Heat dissipation back splint, heat dissipation shell and electronic equipment

Abstract

The invention provides a heat dissipation back splint, the heat dissipation back splint comprises a liquid cooling membrane cold conduction plate, a semiconductor refrigeration sheet and a heat dissipation device, and the semiconductor refrigeration sheet is attached to the liquid cooling membrane cold conduction plate; the cooling device comprises a radiator and a fan, the radiator is in contact with the semiconductor chilling plate, the liquid cooling diaphragm cold guide plate is used for transmitting heat to the semiconductor chilling plate, the semiconductor chilling plate is used for transmitting the heat to the radiator, and the fan is used for cooling the radiator. And cold air generated by the operation of the fan exchanges heat with the radiator and then is discharged out of the radiating back splint. The invention further provides a heat dissipation shell provided with the heat dissipation back splint and electronic equipment.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular to a heat dissipation back clip, a heat dissipation shell provided with the heat dissipation back clip, and electronic equipment provided with the heat dissipation shell. Background Art

[0002] In view of the increasing demand for heat dissipation in existing electronic devices such as mobile phones due to the growing number of gaming and live streaming scenarios, some mobile phones currently use heat dissipation back clips for heat dissipation; the heat dissipation back clip generally uses TEC cooling plates and heat pumps to export heat, and then dissipates it to the environment through a fan. Since the TEC cooling plate is built into the heat dissipation back clip, it is necessary to match the TEC cooling plate with components such as a fixed bracket, a radiator, a fan, and a housing. At the same time, in order to increase the contact heat exchange area between the heat dissipation back clip and the mobile phone, the area of ​​the heat conduction plate of the heat dissipation back clip will be larger than the surface area of ​​the TEC cooling plate. However, the existing cold conduction plate generally uses a composite material of silica gel, copper foil and silica gel pad. The thermal conductivity of the composite material is poor and cannot guarantee the temperature uniformity of the heat conduction cooling, resulting in a large contact thermal resistance between the heat dissipation back clip and the mobile phone. Summary of the invention

[0003] The present application provides a heat dissipation back clip for reducing contact thermal resistance, a heat dissipation housing provided with the heat dissipation back clip, and an electronic device provided with the heat dissipation housing.

[0004] The present application provides a heat dissipation back clip, which includes a liquid-cooled diaphragm cold plate, a semiconductor refrigeration sheet and a heat dissipation device, wherein the semiconductor refrigeration sheet is attached to the liquid-cooled diaphragm cold plate; the heat dissipation device includes a radiator and a fan, wherein the radiator is in contact with the semiconductor refrigeration sheet, the liquid-cooled diaphragm cold plate is used to transfer heat to the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is used to conduct heat to the radiator, and the cold air generated by the fan is discharged from the heat dissipation back clip after heat exchange with the radiator.

[0005] The present application also provides a heat dissipation shell, which includes a heat dissipation back clip and a heat-conducting back shell, the heat dissipation back clip includes a liquid-cooled diaphragm cold plate, a semiconductor refrigeration sheet and a heat dissipation device, the semiconductor refrigeration sheet is attached to the liquid-cooled diaphragm cold plate; the heat dissipation device includes a radiator and a fan, the radiator is in contact with the semiconductor refrigeration sheet, the liquid-cooled diaphragm cold plate is used to transfer heat to the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is used to conduct heat to the radiator, and the liquid-cooled diaphragm cold plate of the heat dissipation back clip is attached to the outer surface of the heat-conducting back shell.

[0006] The present application also provides an electronic device, which includes a middle frame, a mainboard, a heat-conducting back shell, and a heat-dissipating back clip; the mainboard is arranged in the inner cavity of the middle frame, a heat source is provided on the mainboard, the heat-conducting back shell covers the back of the middle frame, the heat-dissipating back clip includes a liquid-cooled diaphragm cold conduction plate, a semiconductor refrigeration sheet and a heat dissipation device, the semiconductor refrigeration sheet is attached to the liquid-cooled diaphragm cold conduction plate; the heat dissipation device includes a radiator and a fan, the radiator is in contact with the semiconductor refrigeration sheet, the liquid-cooled diaphragm cold conduction plate is used to transfer heat to the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is used to conduct heat to the radiator, the liquid-cooled diaphragm cold conduction plate of the heat-dissipating back clip is attached to the outer surface of the heat-conducting back shell, and the heat generated by the operation of the heat source is evenly conducted to the semiconductor refrigeration sheet through the liquid-cooled diaphragm.

[0007] The heat dissipation back clip of the present application is attached to the heat-conductive back shell through one side of the liquid-cooled diaphragm cold plate, and the other side of the liquid-cooled diaphragm cold plate is attached to the semiconductor refrigeration plate, and the surface of the semiconductor refrigeration plate facing away from the liquid-cooled diaphragm cold plate is attached to the radiator, so that the heat on the heat-conductive back shell can be evenly and quickly transferred to the semiconductor refrigeration plate, thereby reducing the contact thermal resistance between the heat dissipation back clip and the electronic device, so that the heat transfer liquid in the liquid-cooled diaphragm cold plate can be quickly and evenly dispersed to absorb the heat on the heat-conductive back shell in contact with the heat dissipation back clip, which can quickly cool the electronic device, improve the thermal conductivity of the liquid-cooled diaphragm cold plate, and improve the cooling and heat exchange effect of the heat dissipation back clip. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the implementation. Obviously, the drawings described below are some implementations of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0009] Figure 1 It is a schematic diagram of the three-dimensional structure of the heat dissipation housing in one embodiment of the present application.

[0010] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure of the heat dissipation shell.

[0011] Figure 3 yes Figure 2 A magnified image of the heatsink clip.

[0012] Figure 4 yes Figure 3 Schematic diagram of the three-dimensional structure of the heat dissipation back clip from another perspective.

[0013] Figure 5 yes Figure 3 Schematic diagram of the three-dimensional structural decomposition of the heat dissipation back clip.

[0014] Figure 6 yes Figure 5 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0015] Figure 7 yes Figure 6 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0016] Figure 8 yes Figure 7 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0017] Fig. 9 yes Figure 8 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0018] Fig.10 yes Fig. 9 Schematic diagram of the three-dimensional structure of the heat dissipation back clip from another perspective.

[0019] Fig.11 yes Fig. 9 Schematic diagram of the structure of the liquid cooling plate.

[0020] Fig.12 yes Fig.11 A schematic cross-sectional view of a liquid cooling plate in FIG.

[0021] Fig.13 yes Figure 3 One of the three-dimensional cross-sectional views of the heat dissipation back clip in FIG.

[0022] Fig.14 yes Fig.13 Schematic diagram of the cross-section of the heat dissipation back clip.

