Light-emitting panel and display device

Abstract

The invention discloses a light-emitting panel and a display device, and belongs to the technical field of display. The light-emitting panel comprises a driving backboard and a plurality of light-emitting units located on one side of the driving backboard. The distances between the two adjacent light-emitting units and the side, away from the light-emitting units, of the driving back plate are set to be different. In the process of die bonding the light-emitting units to the driving back plate, the plurality of first light-emitting units can be die-bonded to the driving back plate, and then the plurality of second light-emitting units are fixed to the driving back plate after die bonding of the plurality of first light-emitting units is completed. At the moment, the distance between the side, deviating from the driving backboard, of the first light-emitting unit and the side, deviating from the light-emitting unit, of the driving backboard is smaller. In the die bonding process of any second light-emitting unit, the suction nozzle does not touch the first light-emitting unit adjacent to the current die-bonded second light-emitting unit. In this way, poor die bonding caused by the suction nozzle is avoided, and the die bonding yield of the light-emitting panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting panel and a display device. Background Art

[0002] In the display field, the application of light emitting diode chips (LED) is becoming more and more widespread. LED chips with a long side size between 100 microns and 300 microns are called Mini LEDs. Mini LED chips can be used as light-emitting units in light-emitting panels (such as backlight modules or direct display panels).

[0003] The process of transferring the LED chip to the circuit backplane is called the die bonding process. In the die bonding process, a robotic arm drives a nozzle to pick up the LED chip and place it on the driver backplane.

[0004] Currently, the die bonding process for Mini LED chips has the problem of low yield. Summary of the invention

[0005] The embodiments of the present application provide a light-emitting panel and a display device, which can solve the problem of low die bonding yield of existing light-emitting panels based on Mini LEDs. The technical solution is as follows:

[0006] In one aspect, a light-emitting panel is provided, comprising: a driving backplane, and a plurality of light-emitting units located on one side of the driving backplane;

[0007] The plurality of light-emitting units are arranged in a plurality of columns in the first direction and in a plurality of rows in the second direction; any two adjacent light-emitting units in the first direction or the second direction are respectively: a first light-emitting unit and a second light-emitting unit;

[0008] The distance between the first light-emitting unit facing away from the driving backplane and the driving backplane facing away from the light-emitting unit is smaller than the distance between the second light-emitting unit facing away from the driving backplane and the driving backplane facing away from the light-emitting unit.

[0009] Optionally, the driving backplane comprises: a substrate, and a plurality of connecting parts located on the substrate; the plurality of connecting parts are electrically connected to the plurality of light-emitting units correspondingly;

[0010] The connection portion connected to the first light-emitting unit is a first connection portion, and the connection portion connected to the second light-emitting unit is a second connection portion;

[0011] The distance between the substrate and a side of the first connection portion facing the first light-emitting unit is smaller than the distance between the substrate and a side of the second connection portion facing the second light-emitting unit.

[0012] Optionally, the driving backplane further comprises: a driving circuit layer and an insulating layer;

[0013] The driving circuit layer is located on one side of the substrate; the insulating layer is located on a side of the driving circuit layer away from the substrate; the multiple connecting parts are located on a side of the insulating layer away from the substrate and are electrically connected to the driving circuit layer;

[0014] Wherein, in a direction perpendicular to the driving backplane, a thickness of a portion of the insulating layer distributed between the first connecting portion and the substrate is smaller than a thickness of a portion of the insulating layer distributed between the second connecting portion and the substrate.

[0015] Optionally, the insulating layer includes a plurality of sub-insulating layers stacked together;

[0016] The number of layers of the sub-insulating layer distributed between the first connecting portion and the substrate is less than the number of layers of the sub-insulating layer distributed between the second connecting portion and the substrate.

[0017] Optionally, the sub-insulating layer in the insulating layer distributed between the first connecting portion and the substrate includes at least: a first sub-insulating layer; the sub-insulating layer in the insulating layer distributed between the second connecting portion and the substrate includes at least: the first sub-insulating layer and the second sub-insulating layer stacked, and the first sub-insulating layer is closer to the substrate than the second sub-insulating layer;

[0018] Wherein, the first connecting part and the second connecting part are arranged in the same layer and made of the same material;

[0019] Alternatively, the light-emitting panel further includes: a transition connection portion located between the first sub-insulating layer and the second sub-insulating layer, the second connection portion being electrically connected to the driving circuit layer via the transition connection portion, and the transition connection portion being arranged in the same layer and made of the same material as the first connection portion.

