Micro-electro-mechanical loudspeaker hybrid system

Abstract

The invention relates to the technical field of micro electro mechanical systems, in particular to a micro electro mechanical loudspeaker hybrid system which comprises an acoustic cavity. The acoustic sensor and the micro electro mechanical loudspeaker are arranged on the same substrate; and the microprocessor is arranged on the substrate, the input end of the microprocessor is connected with the acoustic sensor, and the output end of the microprocessor is connected with the driving end of the micro electro mechanical loudspeaker. According to the micro-electro-mechanical loudspeaker hybrid system, the loudspeaker can be monitored through the acoustic sensor, the sensitivity is better, distortion is overcome, and the loudspeaker is protected.

Description

Technical Field

[0001] The present invention relates to the field of micro-electromechanical technology, and in particular to a micro-electromechanical speaker hybrid system. Background Art

[0002] MEMS speakers are gradually replacing traditional dynamic or moving iron speakers due to their advantages of miniaturization, reliability and light weight, and are being used in more and more consumer electronics and professional audio equipment. Existing MEMS speakers have low sensitivity, large distortion, and cannot be calibrated and protected. Summary of the invention

[0003] In view of the above problems, an object of the present invention is to provide a micro-electromechanical speaker hybrid system.

[0004] A micro-electromechanical speaker hybrid system includes an acoustic cavity, in which:

[0005] MEMS speakers;

[0006] an acoustic sensor, disposed on the same substrate as the micro-electromechanical speaker;

[0007] A microprocessor is arranged on the substrate, an input end of the microprocessor is connected to the acoustic sensor, and an output end of the microprocessor is connected to a driving end of the micro-electromechanical speaker.

[0008] In the MEMS speaker hybrid system of the present invention, a metal cover is provided on the substrate, and the metal cover and the substrate form the acoustic cavity; the acoustic cavity is also provided with:

[0009] a micro-electromechanical component disposed on the first region of the substrate via an adhesive member located below the micro-electromechanical component;

[0010] The diaphragm is arranged on the micro-electro-mechanical component via a first adhesive film located above the micro-electro-mechanical component.

[0011] In the MEMS speaker hybrid system of the present invention, the metal cover is provided with a sound hole located on one side wall.

[0012] In the micro-electromechanical speaker hybrid system of the present invention, the first area on the substrate has a through hole, and a grid electrostatic voice coil is arranged at the position of the through hole at the bottom of the substrate.

[0013] The MEMS speaker hybrid system of the present invention further comprises a double-sided tape layer, comprising a first portion arranged along the frame of the diaphragm and a second portion arranged along the frame of the back plate.

[0014] For the MEMS speaker hybrid system of the present invention, the length of the metal cover is 7 mm to 8 mm, and the width of the metal cover is 5 mm to 6 mm.

[0015] For the MEMS speaker hybrid system of the present invention, the side length of the acoustic sensor is 0.8 mm, the distance between the acoustic sensor and the MEMS speaker is 0.18 mm to 0.275 mm, and the distance between the acoustic sensor and the microprocessor is 0.2 mm.

[0016] For the MEMS speaker hybrid system of the present invention, the first region is provided with a depression relative to the surface of the substrate, and the MEMS component is disposed in the depression.

[0017] For the MEMS speaker hybrid system of the present invention, a conductive path is provided on the substrate to connect the acoustic sensor and the microprocessor and to connect the microprocessor to the driving end of the MEMS speaker.

[0018] For the MEMS speaker hybrid system of the present invention, the grid electrostatic voice coil is circular, and the adhesive is a square frame structure.

[0019] Beneficial effects: The MEMS speaker hybrid system of the present invention can monitor the speaker through the acoustic sensor, achieving better sensitivity, overcoming distortion, and protecting the speaker. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of the MEMS speaker hybrid system of the present invention;

[0021] Figure 2 is a schematic structural diagram of a specific embodiment of the present invention;

[0022] Figure 3 is an exploded schematic structural diagram of the MEMS speaker of a specific embodiment of the present invention;

[0023] Figure 4 is a bottom view of the MEMS speaker hybrid system of the present invention. Detailed Embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0025] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments may be combined with each other.

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0027] Reference Figures 1 to 4 A micro-electromechanical speaker hybrid system includes an acoustic cavity, and the acoustic cavity is provided with:

[0028] MEMS speakers 13;

[0029] The acoustic sensor 10 and the micro-electromechanical speaker 13 are disposed on the same substrate 1;

[0030] The microprocessor 11 is disposed on the substrate 1 . An input end of the microprocessor 11 is connected to the acoustic sensor 10 , and an output end of the microprocessor 10 is connected to a driving end of a micro-electromechanical speaker 13 .

[0031] In the present application, a micro-electromechanical speaker and an acoustic sensor are arranged in the same acoustic cavity. The acoustic sensor monitors the sound emitted by the micro-electromechanical speaker. The microprocessor acts on the driving end of the micro-electromechanical speaker, and the micro-electromechanical speaker is calibrated through a closed-loop path to achieve better sensitivity, overcome distortion, and protect the speaker.

[0032] In a preferred embodiment of the present invention, a metal cover 2 is provided on the substrate 1, and the metal cover 2 and the substrate 1 form an acoustic cavity; and further comprising:

[0033] A micro-electromechanical component 3 is disposed on a first region of the substrate 1 via an adhesive member 5 located below the micro-electromechanical component 3;

[0034] The diaphragm 4 is disposed on the micro-electro-mechanical component 3 via a first adhesive film 6 located above the micro-electro-mechanical component 3 .

[0035] In the MEMS speaker hybrid system of the present invention, the metal cover 2 is provided with a sound hole 12 located on one side wall. The sound hole 12 is a cylindrical structure extending out of the side wall, the diameter of the sound hole can be 1 mm, and the distance from the front end of the sound hole 12 to the side wall can be 1 mm to 2 mm.

