Display device and method of manufacturing same

Abstract

The present disclosure relates to a display device and a method of manufacturing the same. A display device according to an embodiment of the present specification includes: a substrate including a display area and a non-display area; a driving circuit portion disposed in the display area on the substrate; a plurality of planarization layers disposed on the driving circuit portion; and a plurality of pixels disposed on the plurality of planarization layers in the display area, in which the plurality of pixels includes a plurality of first light emitting element areas and a plurality of second light emitting element areas, and a first insulating layer is disposed in the first light emitting element areas and the second light emitting element areas, and the first insulating layer may have different heights in the first light emitting element region and the second light emitting element region.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application No. 10 - 2023 - 0160826, filed on November 20, 2023, and Korean Patent Application 10 - 2024 - 0159150, filed on November 11, 2024. The disclosures of these Korean patent applications are incorporated herein by reference in their entirety. Technical field

[0003] This specification relates to a display device. Specifically, this specification relates to a display device and a manufacturing method for preventing defects caused by contact between a first electrode and a second electrode in a display device using micro - light - emitting diodes. Background art

[0004] Liquid crystal display devices and organic light - emitting display devices are used as flat - panel display devices.

[0005] Compared with liquid crystal display devices, organic light - emitting display devices have advantages such as improved luminous efficiency, fast response speed, and wide viewing angles. However, organic light - emitting display devices still have low luminous efficiency and are vulnerable to moisture because they contain organic substances, which may reduce reliability and lifespan.

[0006] Recently, micro - light - emitting diode display devices, which are inorganic light - emitting display devices, have been proposed.

[0007] A micro - light - emitting diode display device realizes an image by arranging inorganic light - emitting diodes with a size of 100 micrometers (μm) or less in each pixel. In a micro - light - emitting diode display device, micro - light - emitting diodes grown on a single - crystal substrate can be arranged on an array substrate of the display device, and electrodes can be connected. Summary of the invention

[0008] An array substrate is set by forming a pixel driving circuit portion and connection wirings on a substrate of the display device.

[0009] A first electrode connected to a micro - light - emitting diode element (hereinafter referred to as a light - emitting element) can be set on an array substrate of the display device. A light - emitting element can be set on the array substrate, and then a second electrode can be set on the light - emitting element.

[0010] A light - emitting element grown on a single - crystal substrate can be set on the array substrate through a transfer process.

[0011] After setting the light - emitting element, the second electrode can connect the light - emitting element and the pixel driving circuit to transmit a power voltage.

[0012] During the transfer process, there is a case where a light-emitting element is not transferred to a predetermined position on the array substrate.

[0013] If the light-emitting element is not provided, the second electrode and the first electrode under the light-emitting element may come into contact with each other and be electrically connected, which may cause a short circuit.

[0014] Therefore, the inventors of the present specification have invented a display device and a manufacturing method thereof that can improve reliability by preventing a short circuit between the second electrode and the first electrode provided under the second electrode in the non-transferred area of the light-emitting element.

[0015] The problems of the present specification are not limited to the problems mentioned above, and those skilled in the art will clearly understand other problems not mentioned based on the following disclosure.

[0016] A display device according to an embodiment of the present specification may include: a substrate including a display area and a non-display area; a driving circuit part (also referred to as a driving circuit unit) provided in the display area on the substrate; a plurality of planarization layers provided on the driving circuit part; and a plurality of pixels provided on the plurality of planarization layers in the display area, wherein the plurality of pixels include a plurality of first light-emitting element areas and a plurality of second light-emitting element areas, and a first insulating layer is provided in the first light-emitting element area and the second light-emitting element area, and the first insulating layer may have different heights in the first light-emitting element area and the second light-emitting element area.

[0017] A method of manufacturing a display device according to an embodiment of the present specification may include: preparing a substrate including a display area and a non-display area; forming a driving circuit part and a plurality of planarization layers on the substrate; forming a protrusion on the plurality of planarization layers; forming a first connection electrode and a second connection electrode in a first light-emitting element area and a second light-emitting element area provided on the protrusion; providing a light-emitting element on one of the first connection electrode and the second connection electrode; and providing lenses on the upper parts of the other of the first connection electrode and the second connection electrode and on the upper part of the light-emitting element, wherein a first insulating layer may be provided on the first light-emitting element area and the second light-emitting element area.

[0018] Another display device according to an embodiment of the present specification may include: a substrate including a display area and a non-display area; a driving circuit part disposed on the substrate; a plurality of planarization layers disposed on the driving circuit part; and a plurality of pixels disposed on the plurality of planarization layers in the display area, wherein the plurality of pixels include a plurality of first light-emitting element regions and second light-emitting element regions. In the first light-emitting element region, there are provided: a first connection electrode, a first light-emitting element disposed on the first connection electrode, a first lens disposed on the first light-emitting element, and a second electrode disposed on the first lens. And in the second light-emitting element region, there are provided: a second connection electrode, a second lens disposed on the second connection electrode, and a second electrode disposed on the second lens.