[0020] Optionally, the light emitting unit has a pad on one side facing the driving backplane, and the light emitting unit is electrically connected to the driving backplane via the pad;

[0021] Among them, the distance between the side of the soldering pad in the first light-emitting unit facing the driving backplane and the side of the first light-emitting unit away from the driving backplane is smaller than the distance between the side of the soldering pad in the second light-emitting unit facing the driving backplane and the side of the second light-emitting unit away from the driving backplane.

[0022] Optionally, the light-emitting panel further comprises: a plurality of support structures of the same height; the plurality of support structures correspond to the plurality of light-emitting units;

[0023] Wherein, the support structure is located between the driving back plate and the corresponding light emitting unit, one end of the support structure is fixedly connected to the driving back plate, and the other end is abutted against the light emitting unit.

[0024] Optionally, the plurality of light-emitting units include: a plurality of first-type light-emitting units and a plurality of second-type light-emitting units;

[0025] In the first direction, the first type of light emitting units and the second type of light emitting units are arranged alternately, and / or, in the second direction, the first type of light emitting units and the second type of light emitting units are arranged alternately;

[0026] Among them, the distance between the side of the first type of light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit is smaller than the distance between the side of the second type of light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit.

[0027] Optionally, the plurality of light-emitting units include: a plurality of first-type light-emitting units, a plurality of second-type light-emitting units, and a plurality of third-type light-emitting units;

[0028] In the first direction, the first type of light-emitting units, the second type of light-emitting units and the third type of light-emitting units are arranged alternately, and / or, in the second direction, the first type of light-emitting units, the second type of light-emitting units and the third type of light-emitting units are arranged alternately;

[0029] Among them, the distance between the side of the first type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit is smaller than the distance between the side of the second type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit; the distance between the side of the second type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit is smaller than the distance between the side of the third type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit.

[0030] On the other hand, a display device is provided, comprising: any one of the above-mentioned light-emitting panels, and a driving chip bound and connected to the light-emitting panel.

[0031] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0032] By setting the distance between two adjacent light-emitting units and the side of the driving backplane away from the light-emitting units to be different. In the process of bonding the light-emitting units to the driving backplane, multiple first light-emitting units can be bonded to the driving backplane first, and after completing the bonding of multiple first light-emitting units, multiple second light-emitting units can be fixed to the driving backplane. At this time, the distance between the side of the first light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit is smaller than the distance between the side of the second light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit. In the process of bonding any second light-emitting unit, the suction nozzle of the adsorption device will not touch the first light-emitting unit adjacent to the second light-emitting unit currently being bonded. In this way, poor bonding caused by the suction nozzle is avoided, the bonding yield of the first light-emitting unit is guaranteed, and the bonding yield of the light-emitting panel is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 is a schematic diagram of the structure of a light-emitting panel;

[0035] Figure 2 yes Figure 1 A schematic diagram of the die bonding process of the light-emitting panel shown;

[0036] Figure 3 A schematic diagram of the structure of a light-emitting panel provided in an embodiment of the present application;

[0037] Figure 4 for Figure 3 The schematic diagram of the film structure of the light-emitting panel at D-D' is shown;

[0038] Figure 5 for Figure 3 Another schematic diagram of the film structure of the light emitting panel at D-D' is shown;

[0039] Figure 6 A schematic diagram of a die bonding process of a light-emitting panel provided in an embodiment of the present application;

[0040] Figure 7 for Figure 3 A schematic diagram of another film layer structure of the light emitting panel at D-D' is shown;

[0041] Figure 8 for Figure 3 A schematic diagram of another film layer structure of the light emitting panel at D-D' is shown;

[0042] Fig. 9 for Figure 3 A schematic diagram of the structure of another embodiment of the light emitting panel at D-D' is shown;

[0043] Fig.10 A schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present application;

[0044] Fig.11 for Fig.10 The schematic diagram of the film structure of the light-emitting panel at AA' is shown;

[0045] Fig.12 A schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present application;

[0046] Fig.13 for Fig.12 The schematic diagram of the film structure of the light-emitting panel at BB' is shown;

[0047] Fig.14 A schematic diagram of the structure of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0049] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of a light-emitting panel. Figure 2 yes Figure 1 The schematic diagram of the die bonding process of the light-emitting panel shown in the figure, the current light-emitting panel 00 may include a driving backplane 10 and a plurality of light-emitting units 06 electrically connected to the driving backplane 10. The driving backplane 10 has a plurality of connecting parts 04 (such as pads, pins, etc.), and the light-emitting units 06 (i.e., LED light-emitting chips) are welded to the connecting parts 04.

