Surface profile detection device and method

Abstract

The invention relates to a surface profile detection device and method, and the device comprises a light source unit which generates and emits first optical radiation, and the first optical radiation is linear wide-spectrum optical radiation; the optical radiation emitting unit disperses and focuses the first optical radiation so as to focus obtained second optical radiation with different wavelengths to different height positions of the measured object; the optical radiation receiving unit receives the third optical radiation with different wavelengths reflected by the measured object, and disperses and focuses the third optical radiation with different wavelengths to obtain fourth optical radiation with different wavelengths; the spectral analysis unit disperses and focuses the fourth optical radiation with different wavelengths to obtain fifth optical radiation with different wavelengths; and the signal processing unit performs surface profile detection on the detected object based on the wavelength of the target light radiation to obtain the surface profile height of the detected object. In this way, the technical problem that in the prior art, measurement errors of the surface contour height or contour thickness of an object can be caused can be solved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical non-contact measurement, and in particular to a surface profile detection device and method. Background Art

[0002] When measuring the height or thickness of the surface contour of an object, the contact scanning measurement solution often causes some minor damage to the surface of the object being measured and has low efficiency. The optical non-contact measurement solution does not need to contact the object being measured, thus avoiding damage to the surface of the object being measured during the measurement process and improving the measurement efficiency.

[0003] However, the existing optical non-contact measurement scheme is to focus the dispersed light radiation of different wavelengths to different heights in the normal direction of the measured object, and receive and determine the wavelength with the highest intensity in the reflected light radiation to measure the height or thickness of the object surface. Since the light radiation is not only reflected on the surface of the object, but also reflected inside the object, the internally reflected light radiation will interfere with the precision or accuracy of the object surface height measurement, resulting in measurement errors of the object surface profile height or profile thickness. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a surface profile detection method, device, equipment, storage medium and chip to solve technical problems in the prior art that may cause measurement errors in the height or thickness of the surface profile of an object.

[0005] According to a first aspect of an embodiment of the present disclosure, a surface profile detection device is provided, the device comprising:

[0006] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0007] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0008] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0009] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0010] The signal processing unit 500 is used to perform surface contour detection on the object under test 210 based on the wavelength of the target light radiation to obtain the surface contour height of the object under test 210. The target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405.

[0011] According to a second aspect of an embodiment of the present disclosure, a surface profile thickness detection device is provided, the device comprising:

[0012] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0013] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0014] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0015] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0016] The signal processing unit 500 is used to perform profile thickness detection on the object under test 210 based on the wavelength difference to obtain the profile thickness of the object under test 210, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405.

[0017] According to a third aspect of an embodiment of the present disclosure, a surface profile thickness detection device is provided, the device comprising:

[0018] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0019] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0020] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0021] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0022] The signal processing unit 500 is used to perform surface profile detection on the object 210 to be measured based on the wavelength of the target light radiation to obtain the target surface profile height of the object 210 to be measured, wherein the target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths reflected by the upper surface or the lower surface of the object to be measured in each row or each column of the area array receiver 405, and the target surface profile height correspondingly includes the upper surface profile height and the lower surface profile height;

[0023] The signal processing unit 500 is further configured to calculate the contour thickness of the object 210 to be measured based on the contour height of the upper surface of the object 210 to be measured and the contour height of the lower surface of the object 210 to be measured.

[0024] According to a fourth aspect of an embodiment of the present disclosure, a surface profile detection device is provided, the device comprising:

[0025] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0026] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0027] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0028] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0029] The signal processing unit 500 is used to perform profile height detection on the object to be measured 210 based on the respective wavelengths of the first medium surface light radiation and the second medium surface light radiation, so as to obtain the first medium surface profile height and the second medium surface profile height of the object to be measured 210, wherein the first medium surface light radiation is the light radiation reflected by the first medium surface of the object to be measured in each row or column of the light radiation of the fifth light radiation of different wavelength in the area array receiver 405, and the second medium surface light radiation is the light radiation reflected by the second medium surface of the object to be measured in each row or column of the light radiation of the fifth light radiation of different wavelength in the area array receiver 405;

[0030] The signal processing unit 500 is further configured to calculate a profile thickness between the first medium surface and the second medium surface of the measured object 210 based on a profile height of the first medium surface and a profile height of the second medium surface of the measured object 210 .

[0031] According to a fifth aspect of an embodiment of the present disclosure, a surface profile height detection method is provided, the method comprising:

[0032] The light source unit 100 generates and emits a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0033] Dispersing and focusing the first optical radiation by the optical radiation emitting unit 200, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object 210;

[0034] Receiving the third optical radiation of different wavelengths reflected by the measured object 210 through the optical radiation receiving unit 300, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0035] Dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths;

[0036] The signal processing unit 500 performs surface contour detection on the object under test 210 based on the wavelength of the target light radiation to obtain the surface contour height of the object under test 210. The target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405.

[0037] According to a sixth aspect of an embodiment of the present disclosure, a surface profile thickness detection method is provided, the method comprising:

[0038] The light source unit 100 generates and emits a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0039] Dispersing and focusing the first optical radiation by the optical radiation emitting unit 200, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object 210;

[0040] Receiving the third optical radiation of different wavelengths reflected by the measured object 210 through the optical radiation receiving unit 300, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0041] Dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths;

[0042] The signal processing unit 500 performs surface contour detection on the object 210 to obtain the contour thickness of the object 210 based on the wavelength difference, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or column of the area array receiver 405.

[0043] According to a seventh aspect of an embodiment of the present disclosure, a surface profile thickness detection method is provided, the method comprising:

[0044] The light source unit 100 generates and emits a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0045] Dispersing and focusing the first optical radiation by the optical radiation emitting unit 200, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object 210;

[0046] Receiving the third optical radiation of different wavelengths reflected by the measured object 210 through the optical radiation receiving unit 300, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0047] Dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths;

[0048] The signal processing unit 500 performs surface contour detection on the object under test 210 based on the wavelength of the target light radiation to obtain the target surface contour height of the object under test 210, wherein the target light radiation is the fifth light radiation of different wavelengths reflected by the upper surface or lower surface of the object under test and corresponds to the light radiation of the shortest wavelength in each row or column of the area array receiver 405, and the target surface contour height correspondingly includes the upper surface contour height and the lower surface contour height; based on the upper surface contour height of the object under test 210 and the lower surface contour height of the object under test 210, the contour thickness of the object under test 210 is calculated.

