Display panel, display device and manufacturing method of display panel

By slowing down the depression angle in the touch signal opening area of ​​the display panel and using a multi-level depression structure overlap, the film layer etching incomplete and fracture caused by the reduction of the wiring area is solved, and a higher etching integrity and display effect are achieved.

CN120010693APending Publication Date: 2025-05-16BOE TECHNOLOGY GROUP CO LTD +1
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Patent Information

Application Number
CN202510095747.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-21
Publication Date
2025-05-16

AI Technical Summary

Technical Problem

As the wiring area of ​​the display panel continues to shrink, the depression angle at the depression is too large, and the film layer cannot be completely etched, resulting in the film layer breaking during the subsequent stacking process and water vapor entering, causing the metal film layer to oxidize, affecting the display effect.

Method used

By changing the recess angle of the touch signal opening area, the recess angle of the etching area is slowed down, and a multi-level recess structure and parallel area overlap are used to ensure that the film layer etching is completely residue-free and the film layer is avoided.

Benefits of technology

It improves the etching integrity, ensures the quality of the film layer during subsequent stacking, prevents water vapor from entering, extends the service life of the display panel, and improves the display effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a display panel, a display device and a manufacturing method of the display panel, and generally relates to the technical field of display equipment. A non-display area of the display panel comprises a touch signal opening area, and the touch signal opening area comprises a substrate layer, a door signal transmission layer arranged on one side of the substrate layer, a first conductive layer arranged on the side, away from the substrate layer, of the door signal transmission layer, and a first electrode layer arranged on the side, away from the substrate layer, of the first conductive layer; in the orthographic projection area of the gate signal transmission layer, the first conductive layer comprises a parallel area at the bottom layer of the touch signal opening area or a multi-level sunken structure of the touch signal opening area, and the parallel area or the multi-level sunken structure of the first conductive layer is in lap joint with the first electrode layer; the multi-level sunken structure comprises an opening parallel area and slope structures on the two sides of the opening parallel area. The slope structure on each side comprises at least two sub-slope structures, and the angle of each sub-slope structure in the at least two sub-slope structures is smaller than a preset angle.
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Description

Technical Field

[0001] The present disclosure generally relates to the technical field of display devices, and more particularly to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] With the continuous development of display panels, the effective display area of ​​display panels continues to increase.

[0003] In order to increase the effective display area of ​​the display panel, it is usually achieved by continuously narrowing the frame of the display panel. Generally, the frame of the display panel is the wiring area of ​​the display panel. When the frame of the display panel is narrowed, the area of ​​the wiring area is continuously reduced.

[0004] In the related art, the display panel is formed by stacking multiple film layers. Accordingly, in the frame area, the wiring of the display panel is also completed by stacking multiple film layers. When part of the film layer of the display panel needs to be overlapped across the film layer, the already formed film layer may be etched away to form a recess, and the cross-film layer overlap wiring is performed in the recess.

[0005] However, due to the continuous reduction and narrowing of the wiring area, the depression angle of the above-mentioned depression is too large, and the film layer that needs to be etched in the depression area cannot be etched cleanly. In the subsequent process of film layer stacking, the residual film layer is likely to cause the subsequent stacked film layer to break, and then it is easy for water vapor to enter from the film layer break, thereby causing partial oxidation of the metal film layer of the display film layer, and ultimately affecting the display effect. Summary of the invention

[0006] In view of the above-mentioned defects or shortcomings in the relevant technology, it is expected to provide a display panel, a display device and a method for manufacturing a display panel, which can solve the problem that the depression angle of the above-mentioned depression is too large due to the continuous reduction and narrowing of the wiring area, and thus the film layer to be etched in the depression area cannot be etched cleanly, and in the subsequent film layer stacking process, the residual film layer is likely to cause the subsequent stacked film layer to have a film layer fracture, and then it is easy for water vapor to enter from the film layer fracture, thereby causing partial oxidation of the metal film layer of the display film layer, and finally affecting the display effect. By reducing the depression angle of the area to be etched in the display panel, the etching completeness is improved, ensuring that no film layer cracks will appear when the subsequent stacking is continued on the cleanly etched film layer without residue.

[0007] In a first aspect, a display panel is provided, wherein a non-display area of ​​the display panel includes a touch signal opening area, wherein the touch signal opening area includes a substrate layer, a gate signal transmission layer disposed on one side of the substrate layer, a first conductive layer disposed on a side of the gate signal transmission layer away from the substrate layer, and a first electrode layer disposed on a side of the first conductive layer away from the substrate layer;

[0008] In the orthographic projection area of ​​the gate signal transmission layer, the first conductive layer includes: a parallel area of ​​the bottom layer of the touch signal opening area, or a multi-level recessed structure of the touch signal opening area, and the parallel area or the multi-level recessed structure of the first conductive layer overlaps with the first electrode layer;

[0009] The multi-level recessed structure includes an opening parallel region and slope structures on both sides of the opening parallel region; the slope structure on each side includes at least two sub-slope structures, and the angle of each sub-slope structure of the at least two sub-slope structures is smaller than a preset angle.

