Semiconductor packaging mold material rack

Abstract

The invention relates to a semiconductor packaging mold rack, and belongs to the technical field of semiconductor packaging. The semiconductor packaging mold material rack comprises a rack body; the mold comprises an upper mold and a lower mold; the detachable clamping strip mechanism comprises a plurality of frames fixedly connected to the interior of the frame body, clamping blocks fixedly connected to the bottom end of the lower mold and a pressure adjusting assembly, three mounting grooves are formed in each frame, second air bags are arranged in the mounting grooves in the two sides, and adaptive plates are arranged in the mounting grooves; according to the detachable clamping strip mechanism, when a semiconductor is packaged at high temperature, the clamping block, the bottom plate and the adaptive plate can conduct self-adaptive change, it is ensured that the situation that a mold is dislocated due to the thermal expansion influence is avoided, when the clamping block and the adaptive plate are connected, clamping connection is relatively stable, one-way locking can be conducted, meanwhile, the clamping block and the adaptive plate are not influenced by the thermal expansion, and the service life of the mold is prolonged. And therefore, the problem is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor packaging mold material rack. Background Art

[0002] Semiconductor packaging is carried out by high-temperature compression molding. During the packaging process, the semiconductor particles to be packaged are first placed in the product rack, and then the product rack is placed in a high-temperature packaging furnace. The upper and lower molds of the high-temperature packaging furnace will be pressed and sealed to form an injection space, and the plastic material is placed in the injection box and melted at high temperature to flow into the injection space to encapsulate the semiconductor particles. Among them, the semiconductor packaging mold rack is a tool placed in the high-temperature packaging furnace to place the product rack.

[0003] In order to avoid the inconvenience of cleaning and maintenance of the material rack, the connection between the material rack and the mold is generally set to a detachable connection. After searching, the Chinese patent "A semiconductor packaging mold material rack" authorization announcement number "CN 107768289B" has a simple structure and high space utilization. It solves the problem that the length of the wires at both ends of the product caused by thermal expansion during production is uncontrollable. The product rack and the material rack are detachably connected, reducing production and maintenance costs; in addition, the setting of the card strip improves the stability of the product rack; the above application adapts to the change caused by high-temperature expansion, but the direction of change caused by thermal expansion is uncontrollable, the upper and lower molds are prone to misalignment, and when the temperature does not drop, it affects the normal mold disassembly. Summary of the invention

[0004] Based on this, it is necessary to provide a semiconductor packaging mold rack to address the problems that the change direction caused by thermal expansion during device operation is uncontrollable, the upper and lower molds are prone to misalignment, and the normal disassembly of the mold is affected when the temperature does not drop.

[0005] A semiconductor packaging mold material rack, comprising:

[0006] Frame;

[0007] A mold, comprising an upper mold and a lower mold;

[0008] A detachable card strip mechanism, the detachable card strip mechanism comprises a plurality of frames fixedly connected to the frame body, a card block fixedly connected to the bottom end of the lower mold and a pressure regulating assembly, three mounting grooves are provided in the frame, second air bags are provided in the mounting grooves on both sides, an adaption plate is provided in the mounting groove, one end of the adaption plate away from the second air bag penetrates the frame and is in close contact with the side of the card block, a first air bag is provided in the mounting groove in the middle, a bottom plate in close contact with the first air bag is provided in the mounting groove, one end of the bottom plate away from the first air bag penetrates the frame and is in contact with the bottom end of the card block;

[0009] The pressure regulating assembly is used to regulate the air pressure inside the first airbag and the second airbag.

[0010] In one embodiment, the pressure regulating assembly includes a U-shaped tube arranged in the frame, and multiple first airbags and multiple second airbags are connected to the U-shaped tube. The end of the U-shaped tube passes through the frame and is connected to a vertical pipe. A fixed block is fixedly connected to the middle of the inner wall of the vertical pipe. The top and bottom ends of the fixed block are fixedly connected to springs. The end of the spring away from the fixed block is fixedly connected to an adjustment plate, and two exhaust holes are opened on the surface of the vertical pipe.

[0011] In one embodiment, the pressure regulating assembly further comprises an operating frame connected to the U-shaped tube, one end of the operating frame is threadedly connected to an operating rod, and the end of the operating rod passes through the operating frame and is rotatably connected to a piston plate.