[0023] Fig.15 yes Figure 3 Another three-dimensional cross-sectional view of the heat dissipation back clip in FIG.

[0024] Fig.16 yes Fig.15 Schematic diagram of the cross-section of the heat dissipation back clip.

[0025] Fig.17 It is a schematic diagram of the three-dimensional structure of an electronic device in one embodiment of the present application.

[0026] Main markings:

[0027] 100, heat dissipation housing; 20, heat-conducting back shell; 22, back plate; 220, first magnetic attraction member; 222, light inlet; 24, peripheral wall; 242, side wall; 244, end wall; 30, heat dissipation back clip; 31, liquid-cooled diaphragm cold plate; 311, support sheet; 3110, flow channel; 313, first coating; 3132, liquid inlet hole; 3134, liquid outlet hole; 315, second coating; 316, piezoelectric pump; 317, interface layer; 3162, liquid inlet; 3164, liquid outlet; 32, semiconductor cooling sheet; 40, heat dissipation device; 42, radiator; 420, heat-conducting substrate; 4201, heat-conducting sheet; 4202, heat-conducting contact sheet; 4203, first positioning hole; 4204, connecting hole; 4205, clamping groove; 4207, connecting tube; 4208, mounting groove; 421, heat dissipation fin; 422, receiving space; 423, ventilation groove; 44, fan; 46, support frame; 462, positioning part; 4 621, positioning piece; 4623, connecting piece; 4624, fixing hole; 464, supporting part; 50, bracket; 51, through hole; 52, first positioning groove; 521, fixing groove; 53, second positioning groove; 531, positioning column; 533, second positioning hole; 535, clamping piece; 536, positioning flange; 537, first clamping groove; 56, second magnetic attraction member; 60, covering shell; 61, inner cavity; 62, outer peripheral plate; 622, air outlet; 625, plug slot; 64, cover plate; 642, air inlet; 644, connecting column; 645, snap ring slot; 646, block; 647, snap column; 65, protective plate; 650, ventilation hole; 652, snap ring; 654, baffle; 655, second snap slot; 70, circuit board; 72, perforation; 74, snap hole; 75, connector; 300, electronic device; 302, middle frame; 303, motherboard; 304, display screen; 305, heat source; 306, battery. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] In addition, the following descriptions of the various embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0030] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] Please also read Figures 1 to 6 In one embodiment of the present invention, a heat dissipation housing 100 covers the back of an electronic device. The heat dissipation housing 100 includes a heat-conducting back shell 20 and a heat dissipation back clip 30. The heat dissipation back clip 30 includes a liquid-cooled diaphragm cold plate 31, a semiconductor refrigeration sheet 32 ​​and a heat dissipation device 40. The liquid-cooled diaphragm cold plate 31 can be attached to the outer surface of the back plate of the electronic device to be dissipated. The semiconductor refrigeration sheet 32 ​​is attached to the liquid-cooled diaphragm cold plate 31, that is, the semiconductor refrigeration sheet 32 ​​is attached to the surface of the liquid-cooled diaphragm cold plate 31 away from the electronic device; the heat dissipation device 40 includes a radiator 42 and a fan 44. The radiator 42 contacts the semiconductor refrigeration sheet 32. The liquid-cooled diaphragm cold plate 31 is used to transfer heat to the semiconductor refrigeration sheet 32. The semiconductor refrigeration sheet 32 ​​is used to conduct heat to the radiator 42. The cold air generated by the operation of the fan 44 exchanges heat with the radiator 42 and is discharged from the heat dissipation back clip 30. Specifically, the heat generated when the electronic device is in operation is conducted to the heat-conducting back shell 20, and the heat on the heat-conducting back shell 20 is evenly and quickly transferred to the semiconductor refrigeration sheet 32 ​​via the liquid-cooling membrane cooling plate 31. The heat on the semiconductor refrigeration sheet 32 ​​is quickly conducted to the radiator 42, and the fan 44 draws the outside air to exchange heat with the radiator 42 and then discharges it out of the heat dissipation back clamp 30.

[0032] It should be noted that the heat dissipation back clip 30 is detachably connected to the heat-conducting back shell 20, and the heat dissipation housing 100 is installed on the electronic device. The heat dissipation housing 100 is used to dissipate heat for the heat source of the electronic device; for some heat dissipation back clips 30 with wireless charging function, the liquid-cooled diaphragm cold plate 31 is made of non-conductive polymer material, which can enhance the heat dissipation effect of the liquid-cooled diaphragm cold plate 31. The semiconductor cooling sheet 32 ​​is a rectangular sheet. The fan 44 can be but not limited to an axial fan, a piezoelectric fan, a centrifugal fan, etc. The electronic device can be but not limited to a mobile phone, a tablet computer, a laptop computer, a smart watch, a VR head-mounted display, a smart wearable device, etc., and the heat source can be but not limited to a processor, an image sensor, a memory module, a radio frequency circuit, a screen display circuit, a WIFI module, a Bluetooth module or a camera module, etc. The "connection" in the description of the embodiment of the present invention includes two situations: direct connection and indirect connection. For example, the connection between A and B includes direct connection between A and B or connection through a third element C or more other elements. The connection also includes two situations: integrated connection and non-integrated connection. The integrated connection means that A and B are formed and connected as one body, and the non-integrated connection means that A and B are formed and connected as a non-integrated body.

[0033] Compared with the existing heat dissipation back clip, the thermal conductivity coefficient is poor, the contact thermal resistance between the heat dissipation back clip and the electronic device is large, and the uniformity of heat conduction cannot be guaranteed; the heat dissipation back clip 30 of the present application is attached to the heat-conductive back shell 20 through one side of the liquid-cooled diaphragm cold plate 31, and the surface of the liquid-cooled diaphragm cold plate 31 facing away from the heat-conductive back shell 20 is attached to the semiconductor refrigeration plate 32, and the semiconductor refrigeration plate 32 is attached to the radiator 42, which can make the heat on the heat-conductive back shell 20 be evenly and quickly transferred to the semiconductor refrigeration plate 32, thereby reducing the contact thermal resistance between the heat dissipation back clip 30 and the electronic device, so that the heat transfer liquid in the liquid-cooled diaphragm cold plate 31 can be quickly and evenly dispersed to absorb the heat on the heat-conductive back shell 20 in contact with the heat dissipation back clip 30, which can quickly cool the electronic device, improve the thermal conductivity of the liquid-cooled diaphragm cold plate 31, and improve the cooling and heat exchange effect of the heat dissipation back clip 30.

