Power module, power device and vehicle

Abstract

The invention provides a power module, a power device and a vehicle. The power module comprises a substrate assembly, a heat dissipation assembly and a plastic package body, the substrate assembly is provided with a first side face and a second side face which are opposite, the heat dissipation assembly is connected to the second side face of the substrate assembly, the substrate assembly is packaged in the plastic package body in a plastic mode, and a built-in channel is formed in the plastic package body. At least one part of the built-in channel is arranged in the plastic package body located on the first side face of the substrate assembly, and the built-in channel is provided with an inlet and an outlet. According to the invention, the process difficulty can be reduced while double-sided heat dissipation is provided.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of power electronics technology, and in particular to a power module, a power device and a vehicle. Background Art

[0002] As the domestic new energy vehicle market continues to be hot, the development of power modules, as core components of new energy vehicles, has also received widespread attention. The reliability of power modules is directly related to the safety of new energy vehicles, so higher requirements are placed on the reliability of power modules. Among them, the thermal management of power modules is of utmost importance.

[0003] The heat dissipation methods of power modules currently on the market are mainly divided into single-sided heat dissipation and double-sided heat dissipation. Among them, single-sided heat dissipation is the mainstream method. The power module is installed at the corresponding position on the cooling plate. The coolant flows in from the water inlet of the cooling plate, passes through the heat dissipation pin group at the bottom of the substrate assembly, and then flows out from the water outlet of the cooling plate. The heat generated by the power module during use is taken away through heat exchange. However, the heat dissipation method of this solution is single and inefficient, which will affect the reliability, life, inductance and other aspects of the product.

[0004] Double-sided heat dissipation usually involves directly connecting two substrate components through soldering or sintering, and then plastic-sealing the product to form a whole. After being installed on the cooling plate, coolant flows through the bottom of each substrate component, thereby achieving the effect of double-sided heat dissipation. The heat dissipation efficiency of this solution is higher than that of single-sided water cooling, but it requires two substrate components, and the end faces of the upper and lower substrate components and the cooling plate need to be sealed with large sealing rings, resulting in a greater risk of failure, more processing steps, and higher production costs. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a power module, a power device and a vehicle, which can reduce the difficulty of the process while providing double-sided heat dissipation.

[0006] One aspect of an embodiment of the present application provides a power module. The power module includes a substrate assembly, a heat dissipation assembly, and a plastic package, wherein the substrate assembly has a first side surface and a second side surface opposite to each other, the heat dissipation assembly is connected to the second side surface of the substrate assembly, the plastic package seals the substrate assembly therein, a built-in channel is provided inside the plastic package, at least a portion of the built-in channel is provided in the plastic package located on the first side surface of the substrate assembly, and the built-in channel has an inlet and an outlet.

[0007] Furthermore, the built-in channel is formed integrally with the plastic sealing body by pre-setting a pipeline when the substrate assembly is plastic sealed.

[0008] Furthermore, the material of the pipeline includes temperature-resistant plastic or metal material.

[0009] Furthermore, the inlet and the outlet are arranged on a side surface of the plastic package body close to the heat dissipation component.

[0010] Further, the substrate assembly has a first side and a second side relative to each other and a third side and a fourth side relative to each other, the third side and the fourth side are adjacent to the first side and the second side respectively, the power module includes a plurality of terminals, the plurality of terminals are respectively located on the first side and the second side of the substrate assembly, and the built-in channel extends from the third side of the substrate assembly to the fourth side.

[0011] Furthermore, two built-in channels are symmetrically arranged inside the plastic packaging body.

[0012] Further, the two inlets of the two built-in channels are respectively located at opposite ends of the third side of the substrate assembly, and the two outlets of the two built-in channels are respectively located at opposite ends of the fourth side of the substrate assembly.

[0013] Further, the plurality of terminals include power terminals and signal terminals, the power terminals include DC terminals and AC terminals, the DC terminals are located on the first side of the substrate assembly, and the AC terminals and the signal terminals are located on the second side of the substrate assembly.

