Method, system and apparatus for monitoring radiation output of lamp

Abstract

Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring radiation output of a lamp of a processing chamber. In some embodiments, a system includes a plurality of lamps coupled to a chamber, and one or more radiation sensors. Each lamp is identified with one or more zones, radiation sensors are coupled to the chamber, with each radiation sensor proximate at least one lamp. The controller includes instructions that, when executed, cause: the radiation sensor to communicate information associated with radiation emitted by the lamp to the controller; the controller analyzes the information, the analysis comprising: for each zone: determining a function of the radiation varying over time; and monitoring the function for conditions associated with lamp aging; and to, based on the analyzing the information, the controller at least one of: varying the input power delivered to the lamp; and generating an alert.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring the radiant output of lamps of a substrate processing chamber. In one aspect, the lamps are monitored to determine if one or more lamps need to be replaced. Background Art

[0002] As part of substrate processing operations, lamps used for heating can age, degrade, and fail, resulting in increased machine downtime and reduced product yields. Lamp aging, degradation, and / or failure can also affect component performance. Lamps can age at different rates depending on the operation. For example, lamps located in different regional zones of a processing chamber can age in different ways. Therefore, the same input power provided to different regional zones may result in different radiant output from the lamps in each zone. Certain lamp monitoring operations lack precision (e.g., filament resistance detection) and therefore can only detect lamp resistance offsets when multiple lamps have offset resistances. Certain lamp aging effects can only be detected using wafer process results, such as thickness distribution.

[0003] Therefore, there is a need for improved lamp monitoring methods, systems and apparatus that are capable of predicting lamp aging to facilitate reduced machine downtime, accurate lamp aging monitoring, increased production yields and enhanced component performance. Summary of the invention

[0004] Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring the radiant output of lamps of a substrate processing chamber. In one aspect, the lamps are monitored to determine if one or more lamps need to be replaced.

[0005] In one or more embodiments, a system for processing a substrate includes: a processing chamber, the processing chamber including a processing space; a plurality of lamps, the plurality of lamps coupled to the processing chamber, wherein each lamp is identified by one or more zones; one or more radiation sensors, the one or more radiation sensors coupled to the processing chamber, wherein each radiation sensor is proximate to at least one lamp; and a controller, the controller including instructions that, when executed by a processor, cause: the one or more radiation sensors to deliver information associated with radiation emitted by the plurality of lamps to the controller, the controller analyzing the information, the analysis including: for each zone: determining a function of how the radiation varies over time, and monitoring the function for a first condition associated with lamp aging, and based on the analysis of the information, the controller performing at least one of the following actions: changing an input power delivered to at least one of the lamps, and generating an alarm.

[0006] In other embodiments, a method of monitoring a plurality of lamps of a processing chamber includes: identifying each lamp with one or more zones; collecting radiation emitted by the plurality of lamps, generating information about the collected radiation for each zone, analyzing the information, the analysis including: for each zone: determining a function of how the radiation changes over time; and monitoring the function for a first condition associated with lamp aging, and based on the analyzing the information, performing at least one of the following actions: changing an input power delivered to at least one of the lamps, and generating an alarm.

[0007] In some embodiments, a system includes a non-transitory computer-readable storage medium having computer-executable instructions stored thereon that, when executed by a processor, cause the processor to perform a method of monitoring a plurality of lamps of a processing chamber, the method comprising: identifying each lamp with one or more zones, collecting radiation emitted by the plurality of lamps, generating information about the collected radiation for each zone, analyzing the information, the analysis comprising: for each zone: determining a function of how the radiation varies over time, and monitoring the function for a first condition associated with lamp aging, and based on analyzing the information, performing at least one of the following actions: changing an input power delivered to at least one of the lamps, and generating an alarm.

[0008] In one or more embodiments, a radiation sensor for a processing chamber for processing a substrate includes: a sensor unit capable of detecting radiation in a wavelength range of about 300 nanometers to about 5000 nanometers; a sensor cover covering the sensor unit and comprising graphite coated with silicon carbide, and a shield base capable of thermally isolating the sensor unit from its supporting structure, wherein: the radiation sensor is configured to detect radiation emitted by one or more of a plurality of lamps of the processing chamber, each of the plurality of lamps being identified with one or more zones of the processing chamber, and the radiation sensor is configured to generate information about the radiation detected for one of the zones. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more specific description of the present disclosure briefly summarized above may be obtained by reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments and are therefore not to be considered as limiting the scope thereof, and other equally effective embodiments may be allowed.

[0010] Figure 1 is a schematic side cross-sectional view of a processing chamber according to one or more embodiments.

[0011] Figure 2 According to one or more embodiments Figure 1A schematic side cross-sectional view of a lamp and lamp output radiation sensor of a processing chamber is shown.

[0012] Figure 3 According to one or more embodiments, Figure 1 A schematic block diagram of a control system used within a processing chamber is shown.

[0013] Figure 4 According to one or more embodiments, Figure 1 A schematic block diagram of a control feedback loop used within a processing chamber is shown.

[0014] Figure 5 is a block diagram of a method of monitoring a plurality of lamps of a processing chamber according to one or more embodiments.

[0015] To facilitate understanding, like reference numerals have been used, where possible, to designate like components in the drawings. It is contemplated that components and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0016] Embodiments of the present disclosure relate to methods, systems, and apparatus for monitoring the radiant output of lamps of a substrate processing chamber. In one aspect, the lamps are monitored to determine if one or more lamps need to be replaced.

