Camera

Abstract

The invention discloses a camera which comprises an image sensor (100), a TEC module (200), a main control board assembly (700) and a shell, the shell is provided with an inner cavity, the TEC module (200) is arranged in the inner cavity and divides the inner cavity into a refrigeration cavity (B) and a heat dissipation cavity, the image sensor (100) is arranged in the refrigeration cavity (B), and the main control board assembly (700) is arranged in the heat dissipation cavity. According to the scheme, the problem that a refrigerating device in an existing camera is low in refrigerating efficiency can be solved.

Description

[0001] This application is a divisional application of Chinese patent application CN2018109334152, whose application date is August 15, 2018 and whose name is “A camera”. Technical Field

[0002] The present invention relates to the technical field of machine vision, and in particular to a camera. Background Art

[0003] In order to improve the shooting quality, current cameras are usually equipped with a refrigeration device, which can enable the camera's image sensor to operate in a lower temperature environment, thereby reducing the generation of dark current, and further improving the signal-to-noise ratio of images taken in long-term weak light conditions, ultimately being able to capture more ideal fluorescence or chemiluminescence patterns.

[0004] The current refrigeration device cools the entire camera during the process of cooling the camera, which results in insufficient cooling capacity allocated to the image sensor. Obviously, the current whole-machine cooling method has the problem of low cooling efficiency, which will eventually lead to increased energy consumption and, most importantly, poor image quality obtained by the image sensor, which cannot meet the requirements. Summary of the invention

[0005] The invention discloses a camera to solve the problem of low cooling efficiency of current cameras.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions: A camera comprises an image sensor, a TEC module, a main control board assembly and a shell, wherein the shell has an inner cavity, the TEC module is arranged in the inner cavity and divides the inner cavity into a refrigeration cavity and a heat dissipation cavity, the image sensor is arranged in the refrigeration cavity, the main control board assembly is arranged in the heat dissipation cavity and is electrically connected to the image sensor.

[0007] The technical solution adopted by the present invention can achieve the following beneficial effects: In the camera disclosed in the present invention, the TEC module is a refrigeration module in the camera. The TEC module divides the inner cavity of the shell into a refrigeration cavity and a heat dissipation cavity. The image sensor is arranged in the refrigeration cavity, and then the TEC module specifically refrigerates it. The main control board assembly of the camera is arranged in the heat dissipation cavity. Under this assembly structure, the TEC module can specifically refrigerate the image sensor in the refrigeration cavity alone, without refrigerating the entire camera. The cooling capacity of the TEC module can be more concentratedly applied to the image sensor, thereby improving the cooling efficiency of the camera's refrigeration device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings: Figure 1 A schematic diagram of the structure of a camera disclosed in an embodiment of the present invention; Figure 2 for Figure 1 A cross-sectional view of the camera shown, Figure 2 The heat dissipation teeth are not shown; Figure 3 A schematic diagram of the exploded structure of a camera disclosed in an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a first circuit board disclosed in an embodiment of the present invention; Figure 5 A schematic diagram of the connection between the first circuit board and the second circuit board disclosed in an embodiment of the present invention; Figure 6 A cross-sectional view of a partial structure of a camera disclosed in an embodiment of the present invention; Figure 7 and Figure 8 They are Figure 2 Schematic diagram of the structure in the middle at different viewing angles. Figure 7 The heat dissipation teeth are not shown; Fig. 9 A cross-sectional view of a partial structure of a camera; Fig.10 is a schematic diagram of the structure of the back cover; Fig.11 Schematic diagram of the coordination between the cable and the cover.