[0036] In a preferred embodiment of the present invention, a depression is provided in the first region relative to the surface of the substrate 1 , and the micro-electromechanical component 3 is arranged in the depression.

[0037] In a preferred embodiment of the present invention, the adhesive member 5 is a square frame structure.

[0038] In a preferred embodiment of the present invention, the first area on the substrate 1 has a through hole, and a mesh electrostatic voice coil 8 is arranged at the position of the bottom through hole of the substrate 1, and the mesh electrostatic voice coil 8 is circular. The diameter of the through hole can be 1.1 mm, and the diameter of the mesh electrostatic voice coil 8 can be 3 mm to 3.5 mm.

[0039] In a preferred embodiment of the present invention, a conductive glue 9 is disposed in the area on the substrate 1 for disposing the acoustic sensor 10 and the microprocessor 11. A conductive path is also disposed on the substrate 1 to connect the acoustic sensor 10 and the microprocessor 11 and the microprocessor 11 to the driving end of the micro-electromechanical speaker 13.

[0040] Reference Figure 4 The back of the substrate 1 is provided with a first pad VOUT+ and a second pad VOUT-, and the first pad VOUT+ and the second pad VOUT- are respectively connected to an external driving circuit. The output signal of the microprocessor 11 is also connected to the driving circuit, and the signal of the speaker is obtained through the acoustic sensor and connected to the feedback loop, and the calibration of the micro-electromechanical speaker and the distortion are overcome by signal processing. The driving circuit includes a differential amplifier, and the output end of the differential amplifier is connected to the first pad VOUT+ and the second pad VOUT-.

[0041] A preferred embodiment of the present invention further comprises a double-sided tape layer 7, comprising a first portion arranged along the border of the diaphragm 4 and a second portion arranged along the border of the back plate. The second portion of the double-sided tape layer 7 may be 0.3 mm thick and is arranged 0.05 mm away from the edge of the back plate.

[0042] In a preferred embodiment of the present invention, the metal cover is a rectangular structure with an open bottom, the length of the metal cover 2 can be 7mm to 10mm, the width of the metal cover 2 is 5mm to 6mm, and the height of the metal cover 2 is 2mm to mm.

[0043] In a preferred embodiment of the present invention, the side length of the acoustic sensor 10 is 0.8 mm, the distance between the acoustic sensor 10 and the MEMS speaker 13 is 0.18 mm to 0.275 mm, and the distance between the acoustic sensor 10 and the microprocessor 11 is 0.2 mm.

[0044] The speaker of the conventional technology is open-loop, and the speaker is far away from the acoustic sensor. The acoustic sensor and the microprocessor 11 of the present application are arranged close to the micro-electromechanical speaker 13, which can reduce the transmission delay and improve the acoustic characteristics.

[0045] Through the description and drawings, typical embodiments of the specific structures of the specific implementation methods are given, and other transformations can be made based on the spirit of the present invention. Although the above invention proposes the existing preferred embodiments, these contents are not intended to be limiting.

[0046] For those skilled in the art, various changes and modifications will undoubtedly be obvious after reading the above description. Therefore, the attached claims should be regarded as covering all changes and modifications of the true intent and scope of the present invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to still be within the intent and scope of the present invention.

Claims

1. A micro-electromechanical speaker hybrid system, characterized in that: It comprises an acoustic cavity, in which: MEMS speakers; an acoustic sensor disposed on the same substrate as the micro-electromechanical speaker; A microprocessor is arranged on the substrate, an input end of the microprocessor is connected to the acoustic sensor, and an output end of the microprocessor is connected to a driving end of the micro-electromechanical speaker.

2. The MEMS speaker hybrid system according to claim 1, characterized in that: A metal cover is provided on the substrate, and the metal cover and the substrate form the acoustic cavity; the acoustic cavity is also provided with: a micro-electromechanical component disposed on the first region of the substrate via an adhesive member located below the micro-electromechanical component; The diaphragm is arranged on the micro-electro-mechanical component via a first adhesive film located above the micro-electro-mechanical component.

3. The MEMS speaker hybrid system according to claim 2, characterized in that: The metal cover is provided with a sound hole located on one side wall.

4. The MEMS speaker hybrid system according to claim 2, characterized in that: The first area on the substrate has a through hole, and a mesh electrostatic voice coil is arranged at the position of the through hole at the bottom of the substrate.

5. The MEMS speaker hybrid system according to claim 2, characterized in that: It also includes a double-sided tape layer, which includes a first portion arranged along the border of the diaphragm and a second portion arranged along the border of the back plate.

6. The MEMS speaker hybrid system according to claim 2, characterized in that: The metal cover is a rectangular parallelepiped structure with an open bottom. The length of the metal cover is 7 mm to 8 mm, and the width of the metal cover is 5 mm to 6 mm.

7. The MEMS speaker hybrid system according to claim 1, characterized in that: The side length of the acoustic sensor is 0.8 mm, the distance between the acoustic sensor and the micro-electromechanical speaker is 0.18 mm to 0.275 mm, and the distance between the acoustic sensor and the microprocessor is 0.2 mm.

8. The MEMS speaker hybrid system according to claim 2, characterized in that: The first region is provided with a recess relative to the surface of the substrate, and the micro-electromechanical component is arranged in the recess.

9. The MEMS speaker hybrid system according to claim 1, characterized in that: A conductive path is arranged on the substrate to connect the acoustic sensor and the microprocessor and to connect the microprocessor and the driving end of the micro-electromechanical speaker.

10. The MEMS speaker hybrid system according to claim 4, characterized in that: The grid electrostatic voice coil is circular, and the adhesive member is a square frame structure.

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