Lens module and electronic equipment

Abstract

The invention discloses a lens module and electronic equipment, and belongs to the field of electronic equipment, the lens module comprises a circuit board, a photosensitive chip and a plurality of lenses, the circuit board is provided with a light inlet hole, the light inlet hole penetrates through the circuit board along the thickness direction of the circuit board, the number of the lenses is multiple, and the photosensitive chip is arranged on the circuit board. The multiple lenses are distributed in the thickness direction and all installed in the light inlet hole, and the light sensing chip faces the light inlet hole and is arranged on the light outlet side of the lenses.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a lens module and an electronic equipment. Background Art

[0002] The lens module usually includes a lens mounting tube and multiple lenses. The multiple lenses are embedded in the lens mounting tube to form a lens, so that the light outside the lens module passes through the multiple lenses and is incident on the photosensitive chip to form a corresponding image.

[0003] In the above lens module, since the lens mounting tube requires a larger axial mounting space and there is mounting tolerance between the lenses, the size of the lens module is relatively large in the axial direction of the lens, which is not conducive to the development of the lens module towards thinness. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a lens module and an electronic device to solve the problem that the current lens module has a relatively large size in the axial direction of the lens, which is not conducive to the development of the lens module towards lightness and thinness.

[0005] In a first aspect, the present application discloses a lens module, which includes a circuit board, a photosensitive chip and a lens, wherein: The circuit board is provided with a light entrance hole, and the light entrance hole penetrates the circuit board along the thickness direction of the circuit board. The number of the lenses is multiple, and the multiple lenses are distributed along the thickness direction and are all installed in the light entrance hole. The photosensitive chip is arranged toward the light entrance hole, and the photosensitive chip is arranged on the light output side of the lens.

[0006] In a second aspect, an embodiment of the present application discloses an electronic device, which includes the above-mentioned lens module.

[0007] The embodiment of the present application discloses a lens module, wherein the circuit board includes a circuit board, a photosensitive chip is located on one side of the circuit board, and the circuit board is provided with a light inlet hole that is arranged through the circuit board along the thickness direction thereof, and the number of lenses is multiple, and the multiple lenses are distributed along the aforementioned thickness direction, so that the imaging effect of the lens module is relatively better. At the same time, in the embodiment of the present application, the multiple lenses are installed in the light inlet hole of the circuit board, so that the multiple lenses can form a stable assembly relationship with the photosensitive chip. The photosensitive chip is arranged opposite to the light inlet hole, and the photosensitive chip is arranged on the light exit side of the lens, so that the light on the side of the circuit board away from the photosensitive chip can be distributed by multiple lenses after passing through the light inlet hole, and finally incident on the photosensitive chip to form a corresponding image. Obviously, in the lens module disclosed in the above-mentioned embodiment of the present application, there is no need to separately configure a lens mounting tube for the lens, so that during the assembly process of the lens module, the assembly process between the lens mounting tube and the circuit board can be omitted. At the same time, since the lens mounting tube and the aforementioned assembly process are reduced in the lens module, the number of assembly gaps reserved between devices can be reduced, and the cumulative tolerance of the entire lens module can be reduced, so that the size of the lens module in the axial direction of the lens, that is, the above-mentioned thickness direction, is relatively small, which is conducive to the development of the lens module towards lightness and thinness. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 is a structural schematic diagram of a lens module disclosed in an embodiment of the present application; Figure 2 A schematic cross-sectional view of a partial structure of a circuit board in a lens module disclosed in an embodiment of the present application; Figure 3 yes Figure 2 A schematic diagram of the processing process of the circuit board shown; Figure 4 It is a schematic diagram of the assembly of the photosensitive chip in the lens module disclosed in the embodiment of the present application.

[0009] Reference numerals: 110-circuit board, 110a-light entrance hole, 111-first step, 112-second step, 113-third step, 130-second circuit board, 140-flexible board, 150-connector, 160-adhesive part, 170-pad, 180-ball planting, 200-Photosensitive chip, 300-lens, 400-Filter, 500-Noise reduction element. DETAILED DESCRIPTION

[0010] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0011] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0012] like Figure 1-Figure 4 As shown, the embodiment of the present application discloses a lens module, which can be applied to electronic devices such as mobile phones. Figure 1 As shown, the lens module includes a circuit board 110, a photosensitive chip 200 and a lens 300. Of course, the lens module can also generally include other components such as a connector 150, which will not be introduced one by one in this article.