[0012] In one of the embodiments, the voltage regulating assembly also includes a fan fixedly mounted on one side of the frame, a three-way pipe is provided on the fan, the other two ends of the three-way pipe are respectively connected to the frame and the U-shaped tube, the other side of the frame is connected to a delivery pipe, and the other end of the delivery pipe is connected to a heat dissipation fin fixedly connected to the frame.

[0013] In one of the embodiments, a material distribution pipe is disposed at the top of the upper mold, and a plurality of material distribution pipes are disposed at the tops of the plurality of material distribution pipes. Two sealing doors are disposed at the front end of the frame, and observation windows are disposed on the sealing doors.

[0014] In one of the embodiments, the front ends of the two adaptable plates are fixedly connected with guide blocks, and the two guide blocks are distributed in an "eight" shape.

[0015] In one embodiment, the fixing block is cross-shaped, and the inner wall of the vertical tube is fixedly connected with a limiting ring which is in close contact with the adjustment plate.

[0016] In one of the embodiments, the frame is in a "U" shape, and three strip grooves connected to the mounting grooves are opened in the frame, and the two adaptable plates and the bottom plate slide in the corresponding strip grooves respectively.

[0017] In one of the embodiments, a filter plate and a first solenoid valve are sequentially arranged on the three-way pipe, and a second solenoid valve is arranged on the delivery pipe.

[0018] In one embodiment, the clamping block is T-shaped, and both sides of the clamping block are fixedly connected with a first tooth plate, and the opposite sides of the two adaptable plates are fixedly connected with a second tooth plate used in conjunction with the first tooth plate.

[0019] The detachable card strip mechanism of the present invention can make the card block, the bottom plate and the adaptable plate adaptively change during the semiconductor high-temperature packaging, ensuring that the mold will not be dislocated due to the influence of thermal expansion, and the card block and the adaptable plate are relatively stable when connected, and can be locked in one direction, and will not be affected by thermal expansion, resulting in the problem of being unable to be disassembled. Among them, the pressure regulating component can ensure that the multiple first airbags and the multiple second airbags are kept in a constant pressure state by the mutual cooperation of the spring and the regulating plate, so that the bottom plate and the two adaptable plates can present multi-directional uniform deformation when adapting to thermal expansion, and the internal gas pressure is consistent and maintained in a constant state;

[0020] The fan in the pressure regulating assembly of the present invention can quickly discharge the hot gas in the frame and directly contact the heat dissipation fins. The heat dissipation fins are in direct contact with the outside air, which can quickly dissipate heat, reduce the cooling time of the device, and ensure the efficiency of the device. Under the action of the first solenoid valve and the second solenoid valve, when the fan is not running, the device is in a sealed state. At the same time, when the fan is running, the U-shaped tube can be replenished with air, and excess gas can be automatically discharged, ensuring the stability of the operation of the detachable card strip mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the mold, frame and pressure regulating assembly of the present invention;

[0024] Figure 3 An exploded view of the frame, the first airbag and the second airbag of the present invention;

[0025] Figure 4 is an internal cross-sectional view of the frame of the present invention;

[0026] Figure 5 For the present invention Figure 4 The enlarged view of point A in the middle;

[0027] Figure 6 It is a schematic diagram of the connection between the first airbag, the second airbag and the pressure regulating assembly of the present invention;

[0028] Figure 7 For the present invention Figure 6 The enlarged view of point B in the middle;

[0029] Figure 8 For the present invention Figure 6 Enlarged view of point C in the middle;

[0030] Fig. 9 It is a schematic diagram of the connection between the fan and the heat dissipation fins of the present invention.

[0031] Reference numerals:

[0032] 100, frame; 110, sealing door; 200, mold; 210, feed pipe; 220, distribution pipe; 300, detachable card strip mechanism; 310, frame; 311, first air bag; 312, bottom plate; 313, second air bag; 314, adaptation plate; 315, card block; 316, first tooth plate; 317, second tooth plate; 318, guide block; 319, mounting groove; 320, pressure regulating assembly; 321, U-shaped tube; 322, vertical tube; 323, fixed block; 324, spring; 325, adjustment plate; 326, exhaust hole; 330, operation frame; 331, operation rod; 332, piston plate; 340, fan; 341, three-way pipe; 342, first solenoid valve; 343, delivery pipe; 344, second solenoid valve; 345, heat dissipation fin; 346, filter plate. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] Unless otherwise defined, all technical and scientific terms used in the specification of the present invention have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the specification of the present invention includes any and all combinations of one or more related listed items.

