Substrate processing system, substrate processing apparatus and visualization method

Abstract

The present invention provides a system capable of easily visualizing the distribution of the flow of a fluid in a substrate processing apparatus. A substrate processing system (1) is provided with: a substrate processing device (50) having a housing space (A1) in which a substrate (W) is housed; a camera (81) facing the housing space (A1); a pattern (82) which is provided so as to be displayed within the field of view of the camera (81) and which can be imaged by the camera (81) via the housing space (A1); and an image generation unit (211) that generates image data indicating the distribution of the flow of the fluid in the storage space (A1) on the basis of a change in the image of the pattern (82) captured by the camera (81).

Description

Technical Field

[0001] The present invention relates to a substrate processing system, a substrate processing apparatus, and a visualization method. Background Art

[0002] In Patent Document 1, a method for visualizing an air flow is disclosed. In this method, a tracer that moves by using the air flow is mixed into the air flow to be visualized, and a laser beam including a wavelength in a specific visible light region is irradiated in such a manner that it scans repeatedly. The scattered light generated at this time is identified by passing through an optical filter having a relatively high transmittance only in the oscillation wavelength region of the laser.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Laid-Open No. 7-35764 Summary of the Invention

[0006] Technical Problem to be Solved by the Invention

[0007] The present invention provides a system capable of easily visualizing the distribution of the flow of a fluid in a substrate processing apparatus.

[0008] Technical Solution for Solving the Technical Problem

[0009] A substrate processing system according to one aspect of the present invention includes: a substrate processing apparatus having a storage space for storing a substrate; a camera facing the storage space; a pattern that is provided to be displayed within the field of view of the camera and can be photographed by the camera through the storage space; and an image generation unit that generates image data representing the distribution of the flow of a fluid in the storage space based on changes in an image of the pattern photographed by the camera.

[0010] Advantageous Effects of the Invention

[0011] According to the present invention, a system capable of easily visualizing the distribution of the flow of a fluid in a substrate processing apparatus can be provided. Brief Description of the Drawings

[0012] Figure 1 It is a plan view schematically illustrating the structure of a wafer processing system.

[0013] Figure 2 is Figure 1 a front view of the wafer processing system.

[0014] Figure 3 It is a plan view illustrating a substrate processing apparatus.

[0015] Figure 4 is along Figure 3Cross-sectional view taken along line IV-IV in

[0016] Figure 5 is a diagram of an exemplary pattern.

[0017] Figure 6 is a diagram illustrating a reference image and an evaluation image.

[0018] Figure 7 is a top view showing a modified example of a substrate processing apparatus.

[0019] Figure 8 is a cross-sectional view showing another modified example of a substrate processing apparatus.

[0020] Figure 9 is a top view showing yet another modified example of a substrate processing apparatus.

[0021] Figure 10 is a top view showing yet another modified example of a substrate processing apparatus.

[0022] Figure 11 is a top view showing yet another modified example of a substrate processing apparatus.

[0023] Figure 12 is a top view showing yet another modified example of a substrate processing apparatus.

[0024] Figure 13 is a schematic diagram illustrating multiple components of video data.

[0025] Figure 14 is a block diagram illustrating the hardware configuration of an image processing apparatus.

[0026] Figure 15 is a flowchart illustrating a visualization process.

[0027] Figure 16 is a flowchart illustrating a modified example of a visualization process.

[0028] Explanation of Reference Numerals

[0029] 1... Substrate processing system, W... Substrate, 50... Substrate processing apparatus, A1... Storage space, PA1... Peripheral space, 65... Opening, 73... Liquid supply unit, 81... Camera, 82... Pattern, 83... Unit pattern, 211... Image generation unit, 87... Pixel, 300... Reference image, 400... Evaluation image, 85... Temperature adjustment unit, 86... Addition unit, 88... Projection device, 78... Gas supply unit. Detailed Description of the Invention

[0030] Hereinafter, with reference to the drawings, a wafer processing system as a substrate processing apparatus according to the present embodiment will be described. In addition, in the present specification, elements having substantially the same functional structure are denoted by the same reference numerals, and redundant descriptions are omitted.

[0031] (Wafer processing system)

[0032] First, the structure of the wafer processing system according to the present embodiment will be described. Figure 1 、 Figure 2 Figures are respectively a schematic top view and a front view schematically showing the structure of the wafer processing system 1. In the present embodiment, an example will be described in which the wafer processing system 1 is a lithography processing system that forms and develops a resist film on a wafer W.

[0033] As Figure 1 shown, the wafer processing system 1 includes: a cassette station 2 for loading and unloading a cassette C containing a plurality of wafers W; and a processing station 3 including a plurality of various processing devices that perform a predetermined process on the wafer W. Further, the wafer processing system 1 has a structure in which an interface station 4 for transferring the wafer W between the cassette station 2, the processing station 3, and an exposure device (not shown) adjacent to the opposite side of the processing station 3 is integrally connected. In addition, as Figure 1 shown, two processing stations 3 are provided between the cassette station 2 and the interface station 4, but one or three or more processing stations may be provided.

[0034] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and wafer transfer devices 22 and 23. The cassette station 2 transfers the wafer W between the cassette C placed on the mounting table 12 and the processing station 3 by using the wafer transfer devices 22 or 23. Therefore, each of the wafer transfer devices 22 and 23 includes a driving mechanism in directions such as the X direction, the Y direction, the vertical direction, and the direction around the vertical axis (θ direction) as needed, and may include driving mechanisms in all directions.

[0035] At least one of the wafer transfer devices 22 and 23 can exchange the wafer W with the cassette C, and can also perform an exchange operation of exchanging the wafer W with the processing station 3. In addition, the exchange operation of exchanging the wafer W with the processing station 3 is, for example, an operation of exchanging the wafer W with a third block G3 including an exchange device accessible by the wafer transfer device 33 in the processing station 3 described later. The third block G3 may also include a plurality of exchange devices (not shown) arranged in the vertical direction.

[0036] In addition, the cassette station 2 may be provided with an inspection device (not shown) for inspecting the wafer W at a position accessible by any one of the wafer transfer devices 22 and 23.

[0037] The processing station 3 is provided with a plurality of blocks, for example, three types of blocks G1, G2, and G4, namely, the first, the second, and the fourth. In addition, asFigure 2 As shown, a plurality of layers 31 each including first and second blocks G1 and G2 are stacked in the vertical direction. For example, on the front side of the processing station 3 ( Figure 1 on the negative X-direction side), a first block G1 is provided, and on the back side of the processing station 3 ( Figure 1 on the positive X-direction side), a second block G2 is provided. On the interface station 4 side of the processing station 3 ( Figure 1 on the positive Y-direction side) or at the connection part with an adjacent other processing station 3, a fourth block G4 is provided. The fourth block G4 may also include a plurality of transfer devices arranged in the vertical direction. In addition, the above-mentioned third block G3 may also be provided inside the processing station 3.

[0038] A plurality of processing devices are arranged in the first block G1, such as a patterning film forming device and a developing processing device (not shown in both cases). As the patterning film forming device, for example, in addition to a resist film forming device, an antireflection film forming device may also be included. For example, the plurality of processing devices are arranged in the horizontal direction. In addition, the number, arrangement, and type of these processing devices can be arbitrarily selected.

[0039] In these patterning film forming devices and developing processing devices, for example, a process of supplying a predetermined processing liquid to the wafer W or a process of supplying a predetermined gas is performed. Thus, in the patterning film forming device, a resist film used as a mask when forming a pattern of the lower layer side film is formed, and an antireflection film for efficiently performing a light irradiation process such as an exposure process is formed. On the other hand, in the developing processing device, a part of the exposed resist film is removed to form the uneven shape as the above-mentioned mask.

[0040] For example, in the second block G2, heat treatment devices (not shown) for performing heat treatment such as heating and cooling of the wafer W are arranged in the vertical and horizontal directions. In addition, in the second block G2, a hydrophobization treatment device for performing hydrophobization treatment to improve the fixing property of the resist liquid to the wafer W and a peripheral exposure device for exposing the outer peripheral portion of the wafer W are arranged in the vertical direction ( Figure 2 the Z direction) and the horizontal direction, and these devices are not shown. The number and arrangement of these heat treatment devices, hydrophobization treatment devices, and peripheral exposure devices can also be arbitrarily selected.

