Light-emitting device and display device

Abstract

The invention discloses a light-emitting device and a display device. The light-emitting device comprises a transparent layer, a plurality of light-emitting elements, a first wiring layer, a driving chip, a first insulating layer and a plurality of bonding pads. The plurality of light-emitting elements are disposed on the transparent layer. The first wiring layer is arranged above the light-emitting elements and is electrically connected with the plurality of light-emitting elements respectively. The driving chip is arranged above the first wiring layer, a plurality of terminals are arranged on the face, close to the first wiring layer, of the driving chip, and each light-emitting element is electrically connected with the different terminals on the driving chip through the first wiring layer. The first insulating layer comprises a first part and a second part, the first part covers the periphery of the side wall of the driving chip, and the second part covers the surface, deviating from the first wiring layer, of the driving chip. And the plurality of bonding pads are electrically connected with the first wiring layer through the openings of the first insulating layer respectively. The light-emitting device provided by the invention has the advantages of smaller packaging size, no color cast problem, simple preparation process and lower cost.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a light-emitting device and a display device. Background Art

[0002] In recent years, new display technologies have been developing rapidly. For example, technologies such as OLED and MicroLED have received extensive research and attention. LED chips are widely used in display devices, vehicle lamps, general lighting, and other fields due to their high reliability, long life, and low power consumption. In addition, due to the advantage of low power consumption, LED has become the mainstream in the field of display technology.

[0003] At present, a single pixel unit used to form a display screen generally includes light-emitting chips for generating red light, blue light and green light respectively, and a driver chip for being electrically connected to these light-emitting chips. The driver chip controls these light-emitting chips so that the light-emitting device can generate different colors of light. However, since the existing light-emitting device encapsulates two chips, the driver chip and the light-emitting chip, the preparation process is relatively complicated, the reliability is low, and the overall size of the light-emitting device is difficult to further reduce. How to simplify the preparation process, improve the reliability of the device and further reduce the packaging size of the light-emitting device has become a technical difficulty that those skilled in the art need to solve urgently. Summary of the invention

[0004] In view of the above shortcomings of the prior art, an object of the present invention is to provide a light-emitting device and a display device to further reduce the package size of the light-emitting device and simplify the preparation process.

[0005] In order to achieve the above-mentioned object and other related objects, the present invention provides a light emitting device, comprising:

[0006] The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface;

[0007] A plurality of light emitting elements arranged at intervals are disposed on the second surface of the transparent layer;

[0008] A first wiring layer is disposed above the light emitting element and is electrically connected to each of the plurality of light emitting elements;

[0009] A driving chip is arranged above the first wiring layer, a plurality of terminals are arranged on a side of the driving chip close to the first wiring layer, and each light emitting element is electrically connected to different terminals on the driving chip through the first wiring layer;

[0010] A first insulating layer comprises a first portion and a second portion, wherein the first portion covers the periphery of the side wall of the driver chip, and the second portion covers the surface of the driver chip away from the first wiring layer, and a plurality of openings are arranged on the first portion of the first insulating layer;

[0011] A plurality of pads arranged at intervals are electrically connected to the first wiring layer through the openings of the first insulating layer.

[0012] The present invention also provides a light emitting device, comprising:

[0013] The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface;

[0014] A plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer, and electrodes of the light-emitting elements are disposed on a side away from the second surface of the transparent layer;

[0015] A first wiring layer is disposed above the light emitting element and is electrically connected to electrodes of the plurality of light emitting elements respectively;

[0016] A second wiring layer is disposed on a portion of the first wiring layer and is disposed corresponding to the electrodes of the light emitting element;

[0017] A driver chip is arranged above the second wiring layer. A plurality of terminals are arranged on a side of the driver chip close to the second wiring layer. The second wiring layer is also arranged corresponding to the terminals of the driver chip. Each light-emitting element is electrically connected to different terminals on the driver chip through the second wiring layer.

[0018] A first insulating layer covers the driving chip, a first portion of the first insulating layer is provided with a plurality of openings, and a second wiring layer is also provided corresponding to the openings of the first insulating layer;

[0019] A plurality of pads arranged at intervals are electrically connected to the second wiring layer through the openings of the first insulating layer.

[0020] According to another aspect of the present invention, the present invention further provides a display device, comprising:

[0021] Display substrate;

[0022] At least one light emitting device is disposed on the display substrate. Each light emitting device is electrically connected to the display substrate. The light emitting device is the light emitting device mentioned above.

[0023] Compared with the prior art, the light emitting device and the display device of the present invention have at least the following beneficial effects:

[0024] The light-emitting device of the present invention comprises a transparent layer, a plurality of light-emitting elements, a first wiring layer, a driving chip, a first insulating layer and a plurality of pads. The transparent layer comprises a first surface and a second surface arranged opposite to each other, and the first surface is a light-emitting surface. A plurality of light-emitting elements arranged at intervals are arranged on the second surface of the transparent layer. The first wiring layer is arranged above the light-emitting elements and is electrically connected to the plurality of light-emitting elements respectively. The driving chip is arranged above the first wiring layer, and a plurality of terminals are arranged on a side of the driving chip close to the first wiring layer, and each light-emitting element is electrically connected to different terminals on the driving chip through the first wiring layer. The first insulating layer comprises a first part and a second part, the first part covers the periphery of the side wall of the driving chip, and the second part covers the surface of the driving chip away from the first wiring layer. The plurality of pads arranged at intervals are electrically connected to the first wiring layer respectively through the opening of the first insulating layer. In the present invention, since the driving chip and the light-emitting element are stacked up and down, the package size can be further reduced. At the same time, since the driving chip and the light-emitting element are stacked up and down, rather than arranged in the same layer, the light-emitting group composed of the light-emitting elements can be arranged at the center of the light-emitting device, thereby ensuring that the light-emitting device does not have a color deviation problem. Furthermore, the size of the driver chip is smaller than that of the light-emitting device, and the solder pad can extend upward from the connection end of the first wiring layer located at the periphery of the driver chip, avoiding the driver chip passing through the first insulating layer and extending to the surface of the first insulating layer, thereby avoiding the problem of high process difficulty and high cost caused by drilling holes in the driver chip. In addition, the size of the driver chip is smaller than that of the light-emitting device, which is also more conducive to reducing the package size of the light-emitting device. In summary, the light-emitting device of the present invention has a smaller package size, no color deviation problem, a simple preparation process, and a lower cost.

