Method, system and equipment for monitoring automatic binding process of metal wires

Abstract

The invention relates to the technical field of strapping process monitoring, and particularly discloses a metal wire automatic strapping process monitoring method, system and equipment, and the method comprises the steps: screening all qualified metal wires to enter an automatic strapping process, analyzing the characteristic measurement values of all the qualified metal wires, and monitoring the strapping process of all the qualified metal wires in real time. And the comprehensive operation efficiency index is analyzed, and bundling equipment is adjusted. Qualified wires can be effectively screened, inferior-quality products are prevented from entering the follow-up process, and the basic quality of products is guaranteed. Effective and targeted analysis of the binding process is achieved for wires with different characteristics, follow-up adjustment is conducted according to the analysis result, the adaptability of equipment to production tasks is enhanced, the stability of binding quality is effectively improved, the defective rate is reduced, the speed of a winding motor and the speed of a moving motor are reasonably adjusted, the thread pitch of iron wire winding can be guaranteed, and the production efficiency is improved. And the wire arrangement is uniform and neat.

Description

Technical Field

[0001] The present invention relates to the technical field of bundling process monitoring, and in particular to a method, system and equipment for monitoring the automatic bundling process of metal wires. Background Art

[0002] Metal wires are widely used as basic materials in many fields such as construction, machinery manufacturing, and electronics. The bundling process requires that the ends of the wire ropes or the roots of the ropes be fixed together to prevent the wire ropes from cracking and scattering. When bundling, attention should be paid to the firmness and tightness of the fixation to ensure that they will not spread or loosen. Reasonable bundling can ensure that the metal wires remain neat and orderly during transportation and storage, and avoid the wires from being entangled and worn, thereby ensuring that their performance is not damaged. If there are problems in the bundling process, such as loose bundling due to loose wires, it may cause deformation of the wires during subsequent handling, affect their accuracy and strength, and reduce product quality. If the bundling is too tight, scratches may appear on the surface of the wires, increase the risk of rust, and shorten the service life. However, the existing automatic bundling process monitoring mode is often fixed and lacks flexibility, and it is difficult to adapt to metal wires of different specifications and materials, resulting in uneven bundling quality and a high defective rate, which seriously affects production efficiency.

[0003] For example, the invention patent with the announcement number CN106971277B announces a rod and wire material tracking system and method, including: a coding controller, used to obtain the raw material information of the current rod and wire and generate a label associated with the raw material information of the current rod and wire; and to obtain the finished product information of the current rod and wire and generate a corresponding label spacing; a label marking mechanism, used to obtain the label generated by the coding controller, and mark the label associated with the raw material information of the current rod and wire on the rod and wire that has not been subjected to multiple-length flying shearing according to the spacing; a distance controller, used to obtain the spacing generated by the coding controller, detect whether the label marking mechanism is in a working state, and control the movement of the label marking mechanism: if the label marking mechanism is in a non-working state, control the label marking mechanism to move according to the spacing; if the label is in a working state, control the label marking mechanism to maintain the original position.

[0004] For example, the invention patent with publication number CN115456374A discloses a direct rolling production management method for rods and wires, the method comprising: generating corresponding virtual billet materials and finished product virtual materials according to quality control requirements and material requirements in the rod and wire production process, and configuring material parameters and material status for the virtual billet materials and finished product virtual materials; scheduling steel rolling according to each virtual billet material and each finished product virtual material, and the corresponding configured material parameters and material status, to obtain steel rolling scheduling information; scheduling steelmaking according to the steel rolling scheduling information, to obtain steelmaking scheduling information; executing direct rolling production of rods and wires according to the steelmaking scheduling information and the steel rolling scheduling information, wherein, in the process of executing the direct rolling production of rods and wires, the steel rolling scheduling information is dynamically adjusted according to changes in the steelmaking scheduling information.

[0005] However, in the process of implementing the embodiments of the present application, the present application found that the above technology has at least the following technical problems: The current wire bundling monitoring methods are limited in data collection sources and mostly focus only on the basic operating parameters of the bundling equipment. However, metal wires usually have different material specifications and qualities, and the levels of demand for production control often vary. Only focusing on equipment supervision makes it difficult to quickly and accurately make intelligent adjustments to bundling parameters and equipment operating modes, which often leads to unstable bundling quality, increased defective rate, and reduced accuracy and efficiency of automatic metal wire bundling monitoring. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a method, system and device for monitoring the automatic bundling process of metal wires, which can effectively solve the problems involved in the above-mentioned background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: In a first aspect, the present invention provides a method for monitoring the automatic bundling process of metal wires, including: S1, turning on the wire conveying device, introducing each metal wire to be bundled into the bundling area, obtaining the quality parameters of each metal wire to be bundled, analyzing the quality evaluation value of each metal wire to be bundled, and screening each qualified metal wire to enter the automatic bundling process.

[0008] S2, obtaining characteristic parameters of each qualified metal wire, analyzing characteristic measurement values ​​of each qualified metal wire, thereby obtaining allowable fluctuation parameters and comprehensive operation performance verification index of each qualified metal wire.

[0009] S3, start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire.

[0010] S4, based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, the comprehensive operation efficiency index is analyzed, and the bundling equipment is adjusted accordingly and prompt information is generated.

[0011] A second aspect of the present invention provides a metal wire automatic bundling process monitoring system, comprising: The qualified metal wire screening module is used to start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire to enter the automatic bundling process.

[0012] The qualified metal wire characteristic analysis module is used to obtain the characteristic parameters of each qualified metal wire, analyze the characteristic measurement value of each qualified metal wire, and thus obtain the allowable fluctuation parameter and comprehensive operation performance verification index of each qualified metal wire.

[0013] The automatic bundling process monitoring module is used to start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire.

[0014] The bundling equipment adjustment module is used to analyze the comprehensive operation efficiency index based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, thereby adjusting the bundling equipment and generating prompt information.

[0015] A third aspect of the present invention provides a metal wire automatic bundling process monitoring device, comprising: an automatic bundling device, a wire bundling monitoring sensor device, a high-definition scanner and an infrared sensor.

[0016] Automatic bundling device, used for automatic bundling of wires.

[0017] The wire bundling monitoring sensor device is used to collect parameters related to the automatic wire bundling process.

[0018] High-definition scanner, used to acquire and analyze body surface strapping images.

[0019] Infrared sensor, used to sense and collect temperature.