[0049] According to an eighth aspect of an embodiment of the present disclosure, a profile thickness detection method is provided, the method comprising:

[0050] The light source unit 100 generates and emits a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0051] Dispersing and focusing the first optical radiation by the optical radiation emitting unit 200, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object 210;

[0052] Receiving the third optical radiation of different wavelengths reflected by the measured object 210 through the optical radiation receiving unit 300, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0053] Dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths;

[0054] The signal processing unit 500 performs profile height detection on the object to be measured 210 based on respective wavelengths of the first medium surface light radiation and the second medium surface light radiation, and obtains the first medium surface profile height and the second medium surface profile height of the object to be measured 210, wherein the first medium surface light radiation is light radiation reflected by the first medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405, and the second medium surface light radiation is light radiation reflected by the second medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405; based on the first medium surface profile height and the second medium surface profile height of the object to be measured 210, the profile thickness between the first medium surface and the second medium surface of the object to be measured 210 is calculated.

[0055] In combination with the embodiments described in any one of the first to eighth aspects above, in some embodiments, the light source unit 100 includes a linear wide-spectrum emitting device 101 and a first slit aperture 102, the linear wide-spectrum emitting device 101 includes a light source 111 and a light homogenizing device 112, the light source 111 emits wide-spectrum light radiation, which is irradiated to the light homogenizing device 112 for homogenization, and then generates the first light radiation through the first slit aperture 102.

[0056] In combination with the embodiments of any one of the first to eighth aspects above, in some embodiments, the optical radiation emitting unit 200 includes a first focusing component 201, a first dispersion component 202 and a second focusing component 203 in sequence, and the first focusing component 201 and the second focusing component 203 are arranged non-coaxially. After the first optical radiation is irradiated to the optical radiation emitting unit 200, it passes through the first focusing component 201 and then enters the first dispersion component 202 for dispersion, and then the dispersed second optical radiation of different wavelengths is focused to different height positions of the object to be measured 210 through the second focusing component 203.

[0057] In combination with the embodiments of any one of the first to eighth aspects above, in some embodiments, the optical radiation receiving unit 300 includes a third focusing component 301, a second dispersion component 302 and a fourth focusing component 303 in sequence, and the third focusing component 301 and the fourth focusing component 303 are arranged non-coaxially. After the third optical radiation of different wavelengths reflected by the object to be measured 210 is received by the optical radiation receiving unit 300, it passes through the third focusing component 301, and then enters the fourth focusing component 303 through the second dispersion component 302 for focusing, so as to obtain the fourth optical radiation of different wavelengths.

[0058] In combination with the embodiments of any one of the first to eighth aspects above, in some embodiments, the spectral analysis unit 400 includes a second slit aperture 401, a fifth focusing component 402, a third dispersion component 403, a sixth focusing component 404 and an array receiver 405 in sequence. After the fourth light radiation of different wavelengths enters the spectral analysis unit 400, it is filtered out by the second slit aperture 401 to focus the light radiation corresponding to the different height positions, and after passing through the fifth focusing component 402, it enters the third dispersion component 403 for dispersion, and then is focused onto the array receiver 405 through the sixth focusing component 404.

[0059] According to the ninth aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: a processor; a memory for storing processor executable instructions; wherein the processor is configured to execute the executable instructions to implement the steps of the surface contour detection method provided in any one of the fifth to eighth aspects above.

[0060] According to the tenth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, on which computer program instructions are stored. When the program instructions are executed by a processor, the steps of the surface contour detection method provided in any one of the fifth to eighth aspects of the present disclosure are implemented.

[0061] According to an eleventh aspect of an embodiment of the present disclosure, a computer program product is provided, comprising a computer program and / or instructions, which, when executed by a processor, implement the steps of the surface contour detection method provided in any one of the fifth to eighth aspects of the present disclosure.

[0062] According to the twelfth aspect of the embodiment of the present disclosure, a chip is provided, comprising: a processor and an interface; the processor is used to read instructions to execute the steps of the surface contour detection method provided in any one of the fifth to eighth aspects above.

[0063] The technical solution provided by the embodiment of the present disclosure may include the following beneficial effects: the light source unit 100 is used to generate and emit the first light radiation, which is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, and disperse and focus the third light radiation of different wavelengths to obtain the fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths to obtain the fifth light radiation of different wavelengths; the signal processing unit 500 is used to detect the surface profile of the measured object 210 based on the wavelength of the target light radiation, and obtain the surface profile height of the measured object 210, wherein the target light radiation is the light radiation of the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405. The device disclosed in the present disclosure uses an optical path deflection design, and the device is smaller and more compact, and has a higher measurement signal-to-noise ratio. The surface profile height of the object 210 is measured by using the target light radiation with the shortest wavelength corresponding to each row or column of the area array receiver 405. This can not only improve the accuracy of profile detection, but also solve technical problems such as measurement errors of surface profile detection in the prior art.

[0064] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0066] Figure 1 It is a schematic structural diagram of a surface profile detection device according to an exemplary embodiment.

[0067] Figure 2 is a schematic structural diagram of a light source unit 100 according to an exemplary embodiment.

[0068] Figure 3 is a schematic structural diagram of a light radiation emitting unit 200 according to an exemplary embodiment.

[0069] Figure 4 is a schematic structural diagram of a light radiation receiving unit 300 according to an exemplary embodiment.

[0070] Figure 5 is a schematic structural diagram of a spectrum analysis unit 400 according to an exemplary embodiment.

[0071] Figure 6 is a signal schematic diagram of an area array receiver 405 according to an exemplary embodiment.

[0072] Figure 7 It is a flow chart of a surface profile height detection method according to an exemplary embodiment.

[0073] Figure 8 It is a flowchart diagram of another profile thickness detection method according to an exemplary embodiment.

[0074] Fig. 9 It is a flowchart diagram of another profile thickness detection method according to an exemplary embodiment.

[0075] Fig.10 It is a flowchart diagram of another profile thickness detection method according to an exemplary embodiment. DETAILED DESCRIPTION

[0076] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0077] It should be noted that all actions of acquiring signals, information or data in the present disclosure are performed with the authorization given by the owner of the corresponding device.

[0078] See also Figure 1 FIG. 1 is a schematic diagram showing the structure of a surface profile detection device according to an exemplary embodiment. Figure 1 The device 10 shown may include, in order: a light source unit 100, a light radiation emitting unit 200, a light radiation receiving unit 300, a spectrum analysis unit 400 and a signal processing unit 500. Several functions / roles of the surface profile detection device 10 are exemplarily introduced below.

[0079] The first embodiment: for any object to be measured (such as a transparent, semi-transparent or opaque object, etc.), the surface profile height of the upper surface thereof is measured.

[0080] The light source unit 100 is mainly used to generate and emit first light radiation, which is linear broad-spectrum light radiation.

[0081] The optical radiation emitting unit 200 is mainly used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210 .

[0082] The optical radiation receiving unit 300 is mainly used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and then disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0083] The spectrum analysis unit 400 is mainly used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths.