[0025] The display device of the present invention includes the above-mentioned light-emitting device and also has the above-mentioned technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of a top view of the structure of a light emitting device in an embodiment of the present invention;

[0027] Figure 2 For along Figure 1 A-A' section view;

[0028] Figure 3a For along Figure 1 Middle B-B' section;

[0029] Figure 3b is a schematic diagram of a top view of the structure of a first wiring layer of a light-emitting device in an embodiment of the present invention;

[0030] Figure 3c is a schematic diagram of a top view of the second wiring layer of the light-emitting device in an embodiment of the present invention;

[0031] Figure 4aSchematic diagram of the connection between the solder pad and the underlying structure of the light emitting device in an embodiment of the present invention;

[0032] Figure 4b A schematic diagram of the connection between a pad and a lower structure in an example of an embodiment of the present invention;

[0033] Figure 5 A schematic diagram of connection between a pad and a lower structure in another example of an embodiment of the present invention;

[0034] Figure 6 A schematic diagram of connection between a pad and a lower structure in yet another example of an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of the structure of the distribution and shape of the pads of a light emitting device in an example of an embodiment of the present invention;

[0036] Figure 8 Schematic diagram of the distribution and shape of solder pads of a light emitting device in an example of an embodiment of the present invention.

[0037] List of reference numerals:

[0038] 100 Transparent Layer

[0039] 101 First Surface

[0040] 102 Second Surface

[0041] 110 First transparent layer

[0042] 120 Second transparent layer

[0043] 201 first light emitting element

[0044] 202 second light emitting element

[0045] 203 third light emitting element

[0046] 300 Filling Layers

[0047] 400 First wiring layer

[0048] 401 pad wiring layer

[0049] 402 First connection wiring layer

[0050] 403 Second connection wiring layer

[0051] 500 Second wiring layer

[0052] 501 Pad connection layer

[0053] 502 First connection layer

[0054] 503 Second connection layer

[0055] 600 Second insulation layer

[0056] 700 driver chip

[0057] 800 First insulation layer

[0058] 901 First driving pad

[0059] 902 Second drive pad

[0060] 903 Third drive pad

[0061] 904 Other pads

[0062] 9041 First other pad

[0063] 9042 Second other pad

[0064] 9043 Third other pad DETAILED DESCRIPTION

[0065] The following specific embodiments illustrate the embodiments of the present invention, and those familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0066] It should be noted that the diagrams provided in the embodiments of the present invention are only used to illustrate the basic concept of the present invention in a schematic manner. Although the diagrams only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component can be changed at will during actual implementation, and the layout of the components may also be more complex. The structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in this application, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by the present invention.

[0067] In order to solve the problems existing in the background technology and other technical problems, this embodiment provides a light emitting device, including:

[0068] The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface;

[0069] A plurality of light emitting elements arranged at intervals are disposed on the second surface of the transparent layer;

[0070] A first wiring layer is disposed above the light emitting element and is electrically connected to each of the plurality of light emitting elements;

[0071] A driving chip is arranged above the first wiring layer, a plurality of terminals are arranged on a side of the driving chip close to the first wiring layer, and each light emitting element is electrically connected to different terminals on the driving chip through the first wiring layer;

[0072] A first insulating layer comprises a first portion and a second portion, wherein the first portion covers the periphery of the side wall of the driver chip, and the second portion covers the surface of the driver chip away from the first wiring layer, and a plurality of openings are arranged on the first portion of the first insulating layer;

[0073] A plurality of pads arranged at intervals are electrically connected to the first wiring layer through the openings of the first insulating layer, respectively. Since the driver chip and the light-emitting element are stacked up and down, the package size can be further reduced. At the same time, since the driver chip and the light-emitting element are stacked up and down instead of being arranged in the same layer, the light-emitting group composed of the light-emitting elements can be arranged in the center of the light-emitting device, thereby ensuring that the light-emitting device does not have a color deviation problem. In addition, the size of the driver chip is the size of the light-emitting device, and the pad can extend upward from the first wiring layer outside the driver chip, avoiding the driver chip passing through the first insulating layer to the surface of the first insulating layer, thereby avoiding the problem of difficult process and high cost caused by drilling holes in the driver chip.

[0074] Optionally, a plurality of light-emitting elements form a light-emitting group of the light-emitting device, and the light-emitting group is located at the center of the light-emitting surface of the light-emitting device, thereby ensuring that the light-emitting device does not have a color shift problem.

[0075] Optionally, the driver chip is located at the center of the light emitting surface of the light emitting device, and the size of the driver chip is smaller than the size of the light emitting device, thereby further reducing the package size of the light emitting device.

[0076] Optionally, the light emitting device further comprises:

[0077] The second insulating layer is arranged between the plurality of light emitting elements and the driving chip, and the first wiring layer is formed in the second insulating layer.

[0078] Optionally, the second insulating layer contacts the contour boundary of the driver chip on the side close to the first wiring layer. Thus, the second insulating layer can prevent the driver chip from contacting the first wiring layer, causing sidewall leakage, and improve device reliability.

[0079] Optionally, the first wiring layer includes:

[0080] A pad wiring layer, a side away from the plurality of light emitting elements being connected to the pad;

[0081] A first connection wiring layer, one end of which is connected to the pad wiring layer, and the other end of which is connected to the driving chip or at least one light emitting element;

[0082] The second connection wiring layer has a surface close to the plurality of light emitting elements electrically connected to the light emitting elements, and a surface close to the driver chip electrically connected to the driver chip.