[0013] In the lens module disclosed in the embodiment of the present application, the number of lenses 300 can be multiple, specifically two, three or more, so that the imaging effect of the lens module is relatively better by using multiple lenses 300. Of course, the multiple lenses 300 need to be distributed along the thickness direction of the circuit board 110 to ensure that the multiple lenses 300 can provide light distribution for the same beam of light, and the structural form and specific parameters of each lens 300 can be flexibly selected according to actual needs. The lens 300 can usually be formed of transparent materials such as glass. In order to reduce the overall weight of the lens module, the lenses 300 can be formed of materials such as resin, and the shape of each lens 300 can be circular, so that the viewfinder of the lens module is relatively large. Of course, when the shape of the light entrance hole 110a is a non-circular structure, the shape of each lens 300 can also be adapted to the shape of the light entrance hole 110a. In addition, in the above-mentioned thickness direction, the multiple lenses 300 can be spaced from each other, on the one hand, to prevent any two adjacent lenses 300 from being easily damaged due to mutual squeezing, and on the other hand, the viewfinder of the lens module can be further improved to a certain extent.

[0014] In order to enable the multiple lenses 300 to form a stable assembly relationship with the photosensitive chip 200, in the embodiment of the present application, the photosensitive chip 200 is located on one side of the circuit board 110, and the circuit board 110 is provided with a light inlet 110a, and the light inlet 110a is used to allow light outside the lens module to enter the lens module, so as to pass through the multiple lenses 300 and be captured by the photosensitive chip 200 located on one side of the circuit board 110, thereby forming a corresponding image. To this end, the light inlet 110a is set through the circuit board 110 along the thickness direction of the circuit board 110, and the photosensitive chip 200 is set toward the light inlet 110a; at the same time, in the embodiment of the present application, the multiple lenses 300 are all installed in the light inlet 110a, and the photosensitive chip 200 is set on the light exit side of the lens 300.

[0015] Specifically, the inner wall of the light entrance hole 110a can be provided with a plurality of limiting grooves, and at the same time, the diameter of each lens 300 is slightly larger than the diameter of the light entrance hole 110a, and slightly smaller than the inner diameter of the limiting groove, so that the plurality of lenses 300 can be installed into the corresponding limiting grooves in sequence by squeezing and pushing, and each lens 300 can be limited by the corresponding limiting groove, so as to achieve the installation purpose of the lens 300. Of course, in order to improve the installation stability between the lens 300 and the circuit board 110, during the installation of the lens 300, glue or other materials can be applied to the outer edge of the lens 300, so that after the lens 300 is installed in the limiting groove, the lens 300 can form a bonding and fixing relationship with the inner wall of the corresponding limiting groove.

[0016] For the photosensitive chip 200, the photosensitive chip 200 can be installed by coating glue or other materials on the surface of the photosensitive chip 200 facing the circuit board 110, so that the photosensitive chip 200 is bonded to the back of the circuit board 110, wherein the side surface of the circuit board 110 facing the light incident side of the lens 300 is the front side of the circuit board 110. In another embodiment of the present application, the photosensitive chip 200 can also be located as a whole within the light incident hole 110a, and the photosensitive chip 200 and the circuit board are fixedly assembled by bonding, which can use the circuit board 110 to provide protection for the photosensitive chip 200.

[0017] The embodiment of the present application discloses a lens module, wherein the circuit board 110 includes the circuit board 110, the photosensitive chip 200 is located on one side of the circuit board 110, and the circuit board 110 is provided with a light inlet 110a which is arranged along the thickness direction thereof, and the number of lenses 300 is multiple, and the multiple lenses 300 are distributed along the aforementioned thickness direction, so that the imaging effect of the lens module is relatively better. At the same time, in the embodiment of the present application, the multiple lenses 300 are all installed in the light inlet 110a of the circuit board 110, so that the multiple lenses 300 can form a stable assembly relationship with the photosensitive chip 200. The photosensitive chip 200 is arranged opposite to the light inlet 110a, and the photosensitive chip 200 is arranged on the light exit side of the lens 300, so that the light on the side of the circuit board 110 away from the photosensitive chip 200 can be distributed by multiple lenses 300 after passing through the light inlet 110a, and finally incident on the photosensitive chip 200 to form a corresponding image. Obviously, in the lens module disclosed in the above-mentioned embodiment of the present application, there is no need to separately configure a lens mounting tube for the lens 300, so that during the assembly process of the lens module, the assembly process between the lens mounting tube and the circuit board 110 can be omitted. At the same time, since the lens mounting tube and the aforementioned assembly process are reduced in the lens module, the number of assembly gaps reserved between components can be reduced, thereby reducing the cumulative tolerance of the entire lens module, and making the size of the lens module in the axial direction of the lens 300, that is, the above-mentioned thickness direction, relatively small, which is conducive to the development of the lens module towards lightweight and thin.