[0084] The signal processor 500 is mainly used to detect the surface profile of the object 210 to be measured based on the wavelength of the target light radiation, and obtain the surface profile height of the object 210 to be measured. The target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or column of the area array receiver 405. That is, the surface profile height of the object 210 to be measured is calculated based on the shortest wavelength of the light radiation in each row or column of the area array receiver 405 (described below in the present disclosure).

[0085] The present disclosure does not limit the calculation method of the surface profile height. For example, the formula can be expressed as: Among them, k, k1, k2 and k3 are all constants, λ min It is the shortest wavelength of light radiation in each row or column of the area array receiver 405.

[0086] By implementing the embodiment of the present disclosure, the light source unit 100 is used to generate and emit a first light radiation, which is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, and disperse and focus the third light radiation of different wavelengths to obtain fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths; the signal processing unit 500 is used to perform surface profile detection on the measured object 210 based on the wavelength of the target light radiation, and obtain the surface profile height of the measured object 210, wherein the target light radiation is the light radiation corresponding to the shortest wavelength of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405. The device disclosed in the present disclosure uses an optical path deflection design, and the device is smaller and more compact, and has a higher measurement signal-to-noise ratio. The surface profile height of the object 210 is measured by using the target light radiation with the shortest wavelength corresponding to each row or column of the area array receiver 405. This can not only improve the accuracy of profile detection, but also solve technical problems such as measurement errors of surface profile detection in the prior art.

[0087] The second embodiment: for a transparent or translucent object to be measured, the contour thickness between the upper surface and the lower surface thereof is measured.

[0088] The light source unit 100 is mainly used to generate and emit a first light radiation, which is a linear wide-spectrum light radiation.

[0089] The optical radiation emitting unit 200 is mainly used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210 .

[0090] The optical radiation receiving unit 300 is mainly used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and then disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0091] The spectrum analysis unit 400 is mainly used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths.

[0092] The signal processor 500 is mainly used to perform profile thickness detection on the object 210 to obtain the profile thickness of the object 210 based on the wavelength difference, and the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or column of the area array receiver 405. That is, the wavelength difference is the difference between the wavelengths of the light radiation reflected by the upper surface and the lower surface of the object 210 in each row or column of the area array receiver 405.

[0093] In practical applications, the present disclosure can calculate the difference between the shortest wavelength and the longest wavelength of each row or column on the area array receiver 405 to obtain the corresponding wavelength difference Δλ=λ max -λ min Then, the profile thickness that matches / corresponds to the wavelength difference can be determined by looking up a table or the like, which is the profile thickness of the object 210 to be measured.

[0094] By implementing the embodiment of the present disclosure, the light source unit 100 is used to generate and emit a first light radiation, which is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, disperse and focus the third light radiation of different wavelengths, and obtain the fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths, and obtain the fifth light radiation of different wavelengths; the signal processing unit 500 is used to perform profile thickness detection on the measured object 210 based on the wavelength difference, and obtain the profile thickness of the measured object 210, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405. The device disclosed in the present disclosure uses an optical path deflection design, and the device is smaller and more compact, and has a higher measurement signal-to-noise ratio. The wavelength difference between the shortest wavelength and the longest wavelength corresponding to each row or column of the area array receiver 405 is used to measure the contour thickness of the object 210 to be measured. This can not only improve the accuracy of contour detection, but also solve technical problems such as measurement errors in contour thickness detection in the prior art.

[0095] The third embodiment: for any object to be measured (such as a transparent, translucent or opaque object, etc.), the above-mentioned device 10 is used to measure the surface profile heights of the upper and lower surfaces twice, and then the profile thickness between the upper and lower surfaces is calculated.

[0096] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0097] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0098] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0099] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0100] The signal processing unit 500 is used to perform surface profile detection on the object 210 to be measured based on the wavelength of the target light radiation to obtain the target surface profile height of the object 210 to be measured, wherein the target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths reflected by the upper surface or the lower surface of the object to be measured in each row or each column of the area array receiver 405, and the target surface profile height correspondingly includes the upper surface profile height and the lower surface profile height;

[0101] The signal processing unit 500 is further configured to calculate the contour thickness of the object 210 to be measured based on the contour height of the upper surface of the object 210 to be measured and the contour height of the lower surface of the object 210 to be measured.

[0102] The present disclosure can refer to the relevant introduction in the aforementioned first embodiment to respectively calculate and obtain the upper surface profile height and the lower surface profile height of the above-mentioned object 210 to be measured. Based on this, the profile thickness of the above-mentioned object 210 to be measured is further calculated. The present disclosure does not limit the calculation implementation method of the profile thickness of the above-mentioned object 210 to be measured. Specifically, for example, the present disclosure performs a difference calculation based on the upper surface profile height of the above-mentioned object 210 to be measured and the lower surface profile height of the above-mentioned object 210 to be measured, thereby calculating and obtaining the profile thickness of the object 210 to be measured.

[0103] By implementing the embodiment of the present disclosure, the light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third light radiation of different wavelengths to obtain fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths. Light radiation; the signal processing unit 500 is used to detect the surface profile of the object 210 to be measured based on the wavelength of the target light radiation, and obtain the target surface profile height of the object 210 to be measured, the target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths reflected by the upper surface or lower surface of the object to be measured in each row or column of the area array receiver 405, and the target surface profile height corresponds to the upper surface profile height and the lower surface profile height; based on the upper surface profile height of the object 210 to be measured and the lower surface profile height of the object 210 to be measured, the profile thickness of the object 210 to be measured is calculated. The device disclosed in the present invention uses an optical path deflection design, and the device is smaller and more compact, and the measurement signal-to-noise ratio is higher. The profile thickness of the object 210 to be measured is measured by using the light radiation with the shortest wavelength in the light radiation reflected by the upper surface and the lower surface of the object 210 to be measured, which can not only improve the accuracy of profile detection, but also solve the technical problems such as measurement error of surface profile detection existing in the prior art.

[0104] Fourth embodiment: for a transparent or translucent object to be measured, the thickness of the profile between any two medium surfaces is measured. The object to be measured may include multiple medium surfaces. For the convenience of describing the present disclosure, the first medium surface and the second medium surface are used as examples to illustrate the relevant contents, but this does not constitute a limitation.

[0105] The light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation;

[0106] The optical radiation emitting unit 200 is used to disperse and focus the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object 210;

[0107] The optical radiation receiving unit 300 is used to receive the third optical radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths;

[0108] A spectrum analysis unit 400, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths;

[0109] The signal processing unit 500 performs profile height detection on the object to be measured 210 based on respective wavelengths of the first medium surface light radiation and the second medium surface light radiation, and obtains the first medium surface profile height and the second medium surface profile height of the object to be measured 210, wherein the first medium surface light radiation is light radiation reflected by the first medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405, and the second medium surface light radiation is light radiation reflected by the second medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405;

[0110] The signal processing unit 500 is further configured to calculate a profile thickness between the first medium surface and the second medium surface of the measured object 210 based on a profile height of the first medium surface and a profile height of the second medium surface of the measured object 210 .

