Integrated packaging equipment for chip production

Abstract

The invention relates to the field of chip packaging, and discloses integrated packaging equipment for chip production, which comprises an injection molding machine and a conveying device, and is characterized in that the injection molding machine comprises a discharge end, and the conveying device is used for conveying a to-be-packaged chip below the discharge end of the injection molding machine; the chip comprises a base and an FC chip, and a gap is formed between the base and the FC chip; a die is arranged below the discharging end, the top of the die is slidably arranged at the lower end of the discharging end in a sleeving mode, and the die is driven by a linear driving piece to move up and down. According to the invention, the chip needing to be processed is conveyed to the position below the discharging end through the conveying device, then the mold is driven to descend through the linear driving piece, the FC chip is wrapped by the mold, then the injection molding material is injected into the mold through the injection molding machine, the mold is filled with the injection molding material, and thus a complete filling material is formed outside the FC chip; and compared with the prior art, the two processes of dispensing and covering part installation are more efficient, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to an integrated packaging device for chip production. Background Art

[0002] FC-BGA (Flip Chip Ball Grid Array) is a packaging format called flip chip ball grid array, which is also the main form of graphics acceleration chip; The general process flow of FC packaging is: align and mount the FC chip with chip bumps on the bottom chip or substrate; after the layout is completed, bond through reflow soldering or hot compression bonding process (wafer bonder); after the interconnection is formed, drip the bottom filler around the chip, and the bottom filler will fill the gap between the chip and the substrate through capillary action; after the filling is completed, place the assembly in a curing oven to cure the bottom filler. The general structure of the obtained FC package is as follows Fig.11 As shown, it includes several main parts such as chip, interconnection structure, substrate and bottom filler. In order to ensure the safety during transportation or use, a cover may be installed on the outside of the chip to achieve the purpose of protection. In the prior art, after the bonding process is completed, in order to ensure the connection strength between the FC chip and the base, enhance heat dissipation and shock absorption, the gap around the FC chip and the base is filled by a dispensing process (that is, Fig.11 After completing this process, a cover is usually installed on the FC chip to achieve the purpose of protection. Therefore, two steps are required to complete it, and there is still room for improvement in production efficiency. Summary of the invention

[0003] In view of the deficiencies of the prior art, the present invention provides an integrated packaging device for chip production to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: An integrated packaging device for chip production, comprising an injection molding machine and a conveying device, wherein the injection molding machine comprises a discharge end, and the conveying device is used to deliver the chip to be packaged below the discharge end of the injection molding machine; The chip comprises a base and an FC chip, and a gap is provided between the base and the FC chip; Below the discharge end there is: A mold, the top of which is slidably sleeved at the lower end of the discharge end and moves up and down driven by a linear drive member, wherein the discharge end is connected to the mold cavity of the mold; and The mold is driven by the linear drive member to move above the chip to cover the FC chip, and the bottom of the mold is against the surface of the base. The injection molding machine injects the injection material into the interior of the mold so that the injection material wraps the entire FC chip and fills the gap between the base and the FC chip. The injection material solidifies to form a covering member. The conveying device transports the chip to be processed to the bottom of the discharge end, and then drives the mold down through the linear drive component so that the mold wraps the FC chip. The injection molding machine then injects the injection molding material into the mold, so that the injection molding material fills the mold, thereby forming a complete filling material outside the FC chip to achieve the purpose of heat dissipation, shock absorption and protection. Compared with the existing technology, the two processes of dispensing and installing covering parts are more efficient, thereby improving the processing efficiency.

[0005] Preferably, at least one pushing member is arranged around the mold, and the pushing member is slidably installed on the side of the mold, and a second telescopic member is installed on the top of the pushing member, and the second telescopic member is used to drive the pushing member to move toward the mold and drive the injection molding material inside the mold to be squeezed into the gap between the base and the FC chip. The second telescopic member drives the pushing member to move toward the mold and drives the injection molding material inside the mold to be squeezed into the gap between the base and the FC chip, so that hollowing phenomenon will not occur in the gap between the base and the FC chip.