[0020] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects: (1) The present invention provides a method, system and equipment for monitoring the automatic bundling process of metal wires, which can effectively screen qualified wires, prevent defective products from entering the subsequent process, and ensure the basic quality of the product. In terms of operation, it can realize effective and targeted analysis of the bundling process for wires with different characteristics, and make subsequent adjustments based on the analysis results, thereby enhancing the adaptability of the equipment to production tasks, effectively improving the stability of the bundling quality, and reducing the defective rate. At the same time, according to the deviation between the comprehensive operation efficiency index and the verification index, the speed of the winding motor and the moving motor is reasonably adjusted to avoid waste of resources and improve production efficiency.

[0021] (2) The present invention can ensure the quality of the wires entering the automatic bundling process from the source by screening out qualified metal wires, avoiding subsequent bundling problems caused by quality defects of the wires themselves, reducing material waste caused by defective products participating in bundling, and improving bundling efficiency.

[0022] (3) The present invention obtains the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire according to the characteristic measurement value of each qualified metal wire, thereby realizing the refined management of metal wires with different characteristics during the bundling process, and providing accurate data adjustment basis for the operation of subsequent bundling equipment. The equipment can perform targeted parameter adaptation according to the specific characteristics of the wire, effectively reduce the bundling error caused by wire differences, and improve the consistency and stability of bundling. At the same time, the comprehensive operation efficiency verification index helps to set reasonable operation standards in advance and discover potential operation anomalies in time, thereby optimizing the entire production process, reducing equipment failure rate, and improving bundling efficiency.

[0023] (4) The present invention can reflect the comprehensive status of the equipment and wires during the bundling operation in real time by adjusting the bundling equipment according to the comprehensive operation efficiency index. When the index deviates from the ideal value, the bundle adjustment value set of the bundling equipment can be extracted in a targeted manner, and the speed of the winding motor and the moving motor can be dynamically optimized. This avoids the fluctuation of bundling quality caused by fixed equipment parameters, and improves bundling efficiency and product quality. At the same time, through precise adjustment, unnecessary energy consumption of the equipment can also be reduced, and the service life of the equipment can be extended. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0025] Figure 1 The figure is a schematic flow chart of the method steps of the present invention.

[0026] Figure 2 It is a schematic diagram of system module connection of the present invention.

[0027] Figure 3 It is a structural diagram of the device of the present invention.

[0028] Figure 4 It is a structural diagram of an automatic strapping device involved in an embodiment of the present invention.

[0029] Figure 5 It is a schematic diagram of a winding mechanism involved in an embodiment of the present invention.

[0030] Figure 6 It is a schematic diagram of a moving mechanism involved in an embodiment of the present invention.

[0031] Figure 7 It is a schematic diagram of a clamping mechanism involved in an embodiment of the present invention.

[0032] Figure 8 The figure is a schematic diagram of a wire head clamping device according to an embodiment of the present invention.

[0033] Fig. 9 This is a rendering of the first layer of wire bundling involved in this embodiment.

[0034] Fig.10 This is a diagram showing the completed effect of wire bundling according to this embodiment.

[0035] Fig.11 This is a diagram showing the spatial positions of the two wire heads after winding is completed in this embodiment.

[0036] In the figure, 1. fixed pinion; 2. winding gear; 3. secondary driving wheel; 4. wire wheel; 5. driving gear; 6. third plate; 7. PLC; 8. second plate; 9. clamping mechanism; 10. first plate; 11. winding motor encoder; 12. wire rope; 13. moving motor encoder; 14. winding motor; 15. moving motor; 16. wire head clamping device; 17. guide column; 18. ball screw; 19. spline shaft; 20. damping device; 901. movable V-block; 902. pin; 903. tension spring; 904. fixed V-block; 1601. spring; 1602. steel ball. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] Reference Figure 1 As shown, the first aspect of the present invention provides a method for monitoring a metal wire automatic bundling process, comprising: It should be noted that the metal wire described in this embodiment is a steel wire rope.

[0039] S1, start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire to enter the automatic bundling process.

[0040] Screening qualified metal wires into the automatic bundling process, the specific analysis process is as follows: The quality parameters of each metal wire to be bundled are obtained, including the average wire diameter, wire density, surface roughness and average surface hardness of each metal wire to be bundled.

[0041] It should be noted that the wire quality parameters can be collected by a wire bundling monitoring sensor device, among which the wire diameter can be collected using a screw micrometer, the surface roughness can be measured by a roughness meter, and the surface hardness can be measured by a Rockwell hardness tester.

[0042] The method for obtaining the wire density is as follows: the wire mass is measured by a mass sensor, the wire length is obtained simultaneously, and the wire density is obtained by dividing the wire mass by the wire length.

[0043] The quality parameters of the metal wires to be bundled are analyzed and processed to obtain the quality evaluation values ​​of the metal wires to be bundled, and the quality evaluation values ​​of the metal wires to be bundled are used to characterize the quality of the metal wires to be bundled.

[0044] The ideal wire quality parameters stored in the database are extracted, including the ideal average wire diameter of the wire, the ideal wire density of the wire, the ideal surface roughness of the wire, and the ideal average surface hardness of the wire.

[0045] In a specific embodiment, the quality evaluation value of each metal wire to be bundled is obtained in the following way: ; in, is the quality evaluation value of the i-th metal wire to be bundled, is the average wire diameter of the i-th metal wire to be bundled, is the linear density of the i-th metal wire to be bundled, is the surface roughness of the i-th metal wire to be bundled, is the average surface hardness of the i-th metal wire to be bundled, is the ideal average wire diameter of the wire, is the ideal linear density of the wire, is the ideal surface roughness of the wire. is the ideal average hardness of the wire surface, is the average wire diameter weight, is the line density weight, is the surface roughness weight, is the average surface hardness weight.

[0046] It should be added that is the hyperbolic cosecant function.

[0047] It should be noted that the average wire diameter weight, wire density weight, surface roughness weight and surface average hardness weight are pre-set values ​​in the database and can be directly extracted from the database when used. For example, the extraction method is to construct a mapping set of the average wire diameter, wire density, surface roughness and surface average hardness and their corresponding weights one by one. When in use, the average wire diameter, wire density, surface roughness and surface average hardness obtained in real time are respectively input into the corresponding mapping set, so as to extract the average wire diameter weight, wire density weight, surface roughness weight and surface average hardness weight.

[0048] It should be understood that the average wire diameter weight, wire density weight, surface roughness weight and surface average hardness weight all range from 0 to 1.

