Circuit board assembly, camera module and electronic equipment

Abstract

The invention discloses a circuit board assembly, a camera module and electronic equipment, and belongs to the technical field of electronic equipment. The circuit board assembly comprises a supporting piece. The base plate is stacked on one side of the supporting piece, and a through hole is formed in the base plate; the sensor chip is connected to the side, away from the supporting piece, of the substrate and blocks the through hole; the flexible plate is arranged in the through hole so as to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity far away from the sensor chip; the induction part is arranged in the first sub-cavity, is at least connected to the flexible plate and is used for driving the flexible plate to move in the extending direction of the through hole; a first airflow channel is arranged in the supporting piece, a second airflow channel is arranged in the base plate, and the first airflow channel is communicated with the second airflow channel and the second sub-cavity.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a circuit board assembly, a camera module and an electronic equipment. Background Art

[0002] With the continuous development of electronic devices, the functions of electronic devices are becoming better and better. At the same time, the functions of camera modules of electronic devices are also becoming better and better. For example, the pixels of camera modules are getting higher and higher.

[0003] During the use of electronic equipment, the heating of the camera module becomes more and more serious. The temperature of the camera module is too high, which affects the stability of the camera module and causes the camera module to freeze. Summary of the invention

[0004] The present application discloses a circuit board assembly, a camera module and an electronic device to solve or at least partially solve the problem existing in the prior art that during the use of the electronic device, the temperature of the camera module is too high, causing the camera module to freeze and affecting the stability of the camera module.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In the first aspect, the present application discloses a circuit board assembly, which includes a support member; a substrate, which is stacked on one side of the support member and is provided with a through hole; a sensor chip, which is connected to a side of the substrate away from the support member and blocks the through hole; a flexible board, which is arranged in the through hole to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity away from the sensor chip; an induction member, which is arranged in the first sub-cavity and is at least connected to the flexible board, and the induction member is used to drive the flexible board to move along the extension direction of the through hole; wherein a first airflow channel is provided in the support member, a second airflow channel is provided in the substrate, and the first airflow channel is connected to the second airflow channel and the second sub-cavity.

[0007] In a second aspect, the present application discloses a camera module, which includes a camera module body and a circuit board assembly of the first aspect, wherein the circuit board assembly is connected to the camera module body.

[0008] In a third aspect, the present application further discloses an electronic device, which includes an electronic device body and a circuit board assembly of the first aspect or a camera module of the second aspect, wherein the circuit board assembly or the camera module is connected to the electronic device body.

[0009] The present application discloses a circuit board assembly, a camera module and an electronic device, wherein the circuit board assembly comprises a support member; a substrate, the substrate is stacked on one side of the support member, and a through hole is arranged in the substrate; a sensor chip, the sensor chip is connected to a side of the substrate away from the support member and blocks the through hole; a flexible board, the flexible board is arranged in the through hole to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity away from the sensor chip; an induction member, the induction member is arranged in the first sub-cavity and connected to the flexible board, and the induction member is used to drive the flexible board to move along the extension direction of the through hole; wherein a first air flow channel is arranged in the support member, a second air flow channel is arranged in the substrate, and the first air flow channel is connected to the second air flow channel and the second sub-cavity.

[0010] The circuit board assembly disclosed in the present application includes a support, a substrate, a sensor chip, a flexible board and a sensing member. The substrate is stacked on one side of the support, a through hole is provided in the substrate, and the sensor chip is connected to the side of the substrate away from the support, and the through hole is blocked to close the end of the through hole close to the sensor chip. The flexible board is arranged in the through hole to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity away from the sensor chip. The sensing member is arranged in the first sub-cavity and connected to the flexible board. The sensing member vibrates after being energized or magnetized, which can drive the flexible board to vibrate along the extension direction of the through hole, so that the air pressure of the first sub-cavity and the second sub-cavity changes, thereby forming a first airflow. The first airflow can flow from the second sub-cavity into the first airflow channel, and the second airflow of the camera module flows from the second airflow channel into the first airflow channel, is carried away by the first airflow, and flows to the outside of the circuit board assembly. Therefore, the circuit board assembly disclosed in the embodiment of the present application is arranged in the camera module, which can take away the heat generated by the camera module, improve the heat dissipation effect and stability of the camera module, thereby avoiding the jamming phenomenon of the camera module.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 A schematic diagram showing the structure of the circuit board assembly in the embodiment of the present application Figure 1 ;

[0014] Figure 2 A schematic diagram showing the structure of the circuit board assembly in the embodiment of the present application Figure 2 ;

[0015] Figure 3 Schematic diagram showing the working process of the circuit board assembly in the embodiment of the present application Figure 1 ;

[0016] Figure 4 Schematic diagram showing the working process of the circuit board assembly in the embodiment of the present application Figure 2 ;

[0017] Figure 5 Schematic diagram showing the working process of the circuit board assembly in the embodiment of the present application Figure 3 .