[0018] As described above, multiple lenses 300 are installed in the light entrance hole 110a, and the light entrance hole 110a is formed on the circuit board 110. Since the circuit board 110 is usually formed of non-transparent materials, the circuit board has a certain light-shielding ability, thereby reducing the interference of light from the side of the circuit board 110 on the imaging effect.

[0019] In order to further reduce the interference of the light outside the side wall of the light entrance hole 110a on the imaging effect of the lens module, that is, to prevent the light emitted to the circuit board 110 in a direction other than the thickness direction from entering the lens 300 and hindering the imaging process of the photosensitive chip 200, in the embodiment of the present application, a light shielding layer can be provided on the inner wall of the light entrance hole 110a. The light shielding layer is formed by a light shielding material, which can be specifically formed by a black coating, or the light shielding layer can be formed by coating a material such as black ink on the inner wall of the light entrance hole 110a. Of course, the thickness of the light shielding layer and other parameters can be flexibly selected according to actual conditions.

[0020] As described above, the assembly relationship between the lens 300 and the circuit board 110 can be made more stable by forming a limiting groove on the inner wall of the light entrance hole 110a. In order to reduce the processing difficulty of the circuit board 110 and further improve the assembly stability between the lens 300 and the circuit board 110, in other embodiments of the present application, such as Figure 2 As shown, the lens module may further include a first step 111 , which is circumferentially arranged along the inner wall of the light entrance hole 110 a , and the first step 111 is away from the first side surface of the photosensitive chip 200 to support the lens 300 .

[0021] In detail, in the direction perpendicular to the thickness direction, the first step 111 is protruded relative to the inner wall of the light entrance hole 110a, and the first step 111 is a closed ring structure, and its center is also a through structure, so as to be opposite to the light entrance hole 110a, so as to ensure that the light on one side of the circuit board 110 can still be incident on the photosensitive chip 200. Specifically, the actual shape of the first step 111 can be adapted to the shape of the light entrance hole 110a. For example, when the light entrance hole 110a is a circular hole, the first step 111 can be a circular ring structure. Of course, in the thickness direction, the size of the first step 111 can be flexibly selected according to actual needs to ensure that it can provide a stable support effect for the lens 300. Among them, the side surface of the first step 111 facing away from the photosensitive chip 200 is the first side surface, and correspondingly, the side surface of the first step 111 facing the photosensitive chip 200 is the second side surface. That is, in the embodiment of the present application, the first step 111 protruding from the inner wall of the light incident hole 110a can be used to provide support for the lens 300, so that the assembly stability between the multiple lenses 300 and the circuit board 110 can be further improved.

[0022] In order to make the supporting effect of each of the multiple lenses 300 relatively good, in a further embodiment of the present application, the lens module may further include at least one second step 112, and each second step 112 is sequentially arranged on the first side of the first step 111. Accordingly, the surface of each second step 112 away from the first step 111 is used to support the lens 300. In more detail, among the multiple lenses 300, one is supported on the first step 111, and the other one or more are correspondingly provided with the second step 112. Of course, in the embodiment of the present application, the radial dimension of the inner circumference of any second step 112 is greater than the radial dimension of the inner circumference of the first step 111, so as to ensure that the first side of the first step 111 can still provide normal support for the lens 300 when the second step 112 is provided. At the same time, when there are multiple second steps 112, it is also necessary to limit the radial size of the inner circumference of each of the multiple second steps 112. Specifically, among any two adjacent second steps 112, the radial size of the inner circumference of the one closer to the first step 111 is smaller than the radial size of the inner circumference of the one farther away from the first step 111.