[0049] Extract the feed quality verification indicators preset in the database.

[0050] The metal wires to be bundled whose quality evaluation value is greater than or equal to the feed quality verification index are recorded as qualified metal wires.

[0051] It should be noted that if the quality assessment value of a metal wire to be bundled is less than the feed quality verification index, the metal wire to be bundled will be transported to the defective area.

[0052] It should be noted that the quality assessment value of the metal wire to be bundled is greater than or equal to the feed quality verification index, indicating that the overall quality of the wire is good and can maintain stable performance in the subsequent processing process, thereby ensuring the efficiency of the entire production process and the quality of the product. Therefore, it can be recognized as qualified metal wire.

[0053] The quality assessment value of the metal wires to be bundled is less than the feed quality verification index, indicating that the quality of the wires does not meet the standards. During the subsequent bundling and use process, problems such as loose bundling and easy damage are very likely to occur, and the quality and safety of the final product cannot be guaranteed. It will be transported to the defective area and a corresponding early warning signal will be generated to avoid adverse effects on the entire production batch.

[0054] The metal wires to be bundled are traversed in sequence, thereby screening out qualified metal wires to enter the automatic bundling process.

[0055] S2, obtaining characteristic parameters of each qualified metal wire, analyzing characteristic measurement values ​​of each qualified metal wire, thereby obtaining allowable fluctuation parameters and comprehensive operation performance verification index of each qualified metal wire.

[0056] In this embodiment, the characteristic measurement values ​​of each qualified metal wire are analyzed to obtain the allowable fluctuation parameter and comprehensive operation efficiency verification index of each qualified metal wire. The specific analysis process is as follows: The characteristic parameters of each qualified metal wire are obtained, including the elastic modulus, electrical conductivity, thermal expansion coefficient and thermal conductivity of each qualified metal wire.

[0057] It should be noted that the characteristic parameters of the wire itself can be collected by the wire bundling monitoring sensor device, among which the elastic modulus can be collected by a dynamic elastic modulus tester, the electrical conductivity can be measured by a conductivity meter, the thermal expansion coefficient can be measured using a thermal expansion meter, and the thermal conductivity can be measured using a thermal conductivity tester.

[0058] It should be noted that the elastic modulus mainly reflects the strength of the bonding force between atoms of the metal wire and determines its ability to resist elastic deformation. Electrical conductivity is closely related to the movement of free electrons inside the metal. The more free electrons there are and the smoother their movement, the higher the electrical conductivity. The thermal expansion coefficient depends on the bonding characteristics and lattice structure between atoms. When the bonding force is weak and the lattice structure is loose, the thermal expansion coefficient is larger. Thermal conductivity is related to the heat transfer effect of electrons and phonons. Electronic thermal conductivity plays an important role in metals, and lattice vibrations (phonons) also participate in the heat conduction process.

[0059] Generally, metals with high elastic modulus have tight bonds between atoms, which may limit the free movement of electrons and reduce electrical conductivity to a certain extent. For the thermal expansion coefficient, when the elastic modulus is high, atomic vibration is restricted and the thermal expansion coefficient is often small. As for thermal conductivity, if the electrical conductivity is high, electrons contribute greatly to heat conduction and the thermal conductivity may be high. At the same time, metals with small thermal expansion coefficients have good lattice stability when the temperature changes, which is conducive to the effective transmission of phonons and may also increase thermal conductivity.

[0060] The characteristic measurement value of each qualified metal wire is obtained according to the analysis and processing of the characteristic parameters of each qualified metal wire, and the characteristic measurement value of each qualified metal wire is used to characterize the characteristic state of each qualified metal wire.

[0061] In a specific embodiment, the characteristic measurement value of each qualified metal wire is obtained by the following method: ; in, is the characteristic measurement value of the jth qualified metal wire, is the elastic modulus of the jth qualified metal wire, is the conductivity of the jth qualified metal wire, is the thermal expansion coefficient of the jth qualified metal wire, is the thermal conductivity of the jth qualified metal wire, is the characteristic measurement factor corresponding to the unit elastic modulus, is the characteristic measurement factor corresponding to unit conductivity, is the characteristic measurement factor corresponding to the unit thermal expansion coefficient, is the characteristic measurement factor corresponding to unit thermal conductivity, and e is a natural constant.

[0062] It should be noted that the characteristic metrological factors corresponding to the unit elastic modulus, the characteristic metrological factors corresponding to the unit electrical conductivity, the characteristic metrological factors corresponding to the unit thermal expansion coefficient, and the characteristic metrological factors corresponding to the unit thermal conductivity are all pre-set values ​​in the database and can be directly extracted from the database when used. For example, the extraction method is to construct a mapping set with the elastic modulus, electrical conductivity, thermal expansion coefficient, and thermal conductivity respectively and the corresponding characteristic metrological factors corresponding to the unit elastic modulus, the unit electrical conductivity, the unit thermal expansion coefficient, and the unit thermal conductivity. When in use, the elastic modulus, electrical conductivity, thermal expansion coefficient, and thermal conductivity collected in real time are input into the mapping set to extract the characteristic metrological factors corresponding to the unit elastic modulus, the unit electrical conductivity, the unit thermal expansion coefficient, and the unit thermal conductivity.

[0063] The fluctuation control efficiency parameters corresponding to each characteristic measurement value interval stored in the database are extracted, and the fluctuation control efficiency parameters corresponding to the interval in which the characteristic measurement value of each qualified metal wire is located are mapped and extracted, and recorded as the bundling fluctuation control efficiency parameters.

[0064] The bundling fluctuation control efficiency parameters include the allowable fluctuation parameters of each qualified metal wire and the comprehensive operation efficiency verification index.

[0065] It should be noted that the larger the characteristic measurement value of a qualified metal wire is, the better the characteristic state of the qualified metal wire is, the higher the bundling accuracy requirement is, the smaller the corresponding extracted allowable fluctuation parameter should be, and the larger the comprehensive operation performance verification index should be.

[0066] S3, start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire.

[0067] In this embodiment, the dynamic stability index of equipment operation is analyzed in the following specific process: During the preset monitoring period, the bundling process is monitored and the instantaneous power of the equipment during the bundling process is collected in real time, thereby obtaining the output power stability coefficient of the equipment.

[0068] It should be understood that the output power stability coefficient of the device can be obtained by the following steps: A1, within the preset monitoring period, collect the instantaneous power of the equipment during the bundling process at each time point, and calculate the average instantaneous power of the equipment.