[0010] In the present application, the non-display area of ​​the display panel includes a touch signal opening area, the touch signal opening area includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer, and a first electrode layer arranged on a side of the first conductive layer away from the substrate layer; within the orthographic projection area of ​​the gate signal transmission layer, the first conductive layer includes: a parallel area of ​​the bottom layer of the touch signal opening area, or a multi-level recessed structure of the touch signal opening area, which is overlapped with the first electrode layer through the parallel area of ​​the first conductive layer or the multi-level recessed structure (the multi-level recessed structure includes an opening parallel area and slope structures on both sides of the opening parallel area; the slope structure on each side includes at least two sub-slope structures, and the angle of each of the at least two sub-slope structures is less than a preset angle). In this way, by changing the recessed angle of the touch signal opening area, the single slope with a larger angle is changed into at least two relatively gentle sub-slope modes, and overlapping at the relatively gentle slopes can ensure that the film layer in this area is completely etched without any residual film layer, or by setting the overlapping area only at the bottom of the touch signal opening area parallel to the substrate layer, it is ensured that the overlapping quality of the film layer in this area will not break during the subsequent stacking of the film layers, which will easily lead to water vapor entering and causing problems in the display process of the display panel.

[0011] In a second aspect, a display device is provided, comprising the display panel described in the first aspect.

[0012] In a third aspect, a method for manufacturing a display panel is provided, wherein a non-display area of ​​the display panel includes a touch signal opening area, the touch signal opening area includes a substrate layer, a gate signal transmission layer disposed on one side of the substrate layer, and a first conductive layer disposed on a side of the gate signal transmission layer away from the substrate layer, the method comprising:

[0013] Etching the spacer film layer between the first conductive layer and the first electrode layer at a side away from the substrate through a first mask, wherein the angle between the etched region of the spacer film layer between the first conductive layer and the first electrode layer and the substrate layer is smaller than a preset angle, and the first conductive layer in the etched region is exposed;

[0014] Disposing the first electrode layer on a side of the first conductive layer away from the substrate, so that the first electrode layer overlaps the first conductive layer in the etched area;

[0015] The touch signal opening area is used to receive the touch signal of the first electrode layer and the gate signal of the gate signal transmission layer at the first conductive layer.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0018] Figure 1 It is one of the side view structure diagrams of a display panel in the related art;

[0019] Figure 2 The second side view structure diagram of a display panel in the related art;

[0020] Figure 3 One of the side view structural diagrams of the display panel provided in the embodiment of the present application;

[0021] Figure 4 The second side view structure diagram of the display panel provided in the embodiment of the present application;

[0022] Figure 5 A schematic diagram of a film layer in a display panel provided in an embodiment of the present application;

[0023] Figure 6 A schematic diagram of a process for manufacturing a display panel provided in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of the structure of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] like Figure 1 and Figure 2 As shown, in Figure 1 This is a film formation morphology diagram of the TMB film layer in the display panel in the related technology. It can be seen that due to the extremely narrow frame design mentioned in the aforementioned content, the design size of the Pad pin is extremely compressed. In addition, the stacking and overlapping of several metal layers result in the inability to completely etch the dielectric layer and the TMA film layer in the corners of the overlapping hole, leaving irregular burrs, resulting in abnormal film formation process during the subsequent stacking of TMB film layers. Specifically, it will cause the aluminum (Al, TMB is composed of Ti-Al-Ti) in the TMB film layer to be exposed and the stacking process cannot be sealed, resulting in water vapor intrusion. Al as a metal layer will corrode and break, as shown in the dotted box area 11 in the figure, resulting in abnormal signal input and ultimately abnormal display of the display panel.

[0028] like Figure 2 As shown, Figure 2 It is a side view cross-sectional view of the display panel, which shows a side cross-sectional view of the touch signal opening area in the non-display area of ​​the display panel. It can be seen that the touch signal opening area is composed of the bottom Gate layer 21 and the BP inorganic layer 22 on the left and right sides of the Gate layer 21. At present, the BP inorganic layer 22 is etched in one step by the CNT-L process to form a structure with a steep slope in the opening area, resulting in the difficulty of subsequent thin film deposition gradually increasing with the thickness, and the opening aperture of the opening area gradually becoming smaller. In addition, the difficulty of film layer etching also increases with the worse film formation. The required etching depth in the vertical direction is much greater than that of the flat area, resulting in the appearance of etching residual burrs, causing poor film formation in the back-end process. Figure 2 It can be seen that the BP inorganic layer 21 side includes the SD1 layer 23, the SD2 layer 24 and the TMB layer 25, and the SD2 layer away from the BP inorganic layer 22 has a residual film layer 26 that was not etched cleanly by the etching process due to the steep slope of the opening area. Figure 2 In the area shown by the dotted frame 27 , the TMB layer 25 will be broken, thereby causing Al in the TMB layer 25 to be exposed. After a long period of use, water vapor will corrode the exposed metal Al, thereby affecting the display effect of the display panel.