[0019] According to an embodiment of the present specification, the driving reliability of the display device can be improved by preventing an electrical short circuit between the second electrode and the first electrode below the second electrode in the untransferred region of the light-emitting element.

[0020] According to an embodiment of the present specification, the light efficiency of the light-emitting element can be improved by disposing a lens on the upper part of the light-emitting element.

[0021] The effects of the present specification are not limited to the above effects, and according to the following description, other effects not mentioned herein will be apparent to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By referring to the accompanying drawings and describing in detail the exemplary embodiments of the present disclosure, the above and other objects, features, and advantages of the present disclosure will become more apparent to those of ordinary skill in the art. In the drawings:

[0023] Figure 1 is a plan view showing a display device according to an embodiment of the present specification;

[0024] Figure 2 is a plan view of the structure of the wiring of the pixel provided with Figure 1 ;

[0025] Figure 3 is a plan view of the structure of the light-emitting element and the lens of the pixel provided with Figure 1 ;

[0026] Figure 4 is a plan view of the structure of the second electrode of the pixel provided with Figure 1 ;

[0027] Figures 5A to 5F is a cross-sectional view showing a method of manufacturing a region taken along the line A-A' according to an embodiment of the present specification; and Figure 3 ;

[0028] Figures 5G to 6 is a cross-sectional view taken along line B-B' according to an embodiment of the present specification. Figure 4 Detailed Embodiment

[0029] Advantages and features of the present specification and methods for achieving them will become apparent with reference to the preferred embodiments described in detail in conjunction with the accompanying drawings. However, the present specification is not limited to the embodiments to be described below and may be implemented in different forms. The embodiments are provided only to fully disclose the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art, and the present specification is defined by the disclosed claims.

[0030] Since the shapes, sizes, ratios, angles, numbers, etc. used to describe the embodiments of the present disclosure in the accompanying drawings are merely exemplary, the present disclosure is not limited to the items shown. Throughout the specification, the same reference numerals indicate the same components. In addition, when determining that a detailed description of related known technologies may unnecessarily obscure the gist of the present disclosure, the detailed description thereof will be omitted. When using "comprising", "having", "consisting of", etc. mentioned in the present specification, other parts may be added unless "only" is used. Unless otherwise explicitly stated, the case where a component is expressed in the singular form includes the plural form.

[0031] When explaining components, it should be understood that even without a separate explicit description, an error range is included.

[0032] In the case of describing positional relationships, for example, when the positional relationship between two parts is described as "on", "at the upper part", "at the lower part", "close to", etc., unless "immediately" or "directly" is used, one or more other parts may be located between the two parts.

[0033] First, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, within the technical spirit of the present disclosure, the first component mentioned below may be the second component.

[0034] Throughout the specification, the same reference numerals indicate the same components.

[0035] The size and thickness of each component shown in the accompanying drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the components shown.

[0036] Any feature of the various embodiments of the present invention can be partially or completely combined or combined with each other, and various interlocks and drives are technically possible, as fully understood by those skilled in the art, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship.

[0037] Hereinafter, a display device according to an embodiment of the present specification will be described in detail with reference to the drawings.

[0038] Figure 1 is a plan view showing a display device according to an embodiment of the present specification.

[0039] Referring to Figure 1 , the display device 10 may include a display area for displaying an image and a non-display area for not displaying an image, and a driving circuit and wirings for transmitting signals to the display area are provided.

[0040] In the non-display area, a driving circuit may be installed, and a pad portion PAD to which an integrated circuit, a printed circuit, etc. are connected may be provided.

[0041] A data driving circuit or a gate driving circuit may be provided in the non-display area, and a controller signal for controlling a driving operation may be supplied to the non-display area.

[0042] A controller signal that receives various timing signals such as a clock signal CLK, an input data enable signal, and a synchronization signal is received from the pad portion PAD.

[0043] The display device 10 may drive a light-emitting element through a pixel driving transistor connected to a driving voltage EVDD. The driving voltage (EVDD) may be a high-potential voltage. The transistor includes a semiconductor element, a source electrode / drain electrode, and a gate electrode, and the driving voltage EVDD is applied to the light-emitting element through a pixel electrode connected to the drain electrode. The high-potential voltage wiring may be connected to a first electrode of the driving transistor of each pixel PXL or the pixel electrode, and a common voltage wiring for supplying a common voltage EVSS may be connected to a second electrode or a cathode electrode of the light-emitting element. The common voltage EVSS may be a low-potential voltage EVSS.

[0044] In addition, a pixel driving circuit portion provided on a substrate of the display device 10 can drive pixels by using a driving circuit chip. The pixel driving circuit portion can drive a plurality of pixels by sending signals from the driving circuit chip, such as a driving voltage, an image signal (digital signal), and a synchronization signal synchronized with the image signal, and outputting a driving voltage EVDD and a common voltage EVSS of a light-emitting element. The pixel driving circuit portion can receive an image signal and a synchronization signal from a host system. The host system can include a main board of a wearable system, a mobile system, a television (TV) system, a tablet computer, a laptop computer, a navigation system, a personal computer (PC), etc.

