Heat dissipation shell, heat dissipation back splint and heat dissipation system

Abstract

The invention provides a heat dissipation shell which is used for heat dissipation of electronic equipment, a heat dissipation back splint comprises a protective shell, a phase change heat storage film and a vapor chamber, and the protective shell is connected to the back of the electronic equipment in a sleeving mode; the phase change heat storage film is arranged on the protective shell; the vapor chamber is stacked on the phase change heat storage film, and heat generated by operation of the electronic equipment is conducted to the phase change heat storage film after being vapor-heated through the vapor chamber. As the phase change heat storage film can absorb a large amount of heat and the temperature rise is not obvious, the heat storage capability of the heat dissipation shell is improved, the temperature rise rate of the heat dissipation shell is reduced, and the time of the electronic equipment in a low-temperature working environment is prolonged. The invention further provides the heat dissipation back splint and the electronic equipment.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular to a heat dissipation housing, a heat dissipation back clip and a heat dissipation system. Background Art

[0002] With the continuous development of the communications industry and AI technology, the functions of existing smart terminal devices such as mobile phones are becoming more and more diverse; while existing mobile phones provide users with richer gaming, imaging, AI and other experiences, the increased power consumption of mobile phones leads to more and more serious heating. Due to the limited internal space of the mobile phone, it is difficult to meet the heat dissipation needs of the mobile phone only through natural convection heat dissipation. At present, some mobile phones use accessories such as micro-pump liquid cooling protective cases and heat dissipation back clips to dissipate heat for the mobile phone. However, the existing micro-pump liquid cooling protective cases can only average the heat generated during the operation of the electronic equipment, and cannot improve the heat exchange efficiency between the electronic equipment and the external environment. As the operating time of the electronic equipment increases, the thermal experience of using the electronic equipment will significantly deteriorate. Summary of the invention

[0003] The present application provides a heat dissipation housing, a heat dissipation back clip and a heat dissipation system that are easy to use.

[0004] A heat dissipation shell provided in the present application is used to dissipate heat for electronic equipment. The heat dissipation back clip includes a protective shell, a phase change thermal storage film and a heat spreader. The protective shell is sleeved on the back of the electronic equipment; the phase change thermal storage film is arranged on the protective shell; the heat spreader is stacked on the phase change thermal storage film, and the heat generated by the operation of the electronic equipment is equalized by the heat spreader and then conducted to the phase change thermal storage film.

[0005] The present application also provides a heat dissipation back clip, which is connected to a heat dissipation shell or to the back of an electronic device. The heat dissipation shell includes a connecting seat, a semiconductor refrigeration sheet, a second wireless charging coil and a second circuit board, the semiconductor refrigeration sheet is arranged on the connecting seat; the second wireless charging coil is arranged on one side of the connecting seat; the second circuit board is arranged on the other side of the connecting seat, the second circuit board is electrically connected to the second wireless charging coil, the second wireless charging coil can sense the changes in the magnetic field generated by the wireless charging coil of the electronic device to generate a second current, and the second current is used to power the semiconductor refrigeration sheet.

[0006] The present application also provides a heat dissipation system, which is used to dissipate heat for electronic equipment. The heat dissipation system includes a heat dissipation shell and a heat dissipation back clip. The heat dissipation shell is sleeved on the back of the electronic equipment, and the heat dissipation back clip is connected to a side of the heat dissipation shell away from the electronic equipment.

[0007] The heat dissipation housing of the present application is sleeved on the back of the electronic device. After the heat generated by the operation of the electronic device passes through the heat pipe for heat equalization, it is conducted to the phase change heat storage film through contact. Since the phase change heat storage film has the characteristic of high heat storage density, the phase change heat storage film can absorb a large amount of heat while the temperature does not rise significantly, improving the heat storage capacity of the heat dissipation housing, reducing the heating rate of the heat dissipation housing, extending the time for the electronic device to operate in a low-temperature environment, and making the thermal experience of using the electronic device change little, thus improving the thermal experience of the user when using the electronic device. Description of the Drawings

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the implementation will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0009] Figure 1 It is a three-dimensional structure schematic diagram of the heat dissipation housing of one embodiment of the present application.

[0010] Figure 2 is Figure 1 a three-dimensional structure exploded schematic diagram of the heat dissipation housing in

[0011] Figure 3 is Figure 2 a further three-dimensional structure exploded schematic diagram of the heat dissipation housing in

[0012] Figure 4 is Figure 3 a further three-dimensional structure exploded schematic diagram of the heat dissipation housing in

[0013] Figure 5 is Figure 4 a further three-dimensional structure exploded schematic diagram of the heat dissipation housing in

[0014] Figure 6 is Figure 5 a three-dimensional structure schematic diagram of another perspective of the heat dissipation housing in

[0015] Figure 7 is Figure 1 a sectional view of one of the three-dimensional views of the heat dissipation housing in

[0016] Figure 8 is Figure 7 an enlarged view of part VIII in

[0017] Fig. 9 is Figure 1 a usage state diagram of the heat dissipation housing in

[0018] Fig.10It is a schematic diagram of the three-dimensional structure of a heat dissipation back clip according to one embodiment of the present application.