[0009] Description of reference numerals: 100-image sensor, 110-support plate, 200-TEC module, 210-TEC body, 220-hot end component, 221-heat dissipation teeth, 230-cold end component, 300-back cover assembly, 310-back cover, 311-heat dissipation boss, 312-light guide column, 313-interface through hole, 314-aviation plug through hole, 320-cover plate, 330-groove, 331-inclined air induction surface, 340-fan guard, 341-screw, 400-front cover, 410-adapter ring, 420-filter, 500- cooling fan, 600- first circuit board, 610- inner frame, 620- outer frame, 630- flexible circuit board, 700- main control board assembly, 710- interface board, 711- avoidance hole, 720- second circuit board, 721- chip, 730- interface, 740- heat sink, 750- thermal pad, 800 electrical adapter, 810 first board-to-board connector, 820- second board-to-board connector, 900- cable, 910- sealing ring, 911- barb, 912- retaining ring, 1000- aviation plug; A-heat dissipation duct, B-refrigeration chamber, C-accommodation chamber, D-dustproof chamber, a-sealing ring, b-sealing ring. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0011] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0012] Please refer to Figure 1-Figure 11 An embodiment of the present invention discloses a camera, which includes an image sensor 100, a TEC module 200, a main control board assembly 700 and a housing.

[0013] The shell has an inner cavity, and the TEC module 200 is arranged in the inner cavity of the shell, and the inner cavity is divided into a refrigeration cavity B and a heat dissipation cavity. The TEC module 200 is a refrigeration device of the camera. The TEC (Thermo Electric Cooler) module 200 is a semiconductor refrigerator made by using the Peltier effect of semiconductor materials. The TEC module 200 is a well-known device. During the operation of the TEC module 200, one end of the TEC module 200 absorbs heat and the other end releases heat. In this embodiment, the end of the TEC module 200 that absorbs heat is used to realize the refrigeration of the refrigeration cavity B, and the end of the TEC module 200 that releases heat releases heat to the heat dissipation cavity, and finally the heat dissipation is realized by the heat dissipation cavity.

[0014] The image sensor 100 is the image acquisition component of the camera and is also a device in the camera that needs to work in a low temperature environment. The image sensor 100 is arranged in the refrigeration chamber B. The main control board assembly 700 is the main control part of the camera. The main control board assembly 700 generates more heat during operation. The main control board assembly 700 is arranged in the heat dissipation chamber and is electrically connected to the image sensor 100, thereby realizing power supply and control of the image sensor 100.

[0015] The camera disclosed in the embodiment of the present invention uses the TEC module 200 to divide the inner cavity of the shell into a cooling cavity B and a heat dissipation cavity, and the image sensor 100 is arranged in the cooling cavity B to be cooled specifically for it, and the main control board assembly 700 with more heat dissipation is arranged in the heat dissipation cavity to avoid its influence on the cooling of the image sensor 100. In this case, the cooling capacity generated by the TEC module 200 of the camera can be concentratedly used to cool the image sensor 100, avoiding cooling the entire camera, and also avoiding cooling some components that do not need to be cooled, which can undoubtedly improve the cooling efficiency.

[0016] In order to further reduce heat exchange, the refrigeration chamber B is usually a sealed chamber. The refrigeration chamber B can be filled with an inert gas, such as nitrogen, helium, etc. The heat exchange effect of the inert gas is poor, and thus the low temperature environment in the refrigeration chamber B can be maintained well.

[0017] The image sensor 100 can be electrically connected to the main control board assembly 700 through the first circuit board 600. The first circuit board 600 is disposed in the refrigeration chamber B, and the image sensor 100 is mounted on the first circuit board 600. The first circuit board 600 not only provides a mounting base for the image sensor 100, but also enables electrical connection between the image sensor 100 and the main control board assembly 700.

[0018] The TEC module 200 generally includes a TEC body 210 and a hot end component 220 and a cold end component 230 respectively disposed at both ends of the TEC body 210. The TEC body 210 is the main component of the TEC module 200, and the TEC body 210 is a thermocouple made of two semiconductor materials. The hot end component 220 is disposed at the end of the TEC body 210 where heat is released, so as to release heat. The cold end component 230 is disposed at the end of the TEC body 210 where heat is absorbed, so as to absorb heat. In order to improve the heat exchange efficiency, both the hot end component 220 and the cold end component 230 can be formed by a structure or material with a higher heat exchange efficiency.