[0045] The driving voltage electrode or the common voltage electrode can be formed together on the front surface of the display device.

[0046] This specification describes an example of forming the common voltage electrode together, but is not limited thereto.

[0047] Refer to Figure 1 , the common voltage EVSS can be provided together on the front surface of the display device, or can be provided together on each pixel PXL row, but is not limited thereto.

[0048] One pixel PXL can include one or more sub-pixels, such as a red sub-pixel, a green sub-pixel, and a blue sub-pixel.

[0049] Figures 2 to 5A is Figure 1 an enlarged plan view and a cross-sectional view of the pixel PXL.

[0050] The display device 10 can include a pixel driving circuit portion 200 provided on a substrate 100, a buffer layer 110, planarization layers 111 and 112, and a plurality of wirings.

[0051] The substrate 100 can be made of flexible plastic. For example, the substrate 100 can be made of a single layer or multiple layers of materials such as polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polyarylate, polysulfone, and cycloolefin copolymer, but is not limited thereto. The substrate 100 can be made of glass.

[0052] The pixel driving circuit portion 200 can be provided on the substrate 100.

[0053] The pixel driving circuit portion 200 can include a plurality of thin film transistors using amorphous silicon semiconductors, polysilicon semiconductors, or oxide semiconductors, and at least one storage capacitor. The thin film transistors can include at least one driving thin film transistor and at least one switching thin film transistor, etc. When a plurality of thin film transistors are included in the pixel driving circuit portion 200, they can be formed on the substrate 100 through a TFT manufacturing process.

[0054] In addition, the pixel driving circuit portion 200 may include a driving circuit chip.

[0055] The driving circuit chip may send a driving voltage for driving the light-emitting element, an image signal (digital signal), a synchronization signal synchronized with the image signal, etc. to the light-emitting element. If the pixel driving circuit portion 200 is a driving circuit chip, an adhesive layer may also be provided between the substrate 100 and the pixel driving circuit portion 200.

[0056] The adhesive layer may be made of an acrylic resin, a silicone resin, etc., but is not limited thereto.

[0057] A buffer layer 110 covering the pixel driving circuit portion 200 may be provided on the substrate 100. The buffer layer 110 may be made of an organic insulating material such as photosensitive acrylene or photosensitive polyimide, but is not limited thereto.

[0058] In addition, the buffer layer 110 may be used by stacking an inorganic insulating material such as silicon nitride (SiN x ) or silicon oxide (SiO 2 ) into multiple layers, and may be used by stacking an organic insulating material and an inorganic insulating material into multiple layers.

[0059] The buffer layer 110 may surround the side surface of the pixel driving circuit portion 200 and cover a part of the upper surface. An opening for exposing a part of the pixel driving circuit portion 200 may be provided to expose the first contact electrode 210 and the second contact electrode 220 of the pixel driving circuit portion 200.

[0060] Multiple planarization layers 111 and 112 may be provided on the buffer layer 110. The multiple planarization layers 111 and 112 may be made of an organic insulating material such as photosensitive acrylene or photosensitive polyimide, but is not limited thereto.

[0061] Multiple contact holes may be formed in the multiple planarization layers 111 and 112 so that a first connection wiring 230 and a third connection wiring 250 for sending signals of the first contact electrode 210 of the pixel driving circuit portion 200, and a second connection wiring 240 and a fourth connection wiring 260 for sending signals of the second contact electrode 220 may be provided on the first planarization layer 111 and the second planarization layer 112.

[0062] The first connection wiring 230, the second connection wiring 240, the third connection wiring 250, and the fourth connection wiring 260 may include at least one of titanium (Ti), molybdenum (Mo), aluminum (Al), indium tin oxide (ITO), or indium zinc oxide (IZO).

[0063] The protrusion 120 can be provided on the third connection wiring 250, the fourth connection wiring 260, and a part of the second planarization layer 112.

[0064] The protrusion 120 can be made of an organic insulating material such as photosensitive acrylate or photosensitive polyimide, but is not limited thereto.

[0065] The first connection electrode 131 and the second connection electrode 132 can be provided on the upper surface and the side surface of the protrusion 120.

[0066] The first connection electrode 131 and the second connection electrode 132 can be formed by the same process as Figure 2 the signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b, and can extend from the signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b to be provided on the upper surface and the side surface of the protrusion 120.

[0067] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b can be electrically connected to the underlying fourth connection wiring 260 to send the driving voltage EVDD from the driving circuit section 200 to the light-emitting element EM.

[0068] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b can extend in the second direction DR2 and can be respectively provided between the sub-pixels Sub_PXL.

[0069] The first connection electrode 131 and the second connection electrode 132 can be provided to extend in the first direction DR1 intersecting the second direction DR2. Each sub-pixel Sub_PXL includes two light-emitting elements, and if one of the light-emitting elements has an abnormality or the light-emitting element has not been transferred, the brightness of the other light-emitting element can be adjusted to prevent a decrease in luminous efficiency.