[0006] Preferably, at least one open groove is arranged around the mold, and the pushing member has an extension portion, which is inserted into the interior of the open groove, and the injection material flows into the open groove to form an extrusion portion.

[0007] Preferably, the injection molding material flows into the gap between the base and the FC chip to form a cushion portion. When the extension portion of the pushing member pushes the extrusion portion to move toward the middle of the chip, the cushion portion expands toward the base and the FC chip. The pushing member is pushed toward the middle of the chip by the second telescopic member, so that the extension portion pushes the extrusion portion, thereby allowing the extrusion portion to move toward the middle of the chip and the cushion portion to expand toward the base and the FC chip, thereby providing a stronger connection strength between the base and the FC chip and a tighter connection.

[0008] Preferably, the injection molding machine also includes a motor and a hot melt box, a feed port is provided on the top of the hot melt box, the discharge end is connected to one end of the hot melt box, a base plate is installed at the bottom of the injection molding machine, and a conveying device is installed above the base plate.

[0009] Preferably, the conveying device includes two transmission rollers and a conveyor belt installed on the two transmission rollers, wherein a driving device is installed at one end of one of the transmission rollers, a support plate is provided in the middle of the conveyor belt, and both ends of the support plate are connected to the bottom plate through connecting rods. The transmission rollers are driven to rotate by the driving device, thereby allowing the conveyor belt to move, thereby achieving the effect of transporting parts.

[0010] Preferably, the support plate is a box structure with a radiator installed at the bottom, a fan installed on the top of the radiator, the fan is fixed at the bottom of the support plate, a plurality of ventilation holes are opened on the top of the support plate, and the fan generates cold air to blow toward the conveyor belt above to cool the cover after injection molding.

[0011] Preferably, a connecting plate is fixedly connected to the top of the mold, a third telescopic member is connected to the top of the connecting plate, and the third telescopic member is connected to a bracket of the injection molding machine via a supporting rod.

[0012] Preferably, a sleeve is connected to the top of the mold, the sleeve is slidably connected to the bottom of the discharge end, and a sealing ring is connected between the sleeve and the outer wall of the discharge end.

[0013] Preferably, at least one limit rod is provided below the discharge end, and the limit rod is used to fix the chip to a specific position. One end of the limit rod is connected to a rotating sleeve, and a fixing rod is provided in the middle of the rotating sleeve. The chip can be placed in an accurate processing position through the limit rod.

[0014] Compared with the prior art, the present invention provides an integrated packaging device for chip production, which has the following beneficial effects: 1. The present invention uses a conveying device to transport the chip to be processed to the bottom of the discharge end, and then drives the mold down through a linear drive component to make the mold wrap the FC chip. Then the injection molding machine injects the injection molding material into the mold, so that the injection molding material fills the mold, thereby forming a complete filling material outside the FC chip to achieve the purpose of heat dissipation, shock absorption and protection. Compared with the prior art, the two processes of dispensing and installing the cover are more efficient, and the processing efficiency is improved compared with the prior art.

[0015] 2. The present invention drives the pusher to move toward the mold through the second telescopic member, driving the injection molding material inside the mold to be squeezed into the gap between the base and the FC chip, so that there will be no hollowing phenomenon in the gap between the base and the FC chip.

[0016] 3. The present invention pushes the member toward the middle of the chip through the second telescopic member, so that the extension part pushes the extrusion part, so that when the extrusion part moves toward the middle of the chip, the pad part expands toward the base and the FC chip, thereby making the connection strength between the base and the FC chip stronger and the connection tighter.