[0083] Optionally, the light emitting device further comprises:

[0084] The second wiring layer is arranged on a portion of the first wiring layer formed in the second insulating layer and exposed on the surface of the second insulating layer. The second wiring layer connects the pad to the first wiring layer, the driving chip to the first wiring layer, and the driving chip to the light emitting element.

[0085] Optionally, the light emitting device further includes a second wiring layer, which is arranged on a portion of the first wiring layer formed in the second insulating layer and exposed to a surface of the second insulating layer, and includes:

[0086] A pad connection layer, arranged on a side of the pad wiring layer close to the pad, and used for connecting the pad and the pad wiring layer;

[0087] A first connection layer, disposed on a side of a portion of the first connection wiring layer close to the driver chip, and used to connect the first connection wiring layer with terminals on the driver chip;

[0088] The second connection layer is arranged on a side of the second connection wiring layer close to the driving chip, and is used to connect the second connection wiring layer with terminals on the driving chip.

[0089] Optionally, in the top projection direction of the light emitting device, the contour boundaries of the first connection layer and the second connection layer are both located within the contour boundary of the driver chip, so that the second insulating layer filled between adjacent second wiring layers contacts the contour boundary of the driver chip. In this way, the second wiring layer can be prevented from contacting the side wall of the driver chip, which causes leakage problems in the driver chip, thereby improving device reliability.

[0090] Optionally, the thickness of the driving chip is greater than the thickness of the light emitting element.

[0091] The present invention also provides a light-emitting device, comprising:

[0092] The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface;

[0093] A plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer, and electrodes of the light-emitting elements are disposed on a side away from the second surface of the transparent layer;

[0094] A first wiring layer is disposed above the light emitting element and is electrically connected to electrodes of the plurality of light emitting elements respectively;

[0095] A second wiring layer is disposed on a portion of the first wiring layer and is disposed corresponding to the electrodes of the light emitting element;

[0096] A driver chip is arranged above the second wiring layer. A plurality of terminals are arranged on a side of the driver chip close to the second wiring layer. The second wiring layer is also arranged corresponding to the terminals of the driver chip. Each light-emitting element is electrically connected to different terminals on the driver chip through the second wiring layer.

[0097] A first insulating layer covers the driving chip, a first portion of the first insulating layer is provided with a plurality of openings, and a second wiring layer is also provided corresponding to the openings of the first insulating layer;

[0098] The plurality of pads arranged at intervals are electrically connected to the second wiring layer through the openings of the first insulating layer. Thus, the electrodes of the light-emitting element in this embodiment are arranged face to face with the terminals of the driving chip, which makes welding easier, simplifies the preparation process, and reduces the difficulty of preparation.

[0099] Optionally, the light emitting device further comprises a second insulating layer, which is arranged between the plurality of light emitting elements and the driver chip, and the first wiring layer and the second wiring layer are formed in the second insulating layer. Optionally, the second insulating layer contacts the contour boundary of the driver chip on the side close to the first wiring layer. Thus, the provision of the second insulating layer can prevent the driver chip from contacting the first wiring layer or the second wiring layer, resulting in sidewall leakage problems, thereby improving device reliability.

[0100] Optionally, the light emitting device further comprises:

[0101] The filling layer is arranged between adjacent light emitting elements and around the periphery of the plurality of light emitting elements.

[0102] Optionally, the multiple light-emitting elements include a first light-emitting element, a second light-emitting element and a third light-emitting element, the first light-emitting element is a light-emitting element radiating blue light, the second light-emitting element is a light-emitting element radiating green light, and the third light-emitting element is a light-emitting element radiating red light.

[0103] Optionally, the pad includes:

[0104] At least two driving pads, including a first driving pad and a second driving pad, the first driving pad drivingly connected to at least two light-emitting elements, and the second driving pad drivingly connected to at least a driving chip;

[0105] The other pads are electrically connected to other terminals of the driver chip.

[0106] Optionally, the at least two driving pads include:

[0107] A first driving pad is electrically connected to the first light emitting element and the second light emitting element;

[0108] The second driving pad is electrically connected to the third light emitting element and is electrically connected to the driving terminal of the driving chip. Driving the red light emitting element separately from the blue-green light emitting element can avoid the large difference between the driving voltage required by the red light emitting element and the driving voltage of the blue light emitting element and the green light emitting element. Driving the red light emitting element alone can avoid unnecessary power consumption caused by simultaneous driving, which is beneficial to saving energy consumption, and can also avoid damage to the light emitting element caused by mismatching driving voltages, which is beneficial to the reliability and service life of the light emitting element.

[0109] Optionally, the at least two driving pads include:

[0110] A first driving pad is electrically connected to the first light emitting element and the second light emitting element;

[0111] A second driving pad is electrically connected to the third light emitting element;

[0112] The third driving pad is electrically connected to the driving terminal of the driving chip. Since the driving voltage required by the red light emitting element is significantly different from the driving voltage of the blue light emitting element and the green light emitting element, driving the red light emitting element alone can avoid unnecessary power consumption caused by simultaneous driving, which is beneficial to saving energy consumption, and can also avoid damage to the light emitting element caused by mismatching driving voltages, which is beneficial to the reliability and service life of the light emitting element. The light emitting device includes six pads, and every three pads are evenly distributed on both sides of the light emitting device, which is beneficial to the uniformity and reliability of subsequent solid crystal.

[0113] Optionally, the at least two driving pads include:

[0114] A first driving pad is electrically connected to the first light emitting element, the second light emitting element and the third light emitting element;

[0115] The second driving pad is electrically connected to the driving terminal on the driving chip, thereby enabling the light emitting element and the driving chip to be driven separately, thus avoiding energy loss caused by inconsistent driving voltages between the light emitting element and the driving chip.

