Communication circuit and method giving consideration to charging and resistance value detection and electronic atomization equipment
By designing a communication circuit that takes into account charging and resistance value detection in electronic atomization equipment, the problem that the MCU cannot communicate with the outside is solved, and the equipment structure is simplified and the service life is extended.
Patent Information
- Application Number
- CN202311582617.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-23
- Publication Date
- 2025-05-23
AI Technical Summary
The MCU of existing electronic atomization equipment cannot communicate with the outside through the USB interface, resulting in the inability to detect the resistance of the heating element after assembly, which increases the complexity of the equipment structure and waste of resources.
Design a communication circuit that takes into account both charging and resistance value detection, including a communication interface, a pull-down unit and a resistance value detection unit, and establish communication with the communication interface through a microcontroller to realize the charging and resistance value detection functions.
Through a communication interface, both charging and resistance detection are taken into account, the area of the microcontroller circuit board is reduced, space occupation and manufacturing costs are reduced, the rationality of the equipment structure design is improved, and the service life of the equipment is extended.
Smart Images

Figure CN120028600A_ABST
Abstract
Description
[Technical field]
[0001] The present application relates to the technical field of electronic atomization equipment, and in particular to a communication circuit, method and electronic atomization equipment that take into account both charging and resistance detection. [Background technology]
[0002] The core components of the electronic atomization device include MCU (Micro Control Unit, single-chip microcomputer), power supply, aerosol generator and heating element mounted on the aerosol generator. The MCU can use the power supply to transmit electrical energy to the heating element to make the heating element generate heat, thereby heating the aerosol generator and generating aerosol. Furthermore, the electronic atomization device is usually also equipped with a USB (Universal Serial Bus) interface, which is connected to the MCU for communication. When the electronic atomization device is out of power or insufficient, the USB interface can be connected to an external charging power supply to charge the electronic atomization device; however, the USB interface of the existing electronic atomization device can only be used for charging, and it is impossible to establish communication between the MCU and the outside, that is, the MCU does not have a communication function, which will bring many disadvantages to the electronic atomization device.
[0003] In the related art, the heating element of the electronic atomization device usually includes two. In the process of assembling the electronic atomization device, the resistance of the two heating elements can be detected to determine whether the two heating elements are installed upside down or whether the electrodes are reversed. However, the MCU of the existing electronic atomization device cannot communicate with the outside through the USB interface. This results in that after the electronic atomization device is assembled, the external PC (Personal Computer) end cannot detect the resistance of the heating element through the USB interface. Therefore, the detection of the resistance of the heating element can only be performed before the electronic atomization device is assembled. Generally, a number of test points are reserved on the circuit board of the MCU (test holes corresponding to the several test points are reserved on the shell of the electronic atomization device), and the several test points are connected to the external PC end, so that the PC end can detect the resistance of the heating element through the several test points. It can be understood that reserving a number of test points and corresponding test holes will inevitably complicate the structure of the electronic atomization device, and will also increase the area of the circuit board of the MCU, which not only increases the space occupancy, but also reduces the rationality of the structural design of the electronic atomization device. In addition, since the MCU of the electronic atomization device cannot communicate with the outside through the USB interface, after the electronic atomization device is assembled and put on the market, when a problem occurs with the electronic atomization device, the MCU cannot be burned through the USB interface to upgrade or repair the program. This results in the problematic electronic atomization device having to be scrapped, which not only causes a waste of resources, but also reduces the service life of the electronic atomization device.
[0004] Therefore, it is necessary to design an electronic atomization device with MCU having communication function. [Summary of the invention]
[0005] The present application provides a communication circuit, method and electronic atomization device that take into account both charging and resistance detection, aiming to solve the problem of unreasonable structural design of the electronic atomization device in the related art due to the need to detect the resistance of the heating element before the electronic atomization device is assembled.
[0006] In order to solve the above-mentioned technical problems existing in the related art, the first aspect of the embodiment of the present application provides a communication circuit that takes into account both charging and resistance detection. The communication circuit is applied to an electronic atomization device, and the electronic atomization device includes an internal power supply, a single-chip microcomputer and a heating element. The heating element is electrically connected to the single-chip microcomputer, and the single-chip microcomputer is electrically connected to the internal power supply. The single-chip microcomputer is used to transmit the heating power provided by the internal power supply to the heating element to heat the heating element. Specifically, the communication circuit includes a communication interface, a pull-down unit and a resistance detection unit. The communication interface is electrically connected to the single-chip microcomputer through the pull-down unit, and the unit is electrically connected to the resistance detection unit, and the resistance detection unit is electrically connected to the heating element. Among them, the resistance detection unit is used to respond to the resistance detection instruction sent by the single-chip microcomputer in the resistance detection mode, and detect the resistance information of the heating element. The communication interface is connected to an external power supply in the charging mode, or to an external computing device in the resistance detection mode, and is used to: receive the charging power provided by the external power supply in the charging mode and transmit it to the single-chip microcomputer, and the pull-down unit is used to limit the charging voltage corresponding to the charging power to within a preset voltage range; or, in the resistance detection mode, receive the resistance acquisition instruction sent by the computing device and transmit it to the single-chip microcomputer. The single-chip microcomputer is also used to: transmit the charging power to the internal power supply in the charging mode to charge the internal power supply; or, in the resistance detection mode, respond to the resistance acquisition instruction, and obtain resistance information from the resistance detection unit, and transmit the resistance information to the computing device through the communication interface.