[0018] Reference numerals:

[0019] 10: support member; 11: first airflow channel; 111: first sub-airflow channel; 112: second sub-airflow channel;

[0020] 20: substrate; 21: through hole; 211: first sub-cavity; 212: second sub-cavity; 22: second air flow channel; 221: third sub-air flow channel; 23: polymer layer; 24: sub-circuit portion; 25: prepreg; 26: solder mask ink layer;

[0021] 30: sensor chip;

[0022] 40: flexible board; 41: circuit layer; 42: adhesive layer; 43: cover film layer;

[0023] 50: induction element; 51: piezoelectric ceramic; 52: telescopic element;

[0024] 60: soft board part;

[0025] 70: hard board part; 71: board-to-board connector. DETAILED DESCRIPTION

[0026] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0028] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Reference Figure 1 , showing the structure of the circuit board assembly in the embodiment of the present application Figure 1 ;reference Figure 2 , showing the structure of the circuit board assembly in the embodiment of the present application Figure 2 ;reference Figure 3 , showing the working process of the circuit board assembly in the embodiment of the present application Figure 1 ;reference Figure 4 , showing the working process of the circuit board assembly in the embodiment of the present application Figure 2 ;reference Figure 5 , showing the working process of the circuit board assembly in the embodiment of the present application Figure 3 .

[0031] like Figures 1 to 5As shown, an embodiment of the present application discloses a circuit board assembly, which includes a support member 10; a substrate 20, the substrate 20 is stacked on one side of the support member 10, and a through hole 21 is provided in the substrate 20; a sensor chip 30, the sensor chip 30 is connected to the side of the substrate 20 away from the support member 10, and blocks the through hole 21; a flexible board 40, the flexible board 40 is arranged in the through hole 21 to divide the through hole 21 into a first sub-cavity 211 close to the sensor chip 30 and a second sub-cavity 212 away from the sensor chip 30; a sensing member 50, the sensing member 50 is arranged in the first sub-cavity 211 and is at least connected to the flexible board 40, and the sensing member 50 is used to drive the flexible board 40 to move along the extension direction of the through hole 21; wherein a first airflow channel 11 is provided in the support member 10, and a second airflow channel 22 is provided in the substrate 20, and the first airflow channel 11 is connected to the second airflow channel 22 and the second sub-cavity 212.

[0032] An embodiment of the present application discloses a circuit board assembly, which is connected to a camera module so as to carry away a second airflow generated by the camera module through the circuit board assembly, thereby improving the heat dissipation effect of the camera module and making the camera module more stable, thereby avoiding the phenomenon of freezing of the camera module.

[0033] Of course, the circuit board assembly can also be connected to other components to take away the airflow generated by other components, thereby improving the heat dissipation effect of other components and making the stability of other components better. In the embodiment of the present application, there are no excessive restrictions on the specific application scenarios of the circuit board assembly. In actual applications, technicians can set it as needed.

[0034] The following will take the example of connecting the circuit board assembly to the camera module to take away the second airflow generated by the camera module to improve the heat dissipation effect of the camera module to provide a relevant description of the embodiments of the present application.

[0035] like Figures 1 to 5 As shown, the arrows indicate the direction of air flow.

[0036] like Figures 1 to 5 As shown, the embodiment of the present application discloses a circuit board assembly, which includes a support member 10, a substrate 20, a sensor chip 30, a flexible board 40 and a sensing member 50. The support member 10 is used to support the circuit board assembly to improve the strength of the circuit board assembly. For example, the support member 10 can be a steel sheet, an iron sheet, etc.