[0017] 4. The present invention sets the support plate as a box structure, a radiator is installed at the bottom, a fan is installed on the top of the radiator, the fan is fixed at the bottom of the support plate, and a plurality of ventilation holes are opened on the top of the support plate. The fan generates cold wind to blow toward the conveyor belt above to cool down the injection-molded cover, so that the cover can be quickly solidified and the effect of efficient demolding can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a stereogram of the present invention; Figure 2 A three-dimensional diagram of the injection molding machine of the present invention; Figure 3 It is an assembly diagram of the base and FC chip of the present invention; Figure 4 A three-dimensional diagram of the mold and the pusher of the present invention; Figure 5 It is a schematic diagram of the movement of the pusher of the present invention; Figure 6 It is a structural diagram of the support plate and the radiator of the present invention; Figure 7 It is a structural diagram of the limiting rod of the present invention; Figure 8 This is a chip structure diagram after processing of the present invention; Fig. 9 It is a structural diagram of the pusher and chip of the present invention; Fig.10 A partial cross-sectional view of a cover of the present invention; Fig.11 It is a prior art schematic diagram of the FC chip of the present invention.

[0019] In the figure: 100, hot melt box; 110, motor; 120, feed port; 130, bottom plate; 140, discharge end; 210, conveyor belt; 220, transmission roller; 230, driving device; 300, chip; 310, base; 320, FC chip; 330, cover; 331, pad; 332, extrusion part; 410, mold; 420, sleeve; 430, connecting plate; 440, third telescopic member; 450, support rod; 510, push member; 520, open slot; 530, second telescopic member; 610, support plate; 620, ventilation hole; 630, radiator; 640, fan; 710, limit rod; 720, rotating sleeve; 730, fixing rod. DETAILED DESCRIPTION Example

[0020] See also Figure 1-3 , this embodiment discloses an integrated packaging device for chip production, including an injection molding machine and a conveying device, the injection molding machine includes a discharge end 140, and the conveying device is used to deliver the chip 300 to be packaged to the bottom of the discharge end 140 of the injection molding machine; The chip 300 includes a base 310 and a FC chip 320 , and a gap is formed between the base 310 and the FC chip 320 ; Below the discharge end 140 there are: The mold 410, whose top is slidably sleeved on the lower end of the discharge end 140, moves up and down driven by the linear drive member, and the discharge end 140 is connected with the mold cavity of the mold 410; The mold 410 is driven by the linear drive member to move above the chip 300 to cover the FC chip 320, and the bottom of the mold 410 abuts against the surface of the base 310. The injection molding machine injects the injection material into the mold 410 so that the injection material wraps the entire FC chip 320 and fills the gap between the base 310 and the FC chip 320. The injection material solidifies to form a cover 330. It should be noted that the above-mentioned linear drive component can be an electric telescopic rod, a hydraulic telescopic rod, a pneumatic telescopic rod or an electric slide rail and any component with a linear pushing effect. The chip 300 to be processed is transported to the bottom of the discharge end 140 through a conveying device, and then the mold 410 is driven down by the linear drive component to make the mold 410 wrap the FC chip 320. Then the injection molding machine injects the injection molding material into the mold 410, so that the injection molding material is filled into the mold 410, so that a complete filling material is formed outside the FC chip 320, so as to achieve the purpose of heat dissipation, shock absorption and protection. Compared with the prior art, the two processes of dispensing and installing the cover 330 are more efficient, thereby improving the processing efficiency.

[0021] Continue reading Figure 4 As an optimized embodiment, at least one pushing member 510 is arranged around the mold 410. The pushing member 510 is slidably installed on the side of the mold 410, and a second telescopic member 530 is installed on the top thereof. The second telescopic member 530 can be an electric telescopic rod, a hydraulic telescopic rod, a pneumatic telescopic rod or an electric slide rail and any component with a linear pushing effect. The second telescopic member 530 is used to drive the pushing member 510 to move toward the mold 410 and drive the injection molding material inside the mold 410 to be squeezed into the gap between the base 310 and the FC chip 320, so that there will be no hollowing phenomenon in the gap between the base 310 and the FC chip 320.