[0050] The driving backplane 10 may include a substrate 01, a driving circuit layer 02, an insulating layer 03, and a plurality of connecting portions 04, wherein the connecting portions 04 are electrically connected to the driving circuit layer 02. The light-emitting unit 06 may include a chip body 06a and a pad 06b or a pin electrically connected to the chip body 06a. At present, the heights of the plurality of connecting portions 04 on the driving backplane 10 relative to the substrate 01 are the same, and the pad 06b of the light-emitting unit 06 is welded to the connecting portion 04 by setting a solder 05.

[0051] like Figure 2As shown, the die bonding process uses a mechanical arm to drive the nozzle 20 to absorb the light-emitting unit 06 and place the light-emitting unit 06 on the driver backplane 10. For high-resolution Mini LED products, the interval K1 between the light-emitting units 06 is small. The nozzle 20 of the suction device is larger than the light-emitting unit 06, and the outer wall of the nozzle 20 is close to the light-emitting unit 06 ( Figure 2 The distance K2 between the light emitting units 06 on the middle right side is greater than the above-mentioned interval K1.

[0052] like Figure 1 As shown, in theory, the connection parts 04 on the driving backplane 10 are at the same height, and the light-emitting units 06 are of the same size. The height h1 of the left light-emitting unit 06 relative to the driving backplane 10 should be equal to the height h2 of the right light-emitting unit 06 relative to the driving backplane 10. However, due to the process error of the die-bonding process, the heights h1 and h2 are often not equal. For the die-bonding process of Mini LED, there is an error of about 10 microns, that is, |h1-h2|≤10 microns.

[0053] like Figure 2 As shown, when h1 is less than h2, the nozzle 20 is likely to touch the light-emitting unit 06 already placed on the left side during the process of sucking the light-emitting unit 06 on the right side for die bonding, resulting in poor die bonding of the light-emitting unit 06 on the left side. Therefore, the current die bonding yield of Mini LED light-emitting panels is low.

[0054] The present application provides a light-emitting panel, which can be used as a backlight module or a display panel in a display device. Figures 3 to 5 , Figure 3 A schematic diagram of the structure of the light-emitting panel provided in an embodiment of the present application, Figure 4 for Figure 3 The schematic diagram of the film structure of the light-emitting panel at D-D' is shown. Figure 5 for Figure 3 Another schematic diagram of the film structure of the light emitting panel at the D-D' is shown. The light emitting panel 000 may include: a driving backplane 100, and a plurality of light emitting units 200 located at one side of the driving backplane 100.

[0055] The plurality of light emitting units 200 are arranged in a plurality of columns in the first direction and in a plurality of rows in the second direction; any two adjacent light emitting units 200 in the first direction X or the second direction Y are respectively: a first light emitting unit 200a and a second light emitting unit 200b, and the first direction X intersects with the second direction Y, for example, they are perpendicular.

[0056] Among them, the distance h01 between the side of the first light-emitting unit 200a away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance h02 between the side of the second light-emitting unit 200b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200.

[0057] The light-emitting panel 000 provided in the embodiment of the present application is configured such that the distance between the side of two adjacent light-emitting units 200 facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200 is different. In the process of die-bonding the light-emitting unit 200 to the driving backplane 100, a plurality of first light-emitting units 200a may be die-bonded to the driving backplane 100 first, and after the plurality of first light-emitting units 200a are die-bonded, a plurality of second light-emitting units 200b may be fixed to the driving backplane 100. At this time, the distance h01 between the side of the first light-emitting unit 200a facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200 is smaller than the distance h02 between the side of the second light-emitting unit 200b facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200. Please refer to Figure 6 , Figure 6 The schematic diagram of the die bonding process of the light-emitting panel provided in the embodiment of the present application shows that, since h02 is greater than h01, during the die bonding process of any second light-emitting unit 200b, the suction nozzle 20 of the adsorption device will not touch the first light-emitting unit 200a adjacent to the second light-emitting unit 200b currently being bonded. In this way, the poor die bonding caused by the suction nozzle 20 is avoided, the die bonding yield of the first light-emitting unit 200a is guaranteed, and the die bonding yield of the light-emitting panel 000 is improved.