[0007] The second aspect of the embodiment of the present application provides an electronic atomization device, which includes an internal power supply, a single-chip microcomputer, a heating element and an aerosol generator. The heating element is sleeved on the aerosol generator, and the inner wall of the heating element is in contact with the aerosol generator. The heating element is electrically connected to the single-chip microcomputer, and the single-chip microcomputer is electrically connected to the internal power supply. The single-chip microcomputer is used to transmit the heating power provided by the internal power supply to the heating element to heat the heating element. Furthermore, the electronic atomization device also includes a communication circuit, and the communication circuit includes a communication interface, a pull-down unit and a resistance detection unit. The communication interface is electrically connected to the single-chip microcomputer through the pull-down unit, and the unit is electrically connected to the resistance detection unit, and the resistance detection unit is electrically connected to the heating element. Among them, the resistance detection unit is used to respond to the resistance detection instruction sent by the single-chip microcomputer in the resistance detection mode, and detect the resistance information of the heating element. The communication interface is connected to an external power supply in the charging mode, or to an external computing device in the resistance detection mode, and is used to: receive the charging power provided by the external power supply in the charging mode and transmit it to the single-chip microcomputer, and the pull-down unit is used to limit the charging voltage corresponding to the charging power to within a preset voltage range; or, in the resistance detection mode, receive the resistance acquisition instruction sent by the computing device and transmit it to the single-chip microcomputer. The single-chip microcomputer is also used to: in the charging mode, transmit the charging power to the internal power supply to charge the internal power supply; or, in the resistance detection mode, respond to the resistance acquisition instruction, and obtain resistance information from the resistance detection unit, and transmit the resistance information to the computing device through the communication interface.
[0008] The third aspect of the embodiment of the present application provides a communication method that takes into account both charging and resistance detection. The communication method is applied to the electronic atomization device mentioned in the second aspect of the embodiment of the present application, and the communication method includes: the resistance detection unit responds to the resistance detection instruction sent by the single-chip microcomputer in the resistance detection mode, and detects the resistance information of the heating element; the communication interface receives the charging power provided by the external power supply in the charging mode and transmits it to the single-chip microcomputer, or receives the resistance acquisition instruction sent by the computing device in the resistance detection mode and transmits it to the single-chip microcomputer; the single-chip microcomputer transmits the charging power to the internal power supply in the charging mode to realize charging of the internal power supply, or responds to the resistance acquisition instruction in the resistance detection mode, and obtains the resistance information from the resistance detection unit, and transmits the resistance information to the computing device through the communication interface.
[0009] It can be understood that through the implementation of the above-mentioned technical scheme of the present application, in the charging mode, the external power supply can establish communication with the single-chip microcomputer through the communication interface of the electronic atomization device, and transmit the charging power provided by itself to the single-chip microcomputer through the communication interface, and then the single-chip microcomputer can transmit the charging power to the internal power supply of the electronic atomization device, thereby realizing the charging of the internal power supply; in the resistance detection mode, the external computing device can establish communication with the single-chip microcomputer through the communication interface of the electronic atomization device, and transmit the resistance acquisition instruction to the single-chip microcomputer through the communication interface, and then the single-chip microcomputer can respond to the resistance acquisition instruction, and obtain the resistance information of the heating element from the resistance detection unit, and transmit the resistance information to the computing device through the communication interface. It can be seen that the electronic atomization device of the present application can take into account the charging function and the resistance detection function through a communication interface, so that the single-chip microcomputer has the ability to communicate with the outside. Therefore, even after the electronic atomization device is assembled, the real-time detection of the resistance of the heating element can be achieved through the communication interface. Therefore, there is no need to reserve a number of test points on the circuit board of the single-chip microcomputer as in the traditional solution, nor is there any need to reserve test holes corresponding to a number of test points on the outer casing of the electronic atomization device, thereby reducing the area of the circuit board of the single-chip microcomputer, which not only reduces the space occupancy, but also improves the rationality of the structural design of the electronic atomization device.
Brief Description of the Drawings
[0010] In order to more clearly illustrate the technical solutions in the related technologies or the embodiments of the present application, the drawings required for use in the description of the related technologies or the embodiments of the present application will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, not all embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0011] Figure 1 A schematic diagram of the structure of a communication system provided in an embodiment of the present application;
[0012] Figure 2 A schematic diagram of the structure of the electronic atomization device provided in an embodiment of the present application;
[0013] Figure 3 A schematic diagram of the structure of a communication circuit provided in an embodiment of the present application;
[0014] Figure 4 A flow chart of a communication method provided in an embodiment of the present application. [Specific implementation method]
[0015] In order to make the purpose, technical solutions and advantages of the present application more obvious and easy to understand, the present application will be clearly and completely described below in conjunction with the embodiments of the present application and the corresponding drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. It should be understood that the various embodiments of the present application described below are only used to explain the present application and are not used to limit the present application, that is, based on the various embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0016] In the related art, the MCU of the electronic atomization device cannot communicate with the outside through the USB interface, which means that after the electronic atomization device is assembled, the external PC end cannot detect the resistance of the heating element through the USB interface. Therefore, the detection of the resistance of the heating element can only be performed before the electronic atomization device is assembled. Generally, a number of test points are reserved on the circuit board of the MCU (test holes corresponding to the test points are reserved on the shell of the electronic atomization device), and the test points are connected to the external PC end, so that the PC end can detect the resistance of the heating element through the test points. It can be understood that reserving a number of test points and corresponding test holes will inevitably complicate the structure of the electronic atomization device, and will also increase the area of the MCU circuit board, which not only increases the space occupancy, but also reduces the rationality of the structural design of the electronic atomization device. In addition, after the electronic atomization device is assembled and put on the market, when the electronic atomization device has problems, the MCU cannot be burned through the USB interface to upgrade or repair the program, which means that the problematic electronic atomization device can only be scrapped, which not only causes a waste of resources, but also reduces the service life of the electronic atomization device. In view of this, the present application proposes a communication circuit that takes into account both charging and resistance detection, an electronic atomization device using the communication circuit, and a communication system using the electronic atomization device in the embodiments below. In the communication system, an external power supply, an external computing device, a burning device, etc. can establish communication with the single-chip microcomputer in the electronic atomization device through the communication interface of the electronic atomization device. The external power supply can charge the internal power supply of the electronic atomization device through the communication interface, the computing device can obtain the resistance information of the heating element of the electronic atomization device through the communication interface, and the burning device can burn the single-chip microcomputer of the electronic atomization device through the communication interface. In other words, the electronic atomization device of the present application can realize the charging of the electronic atomization device through a communication interface, and can also realize the real-time detection of the resistance of the heating element after the electronic atomization device is assembled. In this way, there is no need to reserve a number of test points and corresponding test holes like the traditional scheme, thereby reducing the space occupancy, making the structural design of the electronic atomization device more reasonable, and the manufacturing cost of the electronic atomization device will be reduced accordingly.
