Fracturing pry electric cabinet temperature control method, device, equipment and medium

Abstract

The invention discloses a temperature control method, device and equipment for an electric cabinet of a fracturing pry and a medium, relates to the technical field of semiconductor refrigeration, is applied to a semiconductor cabinet air conditioner and comprises the steps that the current hot surface temperature and the current cold surface temperature of a semiconductor refrigeration sheet connected with the temperature control device of the electric cabinet of the fracturing pry are obtained; determining a temperature difference value between the current hot surface temperature and the current cold surface temperature, and adjusting a current current of the semiconductor cabinet air conditioner based on the temperature difference value to obtain an updated current; adjusting the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing pry electric control box and a preset target temperature interval value to obtain updated voltage; and performing temperature control on the fracturing pry electric cabinet according to the updated current and the updated voltage. According to the scheme, the current is adjusted based on the temperature difference value of the cold and hot surfaces of the semiconductor chilling plate, the voltage is adjusted according to the preset target temperature interval value, the refrigerating capacity is reasonably generated in the actual application environment, and the temperature of the electric cabinet of the fracturing pry can be effectively controlled.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor refrigeration technology, and in particular to a temperature control method, device, equipment and medium for a fracturing skid electric control box. Background Art

[0002] The fracturing skid is the main equipment for fracturing construction at an oil well site. During the construction process, multiple fracturing skids are closely arranged. When the ambient temperature reaches above 35°C, the temperature inside the fracturing skid's electrical control box becomes high (after 13:00 in the afternoon, when the ambient temperature exceeds 35°C, the temperature of the electrical control box exceeds 65°C). When the control system in the electrical control box is at high temperature, the portable tablet cannot be connected to the Internet normally, making remote control impossible. Therefore, the electrical control box needs to be installed with a cabinet air conditioner for cooling.

[0003] Traditional cabinet air conditioners all use air conditioning compressor refrigeration system, equipped with compressor, refrigerant, evaporator, condenser and air power system. On the one hand, the traditional cabinet air conditioner has a complex structure, large size and power consumption of more than 1.5KW. The fracturing skid electric control box is small in size (about 0.2m 3 ), which is not suitable for installing traditional cabinet air conditioners; on the other hand, in harsh environments, full power will lead to an increase in the temperature difference of the cooling plate, but the cooling efficiency is low and the energy consumption is high. However, during the fracturing construction process, the fracturing skid has no external power supply, and the equipment power is powered by the main generator, so it cannot meet the power demand of traditional cabinet air conditioners.

[0004] In summary, it can be seen that how to more reasonably control the temperature of the electrical control box of the fracturing skid in practical applications is a problem to be solved in the art. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide a method, device, equipment and medium for controlling the temperature of the electric control box of a fracturing skid, which can more reasonably control the temperature of the electric control box of the fracturing skid in practical applications. The specific scheme is as follows:

[0006] In the first aspect, the present application discloses a temperature control method for a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, comprising:

[0007] Obtain the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electric control box;

[0008] Determine a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current;

[0009] Adjusting the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electric control box and the preset target temperature interval value to obtain an updated voltage;

[0010] The temperature of the fracturing skid electric control box is controlled according to the updated current and the updated voltage.

[0011] Optionally, adjusting the current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current includes:

[0012] Determine the rated current and preset difference range of the semiconductor cabinet air conditioner;

[0013] Based on the relationship between the temperature difference and the preset difference range, the current of the semiconductor cabinet air conditioner is adjusted using the rated current to obtain an updated current.

[0014] Optionally, based on the relationship between the temperature difference and the preset difference range, the current of the semiconductor cabinet air conditioner is adjusted using the rated current to obtain an updated current, including:

[0015] If the temperature difference is not greater than the lowest value of the preset difference range, determining a first product of the rated current and a first preset ratio, and adjusting the current current of the semiconductor cabinet air conditioner to the first product to obtain an updated current;

[0016] If the temperature difference is not less than the highest value of the preset difference range, determining a second product of the rated current and a second preset ratio, and adjusting the current current of the semiconductor cabinet air conditioner to the second product to obtain an updated current;

[0017] If the temperature difference is less than the highest value of the preset difference range and greater than the lowest value of the preset difference range, the current duty cycle is determined based on the temperature difference and the preset current duty cycle conversion formula, and the current duty cycle, the rated current, and the preset current conversion formula are used to adjust the current of the semiconductor cabinet air conditioner to obtain an updated current.

[0018] Optionally, the current voltage of the semiconductor cabinet air conditioner is adjusted based on the current temperature value of the fracturing skid electric control box and a preset target temperature interval value to obtain an updated voltage, including:

[0019] Determining the rated voltage of the semiconductor cabinet air conditioner;

[0020] If the current temperature value of the fracturing skid electric control box is not less than the maximum value of the preset target temperature interval value, adjusting the current voltage of the semiconductor cabinet air conditioner to the rated voltage to obtain an updated voltage;

[0021] If the current temperature value of the fracturing skid electric control box is not greater than the minimum value of the preset target temperature interval value, the current voltage of the semiconductor cabinet air conditioner is adjusted to 0 to obtain an updated voltage;

[0022] If the current temperature value of the fracturing skid electrical control box is less than the maximum value of the preset target temperature interval value and greater than the minimum value of the preset target temperature interval value, the voltage duty cycle is determined using a preset voltage duty cycle conversion formula, and the current voltage of the semiconductor cabinet air conditioner is adjusted to the product of the voltage duty cycle and the rated voltage to obtain an updated voltage.