[0058] Although the setting theory is that h02 is greater than h01, when the difference between h02 and h01 is set relatively small, it is possible that h02 is smaller than h01 due to the process error of the fixing process. Therefore, in theory, the difference between h02 and h01 needs to take into account the accuracy of the die-bonding process, for example, setting h02-h01>10 microns. In addition, the application requirements of the light-emitting panel 000 also need to be considered. Generally, the height difference between the first light-emitting unit 200a and the second light-emitting unit 200b should not be greater than the thickness of one light-emitting unit 200, for example, h02-h01<100 microns.

[0059] The embodiments of the present application do not limit how to implement the above-mentioned method to achieve that the distance h01 between the side of the first light-emitting unit 200a away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance h02 between the side of the second light-emitting unit 200b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200. Two specific implementation methods are provided below for illustration.

[0060] In the first implementation, please refer to Figure 4 The driving backplane 100 provided in the embodiment of the present application may have connecting portions 005 of different heights in a direction perpendicular to the driving backplane 100 , and the thickness of the first light-emitting unit 200a and the second light-emitting unit 200b may be the same.

[0061] For a possible implementation, please refer to Figure 4 and Figure 7 , Figure 7 for Figure 3 The schematic diagram of another film layer structure of the light-emitting panel at the D-D′ is shown. The driving backplane 100 may include: a substrate 001 and a plurality of connecting parts 005 located on the substrate 001 ; the plurality of connecting parts 005 are electrically connected to the plurality of light-emitting units 200 accordingly.

[0062] The connection portion 005 connected to the first light emitting unit 200a is a first connection portion 005a, and the connection portion 005 connected to the second light emitting unit 200b is a second connection portion 005b.

[0063] The distance d3 between the side of the first connection portion 005a facing the first light emitting unit 200a and the substrate 001 is smaller than the distance d4 between the side of the second connection portion 005b facing the second light emitting unit 200b and the substrate 001 .

[0064] When the distance d3 between the side of the first connecting portion 005a facing the first light-emitting unit 200a and the substrate 001 is smaller than the distance d4 between the side of the second connecting portion 005b facing the second light-emitting unit 200b and the substrate 001, and the thickness of the first light-emitting unit 200a and the second light-emitting unit 200b are the same, it can be achieved that the distance h01 between the side of the first light-emitting unit 200a facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200 is smaller than the distance h02 between the side of the second light-emitting unit 200b facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200.

[0065] There are many ways to realize that d3 is smaller than d4. For example, in the direction perpendicular to the driving backplane 100 , the thickness of the second connecting portion 005 b may be increased; or the distance between the second connecting portion 005 b and the substrate 001 may be increased.

[0066] For a possible implementation, please refer to Figure 4 and Figure 7 The driving backplane 100 may further include: a driving circuit layer 003 and an insulating layer 004 .

[0067] The driving circuit layer 003 is located on one side of the substrate 001 ; the insulating layer 004 is located on the side of the driving circuit layer 003 away from the substrate 001 ; and the plurality of connecting portions 005 are located on the side of the insulating layer 004 away from the substrate 001 and are electrically connected to the driving circuit layer 003 .

[0068] In the direction perpendicular to the driving backplane 100 , the thickness d5 of the insulating layer 004 between the first connecting portion 005 a and the substrate 001 is smaller than the thickness d6 of the insulating layer 004 between the second connecting portion 005 b and the substrate 001 .

[0069] For example, a buffer layer 002 is further provided between the substrate 001 and the driving circuit layer 003. The insulating layer 004 further has a passivation layer 006 on the side facing away from the substrate 001. The passivation layer 006 is provided with an opening, and the connecting portion 005 is exposed through the opening.

[0070] In the embodiment of the present application, the thickness of the insulating layer 004 below the first connection portion 005a and the second connection portion 005b can be adjusted to achieve a distance d5 between the side of the first connection portion 005a facing the first light-emitting unit 200a and the substrate 001 that is smaller than a distance d6 between the side of the second connection portion 005b facing the second light-emitting unit 200b and the substrate 001. Finally, the distance h01 between the side of the first light-emitting unit 200a facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200 is achieved to be smaller than a distance h02 between the side of the second light-emitting unit 200b facing away from the driving backplane 100 and the side of the driving backplane 100 facing away from the light-emitting unit 200.

[0071] There are many ways to adjust the thickness of the insulating layer 004. For example, a layer of the insulating layer 004 may be patterned to form regions with different thicknesses. Another example is to form a plurality of stacked sub-insulating layers to adjust the local thickness by stacking.

[0072] For a possible implementation, please refer to Figure 7 , the insulating layer 004 may include a plurality of sub-insulating layers stacked together.

[0073] The number of sub-insulating layers distributed between the first connecting portion 005 a and the substrate 001 is less than the number of sub-insulating layers distributed between the second connecting portion 005 b and the substrate 001 .