[0019] During operation, the hot end component 220 releases heat and the cold end component 230 absorbs heat. Generally, one side of the image sensor 100 is the sensing side and the other side is the mounting side. As described above, the image sensor 100 can be mounted on the first circuit board 600, the mounting side of the image sensor 100 is connected to the first circuit board 600, and the first circuit board 600 supplies power to the image sensor 100. During operation, the heat absorption of the cold end component 230 causes the temperature of the refrigeration chamber B to drop, thereby achieving refrigeration of the image sensor 100.

[0020] In order to further improve the cooling and heat dissipation effects, in a preferred solution, a heat conductive member with good thermal conductivity can be provided between the TEC body 210 and the cold end component 230 and between the TEC body 210 and the hot end component 220. In a specific embodiment, the heat conductive member can be a printed thermal grease layer.

[0021] In the actual assembly process, the cold-end component 230 and the hot-end component 220 are relatively large in size. In order to better connect the two with the TEC body 210, in a preferred solution, the cold-end component 230 and the hot-end component 220 can be locked by screws, that is, the TEC body 210 is clamped and fixed between the cold-end component 230 and the hot-end component 220.

[0022] Specifically, the cold end member 230 and the hot end member 220 may be connected by a heat-insulating screw made of a heat-insulating material, which can reduce the heat exchange between the cold end member 230 and the hot end member 220. In a specific embodiment, the heat-insulating material may be a nylon material. Heat-insulating materials may be provided between the connection holes of the heat-insulating screw and the cold end member 230 and the connection holes of the hot end member 220 to further reduce heat exchange.

[0023] In order to further improve the cooling efficiency of the image sensor 100, in a preferred solution, the first circuit board 600 may be provided with a through hole, and the cold end component 230 of the TEC module 200 may pass through the through hole and contact the image sensor 100. In this case, the cold end component 230 can achieve direct contact with the image sensor 100 without affecting the electrical connection between the first circuit board 600 and the image sensor 100, which can undoubtedly improve the cooling efficiency of the image sensor 100.

[0024] There are many specific structures of the first circuit board 600 that can meet the above requirements. Figure 4 In a specific embodiment, the first circuit board 600 may include an inner frame 610 and an outer frame 620 disposed around the inner frame 610 and electrically connected thereto. The image sensor 100 is mounted on the inner frame 610, and the cold end member 230 passes through the central hole of the inner frame 610 and contacts the image sensor 100. The central hole of the inner frame 610 is the perforation described above. The inner frame 610 is electrically connected to the outer frame 620, and the outer frame 620 is electrically connected to the main control board assembly 700. The image sensor 100 is mounted on the inner frame 610, and can be electrically connected to the main control board assembly 700 through the inner frame 610 and the outer frame 620 in turn.

[0025] In the process of installing electronic components, the inner frame 610 can be provided with the image sensor 100 and some necessary electronic components with low power, and the outer frame 620 can be provided with some necessary electronic components with high power. This arrangement enables the cold end member 230 to deliver the cooling capacity to the inner frame 610, avoiding delivery to the unnecessary outer frame 620. Obviously, this can undoubtedly further improve the cooling efficiency of the TEC module 200. Of course, in this case, under the premise that the cooling capacity demand of the image sensor 100 is determined, the power consumption of the TEC module 200 will be reduced, and the designer can configure the camera with a TEC module 200 with low power for cooling. Of course, under this structure, if a high-power TEC module 200 is used for cooling, a lower cooling temperature can be achieved, thereby meeting the user's special application or the design requirements of a higher-power image sensor 100.

[0026] It can be seen that the first circuit board 600 of the above structure can provide conditions for the layout of electronic components, thereby further reducing the cooling loss of the TEC module 200, and accordingly, greatly improving the cooling efficiency.