[0037] The substrate 20 in the embodiment of the present application is stacked on one side of the support 10, and the substrate 20 includes a polymer layer 23. The polymer layer 23 has a first surface and a second surface arranged opposite to each other. The first surface and the second surface of the polymer layer 23 are respectively provided with a circuit layer, which can be a copper layer. The circuit layer includes a plurality of sub-circuit portions 24 spaced apart along the extension direction of the circuit board assembly. The substrate 20 also includes a prepreg 25, which is arranged between two adjacent sub-circuit portions 24, and the two adjacent sub-circuit portions 24 are fixed by the prepreg 25 to improve the rigidity of the substrate 20. The substrate 20 also includes a solder resist ink layer 26, which is stacked on the side of the sub-circuit portion 24 and the prepreg 25 away from the polymer layer 23, and the solder resist ink layer 26 prevents the circuit layer from short-circuiting due to excessive solder. Among them, the sensor chip 30 is stacked on the side of the solder resist ink layer 26 away from the support 10.

[0038] Specifically, Figures 1 to 5 As shown, a through hole 21 is provided in the substrate 20, and the through hole 21 penetrates the substrate 20 along the thickness direction of the substrate 20. A sensor chip 30 is stacked on the side of the substrate 20 away from the support 10, that is, the sensor chip 30 is stacked on the side of the substrate 20 away from the solder resist ink layer 26 of the support 10. The sensor chip 30 is connected to the circuit layer of the substrate 20 through a bonding gold wire to conduct the circuit layer and the sensor chip 30, and the sensor chip 30 is arranged opposite to the through hole 21, so that the sensor chip 30 blocks the end of the through hole 21 away from the support 10.

[0039] The flexible board 40 in the embodiment of the present application is disposed in the through hole 21 to divide the through hole 21 into a first sub-cavity 211 and a second sub-cavity 212 which are spaced apart along the thickness direction of the circuit board assembly. It can be understood that the first sub-cavity 211 is located near the sensor chip 30, and the second sub-cavity 212 is located relatively far away from the sensor chip 30, that is, the second sub-cavity 212 is located near the support member 10.

[0040] like Figure 1 and Figure 2 As shown, the flexible board 40 in the embodiment of the present application includes a polymer layer 23, and the polymer layer 23 and the polymer layer 23 of the substrate 20 are the same polymer layer 23. The polymer layer 23 in the embodiment of the present application is generally polyimide, and the polymer layer 23 can be polyetheretherketone, and the polymer layer 23 can also be polyphenylene sulfide. In the embodiment of the present application, there are no excessive restrictions on the specific material of the polymer layer 23, and in actual applications, technicians can choose according to needs.

[0041] The polymer layer 23 in the embodiment of the present application has a first surface and a second surface arranged opposite to each other, and the first surface and the second surface are respectively stacked with a circuit layer 41, and the circuit layer 41 is a copper layer. A glue layer 42 and a cover film layer 43 are sequentially stacked on the side of the circuit layer 41 away from the polymer layer 23 to form a flexible board 40. The induction element 50 is arranged in the first sub-cavity 211 and is at least connected to the flexible board 40.

[0042] It should be noted that the induction element 50 in the embodiment of the present application may be a piezoelectric ceramic 51, an electrostrictive element, or a magnetostrictive element. In the embodiment of the present application, there are no excessive restrictions on the specific structure of the induction element 50. In actual applications, technicians can select a suitable induction element 50 as needed.

[0043] In the embodiment of the present application, the support member 10 is provided with a first airflow channel 11, the substrate 20 is provided with a second airflow channel 22, and the first airflow channel 11 is connected to the second airflow channel 22 and the second sub-cavity 212. It can be understood that the second airflow channel 212 is connected to the camera module and the first airflow channel 11, the second sub-cavity 212 is connected to the first airflow channel 11, and the first airflow channel 11 is connected to the second sub-cavity 212, the second airflow channel 212 and the outside of the circuit board assembly.

[0044] During the operation of the circuit board assembly, the induction element 50 vibrates after being energized or magnetized, driving the flexible board 40 to vibrate, causing the air pressure of the first sub-cavity 211 and the second sub-cavity 212 to change, thereby forming a first airflow, which can flow from the second sub-cavity 212 into the first airflow channel 11. The second airflow of the camera module flows from the second airflow channel 22 into the first airflow channel 11, is carried away by the first airflow, and flows to the outside of the circuit board assembly. Therefore, the circuit board assembly disclosed in the embodiment of the present application is arranged in the camera module, which can take away the heat generated by the camera module, improve the heat dissipation effect and stability of the camera module, and thus avoid the jamming phenomenon of the camera module.