[0014] Another aspect of the embodiment of the present application provides a power device. The power device includes a cooling plate and three power modules as described above, the three power modules are respectively connected to the cooling plate, the cooling plate has a cooling inlet and a cooling outlet, the heat dissipation component in each of the power modules is connected to the cooling inlet and the cooling outlet of the cooling plate through a first seal, and the inlet and outlet of the built-in channel in each of the power modules are connected to the cooling inlet and the cooling outlet of the cooling plate through a second seal and a third seal, respectively.

[0015] Another aspect of the embodiments of the present application provides a vehicle, wherein the vehicle includes the power device as described above.

[0016] The power module, power device and vehicle of one or more embodiments of the present application can achieve double-sided heat dissipation of the substrate assembly by providing a built-in channel in the plastic package located on the first side of the substrate assembly and providing a heat dissipation assembly on the second side of the substrate assembly, thereby improving the heat dissipation capacity of the substrate assembly, improving the heat dissipation efficiency of the product, and thereby improving the product life and reliability.

[0017] The power module, power device and vehicle of one or more embodiments of the present application can achieve double-sided heat dissipation function using a single substrate assembly by setting a built-in channel inside the plastic package, thereby simplifying the structure and reducing production costs and manufacturing difficulty.

[0018] In addition, the power module, power device and vehicle of one or more embodiments of the present application adopt a method of setting a built-in channel inside the plastic package. The inner diameter of the built-in channel is much smaller than that of the heat dissipation component. Therefore, the sealing connection between the inlet and outlet of the built-in channel and the cooling plate can adopt a smaller sized sealing ring without using a large-area sealing ring. Therefore, the problem of poor sealing effect caused by the use of large-area sealing rings can be avoided, and the probability of sealing ring failure is greatly reduced. While ensuring the sealing of the product, the manufacturing process is simplified and the manufacturing difficulty is reduced.

[0019] In addition, the power module, power device and vehicle of one or more embodiments of the present application form two sets of cooling inlet and outlet structures by symmetrically arranging two built-in channels inside the plastic package, which has a reasonable design, improves production efficiency and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a three-dimensional schematic diagram of a power module according to an embodiment of the present application.

[0021] Figure 2 This is a circuit diagram of a power module according to an embodiment of the present application.

[0022] Figure 3 FIG. 1 is a cross-sectional schematic diagram of a power module according to an embodiment of the present application.

[0023] Figure 4 This is a schematic diagram of the overall structure of a power device according to an embodiment of the present application.

[0024] Figure 5 for Figure 4 A top view of the power device is shown.

[0025] Figure 6 This is a schematic diagram of the sealed connection between the inlet of the built-in channel of the plastic package body and the cooling inlet of the cooling plate according to one embodiment of the present application.

[0026] Figure 7 for Figure 6 Magnified view of the boxed area shown.

[0027] Figure 8 A schematic diagram of a double-sided heat dissipation path of a substrate assembly according to an embodiment of the present application.

[0028] Fig. 9A schematic diagram of a first heat dissipation path of a substrate assembly according to an embodiment of the present application.

[0029] Fig.10 A schematic diagram of a second heat dissipation path of a substrate assembly according to an embodiment of the present application.

[0030] Fig.11 A schematic diagram of the internal structure of a vehicle according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices consistent with some aspects of the present application as detailed in the appended claims.

[0032] The power module, power device and vehicle of each embodiment of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the features of the following embodiments and implementations can be combined with each other.

[0033] The present application provides a power module. Figure 1 A three-dimensional schematic diagram of a power module 100 according to an embodiment of the present application is disclosed. Figure 1 As shown, a power module 100 according to an embodiment of the present application is a half-bridge power module 100 , which includes a substrate assembly 110 , a heat dissipation assembly 120 , a plurality of terminals and a plastic package 130 .

[0034] The substrate assembly 110 includes a chipset and a circuit structure thereof, and is responsible for current conversion of the power module 100. The substrate assembly 110 has a first side surface and a second side surface opposite to each other.