[0029] Based on this, the present application proposes a display panel, a display device and a method for manufacturing a display panel, which can solve the problem that the depression angle of the above-mentioned depression is too large due to the continuous reduction and narrowing of the wiring area, and thus the film layer that needs to be etched in the depression area cannot be etched cleanly. In the subsequent process of film layer stacking, the residual film layer is likely to cause the subsequent stacked film layer to break, and then it is easy for water vapor to enter from the film layer break, thereby causing partial oxidation of the metal film layer of the display film layer, and ultimately affecting the display effect. By reducing the depression angle of the area that needs to be etched in the display panel, the etching completeness is improved, ensuring that no film cracks will appear when the subsequent stacking is continued on the cleanly etched film layer without residue.

[0030] Figure 3 and Figure 4 A display panel is provided for an embodiment of the present application, wherein a non-display area of ​​the display panel includes a touch signal opening area, wherein the touch signal opening area includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer, and a first electrode layer arranged on a side of the first conductive layer away from the substrate layer.

[0031] It is understandable that the non-display area of ​​the display panel is often set as the wiring area of ​​the display panel. In the embodiment of the present application, the main structural improvement is in the touch signal opening area for collecting the touch signal of the display panel. It is understandable that the touch signal opening area can be a strip area or a frame area parallel to the frame of the display panel.

[0032] Exemplarily, the touch signal opening area is used to receive the touch signal of the first electrode layer and the gate signal of the gate signal transmission layer at the first conductive layer.

[0033] Exemplarily, the substrate layer may be a BP inorganic layer, the first conductive layer may be an SD2 film layer, the first electrode layer may be a TMB film layer, and the gate signal transmission layer may be a Gate film layer.

[0034] For example, Figure 3 and Figure 4 As shown, in Figure 3 In the embodiment, the film layers from the lower layer to the upper layer include the BP inorganic layer 31 (i.e. the substrate layer), the Gate film layer 32 (i.e. the gate signal transmission layer), the SD2 film layer 33 (i.e. the first conductive layer), and the TMB film layer 34 (i.e. the first electrode layer); accordingly, Figure 4As shown, from the lower film layer to the upper film layer, the film layers include the BP inorganic layer 41 (that is, the above-mentioned substrate layer), the Gate film layer 42 (that is, the above-mentioned gate signal transmission layer), the SD2 film layer 43 (that is, the above-mentioned first conductive layer), and the TMB film layer 44 (that is, the above-mentioned first electrode layer).

[0035] In an embodiment of the present application, within the orthographic projection area of ​​the touch signal opening area, the first conductive layer includes: a parallel area of ​​the bottom layer of the touch signal opening area, or a multi-level recessed structure of the touch signal opening area, and the parallel area or multi-level recessed structure of the first conductive layer overlaps with the first electrode layer.

[0036] In an embodiment of the present application, the multi-level recessed structure includes an opening parallel region and slope structures on both sides of the opening parallel region; the slope structure on each side includes at least two sub-slope structures, and the angle of each of the at least two sub-slope structures is less than a preset angle.

[0037] It can be understood that in the embodiment of the present application, it can be known from the above content that the first conductive layer in the touch signal opening area will simultaneously collect the signal from the first electrode layer and the signal from the gate signal transmission layer, and then transmit the touch signal to the processor of the display panel, so that the display panel can respond and feedback to the process of the user touching the display panel, and display it in the display panel. Based on this, it is necessary to ensure that the signal of the first electrode layer can be transmitted to the first conductive layer. Generally, the signal transmission is achieved by directly overlapping the first electrode layer and the first conductive layer. However, it can be known from the above content that after the first conductive layer is manufactured, other film layers (for example, the second motor layer and the dielectric medium layer) will be set on the side of the first conductive layer away from the substrate layer, and the first electrode layer will be set on the side of the other film layers away from the substrate layer. Therefore, it is necessary to completely etch the other film layers in the touch signal opening area in advance to ensure the overlapping quality of the aforementioned first electrode layer and the first conductive layer. Based on this, in an embodiment of the present application, in order to ensure the overlapping quality between the first electrode layer and the first conductive layer, the slope of the overlapping area of ​​the first conductive layer away from the substrate layer is set to a relatively gentle slope. Specifically, the slope can ensure that there is no residual film layer on the overlapping area of ​​the first conductive layer.