[0041] As Figure 1 shown, a wafer transfer area 32 is formed in the area sandwiched by the first block G1 and the second block G2 in a plan view. A wafer transfer device 33 is arranged in the wafer transfer area 32, for example.

[0042] The wafer transfer device 33 has a transfer arm that is movable, for example, in the X direction, Y direction, θ direction, and vertical direction. The wafer transfer device 33 can move within the wafer transfer area 32 and transfer the wafer W to a specified device within the surrounding first block G1, second block G2, third block G3, and fourth block G4. As Figure 1 shown, in the case where there are multiple processing stations 3, the wafer transfer device 33 provided in the processing station 3 located on the interface station 4 side can transfer the wafer W not only to the specified devices within the first, second, and fourth blocks G1, G2, G4, but also to the specified devices within the fifth block G5 described later.

[0043] Multiple wafer transfer devices 33 are arranged, for example, vertically. One wafer transfer device 33 can transfer the wafer W to a specified device at the height of the upper multiple layers 31 among the multiple layers 31 (refer to Figure 2 ) that are stacked vertically. For the specified devices at the height of the multiple layers 31 located at positions lower than these layers 31, other wafer transfer devices 33 can transfer the wafer W. Multiple wafer transfer areas 32 are provided in such a way that such transfer of the wafer W can be performed. In addition, the wafer transfer device 33 and the like are provided for each layer 31, and the number of wafer transfer devices 33 and the number of layers 31 corresponding to one wafer transfer device 33 can be arbitrarily selected.

[0044] In addition, a reciprocating transfer device (not shown) may be provided in the wafer transfer area 32 or the first block G1 and second block G2. The reciprocating transfer device linearly transfers the wafer W between the space adjacent to the processing station 3 side and the other space adjacent to the opposite side.

[0045] A fifth block G5 including a plurality of transfer devices, and wafer transfer devices 41 and 42 are provided in the interface station 4. The interface station 4 transfers the wafer W using the wafer transfer device 41 or 42 between the fifth block G5 where the wafer W is transferred by the wafer transfer device 33 and the exposure device. Therefore, each of the wafer transfer devices 41 and 42 includes a drive mechanism in directions such as the X direction, Y direction, vertical direction, and around the vertical axis (θ direction) as needed, and may have a drive mechanism in all directions. At least one of the wafer transfer devices 41 and 42 can support the wafer W and transfer the wafer W between the transfer device within the fifth block G5 and the exposure device.

[0046] The cleaning device for cleaning the surface of the wafer W and the above-mentioned peripheral exposure device may also be provided within the interface station 4 at a position accessible by either of the wafer transfer devices 41 and 42.

[0047] As described above, the inspection device can be provided in the cassette station 2, but can also be provided in any transfer arm within the processing station 3 and the interface station 4 respectively. Figure 1or Figure 2 accessible positions among 33, 41, 42 in Figure 2 .

[0048] In the above wafer processing system 1, a control device 100 is provided. The control device 100 is, for example, a computer and has a program storage section (not shown). A program for controlling the processing of the wafer W in the wafer processing system 1 is stored in the program storage section. In addition, a program for controlling the operation of the drive systems of the various processing devices, transfer devices, etc. described above to implement the wafer processing in the wafer processing system 1 is also stored in the program storage section. Further, the above program may also be recorded on a computer-readable storage medium H and installed from the storage medium H into the control device 100.

[0049] (Wafer Processing System)

[0050] The wafer processing system 1 is configured as described above. Next, an example of wafer processing performed using the wafer processing system 1 configured as described above will be described.

[0051] First, a cassette C containing a plurality of wafers W is sent into the cassette station 2 of the wafer processing system 1 and placed on the cassette mounting table 21. Next, each wafer W in the cassette C is sequentially taken out by the wafer transfer device 22 or 23 and transferred to the transfer device in the third block G3.

[0052] The wafer W transferred to the transfer device in the third block G3 is supported by the wafer transfer device 33 and transferred to the hydrophobization treatment device provided in the second block G2 for hydrophobization treatment. Next, it is transferred by the wafer transfer device 33 to the resist film forming device to form a resist film on the wafer W, and then the wafer W is transferred to the heat treatment device for pre-baking treatment, and then transferred to the transfer device in the fifth block G5. In addition, in the case where there are multiple processing stations 3 as in Figure 1 , Figure 2 the wafer W is temporarily placed at the transfer device in the fourth block G4 before being transferred to the transfer device in the fifth block G5, and then the transfer with the multiple wafer transfer devices 33 is performed. Additionally, the wafer W may be transferred to the peripheral exposure device by the wafer transfer device 33 as needed to perform exposure treatment on the peripheral portion of the wafer W.

[0053] The wafer W transferred to the transfer device in the fifth block G5 is transferred by the wafer transfer devices 41 and 42 to the exposure device for exposure treatment with a specified pattern. In addition, the wafer W may be cleaned by the cleaning device before the exposure treatment.

[0054] The wafer W after the exposure treatment is transferred by the wafer transfer devices 41 and 42 to the transfer device in the fifth block G5. After that, the wafer W is transferred by the wafer transfer device 33 to the heat treatment device for post-exposure baking treatment.

[0055] After exposure and baking, the wafer W is transported by the wafer transfer device 33 to the development processing device for development. After the development is completed, the wafer W is transported by the wafer transfer device 33 to the heat treatment device 40 for post-baking treatment.

[0056] After that, the wafer W is transported by the wafer transfer device 33 to the transfer device in the third block G3, and is transported by the wafer transfer device 22 or 23 of the cassette station 2 to the cassette C on the specified cassette mounting table 21. Thus, a series of lithography steps are completed.

[0057] In addition, the wafer processing system in the present invention is not limited to the structure and operation described above. For example, in the above embodiment, the situation of transferring the wafer W between the interface station 4 and the exposure device is described, but it may not be directly connected to the exposure device. In this case, for example, after the wafer W is transported from the cassette station 2 to the processing station 3 and necessary processing is performed, it is transported back to the cassette station 2 for output to the outside. Additionally, unnecessary devices among the devices exemplified as processing devices may not be provided, or the processing in such devices may not be performed.

[0058] (Substrate processing device)

[0059] Figure 3 is a top view illustrating the substrate processing device 50, Figure 4 is a cross-sectional view taken along the Figure 3 line IV-IV in. The substrate processing device 50 is included in the wafer processing system 1. For example, the substrate processing device 50 includes the above-described film forming device 50A for patterning.

[0060] The film forming device 50A for patterning has a chamber 60A, a rotation holding portion 71, a cup-shaped body 72, and a liquid supply portion 73. The chamber 60A has a storage space A1 for storing the wafer W (a semiconductor wafer: an example of a substrate). For example, the chamber 60A has a top plate 61, a bottom plate 62, a peripheral wall 63, an opening / closing member 66, and an exhaust port 67. The top plate 61 extends horizontally above the storage space A1. The bottom plate 62 extends horizontally below the storage space A1. The peripheral wall 63 surrounds the storage space A1 between the top plate 61 and the bottom plate 62 and connects the top plate 61 and the bottom plate 62.

[0061] The peripheral wall 63 includes a partition wall 64 that separates the storage space A1 from the peripheral space PA1. For example, the peripheral wall 63 includes a pair of partition walls 64A, 64B and a pair of partition walls 64C, 64D. The partition walls 64A, 64B face each other with the storage space A1 therebetween. The pair of partition walls 64C, 64D face each other with the storage space A1 therebetween in a direction crossing (e.g., orthogonal to) the direction in which the partition walls 64A, 64B sandwich the storage space A1.

[0062] The partition wall 64 is formed with an opening 65 for the wafer W to pass through when it is transferred from the peripheral space PA1 to the storage space A1 and when it is transferred from the storage space A1 to the peripheral space PA1. For example, the opening 65 is formed in the partition wall 64A. The opening and closing member 66 is driven by, for example, an electric motor, and is raised and lowered to open and close the opening 65.

[0063] The exhaust port 67 opens in the storage space A1 and sends the gas (an example of fluid) in the storage space A1 to the outside of the chamber 60A. As a result, the storage space A1 is ventilated, and the vaporized products generated during the processing of the wafer W are discharged to the outside of the chamber 60A.