[0045] It should be noted that if Figure 1 and Figure 2 As shown, the circuit board assembly disclosed in the embodiment of the present application also includes a soft board portion 60 and a hard board portion 70. Along the extension direction of the circuit board assembly, the above structure, the soft board portion 60 and the hard board portion 70 are arranged in sequence, and the soft board portion 60 is connected between the above structure and the hard board portion 70.

[0046] In the embodiment of the present application, both the soft board part 60 and the hard board part 70 include a polymer layer 23, and the soft board part 60 and the hard board part 70 and the above structure share the same polymer layer 23. The polymer layer 23 has a first surface and a second surface that are arranged opposite to each other.

[0047] In the soft board part 60, the first surface and the second surface of the polymer layer 23 are respectively stacked with a circuit layer 41, and the circuit layer 41 is a copper layer. The side of the circuit layer 41 away from the polymer layer 23 is stacked with a glue layer 42 and a cover film layer 43 in sequence to form the soft board part 60. It can be understood that the structure of the soft board part 60 is the same as or similar to that of the flexible board 40.

[0048] In the rigid board portion 70, the first surface and the second surface of the polymer layer 23 are respectively provided with a circuit layer, which may be a copper layer. The circuit layer includes a plurality of sub-circuit portions 24 arranged at intervals along the extension direction of the circuit board assembly. The rigid board portion 70 also includes a semi-cured sheet 25, which is arranged between two adjacent sub-circuit portions 24, and the two adjacent sub-circuit portions 24 are fixed by the semi-cured sheet 25 to improve the rigidity of the rigid board portion 70. The rigid board portion 70 also includes a solder resist ink layer 26, which is superimposed on the side of the sub-circuit portion 24 and the semi-cured sheet 25 away from the polymer layer 23, and the solder resist ink layer 26 is used to prevent the circuit layer from short-circuiting due to excessive solder. The rigid board portion 70 also includes a board-to-board connector 71, which is connected to the side of the solder resist ink layer 26 that is opposite to the ion circuit portion 24 and the semi-cured sheet 25. It can be understood that, except that the rigid board portion 70 also includes the board-to-board connector 71, the structure of the rigid board portion 70 is the same as that of the substrate 20. In some embodiments, such as Figures 1 to 5 As shown, the first airflow channel 11 in the embodiment of the present application includes a first sub-airflow channel 111 and a second sub-airflow channel 112. The first sub-airflow channel 111 is arranged in the support member 10 along the extension direction of the support member 10, and the second sub-airflow channel 112 penetrates the support member 10 along the thickness direction of the support member 10, and the second sub-airflow channel 112 connects the second sub-cavity 212 and the first sub-airflow channel 111; the second airflow channel 22 is connected to the first sub-airflow channel 111.

[0049] like Figures 1 to 5 As shown, the first air flow channel 11 in the embodiment of the present application is arranged in the support member 10, and the first air flow channel 11 includes a first sub-air flow channel 111 and a second sub-air flow channel 112. The first sub-air flow channel 111 extends along the extension direction of the support member 10, and the second sub-air flow channel 112 extends along the thickness direction of the support member 10 and penetrates the support member 10 along the thickness direction of the support member 10.

[0050] Among them, the second sub-airflow channel 112 is connected to the first sub-airflow channel 111 and the second sub-cavity 212, so that the first airflow in the second sub-cavity 212 can flow into the second sub-airflow channel 112, and the second airflow channel 22 is connected to the first sub-airflow channel 111. The second airflow of the camera module can flow into the first sub-airflow channel 111 and the second sub-airflow channel 112 through the second airflow channel 22, and be carried away by the first airflow, and flow from the second sub-airflow channel 112 to the outside of the circuit board assembly.

[0051] Therefore, the circuit board assembly disclosed in the embodiment of the present application is arranged in the camera module, which can take away the heat generated by the camera module, improve the heat dissipation effect and stability of the camera module, and thus avoid the camera module from freezing.