[0035] The heat dissipation assembly 120 is connected to the second side surface of the substrate assembly 110. The heat dissipation assembly 120 may include, for example, a heat dissipation pin group for increasing the heat dissipation area.

[0036] The substrate assembly 110 has a first side and a second side opposite to each other. A plurality of terminals are respectively located on the first side and the second side of the substrate assembly 110. The plurality of terminals include power terminals and signal terminals 140, wherein the power terminals are used to transmit power information, and the signal terminals 140 are used to transmit signal information.

[0037] The power terminal may include a DC terminal and an AC terminal AC. Optionally, the DC terminal may include a pair of negative DC terminals DC- and a positive DC terminal DC+, wherein the positive DC terminal DC+ is located between the pair of negative DC terminals DC-. In one embodiment, the DC terminal is located on a first side of the substrate assembly 110, and the AC terminal AC and the signal terminal 140 are located on a second side of the substrate assembly 110.

[0038] The plastic package 130 encapsulates the substrate assembly 110 and the portion of each of the multiple terminals connected to the substrate assembly 110, and at least a portion of each of the multiple terminals is exposed outside the plastic package 130 for connection with the outside. The plastic package 130 is used to protect the substrate assembly 110 from external interference.

[0039] like Figure 1 As shown, optionally, the plastic package body 130 is further provided with a creepage groove 131 between the negative DC terminal DC- and the positive DC terminal DC+, and the creepage groove 131 can be used to increase the insulation creepage distance between terminals of different polarities.

[0040] Figure 2 The circuit diagram of a power module 100 according to an embodiment of the present application is disclosed. Figure 2 As shown, the chipset on the substrate assembly 110 includes an upper bridge chip 111 and a lower bridge chip 112. The signal terminal 140 is respectively connected to the gate g, source s and drain d of the upper bridge chip 111 and the gate g and source s of the lower bridge chip 112, the positive DC terminal DC+ is electrically connected to the drain d of the upper bridge chip 111, the negative DC terminal DC- is electrically connected to the source s of the lower bridge chip 112, and the AC terminal AC is electrically connected to the source s of the upper bridge chip 111 and the drain d of the lower bridge chip 112.

[0041] Figure 3 A cross-sectional schematic diagram of a power module 100 according to an embodiment of the present application is disclosed. Figure 3 As shown, a built-in channel 132 is disposed inside the plastic package body 130 , at least a portion of the built-in channel 132 is disposed inside the plastic package body 130 located at the first side of the substrate assembly 110 , and the built-in channel 132 has an inlet 1321 and an outlet 1322 .

[0042] In some embodiments, the built-in channel 132 can be integrally formed with the plastic package body 130 by pre-setting the channel when plastic-sealing the substrate assembly 110. The material of the channel can include, for example, temperature-resistant plastic or metal material.

[0043] In some embodiments, the inlet 1321 and the outlet 1322 of the built-in channel 132 are both disposed on a side of the plastic package body 130 close to the heat dissipation assembly 120 .

[0044] The substrate assembly 110 has a third side and a fourth side relative to each other, and the third side and the fourth side are adjacent to the first side and the second side, respectively. Optionally, the built-in channel 132 can extend from the third side to the fourth side of the substrate assembly 110. It can be understood that the shape of the built-in channel 132 in the plastic package 130 of the present application is only used as an illustrative example of the present application, however, the shape of the built-in channel 132 in the plastic package 130 of the present application is not limited thereto, in other embodiments, the shape or size of the built-in channel 132 of the present application can be adaptively changed according to the actual product, and the preset is completed before the substrate assembly 110 is plastic-sealed, and at least only the built-in channel 132 of the plastic package 130 needs to be retained.

[0045] In some embodiments, two built-in channels 132 are symmetrically disposed inside the plastic package body 130 .