[0023] Optionally, the semiconductor cabinet air conditioner is connected to a display device, and after obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor refrigeration plate connected to the temperature control device of the fracturing skid electric control box, the method further includes:

[0024] Determine the current cooling capacity of the semiconductor cabinet air conditioner to obtain current parameter information of the semiconductor cabinet air conditioner; wherein the current parameter information includes any one or more parameter information of the current cooling capacity, the current hot surface temperature, the current cold surface temperature and the current temperature value of the fracturing skid electric control box;

[0025] The current parameter information is sent to the display device in real time so that the current parameter information is displayed on the display device.

[0026] Optionally, the semiconductor cabinet air conditioner is connected to an Internet of Things communication tool, and after determining the current cooling capacity of the semiconductor cabinet air conditioner to obtain current parameter information of the semiconductor cabinet air conditioner, the method further includes:

[0027] The current parameter information is sent to the Internet of Things communication tool so that the Internet of Things communication tool monitors the current parameter information in a networking mode.

[0028] Optionally, after determining the current cooling capacity of the semiconductor cabinet air conditioner to obtain current parameter information of the semiconductor cabinet air conditioner, the method further includes:

[0029] Based on the current parameter information and the current ambient temperature value, it is determined whether the semiconductor cabinet air conditioner currently meets the preset fault warning condition;

[0030] If the conditions are met, a corresponding early warning instruction is sent to the alarm tool so that the alarm tool issues an early warning based on the early warning instruction.

[0031] In the second aspect, the present application discloses a temperature control device for a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, comprising:

[0032] A temperature acquisition module is used to acquire the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electric control box;

[0033] A current updating module, used for determining a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjusting a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current;

[0034] A voltage updating module, used to adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electric control box and a preset target temperature interval value to obtain an updated voltage;

[0035] A temperature control module is used to control the temperature of the fracturing skid electric control box according to the updated current and the updated voltage.

[0036] In a third aspect, the present application discloses an electronic device, comprising:

[0037] Memory, used to store computer programs;

[0038] The processor is used to execute the computer program to implement the steps of the aforementioned disclosed method for controlling the temperature of the electrical control box of the fracturing skid.

[0039] In a fourth aspect, the present application discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, the steps of the aforementioned disclosed method for controlling the temperature of an electrical control box of a fracturing skid are implemented.

[0040] The beneficial effects of the present application are as follows: the present application is applied to a semiconductor cabinet air conditioner to obtain the current hot surface temperature and the current cold surface temperature of a semiconductor refrigeration plate connected to a temperature control device of an electrical control box of a fracturing skid; determine the temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust the current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current; adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the electrical control box of the fracturing skid and a preset target temperature interval value to obtain an updated voltage; and control the temperature of the electrical control box of the fracturing skid according to the updated current and the updated voltage. It can be seen that the semiconductor refrigeration plate of the semiconductor cabinet air conditioner of the present application is connected to the temperature control device of the fracturing pry electrical control box to obtain the current cold and hot surface temperatures of the semiconductor refrigeration plate to obtain the current temperature difference between the cold and hot surfaces. Because the cooling capacity of the semiconductor cabinet air conditioner is inversely proportional to the temperature difference between the cold and hot surfaces, adjusting the current of the semiconductor cabinet air conditioner based on the temperature difference can effectively control the temperature difference between the cold and hot surfaces, thereby generating more cooling capacity. On the other hand, the present application adjusts the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing pry electrical control box and the preset target temperature range value, which can further improve the cooling capacity of the semiconductor cabinet air conditioner, so that even if the fracturing pry electrical control box is used in harsh environments, the temperature of the fracturing pry electrical control box can be well controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0042] Figure 1 This is a flow chart of a temperature control method for a fracturing skid electric control box disclosed in this application;

[0043] Figure 2 A schematic diagram of a specific semiconductor cabinet air conditioner structure disclosed in this application;

[0044] Figure 3 A schematic diagram of a specific semiconductor cabinet air conditioner hardware structure disclosed in this application;

[0045] Figure 4 A schematic diagram of a multifunctional structure of a semiconductor cabinet air conditioner disclosed in this application;

[0046] Figure 5 This is a flow chart of a specific temperature control method for an electric control box of a fracturing skid disclosed in this application;

[0047] Figure 6A schematic diagram of a specific cold noodle characteristic curve disclosed in this application;

[0048] Figure 7 A schematic diagram of a specific hot surface characteristic curve disclosed in this application;

[0049] Figure 8 A specific comparative analysis schematic diagram disclosed in this application;

[0050] Fig. 9 This is another specific flow chart of the temperature control method of the electric control box of the fracturing skid disclosed in this application;

[0051] Fig.10 This is a schematic diagram of the structure of a temperature control device of a fracturing skid electric control box disclosed in this application;

[0052] Fig.11 This is a structural diagram of an electronic device disclosed in this application. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0054] The fracturing skid is the main equipment for fracturing construction at an oil well site. During the construction process, multiple fracturing skids are closely arranged. When the ambient temperature reaches above 35°C, the temperature inside the fracturing skid's electrical control box becomes high (after 13:00 in the afternoon, when the ambient temperature exceeds 35°C, the temperature of the electrical control box exceeds 65°C). When the control system in the electrical control box is at high temperature, the portable tablet cannot be connected to the Internet normally, making remote control impossible. Therefore, the electrical control box needs to be installed with a cabinet air conditioner for cooling.