[0023] In addition, in the process of forming the first step 111 and each second step 112, the first step 111 and the second step 112 can be spaced apart from each other, and correspondingly, two adjacent second steps 112 can also be spaced apart from each other. In order to reduce the difficulty of processing the lens module, in another embodiment of the present application, along the thickness direction, a second step 112 can be connected to the first step 111, and each second step 112 can be connected in sequence. In particular, referring to Figure 1 The first step 111 and the second step 112 are arranged along the thickness direction of the circuit board 110 away from the photosensitive chip 200 , and the radial dimensions of the inner circumferences decrease successively.

[0024] During the processing of the circuit board 110 in the lens module disclosed in the above embodiment of the present application, Figure 3As shown, it can be formed by laser or etching. Specifically, based on the number of lenses 300 and the maximum thickness of each lens 300 and other parameters, the circuit board 110 with a required thickness is designed. Of course, when other devices need to be installed on the circuit board 110, only the thickness of part of the structure of the circuit board 110 can be relatively large, and a light entrance hole 110a can be set to install multiple lenses 300, while the thickness of other parts of the circuit board 110 for installing conventional electronic devices can be relatively small. That is, in the above embodiment, the lens module may further include a second circuit board 130, and the projection of the second circuit board 130 in a plane perpendicular to the thickness direction is located outside the projection of the circuit board 110 in the aforementioned plane. The circuit board 110 and the second circuit board 130 may be formed in an integral manner, or the two may be formed separately and connected to each other through the flexible board 140 to enhance the assembly adaptability of the entire circuit board 110. On this basis, the connector 150 may be installed on the second circuit board 130, and in order to make the connection stability between the flexible board 140 and the circuit board 110 relatively better, an adhesive portion 160 may be provided on one side surface of the flexible board 140 close to one end of the circuit board 110, which may be formed by applying glue.

[0025] Afterwards, one side surface of the circuit board 110 is processed by laser or etching to form a portion of the light entrance hole 110a. Then, the size of the formed hole can be reduced by narrowing the range of the laser or etching, thereby forming at least one second step 112 "protruding relative to the inner wall of the light entrance hole 110a". Then, the size of the formed hole can be reduced by further narrowing the range of the laser or etching, thereby forming a first step 111 "protruding relative to the inner wall of the second step 112".

[0026] As described above, a light shielding layer may be provided on the inner wall of the light entrance hole 110a. When the circuit board 110 is formed by adopting the above technical solution, a light shielding layer may also be provided on the inner walls of the first step 111 and the second step 112, thereby ensuring that light can basically only enter the light entrance hole 110a from the light entrance hole 110a toward one end port of the photosensitive chip 200 and be captured by the photosensitive chip 200.

[0027] In the above embodiment, the photosensitive chip 200 is arranged on one side of the circuit board 110. In order to enhance the protection effect of the photosensitive chip 200 and prevent the photosensitive chip 200 from being scratched and separated from the circuit board 110 during the assembly of the lens module with other mechanisms or devices, the photosensitive chip 200 can also be installed in the light entrance hole 110a.

[0028] Specifically, in the process of forming the light entrance hole 110a, the first step 111, and the second step 112 on the circuit board 110 by the above-mentioned laser or etching method, after the formation process of the first step 111 is completed, the range of the laser or etching can be increased, so that the side of the first step 111 away from the lens 300 is also convex relative to the light entrance hole 110a, thereby providing an accommodation space for the photosensitive chip 200, so that the photosensitive chip 200 can also be installed in the light entrance hole 110a together with the lens 300.

[0029] Specifically, the photosensitive chip 200 can be installed in the light-entering hole 110a by clamping, and facing the lens 300. In order to further improve the assembly stability between the photosensitive chip 200 and the circuit board 110, glue or other materials can be applied to the outer edge of the photosensitive chip 200, so that after the photosensitive chip 200 is installed in the light-entering hole 110a, the photosensitive chip 200 can be bonded and fixed to the inner wall of the light-entering hole 110a.

[0030] Based on the above embodiment, the photosensitive chip 200 can also be bonded to the second side of the first step 111 facing away from the lens 300. In another embodiment of the present application, the lens module can also include a third step 113, and in the above-mentioned thickness direction, the third step 113 is arranged on the second side of the first step 111 facing the photosensitive chip 200, and the photosensitive chip 200 is fixed on the surface of the third step 113 facing away from the first step 111.