[0069] A2, extract the maximum instantaneous power and the minimum instantaneous power, and subtract the minimum instantaneous power from the maximum instantaneous power to obtain the output power range.

[0070] A3, divide the output power range by the average instantaneous power of the equipment to obtain the equipment output power stability coefficient.

[0071] According to the instantaneous power of the equipment during the bundling process and the duration of the monitoring period, the total energy consumption of the monitored bundling process is obtained.

[0072] It should be noted that the instantaneous power and the total energy consumption of the monitoring bundling process can be collected by the power meter in the wire bundling monitoring sensor device.

[0073] The strapping force of each strapping process is collected, and the set strapping force is obtained synchronously, and the standard deviation of the strapping force deviation is obtained by analysis.

[0074] It should be noted that the standard deviation of the bundling force deviation is obtained by subtracting the set bundling force from the bundling force of each bundling process to obtain the bundling force deviation of each time, and the standard deviation of the bundling force deviation is obtained according to the standard deviation calculation formula. The standard deviation calculation formula is: ;in, is the standard deviation of the binding force, For the The bundling force of the first bundling process, is the number of each bundle, , The number of bundles.

[0075] It should be noted that the bundling force can be acquired by a piezoelectric force sensor in the wire bundling monitoring sensor device.

[0076] Synchronously obtain the maximum vibration acceleration of the equipment during the monitoring period.

[0077] It should be noted that the vibration acceleration can be collected by the acceleration sensor in the wire bundling monitoring sensor device.

[0078] The equipment output power stability coefficient, the total energy consumption of the monitoring strapping process, the standard deviation of the strapping force deviation and the maximum vibration acceleration of the equipment are combined as equipment operation parameters.

[0079] The allowable fluctuation parameters of the target bundling wires are correspondingly extracted according to the allowable fluctuation parameters of each qualified metal wire.

[0080] The allowable fluctuation parameters of the target bundling wire include the allowable fluctuation value of the equipment output power stability coefficient, the allowable fluctuation value of the total energy consumption of the monitoring bundling process, the allowable fluctuation value of the standard deviation of the bundling force deviation and the allowable fluctuation value of the maximum vibration acceleration of the equipment.

[0081] The ideal equipment operating parameters stored in the database are extracted, including the ideal output power stability coefficient of the equipment, the ideal total energy consumption of the monitoring strapping process, the ideal standard deviation of the strapping force deviation and the ideal maximum vibration acceleration of the equipment.

[0082] According to the equipment operation parameters and the allowable fluctuation parameters of the target bundling wire, the equipment operation dynamic stability index is obtained through analysis and processing, and the equipment operation dynamic stability index is used to characterize the operation state of the bundling equipment.

[0083] In a specific embodiment, the device operation dynamic stability index is obtained in the following manner: The equipment output power stability coefficient and the equipment ideal output power stability coefficient are subjected to difference processing, and the absolute value of the difference processing result is taken, which is recorded as the equipment output power stability coefficient deviation value. The equipment output power stability coefficient deviation value and the equipment output power stability coefficient allowable fluctuation value are subjected to ratio processing to obtain the equipment output power stability coefficient deviation rate.

[0084] The total energy consumption of the monitoring and bundling process is processed by difference with the ideal total energy consumption of the monitoring and bundling process, and the absolute value of the difference processing result is taken, which is recorded as the total energy consumption deviation value of the monitoring and bundling process. The total energy consumption deviation value of the monitoring and bundling process is processed by ratio with the allowable fluctuation value of the total energy consumption of the monitoring and bundling process to obtain the total energy consumption deviation rate of the monitoring and bundling process.

[0085] The standard deviation of the tying force deviation is subjected to difference processing with the allowable fluctuation value of the standard deviation of the tying force deviation, and the absolute value of the difference processing result is taken as the standard deviation deviation value of the tying force deviation. The standard deviation deviation value of the tying force deviation is subjected to ratio processing with the allowable fluctuation value of the standard deviation of the tying force deviation to obtain the standard deviation deviation rate of the tying force deviation.

[0086] The maximum vibration acceleration of the equipment is processed by difference with the ideal maximum vibration acceleration of the equipment, and the absolute value of the difference processing result is taken as the maximum vibration acceleration deviation value of the equipment. The maximum vibration acceleration deviation value of the equipment is processed by ratio with the allowable fluctuation value of the maximum vibration acceleration of the equipment to obtain the maximum vibration acceleration deviation rate of the equipment.

[0087] The equipment output power stability coefficient deviation rate weights preset in the database, the total energy consumption deviation rate weights of the monitoring bundling process, the standard deviation deviation rate weights of the bundling force deviation and the equipment maximum vibration acceleration deviation rate weights are extracted.

[0088] Multiply the deviation rate of the equipment output power stability coefficient with the corresponding weight, multiply the deviation rate of the total energy consumption of the monitoring bundling process with the corresponding weight, multiply the standard deviation deviation rate of the bundling force deviation with the corresponding weight, multiply the maximum vibration acceleration deviation rate of the equipment with the corresponding weight, and then add up the products obtained, record the obtained value as the initial accumulated value, and use the initial accumulated value as the independent variable of the exponential function for calculation, where the base of the exponential function is the natural constant e, and record the calculation result as the equipment operation dynamic stability index.

[0089] It should be noted that the equipment output power stability coefficient deviation rate weight, the monitoring and bundling process total energy consumption deviation rate weight, the bundling force deviation standard deviation deviation rate weight and the equipment maximum vibration acceleration deviation rate weight, the extraction process, for example: the equipment output power stability coefficient deviation rate, the monitoring and bundling process total energy consumption deviation rate, the bundling force deviation standard deviation deviation rate and the equipment maximum vibration acceleration deviation rate and the corresponding equipment output power stability coefficient deviation rate weight, the monitoring and bundling process total energy consumption deviation rate weight, the bundling force deviation standard deviation deviation rate weight and the equipment maximum vibration acceleration deviation rate weight are constructed one by one. When used, the equipment output power stability coefficient deviation rate, the monitoring and bundling process total energy consumption deviation rate, the bundling force deviation standard deviation deviation rate and the equipment maximum vibration acceleration deviation rate collected in real time are respectively input into the corresponding mapping set, so as to extract the corresponding equipment output power stability coefficient deviation rate weight, the monitoring and bundling process total energy consumption deviation rate weight, the bundling force deviation standard deviation deviation rate weight and the equipment maximum vibration acceleration deviation rate weight.