[0022] Continue reading Figure 5 As an optimized embodiment, at least one open groove 520 is disposed around the mold 410, and the pusher 510 has an extension portion 511, which is inserted into the interior of the open groove 520, and the injection material flows into the open groove 520 to form the extrusion portion 332; The injection molding material flows into the gap between the base 310 and the FC chip 320 to form a pad 331; Through the above scheme, after the injection molding is completed, an extrusion portion 332 is formed on at least one side of the cover 330. At this time, the pusher 510 is pushed toward the middle of the chip 300 by the second telescopic member 530, so that the extension portion 511 pushes the extrusion portion 332. When the extrusion portion 332 moves toward the middle of the chip 300, the pad portion 331 expands toward the base 310 and the FC chip 320, so that the base 310 and the FC chip 320 have a stronger connection strength and a tighter connection.

[0023] like Figure 1 As shown, the injection molding machine further includes a motor 110 and a hot melt box 100, a feed port 120 is provided at the top of the hot melt box 100, a discharge port 140 is connected to one end of the hot melt box 100, a bottom plate 130 is installed at the bottom of the injection molding machine, and a conveying device is installed above the bottom plate 130; The conveying device includes two transmission rollers 220 and a conveyor belt 210 installed on the two transmission rollers 220, wherein a driving device 230 is installed at one end of one of the transmission rollers 220, and a support plate 610 is arranged in the middle of the conveyor belt 210, and both ends of the support plate 610 are connected to the bottom plate 130 through connecting rods (not shown in the figure). The transmission rollers 220 are driven to rotate by the driving device 230, so that the conveyor belt 210 moves, thereby achieving the effect of transporting parts.

[0024] Continue reading Figure 6 As an optimized embodiment, the support plate 610 is a box structure, and a radiator 630 is installed at the bottom thereof. The radiator 630 is composed of a copper tube and cooling fins forming a closed loop. The copper tube is filled with coolant. A fan 640 is installed on the top of the radiator 630. The fan 640 is fixed at the bottom of the support plate 610. A plurality of ventilation holes 620 are opened on the top of the support plate 610. The fan 640 generates cold wind that blows toward the conveyor belt 210 above to cool down the injection-molded cover 330.

[0025] like Figure 1 As shown, a connecting plate 430 is fixedly connected to the top of the mold 410, and a third telescopic member 440 is connected to the top of the connecting plate 430. The third telescopic member 440 can be an electric telescopic rod, a hydraulic telescopic rod, a pneumatic telescopic rod or an electric slide rail and any component with a linear pushing effect. The third telescopic member 440 is connected to the bracket of the injection molding machine through a support rod 450; The top of the mold 410 is connected with a sleeve 420 , the sleeve 420 is slidably connected with the bottom of the discharge end 140 , and a sealing ring is connected between the sleeve 420 and the outer wall of the discharge end 140 .

[0026] Continue reading Figure 7At least one limiting rod 710 is provided below the discharge end 140, and the limiting rod 710 is used to fix the chip 300 to a specific position. One end of the limiting rod 710 is connected to a rotating sleeve 720, and a fixing rod 730 is sleeved in the middle of the rotating sleeve 720. The limiting rod 710 can keep the chip 300 in an accurate processing position; Continue reading Figure 8-10 As an optimized embodiment, in order to further improve the thermal conductivity between the cover 330 and the outside world, a plurality of grooves may be provided on the top of the mold 410 so that a plurality of heat dissipation fins are formed on the top of the cover 330 , thereby improving the overall heat dissipation efficiency of the chip 300 .

