Laser guide repair device for PCB (Printed Circuit Board)

Abstract

The invention provides a laser guide repair device for a PCB, and relates to the field of circuit board production, and the laser guide repair device comprises a machine body, a Y movement mechanism arranged on the machine body, an X movement mechanism arranged on the machine body, a maintenance tin wire arranged on the machine body, and a smoke suction mechanism arranged on the machine body. In order to solve the problems that in the prior art, after a PCB is welded, under the condition that cooling is not carried out, unsolidified tin at the welding position is likely to be separated out when the PCB is conveyed to the next procedure through a conveying rail mechanism, and then the welding quality is affected, the filtering mechanism and the cooling mechanism are arranged; uniform cooling of the two sides of the PCB is achieved, the cooling time of the PCB is shortened, and the working efficiency of repair is improved; through the arrangement of the filtering mechanism and the cooling mechanism, the problem that the welding quality of the PCB is reduced due to too fast cooling in the prior art is solved; and by arranging the cooling mechanism, the problem that welding spots are too large or too small in the prior art is solved.

Description

Technical Field

[0001] The invention relates to the field of circuit board production, and in particular to a laser-guided rework device for a PCB circuit board. Background Art

[0002] The working principle of the laser-guided rework device for PCB circuit boards is mainly based on the high-precision positioning of lasers, combined with optical imaging and automatic control technology to achieve fast and accurate rework of defective points on PCB boards.

[0003] For example, the "online laser-guided rework equipment" disclosed in the Chinese invention patent (application number: 201910041331.2) discloses in its specification: the present invention transmits PCB boards through a conveying track mechanism, and the conveying track mechanism is composed of a front fixed track, a rear movable track, a width-adjusting screw rod, a width-adjusting screw rod seat, a width-adjusting guide rod, a linear bearing, a transmission wheel and a transmission belt. The colored laser device is jointly controlled by the Y motion mechanism and the X motion mechanism, so that the colored laser prompt can quickly find the bad position and use the maintenance welding mechanism to accurately rework the PCB board. During the rework process, the smoking mechanism is composed of a smoking mounting block, a smoking fan, an adjusting guide rod and a guide rod fixing slide. The smoking mechanism is opened in time to ensure that the air around the operating table is not polluted by smoke and dust.

[0004] However, the above-mentioned online laser guided repair equipment still has some shortcomings in the actual use process: in the above-mentioned prior art, when repairing the PCB board, after the bad position of the PCB board is welded by the repair welding mechanism, it is necessary to wait for the welding part of the PCB board to cool to a certain degree before the next process can be carried out. If the PCB board that has not been cooled is directly carried out to the next process, this will cause the unsolidified tin at the welding part to precipitate, thereby affecting the welding quality. At this time, the conveying track mechanism cannot be started in a short time, and the natural cooling time of the welded PCB board takes 10-15 minutes, which will affect the work efficiency of the PCB board repair. In addition, the smoke generated during welding, the exhaust fan only discharges the smoke through simple air flow, and cannot deeply purify the harmful substances in the smoke (such as particulate matter, toxic gases, etc.). These fumes may spread in the workshop, causing secondary pollution. In this way, when waiting for the PCB board to cool naturally, the smoke spread in the workshop will affect the normal work of the workers in the repair.

[0005] Therefore, we have made improvements to this problem and proposed a laser-guided rework device for PCB circuit boards. Summary of the invention

[0006] The purpose of the present invention is to solve the problem that, after welding, when a PCB board is transferred to the next process through a conveying track mechanism without cooling, unsolidified tin at the welding position is easily precipitated, thereby affecting the welding quality.

[0007] In order to achieve the above-mentioned purpose of the invention, the present invention provides a laser-guided rework device for a PCB circuit board to improve the above-mentioned problem.