[0111] In the present disclosure, the first medium surface and the second medium surface may refer to any two medium surfaces in the object 210 to be measured. For example, when the first medium surface is the upper surface of the object 210 to be measured and the second medium surface is the lower surface of the object 210 to be measured, the entire profile thickness of the object 210 to be measured can be calculated by the measurement principle of the above device. The present disclosure does not limit the calculation implementation method of the profile thickness between the first medium surface and the second medium surface. For example, the present disclosure calculates the difference between the first surface profile height of the object 210 to be measured and the second surface profile height of the object 210 to be measured, thereby calculating the profile thickness between the first medium surface and the second medium surface in the object 210 to be measured.

[0112] It should be noted that when there are multiple media with different refractive indices in the object to be measured 210, the present disclosure needs to consider the influence of all media with different refractive indices that pass through the object to be measured 210 when the light radiation reaches the first medium surface or the second medium surface respectively when calculating the corresponding medium surface profile height. The medium surface profile height corresponding to the first medium surface / the second medium surface is corrected according to the refractive index of different media, and then the difference calculation is performed based on the corrected first medium surface profile height / the corrected second medium surface profile height to obtain the profile thickness between the first medium surface and the second medium surface, etc., which the present disclosure does not make too many restrictions and detailed descriptions.

[0113] By implementing the embodiment of the present disclosure, the light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third light radiation of different wavelengths to obtain fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths; the signal processing unit 500 is used to generate a signal based on the first medium surface light radiation and the second medium surface light radiation. The wavelength of the measured object 210 is respectively used to detect the profile height of the first medium surface and the second medium surface of the measured object 210, and the first medium surface light radiation is the light radiation of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405, which is reflected by the first medium surface of the measured object, and the second medium surface light radiation is the light radiation of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405, which is reflected by the second medium surface of the measured object; based on the profile height of the first medium surface and the profile height of the second medium surface of the measured object 210, the profile thickness between the first medium surface and the second medium surface of the measured object 210 is calculated. The device disclosed in the present invention uses an optical path deflection design, and the device is smaller and more compact, and has a higher measurement signal-to-noise ratio. The wavelength of the light radiation reflected by the first medium surface and the second medium surface of the object 210 in each row or column of the area array receiver 405 is used to measure the contour thickness of the object 210. This can not only improve the accuracy of contour detection, but also solve technical problems such as measurement errors in surface contour detection in the prior art.

[0114] The following is a detailed introduction to each component in the above-mentioned surface profile detection device.

[0115] In one embodiment, the light source unit 100 is located before the light radiation unit 200. Figure 2 FIG. 1 is a schematic diagram showing a structure of a light source unit 100 according to an exemplary embodiment. Figure 2, the light source unit 100 includes a linear wide spectrum emitting device 101 and a first slit aperture 102. The linear wide spectrum emitting device 101 includes a light source 111 and a light homogenizing device 112. The light source 111 in the linear wide spectrum emitting device 101 emits wide spectrum light radiation, which is irradiated to the light homogenizing device 112 for homogenization, and then the first light radiation is generated through the first slit aperture 102. The present disclosure does not limit the wide spectrum light radiation emitted by the light source 111. Preferably, for example, the wavelength of the wide spectrum light radiation is between 100nm and 1000um. The light source 111 may include, but is not limited to, any one or more combinations of the following: light emitting diodes (LEDs), lasers, incandescent lamps, gas discharge lamps, halogen lamps, fiber optic light sources or other objects for generating light. The present disclosure does not limit the light homogenizing device 112 either, which is used to emit relatively uniform or smoothly changing light radiation to achieve a light homogenizing effect. The light homogenizing device 112 may include, but is not limited to, frosted glass, semi-transparent glass or transparent glass, etc. The present disclosure does not limit the first slit aperture 102 , and preferably, for example, the width of the first slit aperture 102 may be between 1 um and 1 mm.

[0116] In yet another embodiment, see Figure 3 FIG. 2 is a schematic diagram showing a structure of a light radiation emitting unit 200 according to an exemplary embodiment. Figure 3 As shown, the optical radiation emitting unit 200 includes a first focusing component 201, a first dispersing component 202 and a second focusing component 203 in sequence. After the first optical radiation is irradiated to the optical radiation emitting unit 200, the first optical radiation passes through the first focusing component 201 and then enters the first dispersing component 202 for dispersion, and then the dispersed second optical radiation of different wavelengths is focused to different height positions of the measured object 210 through the second focusing component 203. In practical applications, after the first optical radiation from the light source unit 100 is irradiated to the optical radiation emitting unit 200, the first optical radiation passes through the first focusing component 201 and then enters the first dispersing component 202 for dispersion, and the dispersed optical radiation is focused through the second focusing component 203, and then the second optical radiation of different wavelengths is focused to different height positions of the measured object 210. Among them, the second optical radiation with a shorter wavelength is focused at a higher height position, and the second optical radiation with a longer wavelength is focused at a lower height position.

[0117] The first focusing component 201 and the second focusing component 203 are arranged non-coaxially, and they have their own optical axes. That is, the optical axis 211 of the first focusing component 201 and the optical axis 212 of the second focusing component 203 are different from each other, and the two optical axes may be parallel to each other, and preferably may intersect, which is not limited in the present disclosure. The present disclosure does not limit the first focusing component 201 and the second focusing component 203, which may include but are not limited to, for example, one or more aspherical lenses, or spherical lenses. The present disclosure does not limit the first dispersive component 202, which may include but are not limited to, for example, any one or more of the following combinations: a dispersion prism, a transmission diffraction grating, a reflection diffraction grating, or other components with a dispersion function.

[0118] In yet another embodiment, see Figure 4 FIG. 1 is a schematic diagram showing a structure of a light radiation receiving unit 300 according to an exemplary embodiment. Figure 4 As shown, the optical radiation receiving unit 300 includes a third focusing component 301, a second dispersion component 302 and a fourth focusing component 303 in sequence. After the third optical radiation of different wavelengths reflected from the surface and the interior of the measured object 210 is received by the optical radiation receiving unit 300, it passes through the third focusing component 301, then passes through the second dispersion component 302 to remove dispersion, and enters the fourth focusing component 302 for focusing, thereby obtaining fourth optical radiation of different wavelengths. In practical applications, the third optical radiation of different wavelengths reflected from the surface and the interior of the measured object 210 is received by the optical radiation receiving unit 300, and the received third optical radiation of different wavelengths is first guided to the second dispersion component 302 through the third focusing component 301, then passes through the second dispersion component 302, and enters the fourth focusing component 302. After being focused by the fourth focusing component 303, the optical radiation enters the spectrum analysis unit 400. The focal points of the light radiation receiving unit 300 at different heights of the measured object 210 and the focal points of the light radiation emitting unit 200 at different heights of the measured object 210 are substantially coincident.