[0052] In the embodiment of the present application, the first airflow channel 11 is configured to include a first sub-airflow channel 111 and a second sub-airflow channel 112, so that the second sub-cavity 212, the second airflow channel 22 and the outside of the circuit board assembly are connected through the first sub-airflow channel 111 and the second sub-airflow channel 112, so that the first airflow in the second sub-cavity 212 can take away the second airflow in the second airflow channel 22. The above configuration helps to reduce the flow path of the first airflow, thereby further improving the heat dissipation effect and stability of the camera module and avoiding the jamming phenomenon of the camera module.

[0053] In some embodiments, Figures 1 to 5 As shown, along the thickness direction of the circuit board assembly, the second sub-airflow channel 112 has a first projection on the substrate 20 , and the first projection falls into the second sub-cavity 212 .

[0054] like Figures 1 to 5 As shown, along the thickness direction of the circuit board assembly, the second sub-airflow channel 112 has a first projection on the substrate 20, and the first projection falls into the second sub-cavity 212. That is, along the thickness direction of the circuit board assembly, the second sub-airflow channel 112 is arranged opposite to the second sub-cavity 212. So that the first airflow in the second sub-cavity 212 can directly flow into the second sub-airflow channel 112, taking away the second airflow flowing from the camera module to the first sub-airflow channel 111 and the second sub-airflow channel 112.

[0055] That is to say, the above arrangement makes the flow path of the first airflow in the second sub-cavity 212 shorter, thereby helping to further improve the heat dissipation effect of the camera module and the stability of the camera module, and avoiding the phenomenon of freezing of the camera module.

[0056] In some embodiments, Figures 1 to 5 As shown, the second sub-airflow channel 112 in the embodiment of the present application has a first portion close to the substrate 20 and a second portion away from the substrate 20 , and the cross-section of the second portion is larger than the cross-section of the first portion.

[0057] like Figures 1 to 5As shown, along the thickness direction of the circuit board assembly, the second sub-airflow channel 112 includes a first portion and a second portion, the first portion is located near the substrate 20, and the second portion is located relatively far away from the substrate 20. It can be understood that, along the thickness direction of the circuit board assembly, the second sub-airflow channel 112 located on the side of the first sub-airflow channel 111 close to the substrate 20 is the first portion, and the second sub-airflow channel 112 located on the side of the first sub-airflow channel 111 far away from the substrate 20 is the second portion.

[0058] The cross section of the second portion is larger than the cross section of the first portion. Taking the second air flow channel 112 as a cylindrical structure as an example, it can be understood that the diameter of the second portion is larger than the diameter of the first portion.

[0059] In the embodiment of the present application, the cross section of the second part of the second airflow channel 112 is set to be larger than the cross section of the first part, so that the first airflow flowing from the second sub-cavity 212 into the first part has a larger air pressure, thereby taking away the second airflow flowing into the first sub-airflow channel 111. The second part has a larger cross section, so that the mixed airflow formed by the first airflow and the second airflow can flow out quickly to the outside of the circuit board assembly. Thus, through the above setting, the heat dissipation effect of the camera module and the stability of the camera module are further improved, and the camera module is prevented from freezing.

[0060] In some embodiments, Figures 1 to 5 As shown, the second airflow channel 22 in the embodiment of the present application includes a plurality of third sub-airflow channels 221, and the plurality of third sub-airflow channels 221 all penetrate the substrate 20, and the plurality of third sub-airflow channels 221 are connected to the first sub-airflow channel 111; along the extension direction of the circuit board assembly, the plurality of third sub-airflow channels 221 are spaced apart from the through hole 21.

[0061] like Figures 1 to 5 As shown, the second airflow channel 22 in the embodiment of the present application includes a plurality of third sub-airflow channels 221, and along the extension direction of the circuit board assembly, the plurality of third sub-airflow channels 221 are spaced apart from the through hole 21 to avoid mutual interference between the third sub-airflow channels 221 and the through hole 21, which results in failure to achieve the cooling function of the circuit board assembly.

[0062] In the embodiment of the present application, along the thickness direction of the circuit board assembly, the plurality of third sub-airflow channels 221 all penetrate the substrate 20, and the plurality of third sub-airflow channels 221 are all connected to the first sub-airflow channel 111. The camera module is arranged on the side of the substrate 20 away from the support member 10, and the second airflow generated by the camera module can flow into the first sub-airflow channel 111 through the plurality of third sub-airflow channels 221, and be carried away by the first airflow flowing from the second sub-cavity 212 to the second sub-airflow channel 112, and flow to the outside of the circuit board assembly.