[0055] Traditional cabinet air conditioners all use air conditioning compressor refrigeration system, equipped with compressor, refrigerant, evaporator, condenser and air power system. On the one hand, the traditional cabinet air conditioner has a complex structure, large size and power consumption of more than 1.5KW. The fracturing skid electric control box is small in size (about 0.2m 3 ), which is not suitable for installing traditional cabinet air conditioners; on the other hand, in harsh environments, full power will lead to an increase in the temperature difference of the cooling plate, but the cooling efficiency is low and the energy consumption is high. However, during the fracturing construction process, the fracturing skid has no external power supply, and the equipment power is powered by the main generator, so it cannot meet the power demand of traditional cabinet air conditioners.

[0056] To this end, the present application correspondingly provides a temperature control solution for the electric control box of a fracturing skid, which can more reasonably control the temperature of the electric control box of the fracturing skid in practical applications.

[0057] See also Figure 1 As shown, the embodiment of the present application discloses a temperature control method for a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, comprising:

[0058] Step S11: obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electrical control box.

[0059] The current hot surface temperature, the current cold surface temperature of the semiconductor refrigeration sheet and the current temperature value of the fracturing skid electric control box are collected in real time. It is understandable that the semiconductor refrigeration sheet of the semiconductor cabinet air conditioner is connected to the temperature control device of the fracturing skid electric control box in advance, that is, the cold sheet of the semiconductor refrigeration sheet is fixed to the heat dissipation device in the temperature control device, and the hot sheet of the semiconductor refrigeration sheet is fixed to the cooling device in the temperature control device, for example Figure 2 A specific schematic diagram of the structure of a semiconductor cabinet air conditioner is shown, wherein the semiconductor cabinet air conditioner is driven by dual PWM (Pulse Width Modulation) control.

[0060] There is an important conclusion in PWM sampling control theory, that is, "when narrow pulses with equal impulses but different shapes are added to a link with inertia, the effect is basically the same." PWM control technology is based on this conclusion, controlling the on and off of semiconductor switching devices, so that the output end obtains a series of pulses with equal amplitudes but unequal widths, and uses these pulses to replace sine waves or other required waveforms. Semiconductor cabinet air conditioner dual PWM control includes current control PWM and voltage control PWM.

[0061] For example Figure 3 The schematic diagram of a specific semiconductor cabinet air conditioner hardware structure is shown, the dual PWM control drive uses the STM32 microprocessor as the main control unit, the drive unit adopts a voltage-limited constant current control circuit, that is, constant voltage first, then constant current, the current control PWM adopts a PWM constant current drive device, and the voltage control PWM adopts a PWM voltage regulator. The STM32 main control unit outputs two PWM signals, which are respectively connected to the PWM input ends of the PWM constant current drive device and the PWM voltage regulator. Each temperature monitoring point is equipped with a temperature sensor, including an ambient temperature sensor, a semiconductor refrigeration plate cold surface temperature sensor, a semiconductor refrigeration plate hot surface temperature sensor, and an internal temperature sensor of the device, which are respectively connected to the STM32 analog signal input end (Analog-to-Digital Converter, i.e. ADC). The semiconductor cabinet air conditioner also includes a DC-DC module for power conversion to realize power supply to the semiconductor cabinet air conditioner.

[0062] Step S12: determining a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjusting a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current.

[0063] Calculate the temperature difference between the current hot surface temperature and the current cold surface temperature, and then use the temperature difference to determine the current duty cycle. By determining the current duty cycle, the corresponding updated current can be determined. During the operation of the system, the heat dissipation device and cooling device of the fracturing skid electrical control box make the temperature difference between the hot and cold surfaces of the semiconductor refrigeration plate reach a dynamic balance. The change in the temperature difference between the hot and cold surfaces can reflect the operating status of the system in real time. The heat dissipation device and the cooling device will change with the ambient temperature. When the current is constant, the temperature difference between the hot and cold surfaces increases, indicating that the system heat dissipation device cannot diffuse all the heat generated by the hot surface, breaking the dynamic balance of the hot and cold surfaces and causing heat accumulation. The heat generated by the hot surface mainly consists of two parts. One part is the heat diffused from the cold surface that is equal to the cooling capacity, and the other part is the heat generated by the electrical power consumption, that is, the thermal power formula: The heat generated by the electrical power consumption = I 2 *R, where I is the current of the semiconductor cooling chip, and R is the internal resistance of the PN (Positive Negative) junction. If the working current is adjusted at this time, the power consumption and heat energy will be greatly reduced, the hot and cold surfaces will be restored to a dynamic balance, and a stable temperature difference between the hot and cold surfaces will be maintained.

[0064] Step S13: adjusting the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electrical control box and the preset target temperature range value to obtain an updated voltage.

[0065] Unlike conventional temperature control devices, the fracturing skid electric control box semiconductor cabinet air conditioner does not need to maintain a constant temperature, but only needs to keep the temperature inside the box within the range of normal operation of the equipment. Therefore, the preset target temperature interval value is not a single value, but an interval value of the target upper limit temperature and the target lower limit temperature. In practical applications, for example, it is 25℃-45℃, that is, the target upper limit temperature is 45℃, and the target lower limit temperature is 25℃, that is, the maximum value of the preset target temperature interval value is 45℃, and the minimum value is 25℃. The driving device adjusts the duty cycle of the working voltage according to the preset target temperature interval value, and the duty cycle adjustment range is 0-100%. When the current temperature value of the fracturing skid electrical control box is greater than or equal to 45°C, the corresponding voltage duty cycle is 100%. When the current temperature value of the fracturing skid electrical control box is less than or equal to 25°C, the corresponding voltage duty cycle is 0%. When the current temperature value of the fracturing skid electrical control box is between the preset target temperature interval values, the system converts the voltage duty cycle according to the temperature change in each cycle. When the voltage duty cycle is 0, the output device driving voltage is 0. When the voltage duty cycle is 100%, the output device driving voltage is the rated voltage.