[0031] Specifically, in the thickness direction, the third step 113 can be spaced apart from the first step 111. To reduce the difficulty of processing, in the embodiment of the present application, the third step 113 is connected to the second side surface of the first step 111 away from the lens 300. In addition, the photosensitive chip 200 can be bonded and fixed to the side surface of the third step 113 away from the first step 111.

[0032] In order to prevent the photosensitive chip 200 from being damaged by being squeezed during the installation process, in the direction perpendicular to the thickness direction, or in other words, when the light entrance hole 110a is a circular hole, along the radial direction of the light entrance hole 110a, the outer edge of the photosensitive chip 200 can be spaced apart from the inner wall of the light entrance hole 110a, thereby preventing the photosensitive chip 200 and other structures such as the circuit board 110 from being squeezed against each other and damaged during the installation of the photosensitive chip 200.

[0033] In addition, when the technical solution disclosed in the embodiment of the present application is adopted, it is also convenient to form an electrical connection relationship between the photosensitive chip 200 and the circuit board 110. In detail, in the embodiment of the present application, the third step 113 in the circuit board 110 is provided with a solder pad 170, and the solder pad 170 is located on the side of the third step 113 away from the first step 111. At the same time, a planting ball 180 can be provided on the solder pad 170 and one of the pins of the photosensitive chip 200. In the process of assembling the photosensitive chip 200, the planting ball 180 can be melted by heat pressing to achieve the purpose of connecting the solder pad 170 and the pin, ensuring that the pin of the photosensitive chip 200 and the corresponding solder pad 170 on the circuit board 110 can be electrically connected through the planting ball 180. Of course, the photosensitive chip 200 usually has multiple pins. Therefore, the number of pads 170 provided on the third step 113 in the circuit board 110 is also multiple, and corresponds to the number of pins of the photosensitive chip 200. In the assembly process, the ball 180 can be pre-planted on each pin of the photosensitive chip 200 to reduce the amount of metal used for the ball 180. In addition, in order to improve the electrical connection effect, the material of the ball 180 can be metal gold.

[0034] In order to further enhance the protective effect of the circuit board 110 on the photosensitive chip 200, in the process of forming the circuit board 110, along the above-mentioned thickness direction, the distance between the backlight surface of the circuit board 110 and the third step 113 can be made slightly larger than the size of the photosensitive chip 200. In this case, after the photosensitive chip 200 is fixed on the side surface of the third step 113 away from the first step 111, there is still a gap between the side surface of the photosensitive chip 200 away from the third step 113 and the backlight surface of the circuit board 110, thereby preventing the back of the photosensitive chip 200 from being squeezed when the lens module is assembled with other mechanisms or components, thereby further enhancing the service life of the photosensitive chip 200.

[0035] Specifically, the photosensitive chip 200 can be fixed to the surface of the third step 113 by glue or other materials. Accordingly, the second step 112 and the lens 300 installed on the first step 111 can also be fixed more stably by glue. Similarly, in the thickness direction, the size of the second step 112 closest to the first step 111 can be larger than the size of the lens 300 installed on the first step 111. Similarly, the thickness of the second step 112 can be designed to ensure that the lenses 300 can be spaced apart from each other. On the one hand, it can prevent the adjacent lenses 300 from being damaged due to mutual squeezing. On the other hand, it can also improve the framing range of the lens module to a certain extent.

[0036] In the embodiment of the present application, the lens module may further include a noise reduction element 500, which may specifically include a capacitor and other devices, which are connected to the circuit to reduce circuit noise, thereby further improving the imaging effect of the lens module. Specifically, the noise reduction element 500 may be installed at a portion of the circuit board 110 where the lens 300 is not provided.

[0037] As described above, when the photosensitive chip 200 is installed on the third step 113, the outer edge of the photosensitive chip 200 can be spaced apart from the inner wall of the light entrance hole 110a. In the embodiment of the present application, the noise reduction element 500 can also be set in the light entrance hole 110a of the circuit board 110, and the noise reduction element 500 can be located between the outer edge of the photosensitive chip 200 and the inner wall of the light entrance hole 110a. In this case, the corresponding pad 170 can be set at the corresponding position of the third step 113, and the noise reduction element 500 can be electrically connected to the circuit board 110. This can further improve the use efficiency of the circuit board 110, save installation space in other areas of the circuit board 110, and reduce the overall size of the circuit board 110.