[0038] Exemplarily, the display panel structures that achieve the overlap quality between the above-mentioned first electrode layer and the first conductive layer mainly include the above-mentioned two types: 1) The first conductive layer includes a parallel area of ​​the bottom layer of the above-mentioned touch signal opening area, and the first electrode layer is overlapped through the parallel area of ​​the first conductive layer; 2) The first conductive layer includes a multi-level recessed structure of the above-mentioned touch signal opening area, and the first electrode layer is overlapped through the multi-level recessed structure of the first conductive layer.

[0039] It is understandable that, in the case where the first conductive layer includes the multi-level recessed structure of the touch signal opening area, the number of the sub-slope structures can be used to ensure that the angle of each sub-slope structure is less than the preset angle. It is understandable that the improvement of the slope structure on one side of the touch signal opening area in the related art to at least two sub-slope structures is to ensure that the slope angle is sufficiently gentle so that other film layers that need to be etched off the surface of the first conductive layer can be etched cleanly. In practical applications, ensuring that the slope angle is sufficiently gentle may be achieved with two sub-slopes, or may require three sub-slopes or even more, and the embodiments of the present application do not limit this.

[0040] In an example, when the display panel structure is the first one, that is, the first conductive layer includes a parallel region of the bottom layer of the touch signal opening area, and the parallel region of the first conductive layer is overlapped with the first electrode layer, as shown in FIG. Figure 3 As shown, in Figure 3 In Figure 3 The dotted circle in the figure is the parallel region 35 where the SD film layer 33 and the TMB film layer 34 overlap. In the region 35, the SD2 film layer 33 and the TMB film layer 34 overlap only in the region parallel to the BP inorganic layer 31 of the bottom layer in the touch signal opening area. Since the parallel region 35 has basically no slope or a gentle slope, the side of the SD2 film layer 33 away from the BP inorganic layer 31 in the parallel region 35 can ensure that there is no residual film layer, thereby ensuring the overlap quality between the SD2 film layer 33 and the TMB film layer 34.

[0041] In another example, when the display panel structure is the second type, that is, the first conductive layer includes the multi-level recessed structure of the touch signal opening area, and the multi-level recessed structure of the first conductive layer is overlapped with the first electrode layer, as shown in FIG. Figure 4 As shown, in Figure 4 In Figure 4 The side of the SD2 film layer 43 away from the BP inorganic layer 31 belongs to the area for overlapping with the TMB film layer 34, that is, the SD2 film layer 43 in the touch signal opening area as a whole belongs to a multi-level recessed structure. Specifically, it can be seen that the SD2 film layer 43 includes an opening parallel area 45 and a slope structure on both sides, wherein the slope structure on each side includes two sub-slope structures 46 (that is, the at least two sub-slope structures mentioned above). Among them, the angle between each sub-slope structure 46 and the BP inorganic layer 41 is less than the preset angle, and the preset angle is the angle to ensure that there is no residual film layer on the surface of the sub-slope structure 46. Therefore, the side of the SD2 film layer 43 away from the BP inorganic layer 41 in the parallel area 35 can ensure that there is no residual film layer, thereby ensuring the overlapping quality between the SD2 film layer 43 and the TMB film layer 44.

[0042] Furthermore, the preset angle may be 60°.

[0043] The non-display area of ​​the display panel includes a touch signal opening area, which includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer, and a first electrode layer arranged on a side of the first conductive layer away from the substrate layer; within the orthographic projection area of ​​the gate signal transmission layer, the first conductive layer includes: a parallel area of ​​the bottom layer of the touch signal opening area, or a multi-level recessed structure of the touch signal opening area, which is overlapped with the first electrode layer through the parallel area of ​​the first conductive layer or the multi-level recessed structure (the multi-level recessed structure includes an opening parallel area and slope structures on both sides of the opening parallel area; the slope structure on each side includes at least two sub-slope structures, and the angle of each of the at least two sub-slope structures is less than a preset angle). In this way, by changing the depression angle of the touch signal opening area, the single slope with a larger angle is changed into at least two relatively gentle sub-slope modes, and overlapping at the relatively gentle slope can ensure that the film layer in this area is completely etched without any residual film layer, or by setting the overlapping area only at the bottom of the touch signal opening area parallel to the substrate layer, it is ensured that the overlapping quality of the film layer in this area will not break during the subsequent film layer stacking process, which will easily enter water vapor and cause problems in the display process of the display panel.

[0044] In another embodiment of the present application, a specific height relationship of at least two sub-slope structures is also provided. Exemplarily, the height difference between any two sub-slope structures in the orthographic projection direction of the at least two sub-slope structures is less than a preset threshold.

[0045] It is understandable that in order to ensure that the angle of each sub-slope in the display panel is within the preset angle, the height of each sub-slope can be set to be basically consistent, so that the angle of each sub-slope can be controlled to be relatively consistent, and the overlap quality can also be controlled.