[0066] Step S14: temperature control of the fracturing skid electric control box is performed according to the updated current and the updated voltage.

[0067] The semiconductor cabinet air conditioner is cooled according to the updated current and updated voltage, so that the temperature of the fracturing skid electric control box can be controlled. It should be noted that the semiconductor cabinet air conditioner can also be connected with display devices, IoT communication tools, and alarm tools, such as Figure 4 The specific semiconductor cabinet air conditioner multifunctional structural diagram shown not only realizes the working status display function but also realizes the emergency warning function, making it easier for users to understand the working status of the fracturing skid electric control box and the semiconductor cabinet air conditioner and make emergency operations in time.

[0068] In this embodiment, the semiconductor cabinet air conditioner is connected to the display device, and after obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor refrigeration plate connected to the temperature control device of the fracturing pry electric control box, it also includes: determining the current cooling capacity of the semiconductor cabinet air conditioner to obtain the current parameter information of the semiconductor cabinet air conditioner; wherein the current parameter information includes any one or more parameter information of the current cooling capacity, the current hot surface temperature, the current cold surface temperature and the current temperature value of the fracturing pry electric control box; sending the current parameter information to the display device in real time so that the current parameter information can be displayed in the display device. The display side is connected to the STM32 main controller I 2 The port can display the internal temperature of the fracturing skid electric control box, the cold and hot surface temperature of the refrigeration plate of the semiconductor cabinet air conditioner, and the voltage, current, power, cooling capacity (W) and other parameter information of the semiconductor cabinet air conditioner in real time. Among them, the specific parameter information to be displayed can be set by the user. For example, the user can set it to display only the internal temperature of the fracturing skid electric control box, or the user can set it to display the internal temperature of the fracturing skid electric control box and the cooling capacity of the semiconductor cabinet air conditioner when it is running.

[0069] In this embodiment, the semiconductor cabinet air conditioner is connected to an Internet of Things communication tool, and after the current cooling capacity of the semiconductor cabinet air conditioner is determined to obtain the current parameter information of the semiconductor cabinet air conditioner, the method further includes: sending the current parameter information to the Internet of Things communication tool so that the Internet of Things communication tool monitors the current parameter information in a networking mode. The Internet of Things communication tool is connected to the UART (Universal Asynchronous Receiver / Transmitter) port of the STM32 main controller, and the current parameter information can be packaged for wireless data transmission, and the MODBUS standard communication protocol is adopted to realize remote monitoring and wireless self-organizing network management, wherein the networking mode is a point-to-multipoint patrol, that is, an Internet of Things communication tool can monitor multiple devices at the same time.

[0070] In this embodiment, after determining the current cooling capacity of the semiconductor cabinet air conditioner to obtain the current parameter information of the semiconductor cabinet air conditioner, it also includes: judging whether the semiconductor cabinet air conditioner currently meets the preset fault warning conditions based on the current parameter information and the current ambient temperature value; if satisfied, sending the corresponding warning instruction to the alarm tool so that the alarm tool can issue an early warning based on the early warning instruction. The alarm tool is connected to the STM32 DO (signal output) port, and the alarm tool can be an audible and visual alarm tool. The STM32 main controller judges whether the semiconductor cabinet air conditioner currently meets the preset fault warning conditions based on the current parameter information and the current ambient temperature value. If satisfied, the corresponding early warning instruction is sent to the alarm tool, so that the alarm tool issues an early warning based on the early warning instruction, and can also be reported to the Internet of Things communication tool and display device to achieve real-time early warning display. Among them, the preset fault warning conditions can be multiple conditions, so the corresponding early warning instructions and early warning measures are also multiple, as shown below:

[0071] 1) The current parameter information and the current ambient temperature value are: when the ambient temperature remains unchanged, the hot surface temperature of the semiconductor refrigeration plate rises rapidly, and the early warning instruction is used to trigger the heat dissipation device failure early warning of the fracturing skid electric control box, and the corresponding early warning measure is only the sound alarm;

[0072] 2) The current parameter information and the current ambient temperature value are: when the hot surface temperature of the semiconductor refrigeration plate remains unchanged and the cold surface temperature rises rapidly, the early warning instruction is used to trigger the failure early warning of the cooling device of the fracturing skid electric control box, and the corresponding early warning measure is only light alarm;

[0073] 3) The current parameter information and the current ambient temperature value are: when the temperature difference between the cold and hot surfaces of the semiconductor refrigeration plate is rapidly reduced (that is, the cold surface temperature rises rapidly and the hot surface temperature drops at the same time), the early warning instruction is used to trigger the semiconductor refrigeration plate early warning of the semiconductor cabinet air conditioner, and the corresponding early warning measures are sound alarm and light alarm.

[0074] The beneficial effects of the present application are as follows: the present application is applied to a semiconductor cabinet air conditioner to obtain the current hot surface temperature and the current cold surface temperature of a semiconductor refrigeration plate connected to a temperature control device of an electrical control box of a fracturing skid; determine the temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust the current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current; adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the electrical control box of the fracturing skid and a preset target temperature interval value to obtain an updated voltage; and control the temperature of the electrical control box of the fracturing skid according to the updated current and the updated voltage. It can be seen that the semiconductor refrigeration plate of the semiconductor cabinet air conditioner of the present application is connected to the temperature control device of the fracturing pry electrical control box to obtain the current cold and hot surface temperatures of the semiconductor refrigeration plate to obtain the current temperature difference between the cold and hot surfaces. Because the cooling capacity of the semiconductor cabinet air conditioner is inversely proportional to the temperature difference between the cold and hot surfaces, adjusting the current of the semiconductor cabinet air conditioner based on the temperature difference can effectively control the temperature difference between the cold and hot surfaces, thereby generating more cooling capacity. On the other hand, the present application adjusts the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing pry electrical control box and the preset target temperature range value, which can further improve the cooling capacity of the semiconductor cabinet air conditioner, so that even if the fracturing pry electrical control box is used in harsh environments, the temperature of the fracturing pry electrical control box can be well controlled.