[0008] The specific application is as follows: It includes a machine body, a Y motion mechanism arranged on the machine body, an X motion mechanism arranged on the machine body, a maintenance tin wire arranged on the machine body, a smoking mechanism arranged on the machine body, a conveying track mechanism arranged on the machine body and a maintenance welding mechanism arranged on the machine body, and also includes a filtering mechanism arranged on the smoking mechanism and a cooling mechanism arranged on the filtering mechanism; The filtering mechanism comprises a threaded tube 1 arranged on the smoking mechanism, a threaded tube 2 threadedly connected to the threaded tube 1, and activated carbon arranged in the threaded tube 2; The cooling mechanism includes a fixing seat arranged on the machine body, a Y-shaped tube arranged on the fixing seat, the Y-shaped tube is connected with the threaded tube 2, an exhaust hole arranged on the Y-shaped tube, and a transfer component arranged on the fixing seat.

[0009] As a preferred technical solution of the present application, the cooling mechanism also includes inlet and outlet holes arranged on the Y-shaped tube, and a plurality of sealing plates are rotatably arranged in the Y-shaped tube, and the plurality of sealing plates are respectively adapted to the inlet and outlet holes and the exhaust holes.

[0010] As a preferred technical solution of the present application, the transfer component includes a hose 1 arranged on a fixed seat, a movable seat is arranged at one end of the hose 1 away from the fixed seat, a cavity is arranged in the movable seat, a plurality of spray holes are arranged on the cavity, a hose 2 is arranged in the hose 1, one end of the hose 2 is rotatably arranged on the movable seat, and the other end of the hose 2 is rotatably arranged on the Y-shaped tube, the sealing plate is connected to the hose 2, and the cavity is connected to the hose 2.

[0011] As a preferred technical solution of the present application, a connecting hole is arranged in the Y-shaped tube, the blocking plate is slidably arranged on the connecting hole, a stopper is arranged on the blocking plate, and the stopper is adapted to the connecting hole.

[0012] As a preferred technical solution of the present application, a strip groove is arranged in the movable seat, an L-shaped block is slidably arranged on the strip groove, a guide column is arranged on the L-shaped block, a sliding roller is slidably arranged on the outer side of the guide column, a rotating block is arranged on the outer side of the movable seat, an arc groove is arranged on the rotating block, the sliding roller is slidably arranged on the arc groove, and an extrusion plate is rotatably arranged on the sliding roller.

[0013] As a preferred technical solution of the present application, the output end of the extrusion plate is wedge-shaped, and the extrusion plate is connected to the rotating part of the sliding roller through a torsion spring.

[0014] As a preferred technical solution of the present application, a guide groove is arranged on the outer side of the guide column, the sliding roller is slidably arranged on the guide groove, and the material of the inner side of the sliding roller is rubber.

[0015] As a preferred technical solution of the present application, a scale is provided on the outer side of the guide column.

[0016] As a preferred technical solution of the present application, an opening and closing groove is arranged in the second hose, a push block is slidably arranged in the opening and closing groove, and the push block and the second hose are adapted to each other.

[0017] As a preferred technical solution of the present application, a pushing column is rotatably arranged on the L-shaped block, and the pushing column is slidably arranged on the moving seat. A threaded extrusion groove is arranged on the outer side of the pushing column, and a protrusion is arranged on the moving seat. The protrusion is adapted to the threaded extrusion groove, and the pushing block is arranged on the pushing column.

