Driving substrate, display module, display screen and manufacturing method of driving substrate

Abstract

The invention discloses a driving substrate, a display module, a display screen and a manufacturing method of the driving substrate, and the driving substrate comprises a driving substrate body which is used for bearing a light-emitting chip array; a plurality of elastic members; a plurality of through holes are formed in the driving substrate body, and one elastic piece is correspondingly arranged in each through hole. The through hole is formed in the driving substrate body, and the elastic piece is arranged in the through hole, so that when the driving substrate body is heated, the elastic piece absorbs the swelling amount generated by the driving substrate body, and the swelling amount of the driving substrate body is reduced; the problem that the appearance size is increased due to thermal expansion of the driving substrate body is reduced or even avoided, so that the problem that the visual effect of the appearance of the whole display screen is poor due to mutual extrusion deformation between the two driving substrate bodies is avoided, and the problem that a large-area dark area appears due to separation of the light-emitting chip and the driving substrate body is solved.

Description

Technical Field

[0001] This application relates to the technical field of display devices, and particularly to a driving substrate, a display module, a display screen, and a manufacturing method of the driving substrate. Background Art

[0002] Most driving substrates of display screens adopt PCB boards, the material of which is FR4 (a composite material based on fiberglass cloth and epoxy resin); FR4 is a material with an extremely high coefficient of thermal expansion, and the coefficient of thermal expansion reaches 15*10 -6 / °C.

[0003] Currently, to achieve a large-sized display screen, the tiled screen method is usually adopted, that is, multiple driving substrates are tiled infinitely; at the same time, in order to ensure the appearance visual effect in the dark state environment, the seam size between driving substrates is required to be less than 0.01 mm. In this way, when the display screen is lit, as the temperature of the light-emitting chips on the driving substrate rises rapidly, the driving substrate will expand rapidly, resulting in mutual extrusion and deformation between adjacent two driving substrates, leading to poor appearance visual effect of the entire display screen; moreover, the deformation of the driving substrate is also likely to cause the separation of the light-emitting chips from the driving substrate, resulting in a large area of dark areas. Summary of the Invention

[0004] In view of the above defects of the related art, a driving substrate, a display module, a display screen, and a manufacturing method of the driving substrate are provided, aiming to solve the technical problem that the driving substrate is prone to deformation due to high temperature.

[0005] The technical solutions adopted by this application to solve the technical problems are as follows:

[0006] A driving substrate includes a driving substrate body for carrying a light-emitting chip array, and further includes:

[0007] A plurality of elastic members;

[0008] A plurality of through holes are provided on the driving substrate body, and an elastic member is correspondingly arranged in each through hole.

[0009] Through the above solution, by providing the through holes on the driving substrate body and arranging the elastic members in the through holes, when the driving substrate body is heated, the elastic members absorb the expansion amount generated by the driving substrate body, reducing or even avoiding the problem of the increase in the external dimension of the driving substrate body caused by thermal expansion, thereby avoiding the problem that the mutual extrusion and deformation between two driving substrate bodies affect the appearance visual effect of the entire display screen, and the problem that the light-emitting chips are separated from the driving substrate body, resulting in a large area of dark areas.

[0010] Optionally, the plurality of through holes are arranged in a ring around the periphery of the light-emitting chip array and close to the edge of the driving substrate body.

[0011] Through the above solution, the through holes are located at the periphery of the light-emitting chip array and close to the edge of the driving substrate body. When a plurality of driving substrate bodies are spliced to form a large-sized display screen, the through holes and the elastic members are closer to the splicing seam between two adjacent driving substrate bodies, so as to effectively absorb the deformation amount at the edge of the driving substrate body, and effectively prevent the driving substrate body from bulging outwards and causing mutual extrusion deformation between two adjacent driving substrate bodies.

[0012] Optionally, the distance between two adjacent through holes is 1 mm to 5 mm.

[0013] Through the above solution, the spacing reserved between two adjacent through holes is moderate, so that while the deformation amount generated by the driving substrate body due to heat can be absorbed by the elastic member, it is ensured that the deformation amount to be generated by the driving substrate body and the deformation amount absorbed by the elastic member can be balanced with each other.