[0064] The rotating holding part 71 supports and absorbs the horizontally arranged wafer W from below, and is driven by an electric motor or the like to rotate around a vertical axis. The liquid supply part 73 supplies a processing liquid to the wafer W stored in the storage space A1. Examples of the processing liquid include, for example, a film-forming liquid for forming a patterned film. Examples of the film-forming wall include, for example, a resist liquid containing a negative or positive resist material.

[0065] For example, the liquid supply unit 73 includes a nozzle 74 and a nozzle conveying device 75. The nozzle 74 opens downward and is disposed above the rotating holding unit 71 to release the processing liquid to the wafer W held by the rotating holding unit 71. The nozzle conveying device 75 is driven by an electric motor or the like to move the nozzle 74 in the horizontal direction. The nozzle conveying device 75 may also be configured to move the nozzle 74 in addition to being able to move in the horizontal direction.

[0066] The cup-shaped body 72 opens upward and accommodates the wafer W held by the rotating holding part 71. The cup-shaped body 72 recovers the processing liquid thrown off the wafer W, for example, by the rotation of the rotating holding part 71 and the wafer W. The cup-shaped body 72 has an exhaust port 76. The exhaust port 76 opens in the cup-shaped body 72 and sends the gas in the cup-shaped body 72 to the outside of the cup-shaped body 72. In this way, the inside of the cup-shaped body 72 is ventilated, and the vaporized products generated in the processing of the wafer W are discharged to the outside of the cup-shaped body 72. For example, the exhaust port 76 opens at the bottom of the cup-shaped body 72.

[0067] ​​Using the exhaust port 67 and the exhaust port 76, a gas flow (an example of a fluid flow) is formed in the storage space A1. For example, when the gas in the storage space A1 is sent out of the chamber 60A through the exhaust port 67, a gas flow is formed in the storage space A1 that enters the storage space A1 from the opening 65 and exits the chamber 60A through the exhaust port 67. When the gas in the cup-shaped body 72 is sent out of the cup-shaped body 72 by the exhaust port 76, a gas flow is formed in the storage space A1 that enters the cup-shaped body 72 from above and exits the cup-shaped body 72 through the exhaust port 76. The fluid flow generated in the storage space A1 may affect the processing of the wafer W. For example, the gas flow in the storage space A1 of the patterning film forming apparatus 50A may affect the film thickness uniformity of the patterning film formed on the wafer W, etc.

[0068] In order to control the influence brought by the fluid flow, it is necessary to visualize the distribution of the fluid flow. Therefore, the substrate processing apparatus 50 further includes a camera 81 and a pattern 82. The camera 81 faces the storage space A1 in the chamber 60A.

[0069] The camera 81, for example, has an image sensor such as a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS), and an optical system that forms an image of the light from the viewing direction on the image sensor. The image sensor includes a plurality of pixels arranged in a matrix.

[0070] The pattern 82 is set to be displayed at least within the field of view of the camera 81 and can be photographed by the camera 81 through the storage space A1. The pattern 82 changes the image photographed by the camera 81 through the schlieren effect. For example, the pattern 82 changes the image photographed by the camera 81 according to the change in the refractive index of the fluid in the storage space A1.

[0071] For example, when the refractive index of the fluid in the storage space A1 changes, the incident position of the light from the pattern 82 to the camera 81 changes. Therefore, the shape of the pattern 82 photographed by the camera 81 may change locally. Assuming that there is no pattern 82, no change in the shape of the pattern 82, etc. will occur in the image photographed by the camera 81. Therefore, in the presence of the pattern 82, it can be considered that the pattern 82 causes the following change in the image, that is, the change in the image generated according to the change in the refractive index of the fluid in the storage space A1.

[0072] The refractive index of a fluid is related to the density of the fluid. The density of the fluid changes according to the flow of the fluid. Therefore, the refractive index of the fluid in the storage space A1 is also related to the flow of the fluid in the storage space A1. For example, in a part of the storage space A1 where there is a flow of fluid (hereinafter referred to as the "flow part"), the refractive index of the fluid changes due to the flow of the fluid. On the other hand, in a part of the storage space A1 where there is no flow of fluid (hereinafter referred to as the "stationary part"), the refractive index of the fluid does not change. Therefore, the imaging position of the part of the pattern 82 that is incident on the camera 81 via the stationary part does not change. In contrast, the imaging position of the part of the pattern 82 that is incident on the camera 81 via the flow part changes. As a result, in the image captured by the camera 81, the distribution of the flow of the fluid in the storage space A1 is visualized as local changes such as the shape of the pattern 82. In this way, through the schlieren effect, the changes in the image corresponding to the flow of the fluid are clarified by the pattern 82, so that the distribution of the flow of the fluid in the storage space A1 can be clearly visualized.

[0073] As Figure 5 illustrated, the pattern 82 may also include a plurality of unit patterns (motif) 83 that are arranged dispersedly within the field of view of the camera 81. The changes in the image caused by the schlieren effect are further clarified by the plurality of unit patterns 83. Therefore, the distribution of the flow of the fluid within the substrate processing apparatus 50 can be visualized more clearly.

[0074] For example, the plurality of unit patterns 83 are arranged two-dimensionally. As a two-dimensional arrangement, a matrix-like arrangement in which the patterns are arranged in row and column directions perpendicular to each other can be cited, but it is not limited thereto. For example, the plurality of unit patterns 83 may be arranged in a staggered lattice pattern or in a honeycomb pattern.

[0075] The unit pattern 83 is a constituent unit of the pattern 82. The shape and size of the unit pattern 83 are not particularly limited. For example, the unit pattern 83 may be circular, rectangular, or a polygon such as a hexagon. The plurality of unit patterns 83 may also include two or more unit patterns 83 that are different from each other in at least any one of shape, size, and color. The shapes, sizes, and colors of the plurality of unit patterns 83 may also be the same. The plurality of unit patterns 83 may be in contact with each other or separated from each other.

[0076] The plurality of unit patterns 83 may be arranged at a constant pitch or at an irregular pitch. The pitch is, for example, the center-to-center distance. For example, in the case where the plurality of unit patterns 83 are arranged in a matrix-like pattern, the pitch of the plurality of unit patterns 83 in the row direction may be constant, and the pitch of the plurality of unit patterns 83 in the column direction may be constant.

[0077] The plurality of unit patterns 83 and the plurality of unit patterns 83 can also be distinguished from each other by mutually different colors. For example, it can be that the plurality of unit patterns 83 are white and the plurality of unit patterns 83 are black with respect to each other. Conversely, it can also be that the plurality of unit patterns 83 are black and the plurality of unit patterns 83 are white with respect to each other.

[0078] In Figure 5 In the illustrated pattern 82, a plurality of unit patterns 83 that are identical to each other in shape, size, and color are arranged in a matrix at a certain pitch P1. Each of the plurality of unit patterns 83 is rectangular and is separated from each other by lattice-shaped lines 84. The lines 84 between the plurality of unit patterns 83 and the plurality of unit patterns 83 are distinguished from each other by mutually different colors. For example, the plurality of unit patterns 83 are white and the lines 84 are black.

[0079] The pattern 82 can also be formed by the unevenness on the surface. For example, it can also be that the plurality of unit patterns 83 are recessed portions and the plurality of unit patterns 83 are convex portions with respect to each other, and the plurality of unit patterns 83 and the plurality of unit patterns 83 are distinguished from each other by the light and shade formed by the unevenness. Conversely, it can also be that the plurality of unit patterns 83 are convex portions and the plurality of unit patterns 83 are recessed portions with respect to each other, and the plurality of unit patterns 83 and the plurality of unit patterns 83 are distinguished from each other. The pattern 82 can also be formed by a combination of the unevenness on the surface and the color.

[0080] Return Figure 4 , the pattern 82 can also be provided on the partition wall 64 that separates the storage space A1 from the peripheral space PA1. A wide pattern can be provided using the partition wall to generate map data for a wide range. The pattern 82 being provided on the partition wall 64 includes two methods: a method of providing the pattern 82 by applying painting, processing, etc. to the partition wall 64 itself, and a method of installing a panel or the like provided with the pattern 82 on the partition wall 64.

[0081] For example, the pattern 82 is provided on the partition wall 64C or the partition wall 64D adjacent to the partition wall 64A formed with the opening 65. In Figure 4 In this case, the pattern 82 is provided on the partition wall 64D, and a camera 81 is provided on the partition wall 64C in a manner facing the pattern 82 through the storage space A1, but it is not limited to this. It is also possible to provide the pattern 82 on the partition wall 64D and the camera 81 on the partition wall 64C.