[0018] Compared with the prior art, the present invention has the following beneficial effects: In the scheme of this application: 1. In order to solve the problem in the prior art that after welding, the PCB board is transferred to the next process through the conveying track mechanism without cooling, which easily leads to the precipitation of unsolidified tin at the welding position, thereby affecting the welding quality, the present application provides a filtering mechanism and a cooling mechanism, and filters the smoke inhaled by the existing smoking mechanism through the filtering mechanism, and transfers the filtered gas to both sides of the welding position of the PCB board through the cooling mechanism, thereby achieving uniform cooling of both sides of the PCB board, shortening the cooling time of the PCB board, and improving the work efficiency of rework; 2. Through the provided filtering mechanism and cooling mechanism, the size of the blocking of the exhaust hole by the blocking plate and the size of the blocking of the connection hole by the block, the cooling degree of the spray hole and the exhaust hole on both sides of the PCB board is controlled, the welding quality of the PCB board is improved, and the problem of reduced welding quality of the PCB board caused by excessive cooling in the prior art is solved; 3. Through the cooling mechanism, the extrusion plate is moved up and down, and the maintenance tin wire is squeezed out evenly, ensuring that the amount of solder is consistent each time welding, solving the problem of too large or too small solder joints in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a laser-guided rework device for a PCB circuit board provided in this application; Figure 2 A schematic diagram of a partial cross-sectional structure of the laser-guided repair device for a PCB circuit board provided in this application; Figure 3 A schematic diagram of the filter structure of the laser-guided rework device for PCB circuit boards provided in this application; Figure 4 A schematic diagram of a cross-sectional structure of a hose of a laser-guided rework device for a PCB circuit board provided in this application; Figure 5 A schematic diagram of a cross-sectional structure of a Y-shaped tube for a laser-guided rework device for a PCB circuit board provided in this application; Figure 6 A schematic diagram of the exploded structure of the Y-shaped tube portion of the laser-guided rework device for PCB circuit boards provided in this application; Figure 7 A schematic diagram of the internal two-dimensional structure of a moving base of a laser-guided rework device for a PCB circuit board provided in this application; Figure 8 Laser-guided rework device for PCB circuit board provided in this application Figure 7 Schematic diagram of the enlarged structure of the middle A area; Fig. 9 A schematic cross-sectional structure diagram of a moving seat of a laser-guided rework device for a PCB circuit board provided in this application; Fig.10 A schematic diagram of the overall structure of the rotating block of the laser-guided rework device for PCB circuit boards provided in this application; Fig.11 A schematic diagram of the overall structure of the extrusion plate of the laser-guided rework device for PCB circuit boards provided in this application.

[0020] Indicated in the figure: 1. Machine body; 101. Y motion mechanism; 102. X motion mechanism; 103. Repair tin wire; 104. Smoking mechanism; 105. Conveying track mechanism; 106. Repair welding mechanism; 2. Filter mechanism; 201. Threaded pipe 1; 202. Threaded pipe 2; 203. Activated carbon; 3. Cooling mechanism; 301. Fixed seat; 302. Y-shaped tube; 303. Exhaust hole; 304. Transfer component; 3041. Hose 1; 3042. Moving seat; 3043. Cavity; 3044. Spray hole; 3045. Hose 2; 305. Inlet and outlet hole; 306. Sealing plate; 307. Connecting hole; 308. Block; 309. Strip groove; 310. L-shaped block; 311. Guide column; 312. Sliding roller; 313. Rotating block; 314. Arc groove; 315. Extrusion plate; 316. Guide groove; 317. Scale; 318. Opening and closing groove; 319. Pushing block; 320. Pushing column; 321. Threaded extrusion groove; 322. Bump. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0022] As described in the background art, after welding, the existing PCB board is transferred to the next process through a conveyor track mechanism without cooling, which easily causes the unsolidified tin at the welding point to precipitate, thereby affecting the welding quality.

[0023] In order to solve this technical problem, the present invention provides a laser-guided rework device for a PCB circuit board, which is applied to circuit board production.