[0014] Optionally, the elastic member includes a silicone rubber elastic member.

[0015] Through the above solution, the elastic member has good heat resistance and elastic deformation performance, so as to improve the absorption performance of the deformation amount generated by the driving substrate body due to thermal expansion, and further reduce the probability of deformation of the driving substrate body after heating.

[0016] Optionally, the through hole includes a square through hole or a circular through hole.

[0017] Through the above solution, the through hole is easier to process, and the extrusion force generated by the driving substrate body on the elastic member in the through hole is more uniform when the driving substrate body expands, further improving the absorption performance of the elastic member for the deformation amount generated by the driving substrate body due to thermal expansion.

[0018] Optionally, along the length and width directions of the driving substrate body, the size of the through hole is 0.5 mm to 5 mm.

[0019] Through the above solution, whether along the length direction or the width direction of the driving substrate body, the maximum size of the elastic member that can be arranged in the through hole is 0.5 mm to 5 mm, so as to ensure the strength of the driving substrate body itself on the premise of satisfying that the elastic member can absorb the deformation amount of the driving substrate body.

[0020] A display module, comprising:

[0021] The driving substrate as described in any one of the above.

[0022] A light emitting chip array, the light emitting chip array comprising a plurality of light emitting chips, the plurality of light emitting chips being bonded to the driving substrate body;

[0023] The packaging structure is arranged on the driving substrate body and covers the light-emitting chip.

[0024] Through the above solution, the packaging structure packages the light-emitting chip, thereby improving the stability of positioning the light-emitting chip on the driving substrate body.

[0025] Optionally, the packaging structure includes:

[0026] A black glue layer is disposed on the driving substrate body and surrounds the periphery of the light-emitting chip;

[0027] The transparent adhesive layer is arranged on the side of the black adhesive layer away from the driving substrate body, and covers the light emitting surface of the light emitting chip and the black adhesive layer.

[0028] Through the above solution, the black glue layer blocks the light-emitting surface around the light-emitting chip, so that the light emitted by the light-emitting chip can only be emitted in a direction away from the driving substrate body, thereby improving the contrast and brightness of the display module. At the same time, the transparent glue layer covers the surface of the black glue layer and the light-emitting chip, which not only protects the light-emitting chip, but also reduces the loss of photons at the interface and improves the light collection efficiency.

[0029] A method for manufacturing a driving substrate, comprising the following steps:

[0030] Providing a driving substrate body, and opening a plurality of through holes on the driving substrate body;

[0031] A rigid flat plate is placed on one side of the driving substrate body to cover the through hole;

[0032] Filling each through hole with a liquid elastic material, and heating and curing the liquid elastic material to form a solid elastic member in the through hole;

[0033] Peel off the rigid plate to obtain a driving substrate.

[0034] A display screen, comprising the display module as described above.

[0035] ​In this application, through holes are provided on the driving substrate body, and elastic members are arranged in the through holes. When the driving substrate body is heated, the elastic members absorb the expansion amount generated by the driving substrate body, reducing or even avoiding the problem of the increase in the external dimension of the driving substrate body due to thermal expansion. Thus, the problem of mutual extrusion and deformation between two driving substrate bodies, resulting in poor appearance visual effect of the entire display screen, and the problem of separation between the light-emitting chip and the driving substrate body, resulting in a large-area dark area, are avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic structural diagram of the driving substrate body in this application;

[0037] Figure 2 is a reference diagram of the usage state of the display module when the elastic member in this application is in a natural state;

[0038] Figure 3 is a reference diagram of the usage state of the display module when the elastic member absorbs the deformation amount of the driving substrate body in this application.

[0039] DESCRIPTION OF REFERENCE NUMERALS:

[0040] 1 - driving substrate body; 2 - through hole; 3 - elastic member; 4 - light-emitting chip; 5 - encapsulation structure; 51 - black glue layer; 52 - transparent glue layer; 6 - metal trace. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0041] To make the objectives, technical solutions, and advantages of this application clearer and more definite, the following further elaborates on this application with reference to the accompanying drawings and by way of examples. It should be understood that the specific embodiments described herein are merely used to explain this application and are not intended to limit this application.