[0070] The signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b are provided on both sides of each sub-pixel Sub_PXL, and each sub-pixel Sub_PXL can include first light-emitting element regions ED1-1, ED2-1, and ED3-1 and second light-emitting element regions ED1-2, ED2-2, and ED3-2.

[0071] A third connection electrode 130 may be disposed on a side surface of a sub-pixel Sub_PXL between signal lines 101-a, 101-b, 102-a, 102-b, 103-a, and 103-b. The third connection electrode 130 may be electrically connected to a third connection wiring 250 through a first contact hole 130H1 and may be connected to a second electrode 190 (see Figure 6 ) through a second contact hole 130H2 to transmit signals of a driving circuit section 200.

[0072] Referring to Figures 3 to 4 , first light-emitting elements EM1-1, EM2-1, and EM3-1 and second light-emitting elements EM1-2 and EM2-2 may be disposed in first light-emitting element regions ED1-1, ED2-1, and ED3-1 and second light-emitting element regions ED1-2 and ED2-2.

[0073] For example, one pixel PXL may include light-emitting elements EM1, EM2, and EM3-1 of three colors. The first light-emitting element EM1 may be a red light-emitting element, the second light-emitting element EM2 may be a green light-emitting element, and the third light-emitting element EM3-1 may be a blue light-emitting element.

[0074] For example, the light-emitting elements may not be transferred to a region where the light-emitting elements are not transferred, for example, a second light-emitting element region ED3-2 of a blue sub-pixel among a plurality of sub-pixels Sub_PXL of a pixel PXL.

[0075] A lens 300 may be disposed on the first light-emitting elements EM1-1, EM2-1, and EM3-1, the second light-emitting elements EM1-2 and EM2-2, and the second light-emitting element region ED3-2.

[0076] In order to connect a second electrode 190 of a light-emitting element disposed on an upper surface of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 and an upper pad electrode, the lens 300 may be formed to have a length shorter than a short side length of an upper surface of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2.

[0077] For example, if the size of an upper surface of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 is 10 μm * 15 μm, the lens 300 may have a maximum diameter less than 10 μm.

[0078] For example, the maximum area ratio occupied by the lens 300 above the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 may not exceed π / 4. Here, π may represent the ratio of the circumference of a circle to its diameter.

[0079] The maximum size of the lens 300 for bringing the second electrode 190 into contact with the upper electrodes of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 may be a size obtained by multiplying the upper area of the first light-emitting elements EM1-1, EM2-1, and EM3-1 and the second light-emitting elements EM1-2 and EM2-2 by (1 - π / 4).

[0080] The lens 300 may include acrylate or silicone as a polymer-based material.

[0081] The second electrode 190 may be disposed on the first light-emitting elements EM1-1, EM2-1, and EM3-1, the second light-emitting elements EM1-2 and EM2-2, and the lens 300.

[0082] Figure 5A ( Figure 5A in (I)) to Figure 5G is a cross-sectional view showing a method of manufacturing a region taken along Figure 3 line A-A' and Figure 4 line B-B' according to an embodiment of the present specification.

[0083] The first connection electrode 131 and the second connection electrode 132 may be disposed on the upper surface and the side surface of the protrusion 120. Here, the first connection electrode 131 and the second connection electrode 132 may be collectively referred to as a first electrode for connecting to a light-emitting element.

[0084] The first connection electrode 131 and the second connection electrode 132 may be a multilayer including titanium (Ti), molybdenum (Mo), aluminum (Al), indium tin oxide (ITO), and indium zinc oxide (IZO).

[0085] Figure 5A In (II) of, it is an enlarged cross-sectional view of a part of the first connection electrode 131. The first connection electrode 131 may be formed as a multilayer structure including a first layer 131a, a second layer 131b, a third layer 131c, and a fourth layer 131d.

[0086] The first layer 131a, the second layer 131b, the third layer 131c, and the fourth layer 131d may include titanium (Ti), molybdenum (Mo), or aluminum (Al).

[0087] The fourth layer 131d may include a transparent conductive oxide layer having corrosion resistance and acid resistance, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0088] By removing a partial region of the fourth layer 131d where the light-emitting element EM is not provided, the fourth layer 131d may be divided into a fourth-first layer 131d-1 region where the light-emitting element EM is provided and a fourth-second layer 131d-2 region where the first layer 131a, the second layer 131b, and the third layer 131c are provided.

[0089] The third layer 131c may be exposed in a region where a part of the fourth layer 131d is removed. The third layer 131c may improve the light-emitting efficiency by reflecting light upward from the light-emitting element EM that performs top emission using a metal material having a high reflectivity such as aluminum (Al).

[0090] A protective layer 160 may be formed on the second planarization layer 112, the first connection electrode 131, the second connection electrode 132, and the protrusion 120. The protective layer 160 may be formed by stacking an inorganic insulating material such as silicon nitride (SiN x ) or silicon oxide (SiO 2 ) into a single layer or multiple layers.