[0046] Optionally, the two inlets 1321 of the two built-in channels 132 are respectively located at opposite ends of a third side of the substrate assembly 110 , and the two outlets 1322 of the two built-in channels 132 are respectively located at opposite ends of a fourth side of the substrate assembly 110 .

[0047] The power module 100 of the present application cools the substrate assembly 110 by providing a built-in channel 132 inside the plastic package 130 , and has a simple structure, convenient processing, good cooling effect, and strong applicability.

[0048] The present application also provides a power device 200 . Figure 4 The overall structural diagram of a power device 200 according to an embodiment of the present application is disclosed. Figure 5 Revealed Figure 4 FIG. 2 is a top view of the power device 200 shown in FIG. Figure 4 and Figure 5 As shown, a power device 200 according to an embodiment of the present application includes a cooling plate 210 and three power modules 100 as described above, and the three power modules 100 are respectively connected to the cooling plate 210. The cooling plate 210 has a cooling inlet 211 and a cooling outlet 212, and an internal cooling channel 213 (such as Figure 6 As shown), the internal cooling channel 213 connects the cooling inlet 211 and the cooling outlet 212.

[0049] The heat dissipation assembly 120 of each power module 100 can be sealed and connected to the cooling plate 210 through the first seal, and connected to the cooling inlet 211 and the cooling outlet 212 of the cooling plate 210. The inlet 1321 and the outlet 1322 of the built-in channel 132 in each power module 100 can be sealed at the cooling inlet 211 and the cooling outlet 212 of the cooling plate 210 through the second seal and the third seal, respectively, and the inlet 1321 and the outlet 1322 of the built-in channel 132 in each power module 100 are connected to the cooling inlet 211 and the cooling outlet 212 of the cooling plate 210, respectively.

[0050] Figure 6 A schematic diagram of a sealed connection between an inlet 1321 of a built-in channel 132 of a plastic package body 130 and a cooling inlet 211 of a cooling plate 210 is disclosed in one embodiment of the present application. Figure 7 Revealed Figure 6 A magnified view of the boxed area shown. Figure 6 And with reference Figure 7 As shown, in one embodiment, a hollow mounting column 214 is provided on the cooling plate 210, and the hollow mounting column 214 is connected to the cooling inlet 211 of the cooling plate 210. A sealing ring 215 is sleeved on the outer periphery of the mounting column 214. The mounting column 214 sleeved with the sealing ring 215 can be inserted into the inlet 1321 of the built-in channel 132 of the plastic package body 130, so that the inlet 1321 of the built-in channel 132 is sealed and connected to the cooling plate 210 through the sealing ring 215, and the inlet 1321 of the built-in channel 132 is connected to the cooling inlet 211 of the cooling plate 210 through the hollow mounting column 214. For the outlet 1322 of the built-in channel 132, a sealing connection method similar to that of the inlet 1321 of the built-in channel 132 can be adopted, which will not be repeated here.

[0051] Furthermore, it is understandable that Figure 6 and Figure 7 The figure is only a schematic connection method between the inlet 1321 or outlet 1322 of the built-in channel 132 of the present application and the cooling plate 210. However, the present application does not limit the sealing connection method between the inlet 1321 or outlet 1322 of the built-in channel 132 and the cooling plate 210. In other embodiments, other sealing connection methods can also be used between the inlet 1321 or outlet 1322 of the built-in channel 132 of the present application and the cooling plate 210. Any method that can achieve sealing between the inlet 1321 or outlet 1322 of the built-in channel 132 and the cooling plate 210 and achieve communication between the inlet 1321 or outlet 1322 of the built-in channel 132 and the cooling inlet 211 or cooling outlet 212 of the cooling plate 210 will be covered within the protection scope of the present application.

[0052] The substrate assembly 110 of the present application may have a double-sided heat dissipation path, so as to achieve double-sided heat dissipation of the substrate assembly 110 . Figure 8 A schematic diagram of a double-sided heat dissipation path of a substrate assembly 110 according to an embodiment of the present application is disclosed. Fig. 9 A schematic diagram of a first heat dissipation path of a substrate assembly 110 according to an embodiment of the present application is disclosed. Fig.10 A schematic diagram of a second heat dissipation path of the substrate assembly 110 according to an embodiment of the present application is disclosed.