[0024] Specifically, please refer to Figure 1-Figure 11 The laser guided rework device for PCB circuit board specifically comprises: a body 1, a Y motion mechanism 101 arranged on the body 1, an X motion mechanism 102 arranged on the body 1, a maintenance tin wire 103 arranged on the body 1, a smoking mechanism 104 arranged on the body 1, a conveying track mechanism 105 arranged on the body 1 and a maintenance welding mechanism 106 arranged on the body 1, and also comprises a filtering mechanism 2 arranged on the smoking mechanism 104, and a cooling mechanism 3 arranged on the filtering mechanism 2. In the prior art, the X motion mechanism 102 and the Y motion mechanism 101 are used to control the colored laser device to indicate the position of the bad point on the PCB board, the smoking mechanism 104 is used to collect the smoke generated during the rework process, the maintenance welding mechanism 106 is used to cooperate with the operator to rework the PCB board with abnormal test, and the conveying track mechanism 105 is used to transport the PCB board; The filter mechanism 2 includes a threaded tube 1 201 disposed on the smoking mechanism 104, a threaded tube 202 threadedly connected to the threaded tube 1 201, and activated carbon 203 disposed in the threaded tube 202; The cooling mechanism 3 includes a fixing seat 301 arranged on the body 1 , a Y-shaped tube 302 arranged on the fixing seat 301 , the Y-shaped tube 302 is connected to the threaded tube 202 , an exhaust hole 303 arranged on the Y-shaped tube 302 , and a transfer component 304 arranged on the fixing seat 301 .

[0025] The laser guided rework device for PCB circuit boards provided by the present invention is designed to solve the problem in the prior art that after welding, the PCB board is transferred to the next process through the conveying track mechanism 105 without cooling, which easily leads to the precipitation of unsolidified tin at the welding position, thereby affecting the welding quality. The present application provides a filtering mechanism 2 and a cooling mechanism 3, and filters the smoke sucked by the existing smoking mechanism 104 through the filtering mechanism 2, and transfers the filtered gas to both sides of the welding position of the PCB board through the cooling mechanism 3, thereby achieving uniform cooling of both sides of the PCB board, shortening the cooling time of the PCB board, and improving the work efficiency of rework; By setting the filtering mechanism 2 and the cooling mechanism 3, the extent of the blocking of the exhaust hole 303 by the blocking plate 306 and the extent of the blocking of the connecting hole 307 by the stopper 308 are controlled, thereby controlling the cooling degree of the spray hole 3044 and the exhaust hole 303 on both sides of the PCB board, thereby improving the welding quality of the PCB board, and solving the problem of reduced welding quality of the PCB board caused by excessive cooling in the prior art; By setting the cooling mechanism 3, the extrusion plate 315 is moved up and down, and the maintenance tin wire 103 is extruded to be uniformly discharged, ensuring that the amount of solder used is consistent during each welding, thereby solving the problem of too large or too small solder joints in the prior art.