[0027] In order to pursue a more extreme cooling effect, only the image sensor 100 can be set on the inner frame 610 without other electronic components. In order to improve the stability of the setting, the image sensor 100 can be set on the inner frame 610 through the support plate 110. The support plate 110 can serve as the main mechanical support. The inner frame 610 is fixedly connected to the support plate 110. The image sensor 100 is installed on the support plate 110 and is electrically connected to the inner frame 610. Of course, the support plate 110 also needs to be provided with a perforation for the cold end member 230 to pass through, so as to facilitate the direct contact between the cold end member 230 and the image sensor 100.

[0028] In order to better adapt to the installation environment, in a preferred solution, the inner frame 610 and the outer frame 620 can be electrically connected through a flexible circuit board 630 or a flexible cable. The flexible circuit board 630 or the flexible cable has good deformation performance, which can better enable the deformation between the inner frame 610 and the outer frame 620 to achieve the purpose of flexibly adapting to the installation environment. A heat insulation material can be provided between the inner frame 610 and the outer frame 620, and the heat insulation material can reduce the thermal impact of the outer frame 620 on the inner frame 610.

[0029] The main control board assembly 700 may include a second circuit board 720, and some high-power electronic devices of the camera may be arranged on the second circuit board 720. Since the second circuit board 720 is located outside the refrigeration chamber B, the influence of these high-power devices on the refrigeration work can be avoided. Of course, the TEC module 200 is also avoided from refrigerating some unnecessary electronic devices, which can undoubtedly reduce the refrigeration power consumption. The camera disclosed in this embodiment arranges electronic devices on circuit boards in different spaces, which is conducive to a more planned layout to improve the refrigeration efficiency.

[0030] The second circuit board 720 can be electrically connected to the first circuit board 600 through an electrical adapter 800 that penetrates from the refrigeration cavity B into the heat dissipation cavity. The electrical adapter 800 can realize electrical connection between the main control board assembly 700 and the first circuit board 600 respectively located in the refrigeration cavity B and the heat dissipation cavity. In a specific embodiment, the electrical adapter 800 can be an adapter circuit board.

[0031] In a specific embodiment, the electrical adapter 800 is connected to the first circuit board 600 via a first board-to-board connector 810, and the electrical adapter 800 is connected to the second circuit board 720 via a second board-to-board connector 820. The first board-to-board connector 810 and the second board-to-board connector 820 can realize the electrical connection and signal connection between the first circuit board 600 and the second circuit board 720, and can also improve the stability of the connection between the first circuit board 600 and the second circuit board 720.

[0032] In a preferred solution, the first board-to-board connector 810 and the second board-to-board connector 820 can be staggered on both sides of the electrical adapter 800. The staggered distribution of the first board-to-board connector 810 and the second board-to-board connector 820 is conducive to the sealing of the electrical adapter 800, thereby making it easier to achieve the sealed isolation between the refrigeration cavity B and the heat dissipation cavity.

[0033] In the embodiment of the present invention, the housing may include a rear cover 310 and a front cover 400 that is connected to the rear cover 310 to form an inner cavity. The main control board assembly 700 may also include an interface board 710, which may be disposed between the second circuit board 720 and the bottom wall of the rear cover 310. The rear cover 310 is provided with an interface 730 that is electrically connected to the interface board 710. The camera may be connected to the outside world through the interface 730.

[0034] The second circuit board 720 is usually provided with a chip 721. The chip 721 is the control core of the camera and generates more heat during operation. Better heat dissipation of the chip 721 is undoubtedly more conducive to the operation of the camera. Based on this, in a preferred solution, the interface board 710 can be provided with an avoidance hole 711 and contact the chip 721. The interface board 710 adopts an opening method, which can make the heat dissipation boss 311 directly contact the chip 721, and finally can further improve the heat dissipation efficiency of the chip 721.