[0075] See also Figure 5 As shown, the embodiment of the present application discloses a specific temperature control method of a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, including:

[0076] Step S21: obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electrical control box.

[0077] This embodiment takes the semiconductor refrigeration chip TEC1-24115 as an example to analyze the cold surface characteristics and hot surface characteristics of the semiconductor refrigeration chip, as follows:

[0078] 1) Analysis of cold surface characteristic curve of semiconductor refrigeration sheet: for example Figure 6 Taking a specific cold surface characteristic curve schematic diagram as an example, when the hot surface temperature (Thot) of the semiconductor refrigeration element is 30°C, the current is 15A, and the temperature difference between the hot and cold surfaces is 10-20°C, the cooling capacity is about 200W; when the temperature difference between the hot and cold surfaces is 20-30°C, the cooling capacity is about 160W, a decrease of 20%; when the temperature difference between the hot and cold surfaces is 30-40°C, the cooling capacity is about 120W, and so on. For every 10°C increase in the temperature difference between the hot and cold surfaces, the cooling capacity decreases by 40W. When the temperature difference between the hot and cold surfaces reaches the maximum value, the cooling capacity returns to zero.

[0079] 2) Analysis of thermal surface characteristic curve of semiconductor refrigeration chip: for example Figure 7Taking a specific hot surface characteristic curve diagram shown as an example, when the hot surface temperature of the semiconductor refrigeration plate is 50°C, the cooling capacity gradually decreases as the temperature difference between the hot and cold surfaces increases.

[0080] 3) Comparative analysis of the hot and cold surface characteristic curves of semiconductor refrigeration chips: for example Figure 8 Taking a specific comparative analysis schematic diagram as an example, the volt-ampere characteristic curves of Thot=30℃ and Thot=50℃ are compared. When the hot surface temperature of the semiconductor refrigerator increases, the voltage of the semiconductor refrigerator will increase slightly under the same current condition, and the power consumption will increase, but the change is not large.

[0081] Therefore, according to the above analysis, when the current is determined, the cooling capacity will decrease significantly as the temperature difference between the hot and cold ends increases. In other words, the cooling capacity of the semiconductor refrigeration sheet changes with the current in a parabolic relationship. When the temperature difference between the hot and cold ends is determined, the cooling capacity reaches the maximum value when the current has a constant value. In this way, controlling the temperature difference between the hot and cold surfaces of the semiconductor refrigeration sheet can effectively improve the cooling capacity, thereby achieving temperature control of the fracturing pry electric control box under low power consumption.

[0082] Step S22: Determine the temperature difference between the current hot surface temperature and the current cold surface temperature.

[0083] Step S23: determining the rated current and preset difference range of the semiconductor cabinet air conditioner; based on the relationship between the temperature difference and the preset difference range, adjusting the current of the semiconductor cabinet air conditioner using the rated current to obtain an updated current.

[0084] In this embodiment, based on the magnitude relationship between the temperature difference and the preset difference range, and using the rated current to adjust the current of the semiconductor cabinet air conditioner to obtain an updated current, which includes: if the temperature difference is not greater than the minimum value of the preset difference range, determine the first product of the rated current and the first preset ratio, and adjust the current of the semiconductor cabinet air conditioner to the first product to obtain an updated current; if the temperature difference is not less than the maximum value of the preset difference range, determine the second product of the rated current and the second preset ratio, and adjust the current of the semiconductor cabinet air conditioner to the second product to obtain an updated current; if the temperature difference is less than the maximum value of the preset difference range and greater than the minimum value of the preset difference range, determine the current duty ratio based on the temperature difference and the preset current duty ratio conversion relationship, and use the current duty ratio, the rated current, and the preset current conversion relationship to adjust the current of the semiconductor cabinet air conditioner to obtain an updated current. The current control PWM adjusts the output current duty ratio Pi according to the temperature difference Tm between the hot and cold surfaces of the thermoelectric cooler, with a range of 0-100%, and then adjusts the current I. The current adjustment is specifically as follows:

[0085] Set the preset difference range to 10°C - 50°C. That is to say, the minimum value of the preset difference range is 10°C, the maximum value of the preset difference range is 50°C, set the first preset ratio to 80%, the second preset ratio to 20%, and the temperature difference limit value between the hot and cold surfaces of the thermoelectric cooler is 66°C;

[0086] 1) When Tm ≤ 10°C, Pi = 100%, I = rated current * 80%;

[0087] 2) When Tm ≥ 50°C, Pi = 0, I = rated current * 20%;

[0088] 3) When 10°C < Tm < 50°C: Pi = 100% - (Tm - 10) * (100% / 40); I = (Pi * rated current * 60%) + (rated current * 20%);

[0089] Adjust the current according to the above current adjustment method to obtain the adjusted current I.

[0090] Step S24: Based on the current temperature value of the fracturing skid electric control box and the preset target temperature range value, adjust the current voltage of the semiconductor cabinet air conditioner to obtain an updated voltage.