[0074] For example, the number of layers of the sub-insulating layer distributed between the first connecting portion 005a and the substrate 001 may be one layer, which may be less than the number of layers of the sub-insulating layer distributed between the second connecting portion 005b and the substrate 001. In the case where the sub-insulating layer is made of a photosensitive insulating material, the sub-insulating layers are stacked to achieve different local thicknesses of the insulating layer 004. Each sub-insulating layer can be formed by photolithography without etching, which is simpler in process.

[0075] For example, please refer to Figure 7 and Figure 8 , Figure 8 for Figure 3 A schematic diagram of another film layer structure of the light-emitting panel at D-D' is shown, in which the sub-insulating layer distributed between the first connecting portion 005a and the substrate 001 in the insulating layer 004 may at least include: a first sub-insulating layer 004a; the sub-insulating layer distributed between the second connecting portion 005b and the substrate 001 in the insulating layer 004 may at least include: a first sub-insulating layer 004a and a second sub-insulating layer 004b arranged in a stacked manner, and the first sub-insulating layer 004a is closer to the substrate 001 than the second sub-insulating layer 004b.

[0076] The orthographic projection of the second sub-insulating layer 004b on the substrate 001 does not overlap with the orthographic projection of the first light-emitting unit 200a on the substrate 001, and the first connecting portion 005a and the second connecting portion 005b are arranged in the same layer and made of the same material.

[0077] Exemplarily, the light-emitting panel 000 may further include: a transition connection portion 005c located between the first sub-insulating layer 004a and the second sub-insulating layer 004b, the second connection portion 005b being electrically connected to the driving circuit layer 003 via the transition connection portion 005c, and the transition connection portion 005c is arranged on the same layer as the first connection portion 005a and is made of the same material.

[0078] Considering that the insulating layer 004 distributed between the second connecting portion 005b and the substrate 001 is relatively thick, it is difficult to directly open a hole in the insulating layer 004. By setting a transfer connecting portion 005c between the sub-insulating layers and opening a hole in each sub-insulating layer, the process difficulty can be reduced.

[0079] In the case where the insulating layer includes multiple stacked sub-insulating layers, a transition connection portion 005c can be provided between every two sub-insulating layers, thereby achieving electrical connection between the connection portion 005 and the driving circuit layer 003, without the need to drill deep holes in the insulating layer 004, thereby reducing the difficulty of the process.

[0080] In the second implementation, please refer to Figure 5The driving backplane 100 provided in the embodiment of the present application may have a connecting portion 005 of the same height in a direction perpendicular to the driving backplane 100, and the thickness of the first light-emitting unit 200a and the second light-emitting unit 200b may be different, wherein the thickness of the first light-emitting unit 200a is less than the thickness of the second light-emitting unit 200b.

[0081] For a possible implementation, please refer to Figure 5 The light emitting unit 200 has a pad 201 on one side facing the driving backplane 100 , and the light emitting unit 200 is electrically connected to the driving backplane 100 through the pad 201 .

[0082] Among them, the distance d1 between the side of the pad 201 in the first light-emitting unit 200a facing the driving backplane 100 and the side of the first light-emitting unit 200a away from the driving backplane 100 is smaller than the distance d2 between the side of the pad 201 in the second light-emitting unit 200b facing the driving backplane 100 and the side of the second light-emitting unit 200b away from the driving backplane 100. That is, the thickness of the first light-emitting unit 200a is smaller than the thickness of the second light-emitting unit 200b. In this way, it can be achieved that the distance h01 between the side of the first light-emitting unit 200a away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance h02 between the side of the second light-emitting unit 200b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200.

[0083] For example, the light emitting unit 200 may include a chip body 202 and a pad 201 electrically connected to the chip body 202. In the embodiment of the present application, the thickness of the first light emitting unit 200a may be adjusted in a direction perpendicular to the driving backplane 100, or the thickness of the pad 201 may be adjusted, so that the thickness of the first light emitting unit 200a is smaller than the thickness of the second light emitting unit 200b.

[0084] It should be noted that the above two implementations may be combined, that is, in the first implementation, the thickness of the first light emitting unit 200a may be smaller than the thickness of the second light emitting unit 200b.

[0085] For a possible implementation, please refer to Fig. 9 , Fig. 9 for Figure 3 The light emitting panel is shown in a schematic structural diagram of another embodiment at position DD′. The light emitting panel 000 may further include: a plurality of support structures 007 with the same height; the plurality of support structures 007 correspond to the plurality of light emitting units 200 .