[0035] In the actual design process, considering the length of the signal transmission path and the connection between electronic components, an interface 730 may be provided on the part of the back cover 310 that is directly opposite to the chip 721. Obviously, the heat dissipation boss 311 cannot contact and dissipate heat with the chip 721 over a large area. Based on this, in the preferred scheme, a heat sink 740 may be sandwiched between the heat dissipation boss 311 and the chip 721. One end of the heat sink 740 is attached to the surface of the chip 721, and the other end contacts the back cover 310 after passing through the avoidance hole 711. The heat sink 740 can increase the contact heat dissipation area, thereby improving the heat dissipation effect on the chip 721. Considering that the inner wall of the back cover 310 and the surface of the chip 721 are not in the same plane, the heat sink 740 is usually a special-shaped piece, such as a Z-shaped heat sink.

[0036] In order to further improve the heat dissipation efficiency, a thermal pad 750 may be provided between the heat sink 740 and the chip 721 and between the heat sink 740 and the back cover 310. The thermal pad 750 is usually made of a material with better thermal conductivity to improve the heat conduction efficiency.

[0037] In order to improve the heat dissipation performance of the heat dissipation cavity, in a preferred solution, a heat dissipation duct A may be provided in the heat dissipation cavity, a heat dissipation fan 500 is provided on the housing, the air outlet of the heat dissipation fan 500 is connected to the air inlet of the heat dissipation duct A, and the air outlet of the heat dissipation duct A is used to communicate with the external environment. During operation, the heat dissipation fan 500 drives the air flow into the heat dissipation duct A, and finally, after heat exchange in the heat dissipation duct, the air is discharged from the air outlet of the heat dissipation duct A to the external environment, thereby completing the heat dissipation. This active heat dissipation method can undoubtedly further improve the heat dissipation performance of the camera.

[0038] In the actual working process, the heat dissipation efficiency of the hot end component 220 of the TEC module 200 directly affects the cooling efficiency of the TEC module 200. If the heat dissipation efficiency of the hot end component 220 is poor, the heat will accumulate and offset the cooling capacity of the cold end component 230, and even damage the TEC module 200 in severe cases. Based on this, in a preferred solution, the shell can include a rear cover assembly 300, and the rear cover assembly 300 includes the rear cover 310 described above. The TEC module 200 includes a hot end component 220, and a heat dissipation duct A can be formed between the hot end component 220 and the rear cover assembly 300. The hot end component 220 directly constitutes the heat dissipation duct A, which undoubtedly enables the hot end component 220 to more efficiently and fully exchange heat with the airflow passing through, thereby achieving the purpose of improving the heat exchange efficiency.

[0039] The hot end component 220 may adopt a shape with good heat dissipation performance. In a specific embodiment, the hot end component 220 may include heat dissipation teeth 221, which can increase the heat exchange area between the hot end component 220 and the airflow, thereby improving the heat dissipation efficiency of the hot end component 220.

[0040] In this embodiment, the rear cover assembly 300 may include a rear cover 310 and a cover plate 320, and the rear cover 310 has an opening facing the hot end component 220. The cover plate 320 is sealed on the opening of the rear cover 310 and forms a receiving cavity C with the rear cover 310, and the main control board assembly 700 may be disposed in the receiving cavity C. Specifically, the cover plate 320 and the hot end component 220 form a heat dissipation duct A. The receiving cavity C can provide a closed installation space for the main control board assembly 700, thereby preventing the main control board assembly 700 from being affected by the external environment.

[0041] There are many ways to achieve the sealing cooperation between the cover plate 320 and the opening of the back cover 310. For example, the surface of the cover plate 320 and the end face of the opening of the back cover 310 can be sealed by face-to-face fitting. In this case, the surface of the cover plate 320 and the end face of the back cover 310 are both high-precision machined surfaces. In this case, the accommodating cavity C formed by the cover plate 320 and the back cover 310 has good sealing performance, and can play a role in waterproofing and dustproofing. Obviously, this is more conducive to the protection of the main control board assembly 700.

[0042] In order to improve the overall appearance of the camera and make the camera smaller, in a preferred solution, the housing is provided with a groove 330, the groove 330 is communicated with the heat dissipation air duct A, and the heat dissipation fan 500 is installed in the groove 330. The notch of the groove 330 can be provided with a fan guard 340, and the fan guard 340 can be fixed to the rear cover assembly 300 by screws 341, thereby realizing the fixed installation of the heat dissipation fan 500 in the groove 330.