[0116] Optionally, the number of other pads is three, and the three other pads are electrically connected to other different terminals on the driving chip respectively.

[0117] Optionally, the length or width of the driving chip is less than 50 μm, the length of the light-emitting device is less than 500 μm, the width of the light-emitting device is less than 500 μm, and the thickness of the light-emitting device is less than 200 μm.

[0118] Optionally, each light-emitting element includes a first electrode and a second electrode, and the first electrode, the second electrode and the terminal of the driving chip of each light-emitting element are located between the light-emitting element and the driving chip, so that the electrode of the light-emitting element and the terminal of the driving chip can be face-to-face welded, which is beneficial to the manufacture of the light-emitting device.

[0119] This embodiment also provides a display device, including:

[0120] Display substrate;

[0121] At least one light-emitting device is arranged on a display substrate, each light-emitting device is electrically connected to the display substrate, and the light-emitting device is the above-mentioned light-emitting device. The package size of the light-emitting device is small, so that the same display substrate of the display device can carry more light-emitting devices, so that the display device has higher pixels and tends to be more miniaturized. The light-emitting center of the light-emitting device is located in the middle of the light-emitting device, which can ensure that the display device has no color deviation problem. At the same time, there is no need to punch holes on the driving chip of the light-emitting device, the preparation process is simpler, the cost is lower, there is no risk of leakage on the side wall of the driving chip, and the reliability of the device is improved. The driving chip and the light-emitting element in the light-emitting device are arranged up and down, so that the electrodes of the light-emitting element and the terminals of the driving chip can be arranged face to face, making it easier to weld the two, simplifying the preparation process of the light-emitting device and reducing the difficulty of preparation.

[0122] The present invention is described in detail below with reference to specific embodiments.

[0123] Example 1

[0124] This embodiment provides a light emitting device, referring to Figure 1 3. The light emitting device includes a transparent layer 100, a plurality of light emitting elements arranged at intervals, a first wiring layer 400, a driving chip 700, a first insulating layer 800, and a plurality of pads arranged at intervals.

[0125] Among them, refer to Figure 2 or Figure 3a, the transparent layer 100 may have a light transmittance of more than 60% in the visible light range. The transparent layer 100 includes a first surface 101 and a second surface 102 arranged opposite to each other, and the first surface 101 is a light emitting surface, that is, the light emitted by the light emitting element is emitted outward through the first surface 101 of the transparent layer 100. The light emitting device needs to have a certain thickness for easy use by the client, so the thickness of the transparent layer 100 is preferably greater than 10μm, and specifically preferably 30μm to 50μm, 50μm to 100μm or 100μm to 300μm. In this embodiment, the transparent layer 100 includes a first transparent layer 101 and a second transparent layer 102, and the first transparent layer 101 is a transparent substrate. Optionally, the transparent substrate can be a light-transmitting substrate such as PET, glass, quartz, sapphire, transparent ceramics, etc. The second transparent layer 102 is an adhesive layer or a transfer layer, wherein the material of the second transparent layer 102 can be an elastic material such as silicone, so that the light-emitting element will be partially sunken into the second transparent layer 102 to keep the electrode surface of the light-emitting element at the same level, and the height difference of the light-emitting surface of each light-emitting element can be reduced, so that the light emitted from the side of the light-emitting element is absorbed by the filling layer 300 described below as much as possible, so as to improve the contrast of the light-emitting device. The thickness of the second transparent layer 102 is preferably 1μm to 15μm or 3μm to 10μm. If the thickness of the second transparent layer 102 is greater than 15μm, the alignment accuracy of the light-emitting element may be affected.

[0126] Reference Figure 3a , a plurality of light emitting elements arranged at intervals are disposed on the second surface 102 of the transparent layer 100. Since the plurality of light emitting elements and the driving chip 700 in this embodiment are stacked up and down, the light emitting group formed by the plurality of light emitting elements can be disposed at the center of the light emitting surface of the light emitting device, so as to ensure that the light emitting device emits symmetrical light without color deviation.

[0127] The light-emitting element in this embodiment mainly refers to a micron-sized light-emitting diode, whose width or length ranges from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, 20 to 50 μm or 50 to 100 μm, and whose thickness ranges from 2 to 15 μm, preferably 5 to 10 μm. Specifically, each light-emitting element includes a semiconductor stack layer, and the semiconductor stack layer may include a first semiconductor layer, a second semiconductor layer arranged in sequence, and an active layer arranged therebetween, wherein the first semiconductor layer is an N-type semiconductor layer, the second semiconductor layer is a P-type semiconductor layer, and the active layer is a multi-layer quantum well layer, which can provide red light, green light or blue light radiation. The N-type semiconductor layer, the multi-layer quantum well layer, and the P-type semiconductor layer are only the basic constituent units of the light-emitting element. On this basis, the light-emitting element may also include other functional structural layers that have an optimizing effect on the performance of the light-emitting element.

[0128] In this embodiment, refer to Figure 3a The plurality of light emitting elements include a first light emitting element 201, a second light emitting element 202, and a third light emitting element 203. The first light emitting element 201, the second light emitting element 202, and the third light emitting element 203 radiate light of different wavelength ranges, respectively. For example, the first light emitting element 201 radiates blue light, the second light emitting element 202 radiates green light, and the third light emitting element 203 radiates red light. In one embodiment, different light emitting elements may have different semiconductor stacking layers, so as to directly radiate light of different wavelength ranges. The specific material of the semiconductor stacking layer is selected according to the wavelength of the radiated light, and includes but is not limited to aluminum gallium arsenide, gallium arsenide phosphide, aluminum gallium indium phosphide, gallium nitride, indium gallium nitride, zinc selenide, or gallium phosphide. In another embodiment, different light-emitting elements may have the same semiconductor stacking layer, for example, the semiconductor stacking layers in the first light-emitting element 201, the second light-emitting element 202 and the third light-emitting element 203 all radiate blue light, and a wavelength conversion layer is provided on the light-emitting surface of the second light-emitting element 202 to convert the radiated blue light into green light, and a wavelength conversion layer is provided on the light-emitting surface of the third light-emitting element 203 to convert the radiated blue light into red light. Each light-emitting element further includes a first electrode and a second electrode. The semiconductor stacking layer has a table surface exposing the first semiconductor layer, the first electrode is formed on the table surface and electrically connected to the first semiconductor layer, and the second electrode is formed on the second semiconductor layer and electrically connected to the second semiconductor layer. In this embodiment, the first electrode and the second electrode of each light-emitting element are both provided on a side away from the second surface 102 of the transparent layer 100, so as to facilitate connection with the terminals on the driver chip subsequently formed above the light-emitting element.