[0017] Embodiments of the present disclosure may provide improved lamp monitoring methods, systems, and devices that are capable of predicting lamp aging to facilitate reduced machine downtime, accurate monitoring, increased production, and enhanced component performance. For example, embodiments of the present disclosure may provide improved systems and methods for monitoring and / or controlling lamps, such as infrared lamps, used in processing chambers such as epitaxial deposition processing chambers. Thus, embodiments of the present disclosure may improve the accuracy of lamp monitoring compared to conventional systems. Embodiments of the present disclosure may beneficially control one or more lamps based at least in part on the radiation output detected from one or more lamps. For example, one or more lamps may be assigned to regional zones within a processing chamber, and the radiation output may be analyzed based on the zone from which it originates, and each control instruction may apply to the lamps of a single zone. Advantageously, one or more lamps may be controlled to compensate for lamp aging differences, such as filament droop, filament breakage, short circuits between filament turns, and / or deposition on the housing of the lamp. Thus, embodiments of the present disclosure may provide monitoring and / or control of independently operated processing chamber lamps without the need for other hardware (e.g., external hardware) or user intervention (e.g., visual inspection of the lamp, manual adjustment of input power). Embodiments of the present disclosure may include systems and methods for automatically controlling lamp power input. Lamp control based at least in part on the radiant output detected from the lamp avoids technical problems associated with manual and / or visual inspection of the lamp, such as lack of precision and inefficiency. Improved lamp control accuracy improves the accuracy of chamber temperature control, thereby providing more predictable deposition results and substrate processing. Improved monitoring and / or control of lamps as provided by embodiments disclosed herein can reduce machine downtime, increase product yield, and provide greater precision and / or efficiency in component performance.

[0018] Figure 1 1 is a schematic side cross-sectional view of a process chamber 100 according to one or more embodiments. The process chamber 100 is a deposition chamber. In one or more embodiments that can be combined with other embodiments, the process chamber 100 is an epitaxial deposition chamber. The process chamber 100 is used to grow an epitaxial film on a substrate 102. The process chamber 100 generates a cross-flow of precursors across a top surface 150 of the substrate 102.

[0019] The processing chamber 100 includes an upper body 158, a lower body 148 disposed below the upper body 158, and a flow module 112 disposed between the upper body 158 and the lower body 148. The upper body 158, the flow module 112, and the lower body 148 form a chamber body. Disposed within the chamber body are a substrate support 106 (e.g., a pedestal), an upper window 108 (e.g., an upper dome), a lower window 110 (e.g., a lower dome), and a plurality of lamps (e.g., incandescent lamps). The plurality of lamps may be adapted to emit radiation (e.g., infrared radiation, optical radiation) to the substrate 102 to raise its temperature (e.g., to a desired processing temperature). For example, the lamps may be adapted to emit radiation and / or infrared (IR) radiation having a wavelength range of about 300 nanometers to about 5000 nanometers. In some embodiments, the lamps may be adapted to emit a peak filament power having a wavelength of about 950 nanometers or more. The lamps may be symmetrically arranged (e.g., in a generally annular configuration) around a central axis of the processing chamber 100. The lamps may be arranged in one or more regional zones (e.g., zones with a common input power; zones providing common susceptor zone heating). As shown, the lamps may be identified by four regional zones, such as lamps 141 in the upper outer zone, lamps 142 in the upper inner zone, lamps 143 in the lower outer zone, and lamps 144 in the lower inner zone. Each zone may have one or more lamps (e.g., between 1 and about 50 or more lamps). In some embodiments, the number of lamps in each zone may be the same, while in other embodiments, each zone may include a different number of lamps (e.g., 12 upper outer zone lamps 141, 20 upper inner zone lamps 142, 32 lower outer zone lamps 143, and 12 lower inner zone lamps 144). In some embodiments that may be combined with other embodiments, it is contemplated that multiple lamps may be arranged according to different geometries and / or directions (e.g., vertical directions). As shown, the controller 120 is in communication with the processing chamber 100 and is used to control processes and methods, such as the operation of the methods described herein. The controller 120 may be adapted to monitor, set, adjust, and / or change the input power (e.g., measured by voltage) delivered to the lamps in different zones, thereby controlling the radial distribution of the radiant energy. For example, the controller 120 may send a control signal to the input power supply, wherein the control signal specifies an input power level based on the lamp zone and / or operating process state. Likewise, the controller 120 may modify the set point of the input power delivered to the lamps. The controller 120 may be adapted to generate an alarm based on data collected by various components of the processing chamber 100.

[0020] The substrate support 106 is disposed between the upper window 108 and the lower window 110. The substrate support 106 includes a support surface 123 that supports the substrate 102. In some embodiments, the substrate support is formed of a material such as graphite coated with silicon carbide. A plurality of upper outer zone lamps 141 and a plurality of upper inner zone lamps 142 are disposed between the upper window 108 and the cover 154. The cover 154 may include a plurality of sensors (e.g., pyrometers; not shown) disposed therein for measuring the temperature within the processing chamber 100. A plurality of lower outer zone lamps 143 and a plurality of lower inner zone lamps 144 are disposed between the lower window 110 and the bottom plate 152. The upper window 108 is an upper dome and is formed of an energy transmission material such as quartz. The lower window 110 is a lower dome and is formed of an energy transmission material such as quartz.