[0043] In a further preferred solution, the cooling fan 500 is at least partially located at the air inlet of the cooling air duct A, so that the airflow discharged by the cooling fan 500 can directly enter the cooling air duct A. Specifically, a part of the cooling fan 500 can be opposite to the rear cover 310, and another part can be opposite to the cooling air duct A. This arrangement can not only dissipate heat for the hot end component 220, but also dissipate heat for the rear cover 310, thereby indirectly dissipating the heat generated by the main control board assembly 700 when it is working.

[0044] The bottom surface of the groove 330 opposite to the cooling fan 500 may be an inclined air induction surface 331, and the inclined air induction surface 331 is used to guide the airflow in the groove 330 to the cooling air duct A. The inclined air induction surface 331 is conducive to the airflow blowing toward the back cover 310 to eventually flow more into the cooling air duct A under its guidance. Of course, the inclination angle of the inclined air induction surface 331 determines the shape of the accommodating cavity C, which in turn affects the normal layout of the main control board assembly 700 inside it. In this embodiment, the inclination angle of the inclined air induction surface 331 should not affect the installation of the main control board assembly 700. Under this premise, the inclination angle of the inclined air induction surface 331 and the distance from the cooling fan 500 can be determined by fluid simulation, so that the air volume passing through the cooling air duct A is maximized.

[0045] The cooling fan 500 is installed in the groove 330, and the cooling air duct A passes through the middle of the camera, so the above assembly method can also improve the appearance performance of the camera to a certain extent.

[0046] The main control board assembly 700 can supply power to other components of the camera, such as an indicator light. Generally, the indicator light is used to display the power-on status of the camera. Generally, when the indicator light is on, it means that the camera is in a power-on state or a working state, otherwise, it means that the camera is in a non-working state or a non-power-on state. The indicator light is usually arranged in the accommodating cavity C, and the indicator light guides the light out of the back cover 310 through a light guide column for display. In a specific embodiment, a light guide column 312 can be arranged in the back cover 310, one end of the light guide column 312 passes through the side wall of the back cover 310, and the other end of the light guide column 312 can pass through the bottom wall of the back cover 310. Of course, at least part of the light guide column 312 between the two ends is located in the accommodating cavity C to receive the light of the indicator light. The light of the indicator light can be emitted from the bottom wall and the side wall of the back cover 310 after being conducted by the light guide column 312. In this case, the user can observe the light of the indicator light in the direction toward the bottom wall of the back cover 310 and the direction toward the side wall of the back cover 310. This structure can facilitate the user's observation, and can also make the camera adapt to more installation environments, with good installation flexibility. In a specific implementation, the light guide column 312 is an L-shaped light guide column. Of course, the light guide column 312 also adopts other shapes, and the embodiment of the present invention does not limit the specific structure of the light guide column 312.

[0047] The cooling fan 500 is usually powered by the main control board assembly 700. Since the cooling fan 500 is usually arranged outside the accommodating chamber C, and the main control board assembly 700 is arranged inside the accommodating chamber C. Therefore, the cooling fan 500 is usually electrically connected to the main control board assembly 700 through the cable 900. Usually, the cable 900 is connected after passing through the cover plate 320. In order to achieve dustproof and waterproof of the accommodating chamber C, a sealing ring 910 can be sleeved on the cable 900, and the sealing ring 910 can be fixed on the cover plate 320 by snapping. Specifically, the sealing ring 910 can be a silicone sealing ring. The sealing ring 910 is an open silicone ring, and the sealing ring includes a barb 911 and a retaining ring 912. The open silicone ring can be sleeved on the cable 900 through the opening, and the barb 911 and the retaining ring 912 are respectively positioned on the surfaces of both sides of the cover plate 320, so as to achieve a better sealing effect, and also facilitate better positioning of the cable 900.