[0019] Fig.11 yes Fig.10 Schematic diagram of the three-dimensional structure of the heat dissipation back clip from another perspective.

[0020] Fig.12 yes Fig.10 Schematic diagram of the three-dimensional structural decomposition of the heat dissipation back clip.

[0021] Fig.13 yes Fig.11 Schematic diagram of the three-dimensional structural decomposition of the heat dissipation back clip.

[0022] Fig.14 yes Fig.12 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0023] Fig.15 yes Fig.13 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0024] Fig.16 yes Fig.14 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0025] Fig.17 yes Fig.15 Schematic diagram of further three-dimensional structural decomposition of the heat dissipation back clip.

[0026] Fig.18 yes Fig.10 The usage status diagram of the heat dissipation back clip.

[0027] Fig.19 It is a three-dimensional structural schematic diagram of a heat dissipation system in one embodiment of the present application.

[0028] Fig. 20 yes Fig.19 Schematic diagram of the three-dimensional structure of the heat dissipation system from another perspective.

[0029] Fig.21 yes Fig.19 Schematic diagram of the three-dimensional structural decomposition of the heat dissipation system.

[0030] Fig. 22 yes Fig. 20 Schematic diagram of the three-dimensional structure of the heat dissipation system from another perspective.

[0031] Fig.23 yes Fig.19 Schematic diagram of the use status of the cooling system in FIG.

[0032] Fig.24 yes Fig.23A schematic diagram of the side structure of the heat dissipation system;

[0033] Fig.25 is a side structural schematic diagram of a heat dissipation system in another embodiment of the present application;

[0034] Fig.26 It is a side structural schematic diagram of a heat dissipation system in another embodiment of the present application.

[0035] Main markings:

[0036] 100, heat dissipation system; 20, heat dissipation housing; 21, protective housing; 210, back plate; 2101, first receiving space; 2102, receiving groove; 2103, support portion; 2104, positioning groove; 2106, first groove; 2107, second groove; 211, installation space; 212, side wall; 213, end wall; 23, phase change thermal storage film; 232, first avoidance hole; 234, second avoidance hole; 24, heat plate; 242, first coating; 244, second coating; 245, circulation pump; 25, guide Thermal adhesive film; 26, first wireless charging coil; 262, first circuit board; 264, flexible circuit board; 27, first magnetic attraction; 40, heat dissipation back clip; 41, connecting seat; 410, first mounting slot; 411, second mounting slot; 412, first positioning plate; 413, positioning column; 414, positioning hole; 415, positioning flange; 416, card slot; 417, thermal conductive connecting plate; 418, fixing slot; 4182, connecting hole; 419, card slot; 42, semiconductor cooling plate; 43, second wireless charging coil ; 44, second circuit board; 442, through slot; 443, mounting hole; 45, second magnetic attraction member; 46, thermal pad; 47, radiator; 470, thermal substrate; 4720, ventilation slot; 4702, first fixing hole; 472, heat sink fin; 473, thermal wind shield; 4732, threading slot; 474, second receiving space; 48, fan assembly; 482, fan; 485, support frame; 4850, positioning portion; 4851, second positioning piece; 4852, connecting piece; 4855, support tube; 4 857. second fixing hole; 49. cover assembly; 490. covering shell; 491. peripheral wall; 4912. air outlet; 4914. clamping block; 492. cover plate; 4921. clamping column; 4922. air inlet; 4924. connecting ring groove; 4925. connecting arc piece; 496. protective frame; 4961. positioning ring; 4963. baffle; 4965. ventilation hole; 4966. clamping hole; 300. electronic device; 320. main board; 322. heat source; 330. battery; 350. wireless charging coil. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In addition, the following descriptions of the various embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] Please also read Figure 1-Figure 4 In one embodiment of the present invention, the heat dissipation housing 20 is used to dissipate heat for an electronic device, which has a wireless charging coil therein; the heat dissipation housing 20 comprises a protective housing 21, a phase change thermal storage film 23, a heat spreader 24 and a thermal conductive adhesive film 25, wherein the protective housing 21 is sleeved on the back of the electronic device; the phase change thermal storage film 23 is arranged on the protective housing, the heat spreader 24 is stacked on the phase change thermal storage film 23, and the thermal conductive adhesive film 25 is stacked on the side of the heat spreader 24 away from the phase change thermal storage film 23; the heat generated by the operation of the electronic device in the inner cavity of the protective housing 21 is transferred to the heat spreader 24 through the thermal conductive adhesive film 25. In this embodiment, the heat spreader 24 is a liquid-cooled membrane cold plate, and the heat flows with the heat conducting liquid of the heat spreader 24, so that the heat is quickly and evenly transferred to the entire heat spreader 24, so that the heat generated by the operation of the electronic device is transferred to the phase change thermal storage film 23 after being heated by the heat spreader 24, and the phase change thermal storage material in the phase change thermal storage film 23 can absorb a large amount of heat during the phase change process, effectively reducing the temperature generated by the electronic device during operation.