[0034] like Figure 1 and Figure 2As shown, the heat-conducting back shell 20 includes a back plate 22 and a peripheral wall 24 arranged around the edge of the back plate 22. The back plate 22 and the peripheral wall 24 enclose an installation space, which is used to accommodate electronic equipment so that the heat generated by the electronic equipment when working can be conducted to the heat-conducting back shell 20. In this embodiment, the back plate 22 is a rectangular plate, and the peripheral wall 24 includes side walls 242 arranged on opposite side edges of the back plate 22 and end walls 244 arranged on opposite end edges of the back plate 22. The back plate 22, the two side walls 242 and the two end walls 244 enclose an installation space. A first magnetic attraction member 220 is provided on the back plate 22. The first magnetic attraction member 220 is used to mutually adsorb with the second magnetic attraction member of the heat dissipation back clip 30, so that the heat dissipation back clip 30 is positioned on the heat-conducting back shell 20, that is, the liquid-cooling diaphragm cold plate 31 is stably attached to the back plate 22. Optionally, three or more first magnetic members 220 are embedded in the back panel 22, and these first magnetic members 220 are arranged in a circle at intervals from each other; in this embodiment, the first magnetic member 220 is an arc-shaped first magnetic sheet, and four first magnetic sheets are embedded in the back panel 22, and the four first magnetic sheets are arranged in a circle at intervals from each other. In other embodiments, two first magnetic members 220 can also be embedded in the back panel 22, and the two first magnetic members 220 are arranged at intervals from each other. The back panel 22 is provided with a light inlet 222, and the light inlet 222 is connected to the installation space, and the lens module of the electronic device is opposite to the light inlet 222. The thermal conductive back shell 20 can be made of but not limited to metal materials such as aluminum alloy, stainless steel, tempered glass, carbon fiber material, silicone material containing graphite powder, or plastic material.

[0035] like Figure 7-Figure 12 As shown, the liquid-cooled diaphragm cold plate 31 includes a support sheet 311, a first coating 313 covering one side of the support sheet 311, a second coating 315 covering the other side of the support sheet 311, and a piezoelectric pump 316; the support sheet 311 has a flow channel 3110, the flow channel 3110 is filled with a heat transfer liquid, and the piezoelectric pump 316 operates to drive the heat transfer liquid to flow in the flow channel 3110, so as to transfer heat evenly and quickly to the liquid-cooled diaphragm cold plate 31. In this embodiment, the liquid-cooled diaphragm cold plate 31 is a circular plate, the support sheet 311, the first coating 313 and the second coating 315 are all circular, the support sheet 311 is clamped by the first coating 313 and the second coating 315, and the diameters of the support sheet 311, the first coating 313 and the second coating 315 are all equal. In other embodiments, the liquid-cooled diaphragm cold plate 31 may be, but not limited to, an elliptical plate, a polygonal plate, a rectangular plate or an irregular plate, and the support sheet 311, the first coating 313 and the second coating 315 may be, but not limited to, elliptical, polygonal, rectangular or irregular in shape, etc. The shapes of the support sheet 311, the first coating 313 and the second coating 315 are consistent so that the first coating 313 and the second coating 315 can clamp the support sheet 311.

[0036] Optionally, the flow channel 3110 is two wavy grooves spaced apart from each other, the two wavy grooves are covered with the support sheet 311, one end of the two wavy grooves are connected to each other, the other ends of the two wavy grooves are spaced apart from each other and close to each other, the piezoelectric pump 316 is disposed on the first coating 313, and the piezoelectric pump 316 is connected to the two wavy grooves respectively. Specifically, the piezoelectric pump 316 includes a liquid inlet 3162 and a liquid outlet 3164, the first coating 313 is provided with a liquid inlet hole 3132 and a liquid outlet hole 3134, the liquid inlet hole 3132 and the liquid outlet hole 3134 are connected to the two ends of the flow channel 3110 respectively, that is, the liquid inlet hole 3132 and the liquid outlet hole 3134 are connected to the two wavy grooves respectively, the liquid inlet 3162 is connected to the liquid outlet hole 3134, and the liquid outlet 3164 is connected to the liquid inlet hole 3132. When the piezoelectric pump 316 is running, it can drive the heat transfer liquid in the flow channel 3110 to pass through the liquid outlet 3134 and the liquid inlet 3132 through the piezoelectric pump 316, and flow back to the flow channel 3110 from the liquid outlet 3164 and the liquid outlet 3164, so as to realize the flow of the heat transfer liquid in the flow channel 3110. The flow rate is quickly transferred to the entire liquid-cooled diaphragm cold plate 31 along with the heat transfer liquid in the flow channel 3110, and the conduction capacity of the liquid-cooled diaphragm cold plate 31 of the heat dissipation back clamp 30 in the thickness direction and the plane direction is quickly improved, the conduction impedance is reduced, the heat dissipation effect is improved, and the freezing point cooling of the electronic equipment is achieved.

[0037] In other embodiments, the flow channel 3110 can be a spiral groove, which is coaxial with the first coating 313, and the spiral groove is covered with the support plate 311. The opposite ends of the spiral groove are spaced and close to each other. The liquid inlet hole 3132 and the liquid outlet hole 3134 of the first coating 313 are respectively connected to the opposite ends of the spiral groove, and the liquid inlet 3162 and the liquid outlet 3164 of the piezoelectric pump 316 are respectively connected to the liquid outlet hole 3134 and the liquid inlet hole 3132; when the piezoelectric pump 316 is running, it can drive the heat transfer liquid in the spiral groove from the liquid outlet hole 3134 and the liquid inlet hole 3132 through the piezoelectric pump 316, and then flow back to the flow channel 3110 from the liquid outlet 3164 and the liquid outlet 3164, so as to realize the flow of heat transfer liquid in the flow channel 3110, thereby quickly and evenly transferring heat to the entire liquid-cooled diaphragm cold guide plate 31. In other embodiments, the flow channel 3110 can also be a groove of other shapes. The flow channel 3110 is covered with the support sheet 311. The liquid inlet hole 3132 and the liquid outlet hole 3134 of the first coating 313 are respectively connected to the opposite ends of the flow channel 3110, and the liquid inlet 3162 and the liquid outlet 3164 of the piezoelectric pump 316 are respectively connected to the liquid outlet hole 3134 and the liquid inlet hole 3132.

[0038] Optionally, the thickness H of the liquid cooling membrane cooling plate 31 is ≥ 150 mm, the height h of the flow channel 3110 is ≥ 80 mm, and the permeability of the first coating 313 and the second coating 315 to water vapor is required to be ≤ 1 g / m 2 / 24hr, the number of piezoelectric pumps 316 is ≥ 1. In this embodiment, the surface of the second coating 315 away from the first coating 313 is attached to the interface layer 317, and the interface layer 317 prevents the liquid-cooled membrane cold plate 31 from being punctured and reduces the interface thermal resistance. The interface layer 317 can be, but is not limited to, a thermally conductive silicone pad or thermally conductive silicone.