[0063] In the embodiment of the present application, the second airflow channel 22 is configured to include a plurality of third sub-airflow channels 221, so that the second airflow generated by the camera module is transmitted to the first sub-airflow channel 111 through the plurality of third sub-airflow channels 221, thereby improving the transmission efficiency of the second airflow. This helps to further improve the heat dissipation effect of the camera module and the stability of the camera module, and avoid the phenomenon of freezing of the camera module.

[0064] In some embodiments, Figure 1 , Figures 3 to 5 As shown, the sensing element 50 in the embodiment of the present application includes a piezoelectric ceramic 51 . The piezoelectric ceramic 51 is disposed in the first sub-cavity 211 and attached to the flexible board 40 .

[0065] like Figure 1 , Figures 3 to 5 As shown, the piezoelectric ceramic 51 is disposed in the first sub-cavity 211 and attached to the flexible board 40. When the piezoelectric ceramic 51 is energized, it can generate vibration, and the vibration of the piezoelectric ceramic 51 can drive the flexible board 40 to vibrate.

[0066] Exemplarily, the piezoelectric ceramic 51 can be disposed in the first sub-cavity 211 and welded to the flexible board 40 to achieve electrical connection between the piezoelectric ceramic 51 and the flexible board 40. When voltage is applied to the piezoelectric ceramic 51, the piezoelectric ceramic 51 will produce mechanical deformation as the voltage and frequency change, that is, the piezoelectric ceramic 51 can vibrate after being energized. The piezoelectric ceramic 51 vibrates, thereby driving the flexible board 40 to vibrate.

[0067] like Figure 3 As shown, when the flexible board 40 vibrates downward, the volume of the second sub-cavity 212 decreases, and the first airflow in the second sub-cavity 212 can flow into the second sub-airflow channel 112. At the same time, the second airflow generated by the camera module can flow from the second airflow channel 22 to the first sub-airflow channel 111 and the second sub-airflow channel 112. The first airflow can take the second airflow away and flow to the outside of the circuit board assembly to achieve heat dissipation of the camera assembly.

[0068] like Figure 4 As shown, when the flexible board 40 is in a horizontal state, the volume of the second sub-cavity 212 remains unchanged, and the first airflow in the second sub-cavity 212 will not flow into the second sub-airflow channel 112. However, under the action of inertia, the second airflow generated by the camera module can still flow from the second airflow channel 22 to the first sub-airflow channel 111 and the second sub-airflow channel 112, and then flow to the outside of the circuit board assembly to achieve heat dissipation of the camera assembly.

[0069] like Figure 5As shown, when the flexible board 40 vibrates upward, the volume of the second sub-cavity 212 becomes larger, and the second airflow can flow from the second sub-airflow channel 112 to the second sub-cavity 212. However, since the cross-section of the first part is smaller than the cross-section of the second part, most of the second airflow can flow out from the second part to the outside of the circuit board assembly, and only a small part of the second airflow flows into the second sub-cavity 212. In other words, even when the flexible board 40 vibrates upward, most of the second airflow can flow out from the second part of the second sub-airflow channel 112 to the outside of the circuit board assembly to achieve heat dissipation of the camera assembly. Only a small part of the second airflow flows into the second sub-cavity 212, and the impact is very small.

[0070] The arrangement of the piezoelectric ceramic 51 in the embodiment of the present application can drive the flexible board 40 to vibrate up and down, so that the volume of the second sub-cavity 212 changes, thereby generating a second airflow to achieve the heat dissipation function of the circuit board assembly.

[0071] In some embodiments, Figure 2 As shown, the sensing element 50 in the embodiment of the present application includes an electrostrictive element 52 , which is disposed in the first sub-cavity 211 , and one end of the electrostrictive element 52 is connected to the flexible board 40 , and the other end is connected to the sensor chip 30 .

[0072] like Figure 2 As shown, the inductive element 50 in the embodiment of the present application can be an electrostrictive element 52, which is disposed in the first sub-cavity 211, and one end of the electrostrictive element 52 is connected to the flexible element 40, and the other end is connected to the sensor chip 30. The electric field of the electrostrictive element 52 is controlled by the sensor chip 30, so that the length of the electrostrictive element 52 changes, thereby driving the flexible board 40 to vibrate.