[0038] Combine the following Figure 1 - Fig. 9 The semiconductor packaging mold frame of the present invention is described.

[0039] In one embodiment, a semiconductor packaging mold rack includes:

[0040] Frame 100;

[0041] The mold 200 includes an upper mold and a lower mold;

[0042] A detachable clip mechanism 300 includes a plurality of frames 310 fixedly connected to the frame body 100, a clip block 315 fixedly connected to the bottom end of the lower mold, and a pressure regulating assembly 320. Three mounting grooves 319 are provided in the frame 310. Second air bags 313 are provided in the mounting grooves 319 on both sides. Adaptive plates 314 are provided in the mounting grooves 319. One end of the adaptive plate 314 away from the second air bag 313 passes through the frame 310 and is in close contact with the side of the clip block 315. A first air bag 311 is provided in the middle mounting groove 319. A bottom plate 312 in close contact with the first air bag 311 is provided in the mounting groove 319. One end of the bottom plate 312 away from the first air bag 311 passes through the frame 310 and is in contact with the bottom end of the clip block 315.

[0043] The pressure regulating assembly 320 is used to regulate the air pressure inside the first airbag 311 and the second airbag 313 .

[0044] like Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the pressure regulating assembly 320 includes a U-shaped tube 321 arranged in the frame 100, and multiple first air bags 311 and multiple second air bags 313 are all connected to the U-shaped tube 321. The end of the U-shaped tube 321 passes through the frame 100 and is connected to a vertical tube 322. A fixed block 323 is fixedly connected to the middle of the inner wall of the vertical tube 322. The top and bottom ends of the fixed block 323 are fixedly connected to a spring 324. The end of the spring 324 away from the fixed block 323 is fixedly connected to an adjustment plate 325. Two exhaust holes 326 are provided on the surface of the vertical tube 322.

[0045] The pressure regulating assembly 320 further includes an operating frame 330 connected to the U-shaped tube 321 . An operating rod 331 is threadedly connected to one end of the operating frame 330 . An end of the operating rod 331 passes through the operating frame 330 and is rotatably connected to a piston plate 332 .

[0046] The front ends of the two adapting plates 314 are fixedly connected with guide blocks 318, and the two guide blocks 318 are distributed in an "eight" shape. Under the guidance of the eight-shaped guide blocks 318, the clamping block 315 can better enter between the two adapting plates 314, reducing the difficulty of docking and making installation and disassembly more convenient.

[0047] The fixing block 323 is cross-shaped, and the inner wall of the vertical tube 322 is fixedly connected with a limiting ring that is in close contact with the adjustment plate 325. The cross-shaped fixing block 323 can provide an installation position for the spring 324 while ensuring mutual communication, and the limiting ring can limit the final position of the adjustment plate 325 to avoid excessive displacement.

[0048] The frame 310 is in a "U" shape, and three strip grooves connected to the mounting grooves 319 are provided in the frame 310. The two adaptable plates 314 and the bottom plate 312 slide in the corresponding strip grooves respectively. When the adaptable plates 314 and the bottom plate 312 move, they can run along a predetermined route without deviation during the adaptive process, thereby ensuring the normal operation of the device.

[0049] The block 315 is T-shaped, and the first tooth plates 316 are fixedly connected to both sides of the block 315, and the second tooth plates 317 used in conjunction with the first tooth plates 316 are fixedly connected to the opposite sides of the two adapting plates 314. The inclination directions of the teeth of the first tooth plate 316 and the second tooth plate 317 are adapted to each other. When the block 315 is installed, it can be directly pushed, and one-way limitation can be performed without reverse movement. After being installed in place, the stability is better, and if the internal air pressure is affected, timely air replenishment can also be performed.