[0039] Optionally, the size and performance of the semiconductor cooling plate 32, such as the maximum temperature difference, the maximum current, the maximum voltage and the maximum cooling capacity, are related to the heat dissipation capacity requirements and the size of the whole machine and are not particularly limited.

[0040] like Fig. 9 and Fig.10 As shown, the radiator 42 includes a heat-conducting substrate 420 and a plurality of heat-dissipating fins 421, and the plurality of heat-dissipating fins 421 are arranged at least one circle along the edge of the heat-conducting substrate 420 to form a receiving space 422, and the ventilation slots 423 between each two adjacent heat-dissipating fins 421 are connected to the receiving space 422, and the fan 44 is accommodated in the receiving space 422 to reduce the overlapping thickness of the fan 44 and the radiator 42; the side of the heat-conducting substrate 420 away from the heat-dissipating fins 421 contacts the semiconductor cooling sheet 32, so that the heat on the semiconductor cooling sheet 32 ​​can be quickly transferred to the radiator 42, and the plurality of heat-dissipating fins 421 surround the fan 44, so that the cold air generated by the fan 44 when it is running can pass through the ventilation slots 423 quickly and with the maximum air volume, and the plurality of heat-dissipating fins 421 increase the surface area for heat exchange with the cold air, thereby improving the heat dissipation efficiency. In this embodiment, the heat-conducting substrate 420 includes a circular heat-conducting sheet 4201 and a heat-conducting contact sheet 4202 protruding from the surface of the heat-conducting sheet 4201 away from the heat-dissipating fin 421. The heat-conducting contact sheet 4202 is a rectangular heat-conducting sheet located in the middle of the heat-conducting sheet 4201, and the heat-conducting contact sheet 4202 is used to directly contact the semiconductor refrigeration sheet 32; a plurality of heat-dissipating fins 421 protrude from the surface of the heat-conducting sheet 4201 away from the heat-conducting contact sheet 4202, and a plurality of heat-dissipating fins 421 are arranged in a circle around the circumference of the heat-conducting sheet 4201, each heat-dissipating fin 421 extends along the radial direction of the heat-conducting sheet 4201, and the ventilation slot 423 between each two adjacent heat-dissipating fins 421 is parallel to the radial direction corresponding to the heat-conducting sheet 4201. In other embodiments, the heat-conducting sheet 4201 can be but not limited to a rectangular sheet, an elliptical sheet, a polygonal sheet, etc., and the heat-conducting contact sheet 4202 can be but not limited to a circular sheet, a rectangular sheet, an elliptical sheet, or a polygonal sheet, etc.

[0041] In this embodiment, two circles of heat dissipation fins 421 are arranged on the surface of the heat conductive sheet 4201 away from the heat conductive contact sheet 4202. The two circles of heat dissipation fins 421 are coaxial, one circle of heat dissipation fins 421 is arranged around the edge of the heat conductive sheet 4201 to form a receiving space 422; the other circle of heat dissipation fins 421 is located in the receiving space 422, and the thickness of the one circle of heat dissipation fins 421 is greater than the thickness of the other circle of heat dissipation fins 421. Since two circles of heat dissipation fins 421 are arranged on the heat conductive sheet 4201, the heat exchange area of ​​the heat dissipation fins 421 can be further increased.

[0042] The heat conducting sheet 4201 is provided with a plurality of first positioning holes 4203 and a plurality of connecting holes 4204. The plurality of first positioning holes 4203 are respectively close to the edge of the heat conducting sheet 4201, and the plurality of connecting holes 4204 are located in the receiving space 422. In this embodiment, two first positioning holes 4203 are provided on the heat conducting sheet 4201, and the two first positioning holes 4203 are located at opposite ends of one diameter of the heat conducting sheet 4201, and three connecting holes 4204 are provided on the heat conducting sheet 4201 and arranged in a circle around the circumference. In other embodiments, the heat conducting sheet 4201 is provided with more than three first positioning holes 4203 and more than three connecting holes 4204, and the more than three first positioning holes 4203 are arranged in a circle around the circumference of the heat conducting sheet 4201, and the more than three connecting holes 4204 are arranged in a circle around the circumference of the heat conducting sheet 4201, and a circle of connecting holes 4204 is closer to the axis of the heat conducting sheet 4201 than a circle of first positioning holes 4203. The outer circumference of the heat conducting sheet 4201 is provided with a snap-in groove 4205. In this embodiment, two snap-in grooves 4205 are provided on the outer circumference of the heat conducting sheet 4201, and the two snap-in grooves 4205 are located at opposite ends of one diameter of the heat conducting sheet 4201. A connecting tube 4207 is provided on the side of the heat conducting sheet 4201 away from the heat conducting contact sheet 4202. In this embodiment, two connecting tubes 4207 are provided on the heat conducting sheet 4201, and the axis of the connecting tube 4207 is parallel to the axis of the heat conducting sheet 4201. The two connecting tubes 4207 are respectively located at opposite ends of one diameter of the heat conducting sheet 4201. A mounting groove 4208 is provided on the heat dissipation fin 421, and the mounting groove 4208 is used to accommodate the connector 75.

[0043] It can be understood that the heat sink 42 can be made of heat dissipation materials such as but not limited to aluminum, copper, and high thermal conductivity polymers; the heat sink 42 can be a heat sink of aluminum extrusion, die casting, shovel teeth, splined teeth, etc. with a thermal conductive substrate 420 thinned, or a lighter buckled thin metal sheet heat sink, or a heat sink made of a high thermal conductivity polymer material.

[0044] Optionally, the heat dissipation back clip further includes a support frame 46, which is accommodated in the receiving space 422, and is used to connect the fan 44 to the receiving space 422 of the radiator 42; specifically, the support frame 46 includes a positioning portion 462 and a support portion 464 connected to the positioning portion 462, the positioning portion 462 is connected to the heat conductive substrate 420, and one end of the support portion 464 away from the positioning portion 462 is connected to the fan 44. Since the support frame 46 is accommodated in the receiving space 422, the support frame 46 will not increase the thickness of the radiator 42, and the support frame 46 can stably connect the fan 44 to the radiator 42. Specifically, the positioning portion 462 includes a positioning piece 4621 and a connecting piece 4623, the support portion 464 is connected to the middle of the positioning piece 4621, the connecting piece 4623 is connected to the edge of the positioning piece 4621, and the connecting piece 4623 is parallel to the positioning piece 4621; the positioning piece 4621 and the thermal conductive substrate 420 can be fixedly connected by means of but not limited to snap-on, screw-on or glue-on, and the connecting piece 4623 and the thermal conductive substrate 420 can be connected by means of but not limited to snap-on, screw-on or glue-on, so that the support frame 46 can be firmly connected to the thermal conductive substrate 420. In this embodiment, the positioning piece 4621 is a circular piece, and three connecting pieces 4623 are connected to the outer circumferential surface of the circular piece. The three connecting pieces 4623 are evenly spaced and arranged in a circle around the circumference of the circular piece. The supporting portion 464 is a supporting tube, one end of which is connected to the middle of the positioning piece 4621, and the other end of the supporting tube supports the fan 44. The axis of the supporting tube is colinear with the axis of the positioning piece 4621; a fixing hole 4624 is provided at one end of each connecting piece 4623 away from the positioning piece 4621.