[0021] A processing space 136 and a purification space 138 are formed between the upper window 108 and the lower window 110. The processing space 136 and the purification space 138 are a portion of an inner space at least partially defined by the upper window 108, the lower window 110, and one or more gaskets 163.

[0022] The interior space has a substrate support 106 disposed therein. The substrate support 106 is connected to a shaft 118. The shaft 118 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and / or adjustment devices that provide motion and / or adjustment for the shaft 118 and / or substrate support 106 within the processing space 136.

[0023] The substrate support 106 may include a lift pin hole 107 disposed therein. The lift pin hole 107 is sized to receive lift pins 132 for lifting the substrate 102 from the substrate support 106 before or after a deposition process. The lift pins 132 may rest on lift pin stops 134 when the substrate support 106 is lowered from the processing position to the transfer position.

[0024] The flow module 112 includes a plurality of gas inlets 114, a plurality of purge gas inlets 164, and one or more exhaust outlets 116. The plurality of gas inlets 114 and the plurality of purge gas inlets 164 are disposed on a side of the flow module 112 opposite to the one or more exhaust outlets 116. One or more flow guides 117a, 117b are disposed below the plurality of gas inlets 114 and the one or more exhaust outlets 116. One or more flow guides 117a, 117b are disposed above the purge gas inlet 164. One or more liners 163 are disposed on the inner surface of the flow module 112 and protect the flow module 112 from the reactive gas used during the deposition operation and / or the cleaning operation. The gas inlet 114 and the purge gas inlet 164 are each positioned to flow gas parallel to the top surface 150 of the substrate 102 disposed in the processing space 136. The gas inlet 114 is fluidly connected to one or more process gas sources 151 and one or more cleaning gas sources 153. The purge gas inlet 164 is fluidly connected to one or more purge gas sources 162. One or more exhaust outlets 116 are fluidly connected to an exhaust pump 157. The one or more process gases supplied using the one or more process gas sources 151 may include one or more reactive gases (e.g., one or more of silicon (Si), phosphorus (P), and / or germanium (Ge)) and / or one or more carrier gases (e.g., one or more of nitrogen (N2) and / or hydrogen (H2)). The one or more purge gases supplied using the one or more purge gas sources 162 may include one or more inert gases (e.g., one or more of argon (Ar), helium (He), and / or nitrogen (N2)). The one or more cleaning gases supplied using the one or more cleaning gas sources 153 may include one or more of hydrogen (H) and / or chlorine (Cl). In one or more embodiments that may be combined with other embodiments, the one or more process gases include silicon phosphide (SiP) and / or phosphine (PH3), and the one or more cleaning gases include hydrochloric acid (HCl).

[0025] The one or more exhaust outlets 116 are further connected to or include an exhaust system 178. The exhaust system 178 fluidly connects the one or more exhaust outlets 116 and the exhaust pump 157. The exhaust system 178 can help in controlled deposition of layers on the substrate 102. The exhaust system 178 is disposed on an opposite side of the processing chamber 100 relative to the flow module 112.

[0026] Figure 22 is an enlarged view of one of the above-mentioned lamps, such as any one of the upper outer zone lamp 141, the upper inner zone lamp 142, the lower outer zone lamp 143 and / or the lower inner zone lamp 144. As shown, the lamp 240 is coupled to the wall 268 (e.g., the inner wall of the upper body 158 or the lower body 148, such as an internal reflector or deflector). The coupling can provide structural support and input power to the lamp 240. The coupling can also communicate sensor readings and / or control signals between the lamp 240 and other components of the processing chamber 100 (e.g., the controller 120). In some embodiments, the surface 269 of the wall 268 (e.g., near the lamp 240) can be adapted to direct (e.g., reflect) light radiation toward the substrate 102 to provide more efficient heating.

[0027] Figure 2A radiation sensor 270 is also shown. The radiation sensor 270 can be positioned (e.g., coupled to the wall 268, and / or another inner wall of the upper body 158 or the lower body 148) proximate to the lamp 240. The radiation sensor 270 can be adapted to preferentially detect radiation of a type emitted by the lamp 240 (e.g., radiation in a wavelength range of about 300 nanometers to about 5,000 nanometers, and / or infrared (IR) radiation). In order to have minimal impact on the processing environment, the radiation sensor 270 can have a small physical size and / or thermal mass (e.g., less than 10% of the lamp 240). The radiation sensor 270 can include a sensor unit 271, a low thermal mass sensor cover 272, and a shield base 273. For example, the sensor unit 271 can be a resistive temperature detector (RTD), a thermocouple (TC), a pyrometer, and / or other type of radiation detector. The sensor unit 271 can have a sensor cover 272 that includes a material similar to the substrate support 106 (e.g., graphite coated with silicon carbide). It is currently believed that similar materials will provide similar thermal absorption spectra for the radiation sensor 270 and the substrate support 106. In addition, the sensor cover 272 can protect the sensor unit 271 from being exposed to materials and gases within the processing chamber 100. The shield base 273 can thermally isolate the radiation sensor 270 from the support structure (e.g., the wall 268). In some embodiments, the shield base 273 can include opaque quartz. In some embodiments, a single radiation sensor 270 is placed near multiple lamps 240. For example, each of the above-mentioned zones can have a single associated radiation sensor. In other words, each radiation sensor 270 is identified with a single zone, and each zone is identified with a single radiation sensor. In some embodiments, one or more radiation sensors 270 can be associated with one or more lamps 240 (e.g., detect radiation from one or more lamps 240), and each associated lamp 240 is in a single zone in the above-mentioned zones. In other words, each radiation sensor 270 is identified with a single zone, but at least one zone is identified with more than one radiation sensor 270. In some embodiments, radiation sensor 270 may be adapted to detect radiation only from a single zone, for example using an opaque deflector located between the radiation sensor and the non-relevant zone.