[0129] In this embodiment, refer to Figure 2 or Figure 3a A filling layer 300 is provided between adjacent light-emitting elements or around the side walls of the light-emitting elements. The provision of the filling layer 300 can prevent color mixing or light interference between adjacent light-emitting elements, thereby improving the contrast of the light-emitting device. The filling layer 300 is provided as a black glue layer that absorbs light. Specifically, the filling layer 300 can be a component formed by dispersing a black filling component with a particle size not greater than 1 μm in a transparent or translucent material such as silica gel, epoxy resin, polyimide, low-temperature glass, polysiloxane, polysilazane, etc. The black filling component in the filling layer 300 includes but is not limited to carbon black, titanium nitride, iron oxide, ferroferric oxide, iron powder, etc. The particle size range of the black filling component is preferably 10 to 100 nm, or 100 to 200 nm, or 200 to 300 nm, or 300 nm to 500 nm. The filling layer 300 can also be made of black dye.

[0130] Reference Figure 2 or Figure 3aThe first wiring layer 400 is disposed on the light emitting element and the filling layer 300. Furthermore, the first wiring layer 400 is electrically connected to each light emitting element. Figure 3a Combination Figure 3b The wiring layer 400 includes a pad wiring layer 401, a first connection wiring layer 402, and a second connection wiring layer 403 arranged in the same layer. The pad wiring layer 401 is arranged directly below the pads to be formed later, and is used to connect the pads. The number of the pad wiring layers 401 corresponds to the number of the pads. The first connection wiring layer 402 is arranged directly below part of the first insulating layer 800 and part of the driver chip 700 to be formed later, one end of which is connected to the pad wiring layer 401, and the other end of which is connected to the driver chip 700 or at least one light-emitting element to be formed later on the top of the light-emitting element. The number of the first connection wiring layer 402 also corresponds to the number of pads. The second connection wiring layer 403 is arranged directly below the driver chip 700 to be formed later, and the side close to the multiple light-emitting elements is electrically connected to the light-emitting elements, and the side close to the driver chip 700 is used to form an electrical connection with the driver chip 700 to be formed later.

[0131] Reference Figure 2 or Figure 3a , the driver chip 700 is arranged above the first wiring layer 400. A plurality of terminals are arranged on the side of the driver chip 700 close to the first wiring layer 400, and the first electrode and the second electrode of each light-emitting element are electrically connected to different terminals on the driver chip 700 through the first wiring layer 400. In this embodiment, the number of terminals is 7. Among them, three terminals are electrically connected to the three light-emitting elements through the first wiring layer 400, respectively, to control the switching of the three light-emitting elements. Optionally, the driver chip 700 is an active driver IC chip. The use of an active driver IC chip can improve the display quality of the light-emitting device, and can be driven at a smaller driving voltage, thereby increasing the service life of the display device.

[0132] Optionally, in order to avoid the driver chip 700 from being too large in size and occupying too much space in the entire light-emitting device, the size of the driver chip 700 is set to be less than or equal to 50μm in this embodiment. It should be noted that the size of the driver chip 700 in this embodiment refers to the length of the driver chip 700 or the width of the driver chip 700. Specifically, the size of the driver chip 700 can be 5μm, 10μm, 20μm or 50μm. Optionally, the thickness of the driver chip 700 is greater than the thickness of the light-emitting element, and the thickness of the driver chip 700 is less than or equal to 5 times the thickness of the light-emitting element. The difference in thickness between the driver chip 700 and the light-emitting element is less than 50μm, for example, less than 25μm, or less than 15μm. Optionally, the thickness of the driver chip 700 is less than 20μm, and the thickness of each light-emitting element is less than 20μm, for example, less than 10μm.

[0133] The driver chip 700 is relatively small in size, smaller than the overall size of the light-emitting device, so the driver chip 700 and the light-emitting element are stacked up and down, instead of being arranged on the same plane as the driver chip 700 and the light-emitting element, the package size of the light-emitting device can be further reduced. In this embodiment, the size (length × width) of the light-emitting device is less than 500 × 500 μm, and the thickness of the light-emitting device is less than 200 μm. Optionally, in order to subsequently form a symmetrical first insulating layer 800 on the periphery of the driver chip 700, and extend through the first insulating layer 800 to form a plurality of symmetrical pads on the surface of the first insulating layer 800, the driver chip 700 is also centered on the light-emitting surface of the light-emitting device in this embodiment.

[0134] In this embodiment, the electrode of the light emitting element is disposed on a side away from the second surface of the transparent layer 100, the driving chip 300 is formed above the light emitting element, and the side of the driving chip 300 having the terminal is disposed face to face with the electrode of the light emitting element, thereby making it easier to achieve welding of the two through the wiring layer. Figure 2 or Figure 3a The first insulating layer 800 includes a first part and a second part, wherein the first part covers the periphery of the side wall of the driver chip 700, and the second part covers the surface of the driver chip 700 away from the first wiring layer 400. Subsequently, the pad can avoid the driver chip 700 connecting to the pad first wiring layer 401 under the first part of the first insulating layer 800, and one end of the first wiring layer 401 connected to the pad passes through the first part of the first insulating layer 800 to the surface of the first insulating layer 800, and the circuit can be turned on without drilling a hole on the driver chip 700, thereby avoiding the problem of high process difficulty and high cost caused by drilling a hole on the driver chip 700 to turn on the circuit.