[0045] Optionally, the heat dissipation back clamp 30 further includes a bracket 50, a through hole 51 is provided in the middle of the bracket 50, the liquid-cooled diaphragm cold plate 31 is connected to one side of the bracket 50, the semiconductor refrigeration sheet 32 ​​is accommodated in the through hole 51, and the radiator 42 is connected to the side of the bracket 50 away from the liquid-cooled diaphragm cold plate 31, so that the liquid-cooled diaphragm cold plate 31, the semiconductor refrigeration sheet 32 ​​and the radiator 42 are mutually stacked and connected to the bracket 50. Specifically, a first positioning groove 52 is provided on the first side of the bracket 50, a second positioning groove 53 is provided on the opposite second side of the bracket 50, opposite sides of the through hole 51 are connected to the first positioning groove 52 and the second positioning groove 53 respectively, the liquid-cooled diaphragm cold plate 31 is positioned in the first positioning groove 52, the semiconductor refrigeration sheet 32 ​​is accommodated in the through hole 51, the heat-conducting substrate 420 is positioned in the second positioning groove 53, and the opposite sides of the semiconductor refrigeration sheet 32 ​​are in contact with the liquid-cooled diaphragm cold plate 31 and the radiator 42 respectively. In this embodiment, the bracket 50 is a circular frame, the through hole 51 is a rectangular hole, the first positioning groove 52 is a first circular groove located in the middle of the first side surface of the bracket 50, and the second positioning groove 53 is a second circular groove located in the middle of the second side surface of the bracket 50, and the axis of the first circular groove is collinear with the axis of the second circular groove.

[0046] like Figure 2 and Figure 9-10 As shown, the heat dissipation back clip 30 is provided with a second magnetic member 56, and the heat dissipation back clip 30 and the heat conductive back shell 20 are connected by mutual adsorption of the first magnetic member 220 and the second magnetic member 56. Optionally, three or more second magnetic members 56 are embedded in the bracket 50, and these second magnetic members 56 are arranged in a circle at intervals from each other; in this embodiment, the second magnetic member 56 is an arc-shaped second magnetic sheet, and four second magnetic sheets are embedded in the periphery of the through hole 51 on the side of the bracket 50 away from the heat sink 42, and the four second magnetic sheets are arranged in a circle at intervals from each other; when the heat dissipation back clip 30 is placed on the heat conductive back shell 20, the four second magnetic members 56 are magnetically adsorbed to the four first magnetic members 220 respectively. In other embodiments, two second magnetic components 56 may also be embedded on one side of the bracket 50 close to the liquid-cooling diaphragm cold plate 31. The two second magnetic components 56 are spaced apart from each other. When the heat dissipation back clip 30 is placed on the heat-conductive back shell 20, the two first magnetic components 220 are magnetically adsorbed to the two second magnetic components 56 respectively.

[0047] The bracket 50 is provided with a fixing groove 521 on the bottom surface of the first positioning groove 52, and the second magnetic attraction member 56 is positioned in the fixing groove 521; optionally, the bracket 50 is provided with three or more fixing grooves 521 on the bottom surface of the first positioning groove 52, and these fixing grooves 521 are arranged in a circle with intervals, and three or more second magnetic attraction members 56 are respectively positioned in the three or more fixing grooves 521; in this embodiment, the fixing groove 521 is in an arc shape, and four fixing grooves 521 are provided on the bottom surface of the first positioning groove 52, and the four fixing grooves 521 are arranged in a circle around the circumference of the first positioning groove 52; the four second magnetic attraction members 56 are respectively positioned in the four fixing grooves 521. The bracket 50 is provided with a plurality of positioning posts 531 on the bottom surface of the second positioning groove 53, and the plurality of positioning posts 531 are respectively close to the inner circumference of the second positioning groove 53, and the plurality of positioning posts 531 can respectively pass through the plurality of first positioning holes 4203 of the heat conductive substrate 420, so that the heat sink 42 can be positioned on the bracket 50. In this embodiment, two positioning posts 531 are provided on the bottom surface of the second positioning groove 53, the two positioning posts 531 are located at opposite ends of one diameter of the second positioning groove 53, and the two positioning posts 531 are respectively penetrated in the two first positioning holes 4203. In other embodiments, the bracket 50 is provided with more than three positioning posts 531 on the bottom surface of the first positioning groove 52, the more than three positioning posts 531 are arranged in a circle around the circumference of the second positioning groove 53, and the more than three positioning posts 531 can be respectively penetrated in more than three first positioning holes 4203. The end of the positioning post 531 away from the second positioning groove 53 is provided with a second positioning hole 533 along the axial direction of the positioning post 531. The bracket 50 is provided with a clamping piece 535 on the bottom surface of the second positioning groove 53. In this embodiment, two clamping pieces 535 are provided on the bottom surface of the second positioning groove 53, the two clamping pieces 535 are located at opposite ends of one diameter of the second positioning groove 53; the two clamping pieces 535 can be respectively clamped in the two clamping grooves 4205 of the heat conductive substrate 420. A positioning flange 536 is provided on the surface of the bracket 50 facing the radiator 42. The positioning flange 536 is close to the periphery of the bracket 50 and is arranged around the circumference of the bracket 50. At least one first slot 537 is provided on the positioning flange 536. In this embodiment, two first slots 537 are provided on the positioning flange 536. The two first slots 537 are located at opposite ends of the radial direction of the bracket 50.