[0026] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, a laser-guided rework device for a PCB circuit board, wherein the cooling mechanism 3 also includes an inlet and outlet hole 305 arranged on a Y-shaped tube 302, and a plurality of blocking plates 306 are rotatably arranged in the Y-shaped tube 302, and the plurality of blocking plates 306 are respectively adapted to the inlet and outlet hole 305 and the exhaust hole 303. In the prior art, the smoking mechanism 104 is composed of a smoking mounting block, a smoking fan, an adjusting guide rod and a guide rod fixing slide, wherein the threaded tube 1 201 is installed on the smoking mounting block and is on a horizontal line with the smoking fan, the threaded tube 1 201 is used to guide the smoke discharged by the smoking fan, the activated carbon 203 is used to filter the smoke discharged by the smoking fan, the threaded tube 202 is connected to the threaded tube 1 201 and the Y-shaped tube 302 by threads, so that the threaded tube 202 is easy to disassemble, and then the activated carbon 203 in the threaded tube 202 is easy to replace, and the exhaust hole 303 is aligned with the PCB board, such as Figure 1 As shown, after the PCB board is welded, the smoke generated during welding is absorbed by the smoking mechanism 104, and the smoke is filtered by the filtering mechanism 2. The filtered gas enters the Y-shaped tube 302, and the filtered gas is discharged from the exhaust hole 303. One side of the PCB board is cooled by the filtered gas. The initial state of the device is that the sealing plate 306 seals the exhaust hole 303, and the inlet and outlet holes 305 are opened. The inlet and outlet holes 305 are provided with two and are respectively provided below the Y-shaped tube 302, as shown in FIG. Figure 5 As shown, the filtered gas is discharged through the inlet and outlet holes 305, so that when the PCB board is welded, the exhaust hole 303 is blocked to prevent the PCB board from being cooled during welding, resulting in uneven heating and cooling of the PCB board and welding defects. After the PCB board is welded, multiple blocking plates 306 rotate synchronously, and the blocking plates 306 unblock the exhaust hole 303. At the same time, the blocking plates 306 block the inlet and outlet holes 305, so that the exhaust hole 303 is expanded, and the filtered gas is discharged from the exhaust hole 303 and cools the PCB board, so that the cooling time of the PCB board is shortened and the work efficiency of the rework is improved. Furthermore, the transfer component 304 includes a hose 1 3041 arranged on the fixed seat 301, a movable seat 3042 is arranged at one end of the hose 1 3041 away from the fixed seat 301, a cavity 3043 is arranged in the movable seat 3042, a plurality of spray holes 3044 are arranged on the cavity 3043, a hose 2 3045 is arranged in the hose 1 3041, one end of the hose 2 3045 is rotatably arranged on the movable seat 3042, and the other end of the hose 2 3045 is rotatably arranged on the Y-shaped tube 302, a blocking plate 306 is connected to the hose 2 3045, and the cavity 3043 is communicated with the hose 2 3045. When the hose 2 3045 rotates, the hose 2 3045 drives the plurality of blocking plates 306 to rotate synchronously, thereby controlling the blocking plates 306 to control the inlet and outlet holes 305 and The exhaust hole 303 is blocked by fixing the hose 1 3041 with the movable seat 3042 and the fixed seat 301 to prevent the hose 1 3041 from rotating synchronously when the movable seat 3042 is rotated, wherein the filtered gas enters the hose 2 3045 from the Y-shaped tube 302, and then enters the cavity 3043 from the hose 2 3045, and finally is discharged from the spray hole 3044. The movable seat 3042 is manually driven by the staff, and the movable seat 3042 is aligned with the welding part of the PCB board, so that the welding part of the PCB board is cooled in a targeted manner, and the filtered gas discharged through the exhaust hole 303 and the gas discharged from the spray hole 3044 cool both sides of the PCB board at the same time, so as to prevent the uneven cooling of the PCB board from affecting the welding quality; Further, a connecting hole 307 is provided in the Y-shaped tube 302, and a blocking plate 306 is slidably provided on the connecting hole 307. A block 308 is provided on the blocking plate 306, and the block 308 is adapted to the connecting hole 307. The connecting hole 307 is blocked by the block 308, wherein the size of the blocking of the connecting hole 307 by the block 308 is used to control the flow rate of the filtered gas entering the second hose 3045. According to the different sizes of the welding area of ​​the PCB board, the size of the blocking of the exhaust hole 303 by the blocking plate 306 and the size of the blocking of the connecting hole 307 by the block 308 can be controlled to control the cooling degree of the two sides of the PCB board by the spray hole 3044 and the exhaust hole 303, thereby improving the welding quality of the PCB board; Through the cooperation of the filtering mechanism 2 and the cooling mechanism 3, targeted cooling is performed on both sides of the welding part of the PCB board, so that the welding part is cooled evenly, the cooling time of the PCB board is shortened, and the work efficiency of rework is improved. At the same time, according to the welding area of ​​the PCB board, the cooling degree of the spray hole 3044 and the exhaust hole 303 on both sides of the PCB board is controlled by the cooling mechanism 3 to improve the welding quality.