[0119] The third focusing component 301 and the fourth focusing component 303 are arranged non-coaxially, and they have their own optical axes. That is, the optical axis 311 of the third focusing component 301 and the optical axis 312 of the fourth focusing component 303 are different from each other, and the two optical axes may be parallel to each other, and preferably may intersect, which is not limited in the present disclosure. The present disclosure does not limit the third focusing component 301 and the fourth focusing component 303, which may include but are not limited to, for example, one or more aspherical lenses, or spherical lenses. The present disclosure does not limit the second dispersion component 302, which may include but are not limited to, for example, any one or more of the following combinations: dispersion prisms, transmission diffraction gratings, reflection diffraction gratings, or other components with dispersion functions.

[0120] In yet another embodiment, see Figure 5 FIG. 4 is a schematic diagram showing a structure of a spectrum analysis unit 400 according to an exemplary embodiment. Figure 5 As shown, the spectrum analysis unit 400 includes a second slit aperture 401, a fifth focusing component 402, a third dispersion component 403, a sixth focusing component 404 and an array receiver 405 in sequence. After the fourth optical radiation of different wavelengths enters the spectrum analysis unit 400, it is filtered out by the second slit aperture 401 to focus the optical radiation corresponding to the different height positions, and the optical radiation corresponding to the different height positions is allowed to pass through the second slit aperture 401. After passing through the fifth focusing component 402, it enters the third dispersion component 403 for dispersion, and then is focused on the array receiver 405 by the sixth focusing component 404. In practical applications, after the fourth optical radiation from the optical radiation receiving unit 300 enters the spectrum analysis unit 400, it is focused on the array receiver 405 by the second slit aperture 401, the fifth focusing component 402, the third dispersion component 403 and the sixth focusing component 404 in sequence. The second slit aperture 401 is mainly used to block the non-focused light radiation on the surface and inside of the measured object 210, and allows light radiation of different wavelengths focused at different heights to pass through. The present disclosure does not limit the width of the second slit aperture 401, for example, the width of the second slit aperture 401 can be between 1um and 1mm.

[0121] The fifth focusing component 402 and the sixth focusing component 404 may support coaxial arrangement or non-coaxial arrangement. Figure 5In the example, only the non-coaxial arrangement is used as an example, but it does not constitute a limitation. The present disclosure does not limit the fifth focusing component 402 and the sixth focusing component 404, which may include but are not limited to, for example, one or more aspherical lenses, or spherical lenses. The present disclosure does not limit the third dispersion component 403, which may include but are not limited to, for example, any one or more of the following combinations: dispersion prisms, transmission diffraction gratings, reflection diffraction gratings, or other components with dispersion functions. The present disclosure does not limit the area array receiver 405, which may include but are not limited to, for example, any one or more of the following combinations: CCD (charge coupled device) devices, CMOS (complementary metal oxide semiconductor) devices, PSD (position sensitive detector) devices, APD (avalanche photodiode) devices or other devices for receiving optical radiation, etc.

[0122] The area array receiver 405 may receive the optical radiation focused by the sixth focusing component 404 , for example, the fifth optical radiation of the different wavelength. Figure 6 FIG. 4 is a schematic diagram showing a signal of a planar array receiver 405 according to an exemplary embodiment. Figure 6 The optical radiation of different wavelengths received on a row or a column of the area array receiver 405 is specifically shown, in which the horizontal axis represents the wavelength λ and the vertical axis represents the signal intensity I of the optical radiation. When measuring the above-mentioned object 210 to be measured, since the optical radiation will be reflected on the surface and inside of the object 210 to be measured, the optical radiation of different wavelengths reflected from different focal positions on the surface and inside of the object 210 to be measured will form optical radiation signals corresponding to different wavelengths on the area array receiver. Since these optical radiation signals include the background noise b caused by the stray optical radiation inside the device 10 and the noise of the receiver circuit. The above-mentioned signal processing unit 500 can set a threshold value TH higher than the background noise signal b, and identify each independent signal higher than the threshold value on each row or column of the area array receiver as a wavelength signal. Each wavelength signal includes a short continuous wavelength. Since the air basically does not reflect the optical radiation, the wavelength of the optical radiation reflected from the focal position on the surface of the object 210 to be measured is shorter than the wavelength of the optical radiation reflected from the focal position inside the object 210 to be measured. And for the transparent or translucent object 210 to be measured, the wavelength of the light radiation reflected by the focal position of the upper surface of the object 210 to be measured is the shortest, while the wavelength of the light radiation reflected by the focal position of the lower surface of the object 210 to be measured is the longest. Considering the light radiation of different wavelengths in each row or column received by the area array receiver 405, the signal processing unit 500 can perform corresponding profile height detection, which is specifically described in detail below in the present disclosure and is not described in detail here.

[0123] It should be noted that the above-mentioned area array receiver 405 can customize its optical signal receiving devices for receiving optical radiation of different wavelengths according to actual needs. For example, m rows or m columns of optical signal receiving devices can be set, and m is a positive integer customized according to actual conditions. The contour detection of the object to be measured can be performed according to the above-mentioned principle for the row / column optical radiation received corresponding to each row or column of optical signal receiving devices of the area array receiver 405, and this disclosure does not make too many restrictions and detailed descriptions on this.

[0124] The object 210 to be measured involved in the present disclosure may include but is not limited to any of the following items, for example: a mirror object, a diffuse reflection object, a transparent object, a semi-transparent object, or an object of any other material / medium, and the present disclosure does not impose too many limitations on this.

[0125] The above-mentioned signal processing unit 500 may include but is not limited to any one or more combinations of the following: CPU (central processing unit), MCU (microcontroller), FPGA (field programmable gate array), DSP (digital signal processor), GPU (graphics processing unit) or other devices with data computing capabilities, etc.