[0090] It should also be noted that the value ranges of the equipment output power stability coefficient deviation rate weight, the total energy consumption deviation rate weight of the monitoring bundling process, the standard deviation deviation rate weight of the bundling force deviation and the equipment maximum vibration acceleration deviation rate weight are all 0-1.

[0091] In this embodiment, the bundling stability index of the target bundling wire is specifically analyzed as follows: During the preset monitoring period, the surface bundling image of the target bundled wire is obtained, the outline of the wire bundling circle is identified, and then the center point of each bundling circle is located. The distance between the center points of two adjacent bundling circles is obtained in turn, and the average distance of the wire bundling is obtained by averaging.

[0092] Identify the wire bundling contour, divide the bundled part of the bundled body into observation sections along the axial direction, obtain the number of windings in each observation section, and thus obtain the standard deviation of the number of windings, and use the standard deviation of the number of windings as the bundling uniformity coefficient.

[0093] The center points of each winding coil of the target bundling wire are identified and located from the surface bundling image of the target bundling wire, and the contact points between the winding coil and the extension axis of the edges on both sides of the bundling body are identified and located, which are respectively recorded as the first contact point of the winding coil and the second contact point of the winding coil. The first contact point of the winding coil and the second contact point of the winding coil are respectively connected with the center point of the winding coil in sequence, and the straight lines formed by the connection are respectively recorded as the first winding reference line and the second winding reference line, and the minimum angles between the first winding reference line and the second winding reference line and the extension axis of one side edge of the corresponding bundling body are extracted, which are respectively recorded as the first winding angle and the second winding angle, so as to obtain the first winding angle and the second winding angle corresponding to the center point of the winding coil, and the center points of each winding coil are traversed in sequence to obtain each first winding angle and each second winding angle, and the first average winding angle and the second average winding angle are respectively obtained by performing mean processing.

[0094] It should be noted that the extension axes of the edges on both sides of the bundling body refer to the extension lines along the axial direction of the bundling body.

[0095] It should also be noted that the body surface binding images can be obtained by a high-definition scanner.

[0096] During a preset monitoring period, the temperature extreme value difference of the target bundling wire is obtained.

[0097] It should be noted that the temperature can be collected by an infrared sensor.

[0098] The average wire bundling spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the temperature extreme value difference are combined as the bundling state parameters of the target bundling wires.

[0099] It should be noted that, in the process of metal wire bundling, if the average wire bundling spacing increases, the bundling uniformity coefficient may also increase, because the uneven spacing makes it easier for the number of windings to vary greatly at different positions, thereby reducing the uniformity of bundling. At the same time, a larger average wire bundling spacing may also change the first average winding angle and the second average winding angle. Due to the change in the relative position of the wires, the winding angle may become more irregular and tend to increase.

[0100] The reference bundling state parameters stored in the database are extracted, including the reference wire bundling average spacing, the reference bundling uniformity coefficient, the reference average winding angle and the reference temperature extreme value difference.

[0101] According to the bundling state parameters of the target bundling wires, a bundling stability index of the target bundling wires is obtained by analysis and processing, and the bundling stability index of the target bundling wires is used to characterize the bundling state of the target bundling wires.

[0102] In a specific embodiment, the bundling stability index of the target bundling wire is obtained by the following method: ; in, It is the bundling stability index of the target bundling wire. is the average wire bundling spacing of the target bundled wires, is the bundling uniformity coefficient of the target bundling wire, is the first average winding angle of the target bundling wire, is the second average winding angle of the target bundling wire, is the temperature extreme value difference of the target bundling wire, is the average spacing of the reference wire bundles, is the reference bundling uniformity coefficient, is the reference average winding angle, is the reference temperature extreme value difference, is the average bundling spacing weight, is the weight of the bundling uniformity coefficient, is the first average winding angle weight, is the second average winding angle weight, is the weight of the temperature extreme difference, and e is a natural constant.

[0103] It should be noted that the weight of the average bundling spacing, the weight of the bundling uniformity coefficient, the weight of the first average winding angle, the weight of the second average winding angle and the weight of the temperature extreme value difference all range from 0 to 1. When used, the preset values ​​can be directly extracted from the database. The specific extraction method is, for example, to construct a mapping set with the average bundling spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the temperature extreme value difference respectively and the average bundling spacing weight, the bundling uniformity coefficient weight, the first average winding angle weight, the second average winding angle weight and the temperature extreme value difference weight. When used, the average bundling spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the temperature extreme value difference obtained in real time are input into the corresponding mapping set, so as to obtain the average bundling spacing weight, the bundling uniformity coefficient weight, the first average winding angle weight, the second average winding angle weight and the temperature extreme value difference weight.

[0104] S4, based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, the comprehensive operation efficiency index is analyzed, and the bundling equipment is adjusted accordingly and prompt information is generated.

[0105] In this embodiment, the comprehensive operation efficiency index is analyzed, and the specific analysis process is as follows: The equipment operation parameters are obtained and analyzed to obtain the equipment operation dynamic stability index.

[0106] The bundling state parameters of the target bundling wire are obtained, and the bundling stability index of the target bundling wire is obtained through analysis and processing.

[0107] According to the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, a comprehensive operation efficiency index is obtained through analysis and processing, and the comprehensive operation efficiency index is used to characterize the bundling operation state of the target bundling wire.

[0108] In a specific embodiment, the comprehensive operation efficiency index is obtained in the following manner: ; in, is the comprehensive operation efficiency index, It is the dynamic stability index of equipment operation. It is the bundling stability index of the target bundling wire. is the weight of the dynamic stability index of equipment operation, is the bundle stability index weight of the target bundled wire, is a logarithmic function with base 10, and e is a natural constant.

[0109] In this embodiment, the strapping equipment is adjusted and prompt information is generated. The specific analysis process is as follows: Based on the comprehensive operation performance verification index of each qualified metal wire, the comprehensive operation performance verification index of the target bundling wire is extracted and recorded as the comprehensive operation performance verification index.

[0110] The comprehensive operation efficiency index and the comprehensive operation efficiency verification index are processed by difference to obtain the comprehensive operation efficiency deviation index.

[0111] It should be noted that the difference processing refers to the comprehensive operation efficiency index minus the comprehensive operation efficiency verification index.