[0046] Exemplarily, the above-mentioned preset threshold may be pre-set or customized.

[0047] It is understandable that the height target of each sub-slope is completely consistent. However, in the actual manufacturing process, the height of each sub-slope may have a certain error range. The above preset threshold is used to indicate the allowable error range of the height of adjacent sub-slope structures. Within this error range, it can be ensured that the angle between each sub-slope and the substrate layer is less than the preset threshold.

[0048] like Figure 5 As shown, Figure 5Schematic diagram of the SD2 film layer 43 in the signal opening area. It can be seen that the heights of the two sub-slopes are d1 and d2, respectively, wherein the difference between d1 and d2 is within the preset threshold. At the same time, the angles of the two sub-slopes are α1 and α2, respectively, and both α1 and α2 are less than the preset angle of 60°.

[0049] In another embodiment of the present application, a film layer structure relationship in the touch signal opening area is also provided when the first conductive layer and the first electrode layer are overlapped only in the parallel area in the touch signal opening area. Exemplarily, the other area in the first conductive layer away from the substrate layer includes a second electrode layer and a dielectric medium layer.

[0050] Exemplarily, the other regions are other regions outside the parallel regions in the first conductive layer.

[0051] Exemplarily, the other area is the non-overlapping area between the first electrode layer and the first conductive layer in the touch signal opening area.

[0052] It can be understood that since the first conductive layer and the first electrode layer overlap only in the parallel region in the touch signal opening area, in the process of manufacturing the display panel, in the touch signal opening area, the spacing film layer between the first conductive layer and the first electrode layer will not be completely etched away, but a portion of the spacing film layer will be left in the region between the first conductive layer and the first electrode layer where overlapping is not required.

[0053] like Figure 3 As shown, in Figure 3 It can be seen that on both sides of the parallel region 35, the TMA film layer 36 (i.e., the second electrode layer) and the dielectric layer 37 are retained in the area outside the parallel region 35 of the touch signal opening area, and the TMB film layer 34 and the SD2 film layer 33 are only overlapped in the parallel region 35. Since the angle between the two sides of the parallel region 35 and the substrate layer 31 is relatively large, and the slope is greater than the preset angle, Figure 3 No further etching is performed, and the film layers on both sides of the parallel region 35 are retained, thus avoiding the problem of incomplete etching that easily causes cracks in the TMB film layer 34, thereby ensuring the overlap quality between the TMB film layer 34 and the SD2 film layer 33.

[0054] In another embodiment of the present application, there is also provided a size relationship between the parallel region and the bottom area of ​​the touch signal opening region when the first conductive layer and the first electrode layer overlap only in the parallel region of the touch signal opening region. Exemplarily, the parallel region includes a partial region or the entire region of the first conductive layer parallel to the substrate layer.

[0055] Exemplarily, the parallel region may occupy all or part of the first conductive layer parallel to the substrate layer, that is, the first electrode layer is completely overlapped or partially overlapped with the first conductive layer parallel to the substrate layer. Figure 3 As shown, the parallel region 35 occupies a portion of the first conductive layer 38 parallel to the substrate layer, that is, a portion of the SD2 film layer 33 parallel to the substrate layer overlaps the TMB layer 34.

[0056] It should be noted that, in order to ensure the overlap quality between the first conductive layer and the first electrode layer, it is necessary to ensure that the parallel region occupies the area of ​​the first conductive layer parallel to the substrate layer. Figure 3 When the width of the region of the first conductive layer parallel to the substrate layer is 4-6 microns, the width of the parallel region 35 should be greater than 2 microns.

[0057] In another embodiment of the present application, a positional relationship only between the dielectric layer and the second electrode layer is also provided. Exemplarily, the first electrode layer is arranged on a side of the second electrode layer away from the substrate, the dielectric layer is arranged on an adjacent side of the first electrode layer away from the substrate layer, and the second electrode layer is arranged on an adjacent side of the dielectric layer away from the substrate layer; the second electrode layer and the dielectric layer are arranged on a side of the first conductive layer away from the substrate layer that overlaps with the other regions in the orthographic projection direction.

[0058] like Figure 3 As shown, in Figure 3 In the method, a TMB film layer 34 (i.e., a first electrode layer) is provided on a side of a TMA film layer 37 (i.e., a second electrode layer) away from the BP inorganic layer 31, a dielectric layer 36 is provided on an adjacent side of the TMB film layer 34 away from the BP inorganic layer 31, and the TMA film layer 37 is provided on an adjacent side of the dielectric layer 36 away from the BP inorganic layer 31, and the TMA film layer 37 and the dielectric layer 36 are provided on a side of the SD2 film layer 33 away from the inorganic layer 31 which overlaps with the other regions in the orthographic projection direction.