[0086] The support structure 007 is located between the driving back plate 100 and the corresponding light emitting unit 200 , one end of the support structure 007 is fixedly connected to the driving back plate 100 , and the other end is abutted against the light emitting unit 200 .

[0087] By providing a support structure 007 that supports the light-emitting unit 200, the distance between each light-emitting unit 200 and the driving backplane 100 can be ensured to be the same in a direction perpendicular to the driving backplane 100, thereby improving the uniformity of the chip height after die bonding. In other words, the die bonding process error can be reduced by the support structure 007, for example, to 5 microns. At this time, the difference between h02 and h01 can be reduced, so that the second light-emitting unit 200b is less protruding than the first light-emitting unit 200a. For example, in the case where an insulating package is to be performed on the surface of the light-emitting unit 200, the overall thickness of the insulating package layer can be reduced, saving costs.

[0088] In the embodiment of the present application, the categories of the plurality of light-emitting units 200 are not limited. The above categories may refer to the size of the light-emitting unit 200, or may refer to the light-emitting color of the light-emitting unit 200. For example, the LED chip may have three types of monochrome light-emitting units, namely, red, green, and blue; three types of two-color light-emitting units, namely, red and blue, red and green, and blue and green; and three-color light-emitting units, namely, red, green, and blue in one. According to the requirements of the actual application, the first light-emitting unit 200a and the second light-emitting unit 200b may be the same type of light-emitting unit, or may be two different types of light-emitting units. Some specific implementations are listed below for description.

[0089] For a possible implementation, please refer to Fig.10 and Fig.11 , Fig.10 A schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present application, Fig.11 for Fig.10 The schematic diagram of the film structure of the light-emitting panel at AA' is shown. The plurality of light-emitting units 200 may include: a plurality of first-type light-emitting units 210a and a plurality of second-type light-emitting units 210b.

[0090] In the first direction X, the first type of light emitting units 210a and the second type of light emitting units 210b are arranged alternately, and / or, in the second direction Y, the first type of light emitting units 210a and the second type of light emitting units 210b are arranged alternately.

[0091] Among them, the distance H1 between the side of the first type light-emitting unit 210a away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance H2 between the side of the second type light-emitting unit 210b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200.

[0092] At this time, the above-mentioned first type of light-emitting unit 210a and the second type of light-emitting unit 210b can be the same type of light-emitting unit 200 or different types of light-emitting units 200. For example, the first type of light-emitting unit 210a and the second type of light-emitting unit 210b are both red, green and blue three-in-one three-color light-emitting units. For another example, the first type of light-emitting unit 210a can be a red and green two-color light-emitting unit, and the second type of light-emitting unit 210b can be a red and blue two-color light-emitting unit. For another example, the first type of light-emitting unit 210a and the second type of light-emitting unit 210b can be two types of red, green and blue single-color light-emitting units. At this time, the first type of light-emitting unit 210a can correspond to the above-mentioned first light-emitting unit 200a, and the second type of light-emitting unit 210b corresponds to the second light-emitting unit 200b. In addition, with regard to the definition of the driving backplane 100, reference can be made to the definition of the driving backplane 100 in other embodiments of the present application.

[0093] For a possible implementation, please refer to Fig.12 and Fig.13 , Fig.12 A schematic diagram of the structure of another light-emitting panel provided in an embodiment of the present application, Fig.13 for Fig.12 The schematic diagram of the film structure of the light-emitting panel at BB' is shown. The plurality of light-emitting units 200 may include: a plurality of first-type light-emitting units 210a, a plurality of second-type light-emitting units 210b, and a plurality of third-type light-emitting units 210c.

[0094] In the first direction X, the first type light emitting unit 210a, the second type light emitting unit 210b and the third type light emitting unit 210c are arranged alternately, and / or, in the second direction Y, the first type light emitting unit 210a, the second type light emitting unit 210b and the third type light emitting unit 210c are arranged alternately.

[0095] Among them, the distance H1 between the side of the first type of light-emitting unit 210a away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance H2 between the side of the second type of light-emitting unit 210b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200; the distance between the side of the second type of light-emitting unit 210b away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200 is smaller than the distance H3 between the side of the third type of light-emitting unit 210c away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200.

[0096] The first type of light emitting unit 210a can be a red monochromatic light emitting unit; the second type of light emitting unit 210b can be a green monochromatic light emitting unit; the third type of light emitting unit 210c can be a blue monochromatic light emitting unit, and they are arranged alternately in red, green and blue in the first direction X and the second direction Y. Of course, the other three types of light emitting units 200 may also be the same or different.