[0091] Step S25: Control the temperature of the fracturing skid electric control box according to the updated current and the updated voltage.

[0092] It can be seen that, based on the theory that when the current size is determined, the cooling capacity will decrease significantly as the temperature difference between the cold and hot ends increases, the present application adjusts the temperature difference between the cold and hot surfaces of the semiconductor refrigeration plate, that is, adjusts the current and then adjusts the temperature difference, so that the subsequent cooling capacity is increased and the required power consumption is reduced, so that the semiconductor cabinet air conditioner is suitable for industrial high temperature environments and obtains maximum cooling efficiency with minimum electric power.

[0093] See also Fig. 9 As shown, the embodiment of the present application discloses a specific temperature control method of a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, including:

[0094] Step S31: obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electrical control box.

[0095] Step S32: determining a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjusting a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current.

[0096] Step S33: Determine the rated voltage of the semiconductor cabinet air conditioner.

[0097] Determine the rated voltage and preset target temperature range value (such as 25℃-45℃) of the semiconductor cabinet air conditioner, that is, the maximum value TH of the preset target temperature range value is 45℃, the minimum value TL of the preset target temperature range value is 25℃, and use the equipment temperature sensor to collect the current temperature value TM of the fracturing skid electrical control box.

[0098] Step S34: If the current temperature value of the fracturing skid electrical control box is not less than the maximum value of the preset target temperature interval value, the current voltage of the semiconductor cabinet air conditioner is adjusted to the rated voltage to obtain an updated voltage.

[0099] If the current temperature value TM of the fracturing skid electric control box is not less than the maximum value of the preset target temperature interval value, that is, TM≥TH, then the voltage duty cycle Pv=100%, and the updated voltage V=rated voltage.

[0100] Step S35: If the current temperature value of the fracturing skid electrical control box is not greater than the minimum value of the preset target temperature range value, the current voltage of the semiconductor cabinet air conditioner is adjusted to 0 to obtain an updated voltage.

[0101] If the current temperature value TM of the fracturing skid electric control box is not greater than the minimum value of the preset target temperature interval value, that is, TM≤TL, then the voltage duty cycle Pv=0, and the updated voltage V=0.

[0102] Step S36: If the current temperature value of the fracturing skid electrical control box is less than the maximum value of the preset target temperature interval value and greater than the minimum value of the preset target temperature interval value, the voltage duty cycle is determined using a preset voltage duty cycle conversion formula, and the current voltage of the semiconductor cabinet air conditioner is adjusted to the product of the voltage duty cycle and the rated voltage to obtain an updated voltage.

[0103] If the current temperature value TM of the fracturing skid electric control box is less than the maximum value of the preset target temperature interval value and greater than the minimum value of the preset target temperature interval value, that is, TH>TM>TL, then it is necessary to first determine the voltage duty cycle Pv using the preset voltage duty cycle conversion relationship, and then adjust the current voltage of the semiconductor cabinet air conditioner to the product of the voltage duty cycle and the rated voltage, that is, the updated voltage V = rated voltage * Pv; wherein, the preset voltage duty cycle conversion relationship is:

[0104] Pv=((TM-TL) / (TH-TL))*100%.

[0105] Step S37: temperature control of the fracturing skid electrical control box is performed according to the updated current and the updated voltage.

[0106] It can be seen that, on the one hand, the present application adjusts the current of the semiconductor cabinet air conditioner to correct the temperature difference between the hot and cold surfaces of the semiconductor refrigeration plate of the semiconductor cabinet air conditioner. Compared with the full-power refrigeration effect of the prior art, the present application generates more cooling capacity but requires less power consumption; on the other hand, when the present application adjusts the temperature of the fracturing pry electrical control box, the adjustment standard is an interval value, not a single value, and the working voltage is periodically adjusted to make the semiconductor cabinet air conditioner run smoothly. Compared with the conventional temperature control switch control mode, the equipment will not be frequently switched on and off, and the internal temperature of the equipment is relatively stable.

[0107] The application is described below. The semiconductor cabinet air conditioner utilizes the Peltier effect of semiconductor materials and uses electrical energy to continuously accumulate the heat from the cold end to the hot end. The greater the temperature difference between the cold end and the hot end, the greater the thermal resistance of the semiconductor refrigeration process. When the temperature difference between the cold and hot ends reaches 66°C, the heat cannot be accumulated and the cooling capacity of the semiconductor device drops to 0. In other words, maintaining the temperature difference between the cold and hot ends is the main condition of the semiconductor refrigeration system.

[0108] First, this application breaks the control mode centered on the target temperature, uses current PWM to control the temperature difference between the hot and cold ends of the semiconductor device, and dynamically corrects the cooling efficiency to maintain the maximum cooling output at different ambient temperatures, thereby reducing the system power consumption while obtaining the same cooling capacity. For example, taking the semiconductor cooling chip 24115 as an example, according to the above characteristic curve analysis, there are two states that can output a cooling capacity of about 100W:

[0109] (1) The temperature difference between the hot and cold ends is 20°C, and the working current is 10A;

[0110] (2) The temperature difference between the hot and cold ends is 40°C, and the operating current is 14A;

[0111] Therefore, reducing the current can gradually reduce the temperature difference between the hot and cold surfaces, thereby increasing the cooling capacity and achieving cooling in a low-power mode.

[0112] Secondly, the fracturing skid electric control box semiconductor cabinet air conditioning voltage PWM control, with 25℃--45℃ temperature range as the preset target temperature range value, adjusts the semiconductor device working voltage. When the ambient temperature is higher than 25℃, the system starts to run. As the ambient temperature slowly rises, the system cooling power gradually increases, so that the temperature inside the box is always lower than the ambient temperature. When the temperature inside the box exceeds 45℃, the system starts full power mode.