[0059] In another embodiment of the present application, a second conductive layer for transmitting signals between the gate signal transmission layer and the first conductive layer is also provided. Exemplarily, a second conductive layer is provided between the gate signal transmission layer and the first conductive layer, and the second conductive layer is used to transmit the gate signal of the gate signal transmission layer to the first conductive layer.

[0060] like Figure 3 As shown, an SD1 film layer 39 (ie, the second conductive layer mentioned above) is disposed between the Gate film layer 32 and the SD2 film layer 33 .

[0061] like Figure 4 As shown, Figure 3 As shown, an SD1 film layer 47 (ie, the second conductive layer mentioned above) is disposed between the Gate film layer 42 and the SD2 film layer 43 .

[0062] An embodiment of the present application further provides a display device, comprising the above-mentioned display panel.

[0063] Figure 6 FIG. 1 is a flow chart of a method for manufacturing a display panel provided by an embodiment of the present application. Figure 6 As shown, the non-display area of ​​the display panel includes a touch signal opening area, and the touch signal opening area includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, and a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer.

[0064] In the embodiment of the present application, the touch signal opening area, the substrate layer, the gate signal transmission layer and the first conductive layer can refer to the above description and will not be elaborated here.

[0065] In the embodiment of the present application, the touch signal opening area is used to receive the touch signal of the first electrode layer and the gate signal of the gate signal transmission layer at the first conductive layer.

[0066] The method includes the following steps 301 and 302:

[0067] Step 301: etching the spacing film layer between the first electrode layer and the first conductive layer on the side away from the substrate through a first mask.

[0068] In the embodiment of the present application, the angle between the etched region of the spacer film layer between the first conductive layer and the first electrode layer and the substrate layer is smaller than a preset angle, and the first conductive layer in the etched region is exposed.

[0069] In the embodiment of the present application, the first mask may be a mask for etching the spacer film layer, such as the second electrode layer (TMA film layer) and the dielectric medium layer.

[0070] It is understandable that, as described above, in the embodiment of the present application, in order to ensure that after etching of the touch signal opening area of ​​the display panel, the first electrode layer subsequently overlaps with other film layers, and the film layer surface exposed in the area where the touch signal opening area is etched does not have residual film layer, therefore, the method of etching the entire area in the touch signal opening area of ​​the single groove form in the related art is improved. Specifically, there are two ways of improvement, the first way is to improve the film layer morphology of the above-mentioned first conductive layer itself, and the second way is to improve the position of the etching area in the touch signal opening area. No matter which way is used, it will eventually achieve the effect that the angle between the etching area of ​​the spacer film layer and the above-mentioned substrate layer is less than the preset angle.

[0071] In the embodiment of the present application, the preset slope is a critical slope for maintaining complete etching of the etching area.

[0072] Step 302: Disposing the first electrode layer on a side of the first conductive layer away from the substrate, so that the first electrode layer overlaps the first conductive layer in the etched area.

[0073] The two improved methods described in the embodiments of the present application are described below respectively.

[0074] The first method is to improve the film morphology of the first conductive layer itself, and to set a second conductive layer on the side of the AND gate signal transmission layer away from the substrate layer to form a multi-level recessed structure through a mask.

[0075] Optionally, in an embodiment of the present application, a second conductive layer is arranged on an adjacent side of the gate signal transmission layer away from the substrate layer, and before etching the spacing film layer between the first electrode layer and the side of the first conductive layer away from the substrate through the first mask, the method comprises: etching the second conductive layer through a second mask so that the second conductive layer forms a multi-level recessed structure within the positive projection area of ​​the gate signal transmission layer; arranging the first conductive layer on an adjacent side of the second conductive layer away from the substrate layer; and sequentially arranging the spacing film layers on the side of the first conductive layer away from the substrate layer.

[0076] Exemplarily, the multi-level recessed structure includes an opening parallel region and slope structures on both sides of the opening parallel region; the slope structure on each side includes at least two sub-slope structures, and the angle of each of the at least two sub-slope structures is smaller than the preset angle.

[0077] Exemplarily, the spacing film layer includes a second electrode layer and a dielectric layer, and the etched region includes the second electrode layer and the dielectric layer in the touch signal opening region.

[0078] It is understandable that in order to ensure that the surface of the first conductive layer in the touch signal opening area away from the substrate layer is etched cleanly, it is necessary to reduce the angle between the first conductive layer and the substrate layer and make the angle area of ​​the recessed portion smooth, thereby ensuring that the etched area is etched cleanly.

[0079] Exemplarily, the second mask may be a mask that is etched by an existing CNT-O process, and therefore, there is no need to re-set a new mask, which is beneficial to saving production costs.

