Heat dissipation packaging structure of liquid heat conduction agent

Abstract

The invention relates to a heat dissipation packaging structure for a liquid heat conduction agent, and the structure comprises a heat conduction pedestal, the center of the upper surface of the heat conduction pedestal is provided with a first groove body, and the heat conduction pedestal is provided with an installation channel below the first groove body; the elastic film covers the first groove body, and the elastic film is of a downward concave structure; the spring is transversely arranged on the heat conduction base, one part of the spring is embedded in the area, corresponding to the lower portion of the elastic film, in the first groove body, and the parts, located on the left side and the right side of the first groove body, of the spring are led out from the left side and the right side of the first groove body and laid on the surface of the heat conduction base; the tail end of the spring penetrates into the mounting channel; the thermal expansion piece is arranged in the mounting channel, and the two ends of the thermal expansion piece are connected to the tail ends of the springs correspondingly; sealing the foam; and the elastic columns are arranged at the corners of the heat conduction base.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation packaging structures, and in particular to a heat dissipation packaging structure with a liquid thermal conductor. Background Art

[0002] Electronic devices, lighting equipment, etc. will generate a lot of heat during use, and the temperature may reach 70°C or even higher. In order to ensure the normal operation of electronic devices or lighting equipment, it is necessary to equip the heat-generating devices with heat dissipation fins and other structures. Liquid thermal conductors have the characteristics of low melting point and high thermal conductivity. For example, the melting point of gallium is about 29°C. It is often used to fill the space between the heat dissipation fins and the heat-generating devices, so that when the heat-generating devices generate heat, they melt into liquid and conduct the heat generated by the heat-generating devices to the heat dissipation fins.

[0003] However, liquid thermal conductors have the property of thermal expansion and contraction. When the temperature of the heating device is not working and drops below 30°C, the liquid thermal conductor begins to solidify and shrink. The distance between the heating device and the heat sink in the prior art is fixed. After the liquid thermal conductor shrinks, a gap is created between the heating device and the heat sink. The heat generated when the heating device starts working needs to re-melt the liquid thermal conductor and reach a certain temperature (for example, 70°C) before it can refill the space between the heating device and the heat sink. In this case, when the lighting device starts working, the gap between the heating device and the heat sink makes it difficult for the heat to be transferred to the heat sink, resulting in a short-term local high temperature, which can easily damage the lighting device.

[0004] The purpose of the present invention is to design a heat dissipation packaging structure of a liquid thermal conductor in view of the above-mentioned problems in the prior art. Summary of the invention

[0005] In view of the problems existing in the above-mentioned prior art, the present invention provides a heat dissipation packaging structure of a liquid thermal conductor, which can effectively solve at least one problem existing in the above-mentioned prior art.

[0006] The technical solution of the present invention is: A heat dissipation packaging structure of a liquid thermal conductor, comprising: A heat-conducting base, wherein a first slot is provided at the center of the upper surface of the heat-conducting base, and a mounting channel is provided below the first slot of the heat-conducting base; An elastic membrane, covering the first groove body, the elastic membrane is in a concave structure; A spring, wherein the spring is transversely arranged on the heat-conducting base, a portion of the spring is buried in the area of ​​the first slot body corresponding to below the elastic membrane, portions of the spring located on the left and right sides of the first slot body are led out from the left and right sides of the first slot body and laid on the surface of the heat-conducting base, and an end of the spring penetrates into the mounting channel; A heat expansion member is arranged in the installation channel, two ends of the heat expansion member are respectively connected to the ends of the spring, and the heat expansion member changes the pulling amount of the spring by expanding and contracting according to the temperature of the heating device; Sealing foam, arranged around the edge of the heat-conducting base, and the space surrounded by the sealing foam is used to fill the liquid heat-conducting agent; The elastic column is arranged at the corner of the heat-conducting base, and the elastic column is used to connect the corresponding heat dissipation device. The elastic column makes the heat-conducting base and the heat dissipation device have a movement tendency to approach each other.

[0007] Furthermore, the heat-conducting base is provided with a connecting pipe on one side of the first trough body, and the portion of the spring located on the upper end surface of the heat-conducting base is arranged in the connecting pipe.

[0008] Furthermore, the connecting pipe is made of an elastic film.

[0009] Furthermore, the number of the springs is several.

[0010] Furthermore, the thermal expansion component is made of a material with a thermal expansion coefficient greater than 150.

[0011] Furthermore, the installation channel is an S-shaped structure.

[0012] Furthermore, the length of the heat expansion member is greater than 10 cm.

[0013] Furthermore, a second slot body is provided at a corner of the heat-conducting base, the elastic column is provided in the second slot body, a mounting platform is provided at the top of the elastic column, and the mounting platform is used to be locked to the corresponding heat dissipation device.