[0082] The wafer processing system 1 may further include an image processing device 200. The image processing device 200 generates map data representing the distribution of the flow of the fluid in the storage space A1 based on the change in the image of the pattern 82 captured by the camera 81. The distribution of the flow of the fluid is, for example, the relationship between the position in the storage space A1 (the position within the image captured by the camera 81) and the state of the flow of the fluid (for example, at least any one of the flow velocity, the flow rate, and the flow direction). The distribution of the flow of the fluid may also be the relationship between the position in the storage space A1 and the density of the fluid.

[0083] By digitizing the change data of the image generated according to the flow of the fluid by utilizing the schlieren effect, filtering processing, enhancement processing, etc. can be performed. Therefore, it is effective for making the distribution of the flow of the fluid more clearly visible.

[0084] For example, the image processing device 200 has an image generation unit 211 and an image storage unit 212 as functionally configured elements (hereinafter referred to as "functional blocks").

[0085] The image generation unit 211 generates map data representing the distribution of the flow of the fluid in the storage space A1 based on the change in the image of the pattern 82 captured by the camera 81. The image generation unit 211 may also generate map data based on the difference between a reference image and an evaluation image, where the reference image is an image obtained by the camera 81 capturing the storage space A1, and the evaluation image is an image captured by the camera 81 at a timing when the distribution of the flow of the fluid is different from the timing of capturing the reference image. By based on the difference between the reference image and the evaluation image, the change in the image of the pattern 82 is made clear. Thereby, map data that more clearly represents the distribution of the flow of the fluid in the storage space A1 is generated.

[0086] For example, the image generation unit 211 acquires a reference image from the camera 81 at a specified first timing and stores it in the image storage unit 212. Thereafter, the image generation unit 211 acquires an evaluation image from the camera 81 at a specified second timing and calculates the difference between the reference image stored in the image storage unit 212 and the evaluation image. For example, the image generation unit 211 calculates the difference between the reference image and the evaluation image for each pixel of the camera 81. For example, the image generation unit 211 calculates the difference between the pixel value in the reference image and the pixel value in the evaluation image for each pixel. High-precision map data representing the distribution of the flow in pixel units can be generated. The pixel value is, for example, a numerical value representing brightness. For example, the image generation unit 211 generates matrix data representing the difference between the pixel value in the reference image and the pixel value in the evaluation image for each pixel of the camera 81 as map data.

[0087] The first timing is preset, for example, during a period when the fluid in the storage space A1 does not flow or the flow of the fluid in the storage space A1 is very small. The first timing can also be preset during a period when there is no flow of the fluid in the storage space A1 to the wafer W or the flow of the fluid in the storage space A1 to the wafer W is very small. As an example, the first timing can also be set during a period when exhaust is performed from the exhaust port 67 but not from the exhaust port 76.

[0088] The second timing is preset during a period when the flow of the fluid in the storage space A1 is large (e.g., the flow rate is fast) compared to the period when the first timing is set. The second timing is preset during a period when the flow of the fluid in the storage space A1 to the wafer W is large (e.g., the flow rate is fast) compared to the period when the first timing is set. As an example, the second timing can also be set during a period when the processing liquid is supplied to the wafer W while exhausting from the exhaust port 76.

[0089] As described above, when the second timing (the acquisition timing of the evaluation image) is set during the period of supplying the processing liquid to the wafer W, the image generation unit 211 generates image data representing the distribution of the flow of the fluid (gas) in a state where the processing liquid is attached to the wafer W. The image data generated in a state where the processing liquid is attached to the wafer W is useful for analyzing the influence of the gas in the storage space A1 on the processing liquid.

[0090] In addition, the vaporized matter from the processing liquid can change the refractive index of the gas. Therefore, the difference in refractive index becomes larger between the part where the vaporized matter is removed by the fluid and the part where the vaporized matter remains. Thus, the change in refractive index caused by the flow becomes larger due to the difference in the content of the vaporized matter, and the change in the image caused by the schlieren effect can be further clarified.

[0091] The camera 81 can also repeatedly capture the evaluation image. The image generation unit 211 can also generate image data each time the camera 81 captures the evaluation image. When repeatedly generating the image data, the reference image is repeatedly used. In the case of repeatedly using the reference image, due to sudden position offsets of the camera 81, etc., the conditions that should be the same when capturing the reference image and the evaluation image may differ. When such a condition difference occurs, it is impossible to identify whether the difference between the evaluation image and the reference image is caused by the condition difference or by the distribution of the flow. Therefore, it may also be difficult to grasp the distribution of the flow based on the image data.

[0092] Therefore, the image generation unit 211 can also update the reference image based on a plurality of evaluation images obtained by repeatedly photographing the evaluation image with the camera 81, and generate image data based on the difference between the updated reference image and the evaluation image captured after the reference image is updated. Even when a sudden positional shift or the like of the camera 81 occurs, by updating the reference image, the above-mentioned conditional difference can be maintained at a low level. Therefore, it is possible to continuously generate image data that is easy to grasp the distribution of the flow.

[0093] For example, each time the image generation unit 211 generates image data based on the difference between the reference image and the evaluation image, it can update the reference image based on the evaluation image that has been used (used in the generation of the image data). For example, the image generation unit 211 can generate a weighted average of the reference image and the evaluation image as a new reference image. The weights of the reference image and the evaluation image are preset through preliminary experiments or the like.

[0094] The image processing apparatus 200 further includes an image display unit 213 as a functional block. The image display unit 213 causes an image representing the distribution of the flow of the fluid in the storage space A1 to be displayed on a display device (such as the display device of the user interface 296 described later) or the like based on the image data. For example, the image display unit 213 performs enhancement processing, filtering processing, etc. on the image data to generate display data, and displays the image based on the display data. For example, the image display unit 213 displays an image representing the flow state in color for each part of the image of the pattern 82.

[0095] Figure 6 It is a diagram obtained by magnifying a part of the reference image and the evaluation image. (a) is the reference image, and (b) is the evaluation image. As Figure 6 shown, the camera 81 has a plurality of pixels 87. The plurality of pixels 87 are arranged in a matrix at a pitch P2. The arrangement pitch (the above-mentioned pitch P1) of the plurality of unit patterns 83 in the image of the pattern 82 can also be larger than the arrangement pitch (pitch P2) of the plurality of pixels 87.

[0096] In Figure 6 the reference image 300, the line 84 between the unit patterns 83 is imaged on the pixels 87A, 87B, 87C, 87D, and not imaged on the pixels 87E, 87F, 87G, 87H. In Figure 6In the evaluation image 400, due to the schlieren effect, the imaging position of line 84 has changed from the reference image 300. For example, in the reference image 300, the part imaged at pixel 87C involves both pixels 87C and 87G in the evaluation image 400. In addition, the part imaged at pixel 87D in the reference image 300 has completely moved to pixel 87H. In this example, at least in pixels 87C, 87D and pixels 87G, 87H, the difference in pixel values between the reference image 300 and the evaluation image 400 becomes larger. Therefore, it indicates that a fluid flow has occurred in the area where at least the parts imaged at pixels 87C, 87D and pixels 87G, 87H pass through.

[0097] Return Figure 4 , the substrate processing apparatus 50 may further include a temperature adjustment unit 85. The temperature adjustment unit 85 makes the temperature of the fluid in the accommodation space A1 different from that at the time of capturing the reference image (e.g., the above-mentioned first timing) at the timing of capturing the evaluation image (e.g., the above-mentioned second timing). For example, the temperature adjustment unit 85 heats or cools the fluid upstream of the fluid flow generated in the accommodation space A1. For example, when the exhaust port 76 opens into the cup-shaped body 72 at the lower part of the cup-shaped body 72, the upper part of the cup-shaped body 72 can be the upstream of the fluid flow. In this case, the temperature adjustment unit 85 may also heat or cool the fluid above the cup-shaped body 72.

[0098] When the fluid is heated or cooled upstream of the flow, the temperature difference between the heated or cooled fluid flowing into the part where the flow is generated and the part where no flow is generated becomes larger. Therefore, the refractive index difference between the part where the flow is generated and the part where no flow is generated is enlarged due to the temperature difference. In this way, by using the temperature difference to increase the change in refractive index caused by the flow, the change in the image caused by the schlieren effect can be further clarified.