[0135] In an alternative embodiment, reference Figure 2 or Figure 3a The light emitting device further includes a second insulating layer 600, which is disposed between the plurality of light emitting elements and the driver chip 700, and the first wiring layer 400 is formed in the second insulating layer 600. Optionally, the second insulating layer 600 contacts the contour boundary of the driver chip 700 on the side close to the first wiring layer 400 to avoid leakage of the driver chip 700 caused by contact between the driver chip 700 and the first wiring layer 400. In a specific example of this embodiment, referring to Figure 3a Combination Figure 3cThe light emitting device further comprises a second wiring layer 500, which is arranged on a portion of the first wiring layer 400 formed in the second insulating layer 600 and exposed on the surface of the second insulating layer 600. The second wiring layer is used to connect the pad to the first wiring layer 400, the driver chip 700 to the first wiring layer 400, and the driver chip 700 to the light emitting element. The second wiring layer 500 comprises a pad connection layer 501, a first connection layer 502 and a second connection layer 503. The pad connection layer 501 is arranged on a side of the pad wiring layer 401 close to the pad, and is correspondingly arranged directly below the pad, and is used to connect the pad to the pad wiring layer 401. The first connection layer 502 is arranged on a side of the first connection wiring layer 402 close to the driver chip 700, and is located directly below the driver chip 700 formed subsequently, and is used to connect the first connection wiring layer 402 to the terminals on the driver chip 700. The second connection layer 503 is disposed on a side of the second connection wiring layer 403 close to the driver chip 700 , and is located directly below the driver chip 700 to be formed subsequently, and is used to connect the second connection wiring layer 403 with terminals on the driver chip 700 .

[0136] If the boundary contour of the first connection layer 502 exceeds the boundary contour of the driver chip 700, the side wall of the driver chip 700 may be in contact with the first connection layer 502, resulting in leakage of the side wall of the driver chip 700. In this embodiment, in the top projection direction of the light-emitting device, the contour boundaries of the first connection layer 502 and the second connection layer 503 are both located within the contour boundary of the driver chip 700, so that the second insulating layer 600 filled between adjacent connection layers contacts the contour boundary of the driver chip 700, avoiding direct contact between the side wall of the driver chip 700 and the connection layer, resulting in leakage of the driver chip 700. Optionally, the size of the first connection layer 502 is smaller than the size of the first connection wiring layer 402, and is disposed directly below the driver chip 700, and the rest of the first connection wiring layer 402 except the first connection layer 502 is filled with the second insulating layer 600, and the filled second insulating layer 600 covers the boundary contour of the side wall of the driver chip 700, which can prevent leakage of the side wall of the driver chip 700. Optionally, the size of the first connection layer 502 is equal to the size of the terminal on the driver chip 700 to which it is connected, and the two are connected accordingly to connect the first connection wiring layer 402 to the driver chip 700. The second connection layer 503 is also completely located below the boundary contour of the driver chip 700, and thus does not contact the side wall of the driver chip 700, thereby preventing leakage of the side wall of the driver chip 700. Optionally, the size of the second connection layer 503 is equal to the size of the second connection wiring layer 403, and the size of the second connection layer 503 is equal to the size of the terminal on the driver chip 700 to which it is connected, and the two are connected accordingly to connect the second connection wiring layer 403 to the driver chip 700, that is, to connect the light-emitting element to the driver chip 700.

[0137] Optionally, the first insulating layer 800 can be any insulating material, such as silicon dioxide or silicon nitride. The second insulating layer 600 can be formed of materials such as epoxy resin, polysiloxane or photoresist, which can prevent the wiring layer from being oxidized and electrically isolate different wirings to prevent leakage failure of the light-emitting device. The materials of the first insulating layer 800 and the second insulating layer 600 can be the same or different.

[0138] Reference Figure 2 or 3a, a plurality of pads arranged at intervals are electrically connected to the second wiring layer 500 through the openings on the first insulating layer 800. In this embodiment, referring to Figure 1 , the pads include at least two driving pads and other pads 904, the at least two driving pads are respectively a first driving pad 901 and a second driving pad 902, the first driving pad 901 drives and connects at least two light-emitting elements, and the second driving pad 902 drives and connects at least the driving chip 700. The number of other pads 904 is three, namely a first other pad 9041, a second other pad 9042 and a third other pad 9043. Among them, the three other pads 904 are electrically connected to other different terminals on the driving chip 700 respectively. The first other pad 9041 (Row / Clk) and the second other pad 9042 (Col / Data) are grounded by inputting data signals and timing signals to the driving chip 700, and the third other pad 9043 (Gnd) is electrically connected to the driving chip 700.

[0139] In one example, refer to Figure 4a or Figure 4b , at least two driving pads include a first driving pad 901 and a second driving pad 902. The first driving pad 901 (VGB) is electrically connected to the first light-emitting element 201 and the second light-emitting element 202, and a driving voltage is input thereto. The second driving pad 902 (VR) is electrically connected to the third light-emitting element 203 and the driving chip 700, so as to simultaneously input a driving voltage to the third light-emitting element 203 and the driving chip 700, and the light-emitting device causes the light-emitting element to emit light with a specific brightness based on the driving voltage. The first light-emitting element 201 and the second light-emitting element 202 are respectively a blue light-emitting element and a green light-emitting element, and the third light-emitting element 203 is a red light-emitting element. Wherein, referring to Figure 3c and 4a The second driving pad 902 can be connected to the third light emitting element 203 and the driving chip 700 through the first connection layer 502 of the second wiring layer 500, referring to Figure 4b, the second connection wiring layer 402 of the first wiring layer 400 can also be separately connected to the terminals on the driver chip 700 to drive the driver chip 700. Since the driving voltage required by the red light emitting element is significantly different from the driving voltage of the blue light emitting element and the green light emitting element, driving the red light element separately can avoid unnecessary power consumption caused by simultaneous driving, which is beneficial to saving energy consumption, and can also avoid damage to the light emitting element caused by mismatching of the driving voltage, which is beneficial to the reliability and service life of the light emitting element.