[0097] Among them, for a first-type light-emitting unit 210a and a second-type light-emitting unit 210b adjacent to each other in the first direction X or the second direction Y, the first-type light-emitting unit 210a corresponds to the first light-emitting unit 200a described in the above embodiment, and the second-type light-emitting unit 210b corresponds to the second light-emitting unit 200b described in the above embodiment.

[0098] For a second type light emitting unit 210b and a third type light emitting unit 210c adjacent to each other in the first direction X or the second direction Y, the second type light emitting unit 210b corresponds to the first light emitting unit 200a described in the above embodiment, and the third type light emitting unit 210c corresponds to the second light emitting unit 200b described in the above embodiment.

[0099] For a first-type light-emitting unit 210a and a third-type light-emitting unit 210c adjacent to each other in the first direction X or the second direction Y, the first-type light-emitting unit 210a corresponds to the first light-emitting unit 200a described in the above embodiment, and the third-type light-emitting unit 210c corresponds to the second light-emitting unit 200b described in the above embodiment.

[0100] In addition, regarding the definition of the driving backplane 100, reference may be made to the definition of the driving backplane 100 in other embodiments of the present application.

[0101] In the process of bonding the light emitting panel 000, the first type of light emitting unit 210a is bonded first, then the second type of light emitting unit 210b is bonded, and finally the third type of light emitting unit 210c is bonded. In this way, by using three types of light emitting units 200 with height differences for bonded bonding, it is possible to avoid the situation where the nozzle 20 touches the already bonded light emitting unit 200.

[0102] It can be seen that in the embodiment of the present application, the first light-emitting unit 200a and the second light-emitting unit 200b are divided only according to the size of the distance between the side of the two adjacent light-emitting units 200 away from the driving backplane 100 and the side of the driving backplane 100 away from the light-emitting unit 200, and the type of the light-emitting unit 200 does not limit the above division. In other words, the multiple light-emitting units 200 can also include four types, five types, or more types of light-emitting units. For example, the light-emitting panel 000 can be provided with multiple light-emitting areas, and the category distribution of the light-emitting units in each light-emitting area can be different. For example, some light-emitting areas use Fig.10 The form shown, other luminous areas adopt Fig.12 The form shown may of course be other possible forms. Based on this, the light-emitting panel 000 provided in the embodiment of the present application can be applicable to light-emitting panels 000 having one or more types of light-emitting units 200, and can improve the die bonding yield of these light-emitting panels 000.

[0103] In summary, the light-emitting panel provided in the embodiment of the present application may include a plurality of light-emitting units and a driving backplane, by setting the distances between two adjacent light-emitting units and the side of the driving backplane away from the light-emitting unit to be different. In the process of bonding the light-emitting unit to the driving backplane, a plurality of first light-emitting units may be bonded to the driving backplane first, and after the bonding of the plurality of first light-emitting units is completed, a plurality of second light-emitting units may be fixed to the driving backplane. At this time, the distance between the side of the first light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit is less than the distance between the side of the second light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit. Based on this, in the process of bonding any second light-emitting unit, the suction nozzle of the adsorption device will not touch the first light-emitting unit adjacent to the second light-emitting unit currently bonding. In this way, poor bonding caused by the suction nozzle is avoided, the bonding yield of the first light-emitting unit is guaranteed, and the bonding yield of the light-emitting panel is improved.

[0104] The present application also provides a display device, please refer to Fig.14 , Fig.14 This is a schematic diagram of the structure of a display device provided in an embodiment of the present application. The display device may include: a light-emitting panel 000 described in any of the above embodiments, and a driving chip 000a bound and connected to the light-emitting panel 000.

[0105] In the embodiment of the present application, the display device may be a display screen in a display device such as a mobile phone, a tablet computer, a laptop computer, a monitor, a smart TV, etc. The display device may also have the technical effects of the above-mentioned light-emitting panel 000, which will not be described again.

[0106] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0107] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0108] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A light-emitting panel, characterized in that: include: A driving backplane, and a plurality of light-emitting units located on one side of the driving backplane; The plurality of light-emitting units are arranged in a plurality of columns in the first direction and in a plurality of rows in the second direction; any two adjacent light-emitting units in the first direction or the second direction are respectively: a first light-emitting unit and a second light-emitting unit; The distance between the first light-emitting unit facing away from the driving backplane and the driving backplane facing away from the light-emitting unit is smaller than the distance between the second light-emitting unit facing away from the driving backplane and the driving backplane facing away from the light-emitting unit.