[0091] The protective layer 160 on the fourth-first layer 131d-1 may be removed by the following process: removing a part of the fourth layer 131d and dividing the region into a fourth-first layer 131d-1 region where the light-emitting element EM is provided and a fourth-second layer 131d-2 region.

[0092] An adhesive layer 170 may be provided on the region of the fourth-first layer 131d-1 where the protective layer 160 is removed. The adhesive layer 170 may be made of indium (In), tin (Sn), metal paste, or an alloy thereof, but is not limited thereto. Herein, when appropriate, the adhesive layer may also be referred to as contact wiring and may sometimes be simply referred to as a metal layer.

[0093] The light-emitting element EM formed on the single crystal substrate may be transferred to the donor substrate DN once and then transferred to the substrate 100 as an array substrate secondarily.

[0094] A plurality of light-emitting elements EM may be included in one donor substrate DN and may be transferred to the first light-emitting element regions ED1-1, ED2-1, and ED3-1 and the second light-emitting element regions ED1-2, ED2-2, and ED3-2 on the protrusion 120.

[0095] According to the light-emitting efficiency of each sub-pixel Sub_PXL, the light-emitting element EM may have different shapes and sizes.

[0096] In addition, as shown, in the case of upward light emission, it may have an inverted conical shape to improve the light emission efficiency, and in the case of downward light emission, it may have a trapezoidal shape or a square shape.

[0097] The light-emitting element EM may be an inorganic light-emitting diode. The inorganic light-emitting diode may have a size of 1 to 50 μm or 1 to 20 μm in the horizontal direction (in the X-axis direction or the Y-axis direction). The inorganic light-emitting diode may be referred to as a micro light-emitting diode. The inorganic light-emitting diode may include a p-doped semiconductor layer, an active layer (e.g., including one or more quantum well layers), and an n-doped semiconductor layer. In addition, the inorganic light-emitting diode may include a first pad electrode connected to the p-doped semiconductor layer and a second pad electrode connected to the n-doped semiconductor layer. The inorganic light-emitting diode may be manufactured using II-VI group or III-V group compound semiconductors. The inorganic light-emitting diode may be manufactured through a separate manufacturing process and may be disposed on the first adhesive layer 170a through a transfer process.

[0098] A second adhesive layer 170b (wherein, in a suitable case, the second adhesive layer may also be referred to as a first metal layer) for increasing the contact force between the light-emitting element EM and the first adhesive layer 170a may also be disposed between the light-emitting element EM and the first adhesive layer 170a.

[0099] The second adhesive layer 170b may be an adhesive containing gold (Au), a metal paste, or a conductive material, but is not limited thereto.

[0100] The first adhesive layer 170a and the second adhesive layer 170b are formed into an adhesive layer 170 through eutectic bonding to fix the light-emitting element EM.

[0101] The transfer method of the light-emitting element EM may use a laser and a stamping process, and the light-emitting element EM may be disposed in the light-emitting element region through such a transfer process. However, due to the misalignment between the donor substrate DN and the substrate 100 or the poor contact between the first adhesive layer 170a and the second adhesive layer 170b, the light-emitting element EM may be transferred to the first light-emitting element region ED3-1, and the light-emitting element EM may not be transferred to the second light-emitting element region ED3-2.

[0102] The laser transfer method may include lowering the donor substrate DN toward the substrate 100, aligning and contacting the light-emitting element EM with the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2, and transferring a laser from the upper part of the donor substrate DN to remove the adhesion force between the donor substrate DN and the light-emitting element EM and enable the light-emitting element EM to be positioned and adhered to the first adhesive layer 170a and the second adhesive layer 170b in the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2.

[0103] The stamping transfer method may include lowering a donor substrate DN toward a substrate 100, aligning and contacting a light-emitting element EM with a first light-emitting element region ED3-1 and a second light-emitting element region ED3-2, and squeezing the donor substrate DN toward the substrate 100 at a low temperature so that the light-emitting element EM can be positioned and adhered onto a first adhesive layer 170a and a second adhesive layer 170b of the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2.

[0104] A first insulating layer 180 may be provided on the first light-emitting element region ED3-1, the second light-emitting element region ED3-2, and the protrusion 120. The first insulating layer 180 may be made of an organic insulating material and may further include scattering particles such as titanium dioxide that reflect or diffuse light as a material for improving the light efficiency of the light-emitting element EM. The first insulating layer 180 may be provided so as to surround the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2, thereby improving the light-emitting effect.

[0105] The first insulating layer 180 is provided on the protrusion 120 on which the light-emitting element EM is provided and surrounds the side surface and the upper surface of the protrusion 120.

[0106] The first insulating layer 180 may be formed to have a high thickness of 1 to 60 μm or 1 to 30 μm so as to surround the protrusion 120 and the light-emitting element EM.

[0107] Since the light-emitting element EM is not transferred to the second light-emitting element region ED3-2, the heights of the first light-emitting element region ED3-1 and the first insulating layer 180 may be formed to be different from each other.