[0030] Embodiment 2 further optimizes the laser-guided repair device for PCB circuit boards provided in Embodiment 1. Specifically, Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 and Fig.11 As shown, a strip groove 309 is provided in the movable seat 3042, an L-shaped block 310 is slidably provided on the strip groove 309, a guide column 311 is provided on the L-shaped block 310, a sliding roller 312 is slidably provided on the outer side of the guide column 311, a rotating block 313 is provided on the outer side of the movable seat 3042, an arc groove 314 is provided on the rotating block 313, the sliding roller 312 is slidably provided on the arc groove 314, an extrusion plate 315 is rotatably provided on the sliding roller 312, the maintenance tin wire 103 slides on the movable seat 3042, the rotating block 313 is manually driven to rotate, and the rotating block 313 drives the sliding roller 312 Together with the guide column 311, it slides along the arc groove 314 and the strip groove 309, and the extrusion plate 315 on the sliding roller 312 squeezes and fixes the maintenance tin wire 103. When the moving seat 3042 moves, the maintenance tin wire 103 moves synchronously. Through the cooperation of the maintenance tin wire 103 and the maintenance welding mechanism 106, the PCB board is welded. The maintenance tin wire 103 is squeezed and fixed by the extrusion plate 315. Compared with the existing direct hand-held welding, by driving the moving seat 3042 and the maintenance tin wire 103 to move synchronously, the situation of workers being burned during welding is avoided; Furthermore, the output end of the extrusion plate 315 is wedge-shaped, and the extrusion plate 315 is connected to the rotation of the sliding roller 312 through a torsion spring. When the rotating block 313 is pushed up and down, the sliding roller 312 on the rotating block 313 is synchronously displaced. When the extrusion plate 315 on the sliding roller 312 is displaced upward, the extrusion plate 315 rotates through the elasticity of the torsion spring and slides along the surface of the repair tin wire 103. When the extrusion plate 315 is displaced downward, the extrusion plate 315 squeezes the repair tin wire 103 and drives the repair tin wire 103 to displace downward synchronously, so that the repair tin wire 103 is evenly discharged. The evenly discharged repair tin wire 103 can ensure that the amount of solder used is consistent during each welding, thereby forming a uniform and regular solder joint, and the shape, size and strength of the solder joint can be kept consistent, avoiding the problem of the solder joint being too large or too small. Furthermore, a guide groove 316 is provided on the outer side of the guide column 311, and the sliding roller 312 is slidably provided on the guide groove 316. The inner side of the sliding roller 312 is made of rubber. The sliding roller 312 is guided by the guide groove 316, and the sliding roller 312 is prevented from rotating, thereby preventing the extrusion plate 315 from deviating when clamping the repair tin wire 103. The inner side of the sliding roller 312 is made of rubber, which can increase the friction between the sliding roller 312 and the guide groove 316, and prevent the sliding roller 312 from sliding along the guide groove 316 due to the gravity of the rotating block 313. Furthermore, a scale 317 is provided on the outer side of the guide column 311, and the amount of the repair tin wire 103 discharged is controlled by the set scale 317. According to the area of ​​the PCB board welding part, the amount of the repair tin wire 103 discharged is controlled, so that the repair tin wire 103 can be fully utilized, thereby improving the utilization rate of the repair tin wire 103; Furthermore, an opening and closing groove 318 is provided in the second hose 3045, and a push block 319 is slidably provided in the opening and closing groove 318. The push block 319 and the second hose 3045 are adapted to each other. The opening and closing groove 318 is used to guide the push block 319, and the push block 319 is used to block the second hose 3045. When the push block 319 blocks the second hose 3045, the stopper 308 blocks the connecting hole 307 at the same time, so that the filtered gas will not enter the second hose 3045, and then the second hose 3045 is ventilated, so that the maintenance tin wire 103 on the movable seat 3042 and the welding mechanism will not be affected when welding the PCB board; Further, a push column 320 is rotatably provided on the L-shaped block 310, and the push column 320 is slidably provided on the moving seat 3042. A threaded extrusion groove 321 is provided on the outer side of the push column 320, and a convex block 322 is provided on the moving seat 3042. The convex block 322 is adapted to the threaded extrusion groove 321. The push block 319 is provided on the push column 320. When the rotating block 313 is driven to rotate, the rotating block 313 drives the sliding roller 312 to unfold synchronously together with the guide column 311, and the guide column 311 drives the L-shaped block 310 to move along the strip groove 309, and the L-shaped block 310 drives the push column 320 to move synchronously. The threaded extrusion groove 321 on the outer side of the push column 320 is provided on the outer side of the push column 320. The extrusion groove 321 squeezes the protrusion 322, and the protrusion 322 drives the push column 320 to rotate, and then the push block 319 on the push column 320 is displaced and rotated along the direction of the opening and closing groove 318, wherein the push block 319 drives the second hose 3045 to rotate, thereby causing the blocking plate 306 to rotate synchronously, wherein when the push block 319 is displaced along the opening and closing groove 318, the gap between the push block 319 and the second hose 3045 is exposed, and then the gas in the second hose 3045 can enter the cavity 3043, and when the push block 319 is at the end position of the second hose 3045, the push block 319 is used to block the second hose 3045, such as Fig. 9 As shown; By moving the rotating block 313 up and down, the uniform discharge of the maintenance tin wire 103 is achieved to avoid the problem of the solder joint being too large or too small. By rotating the rotating block 313, the rotation angle of the hose 2 3045 is adjusted to control the air volume of the exhaust hole 303 and the nozzle 3044, thereby controlling the cooling degree of both sides of the PCB board. By rotating the rotating block 313, the extrusion plate 315 is driven to clamp and fix the maintenance tin wire 103 to avoid the situation where the staff is burned during welding.