Claims

1. An integrated packaging device for chip production, characterized in that: It comprises an injection molding machine and a conveying device, the injection molding machine comprising a discharge end (140), and the conveying device is used to deliver the chip (300) to be packaged to the bottom of the discharge end (140) of the injection molding machine; The chip (300) comprises a base (310) and an FC chip (320), and a gap is provided between the base (310) and the FC chip (320); Below the discharge end (140) there is: A mold (410) whose top is slidably sleeved at the lower end of the discharge end (140) and moves up and down driven by a linear drive member, wherein the discharge end (140) is connected to the mold cavity of the mold (410); and The mold (410) is driven by the linear drive member to move above the chip (300) to cover the FC chip (320), and the bottom end of the mold (410) is against the surface of the base (310). The injection molding machine injects the injection material into the mold (410) so that the injection material wraps the entire FC chip (320) and fills the gap between the base (310) and the FC chip (320). The injection material solidifies to form a covering member (330).

2. The integrated packaging equipment for chip production according to claim 1, characterized in that: At least one pushing member (510) is arranged around the mold (410); the pushing member (510) is slidably mounted on a side of the mold (410); a second telescopic member (530) is mounted on the top of the pushing member; the second telescopic member (530) is used to drive the pushing member (510) to move toward the mold (410) and drive the injection molding material inside the mold (410) to be squeezed into the gap between the base (310) and the FC chip (320).

3. The integrated packaging equipment for chip production according to claim 2, characterized in that: At least one open groove (520) is arranged around the mold (410), and the pushing member (510) has an extension portion (511). The extension portion (511) is inserted into the interior of the open groove (520), and the injection material flows into the open groove (520) to form an extrusion portion (332).

4. The integrated packaging equipment for chip production according to claim 3, characterized in that: The injection material flows into the gap between the base (310) and the FC chip (320) to form a cushion portion (331); when the extension portion (511) of the pusher (510) pushes the extrusion portion (332) to move toward the middle of the chip (300), the cushion portion (331) expands toward the base (310) and the FC chip (320).

5. The integrated packaging equipment for chip production according to claim 1, characterized in that: The injection molding machine further comprises a motor (110) and a hot melt box (100); a feed port (120) is arranged at the top of the hot melt box (100); the discharge port (140) is connected to one end of the hot melt box (100); a bottom plate (130) is installed at the bottom of the injection molding machine; a conveying device is installed above the bottom plate (130).

6. The integrated packaging equipment for chip production according to claim 5, characterized in that: The conveying device comprises two transmission rollers (220) and a conveyor belt (210) mounted on the two transmission rollers (220), wherein a driving device (230) is mounted on one end of one of the transmission rollers (220), a support plate (610) is arranged in the middle of the conveyor belt (210), and both ends of the support plate (610) are connected to a bottom plate (130) via connecting rods.

7. The integrated packaging equipment for chip production according to claim 6, characterized in that: The support plate (610) is a box structure, a radiator (630) is installed at the bottom of the support plate (610), a fan (640) is installed at the top of the radiator (630), the fan (640) is fixed at the bottom of the support plate (610), a plurality of ventilation holes (620) are opened at the top of the support plate (610), and the fan (640) generates cold air that blows toward the conveyor belt (210) above, thereby cooling the cover (330) that has been completed by injection molding.

8. The integrated packaging equipment for chip production according to claim 7, characterized in that: A connecting plate (430) is fixedly connected to the top of the mold (410), a third telescopic member (440) is connected to the top of the connecting plate (430), and the third telescopic member (440) is connected to a bracket of an injection molding machine via a support rod (450).

9. The integrated packaging equipment for chip production according to claim 8, characterized in that: The top of the mold (410) is connected to a sleeve (420), the sleeve (420) is slidably connected to the bottom of the discharge end (140), and a sealing ring is connected between the sleeve (420) and the outer wall of the discharge end (140).

10. An integrated packaging device for chip production according to any one of claims 1 to 9, characterized in that: At least one limiting rod (710) is provided below the discharge end (140), and the limiting rod (710) is used to fix the chip (300) to a specific position. One end of the limiting rod (710) is connected to a rotating sleeve (720), and a fixing rod (730) is provided in the middle of the rotating sleeve (720).

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