[0126] By implementing the embodiments of the present disclosure, the present disclosure uses the light radiation with the shortest wavelength in each row or column of the area array receiver to perform contour detection on the object 210 to be measured, thereby eliminating the influence of the reflected light radiation inside the object on the surface contour height measurement. By using two devices 10 to perform contour detection on the upper surface and the lower surface of the object 210 to be measured, the contour height of the object 210 to be measured can be accurately / precisely measured. In addition, for a transparent / semi-transparent object 210 to be measured, a device 10 can be used to measure the wavelength difference between any two medium surfaces to perform contour detection on the object 210 to be measured, thereby obtaining the contour thickness between the any two medium surfaces in the above-mentioned object 210 to be measured. In a specific implementation, the present disclosure provides a surface profile detection device including a light source unit 100 for generating and emitting a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; a light radiation emitting unit 200 for dispersing and focusing the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; a light radiation receiving unit 300 for receiving third light radiation of different wavelengths after being reflected by the measured object 210, dispersing and focusing the third light radiation of different wavelengths, and obtaining fourth light radiation of different wavelengths; a spectrum analysis unit 400 for dispersing and focusing the fourth light radiation of different wavelengths, and obtaining fifth light radiation of different wavelengths; and a signal processing unit 500 for performing surface profile detection on the measured object 210 based on the wavelength of the target light radiation, and obtaining the surface profile height of the measured object 210, wherein the target light radiation is the light radiation of the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver 405. The device disclosed in the present disclosure uses an optical path deflection design, and the device is smaller and more compact, and has a higher measurement signal-to-noise ratio. The surface profile height information of the object 210 is measured by using the target light radiation with the shortest wavelength corresponding to each row or column of the area array receiver 405. This can not only improve the accuracy of profile detection, but also solve technical problems such as measurement errors of surface profile detection in the prior art.

[0127] Based on the above examples, see Figure 7 FIG. 1 is a flow chart of a surface profile detection method according to an exemplary embodiment. Figure 7 The method shown can be applied to Figure 1-Figure 6 In the device 10 shown, the method may include the following implementation steps:

[0128] S701 . Generate and emit first light radiation through the light source unit 100 , where the first light radiation is linear broad-spectrum light radiation.

[0129] S702 , dispersing and focusing the first optical radiation by the optical radiation emitting unit 200 , so as to focus the obtained second optical radiations with different wavelengths to different height positions of the measured object 210 .

[0130] S703 , receiving, by the optical radiation receiving unit 300 , the third optical radiation of different wavelengths reflected by the measured object 210 , and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0131] S704 , dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths.

[0132] S705. Perform surface contour detection on the object under test 210 based on the wavelength of the target light radiation through the signal processing unit 500 to obtain the surface contour height of the object under test 210. The target light radiation is the light radiation corresponding to the shortest wavelength of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405.

[0133] The present disclosure does not limit the implementation method of the above surface profile height calculation. For example, the formula Calculated, dx represents the surface profile height of the object 210, λ min Indicates the shortest wavelength in each row or column of the area array receiver 405. For the contents not introduced or described in the embodiments of the present disclosure, reference may be made to the relevant descriptions in the aforementioned method embodiments, and no further description is given here.

[0134] See also Figure 8 FIG. 1 is a flow chart of another surface profile detection method according to an exemplary embodiment. Figure 8 The method shown can be applied to Figure 1-Figure 6 In the device 10 shown, the method may include the following implementation steps:

[0135] S801 . Generate and emit first light radiation through the light source unit 100 , where the first light radiation is linear broad-spectrum light radiation.

[0136] S802 , dispersing and focusing the first optical radiation by the optical radiation emitting unit 200 , so as to focus the obtained second optical radiations with different wavelengths to different height positions of the measured object 210 .

[0137] S803 , receiving, by the optical radiation receiving unit 300 , the third optical radiation of different wavelengths reflected by the measured object 210 , and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0138] S804 , dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths.

[0139] S805, performing profile thickness detection on the object 210 to be measured based on the wavelength difference by the signal processing unit 500, and obtaining the profile thickness of the object 210 to be measured, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or column of the area array receiver 405. That is, the wavelength difference is the difference between the wavelengths of the light radiation reflected by the upper surface and the lower surface of the object 210 to be measured in each row or column of the area array receiver 405.

[0140] In practical applications, the present disclosure can calculate the difference between the shortest wavelength and the longest wavelength of each row or column of the area array receiver 405 to obtain the corresponding wavelength difference Δλ=λ max -λ min Then, the profile thickness that matches / corresponds to the wavelength difference can be determined by looking up a table, etc., which is the profile thickness of the object 210 to be measured. For the contents not introduced or described in this disclosure, please refer to the relevant introduction in the above embodiments, and no further description will be given here.

[0141] See also Fig. 9 FIG. 1 is a flow chart of another surface profile detection method according to an exemplary embodiment. Fig. 9 The method shown can be applied to Figure 1-Figure 6 In the device 10 shown, the method may include the following implementation steps:

[0142] S901 . Generate and emit first light radiation through the light source unit 100 , where the first light radiation is linear broad-spectrum light radiation.

[0143] S902 , dispersing and focusing the first optical radiation by the optical radiation emitting unit 200 , so as to focus the obtained second optical radiations with different wavelengths to different height positions of the measured object 210 .

[0144] S903 , receiving, by the optical radiation receiving unit 300 , the third optical radiation of different wavelengths reflected by the measured object 210 , and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0145] S904 , dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths.

[0146] S905. Perform surface contour detection on the object under test 210 based on the wavelength of the target light radiation through the signal processing unit 500 to obtain the target surface contour height of the object under test 210, wherein the target light radiation is the fifth light radiation of different wavelengths reflected by the upper surface or the lower surface of the object under test and corresponds to the light radiation of the shortest wavelength in each row or column of the area array receiver 405, and the target surface contour height correspondingly includes the upper surface contour height and the lower surface contour height; based on the upper surface contour height of the object under test 210 and the lower surface contour height of the object under test 210, calculate the contour thickness of the object under test 210.

[0147] The present disclosure can calculate the upper surface profile height and the lower surface profile height of the above-mentioned object 210 to be measured based on the wavelengths of the light radiation reflected by the upper surface and the lower surface of the above-mentioned object 210 to be measured. Further, the difference calculation is performed based on the upper surface profile height and the lower surface profile height of the above-mentioned object 210 to be measured, so as to obtain the profile thickness of the above-mentioned object 210 to be measured. For the contents not introduced or described in the embodiments of the present disclosure, the relevant introduction in the above-mentioned embodiments can be referred to, and no further description is given here.

[0148] See also Fig.10 FIG. 1 is a flow chart of another contour detection method according to an exemplary embodiment. Fig.10 The method shown can be applied to Figure 1-Figure 6 In the device 10 shown, the method may include the following implementation steps:

[0149] S1001 . Generate and emit first light radiation through the light source unit 100 , where the first light radiation is linear broad-spectrum light radiation.

[0150] S1002 , dispersing and focusing the first optical radiation by the optical radiation emitting unit 200 , so as to focus the obtained second optical radiations with different wavelengths to different height positions of the measured object 210 .

[0151] S1003 , receiving, by the optical radiation receiving unit 300 , third optical radiation of different wavelengths reflected by the measured object 210 , and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths.

[0152] S1004 , dispersing and focusing the fourth optical radiation of different wavelengths by the spectrum analysis unit 400 to obtain fifth optical radiation of different wavelengths.