[0108] In order to connect the second electrode 190 and the light-emitting element EM, an upper second pad electrode of the light-emitting element EM may be exposed. A part of the first insulating layer 180 in the first light-emitting element region ED3-1 and the second light-emitting element region ED3-2 may be removed through a masking process.

[0109] Through this masking process, the first insulating layer 180 in the second light-emitting element region ED3-2 may be removed to expose the first adhesive layer 170a.

[0110] A lens 300 may be formed on the upper second pad electrode of the light-emitting element EM and on the first adhesive layer 170a in the second light-emitting element region ED3-2.

[0111] The lens 300 may form an organic insulating film material on the substrate and form a micro-lens shape through a masking process. The lens 300 is a polymer-based material as an optical material and may include acrylate or siloxane.

[0112] The lens 300 can be formed to have an area equal to or larger than that of the first adhesive layer 170a of the second light-emitting element region ED3-2. In this way, the second electrode 190 disposed on the upper portion of the lens 300 does not contact the adhesive layer.

[0113] When the second electrode 190 disposed on the upper portion of the lens 300 is connected to the first adhesive layer 170a, a short circuit may occur due to the electrical connection.

[0114] In addition, the lens 300 can be formed to have an area smaller than the upper surface area of the second pad electrode of the light-emitting element EM. A minimum area that does not overlap with the lens 300 may be required on the upper surface of the light-emitting element EM so that the light-emitting element EM and the second electrode 190 on the lens 300 disposed above the light-emitting element EM can be electrically connected to the second pad electrode above the light-emitting element EM.

[0115] For example, if the area of the upper surface of the light-emitting element EM is 10 μm * 15 μm, the maximum diameter of the lens 300 can be less than 10 μm.

[0116] For example, the maximum area ratio occupied by the lens 300 above the light-emitting element EM may not exceed π / 4, and the maximum size of the lens 300 for contact between the upper electrode of the light-emitting element EM and the second electrode 190 can be a size obtained by multiplying the upper area of the light-emitting element EM by (1 - π / 4). Here, π can represent the ratio of the circumference of a circle to its diameter.

[0117] The first insulating layer 180 can have a first height H1 from the upper surface of the substrate 100 to the uppermost surface of the first insulating layer 180 in the first light-emitting element region ED3-1, and a second height H2 from the upper surface of the substrate 100 to the uppermost surface of the first insulating layer 180 in the second light-emitting element region ED3-2.

[0118] The first height H1 can be higher than the second height H2.

[0119] The second insulating layer 181 can be formed on the upper portion of the substrate 100 and on the side surface of the first insulating layer 180.

[0120] The second insulating layer 181 can flatten the upper surface and can be disposed to surround the side surface of the first insulating layer 180.

[0121] The second insulating layer 181 can be formed of an organic insulating material and can be made of silicone, photosensitive acrylate, or photosensitive polyimide, but is not limited thereto.

[0122] The second contact hole 130H2 can be formed in the second insulating layer 181 to expose the third connection electrode 130.

[0123] The second electrode 190 may be disposed on the second contact hole 130H2, the lens 300, the light-emitting element EM, the first insulating layer 180, and the second insulating layer 181.

[0124] The second electrode 190 may be electrically connected to the third connection electrode 130 to send a driving voltage EVDD or a common voltage EVSS to the light-emitting element EM.

[0125] On the second electrode 190, a third insulating layer 182 may be disposed in an opening region of the first insulating layer 180 formed on the upper portions of the lens 300 and the light-emitting element EM (see Figure 6 ). The third insulating layer 182 may further include scattering particles in an organic insulating material, such as titanium dioxide. The third insulating layer 182 may be formed of the same material as the first insulating layer 180, and may reflect or diffuse light as a material for improving the light efficiency of the light-emitting element EM, and may planarize its upper surface.

[0126] Figure 6 is a cross-sectional view taken along line B-B' of Figure 4 .

[0127] A light-blocking layer 191 may be disposed on the second insulating layer 181, the second electrode 190, and the third insulating layer 182 on which the light-emitting element EM is not disposed.

[0128] The light-blocking layer 191 may be disposed on the entire surface of the substrate on which the light-emitting element EM is not disposed, and the light-blocking layer 191 may be formed by filling the second contact hole 130H2.

[0129] The light-blocking layer 191 may be formed of an organic material including a black material, but is not limited thereto.

[0130] A fourth insulating film 192 and a protective film may be disposed on the second electrode 190 and the light-blocking layer 191, and a touch portion including a touch electrode for driving a touch may be disposed on the protective film.

[0131] In addition, if necessary, a color filter may be additionally disposed in a region corresponding to the light-emitting element, but is not limited thereto.

[0132] An upper substrate 193 for protecting the display device may be disposed on the fourth insulating film 192.