[0073] In the embodiment of the present application, by setting the induction element 50 as the electrostrictive element 52, the vibration frequency of the electrostrictive element 52 can avoid the hearing range of the human ear, which is usually between 20 Hz and 20 kHz, thereby improving the practicality of the circuit board assembly.

[0074] It should be noted that the electrostrictive member 52 in the embodiment of the present application is made of electrostrictive material, and illustratively, the electrostrictive material can be lead zirconate titanate ceramic. There are spontaneously formed molecular groups in the electrostrictive material, namely the so-called electric domain, which has a certain polarization, and the length along the polarization direction is often different from that in other directions. When an external electric field is applied, this electric domain will rotate so that its polarization direction is turned to the direction consistent with the external electric field as much as possible. Therefore, along the direction of the external electric field, the length of the electrostrictive material will change, and this phenomenon is called the electrostrictive effect.

[0075] As an optional implementation, the telescopic element 50 in the embodiment of the present application may also be a magnetostrictive element, which is arranged in the first sub-cavity 211, and one end of the magnetostrictive element is connected to the flexible board 40, and the other end is connected to the sensor chip 30; the circuit board assembly also includes a coil, which is arranged in the substrate 20 and surrounded by the through hole 21.

[0076] The induction element 50 in the embodiment of the present application may be a magnetostrictive element, which is disposed in the first sub-cavity 211, and one end of the magnetostrictive element is connected to the flexible element 40, and the other end is connected to the sensor chip 30. The sensor chip 30 fixes one end of the magnetostrictive element.

[0077] The circuit board assembly disclosed in the embodiment of the present application also includes a coil, which is arranged in the substrate 20 and surrounded by the through hole 21. When the coil is energized, it can provide a magnetic field for the magnetostrictive element. The change in the magnetic field can cause the magnetostrictive element to change in length, thereby driving the flexible board 40 to vibrate up and down.

[0078] It should be noted that the magnetostrictive element in the embodiment of the present application is made of magnetostrictive material. Under the action of an alternating magnetic field, the magnetostrictive material can generate mechanical vibrations with the same frequency as the alternating magnetic field to achieve the expansion and contraction of the magnetostrictive element.

[0079] The coil in the embodiment of the present application may include multiple coils, which are arranged at intervals on the outer periphery of the through hole 21 along the circumference of the through hole 21. Exemplarily, the coil includes four coils, which are arranged on the outer periphery of the through hole 21 in pairs.

[0080] The embodiment of the present application discloses a circuit board assembly, which includes a support, a substrate, a sensor chip, a flexible board and a sensing element. The substrate is stacked on one side of the support, a through hole is provided in the substrate, the sensor chip is connected to the side of the substrate away from the support, and the through hole is blocked to close the end of the through hole close to the sensor chip. The flexible board is arranged in the through hole to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity away from the sensor chip. The sensing element is arranged in the first sub-cavity and connected to the flexible board. The sensing element vibrates after being energized or magnetized, which can drive the flexible board to vibrate along the extension direction of the through hole, so that the air pressure of the first sub-cavity and the second sub-cavity changes, thereby forming a first airflow. The first airflow can flow from the second sub-cavity into the first airflow channel, and the second airflow of the camera module flows from the second airflow channel into the first airflow channel, is carried away by the first airflow, and flows to the outside of the circuit board assembly. Therefore, the circuit board assembly disclosed in the embodiment of the present application is arranged in the camera module, which can take away the heat generated by the camera module, improve the heat dissipation effect and stability of the camera module, thereby avoiding the jamming phenomenon of the camera module.

[0081] An embodiment of the present application also discloses a camera module, which includes a camera module body and the circuit board assembly in the above embodiment, and the circuit board assembly is connected to the camera module body.

[0082] The camera module disclosed in the embodiment of the present application further includes components such as a voice coil motor (VCM), a lens, a board-to-board (BTB) connector, a holder, and a filter. The voice coil motor realizes fast focusing and anti-shake. The lens can focus light onto the image sensor. The holder fixes components such as the lens, the sensor, and the voice coil motor to ensure the alignment of the optical axis.