[0031] The use process of the laser guided rework device for PCB circuit boards provided by the present invention is as follows: When in use, when the PCB board is being soldered, the rotating block 313 is pushed back and forth up and down, and the sliding roller 312 on the rotating block 313 is synchronously displaced. When the extrusion plate 315 on the sliding roller 312 is displaced upward, the extrusion plate 315 is rotated by the elasticity of the torsion spring and slides along the surface of the repair tin wire 103. When the extrusion plate 315 is displaced downward, the extrusion plate 315 squeezes the repair tin wire 103 and drives the repair tin wire 103 to move downward synchronously, so that the repair tin wire 103 is evenly discharged. The PCB board is welded by the cooperation of the repair tin wire 103 and the repair welding mechanism 106. When the PCB board is welded, the rotating block 313 is driven to rotate, and the rotating block 313 drives the sliding roller 312 and the guide column 311 to unfold synchronously. The guide column 311 drives the L-shaped block 310 to move along the strip groove 309, and the L-shaped block 310 drives the push column 320 to move synchronously. The threaded extrusion groove 321 on the outer side of the push column 320 squeezes the protrusion 322, and the protrusion 322 drives the push column The push block 319 on the push column 320 is displaced and rotated along the direction of the opening and closing groove 318, wherein the push block 319 drives the second hose 3045 to rotate, thereby causing the blocking plate 306 to rotate synchronously, wherein when the push block 319 is displaced along the opening and closing groove 318, the gap between the push block 319 and the second hose 3045 is exposed, and at the same time, the second hose 3045 drives the multiple blocking plates 306 to rotate synchronously, thereby controlling the blocking plates 306 to control the inlet and outlet holes 305 and the exhaust The hole 303 is blocked, and the filtered gas enters the second hose 3045 from the Y-shaped tube 302, and then enters the cavity 3043 from the second hose 3045, and is finally discharged from the nozzle 3044. The two sides of the PCB board are cooled in a targeted manner through the expansion of the nozzle 3044 and the inlet and outlet holes 305, thereby reducing the cooling time of the PCB board. The size of the blocking of the exhaust hole 303 by the blocking plate 306 and the size of the blocking of the connecting hole 307 by the block 308 are controlled by the rotation angle of the second hose 3045.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A laser-guided repair device for a PCB circuit board, comprising a body (1), a Y-motion mechanism (101) arranged on the body (1), an X-motion mechanism (102) arranged on the body (1), a repair tin wire (103) arranged on the body (1), a smoking mechanism (104) arranged on the body (1), a conveying track mechanism (105) arranged on the body (1), and a repair welding mechanism (106) arranged on the body (1), characterized in that: It also includes a filtering mechanism (2) arranged on the smoking mechanism (104), and a cooling mechanism (3) arranged on the filtering mechanism (2); The filtering mechanism (2) comprises a threaded tube 1 (201) arranged on the smoking mechanism (104), a threaded tube 2 (202) threadedly connected to the threaded tube 1 (201), and activated carbon (203) arranged in the threaded tube 2 (202); The cooling mechanism (3) comprises a fixing seat (301) arranged on the machine body (1), a Y-shaped tube (302) arranged on the fixing seat (301), the Y-shaped tube (302) being connected to the second threaded tube (202), an exhaust hole (303) arranged on the Y-shaped tube (302), and a transfer component (304) arranged on the fixing seat (301).