[0014] Furthermore, the mounting platform is provided with a plurality of locking holes.

[0015] Therefore, the present invention provides the following effects and / or advantages: The present application provides an elastic membrane on a heat-conducting base, and then a part of the spring is located under the elastic membrane and the other part is located on the heat-conducting base, so that the coil diameter of the spring can be changed in the process of stretching the spring to change the distance between the heat-conducting base and the heat dissipation fins, and at the same time, the deformation amount caused by the extrusion between the heat-conducting base and the heat dissipation fins on the elastic membrane is changed by changing the stiffness of the spring. Finally, the distance between the heat-conducting base and the heat dissipation device is adaptively adjusted according to different temperatures, and the space between the heat-conducting base and the heat dissipation device is reduced after the temperature drops. The rigidity of the spring is increased, so that the liquid thermal conductive agent contained in the elastic membrane is released between the heat-conducting base and the heat dissipation fins, so that the liquid thermal conductive agent always fills the space between the heat-conducting base and the heat dissipation fins.

[0016] The present application defines the thermal expansion coefficient and length of the thermal expansion member, and increases the accommodating length of the thermal expansion member by installing the S-shape of the channel, so as to adapt to the temperature variation range of the heating device, and can produce a sufficient length change, and then produce a sufficient rigidity change. It can effectively solve the heat dissipation problem of electronic equipment under high temperature conditions. It realizes the improvement of heat dissipation efficiency and reliability through the organic combination of components such as the heat-conducting base, elastic membrane, spring, and thermal expansion member, and is suitable for high-performance heat dissipation scenarios.

[0017] The present application provides elastic columns at the corners of the thermally conductive base, which tighten the distance between the thermally conductive base and the corresponding heat sink, so that the heat sink is tightly attached to the top of the spring. A small amount of distance is generated between the heat sink and the thermally conductive base by changing the coil diameter of the spring, thereby adapting to the volume change of the liquid thermal conductor caused by thermal expansion and contraction at different temperatures, so that the liquid thermal conductor always fills the space between the two.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0019] It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0021] Figure 2 for Figure 1 AA section view.

[0022] Figure 3 It is a schematic diagram of the structural explosion of an embodiment of the present invention.

[0023] Figure 4 A perspective view of the thermally conductive base.

[0024] Figure 5 for Figure 4 BB cross-sectional view.

[0025] Description of reference numerals: Heat-conducting base 1 , first slot body 11 , mounting channel 12 , second slot body 13 , elastic membrane 2 , spring 3 , thermal expansion member 4 , sealing foam 5 , elastic column 6 , connecting pipe 7 , mounting platform 61 . DETAILED DESCRIPTION

[0026] In order to facilitate understanding by those skilled in the art, the structure of the present invention is further described in detail with reference to the embodiments in conjunction with the accompanying drawings: refer to Figure 1-5 , a heat dissipation packaging structure of a liquid thermal conductor, comprising: A heat-conducting base 1 is provided with a first groove 11 at the center of the upper surface of the heat-conducting base 1, and a mounting channel 12 is provided below the first groove 11 of the heat-conducting base 1; the heat-conducting base 1 serves as the foundation and main heat-conducting component of the entire structure, is in direct contact with a heat source, such as a heating device, and is responsible for transferring heat to a liquid heat conductor.

[0027] The elastic membrane 2 covers the first slot body 11, and the elastic membrane 2 is a concave structure; when the temperature changes, the elastic membrane 2 is deformed by force, so that the amount of liquid thermal conductive agent stored in the slot body changes, filling the gap and ensuring the heat dissipation performance; A spring 3, wherein the spring 3 is transversely arranged on the heat-conducting base 1, a portion of the spring 3 is buried in the first slot 11 in an area corresponding to below the elastic membrane 2, portions of the spring 3 located on the left and right sides of the first slot 11 are led out from the left and right sides of the first slot 11 and laid on the surface of the heat-conducting base 1, and a terminal end of the spring 3 is inserted into the mounting channel 12; A heat expansion member 4 is disposed in the installation channel 12, and both ends of the heat expansion member 4 are respectively connected to the ends of the spring 3. The heat expansion member 4 expands and contracts according to the temperature of the heating device, thereby changing the pulling amount of the spring 3; Sealing foam 5, arranged around the edge of the heat-conducting base 1, and the space surrounded by the sealing foam 5 is used to fill the liquid heat-conducting agent; The elastic column 6 is arranged at the corner of the heat-conducting base 1 . The elastic column 6 is used to connect the corresponding heat dissipation device. The elastic column 6 makes the heat-conducting base 1 and the heat dissipation device have a tendency to move closer.