[0048] like Fig. 9 and Fig.10As shown, the heat dissipation back clamp 30 also includes a covering shell 60, which is connected to the side of the bracket 50 away from the liquid-cooled diaphragm cold plate 31, and the radiator 42 and the fan 44 are accommodated in the inner cavity 61 of the covering shell 60. The covering shell 60 includes a peripheral plate 62 and a cover plate 64. The peripheral plate 62 is arranged around the radiator 42, and the cover plate 64 is connected to the end of the peripheral plate 62 away from the bracket 50. The peripheral plate 62 and the cover plate 64 form an inner cavity 61, and the cover plate 64 is provided with an air inlet 642, and the air inlet 642 is connected to the inner cavity 61. The peripheral plate 62 is provided with an air outlet 622, and the air outlet 622 is connected to the inner cavity 61. In this embodiment, the peripheral plate 62 is a cylinder, and the cover plate 64 is a circular plate. The edge of the circular plate is connected to the edge of the cylinder away from the bracket 50, and the air inlet 642 is a circular opening located in the middle of the circular plate; a plurality of air outlets 622 are provided on the peripheral plate 62, each air outlet 622 is an arc-shaped groove, and the plurality of air outlets 622 are arranged in a circle along the circumference of the peripheral plate 62. Specifically, four air outlets 622 are provided on the peripheral plate 62, and the four air outlets 622 are evenly arranged in a circle along the circumference of the peripheral plate 62. The covering shell 60 covers the fan 44 and the radiator 42 for protection, and the cover plate 64 is provided with an air inlet 642, and the peripheral plate 62 is provided with an air outlet 622, so that the air inlet 642 and the air outlet 622 are respectively located at different positions of the covering shell 60, and the interval between the air inlet 642 and the air outlet 622 is large to prevent the hot air discharged from the air outlet 622 from flowing back to the air inlet 642, thereby improving the heat dissipation effect.

[0049] In other embodiments, two air outlets 622 are provided on the peripheral plate 62, and the two air outlets 622 are located at opposite ends of the radial direction of the peripheral plate 62. In other embodiments, three or more air outlets 622 are provided on the peripheral plate 62, and the three or more air outlets 622 are evenly spaced and arranged in a circle around the circumference of the peripheral plate 62.

[0050] A plurality of connection posts 644 are provided on the inner surface of the cover plate 64 near the outer peripheral plate 62, and the plurality of connection posts 644 are arranged in a circle around the circumference of the cover plate 64, and the plurality of connection posts 644 are respectively matched with the plurality of positioning posts 531 of the bracket 50. In this embodiment, two connection posts 644 are provided on the inner surface of the cover plate 64, and the two connection posts 644 are located at opposite ends of one diameter of the cover plate 64. In other embodiments, more than three connection posts 644 are provided on the cover plate 64, and more than three connection posts 644 are arranged in a circle around the circumference of the cover plate 64. A snap ring groove 645 is provided on the inner surface of the cover plate 64 near the periphery of the air outlet 622, and the snap ring groove 645 is arranged around the circumference of the cover plate 64; a clamping block 646 is provided on the bottom surface of the snap ring groove 645 of the cover plate 64. In this embodiment, two clamping blocks 646 are provided on the bottom surface of the snap ring groove 645 of the cover plate 64, and the two clamping blocks 646 are respectively located at opposite ends of the radial direction of the cover plate 64. A clamping column 647 is provided on the inner surface of the cover plate 64. At least one clamping block 624 is provided on the side of the inner circumference of the outer peripheral plate 62 away from the cover plate 64. In this embodiment, two clamping blocks 624 are provided on the side of the inner circumference of the outer peripheral plate 62 away from the cover plate 64, and the two clamping blocks 624 are located at opposite ends of the radial direction of the outer peripheral plate 62. The outer peripheral plate 62 is further provided with a slot 625 , which is connected to the inner cavity 61 of the cover shell 60 . When the cover shell 60 covers the heat sink 42 , the slot 625 faces the connector 75 .

[0051] Optionally, the cover shell 60 further includes a protection plate 65, the edges of which are connected to the periphery of the air inlet 642 of the cover plate 64, and the protection plate 65 is provided with a plurality of ventilation holes 650, which are connected to the air inlet 642. The protection plate 65 faces the fan 44 to protect the fan 44. Specifically, the protection plate 65 includes a snap ring 652 and a baffle plate 654 connected to the snap ring 652, and the snap ring 652 can be snapped to the snap ring groove 645 of the cover plate 64. The baffle plate 654 is provided with a plurality of ventilation holes 650, which are arranged at intervals around the circumference of the snap ring 652; in this embodiment, the baffle plate 654 is provided with three ventilation holes 650, which are evenly spaced and arranged in a circle around the circumference of the snap ring 652. A second slot 655 is disposed on the outer periphery of the snap ring 652 . In this embodiment, two second slots 655 are disposed on the outer periphery of the snap ring 652 . The two second slots 655 are located at opposite ends of the snap ring 652 in the radial direction.

[0052] Optionally, the heat dissipation back clip 30 further includes a circuit board 70, which is positioned between the heat sink 42 and the cover plate 64, and the circuit board 70 is electrically connected to the liquid-cooled diaphragm cold plate 31, the semiconductor refrigeration plate 32 and the fan 44. In this embodiment, the circuit board 70 is an annular circuit board, and the side of the circuit board 70 facing the heat sink 42 is provided with electronic devices, and the connector 75 is electrically connected to the side of the circuit board 70 facing the heat sink 42. The multiple heat dissipation fins 421 of the heat sink 42 are provided with avoidance grooves for accommodating electronic devices. The circuit board 70 is provided with a plurality of through holes 72, and the plurality of through holes 72 are arranged in a circle around the circumference of the circuit board 70, and the plurality of connecting posts 644 of the cover plate 64 can respectively pass through the plurality of through holes 72. In this embodiment, the circuit board 70 is provided with two through holes 72, and the two through holes 72 are respectively located at opposite ends of the radial direction of the circuit board 70; the two connecting posts 644 of the cover plate 64 can respectively pass through the two through holes 72. In other embodiments, the circuit board 70 is provided with more than three through holes 72, and the more than three through holes 72 are arranged in a circle around the circumference of the circuit board 70. The circuit board 70 is also provided with a clamping hole 74. In this embodiment, the circuit board 70 is provided with two clamping holes 74, and the two clamping holes 74 are located at opposite ends of the radial direction of the circuit board 70. In other embodiments, the circuit board 70 is provided with a plurality of clamping holes 74, and the plurality of clamping holes 74 are evenly spaced and arranged in a circle around the circumference of the circuit board 70.