[0038] Optionally, the lens module disclosed in the embodiment of the present application further includes a filter 400, so as to use the filter 400 to filter out infrared light, ultraviolet light and other light that cannot be seen by the human eye, thereby further improving the imaging effect of the lens module. Specifically, the filter 400 can be installed on the light incident side of the multiple lenses 300. In order to improve the protection effect of the filter 400, in another embodiment of the present application, the filter 400 can be located between the multiple lenses 300 and the photosensitive chip 200. Optionally, the filter 400 and the lens 300 can be installed together on the first side of the first step 111.

[0039] When the lens module includes a third step 113, the radial dimension of the inner circumference of the third step 113 can be made smaller than the radial dimension of the inner circumference of the first step 111, so that the first step 111 can be protruded relative to the third step 113. In this case, the filter 400 can be fixedly installed on the second surface of the first step 111 away from the lens 300, which makes the filter 400 have an independent installation position, thereby improving its installation stability, and also preventing the installation process from interfering with the light distribution effects of the filter 400 and the lens 300 located at the same installation position, thereby improving the imaging quality.

[0040] Specifically, the filter 400 and the second side surface of the first step 111 can also be bonded and fixed by glue or other materials, and in order to prevent mutual interference between components, the size of the third step 113 can be slightly larger than the size of the filter 400 in the thickness direction, so that after the filter 400 is installed, the filter 400 and the photosensitive chip 200 can still be spaced apart. In addition, in the direction perpendicular to the thickness direction, the radial size of the inner circumference of the third step 113 can be slightly larger than the size of the filter 400, so that the outer edge of the filter 400 is spaced apart from the inner circumference of the third step 113. Similarly, the outer edge of the lens 300 installed on the first step 111 can be spaced apart from the inner wall of the second step 112, and the outer edge of the lens 300 installed on the outermost second step 112 can be spaced apart from the inner wall of the light entrance hole 110a.

[0041] Based on the lens module disclosed in any of the above embodiments, the present application also discloses an electronic device, which includes a battery and the above lens module, wherein the battery is electrically connected to the photosensitive chip 200. Of course, the electronic device can be a shooting device, or a mobile phone, etc., which is not limited herein.

[0042] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0043] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A lens module, characterized in that: It includes circuit boards, photosensitive chips and lenses, among which: The circuit board is provided with a light entrance hole, and the light entrance hole penetrates the circuit board along the thickness direction of the circuit board. The number of the lenses is multiple, and the multiple lenses are distributed along the thickness direction and are all installed in the light entrance hole. The photosensitive chip is arranged toward the light entrance hole, and the photosensitive chip is arranged on the light output side of the lens.

2. The lens module according to claim 1, characterized in that: The inner wall of the light entrance hole is provided with a light shielding layer.

3. The lens module according to claim 1, characterized in that: The lens module also includes a first step, which is circumferentially arranged along the inner wall of the light entrance hole. The first step is away from the first surface of the photosensitive chip and is used to support the lens.

4. The lens module according to claim 3, characterized in that: The lens module also includes at least one second step, and in the thickness direction, each of the second steps is sequentially arranged on the first side of the first step away from the photosensitive chip, and the surface of the second step away from the first step is used to support the lens.

5. The lens module according to claim 3, characterized in that: The lens module also includes a third step. In the thickness direction, the third step is arranged on the second side of the first step facing the photosensitive chip, and the photosensitive chip is fixed on the surface of the third step away from the first step.

6. The lens module according to claim 5, characterized in that: The third step is provided with a pad, and the pin of the chip is electrically connected to the pad.

7. The lens module according to claim 5, characterized in that: In the radial direction of the light entrance hole, the outer edge of the photosensitive chip is spaced apart from the inner wall of the light entrance hole.

8. The lens module according to claim 7, characterized in that: It also includes a noise reduction element, which is arranged between the outer edge of the photosensitive chip and the inner wall of the light entrance hole, and the noise reduction element is electrically connected to the circuit board.

9. The lens module according to claim 5, characterized in that: It also includes a filter, the radial dimension of the inner circumference of the third step is smaller than the radial dimension of the inner circumference of the first step, and the filter is fixed to the second surface of the first step facing the photosensitive chip.

10. An electronic device, characterized in that: Comprising the lens module described in any one of claims 1-9.

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