[0053] like Figure 8 And with reference Fig. 9 As shown, a first heat dissipation path is formed between the cooling inlet 211 of the cooling plate 210, the heat dissipation assembly 120, and the cooling outlet 212 of the cooling plate 210. Specifically, the coolant flows in from the cooling inlet 211 of the cooling plate 210, passes through the heat dissipation of the heat dissipation pin groups of the heat dissipation assembly 120 on the second side surfaces of the substrate assemblies 110 of the three power modules 100, and finally flows out from the cooling outlet 212 of the cooling plate 210, taking away the heat from the second side surface of the substrate assembly 110, thereby achieving heat dissipation on the second side surface of the substrate assembly 110.

[0054] like Figure 8 And with reference Fig.10 As shown, a second heat dissipation path is formed between the cooling inlet 211 of the cooling plate 210, the built-in channel 132, and the cooling outlet 212 of the cooling plate 210. Specifically, the coolant flows in from the cooling inlet 211 of the cooling plate 210, first through the two inlets 1321 of the two built-in channels 132 in the plastic package 130 located on the second side of the substrate assembly 110 of the first power module 100, respectively flows into the two built-in channels 132 on one side of the second side of the substrate assembly 110, and flows out through the two outlets 1322 of the two built-in channels 132 in the plastic package 130 of the first power module 100, and then, through the two inlets 1321 of the two built-in channels 132 in the plastic package 130 of the second power module 100, respectively flows into the two built-in channels in the plastic package 130 of the second power module 100. 132, and then flows out through the two outlets 1322 of the two built-in channels 132 in the plastic package 130 of the second power module 100, and then flows into the two built-in channels 132 in the plastic package 130 of the third power module 100 through the two inlets 1321 of the two built-in channels 132 in the plastic package 130 of the third power module 100 respectively, and then flows out through the two outlets 1322 of the two built-in channels 132 in the plastic package 130 of the third power module 100, and finally flows out through the cooling outlet 212 of the cooling plate 210, taking away the heat of the first side surface of the substrate assembly 110, thereby cooling the first side surface of the substrate assembly 110.

[0055] The power module 100 and the power device 200 of the present application are configured with a built-in channel 132 in the plastic package 130 located on the first side of the substrate assembly 110, and a heat dissipation assembly 120 is configured on the second side of the substrate assembly 110, thereby achieving double-sided heat dissipation of the substrate assembly 110, improving the heat dissipation capacity of the substrate assembly 110, improving the heat dissipation efficiency of the product, and further improving the product life and reliability.

[0056] Furthermore, the power module 100 and the power device 200 of the present application can achieve the double-sided heat dissipation function using a single substrate assembly 110 by setting a built-in channel 132 inside the plastic package 130, without the need to achieve double-sided heat dissipation through the connection between two substrate assemblies 110 as in the existing solution, thereby simplifying the structure and reducing production costs and manufacturing difficulty.

[0057] In addition, the power module 100 and the power device 200 of the present application adopt a method of setting a built-in channel 132 inside the plastic package 130. The inner diameter of the built-in channel 132 is much smaller than that of the heat dissipation component 120. Therefore, the sealing connection between the inlet 1321 and the outlet 1322 of the built-in channel 132 and the cooling plate 210 can adopt a smaller-sized sealing ring 215 without using a large-area sealing ring 215. Therefore, the problem of poor sealing effect caused by using a large-area sealing ring 215 for connection can be avoided, and the probability of failure of the sealing ring is greatly reduced. While ensuring the sealing of the product, the manufacturing process is simplified and the manufacturing difficulty is reduced.

[0058] In addition, the power module 100 and the power device 200 of the present application form two sets of cooling inlet and outlet structures by symmetrically arranging two built-in channels 132 inside the plastic package 130, which is reasonably designed, improves production efficiency and reduces production costs.