[0053] like Figure 3-Figure 10 and Figure 13-Figure 16When assembling the heat dissipation back clip 30, the four second magnetic suction parts 56 are respectively positioned in the four fixing grooves 521 of the bracket 50, and the liquid-cooled diaphragm cold plate 31 is positioned in the first positioning groove 52 of the bracket 50. The bracket 50 can be fixed between the first positioning groove 52 and the bracket 50 by means of but not limited to clamping or gluing; the semiconductor refrigeration sheet 32 ​​is accommodated in the through hole 51 of the bracket 50, so that one side of the semiconductor refrigeration sheet 32 ​​contacts the liquid-cooled diaphragm cold plate 31; optionally, an interface layer such as a thermal conductive glue can be used to fill the space between the semiconductor refrigeration sheet 32 ​​and the liquid-cooled diaphragm cold plate 31, so as to reduce the thermal resistance between the liquid-cooled diaphragm cold plate 31 and the semiconductor refrigeration sheet 32. Assemble the heat sink 42 to the second positioning groove 53 of the bracket 50. Specifically, the two positioning columns 531 of the bracket 50 pass through the two first positioning holes 4203 of the heat sink 42 respectively. The thermal conductive substrate 420 is clamped in the second positioning groove 53 of the bracket 50, and the two clamping plates 535 are respectively clamped in the two clamping grooves 4205 of the heat sink 42. The thermal conductive contact plate 4202 is accommodated in the through hole 51, and the thermal conductive contact plate 4202 contacts the semiconductor cooling plate 32. Optionally, the semiconductor cooling plate 32 and the thermal conductive contact plate 4202 are filled with thermal interface materials such as but not limited to thermal conductive gel, thermal conductive pad, thermal conductive silicone grease, etc. to reduce the thermal resistance between the semiconductor cooling plate 32 and the thermal conductive contact plate 4202. Assemble the fan 44 to the end of the support portion 464 of the support frame 46 away from the positioning portion 462, and place the support frame 46 and the fan 44 in the receiving space 422 of the radiator 42, so that the fixing holes 4624 of the three connecting pieces 4623 are respectively opposite to the three connecting holes 4204 of the heat-conducting substrate 420, and three locking members such as screws are respectively passed through the three fixing holes 4624 and locked in the three connecting holes 4204, so that the support frame 46 and the fan 44 are positioned at the center of the receiving space 422 of the radiator 42, and the heat dissipation fins 421 surround the fan 44; place the circuit board 70 on the heat dissipation fins 421 of the radiator 42, so that the two through holes 72 are respectively opposite to the second positioning holes 533 of the two positioning columns 531, and the connector 75 is placed in the installation of the radiator 42. Slot 4208, and the electronic components on the circuit board 70 are respectively accommodated in the avoidance grooves of the radiator 42; the protection plate 65 is placed in the inner cavity 61 of the cover shell 60, so that the snap ring 652 is snapped into the snap ring groove 645 of the cover plate 64, and the two snap blocks 646 are respectively snapped into the two second snap grooves 655 of the protection plate 65; the cover shell 60 covers the radiator 42 and the fan 44, so that the two connecting columns 644 of the cover shell 60 pass through the two through holes 72 of the circuit board 70 and are positioned in the second positioning holes 533 of the two positioning columns 531, the two snap blocks 624 are respectively snapped into the two first snap grooves 537 of the bracket 50, and the two snap columns 647 of the cover plate 64 pass through the two snap holes 74 of the circuit board 70 and are snapped into the inner cavity of the two connecting cylinders 4207 of the radiator 42.

[0054] In other embodiments, at least one card slot is provided on the inner surface of the outer plate 62 away from the cover plate 64 , and at least one card block is provided on the positioning flange 536 of the bracket 50 , and at least one card block is engaged in the card slot to connect the cover shell 60 to the bracket 50 .

[0055] In other embodiments, a snap ring groove is provided on the snap ring 652 of the protection plate 65, and a snap ring is provided on the inner surface of the cover plate 64 near the periphery of the air outlet 622, and the snap ring can be snapped into the snap ring groove to fix the protection plate 65 to the cover plate 64.

[0056] like Figure 1-Figure 2 and Figure 13-Figure 16 As shown, when in use, the heat-conducting back shell 20 is placed on the back of the electronic device, and the external power plug is inserted into the slot 625 of the heat dissipation back clip 30, so that the power plug is plugged into the connector 75, thereby supplying power to the piezoelectric pump 316, the semiconductor cooling sheet 32 ​​and the fan 44 of the liquid-cooled diaphragm cold plate 31 through the circuit board 70; at the same time, the circuit board 70 adjusts the power of the semiconductor cooling sheet 32, the fan 44 and the piezoelectric pump 316. The liquid-cooled diaphragm cold plate 31 of the heat dissipation back clip 30 is brought into contact with the back plate 22 of the heat-conducting back shell 20, and the four first magnetic suction members 220 are respectively magnetically attracted to the four second magnetic suction members 56, so that the heat dissipation back clip 30 is positioned on the back shell 20. The heat generated by the operation of the electronic device is conducted to the heat-conducting back shell 20, and the heat on the heat-conducting back shell 20 is conducted to the liquid-cooled diaphragm cold plate 31. The heat is quickly evenly heated by the flow of the heat transfer liquid in the liquid-cooled diaphragm cold plate 31, and then conducted to the semiconductor refrigeration sheet 32. The semiconductor refrigeration sheet 32 ​​quickly conducts the heat to the radiator 42. The fan 44 draws outside air from the air inlet 642 through the ventilation slots 423 of the radiator 42. The outside air is discharged from the air outlet 622 after heat exchange with the cooling fins 421 of the radiator 42.

[0057] The heat dissipation back clip 30 of the heat dissipation housing 100 of the present application is positioned on the heat-conducting back shell 20, and the electronic device is accommodated in the inner cavity of the heat-conducting back shell 20. The heat generated by the operation of the electronic device is conducted to the liquid-cooled diaphragm cold plate 31 through the heat-conducting back shell 20. The piezoelectric pump 316 drives the heat-conducting liquid in the liquid-cooled diaphragm cold plate 31 to flow, so as to achieve rapid temperature equalization of the liquid-cooled diaphragm cold plate 31 and conduct the heat to the semiconductor refrigeration sheet 32. In this embodiment, the thermal conductivity of the liquid-cooled diaphragm cold plate 31 can reach more than 2000W / mK, which is much greater than copper (~400W / mK) and silica gel (~1.5W / mK); through the high thermal conductivity of the liquid-cooled diaphragm cold plate 31, the thermal resistance of the liquid-cooled diaphragm cold plate 31 can be effectively reduced, and the absorption capacity of the heat generated by the electronic device in contact with the heat dissipation back clip 30 is improved, and the heat dissipation efficiency between the heat dissipation back clip 30 and the electronic device is greatly improved, which solves the problem of low heat dissipation efficiency caused by insufficient thermal conductivity of the cold plate of the heat dissipation back clip in the prior art. At the same time, the semiconductor refrigeration sheet 32 ​​works, actively transferring heat from the cold end to the hot end, that is, conducting the heat on the semiconductor refrigeration sheet 32 ​​to the radiator 42, and the fan 44 operates to draw outside air through the radiator 42 to diffuse the heat into the environment, thereby achieving efficient heat dissipation; secondly, the liquid-cooled diaphragm cold plate 31, the semiconductor refrigeration sheet 32 ​​and the radiator 42 are stacked on each other and accommodated in the bracket 50, and the fan 44 is accommodated in the accommodation space 422 of the radiator 42, thereby reducing the overall thickness of the heat dissipation back clip 30, and significantly reducing the volume and weight of the heat dissipation back clip 30, and the heat dissipation back clip 30 is light and does not weigh you down, and is small enough not to hinder the operation of electronic equipment.