[0099] The temperature adjustment unit 85 may also be configured to have a thermoelectric element provided in the flow path of the fluid, and electric power can be supplied to the thermoelectric element to change the temperature of the fluid. The thermoelectric element is an element that heats or cools the surrounding area by supplying electric power. As an example of the thermoelectric element, a Peltier element etc. can be cited. The temperature adjustment unit 85 can be easily turned on / off.

[0100] The temperature adjustment unit 85 only needs to be configured to be able to heat or cool at least the fluid flowing within the generation range of the image data, and does not have to be arranged above the cup-shaped body 72. The temperature adjustment unit 85 may also be arranged within the field of view of the camera 81.

[0101] The substrate processing apparatus 50 may also include an addition unit 86 instead of the temperature adjustment unit 85, or may include the addition unit 86 in addition to the temperature adjustment unit 85. The addition unit 86 supplies an additive that changes the refractive index to the fluid in the accommodation space A1 at the timing of capturing the evaluation image (for example, the second timing described above). Examples of the additive include vaporized organic solvents (for example, vaporized acetone). For example, the addition unit 86 supplies the additive to the fluid upstream of the flow of the fluid generated in the accommodation space A1. For example, the addition unit 86 supplies the additive to the fluid above the cup-shaped body 72.

[0102] When the additive is supplied to the fluid upstream of the flow, the difference in the content of the additive between the portion where the fluid containing the additive flows into the portion where the flow is generated and the portion where no flow is generated becomes larger. Therefore, the difference in the refractive index between the portion where the flow is generated and the portion where no flow is generated is widened due to the difference in the content of the additive. In this way, by increasing the change in the refractive index caused by the flow by using the difference in the content of the additive, the variation in the image caused by the schlieren effect can be further clarified.

[0103] Figure 7 It is a top view showing a modified example of the substrate processing apparatus. As Figure 7 shown, the pattern 82 may also be provided on a surface F1 inclined with respect to a surface VP1 perpendicular to the optical axis OAx of the camera 81. For example, the optical axis OAx of the camera 81 may be inclined with respect to the normal of the inner surface of the partition wall 64D on which the pattern 82 is provided.

[0104] Even when the plurality of unit patterns 83 are arranged uniformly and at a constant pitch, the sizes can be made different between the plurality of unit patterns in the image of the pattern 82. In the image of the pattern 82, by making the sizes different between the plurality of unit patterns, the variation in the image caused by the schlieren effect can be further clarified.

[0105] Figure 8 It is a cross-sectional view showing another modified example of the substrate processing apparatus. As Figure 8As shown, the substrate processing apparatus 50 may also include a projection device 88 instead of the pattern 82. The projection device 88 projects the pattern 82 onto the projection surface F2. The surface F2 is arranged to be presented within the field of view of the camera 81 and is arranged to be able to be photographed by the camera 81 via the accommodation space A1. For example, when the camera 81 is provided on the partition wall 64C, the surface F2 is provided on the inner surface of the partition wall 64D. The projection device 88 may also be configured to project the pattern 82 onto the surface F2 via the accommodation space A1. For example, the projection device 88 is provided on the partition wall 64C and projects the pattern 82 onto the surface F2 of the partition wall 64D via the accommodation space A1. The setting that includes the projection device 88 that projects the pattern 82 onto the surface F2 prepared for projection instead of including the pattern 82 is also included in the setting that includes the pattern 82.

[0106] By using the projection device 88, it is possible to easily set the pattern 82 compared to always setting the pattern 82. In addition, deterioration of the pattern 82 caused by a processing liquid or the like can also be suppressed.

[0107] The projection device 88 may also project the pattern 82 onto the surface F2 via the space A31 between the area for projecting the pattern 82 in the surface F2 and the camera 81. The light emitted from the projection device 88 is refracted twice when passing through the space A31 on the way to the surface F2 and when passing through the space A31 on the way to the camera 81. As a result, compared with the case where the camera 81 photographs the pattern 82 fixed to the surface F2, the change in the pixel value caused by refraction becomes larger. Therefore, it is possible to generate image data that represents the distribution of the flow with higher sensitivity.

[0108] For example, the projection device 88 may also project the pattern 82 onto the surface F2 via the space within the field of view of the camera 81. The projection device 88 may be configured such that the light from the projection device 88 to the surface F2 and the light from the surface F2 to the camera 81 pass through the common space A31. The angle formed by the central axis of the light emitted from the projection device 88, i.e., the optical axis OAx1, and the central axis of the light incident on the camera 81, i.e., the optical axis OAx2, may be 30° or less, may be 20° or less, or may be 10° or less.

[0109] The camera 81 may also be fixed relative to the projection device 88. The camera 81 being fixed relative to the projection device 88 means fixing the position of the camera 81 by holding the camera 81 with the projection device 88. For example, in Figure 8 In the case where the projection device 88 fixed to the partition wall 64C has the camera 81 arranged thereon, the camera 81 is held by the projection device 88. By suppressing the relative vibration of the camera 81 with respect to the pattern 82, it is possible to further clarify the fluctuation of the image caused by the schlieren effect.

[0110] The surface F2 may also have a tone and texture that clarify the pattern 82 projected by the projection device 88. The surface F2 can be formed by pasting a sheet on the partition wall 64D or the like, or can be formed by applying coating or processing to the partition wall 64D itself.

[0111] The configurations of the camera 81 and the pattern 82 are not limited to the configurations exemplified above, and can be arbitrarily changed as long as the pattern 82 can be photographed by the camera 81 via the storage space A1. Figure 9 Indicates Figure 3 A modification of the configurations of the camera 81 and the pattern 82 in Figure 9 The storage space A2 in

[0112] In Figure 9 In

[0113] As described above, the case where the camera 81 and the pattern 82 are provided in the patterning film forming apparatus 50A has been exemplified, but the processing apparatus provided with the camera 81 and the pattern 82 is not limited to the patterning film forming apparatus 50A. Figure 10 Is a top view exemplifying the case where the camera 81 and the pattern 82 are provided in the heat treatment apparatus. Figure 10 The substrate processing apparatus 50 shown

[0114] The heat treatment apparatus 50B has a chamber 60B and a hot plate 77. The chamber 60B has a storage space A11 for storing the wafer W. The chamber 60B has a top plate 61, a bottom plate 62, a peripheral wall 63, an opening / closing member 66, and an exhaust port 67 in the same manner as the chamber 60A. An opening 65 is formed in the partition wall 64 of the peripheral wall 63. The substrate processing apparatus 50 has a storage space A12 connected to the storage space A11 via the opening 65. The hot plate 77 supports the wafer W in the storage space A11 and heats it using a heater.

[0115] In Figure 10In [the structure], the camera 81 and the pattern 82 are arranged near the opening 65 in the accommodation space A12 with the opening 65 therebetween. The image generation unit 211 may also generate image data representing the distribution of the flow of the fluid around the opening 65 in a state where there is a temperature difference between the fluid in the accommodation space A12 and the fluid in the accommodation space A11 (the second accommodation space). For example, the image generation unit 211 acquires a reference image in a state where the opening 65 is closed by the opening / closing member 66. In a state where the opening 65 is closed by the opening / closing member 66, the accommodation space A11 is heated by the hot plate 77, so there is a temperature difference between the fluid in the accommodation space A11 and the fluid in the accommodation space A12. After the opening / closing member 66 opens the opening 65 in this state, the image generation unit 211 acquires an evaluation image and generates image data based on the difference between the reference image and the evaluation image.

[0116] In the accommodation space A12, the temperature difference between the part where the fluid heated by the hot plate 77 flows into to generate the flow from the opening 65 and the part where no flow is generated becomes larger. Therefore, the difference in refractive index between the part where the flow is generated and the part where no flow is generated is enlarged due to the temperature difference. Therefore, it is possible to further clarify the change in the image caused by the schlieren effect and clearly visualize the flow of the fluid between the accommodation space A11 and the accommodation space A12. In this structure, it can also be said that the hot plate 77 functions as the above-described temperature adjustment unit 85.

[0117] The substrate processing apparatus 50 may also be included in another substrate processing system different from the wafer processing system 1. For example Figure 11 The substrate processing apparatus 50 shown includes a gas processing apparatus 50C of another substrate processing system. The gas processing apparatus 50C is a device that supplies a processing gas such as an etching gas to the wafer W.