[0017] Figure 1 and Figure 2They are structural schematic diagrams of a communication system and an electronic atomization device, respectively. In some embodiments, the communication system includes an electronic atomization device 100, a computing device 400, an external power supply 300 and a communication connector 200. The electronic atomization device 100 includes a single-chip microcomputer 101, a communication interface 102, an internal power supply 106 and a heating element 103. The communication interface 102 is electrically connected to the single-chip microcomputer 101, and the single-chip microcomputer 101 is electrically connected to the internal power supply 106 and the heating element 103. The single-chip microcomputer 101 can transmit the heating power provided by the internal power supply 106 to the heating element 103 to heat the heating element 103. In the present application, the electronic atomization device 100 has at least two working modes, namely a charging mode and a resistance detection mode. In the actual communication process, when the electronic atomization device 100 is in the charging mode, the external power supply 300 can be connected to the communication interface 102 of the electronic atomization device 100 through the communication connector 200, and transmit the charging power to the single-chip microcomputer 101 of the electronic atomization device 100 through the communication interface 102, and then the single-chip microcomputer 101 can transmit the charging power to the internal power supply 106 of the electronic atomization device 100 to charge the internal power supply 106; when the electronic atomization device 100 is in the resistance detection mode, the computing device 400 can be connected to the communication interface 102 through the communication connector 200, and transmit the resistance acquisition instruction to the single-chip microcomputer 101 through the communication interface 102, and then the single-chip microcomputer 101 can respond to the resistance acquisition instruction, detect the resistance information of the heating element 103, and transmit the resistance information to the computing device 400 through the communication interface 102. It can be seen that in this communication system, the electronic atomization device 100 can take into account both the charging function and the resistance detection function through a communication interface 102, so that the single-chip microcomputer 101 has the ability to communicate with the outside, so that even after the electronic atomization device 100 is assembled, the real-time detection of the resistance of the heating element 103 can be realized through the communication interface 102, so that it is not necessary to reserve a number of test points on the circuit board of the single-chip microcomputer 101 as in the traditional solution, nor is it necessary to reserve test holes corresponding to a number of test points on the shell of the electronic atomization device 100, thereby reducing the area of the circuit board of the single-chip microcomputer 101, which not only reduces the space occupation and the manufacturing cost of the electronic atomization device 100, but also improves the rationality of the structural design of the electronic atomization device 100. In addition, it should be noted that the communication interface 102 is one of the components of the communication circuit of the present application. As for what structures the communication circuit of the present application also includes, it will be elaborated in detail in the relevant embodiments below.
[0018] As one example, see Figure 1In addition to the structures listed above, the communication system also includes a burning device 500, which means that the working mode of the electronic atomization device 100 includes a burning mode in addition to a charging mode and a resistance detection mode. In the actual communication process, when the electronic atomization device 100 is in the burning mode, the burning device 500 can be connected to the communication interface 102 through the communication connector 200, and then the burning device 500 can transmit the burning information to the single-chip microcomputer 101 through the communication interface 102, and the single-chip microcomputer 101 can perform the burning work according to the burning information after receiving the burning information, and transmit the process and / or results of the burning work to the burning device 500 through the communication interface 102 for intuitive display. That is to say, the electronic atomization device 100 of the present application not only takes into account the charging function and the resistance detection function, but also takes into account the burning function. After the electronic atomization device 100 is assembled and put on the market, when the electronic atomization device 100 has a problem, the single-chip microcomputer 101 can be burned through the burning device 500 to achieve program upgrade or repair, without directly scrapping the electronic atomization device 100 as in the traditional solution, thereby avoiding waste of resources and extending the service life of the electronic atomization device 100. It can be understood that whether it is the resistance detection function or the burning function, it depends on the single-chip microcomputer 101 of the electronic atomization device 100 of the present application having a communication function, and once the single-chip microcomputer 101 does not have a communication function, then the resistance detection function and the burning function cannot be realized.