[0028] When in use, the heat-conducting base 1 is attached to the surface of the heating device, and the heat generated by the heating device is conducted through the heat-conducting base 1. Liquid thermal conductive agent is injected into the space enclosed by the sealing foam 5, and the upper surface of the sealing foam 5 is attached to the heat dissipation device, and the heat dissipation device is connected to the elastic column 6, so that the liquid thermal conductive agent is sealed through the space between the heat dissipation device and the sealing foam 5 to prevent the liquid thermal conductive agent from leaking out, and the heat of the heat-conducting base 1 is transferred to the heat dissipation device through the high thermal conductivity of the liquid thermal conductive agent. The elastic column 6 connects the heat dissipation device and the heat-conducting base 1 in a tensioned state, so that the heat dissipation device is tightly attached to the upper surface of the sealing foam 5, and the distance between the heat dissipation device and the sealing foam 5 is adjustable.

[0029] Through the way the spring 3 passes, the spring 3 passes under the corresponding elastic membrane 2 in the first slot 1, and one end of the spring 3 is pulled by the thermal expansion member 4, so that the spring 3 presents different stiffnesses under the action of thermal expansion and contraction of the thermal expansion member 4. Specifically, when the lighting lamp or electronic device is not in use, its temperature decreases, the thermal expansion member 4 contracts, and the spring 3 is pulled a certain distance into the installation channel. The spring 3 is tightened and the stiffness is increased. Since the spring 3 is located under the elastic membrane 2, on the one hand, the elastic membrane 2 is difficult to bend downward after the spring 3 is stretched, so that the liquid thermal conductor stored in the elastic membrane 2 is discharged. In the process of cooling, shrinking and solidifying of the liquid thermal conductor, the liquid thermal conductor is squeezed as much as possible to fill the space between the thermal base 1 and the heat dissipation device; when the lighting lamp or electronic device is in use, the liquid thermal conductor expands due to heat, and its volume increases. The length of the thermal expansion member 4 increases after expansion, which reduces the pulling amount on the spring 3, and the spring 3 is relaxed, so that the elastic membrane 2 is more likely to deform downward. At this time, more liquid thermal conductor can be stored in the elastic membrane 2; on the other hand, after the spring 3 is stretched, the coil diameter of the spring 3 becomes smaller. Since the portion of the spring 3 located on the upper end surface of the thermally conductive base 1 is disposed between the thermally conductive base 1 and the heat sink, after the coil diameter of the spring 3 becomes smaller, the coil diameter of the spring 3 is smaller than the original distance between the bottom ends of the thermally conductive base 1 and the heat sink. Driven by the elastic column 6, the thermally conductive base 1 and the heat sink have a tendency to move closer, thereby reducing the space between the thermally conductive base 1 and the heat sink. Under the combined effect, it is ensured that the liquid thermal conductor can still fill the space between the thermally conductive base 1 and the heat sink when its volume decreases after cooling and shrinking, thereby preventing the formation of gaps after the liquid thermal conductor shrinks.

[0030] By utilizing the high thermal conductivity and thermal expansion characteristics of the liquid thermal conductor, the dynamic optimization of the heat dissipation performance is achieved through the combined action of the spring 3 and the thermal expansion member 4. Furthermore, the heat-conducting base 1 is provided with a connecting pipe 7 on one side of the first slot body 11 , and a portion of the spring 3 located on the upper end surface of the heat-conducting base 1 is arranged in the connecting pipe 7 .

[0031] Furthermore, the connecting pipe 7 is made of an elastic film.

[0032] The connecting pipe 7 can be wrapped around the outer periphery of the spring 3 to prevent the liquid thermal conductor from penetrating into the installation channel under the thermal base 1. At the same time, the connecting pipe 7 is made of an elastic film, which can always fit the surface of the spring 3 after the coil diameter of the spring 3 changes, and adapt to the coil diameter under different pulling amounts of the spring 3. The connecting pipe 7 and the elastic film 2 can be made of polyethylene (PE) or polypropylene (PP), etc., so as not to react with the liquid thermal conductor, but have a certain elasticity, and can withstand high temperatures within 100°C.

[0033] Furthermore, the number of the springs 3 is several.

[0034] In this embodiment, there are two springs 3 arranged below each of the first grooves 11, corresponding to the two sides of the first grooves 11 respectively, so as to better support the lower end of the elastic membrane 2, thereby changing the deformation of the elastic membrane 2 at multiple positions of the elastic membrane 2.

[0035] Furthermore, the thermal expansion member 4 is made of a material with a thermal expansion coefficient greater than 150.

[0036] Furthermore, the installation channel 12 is an S-shaped structure.

[0037] Furthermore, the length of the heat expansion member 4 is greater than 10 cm.