[0153] S1005. Perform profile height detection on the object to be measured 210 based on the wavelengths of the first medium surface light radiation and the second medium surface light radiation by the signal processing unit 500 to obtain the first medium surface profile height and the second medium surface profile height of the object to be measured 210, wherein the first medium surface light radiation is light radiation reflected by the first medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405, and the second medium surface light radiation is light radiation reflected by the second medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver 405; and the profile thickness between the first medium surface and the second medium surface of the object to be measured 210 is calculated based on the first medium surface profile height and the second medium surface profile height of the object to be measured.

[0154] The present disclosure can calculate the first surface profile height and the second surface profile height of the measured object 210 based on the wavelengths of the light radiation reflected by the first medium surface and the second medium surface of the measured object 210. Further, a difference calculation is performed based on the first surface profile height and the second surface profile height of the measured object 210, so as to obtain the profile thickness between the first medium surface and the second medium surface of the measured object 210. For the contents not introduced or described in the embodiments of the present disclosure, the relevant introduction in the aforementioned embodiments can be referred to, and no further description is given here.

[0155] By implementing the embodiment of the present disclosure, the light source unit 100 is used to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; the light radiation emitting unit 200 is used to disperse and focus the first light radiation, so as to focus the obtained second light radiation of different wavelengths to different height positions of the measured object 210; the light radiation receiving unit 300 is used to receive the third light radiation of different wavelengths reflected by the measured object 210, and to disperse and focus the third light radiation of different wavelengths to obtain fourth light radiation of different wavelengths; the spectrum analysis unit 400 is used to disperse and focus the fourth light radiation of different wavelengths to obtain fifth light radiation of different wavelengths; the signal processing unit 500 is used to generate a signal based on the first medium surface light radiation and the second medium surface light radiation. The wavelength of the measured object 210 is used to detect the profile height of the first medium surface and the second medium surface of the measured object 210, respectively, to obtain the profile height of the first medium surface and the second medium surface of the measured object 210, the first medium surface light radiation is the light radiation of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405, which is reflected by the first medium surface of the measured object, and the second medium surface light radiation is the light radiation of the fifth light radiation of different wavelengths in each row or column of the area array receiver 405, which is reflected by the second medium surface of the measured object; based on the profile height of the first medium surface and the profile height of the second medium surface of the measured object 210, the profile thickness between the first medium surface and the second medium surface of the measured object 210 is calculated. The device disclosed in the present invention uses an optical path deflection design, and the device is smaller and more compact, and the measurement signal-to-noise ratio is higher. The surface profile height information of the measured object 210 is measured by using the target light radiation with the shortest wavelength corresponding to each row or column of the area array receiver 405, which can not only improve the accuracy of profile detection, but also solve the technical problems such as measurement error of surface profile detection existing in the prior art.

[0156] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory including instructions, and the instructions can be executed by a processor of a computer device to complete all or part of the steps in the above-mentioned surface profile detection method. For example, the non-transitory computer-readable storage medium can be a ROM, a FLASH memory, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0157] In addition to being an independent electronic device, the above-mentioned device can also be a part of an independent electronic device. For example, in one embodiment, the device can be an integrated circuit (IC) or a chip, wherein the integrated circuit can be an IC or a collection of multiple ICs; the chip can include but is not limited to the following types: GPU (Graphics Processing Unit), CPU (Central Processing Unit), FPGA (Field Programmable Gate Array), DSP (Digital Signal Processor), ASIC (Application Specific Integrated Circuit), SOC (System on Chip, SoC), etc. The above-mentioned integrated circuit or chip can be used to execute executable instructions (or codes) to implement all or part of the steps in the above-mentioned surface contour detection method. The executable instructions can be stored in the integrated circuit or chip, or can be obtained from other devices or equipment, for example, the integrated circuit or chip includes a processor, a memory, and an interface for communicating with other devices. The executable instructions can be stored in the memory, and when the executable instructions are executed by the processor, all or part of the steps in the above-mentioned surface contour detection method are implemented. Alternatively, the integrated circuit or chip may receive executable instructions through the interface and transmit the instructions to the processor for execution, so as to implement all or part of the steps in the above-mentioned surface contour detection method.

[0158] In another exemplary embodiment, a computer program product is also provided, which includes a computer program and / or instructions that can be executed by a programmable device, and the computer program and / or instructions are used to perform all or part of the steps in the above-mentioned surface contour detection method when executed by the programmable device.

[0159] Understandably, the processor in the embodiment of the present disclosure may be an integrated circuit chip having signal processing capabilities. In the implementation process, each step of the above method embodiment may be completed by an integrated logic circuit of hardware in the processor or an instruction in the form of software. The above processor may be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.

[0160] It is understandable that the memory in the embodiments of the present disclosure may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct RAM (DR RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0161] It should be noted here that the description of the above storage medium, device and chip embodiments is similar to the description of the above method embodiments, and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium, storage medium and device embodiments of the present disclosure, please refer to the description of the method embodiments of the present disclosure for understanding.

[0162] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the present disclosure. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0163] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A surface profile height detection device, characterized in that: include: A light source unit, configured to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; an optical radiation emitting unit, used for dispersing and focusing the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object; an optical radiation receiving unit, configured to receive third optical radiation of different wavelengths reflected by the measured object, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; a spectrum analysis unit, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths; A signal processing unit is used to perform surface contour detection on the object under test based on the wavelength of the target light radiation to obtain the surface contour height of the object under test, wherein the target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver.

2. A surface profile thickness detection device, characterized in that: include: A light source unit, configured to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; an optical radiation emitting unit, used for dispersing and focusing the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object; an optical radiation receiving unit, configured to receive third optical radiation of different wavelengths reflected by the measured object, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; a spectrum analysis unit, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths; A signal processing unit is used to perform profile thickness detection on the object to be measured based on the wavelength difference to obtain the profile thickness of the object to be measured, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver.

3. A surface profile thickness detection device, characterized in that: include: A light source unit, configured to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; an optical radiation emitting unit, used for dispersing and focusing the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object; an optical radiation receiving unit, configured to receive third optical radiation of different wavelengths reflected by the measured object, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; a spectrum analysis unit, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths; A signal processing unit, configured to perform surface profile detection on the object to be measured based on the wavelength of target light radiation, and obtain a target surface profile height of the object to be measured, wherein the target light radiation is light radiation of the shortest wavelength corresponding to the fifth light radiation of different wavelengths reflected by the upper surface or the lower surface of the object to be measured in each row or column of the area array receiver, and the target surface profile height correspondingly includes an upper surface profile height and a lower surface profile height; The signal processing unit is further used to calculate the contour thickness of the object to be measured based on the contour height of the upper surface of the object to be measured and the contour height of the lower surface of the object to be measured.