[0080] Furthermore, after etching, Figure 4 As shown, the Figure 4As described above, the SD1 film layer 45 on the side of the Gate film layer 42 away from the BP inorganic layer 41 is etched by the CNT-O process, and the etched SD1 film layer 45 includes an opening parallel area and slope structures on both sides of the above-mentioned opening parallel area, and the slope structure on each side includes two sub-slope structures with similar heights.

[0081] In this way, the angle between each sub-slope and the BP inorganic layer 41 is actually smaller than the preset angle. After the SD2 film layer 43 is further set on the SD1 film layer 45, the structure of the SD2 film layer 43 also includes the opening parallel area and the slope structures on both sides of the above-mentioned opening parallel area. The slope structure on each side includes two sub-slope structures with similar heights, and the angle between each sub-slope and the BP inorganic layer 41 is actually smaller than the preset angle. Therefore, in the process of etching the touch signal opening area, it can be ensured that the other spacing film layers (including TMA film layers and dielectric dielectric layers) on the side of the SD2 film layer 43 away from the BP inorganic layer 41 are completely etched without any residual film layer.

[0082] Furthermore, Figure 4 As shown, in Figure 4 It can be seen that the dotted line 48 is the original one, that is, the boundary formed by etching at the recess of the touch signal opening area in the related art, and in the embodiment of the present application, the boundary formed by etching at the recess of the touch signal opening area is the position of the dotted line 49, which is formed by expanding the boundary formed by etching at the recess of the touch signal opening area and setting at least two sub-slope structures on one side of the touch signal opening area, which greatly reduces the slope angle of the etching area, can ensure complete etching and the overlapping quality of subsequent film layers.

[0083] The second method is to improve the position of the etching area in the touch signal opening area.

[0084] Optionally, in an embodiment of the present application, etching the spacing film layer between the first electrode layer and the side of the first conductive layer away from the substrate through the first mask includes: etching the spacing film layer through a second mask so that the first conductive layer is exposed in a parallel region where the touch signal opening area is parallel to the substrate layer.

[0085] Exemplarily, the parallel region is a partial region or a whole region in the first conductive layer that is parallel to the substrate layer.

[0086] like Figure 3 As shown, in Figure 3 In the embodiment, the region of the first conductive layer parallel to the substrate layer is the first conductive layer 38 in the SD2 film layer 33 parallel to the substrate layer, wherein the parallel region is also Figure 3 The parallel region 35 occupies a portion of the first conductive layer 38 that is parallel to the substrate layer.

[0087] The present application also provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the training rule determination method described in the present application is implemented. For example, the following can be executed: Figure 6 The individual steps of the method are shown.

[0088] The present invention provides a computer program product, which includes instructions that are executed by a processor when the processor executes the instructions. Figure 6 The individual steps of the method are shown.

[0089] It should be noted that although the operations of the method of the present invention are described in a particular order in the drawings, this does not require or imply that the operations must be performed in this particular order or that all illustrated operations must be performed to achieve desired results.

[0090] Reference below Figure 7 , Figure 7 FIG. 1 is a schematic diagram showing a structure of a computer device suitable for implementing an embodiment of the present application. Figure 7 As shown, the computer system 1700 includes a central processing unit (CPU) 1701, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 1702 or the program loaded from the storage part 1708 to the random access memory (RAM) 1703. In the RAM 1703, various programs and data required for the operation instructions of the system are also stored. The CPU 1701, the ROM 1702, and the RAM 1703 are connected to each other through a bus 1704. An input / output (I / O) interface 1705 is also connected to the bus 1704.

[0091] The following components are connected to the I / O interface 1705: an input section 1706 including a keyboard, a mouse, etc.; an output section 1707 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage section 1708 including a hard disk, etc.; and a communication section 1709 including a network interface card such as a LAN card, a modem, etc. The communication section 1709 performs communication processing via a network such as the Internet. A drive 1710 is also connected to the I / O interface 1705 as needed. A removable medium 1711, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1710 as needed, so that a computer program read therefrom is installed into the storage section 1708 as needed.

[0092] In particular, according to an embodiment of the present application, the above reference flow chart Figure 6The described process can be implemented as a computer software program. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer readable medium, and the computer program includes a program code for executing the method shown in the flow chart. In such an embodiment, the computer program includes a program code for executing the method shown in the flow chart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication part 1709, and / or installed from the removable medium 1711. When the computer program is executed by the central processing unit (CPU) 1701, the above-mentioned functions defined in the system of the present application are executed.

[0093] It should be noted that the computer-readable medium shown in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. Computer-readable signal media may also be any computer-readable medium such as a computer-readable storage medium that can send, propagate or transmit a program for use by or in conjunction with an instruction execution system, device or device. The program code contained on the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0094] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, functions and operating instructions of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the aforementioned module, program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some implementations as replacements, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, the boxes represented by two connections can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operating instruction, or can be implemented with a combination of dedicated hardware and computer instructions.