[0019] As one example, see Figure 1In addition to the structures listed above, the communication system also includes a charger 600, and the charger 600, the computing device 400 and the burning device 500 are all equipped with USB interfaces. On this basis, the communication connector 200 includes a communication connector 201, a connecting line 203 and a USB connector 202, and the USB connector 202 is electrically connected to the communication connector 201 through the connecting line 203. In the actual communication process, when the electronic atomization device 100 is in the charging mode, the communication connector 201 is connected to the communication interface 102, the USB connector 202 is connected to the USB interface on the charger 600, and the charger 600 is connected to the external power supply 300, thereby establishing the communication between the external power supply 300 and the single-chip microcomputer 101, and the external power supply 300 can sequentially transmit charging power to the single-chip microcomputer 101 through the communication connector 200 and the communication interface 102, thereby realizing the charging of the internal power supply 106; when the electronic atomization device 100 is in the resistance detection mode, the communication connector 201 is connected to the communication interface 102, and the USB connector 202 is connected to the computer. The USB interface on the device 400 is connected, thereby establishing communication between the computing device 400 and the single-chip microcomputer 101, and the computing device 400 can obtain the resistance information of the heating element 103 through the communication interface 102 and the communication connector 200 in turn; when the electronic atomization device 100 is in the burning mode, the communication connector 201 is connected to the communication interface 102, and the USB connector 202 is connected to the USB interface on the burning device 500, thereby establishing communication between the burning device 500 and the single-chip microcomputer 101, and the burning device 500 can burn the single-chip microcomputer 101 through the communication connector 200 and the communication interface 102 in turn to achieve program upgrade or repair.
[0020] The above embodiments are only preferred implementations of the present application, and they are not the only limitations on the contents related to the communication system; in this regard, those skilled in the art can flexibly set them according to the actual application scenarios based on the above embodiments. Figure 2 and Figure 3 , the structure of the electronic atomization device 100 in the communication system and the communication circuit in the electronic atomization device 100 are further explained.
[0021] Figure 2It is a structural schematic diagram of an electronic atomization device. In some embodiments, the electronic atomization device 100 includes an internal power supply 106, a single-chip computer 101, a heating element 103 and an aerosol generator 104. The aerosol generator 104 is arranged inside the heating element 103. The inner wall of the heating element 103 is in contact with the aerosol generator 104. The heating element 103 is electrically connected to the single-chip computer 101. The single-chip computer 101 is electrically connected to the internal power supply 106. The single-chip computer 101 can transmit the heating power provided by the internal power supply 106 to the heating element 103, thereby heating the heating element 103, and the heat emitted by the heating element 103 can heat the aerosol generator 104 to generate aerosol for the user to inhale. Furthermore, the electronic atomization device 100 also includes a communication circuit, which includes a communication interface 102, a pull-down unit 111 and a resistance detection unit 108. The communication interface 102 is electrically connected to the microcontroller 101 through the pull-down unit 111, the unit is electrically connected to the resistance detection unit 108, and the resistance detection unit 108 is electrically connected to the heating element 103. In the actual communication process, when the electronic atomization device 100 is in the charging mode, the communication interface 102 is connected to the external power supply 300, and the communication interface 102 can access the charging power provided by the external power supply 300 and transmit it to the single-chip microcomputer 101, and then the single-chip microcomputer 101 can transmit the charging power to the internal power supply 106 to realize the charging of the internal power supply 106; when the electronic atomization device 100 is in the resistance detection mode, the communication interface 102 is connected to the external computing device 400, and the communication interface 102 receives the resistance acquisition instruction sent by the computing device 400 and transmits it to the single-chip microcomputer 101, and the single-chip microcomputer 101 responds to the resistance acquisition instruction and sends a resistance detection instruction to the resistance detection unit 108, and the resistance detection unit 108 responds to the resistance detection instruction and detects the resistance information of the heating element 103, and transmits the resistance information to the single-chip microcomputer 101, and the single-chip microcomputer 101 transmits the resistance information to the computing device 400 through the communication interface 102. In addition, the aerosol generator 104 of the present application can be either solid or liquid. When the aerosol generator 104 is solid, it can be placed inside the heating element 103, or the outer wall of the heating element 103 can be wrapped with the aerosol generator 104 of a certain thickness; when the aerosol generator 104 is liquid, it can be placed inside the heating element 103, or the heating element 103 can be installed in a container containing the aerosol generator 104; it can be understood that no matter what form the aerosol generator 104 takes, and how the aerosol generator 104 and the heating element 103 are assembled, as long as the heat emitted by the heating element 103 can heat the aerosol generator 104 and generate an aerosol.
[0022] It should be noted that the electronic atomization devices 100 currently on the market are usually dual-output (i.e., two heating elements 103), and the assembly of the electronic atomization devices 100 is usually performed manually, which may easily lead to the problem of incorrect assembly of the two heating elements 103, such as the two heating elements 103 being installed upside down or the electrodes of the heating elements 103 being connected in reverse. In this context, a separate design space needs to be reserved on the circuit board of the single-chip microcomputer 101 to detect the resistance value of each heating element 103. For example, in some test items, three test points need to be reserved on the circuit board of the single-chip microcomputer 101 (and also on the shell of the electronic atomization device 100). Reserving test holes corresponding to several test points respectively), and connecting these three test points to the external computing device 400, detecting the resistance of each heating element 103 through the computing device 400 and the three test points, and then judging whether the two heating elements 103 are installed upside down or whether the electrodes of the heating elements 103 are reversed according to the detected resistance, and reserving several test points and corresponding test holes will inevitably lead to the complication of the structure of the electronic atomization device 100, and will also increase the area of the circuit board of the single-chip computer 101, which not only increases the space occupation and manufacturing cost, but also reduces the rationality of the structural design of the electronic atomization device 100. In this regard, it can be seen from the previous description of the electronic atomization device 100 that the present application can detect the resistance of the heating element 103 in real time through the communication interface 102 after the electronic atomization device 100 is assembled, so that there is no need to reserve several test points and corresponding test holes, thereby reducing the space occupation, making the structural design of the electronic atomization device 100 more reasonable, and the manufacturing cost of the electronic atomization device 100 will be reduced accordingly.