[0038] In this embodiment, the unit of thermal expansion coefficient can be 10 -6 / ℃, represents the length change (mm) produced by each degree of temperature increase. The temperature difference between the used state and the unused state of the heating device in this embodiment is generally 50-70℃. The thermal expansion member 4, which is made of a material with a thermal expansion coefficient greater than 150 and a length of 10cm, can produce a length change of more than 7.5mm under the temperature difference change, thereby effectively pulling the spring 3 to produce a sufficient stretch change. The installation channel 12 is an S-shaped structure that can accommodate a longer thermal expansion member 4, so that it has a sufficient length.

[0039] Furthermore, a second slot 13 is provided at the corner of the thermally conductive base 1 , the elastic column 6 is provided in the second slot 13 , a mounting platform 61 is provided at the top of the elastic column 6 , and the mounting platform 61 is used to be locked to the corresponding heat dissipation device.

[0040] In this embodiment, the second groove body 13 is used to accommodate the elastic column 6, and the mounting platform 61 arranged on the top of the elastic column 6 can be connected to the heat sink, so as to support the heat sink and prevent the heat sink from being separated from the thermally conductive base 1, and provide the heat sink and the thermally conductive base 1 with a structural foundation with adjustable distance. The elastic column 6 makes the thermally conductive base 1 and the heat sink close to and fit each other, and the sealing foam 5 has a certain thickness deformation space, so that it can always fit between the thermally conductive base 1 and the heat sink at different distances.

[0041] Furthermore, the mounting platform 61 is provided with a plurality of locking holes.

[0042] The locking holes can facilitate connection to the bottom surface of the heat sink.

[0043] It should be noted that in the claims, any reference signs placed between brackets shall not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claim. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The invention may be implemented by means of hardware comprising several different components and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0044] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0045] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

Claims

1. A heat dissipation packaging structure of a liquid thermal conductor, characterized in that: include: A heat-conducting base (1), wherein a first groove (11) is provided at the center of an upper surface of the heat-conducting base (1), and a mounting channel (12) is provided below the first groove (11) of the heat-conducting base (1); An elastic membrane (2) covering the first groove body (11), the elastic membrane (2) being a concave structure; A spring (3), the spring (3) being arranged transversely on the heat-conducting base (1), a portion of the spring (3) being embedded in the first slot (11) in an area corresponding to the area below the elastic membrane (2), the portions of the spring (3) located on the left and right sides of the first slot (11) being led out from the left and right sides of the first slot (11) and laid on the surface of the heat-conducting base (1), and the end of the spring (3) being inserted into the mounting channel (12); A heat expansion member (4) is arranged in the installation channel (12), with two ends of the heat expansion member (4) respectively connected to the ends of the spring (3), and the heat expansion member (4) changes the pulling amount of the spring (3) by expanding and contracting according to the temperature of the heating device; A sealing foam (5) is arranged around the edge of the heat-conducting base (1), and the space surrounded by the sealing foam (5) is used to be filled with a liquid heat-conducting agent; An elastic column (6) is arranged at a corner of the heat-conducting base (1); the elastic column (6) is used to connect a corresponding heat dissipation device; the elastic column (6) enables the heat-conducting base (1) and the heat dissipation device to have a tendency to move closer to each other.

2. The heat dissipation packaging structure of a liquid thermal conductor according to claim 1, characterized in that: The heat-conducting base (1) is provided with a connecting pipe (7) on one side of the first trough body (11), and the portion of the spring (3) located on the upper end surface of the heat-conducting base (1) is arranged in the connecting pipe (7).

3. The heat dissipation packaging structure of a liquid thermal conductor according to claim 2, characterized in that: The connecting pipe is made of an elastic film.

4. The heat dissipation packaging structure of a liquid thermal conductor according to claim 1, characterized in that: The number of the springs (3) is several.

5. The heat dissipation packaging structure of a liquid thermal conductor according to claim 1, characterized in that: The thermal expansion component (4) is made of a material with a thermal expansion coefficient greater than 150.

6. The heat dissipation packaging structure of a liquid thermal conductor according to claim 5, characterized in that: The installation channel (12) is an S-shaped structure.

7. The heat dissipation packaging structure of a liquid thermal conductor according to claim 6, characterized in that: The length of the heat expansion member (4) is greater than 10 cm.

8. The heat dissipation packaging structure of a liquid thermal conductor according to claim 1, characterized in that: A second groove body is provided at a corner of the heat-conducting base (1), the elastic column (6) is provided in the second groove body, and a mounting platform (61) is provided at the top of the elastic column (6), the mounting platform (61) being used for being locked to a corresponding heat dissipation device.

9. The heat dissipation packaging structure of a liquid thermal conductor according to claim 8, characterized in that: The mounting platform (61) is provided with a plurality of locking holes.

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