[0140] In another example, referring to Figure 5 , at least two driving pads include a first driving pad 901, a second driving pad 902 and a third driving pad 903. The first driving pad 901 (VGB) is electrically connected to the first light-emitting element 201 and the second light-emitting element 202, and inputs a driving voltage thereto. The second pad is electrically connected to the driving chip 700 to input a driving voltage to the driving chip 700. The third driving pad 903 (VR) is electrically connected to the third light-emitting element 203 to input a driving voltage separately to the third light-emitting element 203. Since the red light-emitting element is driven separately through the third driving pad 903, unnecessary power consumption caused by simultaneous driving can be avoided, which is beneficial to energy saving, and damage to the light-emitting element caused by driving voltage mismatch can be avoided, which is beneficial to the reliability and service life of the light-emitting element. The light-emitting device in this embodiment includes six pads, and every three pads are evenly distributed on both sides of the light-emitting device, which is beneficial to the uniformity and reliability of subsequent solid crystal. Optionally, refer to Figure 7 The connection relationship between the pad and the light emitting element and the driver chip in this embodiment is similar to Figure 5 The difference is that the shape of the light emitting device in this embodiment is hexagonal, which is Figure 5 The advantage of the rectangular shape in FIG. 1 is that the area of ​​the light emitting device can be smaller. Figure 8 The number of pads and the connection relationship between the pads, the light emitting element and the driver chip in this embodiment are the same as Figure 5 The difference is that the light emitting device in this embodiment is placed horizontally, which is also conducive to saving area.

[0141] In yet another example, referring to Figure 6, at least two driving pads include a first driving pad 901 and a second driving pad 902. The first driving pad 901 (VGB) is electrically connected to the first light-emitting element 201, the second light-emitting element 202 and the third light-emitting element 203, and a driving voltage is input thereto. The second pad is electrically connected to the driver chip 700 to input a driving voltage to the driver chip 700. Thus, the present embodiment can realize the separate driving of the light-emitting element and the driver chip 700, and avoid the energy loss caused by the inconsistent driving voltage between the light-emitting element and the driver chip 700. In order to avoid the energy loss caused by the inconsistent driving voltage between the light-emitting elements, optionally, the first light-emitting element 201, the second light-emitting element 202 and the third light-emitting element 203 can all be set as light-emitting elements of the same luminous color, and a wavelength conversion layer (such as QD quantum dots) is subsequently added to each light-emitting element to convert it into a light-emitting element of three colors of red, blue and green. At this time, the driving voltages required for the three light-emitting elements are the same, and the control of the same driving pad can be realized without causing energy loss.

[0142] The method for forming the above-mentioned light emitting device comprises: referring to Figures 1 to 3a , provide a first transparent layer 110, the first transparent layer 110 is a transparent substrate, and a second transparent layer 120 is coated on the transparent substrate, the second transparent layer 120 is a transfer layer, and a first light-emitting element 201, a second light-emitting element 202 and a third light-emitting element 203 are placed by mass transfer, and each light-emitting element is a micro light-emitting diode. Coat a filling layer 300 to cover the side of the micro light-emitting diode, and make a first wiring layer on the filling layer 300. Plate and weld the second wiring layer at the position where it needs to be welded to the electrode of the micro light-emitting diode, and then prepare a second insulating layer 600 and open a window at the position of the second wiring layer. Solder the driver chip 700 and coat the first insulating layer 800. Open a window at the position of the package pad of the first insulating layer 800, and plate the pad in the window, and finally form the light-emitting device in this embodiment.

[0143] Example 2

[0144] This embodiment provides a display device, which includes a display substrate and at least one light-emitting device disposed on the display substrate. The light-emitting device is the light-emitting device in Embodiment 1.

[0145] Specifically, the pad of each light emitting device is electrically connected to the display substrate, and the light emitting surface of the light emitting device is away from the display substrate. When there are more than two light emitting devices, more than two light emitting devices are arranged at intervals on the display substrate, and each light emitting device is electrically connected to the display substrate.

[0146] The display device in this embodiment includes the light-emitting device in the above-mentioned embodiment 1. The package size of the light-emitting device is small, and thus the same display substrate of the display device in this embodiment can carry more light-emitting devices, so that the display device has higher pixels and tends to be more miniaturized. The light-emitting center of the light-emitting device is located in the middle of the light-emitting device, which can ensure that the display device has no color deviation problem. At the same time, there is no need to punch holes on the driving chip of the light-emitting device, the preparation process is simpler, the cost is lower, and there is no risk of leakage on the side wall of the driving chip, which improves the reliability of the device.

[0147] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A light emitting device, characterized in that: include: The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface; A plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer; A first wiring layer is disposed above the light emitting element and is electrically connected to the plurality of light emitting elements respectively; A driving chip is arranged above the first wiring layer, a plurality of terminals are arranged on a side of the driving chip close to the first wiring layer, and each of the light-emitting elements is electrically connected to different terminals on the driving chip through the first wiring layer; A first insulating layer, comprising a first portion and a second portion, wherein the first portion covers the periphery of the side wall of the driver chip, and the second portion covers the surface of the driver chip away from the first wiring layer, and a plurality of openings are arranged on the first portion of the first insulating layer; A plurality of pads arranged at intervals are electrically connected to the first wiring layer through the openings of the first insulating layer.

2. The light emitting device according to claim 1, characterized in that: The plurality of light emitting elements form a light emitting group of the light emitting device, and the light emitting group is located at the center of a light emitting surface of the light emitting device.