[0059] The present application also provides a vehicle 300 . Fig.11 The internal structure diagram of a vehicle 300 according to an embodiment of the present application is disclosed. Fig.11As shown, the vehicle 300 includes the power device 200 as described above. The vehicle 300 also includes a DC power supply 310, a motor 320, a drive board 330 and a control board 340. The positive and negative poles of the DC power supply 310 of the vehicle 300 are respectively connected to the positive DC terminal DC+ and the negative DC terminal DC- of the power terminal. The DC current is converted into AC current after passing through the power module 100, and is output from the AC terminal AC of the power terminal to the motor 320 of the vehicle 300. Among them, the signals of the double-sided heat dissipation power module 100 during operation and the temperature rise sensing signals can be transmitted to the control board 340 of the vehicle 300 through the signal terminal 140 through the drive board 330, and the motor 320 can be controlled accordingly through the control board 340 of the vehicle 300.

[0060] The vehicle 300 of the present application can well improve the heat dissipation performance of the power device 200 and enhance the performance of the power device 200 by adopting the above-mentioned power device 200, thereby having higher safety and reliability.

[0061] The power module, power device and vehicle provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the power module, power device and vehicle in the embodiments of the present application. The description of the above embodiments is only used to help understand the core idea of ​​the present application and is not intended to limit the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the spirit and principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications should also fall within the scope of protection of the claims attached to the present application.

Claims

1. A power module, characterized in that: It includes a substrate assembly, a heat dissipation assembly and a plastic package body, wherein the substrate assembly has a first side surface and a second side surface opposite to each other, the heat dissipation assembly is connected to the second side surface of the substrate assembly, the plastic package body seals the substrate assembly therein, a built-in channel is arranged inside the plastic package body, at least a part of the built-in channel is arranged in the plastic package body located on the first side surface of the substrate assembly, and the built-in channel has an inlet and an outlet.

2. The power module according to claim 1, wherein: The built-in channel is formed integrally with the plastic sealing body by pre-arranging a pipeline when the substrate assembly is plastic sealed.

3. The power module according to claim 2, wherein: The material of the pipeline includes temperature-resistant plastic or metal material.

4. The power module according to claim 1, wherein: The inlet and the outlet are arranged on a side surface of the plastic package body close to the heat dissipation component.

5. The power module according to claim 4, characterized in that: The substrate assembly has a first side and a second side opposite to each other and a third side and a fourth side opposite to each other, the third side and the fourth side are adjacent to the first side and the second side respectively, the power module includes a plurality of terminals, the plurality of terminals are respectively located on the first side and the second side of the substrate assembly, and the built-in channel extends from the third side of the substrate assembly to the fourth side.

6. The power module according to claim 5, characterized in that: Two built-in channels are symmetrically arranged inside the plastic packaging body.

7. The power module according to claim 6, wherein: The two inlets of the two built-in channels are respectively located at opposite ends of the third side of the substrate assembly, and the two outlets of the two built-in channels are respectively located at opposite ends of the fourth side of the substrate assembly.

8. The power module according to claim 5, characterized in that: The plurality of terminals include power terminals and signal terminals. The power terminals include DC terminals and AC terminals. The DC terminals are located on the first side of the substrate assembly. The AC terminals and the signal terminals are located on the second side of the substrate assembly.

9. A power device, characterized in that: It comprises a cooling plate and three power modules as described in any one of claims 1 to 8, the three power modules are respectively connected to the cooling plate, the cooling plate has a cooling inlet and a cooling outlet, the heat dissipation component in each of the power modules is connected to the cooling inlet and the cooling outlet of the cooling plate through a first seal, and the inlet and outlet of the built-in channel in each of the power modules are connected to the cooling inlet and the cooling outlet of the cooling plate through a second seal and a third seal, respectively.

10. A vehicle, characterized in that: Comprising the power device as claimed in claim 9.

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