[0113] Through the above current adjustment and voltage adjustment, the temperature of the fracturing skid electric control box can be effectively controlled. For example, when the ambient temperature is 30°C, the semiconductor cabinet air conditioner can control the temperature inside the box to about 25°C; when the ambient temperature is 40°C, the semiconductor cabinet air conditioner can control the temperature inside the box to about 32°C; when the ambient temperature is 50°C, the semiconductor cabinet air conditioner can control the temperature inside the box to about 43°C.

[0114] See also Fig.10 As shown, the embodiment of the present application discloses a temperature control device for a fracturing skid electric control box, which is applied to a semiconductor cabinet air conditioner, including:

[0115] The temperature acquisition module 11 is used to acquire the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electric control box;

[0116] A current updating module 12, used to determine a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current;

[0117] A voltage updating module 13, configured to adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electric control box and a preset target temperature interval value to obtain an updated voltage;

[0118] The temperature control module 14 is used to control the temperature of the fracturing skid electric control box according to the updated current and the updated voltage.

[0119] The beneficial effects of the present application are as follows: the present application is applied to a semiconductor cabinet air conditioner to obtain the current hot surface temperature and the current cold surface temperature of a semiconductor refrigeration plate connected to a temperature control device of an electrical control box of a fracturing skid; determine the temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust the current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current; adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the electrical control box of the fracturing skid and a preset target temperature interval value to obtain an updated voltage; and control the temperature of the electrical control box of the fracturing skid according to the updated current and the updated voltage. It can be seen that the semiconductor refrigeration plate of the semiconductor cabinet air conditioner of the present application is connected to the temperature control device of the fracturing pry electrical control box to obtain the current cold and hot surface temperatures of the semiconductor refrigeration plate to obtain the current temperature difference between the cold and hot surfaces. Because the cooling capacity of the semiconductor cabinet air conditioner is inversely proportional to the temperature difference between the cold and hot surfaces, adjusting the current of the semiconductor cabinet air conditioner based on the temperature difference can effectively control the temperature difference between the cold and hot surfaces, thereby generating more cooling capacity. On the other hand, the present application adjusts the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing pry electrical control box and the preset target temperature range value, which can further improve the cooling capacity of the semiconductor cabinet air conditioner, so that even if the fracturing pry electrical control box is used in harsh environments, the temperature of the fracturing pry electrical control box can be well controlled.

[0120] Furthermore, an embodiment of the present application also provides an electronic device. Fig.11 This is a structural diagram of an electronic device 20 according to an exemplary embodiment. The content in the diagram cannot be regarded as any limitation on the scope of use of the present application.

[0121] Fig.11 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Specifically, it may include: at least one processor 21, at least one memory 22, a power supply 23, a communication interface 24, an input / output interface 25, and a communication bus 26. The memory 22 is used to store a computer program, which is loaded and executed by the processor 21 to implement the relevant steps in the temperature control method of the fracturing skid electric control box executed by the electronic device disclosed in any of the aforementioned embodiments.

[0122] In this embodiment, the power supply 23 is used to provide working voltage for each hardware device on the electronic device; the communication interface 24 can create a data transmission channel between the electronic device and the external device, and the communication protocol it follows is any communication protocol that can be applied to the technical solution of the present application, and is not specifically limited here; the input and output interface 25 is used to obtain external input data or output data to the outside world, and its specific interface type can be selected according to specific application needs and is not specifically limited here.

[0123] Among them, the processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 21 can be implemented in at least one hardware form of DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). The processor 21 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU (Central Processing Unit); the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 21 may be integrated with a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 21 may also include an AI (Artificial Intelligence) processor, which is used to process computing operations related to machine learning.

[0124] In addition, the memory 22, as a carrier for storing resources, can be a read-only memory, a random access memory, a disk or an optical disk, etc. The resources stored thereon include an operating system 221, a computer program 222 and data 223, etc. The storage method can be temporary storage or permanent storage.

[0125] The operating system 221 is used to manage and control the hardware devices and computer programs 222 on the electronic device, so as to realize the operation and processing of the massive data 223 in the memory 22 by the processor 21, which can be Windows, Unix, Linux, etc. In addition to including a computer program that can be used to complete the temperature control method of the fracturing skid electric control box executed by the electronic device disclosed in any of the aforementioned embodiments, the computer program 222 can further include a computer program that can be used to complete other specific tasks. In addition to data transmitted from an external device received by the electronic device, the data 223 can also include data collected by its own input and output interface 25.

[0126] Furthermore, the present application also discloses a computer-readable storage medium for storing a computer program; wherein, when the computer program is executed by a processor, the temperature control method of the electric control box of the fracturing skid disclosed above is implemented. For the specific steps of the method, reference may be made to the corresponding contents disclosed in the aforementioned embodiments, and no further description will be given here.

[0127] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0128] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented with electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application. The steps of the method or algorithm described in conjunction with the embodiments disclosed herein can be implemented directly with hardware, a software module executed by a processor, or a combination of the two. The software module can be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable EPROM (Erasable Programmable Read Only Memory), an electrically erasable programmable EEPROM (Electrically Erasable Programmable read only memory), a register, a hard disk, a removable disk, a CD-ROM (Compact Disc Read-Only Memory), or any other form of storage medium known in the technical field.