[0042] This application provides a driving substrate, as Figure 1 , Figure 2 and Figure 3 shown. The driving substrate includes: a driving substrate body 1 and a plurality of elastic members 3. Among them, the driving substrate body 1 is used to carry a light-emitting chip array, and the light-emitting chip array is formed by arranging a plurality of light-emitting chips 4 in an array. A plurality of through holes 2 (as Figure 1 shown) are provided on the driving substrate body 1. The through holes 2 correspond to the elastic members 3 one by one, and the through holes 2 are used to accommodate the elastic members 3. Specifically, one of the elastic members 3 is correspondingly arranged in each of the through holes 2.

[0043] In this application, a through hole 2 is provided on the driving substrate body 1, and the elastic member 3 is arranged in the through hole 2, so that when the driving substrate body 1 is heated, the elastic member 3 absorbs the expansion amount generated by the driving substrate body 1 (as Figure 3 shown), reducing or even avoiding the problem that the outer dimension of the driving substrate body 1 becomes larger due to thermal expansion, and further avoiding: when splicing two driving substrate bodies 1, mutual extrusion deformation occurs, resulting in poor appearance visual effect of the entire display screen, and the problem that the light-emitting chip 4 is separated from the driving substrate body 1 and a large-area dark area appears.

[0044] It should be noted that the through hole 2 penetrates the driving substrate body 1 along the thickness direction of the driving substrate body 1. The elastic member 3 is completely attached to the inner surface of the through hole 2, and both outer end faces of the elastic member 3 are flush with the outer surface of the driving substrate body 1, which not only ensures that the through hole 2 is filled with the elastic member 3, but also avoids the elastic member 3 causing adverse interference to other assembly structural parts outside the driving substrate body 1.

[0045] In an embodiment of this application, a plurality of through holes 2 are arranged in a ring around the periphery of the light-emitting chip array and are close to the edge of the driving substrate body 1.

[0046] In this embodiment, the through hole 2 is located at the periphery of the light-emitting chip array and is close to the edge of the driving substrate body 1. When a plurality of driving substrate bodies 1 are spliced to form a large-size display screen, the through hole 2 and the elastic member 3 are closer to the splicing seam between two adjacent driving substrate bodies 1, so as to effectively absorb the deformation amount at the edge of the driving substrate body 1 and effectively avoid the driving substrate body 1 bulging outwards and causing mutual extrusion deformation between two adjacent driving substrate bodies 1.

[0047] In an embodiment of this application, the elastic member 3 includes a silicone rubber elastic member 3.

[0048] In this embodiment, the silicone rubber elastic member 3 has good heat resistance and elastic deformation performance, so that the silicone rubber elastic member 3 has good absorption performance for the deformation amount generated by the thermal expansion of the driving substrate body 1, further reducing or even avoiding the probability of deformation of the driving substrate body 1 after heating.

[0049] In an embodiment of this application, the through hole 2 includes a square through hole; in an embodiment of this embodiment, the cross section of the through hole 2 is a square, that is, the four side lengths of the cross section of the through hole 2 are equal, which is not only convenient for processing, but also can make the extrusion force generated by the driving substrate body 1 on the elastic member 3 in the through hole 2 more uniform when the driving substrate body 1 expands, further improving the absorption performance of the elastic member 3 for the deformation amount generated by the thermal expansion of the driving substrate body 1.

[0050] In another embodiment of the present application, the through hole 2 is a circular through hole, that is, the cross-section of the through hole 2 is circular, which is convenient for processing and can make the extrusion force generated by the expansion of the driving substrate body 1 on the elastic member 3 in the through hole 2 more uniform, further improving the absorption performance of the elastic member 3 for the deformation amount generated by the thermal expansion of the driving substrate body 1.

[0051] In one embodiment of the present application, the distance between two adjacent through holes 2 is 1 mm to 5 mm, so that the distance reserved between two adjacent through holes 2 is appropriate, so that while ensuring that the deformation amount generated by the driving substrate body 1 due to heat can be absorbed by the elastic member 3, it is ensured that the deformation amount to be generated by the driving substrate body 1 and the deformation amount absorbed by the elastic member 3 can be balanced with each other.