[0050] In this embodiment, when the block 315 is affected by thermal expansion, the block 315 squeezes the two adaptable plates 314 and the bottom plate 312 at the same time. The two adaptable plates 314 and the bottom plate 312 operate simultaneously to squeeze the first airbag 311 and the second airbag 313, and the insides thereof are interconnected. The squeezing force on the block 315 is consistent, and the excess gas will enter the U-shaped tube 321. The multiple first airbags 311, the multiple second airbags 313 and the U-shaped tube 321 are connected, and the excess gas will enter the vertical tube 322, the gas will squeeze the adjustment plate 325, and the adjustment plate 325 will move to the exhaust hole 326 position, and the excess gas will be automatically discharged; when pressure relief is required, the operating rod 331 is rotated, and the operating rod 331 drives the piston plate 332 to move, and the excess gas in the U-shaped tube 321 will enter the operating frame 330, and the gas in the first airbag 311 and the second airbag 313 will be discharged, so that the block 315 can be quickly disassembled, and this operation can also be used to replenish air when it is needed.

[0051] like Figure 1 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the voltage regulating assembly 320 also includes a fan 340 fixedly mounted on one side of the frame 100, a three-way pipe 341 is provided on the fan 340, the other two ends of the three-way pipe 341 are respectively connected to the frame 100 and the U-shaped tube 321, the other side of the frame 100 is connected to a delivery pipe 343, and the other end of the delivery pipe 343 is connected to a heat dissipation fin 345 fixedly connected to the frame 100.

[0052] The three-way pipe 341 is provided with a filter plate 346 and a first electromagnetic valve 342 in sequence, and the delivery pipe 343 is provided with a second electromagnetic valve 344. Under the action of the first electromagnetic valve 342 and the second electromagnetic valve 344, when the fan 340 is not running, the device is in a sealed state, and the gas entering the frame 100 is filtered through the filter plate 346 to prevent impurities or dust from entering the device.

[0053] In this embodiment, the fan 340 is started, and external air enters the three-way pipe 341. Most of the gas will enter the frame 100, and the hot gas will enter the delivery pipe 343, directly contacting the heat dissipation fins 345. The heat dissipation performance of the heat dissipation fins 345 is used to quickly disperse the heat in the device. Part of the gas will enter the U-shaped tube 321, and the multiple first air bags 311, the multiple second air bags 313 and the U-shaped tube 321 are connected. The excess gas will enter the vertical pipe 322, and the gas will squeeze the adjustment plate 325. The adjustment plate 325 moves to the exhaust hole 326, and the excess gas will be automatically discharged, thereby realizing the constant pressure operation of the detachable card strip mechanism 300 and ensuring the stability of the operation of the detachable card strip mechanism 300.

[0054] like Figure 1 and Figure 2 As shown, a material distribution pipe 220 is provided at the top of the upper mold, and a detachable feeding pipe 210 is provided at the top of the multiple material distribution pipes 220. Two sealing doors 110 are provided at the front end of the frame 100, and an observation window is provided on the sealing door 110.

[0055] In this embodiment, during packaging, the external solution enters from the feed pipe 210, and enters the corresponding mold 200 through the distribution pipe 220, so that multiple semiconductors are packaged simultaneously, and the feed pipe 210 is a multi-way pipe, and the connection between the distribution pipe 220 and the feed pipe 210 is a threaded connection. When the mold 200 needs to be disassembled, the two can be separated without affecting the conventional disassembly of the mold 200. The sealing door 110 can ensure that the device is in a sealed state, thereby combining the device with the external air to avoid being affected by external gas or impurities during packaging, and the observation window can more intuitively observe the internal situation of the device.

[0056] Working principle: Place the semiconductor to be packaged in the upper and lower molds, merge the mold 200, and push the card block 315 under the guidance of the guide block 318. The inclination directions of the first tooth plate 316 and the second tooth plate 317 are matched, and the molds are pushed to the final installation position in turn, and self-locked. The connection between the mold 200 and the feed pipe 210 is completed using the distribution pipe 220, and the sealing door 110 is closed. The mold is injected with liquid using the feed pipe 210 to achieve semiconductor packaging. During this process, the detachable card strip mechanism 300 can be adaptively fitted. When heat dissipation or voltage stabilization is required, the fan 340 can be started to complete the internal voltage stabilization of the detachable card strip mechanism 300 and the rapid heat dissipation of the semiconductor that has been packaged in the mold 200, adapt to the thermal expansion during the packaging process, and can be disassembled at any time without being affected by thermal expansion.

[0057] It should be noted that the sealing door 110, mold 200, fan 340, first solenoid valve 342, second solenoid valve 344 and heat dissipation fins 345 in the above description are all relatively mature devices in the existing technology. The specific models can be selected according to actual needs. At the same time, the fan 340, the first solenoid valve 342 and the second solenoid valve 344 can be powered by a built-in power supply or by AC power. The specific power supply method is selected according to the situation and will not be elaborated here.