[0028] The radiation sensor 270 is adapted to detect radiation emitted by the associated lamp 240 and communicate information about the detected radiation to the controller 120. For example, the information may be in the form of an energy spectrum and / or temperature measurement. The information may be specific to a narrow wavelength band, one or more wavelength bands, and / or a broadband energy spectrum. The radiation sensor 270 sends information to the controller 120 in the form of data. The controller 120 receives data from each radiation sensor 270. The controller 120 analyzes the data to detect relative changes in the detected radiation. For example, for each zone, the controller may monitor the input power and the associated radiation output of the lamp. For a single zone, between different zones, or among different zones, and / or any combination thereof, the input power and the associated radiation output may be compared over time. For example, a function of the change in radiation over time may be weighted by the input power. In some embodiments, the controller may generate an alarm when monitoring identifies a condition associated with lamp aging. For example, monitoring may identify a significant difference (e.g., greater than 3%) in the input power weighted radiation output in terms of comparison over time and / or comparison with other zones. In some embodiments, the alarm indicates replacement instructions for the corresponding lamp 240. The alarm may indicate that the corresponding lamp 240 may subsequently fail within a specified time frame, such as within a certain number of weeks or months of operation. Additionally, or alternatively, the alarm may instruct the operator to replace the corresponding lamp 240. The alarm may be displayed on a user interface.

[0029] In some embodiments (not shown), one or more cameras may be used in conjunction with the radiation sensor 270 to monitor the lamp 240. For example, one or more cameras may optically monitor the lamp 240 and communicate the resulting images and / or information to the controller 120. In some embodiments, each camera may capture an image of light emitted from the lamp. In some embodiments, each camera may be identified with a single zone. In some embodiments, the images may be analyzed to detect conditions associated with lamp aging (e.g., filament position changes, filament sagging, filament breakage, filament turn-to-turn shorts, and / or deposition on the housing of the lamp). For example, the controller 120 may analyze the images to detect lamp aging. In some embodiments, based on the above-described detected changes in radiation from the radiation sensor, the controller may be triggered to analyze the images to detect lamp aging. In some embodiments, an alarm triggered by monitoring radiation from the radiation sensor may be enhanced by analysis of the image. For example, monitoring radiation in a particular zone may generate an alarm that triggers the controller to analyze images from the zone, which results in enhancing the alarm to identify lamp aging conditions for one or more particular lamps in the zone. For example, suitable cameras and their uses may be disclosed in U.S. Patent No. 11,562,915, the entire contents of which are incorporated herein by reference.

[0030] Figure 3 According to one or more embodiments Figure 1 Schematic block diagram of a control system 300 for use with the process chamber 100 shown. The controller 120 is configured to receive data or input as sensor readings 302 from a plurality of sensors. The sensors may include, for example, sensors that monitor the growth of a layer on the substrate 102 and / or sensors that monitor growth or residue on the inner surfaces of chamber components of the process chamber 100 (e.g., the inner surfaces of the upper window 108 and one or more liners 163). The sensors may also include a radiation sensor 270 and / or a camera for monitoring the lamp 240. The controller 120 is equipped with or communicates with a system model 306 of the process chamber 100. The system model 306 includes a heating model, a rotational position model, a gas flow model, and a lamp aging model (e.g., lamp resistance transfers from a new lamp to an aged lamp). The system model 306 is a program configured to estimate parameters (e.g., gas flow rate, gas pressure, rotational position of components, and heating distribution) within the process chamber 100 throughout the deposition operation and / or cleaning operation. The controller 120 is also configured to store the readings and calculations 304.

[0031] The readings and calculations 304 include previous sensor readings 302, such as any previous sensor readings within the processing chamber 100. The readings and calculations 304 also include calculated values ​​stored after the sensor readings 302 are measured by the controller 120 and operated through the system model 306. Therefore, the controller 120 is configured to retrieve the stored readings and calculations 304 and save the readings and calculations 304 for future use. Maintaining previous readings and calculations enables the controller 120 to adjust the system model 306 over time to reflect a more accurate version of the processing chamber 100. For example, energy spectrum and / or temperature measurements taken during a calibration or setup phase can be stored as a "fingerprint" for one or more lamps. This fingerprint information can then be compared with subsequent information from the radiation sensor to detect lamp radiation drift. In some embodiments, the controller can adjust the input power of the lamp to maintain the emitted radiation (power and / or wavelength) during certain operations and / or operating process states. For example, the controller 120 can send a control signal to the input power supply, wherein the control signal specifies an input power level based on the stored fingerprint, radiation drift, lamp zone, and / or operating process state. The controller 120 may analyze the readings and calculations 304 based on the zone from which the readings and calculations 304 are derived. The controller 120 may thereby adjust the input power to the lamps of a particular zone to maintain radiation emitted from that zone during certain operating and / or operating process states.