[0023] As one example, Figure 31 is a schematic diagram of the structure of the communication circuit, wherein the communication interface 102 is a tepy-c interface, and the tepy-c interface has a plurality of pins, and the plurality of pins include a first ground pin GND1, a second ground pin GND2, a first communication pin CC1, and a second communication pin CC2. Based on this, the pull-down unit 111 includes a first pull-down resistor R1 and a second pull-down resistor R2, one end of the first pull-down resistor R1 is electrically connected to the first ground pin GND1, and the other end is electrically connected to the first communication pin CC1, the first pull-down resistor R1 and the first ground pin GND1 are grounded, the first pull-down resistor R1 and the first communication pin CC1 are electrically connected to the single-chip computer 101, one end of the second pull-down resistor R2 is electrically connected to the second ground pin GND2, and the other end is electrically connected to the second communication pin CC2, the second pull-down resistor R2 and the second ground pin GND2 are grounded, and the second pull-down resistor R2 and the second communication pin CC2 are electrically connected to the single-chip computer 101. In the actual communication process, when the electronic atomization device 100 is in the resistance detection mode, the resistance acquisition instruction is input to the microcontroller 101 through the first communication pin CC1, and the resistance information is output to the computing device 400 through the second communication pin CC2; when the electronic atomization device 100 is in the charging mode, the charging power is input to the microcontroller 101 through the first communication pin CC1 and the second communication pin CC2. Optionally, a USB to serial port unit is added to the communication circuit, and the single-chip computer 101 can transmit the resistance information obtained from the resistance detection unit 108 to the USB to serial port unit, and the USB to serial port unit converts the resistance information into D+ and D- signals inherent to the USB, and then transmits the D+ and D- signals to the computing device 400 through the communication interface 102; wherein, the USB to serial port unit can use a USB to serial port chip of model CH340, CH340 is a USB bus adapter chip, which can realize USB to serial port or USB to printer port. In serial port mode, CH340 can provide commonly used MODEM communication signals for expanding the asynchronous serial port for the computing device 400, or directly upgrading ordinary serial port devices to the USB bus.
[0024] Preferably, the tepy-c interface has six pins, which include the first ground pin GND1, the second ground pin GND2, the first communication pin CC1 and the second communication pin CC2 listed above, as well as the first power supply pin VBUS1 and the second power supply pin VBUS2. The first power supply pin VBUS1 and the second power supply pin VBUS2 are electrically connected to the internal power supply 106, respectively, so that the internal power supply 106 can power the communication interface 102 through the first power supply pin VBUS1 and the second power supply pin VBUS2. It can be understood that the present application uses a 6pin (pin) tepy-c interface to simultaneously realize charging, communication and burning, and has a higher degree of integration; in addition, the popular tepy-c interfaces on the market at this stage include 6pin, 12pin, 16pin, 24pin, etc., and their prices are all between 0.5 and 2 yuan. For the electronic atomization device 100, the cost is too high and it is not recommended to use it, and the average price of the 6pin tepy-c interface is about 0.15 yuan, and the price advantage is very obvious.
[0025] In addition, it should be noted that the function of the pull-down unit 111 is to limit the charging voltage corresponding to the charging energy within a preset voltage range, or in other words, to limit the charging voltage corresponding to the charging energy to a specified voltage within a preset voltage range, so as to ensure that all external power supplies 300 on the market can provide the specified voltage to charge the internal power supply 106. It can be understood that the first communication pin CC1 and the second communication pin CC2 can be considered as the charging protocol pins of the type-c interface. For the electronic atomization device 100, when charging the internal power supply 106, the charging voltage provided should be 5V, not higher than 5V, so it is necessary to design a pull-down unit 111 (i.e., the first pull-down resistor R1 and the second pull-down resistor R2) in the communication circuit to limit the charging voltage corresponding to the charging energy, specifically, to limit the charging voltage corresponding to the charging energy to 5V, so that it can be ensured that all external power supplies 300 on the market can provide a charging voltage of 5V to charge the internal power supply 106. Optionally, the resistance values of the first pull-down resistor R1 and the second pull-down resistor R2 are both 5.1K.
[0026] As one example, see Figure 2 In addition to the structures listed above, the communication circuit may also include an electrostatic protection unit 110 electrically connected between the pull-down unit 111 and the single-chip computer 101. In the actual communication process, the electrostatic protection unit 110 can suppress the static electricity generated during the operation of the electronic atomization device 100. In some implementations of this embodiment, see Figure 3The electrostatic protection unit 110 includes a first electrostatic resistor 112 and a second electrostatic resistor 113. The first electrostatic resistor 112 is connected in parallel to both ends of the first pull-down resistor R1, and the second electrostatic resistor 113 is connected in parallel to both ends of the second pull-down resistor R2. The first electrostatic resistor 112 and the first communication pin CC1, and the second electrostatic resistor 113 and the second communication pin CC2 are electrically connected to the single-chip computer 101. As one implementation, the first electrostatic resistor 112 includes a first zener diode D1 and a second zener diode D2, and the cathode of the first zener diode D1 is connected in series to the cathode of the second zener diode D2; similarly, the second electrostatic resistor 113 includes a third zener diode D3 and a fourth zener diode D4, and the cathode of the third zener diode D3 is connected in series to the cathode of the fourth zener diode D4. It should be noted that the electronic atomization device 100 generally needs to meet the electrostatic high voltage requirements in the industry (i.e., 4000V for electrostatic contact of the type-c interface and 8000V for air), so it is necessary to design an electrostatic protection unit 110 in the communication circuit, and use the first electrostatic resistor 112 and the second electrostatic resistor 113 in the electrostatic protection unit 110 to suppress the static electricity generated during the operation of the electronic atomization device 100.