[0112] It should be noted that the result of the difference processing can be greater than zero, less than zero or equal to zero.

[0113] The set of strapping equipment adjustment values ​​corresponding to each operation efficiency deviation index interval stored in the database is extracted, and the set of strapping equipment adjustment values ​​corresponding to the interval where the comprehensive operation efficiency deviation index is located is mapped and extracted, and recorded as the set of strapping equipment target adjustment values.

[0114] The set of target adjustment values ​​of the strapping equipment includes a winding motor speed adjustment value and a moving motor speed adjustment value.

[0115] The strapping equipment is adjusted based on the set of target adjustment values ​​of the strapping equipment and prompt information is generated synchronously.

[0116] It should be noted that when the comprehensive operation efficiency deviation index is less than zero, it means that the comprehensive operation efficiency index is less than the comprehensive operation efficiency verification index. At this time, the smaller the comprehensive operation efficiency deviation index is, that is, the larger its absolute value is, the worse the actual comprehensive operation efficiency is. In order to ensure the bundling quality, the bundling speed should be reduced, that is, the corresponding extracted adjustment value should be a negative value. The smaller the comprehensive operation efficiency deviation index is, the greater the deviation is, the greater the adjustment range that needs to be made, and the larger the corresponding extracted adjustment value is.

[0117] When the comprehensive operation efficiency deviation index is greater than zero, it means that the comprehensive operation efficiency index is greater than the comprehensive operation efficiency verification index. At this time, the larger the comprehensive operation efficiency deviation index is, the better the actual comprehensive operation efficiency is. In order to avoid waste of resources, the bundling speed can be increased, that is, the corresponding extracted adjustment value should be a positive value. The larger the comprehensive operation efficiency deviation index is, the larger the extracted adjustment value is.

[0118] When the comprehensive operating efficiency deviation index is equal to zero, no adjustment is performed, that is, the extracted adjustment value is 0.

[0119] It should be noted that the winding motor speed adjustment value and the moving motor speed adjustment value should increase and decrease at the same time, and the speed adjustment will not affect the bundling quality, such as bundling spacing, bundling uniformity, etc.

[0120] In a specific embodiment, for example, in the actual automatic bundling production of metal wires, it is assumed that the comprehensive operating efficiency deviation index calculated by the system is -0.2 (less than zero), indicating that the actual comprehensive operating efficiency is poor. At this time, the winding motor speed adjustment value extracted from the database is -0.3r / min (the speed is reduced by 0.3 revolutions per minute), and the moving motor speed adjustment value is also -0.3r / min (the speed is reduced by 0.3 revolutions per minute). The corresponding prompt information generated is "The current comprehensive operating efficiency is lower than the standard. To ensure the quality of bundling, please reduce the winding motor speed by 0.3r / min and the moving motor speed by 0.3r / min."

[0121] If the comprehensive operation efficiency deviation index is 0.2 (greater than zero), it means that the actual operation efficiency is good. At this time, in the extracted set of target adjustment values ​​of the strapping equipment, the winding motor speed adjustment value is +0.2r / min, and the mobile motor speed adjustment value is +0.2r / min. The corresponding prompt message is "The equipment operation efficiency is good. To avoid waste of resources, increase the winding motor speed by 0.2r / min and the mobile motor speed by 0.2r / min".

[0122] If the comprehensive operating efficiency deviation index is exactly 0, such as this situation occurs in a certain monitoring, then the equipment does not need to be adjusted, and the prompt message is "The equipment is in good operating condition, maintain the current bundling parameters."

[0123] Reference Figure 2 As shown, the second aspect of the present invention provides a metal wire automatic bundling process monitoring system, comprising: The qualified metal wire screening module is used to start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire to enter the automatic bundling process.

[0124] The qualified metal wire characteristic analysis module is used to obtain the characteristic parameters of each qualified metal wire, analyze the characteristic measurement value of each qualified metal wire, and thus obtain the allowable fluctuation parameter and comprehensive operation performance verification index of each qualified metal wire.

[0125] The automatic bundling process monitoring module is used to start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire.

[0126] The bundling equipment adjustment module is used to analyze the comprehensive operation efficiency index based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, thereby adjusting the bundling equipment and generating prompt information.

[0127] See also Figure 3 As shown, the third aspect of the present invention provides a metal wire automatic bundling process monitoring device, including: an automatic bundling device, a wire bundling monitoring sensor device, a high-definition scanner and an infrared sensor, wherein the wire bundling monitoring sensor device, the high-definition scanner and the infrared sensor are used together to monitor the automatic bundling device.

[0128] See also Figure 4 As shown, it is a structural diagram of the automatic bundling device involved in an embodiment of the present invention, which is used for automatic bundling of wires, wherein the first layer winding starting point is the initial position where the metal wire starts to be wound in the automatic bundling device, the first layer winding end point is the position of the metal wire after the first layer winding is completed in the automatic bundling device, and the second layer winding end point refers to the position of the metal wire after the second layer winding is completed in the automatic bundling device after the first layer winding is completed.

[0129] The iron wire is wound around the wire wheel 4.

[0130] The automatic bundling device comprises a winding mechanism, a moving mechanism, a clamping mechanism and a wire head clamping device.

[0131] See also Figure 5 , which is a schematic diagram of a winding mechanism involved in an embodiment of the present invention.

[0132] The iron wire acts on the winding gear 2 , and drives the spline shaft 19 , the driving gear 5 , and the secondary driving wheel 3 through the winding motor 14 , thereby driving the winding gear 2 to rotate, and winding the iron wire on the wire rope 12 .

[0133] See also Figure 6 , which is a schematic diagram of a moving mechanism involved in an embodiment of the present invention.

[0134] The ball screw 18 is driven by the mobile motor 15 to drive the third plate 6 and the winding mechanism to move left and right to control the winding length of the wire.

[0135] See also Figure 7 , which is a schematic diagram of a clamping mechanism involved in an embodiment of the present invention.

[0136] The clamping mechanism uses a V-shaped clamping mechanism. Through the 903 tension spring, the wire rope within a certain diameter range can be clamped. The 901 movable V-shaped block is pulled up, the wire rope is placed in it, and then clamped.

[0137] See also Figure 8 , which is a schematic diagram of a wire head clamping device according to an embodiment of the present invention.

[0138] The wire head clamping device causes the steel ball 1602 to clamp and release the wire through the expansion and contraction of the spring 1601.

