carrier unit.

13. A method for aligning a semiconductor substrate, wherein a mark for circumferential positioning is formed on the outer periphery of the semiconductor substrate, characterized in that: The semiconductor substrate alignment method comprises: detecting the mark of the semiconductor substrate placed on a placement portion and rotated about a rotation axis; determining the position of the mark based on the detection result of the mark without stopping the rotation of the placing portion for detecting the mark; as well as After the position of the mark is determined, the placement unit is rotated based on the determined position of the mark to align the semiconductor substrate without stopping the rotation of the placement unit and maintaining the rotation direction of the placement unit.

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