[0032] The controller 120 includes a central processing unit (CPU), a memory including instructions, and support circuits for the CPU. The controller 120 controls various items directly or via other computers and / or controllers. In one or more embodiments, the controller 120 is communicatively coupled to a dedicated controller, and the controller 120 acts as a central controller.

[0033] The controller 120 is any form of a general purpose computer processor used in an industrial environment to control various substrate processing chambers and devices and sub-processors thereon or therein. The memory or non-transitory computer readable medium is one or more of readily available memories, such as random access memory (RAM), dynamic random access memory (DRAM), static RAM (SRAM) and synchronous dynamic RAM (SDRAM (e.g., DDR1, DDR2, DDR3, DDR3L, LPDDR3, DDR4, LPDDR4, etc.), read only memory (ROM), floppy disk, hard disk, flash drive, or any other form of local or remote digital memory. The support circuits of the controller 120 are coupled to the CPU to support the CPU (processor). The support circuits include cache, power supply, clock circuit, input / output circuit system and subsystems, etc. The operating parameters (pressure of the process gas, flow rate of the process gas and / or rotational position of the process kit) and operations are stored in the memory as software routines, which are executed or called to turn the controller 120 into a special purpose controller to control the operation of the various chambers / modules described herein. The controller 120 is configured to perform any of the operations described herein. The instructions stored on the memory, when executed, cause one or more operations of the method 500 (described below) to be performed.

[0034] The various operations described herein (eg, the operations of method 500 ) may be performed automatically using controller 120 , or may be performed automatically or manually through certain operations performed by a user.

[0035] In one or more embodiments, the controller 120 includes a mass storage device, an input control unit, and a display unit (not shown). The controller 120 monitors the process gas and purge gas flow. In one or more embodiments, the controller 120 includes multiple controllers 120 so that the stored readings and calculations 304 and the system model 306 are stored in a controller that is independent of the controller 120 that operates the process chamber 100. In one or more embodiments, all of the system models 306 and stored readings and calculations 304 are stored in the controller 120.

[0036] The controller 120 is configured to control the rotational position, heating, and gas flow through the processing chamber 100 by providing outputs to the controls 308 for the lamps, gas flow, and motion assembly 121. The controls 308 include controls for the upper outer zone lamps 141, the upper inner zone lamps 142, the lower outer zone lamps 143, the lower inner zone lamps 144, the process gas source 151, the purge gas source 162, the motion assembly 121, and the exhaust pump 157.

[0037] The controller 120 is configured to adjust the output to the control member 308 based on the sensor readings 302, the system model 306, and the stored readings and calculations 304. For example, the controller 120 can send a control signal to the input power supply, wherein the control signal specifies the input power level based on the sensor readings 302, the system model 306, and / or the stored readings and calculations 304. The controller 120 can send a personalized control signal to the input power supply of each zone. The controller 120 includes embedded software and a compensation algorithm for calibrating the measured values. The controller 120 may include one or more machine learning algorithms and / or artificial intelligence algorithms that estimate optimized parameters for deposition operations and / or cleaning operations. One or more machine learning algorithms and / or artificial intelligence algorithms can use, for example, a regression model (e.g., a linear regression model) or a clustering technique to estimate the optimized parameters. The algorithm can be unsupervised or supervised.

[0038] In one or more embodiments, the controller 120 can be configured to: (a) send a control signal to an input power supply to adjust the input power of one or more lamps 240 (e.g., lamps in a particular zone); (b) repeatedly obtain radiation measurements from one or more radiation sensors 270 (e.g., radiation sensors in a particular zone); (c) compare the obtained radiation measurements with a target radiation output; and (d) selectively adjust the input power of one or more lamps (e.g., lamps in a particular zone) by sending a control signal to the device, thereby maintaining the input power of the one or more lamps within 3% of the target radiation output.

[0039] Figure 4 According to one or more embodiments, Figure 1Schematic block diagram of a control feedback loop 400 within a processing chamber as shown. The control feedback loop 400 can be used to monitor, set and / or change the amount of input power delivered to one or more lamps 240. For example, the control system 300 can implement the control feedback loop 400 to monitor and / or control the lamps 240. In some embodiments, each of the above-mentioned zones will employ a separate control feedback loop 400. For example, for a given zone (e.g., an upper outer zone), an initial set point temperature 421 will be identified. The set point temperature can be based on the desired operating conditions within the processing chamber 100. The set point temperature 421 can be identified with one or more specific locations within the processing chamber 100, such as at the axial center of the top surface 150 of the substrate 102. The set point temperature 421 can be initially input into components of the control system 300. As Figure 4 As shown, the set point temperature is initially input into the PID control 422, which has been adapted to adjust the power supply to the corresponding zone based on the temperature reading. Thus, the set point temperature 421 generates an electrical power set point for the initial input into the PID control 422.

[0040] The electrical power set point of PID control 422 is fed to PID control 423 which has been adapted to regulate the voltage supply to the various zones based on the electrical power set point and information about the radiation emitted from the various lamps (here shown as lamp 440).

[0041] The voltage supply of the PID control 423 is fed to the SCR 424 which has been adapted to regulate the facility power of the corresponding zone to a voltage output based on the voltage supply of the PID control 423 .