[0133] The upper substrate 193 may be made of a single layer or multiple layers of materials such as but not limited to glass, polyimide, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyethersulfone, polyarylate, polysulfone, and cycloolefin copolymer. The display device according to an embodiment of the present specification may be described as follows.

[0134] A display device according to an embodiment of the present specification can be described as follows.

[0135] A display device according to an embodiment of the present specification may include: a substrate including a display area and a non-display area; a driving circuit part disposed in the display area on the substrate; a plurality of planarization layers disposed on the driving circuit part; and a plurality of pixels disposed on the plurality of planarization layers in the display area, wherein the plurality of pixels may include a plurality of first light-emitting element areas and a plurality of second light-emitting element areas, a first insulating layer may be disposed in the first light-emitting element area and the second light-emitting element area, and the first insulating layer may have different heights in the first light-emitting element area and the second light-emitting element area.

[0136] According to some embodiments of the present specification, the height of the first insulating layer may include a first height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the first light-emitting element area, and a second height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the second light-emitting element area.

[0137] According to some embodiments of the present specification, the first height may be higher than the second height.

[0138] According to some embodiments of the present specification, the plurality of pixels may include a plurality of sub-pixels, and each sub-pixel may include at least one protrusion.

[0139] According to some embodiments of the present specification, the first light-emitting element area and the second light-emitting element area may be disposed on at least one protrusion.

[0140] According to some embodiments of the present specification, below at least one protrusion, a first connection wiring may be disposed corresponding to the first light-emitting element area, and a second connection wiring may be disposed corresponding to the second light-emitting element area.

[0141] According to some embodiments of the present specification, a first connection electrode may be disposed on the first connection wiring, and a second connection electrode may be disposed on the second connection wiring.

[0142] According to some embodiments of the present specification, a first light-emitting element may be disposed on the first connection electrode.

[0143] According to some embodiments of the present specification, the display device includes a lens disposed on the first light-emitting element and a lens disposed on the second connection electrode.

[0144] According to some embodiments of the present specification, a second electrode may be disposed on the lens and the first insulating layer.

[0145] According to some embodiments of the present specification, the display device may further include: a second insulating layer disposed on the second electrode.

[0146] According to some embodiments of the present specification, the second insulating layer may be formed of the same material as the first insulating layer and / or may have a flat upper surface.

[0147] A method of manufacturing a display device according to an embodiment of the present specification may include: preparing a substrate including a display area and a non-display area; forming a driving circuit portion and a plurality of planarization layers on the substrate; forming protrusions on the plurality of planarization layers; forming a first connection electrode and a second connection electrode in a first light-emitting element area and a second light-emitting element area disposed on the protrusions; disposing a light-emitting element on one of the first connection electrode and the second connection electrode; and disposing lenses on the other of the first connection electrode and the second connection electrode and on the upper portion of the light-emitting element, wherein a first insulating layer may be disposed on the first light-emitting element area and the second light-emitting element area.

[0148] According to some embodiments of the present specification, the disposing the light-emitting element may include: performing laser transfer or stamping transfer from a donor substrate to the prepared substrate.

[0149] According to some embodiments of the present specification, the first insulating layer may have a first height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the first light-emitting element area and a second height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the second light-emitting element area.

[0150] According to some embodiments of the present specification, the first height may be formed to be higher than the second height.

[0151] According to some embodiments of the present specification, an adhesive layer is formed on the first connection electrode and the second connection electrode.

[0152] According to some embodiments of the present specification, the lens may be formed to be equal to or larger than the area of the adhesive layer.

[0153] A display device according to an embodiment of the present specification may include: a substrate including a display area and a non-display area; a driving circuit part disposed on the substrate; a plurality of planarization layers disposed on the driving circuit part; and a plurality of pixels disposed on the plurality of planarization layers in the display area, wherein the plurality of pixels may include a plurality of first light-emitting element regions and second light-emitting element regions, wherein a first connection electrode, a first light-emitting element disposed on the first connection electrode, a first lens disposed on the first light-emitting element, and a second electrode disposed on the first lens may be disposed in the first light-emitting element region, and a second connection electrode, a second lens disposed on the second connection electrode, and a second electrode disposed on the second lens may be disposed in the second light-emitting element region.

[0154] According to some embodiments of the present specification, the second connection electrode and the second electrode may be physically and electrically separated by the second lens, that is, they may not be in contact with each other due to the second lens.

[0155] According to some embodiments of the present specification, the second connection electrode and the second electrode are not in contact due to the lens.

[0156] According to some embodiments of the present specification, a protective layer may be disposed on the second connection electrode such that a part of the second connection electrode is exposed, a contact wiring may be disposed on the exposed part of the second connection electrode, and the second lens may cover the contact wiring.

[0157] According to some embodiments of the present specification, the area of the lens is larger than the area of the contact wiring and smaller than the area of the upper surface of the second light-emitting element.

[0158] The embodiments of the present specification have been described in more detail with reference to the accompanying drawings, but the present specification may not necessarily be limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. Therefore, the embodiments disclosed in the present specification are not intended to limit the technical spirit of the present invention, but for illustration, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the above embodiments are illustrative in all aspects and not restrictive. The protection scope of the present invention should be interpreted by the appended claims, and all technical spirits within the equivalent scope should be interpreted as being included within the scope of the present specification.