[0058] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A semiconductor packaging mold rack, characterized in that: include: A frame (100); A mold (200), wherein the mold (200) comprises an upper mold and a lower mold; A detachable card strip mechanism (300), the detachable card strip mechanism (300) comprises a plurality of frames (310) fixedly connected to the frame body (100), a card block (315) fixedly connected to the bottom end of the lower mold, and a pressure regulating assembly (320), the frame (310) is provided with three mounting grooves (319), the mounting grooves (319) on both sides are provided with second air bags (313), the mounting grooves (319) are provided with an adaptable plate (314), the adaptable The end of the plate (314) away from the second airbag (313) passes through the frame (310) and is in close contact with the side of the block (315); the first airbag (311) is arranged in the installation groove (319) in the middle; the bottom plate (312) in close contact with the first airbag (311) is arranged in the installation groove (319); the end of the bottom plate (312) away from the first airbag (311) passes through the frame (310) and is in contact with the bottom end of the block (315); The pressure regulating component (320) is used to regulate the air pressure inside the first airbag (311) and the second airbag (313).

2. The semiconductor packaging mold rack according to claim 1, characterized in that: The pressure regulating assembly (320) comprises a U-shaped tube (321) arranged in the frame (100); a plurality of the first airbags (311) and a plurality of the second airbags (313) are all connected to the U-shaped tube (321); an end of the U-shaped tube (321) passes through the frame (100) and is connected to a vertical tube (322); a fixed block (323) is fixedly connected to the middle of the inner wall of the vertical tube (322); a spring (324) is fixedly connected to the top and bottom ends of the fixed block (323); an adjustment plate (325) is fixedly connected to one end of the spring (324) away from the fixed block (323); and two exhaust holes (326) are provided on the surface of the vertical tube (322).

3. The semiconductor packaging mold rack according to claim 2, characterized in that: The pressure regulating assembly (320) further comprises an operating frame (330) connected to the U-shaped tube (321); one end of the operating frame (330) is threadedly connected to an operating rod (331); an end of the operating rod (331) passes through the operating frame (330) and is rotatably connected to a piston plate (332).

4. The semiconductor packaging mold rack according to claim 2, characterized in that: The voltage regulating assembly (320) further comprises a fan (340) fixedly mounted on one side of the frame (100); a three-way pipe (341) is arranged on the fan (340); the other two ends of the three-way pipe (341) are respectively connected to the frame (100) and the U-shaped pipe (321); the other side of the frame (100) is connected to a delivery pipe (343); the other end of the delivery pipe (343) is connected to a heat dissipation fin (345) fixedly connected to the frame (100).

5. The semiconductor packaging mold rack according to claim 1, characterized in that: A material distribution pipe (220) is arranged at the top of the upper mold, and a detachable material feeding pipe (210) is arranged at the top of the plurality of material distribution pipes (220). Two sealing doors (110) are arranged at the front end of the frame (100), and an observation window is arranged on the sealing door (110).

6. The semiconductor packaging mold rack according to claim 1, characterized in that: The front ends of the two adaptable plates (314) are fixedly connected with guide blocks (318), and the two guide blocks (318) are distributed in an "eight" shape.

7. The semiconductor packaging mold material rack according to claim 2, characterized in that: The fixing block (323) is cross-shaped, and the inner wall of the vertical pipe (322) is fixedly connected with a limiting ring that is in close contact with the adjustment plate (325).

8. The semiconductor packaging mold rack according to claim 1, characterized in that: The frame (310) is U-shaped, and three strip grooves connected to the mounting groove (319) are provided in the frame (310). The two adaptable plates (314) and the bottom plate (312) slide in the corresponding strip grooves respectively.

9. The semiconductor packaging mold rack according to claim 4, characterized in that: The three-way pipe (341) is provided with a filter plate (346) and a first electromagnetic valve (342) in sequence, and the delivery pipe (343) is provided with a second electromagnetic valve (344).

10. The semiconductor packaging mold rack according to claim 1, characterized in that: The clamping block (315) is T-shaped, and both sides of the clamping block (315) are fixedly connected to first tooth plates (316), and opposite sides of the two adapting plates (314) are fixedly connected to second tooth plates (317) used in conjunction with the first tooth plates (316).

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