[0048] In the embodiment of the present invention, specifically, an adapter ring 410 is installed on the front cover 400, and a filter 420 is installed in the lens barrel of the adapter ring 410 opposite to the image sensor 100. The filter 420, the adapter ring 410, the first circuit board 600, the front cover 400 and the TEC module 200 can surround a refrigeration chamber B. The two connected components can be sealed by a sealing ring and a sealant to ensure the sealing of the refrigeration chamber B. Of course, there are many ways to form the refrigeration chamber B in the camera. Under the premise of not affecting the normal operation of each component of each camera, more or fewer components can be used to form the refrigeration chamber B.

[0049] In order to further alleviate the condensation phenomenon, in a preferred solution, a molecular sieve can be set in the refrigeration chamber B. The molecular sieve has good water absorption performance. The molecular sieve can solve the condensation problem caused by the trace leakage that is difficult to avoid in long-term sealing. Specifically, a certain amount of molecular sieve can be fixed in the refrigeration chamber B by using a pressing plate, which can extend the sealing time of the refrigeration chamber B.

[0050] Cameras, especially industrial cameras, have very high requirements for the cleanliness of the imaging surface and the protective glass surface of the image sensor 100. Even micron-level dust on the protective glass surface of conventional image sensors will affect the imaging. In order to meet this requirement, the components in the camera that need to be dustproof can use electronic components that are easy to remove and prevent dust. Specifically, the image sensor 100 and the filter 420 can use the dust removal method commonly used in the industry for optical components, such as using dust-free paper or ultrasonic cleaning.

[0051] In a specific implementation, the filter 420, the adapter ring 410, the front cover 400 and the image sensor 100 can enclose a dustproof cavity D, which is a part of the refrigeration cavity B. The above components can enclose the components that are greatly affected by dust into the dustproof cavity D, and the above components are also easier to remove dust. Specifically, the image sensor 100 and the front cover 400 can be sealed by glue dot, and the glue dot position can be on the periphery of the protective glass of the image sensor 100.

[0052] In this embodiment, the refrigeration chamber B is preferably a sealed chamber. The sealing of the refrigeration chamber B is one of the key points in the design. Once the seal fails, condensed water droplets may cause the internal circuit of the camera to short-circuit, and even burn the valuable image sensor 100. The camera disclosed in this embodiment can use the vacuum sealing standard as the sealing criterion, and a double sealing method of a sealing ring and a spot sealant can be used at key positions to achieve sealing.

[0053] During the process of assembling the filter 420 to the adapter ring 410, sealant can be applied between the two for sealing. The electrical adapter 800 can be fixed to the hot end component 220 by screws, and the sealant is filled in the glue dispensing grooves around the first board-to-board connector 810 and the second board-to-board connector 820 on both sides of the electrical adapter 800.

[0054] The hot end component 220 and the front cover 400 can be sealed by glue pouring, and the adapter ring 410 and the front cover 400 can be sealed by glue dispensing. Of course, the adapter ring 410 can also be sealed with the front cover 400 through a sealing ring a. The front cover 400 and the TEC module 200 can also be sealed through a sealing ring b.

[0055] The light guide column 312 needs to extend out of the back cover assembly 300, so the back cover 310 has a through hole for the light guide column 312 to pass through, and a sealant can be applied to seal and prevent dust. The interface through hole 313 on the back cover 310 for the interface 730 to pass through can be overlapped by a conductive sponge between the interface 730 and the back cover 310 to prevent dust.

[0056] The camera generally includes an aviation plug 1000. The aviation plug 1000 and the aviation plug through hole 314 on the rear cover 310 can be sealed by the structure of the aviation plug 1000 itself to prevent dust.

[0057] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0058] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A camera, It is characterized in that The invention comprises an image sensor (100), a TEC module (200), a main control board assembly (700) and a housing, wherein the housing has an inner cavity, the TEC module (200) is arranged in the inner cavity and divides the inner cavity into a refrigeration cavity (B) and a heat dissipation cavity, the image sensor (100) is arranged in the refrigeration cavity (B), and the main control board assembly (700) is arranged in the heat dissipation cavity and is electrically connected to the image sensor (100).