[0083] Here, the specific components included in the camera module will not be listed one by one. In actual applications, those skilled in the art can set the specific components of the camera module according to needs.

[0084] It should be noted that the structure of the circuit board assembly included in the camera module disclosed in the embodiment of the present application is the same as that of the circuit board assembly in the above embodiment, and their beneficial effects are also similar. Here, it will not be elaborated further.

[0085] An embodiment of the present application also discloses an electronic device, which includes an electronic device body and the circuit board assembly or the camera module in the above embodiment, and the circuit board assembly or the camera module is connected to the electronic device body.

[0086] It should be noted that the structure of the circuit board assembly included in the electronic device disclosed in the embodiment of the present application is the same as that of the circuit board assembly in the above embodiment, and their beneficial effects are also similar. Here, it will not be elaborated further.

[0087] Similarly, the camera module included in the electronic device disclosed in the embodiment of the present application has the same structure as the camera module in the above embodiment, and their beneficial effects are also similar. Here, it will not be elaborated further.

[0088] It should be noted that the circuit board assembly included in the electronic device in the embodiment of the present application has the same structure as the circuit board assembly in the above embodiment, and their beneficial effects are also similar. Here, it will not be elaborated further.

[0089] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0090] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: Supports; A substrate, the substrate is stacked on one side of the support member, and a through hole is provided in the substrate; a sensor chip, the sensor chip being connected to a side of the substrate away from the support member and blocking the through hole; a flexible board, wherein the flexible board is disposed in the through hole to divide the through hole into a first sub-cavity close to the sensor chip and a second sub-cavity far from the sensor chip; A sensing member, the sensing member is disposed in the first sub-cavity and is at least connected to the flexible board, and the sensing member is used to drive the flexible board to move along the extending direction of the through hole; Wherein, a first airflow channel is arranged in the support member, a second airflow channel is arranged in the substrate, and the first airflow channel is connected to the second airflow channel and the second sub-cavity.

2. The circuit board assembly according to claim 1, characterized in that: The first airflow channel includes a first sub-airflow channel and a second sub-airflow channel, The first sub-airflow channel is arranged in the support member along the extension direction of the support member, the second sub-airflow channel penetrates the support member along the thickness direction of the support member, and the second sub-airflow channel communicates with the second sub-cavity and the first sub-airflow channel; The second air flow channel is communicated with the first sub-air flow channel.

3. The circuit board assembly according to claim 2, characterized in that: Along the thickness direction of the circuit board assembly, the second sub-airflow channel has a first projection on the substrate, and the first projection falls into the second sub-cavity.

4. The circuit board assembly according to claim 2 or 3, characterized in that: The second sub-airflow channel has a first portion close to the substrate and a second portion away from the substrate, and a cross section of the second portion is larger than a cross section of the first portion.

5. The circuit board assembly according to claim 2, characterized in that: The second airflow channel includes a plurality of third sub-airflow channels, the plurality of third sub-airflow channels all penetrate the substrate, and the plurality of third sub-airflow channels all communicate with the first sub-airflow channel; Along the extension direction of the circuit board assembly, a plurality of the third sub-airflow channels are arranged at intervals from the through holes.

6. The circuit board assembly according to claim 1, characterized in that: The induction element includes piezoelectric ceramics, which are arranged in the first sub-cavity and attached to the flexible plate.

7. The circuit board assembly according to claim 1, characterized in that: The induction element comprises an electrostrictive element, which is arranged in the first sub-cavity, and one end of the electrostrictive element is connected to the flexible board, and the other end of the electrostrictive element is connected to the sensor chip.

8. The circuit board assembly according to claim 1, characterized in that: The induction element comprises a magnetostrictive element, which is arranged in the first sub-cavity, and one end of the magnetostrictive element is connected to the flexible element, and the other end of the magnetostrictive element is connected to the sensor chip; The circuit board assembly also includes a coil, which is arranged in the substrate and surrounds the through hole.

9. A camera module, characterized in that: It comprises a camera module body and a circuit board assembly according to any one of claims 1 to 8, wherein the circuit board assembly is connected to the camera module body.

10. An electronic device, characterized in that: It comprises an electronic device body and a circuit board assembly according to any one of claims 1 to 8 or a camera module according to claim 9, wherein the circuit board assembly or the camera module is connected to the electronic device body.

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