[0159] Description of Reference Numerals

[0160] 100: Substrate 200: Pixel Driving Circuit Part

[0161] 110: Buffer Layer 111: First Planarization Layer

[0162] 112: Second planarization layer 120: Protrusion

[0163] ED1, ED2, ED3: Light-emitting element regions

[0164] 191: Light-blocking layer 160: Protective layer

[0165] 170: Adhesive layer 180: First insulating layer

[0166] 181: Second insulating layer 182: Third insulating layer

[0167] 190: Second electrode

Claims

1. A display device, comprising: A substrate including a display area and a non-display area; A driving circuit part, which is arranged in the display area on the substrate; A plurality of planarization layers disposed on the driving circuit portion; as well as a plurality of pixels disposed on the plurality of planarization layers in the display area, The plurality of pixels include a plurality of first light emitting element regions and a plurality of second light emitting element regions. A first insulating layer is provided in the first light emitting element region and the second light emitting element region, and The first insulating layer has different heights in the first light emitting element region and the second light emitting element region.

2. The display device according to claim 1, wherein: The height of the first insulating layer includes a first height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the first light-emitting element region, and a second height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the second light-emitting element region.

3. The display device according to claim 2, wherein: The first height is higher than the second height.

4. The display device according to claim 1, wherein: The plurality of pixels includes a plurality of sub-pixels, and Each sub-pixel includes at least one protrusion.

5. The display device according to claim 4, wherein: The first light emitting element region and the second light emitting element region are disposed on the at least one protrusion.

6. The display device according to claim 5, wherein: Under the at least one protruding portion, a first connection wiring is provided corresponding to the first light emitting element region and a second connection wiring is provided corresponding to the second light emitting element region.

7. The display device according to claim 6, wherein: A first connection electrode is provided on the first connection wiring, and a second connection electrode is provided on the second connection wiring.

8. The display device according to claim 7, wherein: A first light emitting element is disposed on the first connecting electrode.

9. The display device according to claim 8, further comprising: A lens is disposed on the first light emitting element and a lens is disposed on the second connection electrode.

10. The display device according to claim 9, wherein: A second electrode is disposed on the lens and the first insulating layer.

11. The display device according to claim 10, further comprising: A second insulating layer is disposed on the second electrode.

12. The display device according to claim 11, wherein: The second insulating layer is formed of the same material as the first insulating layer and / or has a flat upper surface.

13. A method for manufacturing a display device, comprising: Prepare a substrate including a display area and a non-display area; forming a driving circuit portion and a plurality of planarization layers on the substrate; forming a protrusion on the plurality of planarization layers; forming a first connection electrode and a second connection electrode in a first light emitting element region and a second light emitting element region provided on the protrusion; Disposing a light emitting element on one of the first connecting electrode and the second connecting electrode; as well as A lens is disposed on an upper portion of the other of the first connection electrode and the second connection electrode and an upper portion of the light emitting element, respectively. Wherein, a first insulating layer is arranged on the first light emitting element region and the second light emitting element region.

14. The method according to claim 13, wherein: The providing the light emitting element includes performing laser transfer or stamping transfer from the donor substrate to the prepared substrate.

15. The method according to claim 13, wherein: The first insulating layer has a first height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the first light emitting element region, and a second height from the upper surface of the substrate to the uppermost surface of the first insulating layer disposed in the second light emitting element region.

16. The method according to claim 15, wherein: The first height is formed to be higher than the second height.

17. The method according to claim 13, wherein: An adhesive layer is formed on the first connection electrode and the second connection electrode.

18. The method according to claim 17, wherein: The lens is formed to be equal to or larger than an area of ​​the adhesive layer.

19. A display device comprising: A substrate including a display area and a non-display area; A driving circuit part, which is arranged on the substrate; A plurality of planarization layers disposed on the driving circuit portion; as well as a plurality of pixels disposed on the plurality of planarization layers in the display area, The plurality of pixels include a plurality of first light emitting element regions and a second light emitting element region, The first light emitting element region is provided with: a first connection electrode, a first light emitting element provided on the first connection electrode, a first lens provided on the first light emitting element, and a second electrode provided on the first lens; and The second light emitting element region is provided with: a second connection electrode, a second lens provided on the second connection electrode, and a second electrode provided on the second lens.

20. The display device according to claim 19, wherein: The second connection electrode and the second electrode do not contact each other due to the second lens.

21. The display device according to claim 19, wherein: A protective layer is provided on the second connection electrode so that a portion of the second connection electrode is exposed. A contact wiring is provided on the exposed portion of the second connection electrode, and The second lens covers the contact wiring.

22. The display device according to claim 21, wherein: An area of ​​the second lens is larger than an area of ​​the contact wiring and smaller than an area of ​​an upper surface of the second light emitting element.

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