3. The light emitting device according to claim 1, characterized in that: The light emitting device further comprises: The second insulating layer is disposed between the plurality of light emitting elements and the driving chip, and the first wiring layer is formed in the second insulating layer.

4. The light emitting device according to claim 3, characterized in that: The second insulating layer contacts a contour boundary of the driving chip on a side close to the first wiring layer.

5. The light emitting device according to claim 4, characterized in that: The first wiring layer comprises: A pad wiring layer, a side away from the plurality of light emitting elements being connected to the pad; A first connection wiring layer, one end of which is connected to the pad wiring layer, and the other end of which is connected to the driving chip or at least one light emitting element; The second connection wiring layer has a surface close to the plurality of light emitting elements electrically connected to the light emitting elements, and a surface close to the driving chip electrically connected to the driving chip.

6. The light emitting device according to claim 5, characterized in that: The light emitting device further comprises: The second wiring layer is arranged on a portion of the first wiring layer formed in the second insulating layer and exposed to the surface of the second insulating layer. The second wiring layer connects the pad and the first wiring layer, the driving chip and the first wiring layer, and the driving chip and the light-emitting element.

7. The light emitting device according to claim 5, characterized in that: The light emitting device further includes a second wiring layer, the second wiring layer is arranged on a portion of the first wiring layer formed in the second insulating layer and exposed to a surface of the second insulating layer, the second wiring layer including: A pad connection layer, disposed on a side of the pad wiring layer close to the pad, and used to connect the pad to the pad wiring layer; A first connection layer, disposed on a side of the first connection wiring layer close to the driver chip, and used to connect the first connection wiring layer with terminals on the driver chip; The second connection layer is arranged on a side of the second connection wiring layer close to the driving chip, and is used to connect the second connection wiring layer with terminals on the driving chip.

8. The light emitting device according to claim 7, characterized in that: In the top projection direction of the light emitting device, the contour boundaries of the first connection layer and the second connection layer are both located within the contour boundary of the driving chip, so that the second insulating layer filled between adjacent second wiring layers contacts the contour boundary of the driving chip.

9. The light emitting device according to claim 1, characterized in that: The thickness of the driving chip is greater than the thickness of the light emitting element.

10. A light emitting device, characterized in that: The light emitting device comprises: The transparent layer comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface is a light emitting surface; A plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer, and electrodes of the light-emitting elements are disposed on a side away from the second surface of the transparent layer; A first wiring layer is disposed above the light emitting element and is electrically connected to the electrodes of the plurality of light emitting elements respectively; A second wiring layer is disposed on a portion of the first wiring layer and is disposed corresponding to the electrode of the light emitting element; A driver chip is arranged above the second wiring layer, a plurality of terminals are arranged on a side of the driver chip close to the second wiring layer, the second wiring layer is also arranged corresponding to the terminals of the driver chip, and each of the light-emitting elements is electrically connected to different terminals on the driver chip through the second wiring layer; A first insulating layer, covering the driving chip, a first portion of the first insulating layer is provided with a plurality of openings, and the second wiring layer is also provided corresponding to the openings of the first insulating layer; A plurality of pads arranged at intervals are electrically connected to the second wiring layer through the openings of the first insulating layer.

11. The light emitting device according to claim 10, characterized in that: The light emitting device further comprises: The second insulating layer is disposed between the plurality of light emitting elements and the driving chip, and the first wiring layer and the second wiring layer are formed in the second insulating layer.

12. The light emitting device according to claim 10, characterized in that: The light emitting device further comprises: A filling layer, disposed between adjacent light-emitting elements and around the plurality of light-emitting elements; The plurality of light-emitting elements include a first light-emitting element, a second light-emitting element and a third light-emitting element, wherein the first light-emitting element is a light-emitting element radiating blue light, the second light-emitting element is a light-emitting element radiating green light, and the third light-emitting element is a light-emitting element radiating red light; The transparent layer comprises: First transparent layer; The second transparent layer is disposed on the first transparent layer, and the plurality of light emitting elements arranged at intervals are disposed on the second transparent layer.

13. The light emitting device according to claim 12, characterized in that: The pad comprises: At least two driving pads, including a first driving pad and a second driving pad, wherein the first driving pad is drivingly connected to at least two light-emitting elements, and the second driving pad is drivingly connected to at least the driving chip; Other pads are electrically connected to other terminals of the driving chip.

14. The light emitting device according to claim 13, characterized in that: The at least two driving pads include: A first driving pad, electrically connected to the first light emitting element and the second light emitting element; The second driving pad is electrically connected to the third light emitting element and to the driving terminal of the driving chip.

15. The light emitting device according to claim 13, characterized in that: The at least two driving pads include: A first driving pad, electrically connected to the first light emitting element and the second light emitting element; A second driving pad, electrically connected to the third light emitting element; The third driving pad is electrically connected to the driving terminal of the driving chip.

16. The light emitting device according to claim 13, characterized in that: The at least two driving pads include: A first driving pad is electrically connected to the first light emitting element, the second light emitting element and the third light emitting element; The second driving pad is electrically connected to the driving terminal on the driving chip.

17. The light emitting device according to claim 13, characterized in that: The number of the other pads is three, and the three other pads are electrically connected to other different terminals on the driving chip respectively.

18. The light emitting device according to claim 10, characterized in that: The length or width of the driving chip is less than 50 μm, the length of the light-emitting device is less than 500 μm, the width of the light-emitting device is less than 500 μm, and the thickness of the light-emitting device is less than 200 μm.

19. The light emitting device according to claim 10, characterized in that: Each of the light-emitting elements includes a first electrode and a second electrode. The first electrode, the second electrode and the terminal of the driving chip of each of the light-emitting elements are located between the light-emitting element and the driving chip.

20. A display device, characterized in that: include: Display substrate; At least one light-emitting device is disposed on the display substrate, each of the light-emitting devices is electrically connected to the display substrate, and the light-emitting device is the light-emitting device according to any one of claims 1 to 19.

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