[0129] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0130] The above is a detailed introduction to the temperature control method, device, equipment and medium of the fracturing skid electric control box provided by the present invention. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A temperature control method for a fracturing skid electric control box, characterized in that: Applied to semiconductor cabinet air conditioners, including: Obtain the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electric control box; Determine a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjust a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current; Adjusting the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electric control box and the preset target temperature interval value to obtain an updated voltage; The temperature of the fracturing skid electric control box is controlled according to the updated current and the updated voltage.

2. The temperature control method of the fracturing skid electric control box according to claim 1, characterized in that: The step of adjusting the current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current includes: Determine the rated current and preset difference range of the semiconductor cabinet air conditioner; Based on the relationship between the temperature difference and the preset difference range, the current of the semiconductor cabinet air conditioner is adjusted using the rated current to obtain an updated current.

3. The temperature control method of the fracturing skid electric control box according to claim 2, characterized in that: The adjusting the current of the semiconductor cabinet air conditioner based on the relationship between the temperature difference and the preset difference range and using the rated current to obtain an updated current includes: If the temperature difference is not greater than the lowest value of the preset difference range, determining a first product of the rated current and a first preset ratio, and adjusting the current current of the semiconductor cabinet air conditioner to the first product to obtain an updated current; If the temperature difference is not less than the highest value of the preset difference range, determining a second product of the rated current and a second preset ratio, and adjusting the current current of the semiconductor cabinet air conditioner to the second product to obtain an updated current; If the temperature difference is less than the highest value of the preset difference range and greater than the lowest value of the preset difference range, the current duty cycle is determined based on the temperature difference and the preset current duty cycle conversion formula, and the current duty cycle, the rated current, and the preset current conversion formula are used to adjust the current of the semiconductor cabinet air conditioner to obtain an updated current.

4. The temperature control method of the fracturing skid electric control box according to claim 1, characterized in that: The current voltage of the semiconductor cabinet air conditioner is adjusted based on the current temperature value of the fracturing skid electric control box and the preset target temperature interval value to obtain an updated voltage, including: Determining the rated voltage of the semiconductor cabinet air conditioner; If the current temperature value of the fracturing skid electric control box is not less than the maximum value of the preset target temperature interval value, adjusting the current voltage of the semiconductor cabinet air conditioner to the rated voltage to obtain an updated voltage; If the current temperature value of the fracturing skid electric control box is not greater than the minimum value of the preset target temperature interval value, the current voltage of the semiconductor cabinet air conditioner is adjusted to 0 to obtain an updated voltage; If the current temperature value of the fracturing skid electrical control box is less than the maximum value of the preset target temperature interval value and greater than the minimum value of the preset target temperature interval value, the voltage duty cycle is determined using a preset voltage duty cycle conversion formula, and the current voltage of the semiconductor cabinet air conditioner is adjusted to the product of the voltage duty cycle and the rated voltage to obtain an updated voltage.

5. The temperature control method of the fracturing skid electric control box according to any one of claims 1 to 4, characterized in that: The semiconductor cabinet air conditioner is connected to the display device, and after obtaining the current hot surface temperature and the current cold surface temperature of the semiconductor refrigeration plate connected to the temperature control device of the fracturing skid electric control box, the method further includes: Determine the current cooling capacity of the semiconductor cabinet air conditioner to obtain current parameter information of the semiconductor cabinet air conditioner; wherein the current parameter information includes any one or more parameter information of the current cooling capacity, the current hot surface temperature, the current cold surface temperature and the current temperature value of the fracturing skid electric control box; The current parameter information is sent to the display device in real time so that the current parameter information is displayed on the display device.

6. The temperature control method of the fracturing skid electric control box according to claim 5, characterized in that: The semiconductor cabinet air conditioner is connected to an Internet of Things communication tool, and after the current cooling capacity of the semiconductor cabinet air conditioner is determined to obtain current parameter information of the semiconductor cabinet air conditioner, the method further includes: The current parameter information is sent to the Internet of Things communication tool so that the Internet of Things communication tool monitors the current parameter information in a networking mode.

7. The temperature control method of the fracturing skid electric control box according to claim 5, characterized in that: After determining the current cooling capacity of the semiconductor cabinet air conditioner to obtain current parameter information of the semiconductor cabinet air conditioner, the method further includes: Based on the current parameter information and the current ambient temperature value, it is determined whether the semiconductor cabinet air conditioner currently meets the preset fault warning condition; If the conditions are met, a corresponding early warning instruction is sent to the alarm tool so that the alarm tool issues an early warning based on the early warning instruction.

8. A temperature control device for a fracturing skid electric control box, characterized in that: Applied to semiconductor cabinet air conditioners, including: A temperature acquisition module is used to acquire the current hot surface temperature and the current cold surface temperature of the semiconductor cooling plate connected to the temperature control device of the fracturing skid electric control box; A current updating module, used for determining a temperature difference between the current hot surface temperature and the current cold surface temperature, and adjusting a current current of the semiconductor cabinet air conditioner based on the temperature difference to obtain an updated current; A voltage updating module, used to adjust the current voltage of the semiconductor cabinet air conditioner based on the current temperature value of the fracturing skid electric control box and a preset target temperature interval value to obtain an updated voltage; A temperature control module is used to control the temperature of the fracturing skid electric control box according to the updated current and the updated voltage.

9. An electronic device, characterized in that: include: Memory, used to store computer programs; A processor is used to execute the computer program to implement the steps of the temperature control method of the electrical control box of the fracturing skid as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: Used to store computer programs; wherein, when the computer program is executed by a processor, the steps of the temperature control method of the electrical control box of the fracturing skid are implemented as described in any one of claims 1 to 7.

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