[0118] The gas processing apparatus 50C has a chamber 60C and a gas supply unit 78. The chamber 60C has an accommodation space A21 for accommodating the wafer W. The chamber 60C has a top plate 61, a bottom plate 62, and a peripheral wall 63 in the same manner as the chamber 60A.

[0119] The gas supply unit 78 supplies the processing gas from above toward the wafer W accommodated in the accommodation space A21 and held horizontally. In Figure 11 [the structure], the camera 81 and the pattern 82 are respectively provided in partition walls 64C, 64D that face each other in the partition wall 64 of the peripheral wall 63. The image generation unit 211 generates image data representing the distribution of the flow of the processing gas as the distribution of the flow of the fluid. For example, the image generation unit 211 acquires a reference image in a state where the processing gas is not supplied from the gas supply unit 78. The image generation unit 211 acquires an evaluation image after starting to supply the processing gas from the gas supply unit 78 and generates image data based on the difference between the reference image and the evaluation image.

[0120] According to Figure 11 The substrate processing apparatus 50 can generate image data useful for analyzing the supply state of the processing gas supplied to the wafer W. In the storage space A21, the processing gas flows into a part where the flow from the gas supply unit 78 is generated, and there is more processing gas between the part where the flow is not generated (compared to the part where the flow is not generated). Therefore, the difference in refractive index between the part where the flow is generated and the part where the flow is not generated expands according to the amount of the processing gas. Therefore, it is possible to further clarify the change in the image caused by the schlieren effect and clearly visualize the flow of the processing gas. In this structure, it can also be said that the gas supply unit 78 functions as the above-described addition unit 86.

[0121] The image processing apparatus 200 may also be configured to be able to perform at least any one of filtering processing and enhancement processing of the image data using two-dimensional orthogonal polynomials. For example, as Figure 12 shown, the image processing apparatus 200 may further include an expansion unit 221, a coefficient change unit 222, and a reconstruction unit 223 as functional blocks. The expansion unit 221 expands the image data into a series of multiple components each represented by a two-dimensional orthogonal polynomial. For example, each of the multiple components is matrix data having the same number of rows and columns as the image data. The series refers to data obtained by weighted summation (weighted addition) of the multiple components. The weights (coefficients) of each of the multiple components are set so that the result of the summation is consistent with the image data.

[0122] The coefficient change unit 222 changes the coefficients of one or more change target components among the multiple components in the series. For example, in the case of filtering processing, one or more components that should be reduced in the filtering processing among the multiple components are one or more change target components, and the coefficient change unit reduces the coefficients of the one or more change target components. In the case of enhancement processing, one or more components that should be increased in the enhancement processing among the multiple components are one or more change target components, and the coefficient change unit increases the coefficients of the one or more change target components.

[0123] The reconstruction unit 223 reconstructs the image data based on the series in which the coefficients of one or more change target components are changed. For example, the reconstruction unit 223 reconstructs the image data by weighted summation of the multiple components.

[0124] The two-dimensional orthogonal polynomial is a two-dimensional Legendre polynomial. Figure 13 is a schematic diagram illustrating multiple components each of which is a two-dimensional Legendre polynomial. The multiple components include a component LP0 that does not form a pattern, multiple components LP1 that form a vertical stripe pattern, multiple components LP2 that form a horizontal stripe pattern, and multiple components LP3 that are a synthesis of the vertical stripe pattern and the horizontal stripe pattern.

[0125] For example, in a case where the flow of a fluid is likely to occur in the vertical direction, the coefficient changing unit 222 may also use at least any one of the plurality of components LP1 as one or more components to be changed, and increase the coefficients of the one or more components to be changed. Thereby, it is easy to emphasize the distribution of the fluid flow. In addition, the coefficient changing unit 222 may also use at least any one of the plurality of components LP2 as one or more components to be changed, and decrease the coefficients of the one or more components to be changed. Thereby, the horizontal stripe pattern that has a weak relationship with the fluid flow is reduced, and thus the distribution of the fluid flow can be grasped more easily.

[0126] The two-dimensional orthogonal polynomial does not have to be limited to the two-dimensional Legendre polynomial. The two-dimensional orthogonal polynomial may be, for example, a two-dimensional Chebyshev polynomial.

[0127] Figure 14 is a block diagram illustrating the hardware configuration of the image processing apparatus 200. As Figure 14 shown, the image processing apparatus 200 includes a circuit 290. The circuit 290 includes a processor 291, a memory 292, a storage 293, an image processing circuit 294, a switching circuit 295, and a user interface 296.

[0128] The storage 293 includes, for example, one or more non-volatile storage media. Examples of the non-volatile storage media include a hard disk drive, a solid state drive, a flash memory, etc. The non-volatile storage media may also include a removable storage medium such as an optical disc. The storage 293 stores a program for causing the image processing apparatus 200 to execute a process of generating map data representing the distribution of the fluid flow based on the change in the image of the pattern 82 captured by the camera 81. For example, the storage 293 stores a program for causing the image processing apparatus 200 to constitute each of the above functional blocks.

[0129] The memory 292 includes one or more volatile storage media. Examples of the volatile storage media include a random access memory. The memory 292 temporarily stores the program loaded from the storage 293. The processor 291 includes one or more arithmetic devices. Examples of the arithmetic devices include a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit). The processor 291 causes the processing apparatus 200 to constitute each of the above functional block images by executing the program loaded into the memory 292. The processor 291 may also cause the memory 292 to temporarily store the calculation result.

[0130] The image processing circuit 294 causes the camera 81 to perform shooting according to a request from the processor 291, and acquires the captured image from the camera 81. The switch circuit 295 causes the projection device 88 to start or stop projecting the pattern 82 according to a request from the processor 291. The user interface 296 includes one or more input devices and one or more display devices. Examples of the input device include a keyboard or a mouse. Examples of the display device include a liquid crystal monitor. The input device may also be assembled with the display device to form a touch panel. The user interface 296 outputs an input to one or more input devices and displays text, images, etc. on one or more display devices according to a request from the processor 291.

[0131] The image processing device 200 may be assembled in the control device 100 or may be assembled in hardware different from the control device 100. A network line such as a wide area network or a local area network may also be provided between the image processing device 200 and the substrate processing device 50.

[0132] (Visualization process)

[0133] As an example of the visualization method, the visualization process executed by the image processing device 200 is illustrated. This process includes: a step of acquiring an image obtained by the camera 81 facing A1 and shooting the pattern 82 via A1, where the pattern 82 is set to be presented within the field of view of the camera 81; and a step of generating map data representing the distribution of the flow of the fluid in A1 based on the change in the acquired image.

[0134] Figure 15 is a flowchart illustrating the visualization process. As Figure 15 shown, the image processing device 200 first executes steps S01, S02, S03, and S04. In step S01, the map generation unit 211 waits for the above first timing. In step S02, the map generation unit 211 causes the camera 81 to start shooting a moving image for generating a reference image. In step S03, the map generation unit 211 waits for a specified time to elapse. In step S04, the map generation unit 211 generates a reference image based on a plurality of still images constituting the moving image captured by the camera 81. For example, the map generation unit 211 generates a reference image by averaging a plurality of still images and stores it in the image storage unit 212. Thus, the reference image is acquired.

[0135] Next, the image processing apparatus 200 executes steps S05, S06, S07, and S08. In step S05, the image generation unit 211 waits for the second timing described above. In step S06, the image generation unit 211 causes the camera 81 to start capturing a moving image for generating an evaluation image. In step S07, the image generation unit 211 waits for the result for a specified time. In step S08, the image generation unit 211 generates an evaluation image based on a plurality of still images constituting the moving image captured by the camera 81. For example, the image generation unit 211 generates an evaluation image by averaging the plurality of still images and stores it in the image storage unit 212.

[0136] Next, the image processing apparatus 200 executes steps S11, S12, S13, and S14. In step S11, the image generation unit 211 generates image data based on the difference between the reference image and the evaluation image. In step S12, the image generation unit 211 performs an enhancement process on the image data. The enhancement process is, for example, a process of enlarging the difference in pixel values between pixels. In step S13, the image generation unit 211 performs a filtering process on the image data. The filtering process is a process of removing values caused by noise from the pixel values. The execution order of the enhancement process and the filtering process is not limited to this, and the enhancement process may also be performed after the filtering process.