[0095] The units or modules involved in the embodiments described in the present application may be implemented by software or hardware. The units or modules described may also be set in a processor. For example, it may be described as: a processor includes a first receiving module, a second receiving module, and a sending module. The names of these units or modules do not, in some cases, constitute limitations on the units or modules themselves.

[0096] As another aspect, the present application further provides a computer-readable storage medium, which may be included in the electronic device described in the above embodiment, or may exist independently without being assembled into the electronic device. The above computer-readable storage medium stores one or more programs, and when the above programs are used by one or more processors to execute the method for manufacturing a display panel described in the present application.

[0097] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of disclosure involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned disclosed concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other to form a technical solution.

Claims

1. A display panel, characterized in that: The non-display area of ​​the display panel includes a touch signal opening area, and the touch signal opening area includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer, and a first electrode layer arranged on a side of the first conductive layer away from the substrate layer; In the orthographic projection area of ​​the touch signal opening area, the first conductive layer includes: a parallel area of ​​the bottom layer of the touch signal opening area, or a multi-level recessed structure of the touch signal opening area, and the parallel area or the multi-level recessed structure of the first conductive layer overlaps with the first electrode layer; The multi-level recessed structure includes an opening parallel region and slope structures on both sides of the opening parallel region; the slope structure on each side includes at least two sub-slope structures, and the angle of each sub-slope structure of the at least two sub-slope structures is smaller than a preset angle.

2. The display panel according to claim 1, characterized in that: A height difference between two adjacent sub-slope structures in the orthographic projection direction of at least two sub-slope structures is smaller than a preset threshold.

3. The display panel according to claim 1, characterized in that: The other regions in the first conductive layer include a second electrode layer and a dielectric layer on a side away from the substrate layer, and the other regions are other regions in the first conductive layer outside the parallel regions.

4. The display panel according to claim 1, characterized in that: The parallel region includes a partial region or a whole region of the first conductive layer that is parallel to the substrate layer.

5. The display panel according to claim 3, characterized in that: The first electrode layer is arranged on a side of the second electrode layer away from the substrate, the dielectric layer is arranged on an adjacent side of the first electrode layer away from the substrate layer, and the second electrode layer is arranged on an adjacent side of the dielectric layer away from the substrate layer; The second electrode layer and the dielectric medium layer are arranged on a side of the first conductive layer that overlaps with the other regions in the orthographic projection direction and is away from the substrate layer.

6. The display panel according to claim 1, characterized in that: A second conductive layer is disposed between the gate signal transmission layer and the first conductive layer, and the second conductive layer is used to transmit the gate signal of the gate signal transmission layer to the first conductive layer.

7. A display device, characterized in that: A display panel comprising any one of claims 1 to 6.

8. A method for manufacturing a display panel, characterized in that: The non-display area of ​​the display panel includes a touch signal opening area, the touch signal opening area includes a substrate layer, a gate signal transmission layer arranged on one side of the substrate layer, and a first conductive layer arranged on a side of the gate signal transmission layer away from the substrate layer, the method comprising: Etching the spacer film layer between the first conductive layer and the first electrode layer at a side away from the substrate through a first mask, wherein the angle between the etched region of the spacer film layer between the first conductive layer and the first electrode layer and the substrate layer is smaller than a preset angle, and the first conductive layer in the etched region is exposed; Disposing the first electrode layer on a side of the first conductive layer away from the substrate, so that the first electrode layer overlaps the first conductive layer in the etched area; The touch signal opening area is used to receive the touch signal of the first electrode layer and the gate signal of the gate signal transmission layer at the first conductive layer.

9. The method according to claim 8, characterized in that A second conductive layer is provided on a side of the gate signal transmission layer away from the substrate layer, and before etching the spacing film layer between the first electrode layer and the side of the first conductive layer away from the substrate through the first mask, the method comprises: The second conductive layer is etched through a second mask so that the second conductive layer forms a multi-level recessed structure in the orthographic projection region of the gate signal transmission layer, wherein the multi-level recessed structure includes an opening parallel region and slope structures on both sides of the opening parallel region; each side of the slope structure includes at least two sub-slope structures, and the angle of each sub-slope structure of the at least two sub-slope structures is less than the preset angle; Disposing the first conductive layer on an adjacent side of the second conductive layer away from the substrate layer; The spacer film layer is sequentially arranged on a side of the first conductive layer away from the substrate layer, the spacer film layer includes a second electrode layer and a dielectric medium layer, and the etched area includes the second electrode layer and the dielectric medium layer in the touch signal opening area.

10. The method according to claim 8, characterized in that The etching of the spacer film layer between the first conductive layer and the first electrode layer on the side away from the substrate through the first mask includes: The spacer film layer is etched through a second mask, so that the first conductive layer is exposed in a region parallel to the touch signal opening region and the substrate layer.