[0139] The automatic bundling process is as follows: the control device calculates the bundling length of the wire rope according to the diameter of the bundled wire rope 12, thereby determining the end position of the first layer of winding. The moving motor 15 and the winding motor 14 are controlled by PLC7.

[0140] First, according to the position where the steel wire rope 12 needs to be tied, it is manually placed into the gap between the second plate 8 and the winding gear 2, and the steel wire rope 12 is clamped by the clamping mechanism 9.

[0141] Then, start the moving motor 15, move the third plate 6 closer to the second plate 8, and after reaching the starting position of the first layer of winding, stop the moving motor 15, start the winding motor 14, turn the damping device 20 of the wire inlet to the same horizontal height as the wire head clamping device 16, stop the winding motor 14, manually pass the wire through the damping wire inlet hole, clamp one end of the wire through the wire head clamping device 16, and the preparation work is completed.

[0142] Next, the winding motor 14 and the moving motor 15 are started at the same time. The movement motor 15 rotates to drive the ball screw 18 to rotate, and the third plate 6 moves away from the second plate 8 at the speed calculated by the control system through the screw nut pair. At the same time, the winding motor 14 rotates to drive the spline shaft 19, the driving gear 5, and the secondary driving wheel 3, and then drives the winding gear 2 to rotate, and the wire is wound onto the wire rope 12. When the third plate 6 moves to the end point of the first layer of winding, the moving motor 15 reverses, and the ball screw 18 reverses to drive the third plate 6 to approach the second plate 8, and reversely winds to the end point of the second layer of winding. The winding motor 14 and the moving motor 15 stop running, and the wire is cut and pulled out manually, and the winding work is completed.

[0143] Finally, the two wire heads are manually tightened and pressed into the steel wire rope 12, the V-shaped clamp block 9 is loosened, the steel wire rope 12 is taken out, and the steel wire rope bundling is completed.

[0144] The wire bundling monitoring sensor device is used to collect parameters related to the automatic wire bundling process.

[0145] High-definition scanner, used to acquire and analyze body surface strapping images.

[0146] Infrared sensor, used to sense and collect temperature.

[0147] See also Fig. 9 The figure shows the first layer effect of wire bundling involved in this embodiment.

[0148] See also Fig.10 As shown, this is a diagram showing the completed effect of wire bundling according to this embodiment.

[0149] See also Fig.11 As shown in the figure, it is a spatial position diagram of the two wire heads after winding is completed in this embodiment. In the figure, d is the diameter of the wire rope, is the angle between the wire head 1 and the plane, It is the angle between the wire head 1 and the plane. In a specific embodiment, the diameter of the wire rope is between 25 mm and 125 mm. After winding is completed, the angle between the wire head 1 and the plane needs to be greater than or equal to 30°, and the angle between the wire head 1 and the plane needs to be less than or equal to 45°, so as to facilitate manual tightening of the two wire heads later.

[0150] It should be noted that in a specific embodiment, after the bundling process is completed, the diameter of the wire rope is collected and the allowable diameter range of the rope threading hole is obtained. If the diameter of the wire rope is within the allowable diameter range of the rope threading hole, a bundling completion message is generated. If the diameter of the wire rope exceeds the allowable diameter range of the rope threading hole, a warning message is generated to indicate that the bundling has failed.

[0151] It should be understood that the bundled wire rope must be able to pass through the rope hole to ensure its normal use, otherwise the wire rope will be stuck at the bundle and cannot be pulled. Therefore, the diameter of the bundled wire rope must be controlled.

[0152] The above contents are merely examples and explanations of the structure of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the structure of the invention or exceed the scope defined by the present invention, they should all fall within the protection scope of the present invention.

Claims

1. A method for monitoring the automatic bundling process of metal wires, characterized in that: include: S1, start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire to enter the automatic bundling process; S2, obtaining characteristic parameters of each qualified metal wire, analyzing characteristic measurement values ​​of each qualified metal wire, thereby obtaining allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire; S3, start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the equipment operation dynamic stability index, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire; S4, based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, the comprehensive operation efficiency index is analyzed, and the bundling equipment is adjusted accordingly and prompt information is generated.

2. The method for monitoring the automatic bundling process of metal wires according to claim 1, characterized in that: The screened qualified metal wires enter the automatic bundling process, and the specific analysis process is as follows: Obtaining quality parameters of each metal wire to be bundled, including average wire diameter, wire density, surface roughness and average surface hardness of each metal wire to be bundled; According to the quality parameters of the metal wires to be bundled, the quality evaluation values ​​of the metal wires to be bundled are obtained, wherein the quality evaluation values ​​of the metal wires to be bundled are used to characterize the quality of the metal wires to be bundled; Extract the feed quality verification indicators preset in the database; The metal wires to be bundled whose quality assessment value is greater than or equal to the feed quality verification index are recorded as qualified metal wires; The metal wires to be bundled are traversed in sequence, thereby screening out qualified metal wires to enter the automatic bundling process.

3. The method for monitoring the automatic bundling process of metal wires according to claim 1, characterized in that: The characteristic measurement values ​​of each qualified metal wire are analyzed to obtain the allowable fluctuation parameters and comprehensive operation efficiency verification index of each qualified metal wire. The specific analysis process is as follows: Obtaining characteristic parameters of each qualified metal wire, including elastic modulus, electrical conductivity, thermal expansion coefficient and thermal conductivity of each qualified metal wire; According to the characteristic parameters of each qualified metal wire, characteristic measurement values ​​of each qualified metal wire are obtained, and the characteristic measurement values ​​of each qualified metal wire are used to characterize the characteristic state of each qualified metal wire; Extract the fluctuation control efficiency parameters corresponding to each characteristic measurement value interval stored in the database, and map and extract the fluctuation control efficiency parameters corresponding to the interval where the characteristic measurement value of each qualified metal wire is located, and record them as the bundling fluctuation control efficiency parameters; The bundling fluctuation control efficiency parameters include the allowable fluctuation parameters of each qualified metal wire and the comprehensive operation efficiency verification index.

4. The method for monitoring the automatic bundling process of metal wires according to claim 1, characterized in that: The analysis of the comprehensive operation efficiency index is specifically carried out as follows: Obtain equipment operation parameters, analyze and process to obtain the equipment operation dynamic stability index; Obtaining the bundling state parameters of the target bundling wire, and analyzing and processing to obtain the bundling stability index of the target bundling wire; According to the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, a comprehensive operation efficiency index is obtained through analysis and processing. The comprehensive operation efficiency index is used to characterize the bundling operation state of the target bundling wire.