[0137] In step S14, the image display unit 213 displays the above-mentioned image based on the image data after the enhancement process and the filtering process. Thus, the visualization process is completed.

[0138] In the case where the image processing apparatus 200 includes an expansion unit 221, a coefficient change unit 222, and a reconstruction unit 223, the expansion unit 221, the coefficient change unit 222, and the reconstruction unit 223 can execute steps S12 and S13 as described above.

[0139] Figure 16 is a flowchart showing a modification example of the visualization process, which is different from the flowchart of Figure 15 in that the generation of the evaluation image and the generation of the image data are repeated. In the flowchart of Figure 16 , steps S01 to S14 are the same as steps S01 to S14 in the flowchart of Figure 15 .

[0140] In the flowchart of Figure 16 , after the image processing apparatus 200 displays the image in step S14, it executes step S15. In step S15, the image generation unit 211 updates the reference image. For example, the image generation unit generates a weighted average of the evaluation image generated in step S08 and the reference image as a new reference image and stores it in the image storage unit 212.

[0141] Next, the image processing apparatus 200 executes step S16. In step S16, the image generation unit 211 stands by for a prescribed period of time from the start time point of step S06. After that, the image processing apparatus 200 returns the process to step S06. Thus, the generation of the evaluation image, the generation of the video data, the display of the video image, and the update of the reference image are repeatedly executed at the above-described prescribed period.

[0142] (Summary)

[0143] The embodiment exemplified above includes the following configurations.

[0144] (1) A substrate processing system 1, comprising: a substrate processing apparatus 50 having a storage space A1 for storing a substrate W; a camera 81 facing the storage space A1; a pattern 82 provided to be presented within the field of view of the camera 81 and capable of being photographed by the camera 81 via the storage space A1; and an image generation unit 211 that generates video data representing the distribution of the flow of fluid in the storage space A1 based on the change in the image of the pattern 82 photographed by the camera 81.

[0145] Due to the schlieren effect, the change in the image generated according to the flow of the fluid is clarified by the pattern 82, and thus video data clearly representing the distribution of the flow of fluid in the storage space A1 is generated. Therefore, it is possible to easily visualize the distribution of the flow of fluid in the substrate processing apparatus 50.

[0146] (2) The substrate processing system 1 according to (1), wherein the image generation unit 211 generates video data based on the difference between a reference image 300 and an evaluation image 400, the reference image 300 being an image obtained by the camera 81 photographing the storage space A1, and the evaluation image 400 being an image obtained by the camera 81 photographing at a timing when the distribution of the flow of fluid is different from the timing when the reference image 300 is photographed.

[0147] By based on the difference between the reference image 300 and the evaluation image 400, the change in the image of the pattern 82 is made clear. As a result, video data that more clearly represents the distribution of the flow of fluid in the storage space A1 is generated. Therefore, it is possible to more clearly visualize the distribution of the flow of fluid in the substrate processing apparatus 50.

[0148] (3) The substrate processing system 1 according to (2), wherein the camera 81 has a plurality of pixels 87, and the image generation unit 211 generates video data based on the difference between the pixel 87 value in the evaluation image 400 of each of the plurality of pixels 87 and the pixel 87 value in the reference image 300.

[0149] High-precision video data can be generated.

[0150] (4) The substrate processing system 1 according to any one of (1) to (3), wherein the pattern 82 includes a plurality of unit patterns 83 arranged dispersedly within the field of view of the camera 81.

[0151] The variation of the image caused by the schlieren effect is further sharpened by the plurality of unit patterns 83. Therefore, the distribution of the fluid flow within the substrate processing apparatus 50 can be visualized more clearly.

[0152] (5) The substrate processing system 1 according to (4), wherein the camera 81 has a plurality of pixels 87, and the arrangement pitch of the plurality of unit patterns 83 in the image of the pattern 82 is larger than the arrangement pitch of the plurality of pixels 87.

[0153] The generation of moiré patterns can be suppressed.

[0154] (6) The substrate processing system 1 according to (4) or (5), wherein the pattern 82 includes a plurality of unit patterns 83 arranged at a constant pitch and uniformly, and is provided on a surface inclined with respect to a surface perpendicular to the optical axis of the camera 81.

[0155] In the image of the pattern 82, by making the sizes between the plurality of unit patterns 83 different, the variation of the image caused by the schlieren effect can be further sharpened.

[0156] (7) The substrate processing system 1 according to any one of (1) to (6), wherein the pattern 82 is provided on a partition wall that separates the storage space A1 from the peripheral space PA1.

[0157] By using a wide pattern 82 provided on the partition wall, image data for a wide range can be generated.

[0158] (8) The substrate processing system 1 according to any one of (1) to (7), wherein the substrate processing system 1 further includes a projection device 88 that projects the pattern 82 onto a surface that is arranged to be presented within the field of view of the camera 81 and can be photographed by the camera 81 via the storage space A1.

[0159] The pattern 82 can be easily set. The deterioration of the pattern 82 caused by the processing liquid or the like can also be suppressed.

[0160] (9) The substrate processing system 1 according to (8), wherein the projection device 88 projects the pattern 82 onto the surface via the space A31 between the area for projecting the pattern 82 on the surface and the camera 81.

[0161] The light emitted from the projection device 88 is refracted twice, once when passing through space A31 to reach the surface and once when passing through space A31 to reach the camera 81. As a result, compared with the case where the camera 81 captures the pattern 82 fixed on the surface, the change in pixel values caused by refraction becomes larger. Therefore, it is possible to generate image data representing the distribution of the flow with higher sensitivity.

[0162] (10) The substrate processing system 1 according to (8), wherein the camera 81 is fixed to the projection device 88.

[0163] By suppressing the relative vibration of the camera 81 with respect to the pattern 82, the variation of the image caused by the schlieren effect can be further clarified.

[0164] (11) The substrate processing system 1 according to (2) or (3), further comprising a temperature adjustment unit 85 that makes the temperature of the fluid in the storage space A1 different at the timing of capturing the evaluation image 400 compared to the timing of capturing the reference image 300.

[0165] By increasing the change in refractive index caused by the flow, the variation of the image caused by the schlieren effect can be further clarified.

[0166] (12) The substrate processing system 1 according to (11), wherein the temperature adjustment unit 85 has a thermoelectric element provided in the flow path of the fluid, and electric power is supplied to the thermoelectric element to change the temperature of the fluid.

[0167] The temperature adjustment unit 85 can be easily turned on / off.

[0168] (13) The substrate processing system 1 according to any one of (2) or (3), further comprising an addition unit 86 that supplies an additive that changes the refractive index to the fluid in the storage space A1 at the timing of capturing the evaluation image 400.

[0169] By increasing the change in refractive index caused by the flow, the variation of the image caused by the schlieren effect can be further clarified.

[0170] (14) The substrate processing system 1 according to (2) or (3), wherein the camera 81 repeatedly captures the evaluation image, and the image generation unit 211 generates image data each time the camera 81 captures the evaluation image.

[0171] It is possible to continuously monitor the distribution of the fluid.

[0172] (15) The substrate processing system 1 described in (14), wherein the image generation unit 211 updates the reference image based on a plurality of evaluation images obtained by repeatedly photographing the evaluation image with the camera 81, and generates image data based on the difference between the updated reference image and the evaluation image photographed after the reference image is updated.

[0173] When the reference image is repeatedly used, due to a sudden positional shift of the camera 81 or the like, the conditions that should be the same when photographing the reference image and the evaluation image may differ. When such a condition difference occurs, it is impossible to identify whether the difference between the evaluation image and the reference image is caused by the condition difference or by the flow distribution, and thus it may be difficult to grasp the flow distribution based on the image data. In contrast, by updating the reference image, even when a sudden positional shift of the camera 81 or the like occurs, the above-mentioned condition difference can be maintained at a low level. Therefore, it is possible to continuously generate image data that is easy to grasp the flow distribution.

[0174] (16) The substrate processing system 1 described in any one of (1) to (15), further comprising: an expansion unit 221 that expands the image data into a series of a plurality of components each represented by a two-dimensional orthogonal polynomial; a coefficient change unit 222 that changes the coefficients of one or more change target components among the plurality of components in the series; and a reconstruction unit that reconstructs the image data based on the series in which the coefficients of one or more change target components have been changed.

[0175] It is possible to easily perform a filtering process for removing components that are difficult to grasp the flow distribution of the fluid and an enhancement process for emphasizing the flow distribution of the fluid.