[0027] As one example, see Figure 2 In addition to the structures listed above, the communication circuit also includes a current limiting unit 109, which is electrically connected between the electrostatic protection unit 110 and the single-chip microcomputer 101. The current limiting unit 109 can limit the charging current corresponding to the charging energy within a preset current range. Its main purpose is to protect the single-chip microcomputer 101 from overvoltage and prevent the single-chip microcomputer 101 from being damaged by high voltage. In some implementations of this embodiment, see Figure 3, the current limiting unit 109 includes a first current limiting resistor R3 and a second current limiting resistor R4, one end of the first current limiting resistor R3 is electrically connected between the first electrostatic resistor 112 and the first communication pin CC1, and the other end is electrically connected to the single-chip computer 101, and one end of the second current limiting resistor R4 is electrically connected between the second electrostatic resistor 113 and the second communication pin CC2, and the other end is electrically connected to the single-chip computer 101. In the actual communication process, when the electronic atomization device 100 is in the resistance detection mode, the resistance acquisition instruction is transmitted to the single-chip computer 101 through the first communication pin CC1 and the first current limiting resistor R3 in sequence, and the resistance information is transmitted to the computing device 400 through the second current limiting resistor R4 and the second communication pin CC2 in sequence. It should be noted that the overvoltage protection point of the electronic atomization device 100 on the market has been raised to 28V at this stage. The high voltage will cause damage to the single-chip microcomputer 101, and then the electronic atomization device 100 cannot work normally. In order to ensure that 28V will not damage the single-chip microcomputer 101, it is necessary to design a current limiting unit 109 in the communication circuit. The first current limiting resistor R3 and the second current limiting resistor R4 in the current limiting unit 109 can ensure that the limiting current during operation is only 2.8mA, so that the I / O port (Input / Output, input / output port) of the single-chip microcomputer 101 will not be damaged. Optionally, the resistance values of the first current limiting resistor R3 and the second current limiting resistor R4 are both 1k (it is not recommended to use 0 ohm resistors).
[0028] As one example, see Figure 2 , the communication interface 102 is connected to the external burning device 500 in the burning mode, then in the actual communication process, the communication interface 102 can receive the burning information sent by the burning device 500 and transmit it to the single-chip microcomputer 101, and the single-chip microcomputer 101 can perform the burning work according to the burning information after receiving the burning information, and transmit the process and / or results of the burning work to the burning device 500 through the communication interface 102 for intuitive display. It should be noted that the burning form of the single-chip microcomputer 101 includes any one of SWIM single-line burning and SPI two-line burning. When the single-chip microcomputer 101 adopts SPI two-line burning, since the SPI communication requires a reset signal to work, the single-chip microcomputer 101 needs to support the self-reset function. In some implementations of this embodiment, the burning information includes a clock signal and data to be burned. In the burning mode, see Figure 3 The clock signal is transmitted to the single-chip computer 101 through the first communication pin CC1 and the first current-limiting resistor R3 in sequence, and the data to be burned is transmitted to the single-chip computer 101 through the second communication pin CC2 and the second current-limiting resistor R4 in sequence; wherein, the clock signal is used to synchronize the clock between the single-chip computer 101 and the burning device 500, and after the burning work is completed, the data to be burned is written into the single-chip computer 101.
[0029] As one example, see Figure 2 In addition to the structures listed above, the communication circuit may also include some common structures in this field, such as a heating unit 105. The single-chip microcomputer 101 is electrically connected to the heating element 103 through the heating unit 105. In the actual communication process, the heating unit 105 has an on state and an off state. The on state and the off state of the heating unit 105 can be switched under the control of the single-chip microcomputer 101. The heating unit 105 can receive the heating power provided by the internal power supply 106 transmitted by the single-chip microcomputer 101, and only when the heating unit 105 is in the on state can the heating unit 105 continue to transmit the heating power to the heating element 103 to achieve heating of the heating element 103. That is to say, when the heating element 103 needs to be heated, the single-chip microcomputer 101 needs to control the heating unit 105 to be in the on state. Similarly, see Figure 2 For example, the charging unit 107, the single chip microcomputer 101 is electrically connected to the internal power supply 106 through the charging unit 107. After the single chip microcomputer 101 receives the charging power provided by the external power supply 300, the single chip microcomputer 101 can transmit the charging power to the charging unit 107. The charging unit 107 also has an on state and an off state, and the on state and the off state of the charging unit 107 can also be switched under the control of the single chip microcomputer 101. Only when the charging unit 107 is in the on state, the charging unit 107 can continue to transmit the charging power to the internal power supply 106 to charge the internal power supply 106. That is to say, when the internal power supply 106 needs to be charged, the single chip microcomputer 101 needs to control the charging unit 107 to be in the on state.
[0030] Furthermore, for example, a power management unit (not shown) electrically connected to the internal power supply 106 is mainly used to implement the management function of the internal power supply 106, which may include but is not limited to temperature monitoring, power monitoring, low voltage protection, overcurrent protection and charging management. For another example, a display control unit and an LED display light (not shown) arranged on the housing of the electronic atomization device 100, the display control unit is electrically connected to the LED display light, which can control the LED display light to emit a constant light of different colors and / or a flashing light of different colors, mainly used to indicate different working states of the electronic atomization device 100, which may include but is not limited to the power-on state, preheating state, low power state, heating state, heating completion state and charging completion state. As for what common structures in the field the communication circuit also includes, this application will not be described in detail here.