[0058] like Fig.17 As shown, the present application also provides an electronic device 300, which includes a middle frame 302, a motherboard 303 arranged in the inner cavity of the middle frame 302, a display screen 304, a battery 306 and the heat dissipation housing described in the above embodiment, the display screen 304 is arranged on the front of the middle frame 302 and is electrically connected to the motherboard 303, the heat-conducting back shell 20 replaces the heat-conducting back shell of the electronic device 300, the heat-conducting back shell 20 directly covers the back of the middle frame 302, the heat-dissipating back clip 30 is connected to the back of the heat-conducting back shell 20, and the motherboard 303 is also The circuit board is electrically connected to the battery 306 and the heat dissipation back clip 30, and the battery 306 is used to provide power to the main board 303, the display screen 304, the semiconductor cooling plate of the heat dissipation back clip 30, the fan and the piezoelectric pump of the liquid-cooled diaphragm cold plate; a heat source 305 is provided on the main board 303, and the heat generated by the heat source 305 when it is in operation is evenly transferred to the semiconductor cooling plate 32 through the liquid-cooled diaphragm cold plate 31, and then transferred to the radiator, and the fan draws outside air through the radiator to diffuse the heat into the environment.

[0059] The heat generated by the heat source 305 of the electronic device 300 of the present application is transferred to the heat-conducting back shell 20, and the piezoelectric pump 316 of the liquid-cooled diaphragm cold plate 31 drives the heat-conducting liquid in the flow channel 3110 to achieve the uniform temperature of the liquid-cooled diaphragm cold plate 31 and transfer the heat to the semiconductor cooling chip. At the same time, the semiconductor cooling chip of the heat dissipation back clip 30 works, transferring the heat on the semiconductor cooling chip to the radiator, and the fan sucks the outside air through the radiator to diffuse the heat into the environment, thereby achieving efficient heat dissipation.

[0060] The above is an implementation of the embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A heat dissipation back clip, characterized in that: The heat dissipation back clip comprises: Liquid-cooled diaphragm cooling plate, A semiconductor refrigeration sheet, the semiconductor refrigeration sheet is attached to the liquid-cooled membrane cooling plate; and The heat dissipation device includes a radiator and a fan. The radiator is in contact with the semiconductor refrigeration plate. The liquid-cooled diaphragm cold plate is used to transfer heat to the semiconductor refrigeration plate. The semiconductor refrigeration plate is used to conduct heat to the radiator. The cold air generated by the fan exchanges heat with the radiator and is discharged from the heat dissipation back clip.

2. The heat dissipation back clip according to claim 1, characterized in that: The liquid-cooled diaphragm cold plate includes a support plate, a first coating covering one side of the support plate, a second coating covering the other side of the support plate, and a piezoelectric pump; the support plate has a flow channel filled with a heat transfer liquid, and the piezoelectric pump operates to drive the heat transfer liquid to flow in the flow channel.

3. The heat dissipation back clip according to claim 2, characterized in that: The piezoelectric pump is arranged on the first coating, and the piezoelectric pump includes a liquid inlet and a liquid outlet. The first coating is provided with a liquid inlet hole and a liquid outlet hole, and the liquid inlet hole and the liquid outlet hole are respectively connected to the two ends of the flow channel. The liquid inlet is connected to the liquid outlet hole, and the liquid outlet is connected to the liquid inlet hole.

4. The heat dissipation back clip according to claim 1, characterized in that: The heat sink includes a heat-conducting substrate and a plurality of heat-dissipating fins. The plurality of heat-dissipating fins are arranged at least one circle along the edge of the heat-conducting substrate to form a receiving space. The ventilation slots between each two adjacent heat-dissipating fins are connected to the receiving space. The fan is accommodated in the receiving space.

5. The heat dissipation back clip according to claim 4, characterized in that: The heat dissipation back clip also includes a support frame, which is accommodated in the accommodating space. The support frame includes a positioning portion and a support portion connected to the positioning portion. The positioning portion is connected to the thermal conductive substrate, and one end of the support portion away from the positioning portion is connected to the fan.

6. The heat dissipation back clip according to claim 1, characterized in that: The heat dissipation back clamp also includes a bracket, a through hole is provided in the middle of the bracket, the liquid-cooled diaphragm cold plate is connected to one side of the bracket, the semiconductor refrigeration plate is accommodated in the through hole, and the radiator is positioned on the side of the bracket away from the liquid-cooled diaphragm cold plate.

7. The heat dissipation back clip according to claim 6, characterized in that: The heat dissipation back clamp also includes a covering shell, which is connected to a side of the bracket facing away from the liquid-cooled diaphragm cold plate, the radiator and the fan are accommodated in an inner cavity of the covering shell, the covering shell includes a peripheral plate and a cover plate, the peripheral plate is arranged around the radiator, the cover plate is connected to one end of the peripheral plate facing away from the bracket, the cover plate is provided with an air inlet, and the peripheral plate is provided with an air outlet.

8. The heat dissipation back clip according to claim 7, characterized in that: The cover shell further comprises a protection plate, the edges of which are connected to the periphery of the air inlet of the cover plate, and a plurality of ventilation holes are arranged on the protection plate, and the ventilation holes are connected to the air inlet.

9. A heat dissipation housing, characterized in that: The heat dissipation housing comprises the heat dissipation back clip and the heat conductive back shell as described in any one of claims 1 to 8, and the liquid cooling membrane cooling plate of the heat dissipation back clip is attached to the outer surface of the heat conductive back shell.

10. An electronic device, characterized in that: The electronic device includes a middle frame, a mainboard, a heat-conducting back shell, and a heat dissipation back clip as described in any one of claims 1 to 8; the mainboard is arranged in the inner cavity of the middle frame, a heat source is provided on the mainboard, the heat-conducting back shell covers the back of the middle frame, the liquid-cooling diaphragm cooling plate of the heat-dissipating back clip is attached to the outer surface of the heat-conducting back shell, and the heat generated by the operation of the heat source is evenly conducted to the semiconductor refrigeration plate through the liquid-cooling diaphragm.

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