2. The light emitting panel according to claim 1, characterized in that: The driving backplane comprises: a substrate, and a plurality of connecting parts located on the substrate; the plurality of connecting parts are electrically connected to the plurality of light-emitting units correspondingly; The connection portion connected to the first light-emitting unit is a first connection portion, and the connection portion connected to the second light-emitting unit is a second connection portion; The distance between the substrate and a side of the first connection portion facing the first light-emitting unit is smaller than the distance between the substrate and a side of the second connection portion facing the second light-emitting unit.

3. The light emitting panel according to claim 2, characterized in that: The driving backplane further comprises: a driving circuit layer and an insulating layer; The driving circuit layer is located on one side of the substrate; the insulating layer is located on a side of the driving circuit layer away from the substrate; the multiple connecting parts are located on a side of the insulating layer away from the substrate and are electrically connected to the driving circuit layer; Wherein, in a direction perpendicular to the driving backplane, a thickness of a portion of the insulating layer distributed between the first connecting portion and the substrate is smaller than a thickness of a portion of the insulating layer distributed between the second connecting portion and the substrate.

4. The light emitting panel according to claim 3, characterized in that: The insulating layer includes a plurality of sub-insulating layers stacked in layers; The number of layers of the sub-insulating layer distributed between the first connecting portion and the substrate is less than the number of layers of the sub-insulating layer distributed between the second connecting portion and the substrate.

5. The light emitting panel according to claim 4, characterized in that: The sub-insulating layer distributed between the first connecting portion and the substrate in the insulating layer at least includes: a first sub-insulating layer; the sub-insulating layer distributed between the second connecting portion and the substrate in the insulating layer at least includes: the first sub-insulating layer and the second sub-insulating layer stacked, and the first sub-insulating layer is closer to the substrate than the second sub-insulating layer; Wherein, the first connecting part and the second connecting part are arranged in the same layer and made of the same material; Alternatively, the light-emitting panel further includes: a transition connection portion located between the first sub-insulating layer and the second sub-insulating layer, the second connection portion being electrically connected to the driving circuit layer via the transition connection portion, and the transition connection portion being arranged in the same layer and made of the same material as the first connection portion.

6. The light emitting panel according to claim 1, characterized in that: The light emitting unit has a pad on one side facing the driving backplane, and the light emitting unit is electrically connected to the driving backplane via the pad; Among them, the distance between the side of the soldering pad in the first light-emitting unit facing the driving backplane and the side of the first light-emitting unit away from the driving backplane is smaller than the distance between the side of the soldering pad in the second light-emitting unit facing the driving backplane and the side of the second light-emitting unit away from the driving backplane.

7. The light-emitting panel according to any one of claims 1 to 6, characterized in that: The light-emitting panel further comprises: a plurality of support structures of the same height; the plurality of support structures correspond to the plurality of light-emitting units; Wherein, the support structure is located between the driving back plate and the corresponding light emitting unit, one end of the support structure is fixedly connected to the driving back plate, and the other end is abutted against the light emitting unit.

8. The light emitting panel according to any one of claims 1 to 6, characterized in that: The plurality of light emitting units include: a plurality of first-type light emitting units and a plurality of second-type light emitting units; In the first direction, the first type of light emitting units and the second type of light emitting units are arranged alternately, and / or, in the second direction, the first type of light emitting units and the second type of light emitting units are arranged alternately; Among them, the distance between the side of the first type of light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit is smaller than the distance between the side of the second type of light-emitting unit away from the driving backplane and the side of the driving backplane away from the light-emitting unit.

9. The light-emitting panel according to any one of claims 1 to 6, characterized in that: The plurality of light-emitting units include: a plurality of first-type light-emitting units, a plurality of second-type light-emitting units, and a plurality of third-type light-emitting units; In the first direction, the first type of light-emitting units, the second type of light-emitting units and the third type of light-emitting units are arranged alternately, and / or, in the second direction, the first type of light-emitting units, the second type of light-emitting units and the third type of light-emitting units are arranged alternately; Among them, the distance between the side of the first type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit is smaller than the distance between the side of the second type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit; the distance between the side of the second type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit is smaller than the distance between the side of the third type of light-emitting unit facing away from the driving backplane and the side of the driving backplane facing away from the light-emitting unit.

10. A display device, characterized in that: include: The light-emitting panel according to any one of claims 1 to 9, and a driving chip bound and connected to the light-emitting panel.

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