[0042] The output from the SCR 424 voltage provides input power to the corresponding zone's lamp 440. With this input power, the energy emitted from the lamp in the form of heat and radiation can be set, adjusted and / or varied.

[0043] Feedback loop 400 provides two feedback mechanisms. Heat from lamp 440 can be detected by pyrometer 480 of corresponding zone. Therefore, temperature feedback can be provided to PID control 422 from pyrometer 480. Similarly, radiation from lamp 440 can be detected by radiation sensor 470 of corresponding zone. Therefore, radiation feedback can be provided to PID control 423 from radiation sensor 470. Together, the two feedback mechanisms of control feedback loop 400 can be used to monitor, set and / or change the amount of input power delivered to one or more lamps. For example, control system 300 can send a control signal to PID control 423, wherein the control signal specifies the input power level based on the current electrical power set point and / or the radiation feedback from radiation sensor 470. In some embodiments, one or both of the feedback mechanisms can be repeated multiple times. For example, feedback loop 400 can connect controller 120 to a member for radiation measurement (e.g., radiation sensor 270) to repeatedly measure the radiation output of one or more lamps 240. In some embodiments, the control signal can be specific to one zone of the processing chamber.

[0044] The control system 300 may include one or more machine learning algorithms and / or artificial intelligence algorithms that may implement, adjust, and / or refine the above one or more algorithms, inputs, outputs, or variables. Additionally or alternatively, the one or more machine learning algorithms and / or artificial intelligence algorithms may rank or prioritize certain aspects of the adjustment of the feedback loop 400 relative to other aspects of the feedback loop 400. The one or more machine learning algorithms and / or artificial intelligence algorithms may take into account other changes within the processing system, such as hardware replacement and / or degradation. In another example, the one or more machine learning algorithms and / or artificial intelligence algorithms may take into account upstream or downstream changes that may occur in the processing system due to variable changes in the feedback loop 400. For example, if variable "A" is adjusted to cause a change in aspect "B" of the process, and such adjustment inadvertently causes a change in aspect "C" of the process, the one or more machine learning algorithms and / or artificial intelligence algorithms may take into account such changes in aspect "C". In such examples, the one or more machine learning algorithms and / or artificial intelligence algorithms embody predictive aspects associated with implementing the feedback loop 400. The predictive aspects may be utilized to proactively mitigate unexpected changes within the processing system. One or more machine learning algorithms and / or artificial intelligence algorithms can estimate optimized parameters using, for example, a regression model (e.g., a linear regression model) or clustering techniques. The algorithm can be unsupervised or supervised.

[0045] Figure 55 is a block diagram of a method 500 for monitoring a plurality of lamps of a processing chamber according to one or more embodiments. The method 500 begins at operation 510, which includes identifying each lamp with one or more zones. The method 500 proceeds to operation 520, which includes collecting radiation emitted by the lamp. For example, a radiation sensor may monitor the radiation emitted by the lamp. The radiation sensor may continuously and / or intermittently measure the radiation emitted by the lamp. In some embodiments, the radiation sensor may collect data according to an automatic schedule, which may be adjusted by a controller as operating parameters change over time. The method 500 proceeds to operation 530, which includes generating information about the radiation of each zone. For example, the information may include an absorption spectrum. In some embodiments, the information may be specified and / or subdivided by zone of the processing chamber. The method 500 proceeds to operation 540, which includes analyzing the information.

[0046] Based on the analysis of operation 540, method 500 proceeds to either (or both) of operation 551 or operation 552. Operation 551 includes changing the input power delivered to at least one of the lamps. For example, the input power may vary based on the above-mentioned fingerprint of one or more lamps. The controller may automatically change the input power according to an automatic schedule, which may be adjusted by the controller as the operating parameters change over time. In some embodiments, the controller may adjust the input power in different ways for different zones. Operation 552 includes generating an alarm. For example, the alarm may indicate a replacement instruction for the corresponding lamp. In some embodiments that may be combined with other embodiments, the replacement instruction instructs an operator (e.g., on a display of a user interface) to replace the corresponding lamp. The operator may then replace the corresponding single lamp without having to replace any other lamps to reduce machine downtime, reduce costs and resource expenditures, and increase substrate throughput of the processing chamber. The corresponding single lamp may be replaced before the lamp actually fails. In some embodiments that may be combined with other embodiments, the replacement instruction provides an operator with an estimate of the remaining life of the corresponding lamp, such as the remaining service life. Operators can use this remaining life estimate for each lamp in order to plan and perform appropriate maintenance activities to reduce machine downtime, lower costs and resource expenditures, and increase substrate throughput for the processing chamber.

[0047] In addition, embodiments of the present disclosure (e.g., embodiments of the intermediate plate) are modular and can be used across various processing (e.g., deposition) operations and / or cleaning operations, including across various operating parameters. In addition, depending on the processing parameters (e.g., flow rates, temperatures, pressures, and / or gas compositions) used in the processing operations and / or cleaning operations, one or more aspects, features, components, operations, and / or characteristics of the various processing kits (e.g., intermediate plates) described herein can be selected, combined, and / or modified.

[0048] It is contemplated that one or more aspects disclosed herein may be combined. As an example, one or more aspects, features, components, operations, and / or characteristics of the process chamber 100, controller 120, lamp 240, radiation sensor 270, control system 300, control feedback loop 400, and / or method 500 may be combined. Furthermore, it is contemplated that one or more aspects disclosed herein may include some or all of the aforementioned benefits.