[0052] In one embodiment of the present application, along the length and width directions of the driving substrate body, the size of the through hole 2 is 0.5 mm to 5 mm, that is, whether along the length direction of the driving substrate body or along the width direction of the driving substrate body, the maximum size of the elastic member 3 that can be arranged in the through hole 2 is 0.5 mm to 5 mm, so as to ensure the strength of the driving substrate body 1 itself on the premise of satisfying that the elastic member 3 can absorb the deformation amount of the driving substrate body 1.

[0053] In one embodiment of this embodiment, along the length and width directions of the driving substrate body, the size of the through hole 2 is 0.5 mm to 2 mm. It can be understood that for the square through hole, the size of the through hole 2 refers to the side length of the square cross-section of the through hole 2; for the circular through hole, the size of the through hole 2 refers to the diameter of the circular cross-section of the through hole 2.

[0054] It can be understood that since metal traces 6 also need to be arranged on the driving substrate body 1, the arrangement of the through holes 2 needs to be staggered from the metal traces 6 to avoid interference between the two.

[0055] The present application also provides a display module, and the display module includes a plurality of driving substrates as described in any one of the above.

[0056] The display module further includes: a light-emitting chip array and a packaging structure 5; as Figure 2 and Figure 3As shown, the light-emitting chip array includes a plurality of light-emitting chips 4, and the plurality of light-emitting chips 4 are arranged in an array on the driving substrate body 1; the encapsulation structure 5 is disposed on the driving substrate body 1 and covers the light-emitting chips 4, so as to encapsulate the light-emitting chips 4 through the encapsulation structure 5, thereby improving the positioning stability of the light-emitting chips 4 on the driving substrate body 1 and ensuring good electrical connectivity between the light-emitting chips 4 and the driving substrate body 1.

[0057] In an embodiment of the present application, the encapsulation structure 5 includes: a black glue layer 51 and a transparent glue layer 52. The black glue layer 51 is disposed on the driving substrate body 1 and is arranged around the periphery of the light-emitting chips 4; that is, each light-emitting chip 4 is surrounded by the black glue layer 51, so that the light-emitting surfaces around the light-emitting chips 4 are blocked by the black glue layer 51, and the light emitted by the light-emitting chips 4 can only be emitted in a direction away from the driving substrate body 1, thereby improving the contrast and brightness of the display module.

[0058] The transparent glue layer 52 is disposed on a side of the black glue layer 51 away from the driving substrate body 1 and covers the light-emitting surface of the light-emitting chips 4 and the black glue layer 51, which not only protects the light-emitting chips 4, but also reduces the loss of photons at the interface, thereby improving the light extraction efficiency.

[0059] It should be noted that since the black glue layer 51 is used to encapsulate the light-emitting chips 4 and block the light-emitting surfaces around the light-emitting chips 4, in this embodiment, the thickness of the black glue layer 51 is equal to the thickness of the light-emitting chips 4, that is, one side of the black glue layer 51 is attached to the driving substrate body 1, and the other side is flush with the light-emitting chips 4.

[0060] Since the transparent glue layer 52 needs to refract the light emitted by the light-emitting chips 4 to improve the light extraction efficiency, the transparent glue layer 52 needs to have a certain thickness; in one embodiment of this embodiment, the thickness of the transparent glue layer 52 is greater than the thickness of the black glue layer 51 and less than the thickness of the driving substrate body 1.

[0061] Based on the driving substrate described in any one of the above, the present application further provides a manufacturing method of a driving substrate, including the following steps:

[0062] S100. Provide a driving substrate body and open a plurality of through holes on the driving substrate body;

[0063] Specifically, the light-emitting chip array is bonded to the driving substrate body, and the opening area of ​​the plurality of through holes needs to avoid the bonding area where the light-emitting chips are displayed. In one embodiment of the present application, the through holes are located at the periphery of the bonding area of ​​the light-emitting chip array and close to the edge of the driving substrate body, so that when multiple driving substrate bodies are spliced ​​to form a large-size display screen, the through holes are closer to the splicing seam between two adjacent driving substrate bodies. The metal routing on the driving substrate needs to avoid the location of the punching holes, or avoid the location of the reserved punching holes.