2. A laser guided repair device for a PCB circuit board according to claim 1, characterized in that: The cooling mechanism (3) further comprises an inlet and outlet hole (305) arranged on the Y-shaped tube (302), and a plurality of blocking plates (306) are rotatably arranged in the Y-shaped tube (302), and the plurality of blocking plates (306) are respectively adapted to the inlet and outlet hole (305) and the exhaust hole (303).

3. A laser guided repair device for a PCB circuit board according to claim 2, characterized in that: The transfer component (304) comprises a first hose (3041) arranged on a fixed seat (301); a movable seat (3042) is arranged at one end of the first hose (3041) away from the fixed seat (301); a cavity (3043) is arranged in the movable seat (3042); a plurality of spray holes (3044) are arranged in the cavity (3043); a second hose (3045) is arranged in the first hose (3041); one end of the second hose (3045) is rotatably arranged on the movable seat (3042); the other end of the second hose (3045) is rotatably arranged on the Y-shaped tube (302); the blocking plate (306) is connected to the second hose (3045); and the cavity (3043) is in communication with the second hose (3045).

4. A laser guided repair device for a PCB circuit board according to claim 3, characterized in that: A connecting hole (307) is provided in the Y-shaped tube (302), the blocking plate (306) is slidably disposed on the connecting hole (307), a stopper (308) is provided on the blocking plate (306), and the stopper (308) is adapted to fit the connecting hole (307).

5. A laser guided repair device for a PCB circuit board according to claim 4, characterized in that: A strip groove (309) is arranged inside the movable seat (3042), an L-shaped block (310) is slidably arranged on the strip groove (309), a guide column (311) is arranged on the L-shaped block (310), a sliding roller (312) is slidably arranged on the outer side of the guide column (311), a rotating block (313) is arranged on the outer side of the movable seat (3042), an arc groove (314) is arranged on the rotating block (313), the sliding roller (312) is slidably arranged on the arc groove (314), and an extrusion plate (315) is rotatably arranged on the sliding roller (312).

6. A laser-guided repair device for a PCB circuit board according to claim 5, characterized in that: The output end of the extrusion plate (315) is wedge-shaped, and the extrusion plate (315) is connected to the rotation point of the sliding roller (312) via a torsion spring.

7. A laser guided repair device for a PCB circuit board according to claim 6, characterized in that: A guide groove (316) is provided on the outer side of the guide column (311), the sliding roller (312) is slidably arranged on the guide groove (316), and the inner side of the sliding roller (312) is made of rubber.

8. The laser-guided repair device for a PCB circuit board according to claim 7, characterized in that: The outer side of the guide column (311) is provided with a scale (317).

9. A laser-guided repair device for a PCB circuit board according to claim 8, characterized in that: An opening and closing groove (318) is provided in the second hose (3045), a push block (319) is slidably provided in the opening and closing groove (318), and the push block (319) and the second hose (3045) are adapted to each other.

10. A laser guided repair device for a PCB circuit board according to claim 9, characterized in that: A push column (320) is rotatably arranged on the L-shaped block (310), the push column (320) is slidably arranged on the movable seat (3042), a thread extrusion groove (321) is arranged on the outer side of the push column (320), a convex block (322) is arranged on the movable seat (3042), the convex block (322) is matched with the thread extrusion groove (321), and the push block (319) is arranged on the push column (320).

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