[0049] Embodiments of the present disclosure also relate to any one or more of the following embodiments 1 to 21:

[0050] 1. A system for processing a substrate, comprising: a processing chamber, the processing chamber including a processing space; a plurality of lamps, the plurality of lamps coupled to the processing chamber, wherein each lamp is identified by one or more zones; one or more radiation sensors, the one or more radiation sensors coupled to the processing chamber, wherein each radiation sensor is proximate to at least one lamp; and a controller, the controller comprising instructions, which when executed by a processor cause: the one or more radiation sensors to communicate information associated with radiation emitted by the plurality of lamps to the controller; the controller to analyze the information, the analysis comprising: for each zone: determining a function of how the radiation varies over time; and monitoring the function for a first condition associated with lamp aging; and based on the analysis of the information, the controller to perform at least one of the following actions: changing an input power delivered to at least one of the lamps; and generating an alarm.

[0051] 2. The system of embodiment 1, wherein the one or more zones include: an upper outer zone; an upper inner zone; a lower outer zone; and a lower inner zone.

[0052] 3. The system of embodiment 1 or 2, wherein each radiation sensor is identified by a single zone of the one or more zones.

[0053] 4. The system of any one of embodiments 1 to 3, wherein at least one zone is associated with more than one radiation sensor.

[0054] 5. A system according to any one of embodiments 1 to 4, wherein the system further includes: one or more cameras, wherein the instructions, when executed by the processor, further cause: the one or more cameras to communicate multiple images of light emitted from the lamp to the controller; the controller analyzes the images to detect a second condition associated with lamp aging; and based on the analysis of the images, the controller enhances the alarm.

[0055] 6. The system of any one of embodiments 1 to 5, wherein each camera of the one or more cameras is identified with a single zone of the one or more zones.

[0056] 7. The system according to any one of embodiments 1 to 6, wherein the alarm indicates a replacement instruction for at least one lamp of the corresponding zone.

[0057] 8. The system of any one of embodiments 1 to 7, wherein the alarm indicates an estimated remaining life of at least one lamp of the corresponding zone.

[0058] 9. A method for monitoring multiple lamps in a processing chamber, comprising: identifying each lamp with one or more zones; collecting radiation emitted by the multiple lamps; generating information about the collected radiation for each zone; analyzing the information, the analysis comprising: for each zone: determining a function of how the radiation changes over time; and monitoring the function for a first condition associated with lamp aging; and based on the analyzing the information, performing at least one of the following actions: changing the input power delivered to at least one of the lamps; and generating an alarm.

[0059] 10. The method of embodiment 9, wherein the one or more zones include: an upper outer zone; an upper inner zone; a lower outer zone; and a lower inner zone.

[0060] 11. The method of embodiment 9 or 10, wherein radiation is collected using a plurality of radiation sensors.

[0061] 12. The method of embodiment 11, wherein each radiation sensor is identified by a single zone of the one or more zones.

[0062] 13. The method of embodiment 11 or 12, wherein at least one zone is associated with more than one radiation sensor.

[0063] 14. The method of any one of embodiments 9 to 13, wherein the function comprises input power weighted radiation output.

[0064] 15. The method of any one of embodiments 9 to 14, wherein analyzing the information further comprises comparing a function of the radiation variation over time of one of the zones with a function of the radiation variation over time of another of the zones.

[0065] 16. The method of any one of embodiments 9 to 15, further comprising: capturing multiple images of light emitted from the lamp using one or more cameras; analyzing the images to detect a second condition associated with lamp aging; and enhancing the alarm based on the analysis of the images.

[0066] 17. The method of embodiment 16, wherein each camera of the one or more cameras is identified with a single zone of the one or more zones.

[0067] 18. The method of any one of embodiments 9 to 17, wherein the alarm indicates at least one of: a replacement instruction for at least one lamp of the corresponding zone; and an estimated remaining life of at least one lamp of the corresponding zone.

[0068] 19. A method of monitoring a plurality of lamps of a processing chamber, the method comprising: any one of the systems of any one of embodiments 1 to 8.

[0069] 20. A non-transitory computer-readable storage medium having computer executable instructions stored thereon, which when executed by a processor causes the processor to perform a method for monitoring multiple lamps of a processing chamber, the method comprising: identifying each lamp with one or more zones; collecting radiation emitted by the multiple lamps; generating information about the collected radiation for each zone; analyzing the information, the analysis comprising: for each zone: determining a function of how the radiation changes over time; and monitoring the function for a first condition associated with lamp aging; and based on the analysis of the information, performing at least one of the following actions: changing the input power delivered to at least one of the lamps; and generating an alarm.

[0070] 21. A radiation sensor for a processing chamber for processing a substrate, the radiation sensor comprising: a sensor unit capable of detecting radiation in a wavelength range of about 300 nanometers to about 5,000 nanometers; a sensor cover covering the sensor unit and comprising graphite coated with silicon carbide; and a shield base capable of thermally isolating the sensor unit from its supporting structure, wherein: the radiation sensor is configured to detect radiation emitted by one or more of a plurality of lamps of the processing chamber, each of the plurality of lamps is identified with one or more zones of the processing chamber, and the radiation sensor is configured to generate information about the detected radiation for one of the zones.