[0031] The above embodiments are only preferred implementations of the present application. They are not the only limitations on the electronic atomization device 100 and the communication circuit. Those skilled in the art can flexibly set them according to the actual application scenarios based on the above embodiments. In addition, the electronic atomization device 100 or the communication circuit described in the above embodiments also corresponds to the communication method. Figure 4 It is a flow chart of the communication method, and the communication method includes steps 401 to 403 (abbreviated as S401 to S403), namely: S401, the resistance detection unit 108 responds to the resistance detection instruction sent by the single-chip microcomputer 101 in the resistance detection mode, and detects the resistance information of the heating element 103; S402, the communication interface 102 receives the charging power provided by the external power supply 300 in the charging mode and transmits it to the single-chip microcomputer 101, or receives the resistance acquisition instruction sent by the computing device 400 in the resistance detection mode and transmits it to the single-chip microcomputer 101; S403, the single-chip microcomputer 101 transmits the charging power to the internal power supply 106 in the charging mode to charge the internal power supply 106, or responds to the resistance acquisition instruction in the resistance detection mode, and obtains the resistance information from the resistance detection unit 108, and transmits the resistance information to the computing device 400 through the communication interface 102. It should be noted that for any incomplete description of the communication method, please refer to the description of the electronic atomization device 100 or the communication circuit in the previous text of this application.
[0032] It can be understood that, through the implementation of the above-mentioned embodiments of the present application, the electronic atomization device 100 can take into account the charging function, the resistance detection function and the burning function through a communication interface 102, so that the single-chip microcomputer 101 has the ability to communicate with the outside. Therefore, even after the electronic atomization device 100 is assembled, the real-time detection of the resistance of the heating element 103 can be realized through the communication interface 102, so that it is not necessary to reserve a number of test points on the circuit board of the single-chip microcomputer 101 as in the traditional solution, nor is it necessary to reserve test holes corresponding to the several test points on the shell of the electronic atomization device 100. This reduces the area of the circuit board of the single-chip microcomputer 101, which not only reduces the space occupation and the manufacturing cost of the electronic atomization device 100, but also improves the rationality of the structural design of the electronic atomization device 100; and, after the electronic atomization device 100 is assembled and put on the market, when there is a problem with the electronic atomization device 100, the single-chip microcomputer 101 can be burned through the burning device 500 to achieve program upgrades or repairs, without having to directly scrap the electronic atomization device 100 as in the traditional solution, thereby avoiding waste of resources and extending the service life of the electronic atomization device 100. In addition, it has been experimentally verified that the method of detecting the resistance of the heating element 103 through the communication interface 102 of the present application has a higher detection accuracy than the traditional solution, and can be accurate to 0.001Ω.
[0033] It should be noted that the several embodiments shown in the above text of the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can refer to each other; in addition, for the method embodiment, it is similar to the product embodiment, and the deficiencies in the description of the two can refer to each other. It should also be noted that in the text description of the present application, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is such an actual relationship or order between these entities or operations. Further, the terms "include", "comprise" or any other corresponding variants are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only these elements, but also other elements not explicitly listed, or may also include elements inherent to such process, method, article or device; and, in the absence of more restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0034] In addition, by implementing the several embodiments shown above in the present application, professionals and technicians in this field can implement or use the present application. For the several embodiments shown above in the present application, various modifications will be obvious to professionals and technicians in this field, and the general principles defined in the present application can be implemented in other embodiments not shown without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the several embodiments shown above, but will comply with the widest range consistent with the principles and novel features disclosed in the present application.
Claims
1. A communication circuit that takes into account both charging and resistance detection, It is characterized in that Applied to an electronic atomization device, the electronic atomization device includes an internal power supply, a single-chip microcomputer and a heating element, the heating element is electrically connected to the single-chip microcomputer, the single-chip microcomputer is electrically connected to the internal power supply, the single-chip microcomputer is used to transmit the heating power provided by the internal power supply to the heating element to heat the heating element; the communication circuit includes a communication interface, a pull-down unit and a resistance detection unit, the communication interface is electrically connected to the single-chip microcomputer through the pull-down unit, the unit is electrically connected to the resistance detection unit, and the resistance detection unit is electrically connected to the heating element, wherein: The resistance detection unit is used to respond to the resistance detection instruction sent by the single chip microcomputer in the resistance detection mode and detect the resistance information of the heating element; The communication interface is connected to an external power source in the charging mode, or is connected to an external computing device in the resistance detection mode, and is used to: receive the charging power provided by the external power source in the charging mode and transmit it to the single-chip microcomputer, and the pull-down unit is used to limit the charging voltage corresponding to the charging power within a preset voltage range; or, in the resistance detection mode, receive the resistance acquisition instruction sent by the computing device and transmit it to the single-chip microcomputer; The single chip microcomputer is also used to: in the charging mode, transmit the charging electric energy to the internal power supply to charge the internal power supply; or, in the resistance detection mode, respond to the resistance acquisition instruction and obtain the resistance information from the resistance detection unit, and transmit the resistance information to the computing device through the communication interface.
2. The communication circuit according to claim 1, It is characterized in that The communication interface is a tepy-c interface, and the tepy-c interface has a plurality of pins, and the plurality of pins include a first ground pin, a second ground pin, a first communication pin, and a second communication pin; The pull-down unit includes a first pull-down resistor and a second pull-down resistor, one end of the first pull-down resistor is electrically connected to the first ground pin, and the other end is electrically connected to the first communication pin, the first pull-down resistor and the first ground pin are grounded, the first pull-down resistor and the first communication pin are electrically connected to the single-chip microcomputer, one end of the second pull-down resistor is electrically connected to the second ground pin, and the other end is electrically connected to the second communication pin, the second pull-down resistor and the second ground pin are grounded, and the second pull-down resistor and the second communication pin are electrically connected to the single-chip microcomputer; wherein, in the resistance detection mode, the resistance acquisition instruction is input to the single-chip microcomputer by the first communication pin, and the resistance information is output to the computing device by the second communication pin; in the charging mode, the charging power is input to the single-chip microcomputer by the first communication pin and the second communication pin.