5. The method for monitoring the automatic bundling process of metal wires according to claim 4, characterized in that: The specific analysis process of the equipment operation dynamic stability index is as follows: During the preset monitoring period, the bundling process is monitored, and the instantaneous power of the dynamic stability index of the equipment operation during the bundling process is collected in real time, thereby obtaining the output power stability coefficient of the equipment; According to the instantaneous power of the equipment during the bundling process and the duration of the monitoring period, the total energy consumption of the bundling process is obtained; The strapping force of each strapping process is collected, and the set strapping force is obtained synchronously, and the standard deviation of the strapping force deviation is obtained by analysis; Synchronously obtain the maximum vibration acceleration of the equipment during the monitoring period; The equipment output power stability coefficient, the total energy consumption of the monitoring strapping process, the standard deviation of the strapping force deviation and the maximum vibration acceleration of the equipment are combined as equipment operation parameters; Extracting the allowable fluctuation parameter of the target bundled wire material according to the allowable fluctuation parameter of each qualified metal wire material; According to the equipment operation parameters and the allowable fluctuation parameters of the target bundling wire, the equipment operation dynamic stability index is obtained through analysis and processing, and the equipment operation dynamic stability index is used to characterize the operation state of the bundling equipment.

6. The method for monitoring the automatic bundling process of metal wires according to claim 4, characterized in that: The specific analysis process of the bundling stability index of the target bundling wire is as follows: During a preset monitoring period, the surface bundling image of the target bundled wire is obtained, the outline of the wire bundling circle is identified, and then the center point of each bundling circle is located, and the distance between the center points of two adjacent bundling circles is obtained in turn, and the average distance of the wire bundling is obtained by averaging. Identify the wire bundling contour, divide the bundled part of the bundled body into observation sections along the axial direction, obtain the number of windings of each observation section, thereby obtaining the standard deviation of the number of windings, and use the standard deviation of the number of windings as the bundling uniformity coefficient; Identify and locate the center points of each winding coil of the target bundling wire from the surface bundling image of the target bundling wire, identify and locate the contact points between the winding coil and the extension axis of the edges on both sides of the bundling body, record them as the first contact point of the winding coil and the second contact point of the winding coil respectively, connect the first contact point of the winding coil and the second contact point of the winding coil with the center point of the winding coil respectively, record the straight lines formed by the connection as the first winding reference line and the second winding reference line respectively, extract the minimum angles between the first winding reference line and the second winding reference line and the extension axis of the edge on one side of the corresponding bundling body, record them as the first winding angle and the second winding angle respectively, thereby obtaining the first winding angle and the second winding angle corresponding to the center point of the winding coil, traverse the center points of each winding coil in turn, thereby obtaining each first winding angle and each second winding angle, and perform mean processing respectively to obtain the first average winding angle and the second average winding angle; Within a preset monitoring period, obtaining the temperature extreme value difference of the target bundling wire; The average wire bundling spacing, the bundling uniformity coefficient, the first average winding angle, the second average winding angle and the temperature extreme value difference are combined as the bundling state parameters of the target bundling wire; According to the bundling state parameters of the target bundling wires, a bundling stability index of the target bundling wires is obtained by analysis and processing, and the bundling stability index of the target bundling wires is used to characterize the bundling state of the target bundling wires.

7. The method for monitoring the automatic bundling process of metal wires according to claim 1, characterized in that: The strapping equipment is adjusted and prompt information is generated, and the specific analysis process is as follows: Based on the comprehensive operation efficiency verification index of each qualified metal wire, the comprehensive operation efficiency verification index of the target bundling wire is extracted and recorded as the comprehensive operation efficiency verification index; The comprehensive operation efficiency index and the comprehensive operation efficiency verification index are processed by difference to obtain the comprehensive operation efficiency deviation index; Extract the set of strapping equipment adjustment values ​​corresponding to each operation efficiency deviation index interval stored in the database, and map and extract the set of strapping equipment adjustment values ​​corresponding to the interval where the comprehensive operation efficiency deviation index is located, and record it as the set of strapping equipment target adjustment values; The bundled equipment target adjustment value collection includes a winding motor speed adjustment value and a moving motor speed adjustment value; The strapping equipment is adjusted based on the set of target adjustment values ​​of the strapping equipment and prompt information is generated synchronously.

8. The method for monitoring the automatic bundling process of metal wires according to claim 4, characterized in that: The specific method for obtaining the comprehensive operation efficiency index is as follows: ； in, is the comprehensive operation efficiency index, It is the dynamic stability index of equipment operation. It is the bundling stability index of the target bundling wire. is the weight of the dynamic stability index of equipment operation, is the bundle stability index weight of the target bundled wire, and e is a natural constant.

9. A device for using a method for monitoring the automatic bundling process of metal wires as claimed in any one of claims 1 to 8, characterized in that: include: Automatic strapping device, wire strapping monitoring sensor device, high-definition scanner and infrared sensor; Automatic bundling device, used for automatic bundling of wires; Wire bundling monitoring sensor device, used to collect parameters related to the automatic wire bundling process; High-definition scanner, used to obtain and analyze body surface strapping images; Infrared sensor, used to sense and collect temperature.

10. A metal wire automatic bundling process monitoring system, characterized in that: include: The qualified metal wire screening module is used to start the wire conveying device, introduce each metal wire to be bundled into the bundling area, obtain the quality parameters of each metal wire to be bundled, analyze the quality evaluation value of each metal wire to be bundled, and screen each qualified metal wire to enter the automatic bundling process; The qualified metal wire characteristic analysis module is used to obtain the characteristic parameters of each qualified metal wire, analyze the characteristic measurement value of each qualified metal wire, and thereby obtain the allowable fluctuation parameter and comprehensive operation efficiency verification index of each qualified metal wire; The automatic bundling process monitoring module is used to start the automatic bundling device, monitor the bundling process of each qualified metal wire in real time, obtain the equipment operation parameters, analyze the dynamic stability index of the equipment operation, record the currently bundled qualified metal wire as the target bundling wire, synchronously obtain the bundling state parameters of the target bundling wire, and analyze the bundling stability index of the target bundling wire; The bundling equipment adjustment module is used to analyze the comprehensive operation efficiency index based on the equipment operation dynamic stability index and the bundling stability index of the target bundling wire, thereby adjusting the bundling equipment and generating prompt information.

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