[0071] Although the foregoing is directed to the embodiments of the present disclosure, other and further embodiments may be designed without departing from its basic scope, and the scope thereof is determined by the claims below. All documents described herein are incorporated herein by reference, including any priority documents and / or test procedures, as long as they are not inconsistent with this document. It is apparent from the general description and specific embodiments hereinabove that, although the form of the present disclosure has been shown and described, various modifications may be made without departing from the spirit and scope of the present disclosure. Therefore, it is not intended to limit the present disclosure accordingly. Likewise, for purposes of U.S. law, the word "include" is deemed to be a synonym of the word "include". Similarly, whenever a mixture, element, or group of elements is preceded by the transition phrase "include", it is understood that the same composition or group of elements with the transition phrase "essentially composed of", "consisting of", "selected from a group consisting of" or "is" before the oral description of the mixture, element, or element is intended, and vice versa. As used herein, the term "about" refers to a variation of + / -10% of the nominal value. It should be understood that such variation may be included in any value provided herein.

[0072] Certain embodiments and features have been described using a set of numerical upper limits and a set of numerical lower limits. It should be understood that, unless otherwise stated, any specified numerical range includes a lower endpoint value and an upper endpoint value. It should be understood that, unless otherwise stated, a range including a combination of any two values ​​may be considered, for example, a combination of any lower value with any higher value, a combination of any two lower values, and / or a combination of any two higher values. Certain lower limits, upper limits, and ranges appear in one or more claims below.

Claims

1. A system for processing a substrate, the system comprising: a processing chamber, the processing chamber comprising a processing space; a plurality of lamps coupled to the processing chamber, wherein each of the lamps is identified by one or more zones; one or more radiation sensors coupled to the processing chamber, wherein each radiation sensor is proximate to at least one lamp; as well as A controller comprising instructions that, when executed by a processor, cause: the one or more radiation sensors communicating information associated with radiation emitted by the plurality of lamps to the controller; The controller analyzes the information, the analysis comprising: For each zone: Determine the function of how radiation varies over time; and monitoring the function for a first condition associated with lamp aging; and Based on analyzing the information, the controller performs at least one of the following actions: varying input power delivered to at least one of the lamps; and Generates an alert.

2. The system of claim 1, wherein the one or more zones include: Upper Foreign Language District; upper inner area; Lower outer area; as well as Lower inner area.

3. The system of claim 1, wherein each radiation sensor is identified with a single zone of the one or more zones.

4. The system of claim 3, wherein at least one zone is associated with more than one radiation sensor.

5. The system of claim 1, further comprising: one or more cameras, wherein the instructions, when executed by a processor, further cause: the one or more cameras communicating a plurality of images of light emitted from the lamp to the controller; the controller analyzing the image to detect a second condition associated with lamp aging; as well as Based on the analyzing the images, the controller enhances the alarm.

6. The system of claim 5, wherein each of the one or more cameras is identified with a single zone of the one or more zones.

7. The system of claim 1, wherein the alarm indicates a replacement instruction for at least one lamp of the corresponding zone.

8. The system of claim 1, wherein the alert indicates an estimated remaining life of at least one lamp of the corresponding zone.

9. A method of monitoring a plurality of lamps of a processing chamber, the method comprising: identifying each of the lights with one or more regions; collecting radiation emitted by the plurality of lamps; generating information about the collected radiation for each zone; Analyzing the information, the analysis comprising: For each zone: Determine the function of how radiation varies over time; and monitoring the function for a first condition associated with lamp aging; and Based on the analyzing the information, performing at least one of the following actions: varying input power delivered to at least one of the lamps; and Generates an alert.

10. The method of claim 9, wherein the one or more regions include: Upper Foreign Language District; upper inner area; Lower outer area; as well as Lower inner area. The method of claim 9 , wherein the radiation is collected using a plurality of radiation sensors.

12. The method of claim 11, wherein each radiation sensor is identified with a single zone of the one or more zones.

13. The method of claim 12, wherein at least one zone is associated with more than one radiation sensor.

14. The method of claim 9, wherein the function comprises input power weighted radiant output.

15. The method of claim 9, wherein analyzing the information further comprises: The function of the variation of radiation over time for one of the zones is compared to the function of the variation of radiation over time for the other of the zones.

16. The method of claim 9, further comprising: capturing a plurality of images of light emitted from the lamp using one or more cameras; analyzing the image to detect a second condition associated with lamp aging; as well as The alert is enhanced based on the analyzing the image.

17. The method of claim 16, wherein each of the one or more cameras is identified with a single zone of the one or more zones.

18. The method of claim 9, wherein the alarm indicates a replacement instruction for at least one lamp of the corresponding zone.

19. The method of claim 9, wherein the alert indicates an estimated remaining life of at least one lamp of the corresponding zone.

20. A radiation sensor for a processing chamber for processing a substrate, the radiation sensor comprising: a sensor unit capable of detecting radiation having a wavelength in the range of about 300 nanometers to about 5000 nanometers; a sensor cover covering the sensor unit and comprising graphite coated with silicon carbide; and A shielding base capable of thermally isolating the sensor unit from its supporting structure, wherein: The radiation sensor is configured to detect radiation emitted by one or more of the plurality of lamps of the processing chamber, Each of the plurality of lamps is identified with one or more zones of the processing chamber, and The radiation sensor is configured to generate information regarding the detected radiation for one of the zones.

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