[0064] S200, placing a rigid flat plate on one side of the driving substrate body to cover the through hole;

[0065] S300, filling the through hole with liquid elastic material, and heating and curing the liquid elastic material to form a solid elastic member in the through hole;

[0066] Specifically, the rigid plate is used to cover the through hole, thereby receiving the liquid elastic material, so that when the liquid elastic material is filled into the through hole, the liquid elastic material can be retained in the through hole and will not flow out of the through hole. After the liquid elastic material is filled into each through hole and heated and cured, a solid elastic member can be formed in the through hole, thereby obtaining a driving substrate body having a plurality of the elastic members.

[0067] Wherein, the rigid plate is provided with ventilation holes at locations corresponding to the through holes, so that the air in the through holes can be discharged to the outside through the ventilation holes.

[0068] S400, peeling off the rigid flat plate to obtain a driving substrate.

[0069] After obtaining the driving substrate, the light-emitting chip array can be bonded to the driving substrate body, and then the packaging structure can be laid on the driving substrate body to obtain the display module.

[0070] The present application also provides a display screen, which includes a display module as described in any one of the above items.

[0071] In summary, the present application provides a driving substrate, a display module, a display screen, and a manufacturing method of the driving substrate. The driving substrate includes: a driving substrate body 1 for carrying a light-emitting chip array; and a plurality of elastic members 3. A plurality of through holes 2 are provided on the driving substrate body 1, and each of the through holes 2 is correspondingly provided with one of the elastic members 3. In the present application, the through holes 2 are provided on the driving substrate body 1, and the elastic members 3 are arranged in the through holes 2, so that when the driving substrate body 1 is heated, the elastic members 3 absorb the expansion amount generated by the driving substrate body 1, reducing or even avoiding the problem that the external dimension of the driving substrate body 1 becomes larger due to thermal expansion, thereby avoiding the problem that the appearance visual effect of the entire display screen is poor due to mutual extrusion and deformation between two driving substrate bodies 1, and the problem that a large-area dark area appears due to the separation of the light-emitting chip 4 from the driving substrate body 1.

[0072] It should be understood that the application of the present application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of the present application.

Claims

1. A driving substrate, comprising a driving substrate body, used to carry a light-emitting chip array, characterized in that: It also includes: a plurality of elastic members; The driving substrate body is provided with a plurality of through holes, and one of the elastic members is correspondingly arranged in each of the through holes.

2. The driving substrate according to claim 1, characterized in that: A plurality of through holes are arranged around the periphery of the light emitting chip array and are close to the edge of the driving substrate body.

3. The driving substrate according to claim 2, characterized in that: The distance between two adjacent through holes is 1 mm to 5 mm.

4. The driving substrate according to any one of claims 1 to 3, characterized in that: The elastic member comprises a silicone rubber elastic member.

5. The driving substrate according to claim 1, characterized in that: The through hole includes a square through hole or a circular through hole.

6. The driving substrate according to claim 1, characterized in that: Along the length and width directions of the driving substrate body, the sizes of the through holes are both 0.5 mm to 5 mm.

7. A display module, characterized in that: It includes: The driving substrate according to any one of claims 1 to 6; Light emitting chip array; The light emitting chip array comprises a plurality of light emitting chips, and the plurality of light emitting chips are bonded to the driving substrate body; The packaging structure is arranged on the driving substrate body and covers the light emitting chip.

8. The display module according to claim 7, characterized in that: The packaging structure comprises: A black glue layer is disposed on the driving substrate body and surrounds the periphery of the light-emitting chip; The transparent adhesive layer is arranged on a side of the black adhesive layer away from the driving substrate body and covers the light emitting surface of the light emitting chip and the black adhesive layer.

9. A method for manufacturing a driving substrate, characterized in that: It includes the following steps: Providing a driving substrate body, and opening a plurality of through holes on the driving substrate body; A rigid flat plate is placed on one side of the driving substrate body to cover the through hole; Filling the through hole with a liquid elastic material, and heating and curing the liquid elastic material to form a solid elastic member in the through hole; The rigid plate is peeled off to obtain a driving substrate.

10. A display screen, characterized in that: The display screen comprises the display module as claimed in claim 7 or 8.

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