3. The communication circuit according to claim 2, It is characterized in that It also includes an electrostatic protection unit electrically connected between the pull-down unit and the single-chip microcomputer, and the electrostatic protection unit is used to suppress static electricity generated during the operation of the electronic atomization device.
4. The communication circuit according to claim 3, It is characterized in that The electrostatic protection unit includes a first electrostatic resistor and a second electrostatic resistor, the first electrostatic resistor is connected in parallel at both ends of the first pull-down resistor, the second electrostatic resistor is connected in parallel at both ends of the second pull-down resistor, and the first electrostatic resistor and the first communication pin, as well as the second electrostatic resistor and the second communication pin, are electrically connected to the microcontroller respectively.
5. The communication circuit according to claim 4, It is characterized in that The first electrostatic resistor includes two voltage-stabilizing diodes, and the cathode of one of the voltage-stabilizing diodes is connected in series with the cathode of the other voltage-stabilizing diode; wherein the structure of the second electrostatic resistor is the same as that of the first electrostatic resistor.
6. The communication circuit according to claim 4, It is characterized in that It also includes a current limiting unit, which is electrically connected between the electrostatic protection unit and the single-chip computer, and is used to limit the charging current corresponding to the charging energy within a preset current range.
7. The communication circuit according to claim 6, It is characterized in that The current limiting unit includes a first current limiting resistor and a second current limiting resistor, one end of the first current limiting resistor is electrically connected between the first electrostatic resistor and the first communication pin, and the other end is electrically connected to the single-chip microcomputer, one end of the second current limiting resistor is electrically connected between the second electrostatic resistor and the second communication pin, and the other end is electrically connected to the single-chip microcomputer; wherein, in the resistance detection mode, the resistance acquisition instruction is transmitted to the single-chip microcomputer via the first communication pin and the first current limiting resistor in sequence, and the resistance information is transmitted to the computing device via the second current limiting resistor and the second communication pin in sequence.
8. The communication circuit according to claim 7, It is characterized in that The communication interface is connected to an external burning device in the burning mode, and is also used to receive the burning information sent by the burning device in the burning mode and transmit it to the single-chip microcomputer; the single-chip microcomputer is also used to perform burning work according to the burning information in the burning mode; wherein the burning form of the single-chip microcomputer includes any one of SWIM single-line burning and SPI two-line burning, and when the single-chip microcomputer adopts the SPI two-line burning, the single-chip microcomputer supports a self-reset function.
9. The communication circuit according to claim 8, It is characterized in that The programming information includes a clock signal and data to be programmed. In the programming mode, the clock signal is transmitted to the single-chip microcomputer via the first communication pin and the first current-limiting resistor in sequence, and the data to be programmed is transmitted to the single-chip microcomputer via the second communication pin and the second current-limiting resistor in sequence; wherein the clock signal is used to synchronize the clock between the single-chip microcomputer and the programming device, and after the programming work is completed, the data to be programmed is written into the single-chip microcomputer.
10. The communication circuit according to claim 2, It is characterized in that The plurality of pins further include a first power supply pin and a second power supply pin, wherein the first power supply pin and the second power supply pin are electrically connected to the internal power source respectively.
11. An electronic atomization device, It is characterized in that The electronic atomization device comprises an internal power supply, a single-chip microcomputer, a heating element and an aerosol generator, wherein the heating element is sleeved on the aerosol generator, the inner wall of the heating element is in contact with the aerosol generator, the heating element is electrically connected to the single-chip microcomputer, the single-chip microcomputer is electrically connected to the internal power supply, and the single-chip microcomputer is used to transmit the heating power provided by the internal power supply to the heating element to heat the heating element; the electronic atomization device also comprises a communication circuit, the communication circuit comprises a communication interface, a pull-down unit and a resistance detection unit, the communication interface is electrically connected to the single-chip microcomputer through the pull-down unit, the unit is electrically connected to the resistance detection unit, and the resistance detection unit is electrically connected to the heating element, wherein: The resistance detection unit is used to respond to the resistance detection instruction sent by the single chip microcomputer in the resistance detection mode and detect the resistance information of the heating element; The communication interface is connected to an external power source in the charging mode, or is connected to an external computing device in the resistance detection mode, and is used to: receive the charging power provided by the external power source in the charging mode and transmit it to the single-chip microcomputer, and the pull-down unit is used to limit the charging voltage corresponding to the charging power within a preset voltage range; or, in the resistance detection mode, receive the resistance acquisition instruction sent by the computing device and transmit it to the single-chip microcomputer; The single chip microcomputer is also used to: in the charging mode, transmit the charging electric energy to the internal power supply to charge the internal power supply; or, in the resistance detection mode, respond to the resistance acquisition instruction and obtain the resistance information from the resistance detection unit, and transmit the resistance information to the computing device through the communication interface.
12. A communication method that takes into account both charging and resistance detection. It is characterized in that The electronic atomization device according to claim 11 comprises: The resistance detection unit responds to the resistance detection instruction sent by the single chip microcomputer in the resistance detection mode, and detects the resistance information of the heating element; The communication interface receives charging power provided by an external power source in the charging mode and transmits it to the single-chip microcomputer, or receives a resistance value acquisition instruction sent by a computing device in the resistance value detection mode and transmits it to the single-chip microcomputer; The single chip microcomputer transmits the charging power to the internal power supply in the charging mode to charge the internal power supply, or responds to the resistance acquisition instruction in the resistance detection mode, obtains the resistance information from the resistance detection unit, and transmits the resistance information to the computing device through the communication interface.