[0176] (17) The substrate processing system 1 described in (16), wherein the two-dimensional orthogonal polynomial is a two-dimensional Legendre polynomial.

[0177] It is possible to more easily perform the filtering process and the enhancement process.

[0178] (18) The substrate processing system 1 described in any one of (1) to (17), wherein the image generation unit 211 generates image data representing the flow distribution of the gas as the flow distribution of the fluid.

[0179] It is possible to easily visualize the flow distribution of the gas.

[0180] (19) The substrate processing system 1 described in (18), wherein the substrate processing device 50 further has a liquid supply unit 73 that supplies a processing liquid to the substrate W accommodated in the accommodation space A1, and the image generation unit 211 generates image data representing the flow distribution of the gas in a state where the processing liquid adheres to the substrate W.

[0181] Capable of generating image data useful for analyzing the influence of the gas in the storage space A1 on the processing liquid.

[0182] (20) The substrate processing system 1 according to any one of (1) to (19), wherein the substrate processing apparatus 50 further has a second storage space A11 connected to the storage space A12 via an opening 65, and the image generation unit 211 generates image data representing the distribution of the flow of the fluid around the opening 65 in a state where the temperature of the fluid in the storage space A12 is different from that of the fluid in the second storage space A11.

[0183] Capable of easily visualizing the flow of the fluid between the storage space A12 and the second storage space A11.

[0184] (21) The substrate processing system 1 according to any one of (1) to (20), wherein the substrate processing apparatus 50 further has a gas supply unit 78 that supplies a processing gas to the substrate W stored in the storage space A1, and the image generation unit 211 generates image data representing the distribution of the flow of the processing gas as the distribution of the flow of the fluid.

[0185] Capable of generating image data useful for analyzing the supply state of the processing gas supplied to the substrate W.

[0186] (22) A substrate processing apparatus 50, comprising: a storage space A1 for storing a substrate W; a camera 81 facing the storage space A1; and a pattern 82 that is provided to be presented within the field of view of the camera 81, can be photographed by the camera 81 via the storage space A1, and causes the image photographed by the camera 81 to change according to the change in the refractive index of the fluid in the storage space A1.

[0187] (23) A visualization method for visualizing the distribution of the flow of the fluid in the storage space A1 in which the substrate W is stored in the substrate processing apparatus 50, the visualization method including: a step of acquiring an image obtained by the camera 81 facing the storage space A1 photographing the pattern 82 via the storage space A1, wherein the pattern 82 is provided to be presented within the field of view of the camera 81; and a step of generating image data representing the distribution of the flow of the fluid in the storage space A1 based on the change in the acquired image.

[0188] The embodiments have been described above, but the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof. As an example of the substrate, a semiconductor wafer has been illustrated, but it is not limited thereto. For example, the substrate may also be a glass substrate. In addition, the case where the fluid is a gas has been mainly illustrated, but the fluid may also be a liquid. Even if the fluid is a liquid, a schlieren effect can be obtained, and thus the distribution of the flow of the fluid can be visualized by the above-described configuration.

Claims

1. A substrate processing system, characterized in that: include: A substrate processing device having a storage space for storing substrates; a camera facing the storage space; a pattern, which is configured to be displayed within the field of view of the camera and can be photographed by the camera through the storage space; and An image generating unit generates image data representing the distribution of the flow of the fluid in the storage space based on changes in the image of the pattern captured by the camera.

2. The substrate processing system according to claim 1, characterized in that: The image generating unit generates the image data based on the difference between a reference image and an evaluation image, wherein the reference image is an image obtained by the camera photographing the storage space, and the evaluation image is an image photographed by the camera at a time when the flow distribution of the fluid is different from the time when the reference image is photographed.

3. The substrate processing system according to claim 2, characterized in that: The camera has a plurality of pixels. The image generation unit generates the image data based on a difference between a pixel value of each of the plurality of pixels in the evaluation image and a pixel value in the reference image.

4. The substrate processing system according to any one of claims 1 to 3, characterized in that: The pattern includes a plurality of unit patterns dispersedly arranged within a field of view of the camera.

5. The substrate processing system according to claim 4, characterized in that: The camera has a plurality of pixels. An arrangement pitch of the plurality of unit patterns in the pattern image is larger than an arrangement pitch of the plurality of pixels.

6. The substrate processing system according to claim 4, characterized in that: The pattern includes the plurality of unit patterns that are arranged uniformly at a constant pitch and are provided on a surface that is inclined with respect to a surface that is perpendicular to the optical axis of the camera.

7. The substrate processing system according to any one of claims 1 to 3, characterized in that: The pattern is provided on a partition wall that separates the storage space from a surrounding space.

8. The substrate processing system according to any one of claims 1 to 3, characterized in that: It also includes a projection device, which projects the pattern onto a surface that is configured to be displayed within the field of view of the camera and can be photographed by the camera through the storage space.

9. The substrate processing system according to claim 8, characterized in that: The projection device projects the pattern onto the surface via a space between a region in the surface for projecting the pattern and the camera.

10. The substrate processing system according to claim 8, characterized in that: The camera is fixed to the projection device.

11. The substrate processing system according to claim 2 or 3, characterized in that: The system further includes a temperature adjustment unit configured to make the temperature of the fluid in the storage space different when the evaluation image is captured and when the reference image is captured.

12. The substrate processing system according to claim 11, characterized in that: The temperature adjustment unit includes a thermoelectric element provided in a flow path of the fluid, and electric power is supplied to the thermoelectric element to change the temperature of the fluid.

13. The substrate processing system according to claim 2 or 3, characterized in that: The system further includes an adding unit configured to supply an additive for changing a refractive index to the fluid in the storage space at a timing when the evaluation image is captured.

14. The substrate processing system according to claim 2 or 3, characterized in that: The camera repeatedly captures the evaluation image. The image generation unit generates the image data every time the evaluation image is captured by the camera.

15. The substrate processing system according to claim 14, characterized in that: The image generation unit updates the reference image based on a plurality of evaluation images obtained by repeatedly photographing the evaluation image with the camera, and generates the image data based on a difference between the updated reference image and the evaluation image photographed after the reference image is updated.

16. The substrate processing system according to any one of claims 1 to 3, characterized in that: Also includes: an expansion unit that expands the image data into a series of multiple components each represented by a two-dimensional orthogonal polynomial; a coefficient changing unit that changes coefficients of one or more change target components of the plurality of components in the series; and A reconstruction unit reconstructs the image data based on the series after changing the coefficients of the one or more change target components.

17. The substrate processing system according to claim 16, characterized in that: The two-dimensional orthogonal polynomials are two-dimensional Legendre polynomials.

18. The substrate processing system according to any one of claims 1 to 3, characterized in that: The map generation unit generates the map data representing the distribution of the flow of the gas as the distribution of the flow of the fluid.

19. The substrate processing system according to claim 18, characterized in that: The substrate processing device further includes a liquid supply unit that supplies processing liquid to the substrate stored in the storage space. The image generating unit generates the image data indicating the distribution of the flow of the gas in a state where the processing liquid is attached to the substrate.

20. The substrate processing system according to any one of claims 1 to 3, characterized in that: The substrate processing device further comprises a second storage space connected to the storage space via an opening. The map generation unit generates the map data indicating the distribution of the flow of the fluid around the opening in a state where the temperature of the fluid in the storage space and the temperature of the fluid in the second storage space are different.

21. The substrate processing system according to any one of claims 1 to 3, characterized in that: The substrate processing apparatus further includes a gas supply unit for supplying a processing gas to the substrate stored in the storage space. The map generation unit generates the map data indicating the distribution of the flow of the processing gas as the distribution of the flow of the fluid.

22. A substrate processing device, characterized in that: include: A storage space for storing substrates; a camera facing the storage space; and The pattern is configured to be displayed within the field of view of the camera, can be photographed by the camera through the storage space, and changes the image photographed by the camera according to the change of the refractive index of the fluid in the storage space.

23. A visualization method, characterized in that: The visualization method visualizes the flow distribution of a fluid in a storage space storing substrates in a substrate processing device, and comprises: A step of acquiring an image obtained by photographing a pattern through the storage space with a camera facing the storage space, wherein the pattern is configured to be displayed within the field of view of the camera; and A step of generating image data representing the distribution of the flow of the fluid in the storage space based on changes in the acquired image.

Images