4. A surface profile thickness detection device, characterized in that: include: A light source unit, configured to generate and emit a first light radiation, wherein the first light radiation is a linear wide-spectrum light radiation; an optical radiation emitting unit, used for dispersing and focusing the first optical radiation, so as to focus the obtained second optical radiation of different wavelengths to different height positions of the measured object; an optical radiation receiving unit, configured to receive third optical radiation of different wavelengths reflected by the measured object, and to disperse and focus the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; a spectrum analysis unit, configured to disperse and focus the fourth optical radiation of different wavelengths to obtain fifth optical radiation of different wavelengths; A signal processing unit, configured to perform profile height detection on the object to be measured based on respective wavelengths of the first medium surface light radiation and the second medium surface light radiation, to obtain the first medium surface profile height and the second medium surface profile height of the object to be measured, wherein the first medium surface light radiation is light radiation reflected by the first medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver, and the second medium surface light radiation is light radiation reflected by the second medium surface of the object to be measured in each row or column of light radiation of the fifth light radiation of different wavelength in the area array receiver; The signal processing unit is further used to calculate the profile thickness between the first medium surface and the second medium surface in the measured object based on the profile height of the first medium surface and the profile height of the second medium surface of the measured object.

5. A surface profile height detection method, characterized in that: include: Generate and emit first light radiation through a light source unit, wherein the first light radiation is linear broad-spectrum light radiation; Dispersing and focusing the first optical radiation by an optical radiation emitting unit, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object; receiving, by means of an optical radiation receiving unit, third optical radiations of different wavelengths reflected by the measured object, and dispersing and focusing the third optical radiations of different wavelengths to obtain fourth optical radiations of different wavelengths; Dispersing and focusing the fourth optical radiation of different wavelengths by a spectrum analysis unit to obtain fifth optical radiation of different wavelengths; The surface profile of the object to be measured is detected based on the wavelength of the target light radiation by a signal processing unit to obtain the surface profile height of the object to be measured, and the target light radiation is the light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver.

6. A surface profile thickness detection method, characterized in that: include: Generate and emit first light radiation through a light source unit, wherein the first light radiation is linear broad-spectrum light radiation; Dispersing and focusing the first optical radiation by an optical radiation emitting unit, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object; receiving, by means of an optical radiation receiving unit, third optical radiation of different wavelengths reflected by the measured object, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; Dispersing and focusing the fourth optical radiation of different wavelengths by a spectrum analysis unit to obtain fifth optical radiation of different wavelengths; The signal processing unit performs contour detection on the object to be measured based on the wavelength difference to obtain the contour thickness of the object to be measured, wherein the wavelength difference is the difference between the longest wavelength and the shortest wavelength corresponding to the fifth light radiation of different wavelengths in each row or each column of the area array receiver.

7. A surface profile thickness detection method, characterized in that: include: Generate and emit first light radiation through a light source unit, wherein the first light radiation is linear broad-spectrum light radiation; Dispersing and focusing the first optical radiation by an optical radiation emitting unit, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object; receiving, by means of an optical radiation receiving unit, third optical radiation of different wavelengths reflected by the measured object, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; Dispersing and focusing the fourth optical radiation of different wavelengths by a spectrum analysis unit to obtain fifth optical radiation of different wavelengths; Performing surface profile detection on the object to be measured based on the wavelength of target light radiation by a signal processing unit to obtain a target surface profile height of the object to be measured, wherein the target light radiation is light radiation with the shortest wavelength corresponding to the fifth light radiation of different wavelengths reflected by the upper surface or the lower surface of the object to be measured in each row or column of the area array receiver, and the target surface profile height correspondingly includes the upper surface profile height and the lower surface profile height; Based on the upper surface profile height of the measured object and the lower surface profile height of the measured object, the profile thickness of the measured object is calculated.

8. A method for detecting profile thickness, characterized in that: include: Generate and emit first light radiation through a light source unit, wherein the first light radiation is linear broad-spectrum light radiation; Dispersing and focusing the first optical radiation by an optical radiation emitting unit, so as to focus the obtained second optical radiation with different wavelengths to different height positions of the measured object; receiving, by means of an optical radiation receiving unit, third optical radiation of different wavelengths reflected by the measured object, and dispersing and focusing the third optical radiation of different wavelengths to obtain fourth optical radiation of different wavelengths; Dispersing and focusing the fourth optical radiation of different wavelengths by a spectrum analysis unit to obtain fifth optical radiation of different wavelengths; The signal processing unit performs profile height detection on the object to be measured based on the respective wavelengths of the first medium surface light radiation and the second medium surface light radiation to obtain the first medium surface profile height and the second medium surface profile height of the object to be measured, wherein the first medium surface light radiation is the light radiation reflected by the first medium surface of the object to be measured in each row or column of the light radiation of the fifth light radiation with different wavelengths in the area array receiver, and the second medium surface light radiation is the light radiation reflected by the second medium surface of the object to be measured in each row or column of the light radiation of the fifth light radiation with different wavelengths in the area array receiver; based on the first medium surface profile height and the second medium surface profile height of the object to be measured, the profile thickness between the first medium surface and the second medium surface of the object to be measured is calculated.

9. The device or method according to any one of claims 1 to 8, characterized in that: The light source unit includes a linear wide-spectrum emission device and a first slit aperture. The linear wide-spectrum emission device includes a light source and a light homogenizing device. The light source emits wide-spectrum light radiation, which is irradiated to the light homogenizing device for homogenization, and then generates the first light radiation through the first slit aperture.

10. The device or method according to any one of claims 1 to 8, characterized in that: The optical radiation emitting unit includes a first focusing component, a first dispersing component and a second focusing component in sequence. The first focusing component and the second focusing component are arranged non-coaxially. After the first optical radiation is irradiated to the optical radiation emitting unit, it passes through the first focusing component and then enters the first dispersing component for dispersion. Then, the dispersed second optical radiation of different wavelengths is focused to different height positions of the object to be measured through the second focusing component.

11. The device or method according to any one of claims 1 to 8, characterized in that: The optical radiation receiving unit comprises a third focusing component, a second dispersion component and a fourth focusing component in sequence, and the third focusing component and the fourth focusing component are arranged non-coaxially. After the third optical radiation of different wavelengths reflected by the measured object is received by the optical radiation receiving unit, it passes through the third focusing component and then enters the fourth focusing component through the second dispersion component for focusing, so as to obtain the fourth optical radiation of different wavelengths.

12. The device or method according to any one of claims 1 to 8, characterized in that: The spectral analysis unit includes a second slit aperture, a fifth focusing component, a third dispersion component, a sixth focusing component and an area array receiver in sequence. After the fourth light radiation of different wavelengths enters the spectral analysis unit, it is filtered out by the second slit aperture to focus the light radiation corresponding to the different height positions, passes through the fifth focusing component, enters the third dispersion component for dispersion, and is then focused onto the area array receiver by the sixth focusing component.

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