2. The camera according to claim 1, It is characterized in that The image sensor (100) is electrically connected to the main control board assembly (700) via a first circuit board (600); the first circuit board (600) is arranged in the refrigeration cavity (B); the image sensor (100) is mounted on the first circuit board (600); the TEC module (200) comprises a cold end component (230); the cold end component (230) passes through a through hole of the first circuit board (600) and contacts the image sensor (100).

3. The camera according to claim 2, It is characterized in that The first circuit board (600) comprises an inner frame (610) and an outer frame (620) arranged around the inner frame (610) and electrically connected thereto, the image sensor (100) is mounted on the inner frame (610), the cold end component (230) passes through a central hole of the inner frame (610) and contacts the image sensor (100), the central hole being the through hole.

4. The camera according to claim 3, It is characterized in that The inner frame (610) and the outer frame (620) are electrically connected via a flexible circuit board (630), and a heat insulating material is filled between the inner frame (610) and the outer frame (620).

5. The camera according to claim 2, It is characterized in that The main control board assembly (700) comprises a second circuit board (720), and the second circuit board (720) is electrically connected to the first circuit board (600) via an electrical adapter (800) that penetrates from the refrigeration cavity (B) into the heat dissipation cavity.

6. The camera according to claim 5, It is characterized in that The shell comprises a rear cover (310) and a front cover (400) connected to the rear cover (310) to form the inner cavity. The main control board assembly (700) further comprises an interface board (710). The interface board (710) is arranged between the second circuit board (720) and the bottom wall of the rear cover (310). The rear cover (310) is provided with an interface (730) electrically connected to the interface board (710).

7. The camera according to claim 6, It is characterized in that A chip (721) is arranged on the second circuit board (720), an avoidance hole (711) is arranged on the interface board (710), a heat dissipation boss (311) passing through the avoidance hole (711) is arranged on the bottom wall inside the rear cover (310), a heat dissipation boss (311) passing through the avoidance hole (711) is arranged, a heat sink (740) is sandwiched between the heat dissipation boss (311) and the chip (721), one end of the heat sink (740) is attached to the surface of the chip (721), and the other end passes through the avoidance hole (711) and contacts the rear cover (310).

8. The camera according to claim 1, It is characterized in that A heat dissipation duct (A) is arranged in the heat dissipation cavity, a heat dissipation fan (500) is arranged on the shell, an air outlet of the heat dissipation fan (500) is communicated with an air inlet of the heat dissipation duct (A), and the air outlet of the heat dissipation duct (A) is used to communicate with the external environment; the shell comprises a rear cover assembly (300), the TEC module (200) comprises a hot end component (220), the heat dissipation duct (A) is formed between the hot end component (220) and the rear cover assembly (300), and the rear cover assembly (300) comprises a rear cover (310) and a cover plate (320), the rear cover (310) having an opening facing the hot end component (220), the cover plate (320) sealingly covering the opening of the rear cover (310) and forming a receiving cavity (C) with the rear cover (310), the main control board assembly (700) being arranged in the receiving cavity (C), the cover plate (320) and the hot end component (220) forming the heat dissipation duct (A); the heat dissipation duct (A) separates the refrigeration cavity (B) and the main control board assembly (700).

9. The camera according to claim 8, It is characterized in that The housing is provided with a groove (330), the heat dissipation fan (500) is installed in the groove (330), and the groove (330) is connected to the heat dissipation air duct (A).

10. The camera according to claim 9, It is characterized in that The heat dissipation fan (500) is at least partially located at the air inlet of the heat dissipation duct (A), and the bottom surface of the groove (330) opposite to the heat dissipation fan (500) is an inclined air induction surface, which can guide the airflow in the groove (330) into the heat dissipation duct (A).

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