[0041] It should be noted that the heat dissipation housing 20 is sleeved on the back of the electronic device, and the heat dissipation housing 20 is used to dissipate heat from the heat source of the electronic device; the heat spreader 24 is made of a non-conductive polymer material, which can enhance the heat spread effect of the heat spreader 24. The heat spreader 24 can be, but is not limited to, a liquid cooling membrane heat spreader, an ultra-thin heat spreader, a semiconductor refrigeration sheet, etc. The phase change thermal storage film 23 selects materials with higher heat storage capacity, higher reliability, and lower cost to achieve better heat dissipation effect; specifically, the phase change thermal storage film 23 can be, but is not limited to, expanded graphite-based composite materials, microcapsule encapsulation materials, polyols and high-density polyethylene, paraffin, fatty acids and their derivatives, hydrated salts, molten salts, etc. The electronic device can be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a smart watch, a VR head-mounted display, a smart wearable device, etc., and the heat source can be, but is not limited to, a processor, an image sensor, a memory module, a radio frequency circuit, a screen display circuit, a WIFI module, a Bluetooth module, or a camera module, etc. The "connection" in the description of the embodiments of the present invention includes both direct connection and indirect connection. For example, the connection between A and B includes A and B being directly connected or connected through a third element C or more other elements. The connection also includes two situations: integrated connection and non-integrated connection. The integrated connection means that A and B are formed and connected as one body, and the non-integrated connection means that A and B are formed and connected as a non-integrated body.

[0042] The heat dissipation shell 20 of the present invention is sleeved on the back of the electronic device. When the heat generated by the operation of the electronic device is equalized by the heat spreader 24, it is conducted to the phase change thermal storage film 23 through contact. Since the phase change thermal storage film 23 has the characteristic of high heat storage density, the phase change thermal storage film 23 can absorb a large amount of heat without obvious temperature rise, thereby improving the heat storage capacity of the heat dissipation shell 20, reducing the heating rate of the heat dissipation shell 20, and extending the time that the electronic device is in a low-temperature working environment, so that the thermal experience of the electronic device does not change much, thereby improving the thermal experience of the user when using the electronic device.

[0043] like Figure 5 and Figure 6As shown, the heat dissipation housing 20 includes a back plate 210 and a peripheral wall arranged around the edge of the back plate 210. The back plate 210 and the peripheral wall form an installation space 211, and the installation space 211 is used to accommodate electronic equipment. In this embodiment, the back plate 210 is a rectangular plate, and the peripheral wall includes side walls 212 arranged on opposite side edges of the back plate 210 and end walls 213 arranged on opposite side edges of the back plate 210. The back plate 210, the two side walls 212 and the two end walls 213 form the installation space 211. The inner surface of the back plate 210 is provided with a first receiving space 2101, and the thermal conductive adhesive film 25 can be positioned in the first receiving space 2101; in this embodiment, the first receiving space 2101 is a rectangular groove, and the rectangular groove covers the entire inner surface of the back plate 210. The inner surface of the heat dissipation shell 20 is provided with a receiving groove 2102, and the phase change thermal storage film 23 and the heat spreader 24 are both accommodated in the receiving groove 2102; in this embodiment, the receiving groove 2102 is located on the inner surface of the back plate 210 in the first receiving space 2101, and the shape of the phase change thermal storage film 23 and the shape of the heat spreader 24 are consistent with the shape of the receiving groove 2102.

[0044] Optionally, the heat dissipation housing 20 further includes a first wireless charging coil 26, which is disposed in the protective housing 21. When the wireless charging coil of the electronic device accommodated in the installation space 211 generates a changing magnetic field, the first wireless charging coil 26 senses the change in the magnetic field to generate a first current, which is used to power the heat spreader 24. In this embodiment, the first wireless charging coil 26 is disposed at one end of the inner surface of the back plate 210, the area of ​​the wireless charging coil of the electronic device is larger than the area of ​​the first wireless charging coil 26, and the orthographic projection of the first wireless charging coil 26 on the surface of the wireless charging coil of the electronic device is located on the surface of the wireless charging coil. The first wireless charging coil 26 can be embedded in the interior of the back plate 210. In this embodiment, the heat dissipation housing 20 is provided with a support portion 2103 on the bottom surface of the receiving groove 2102. Specifically, the support portion 2103 is a circular block, and the first wireless charging coil 26 is disposed on the support portion 2103.

[0045] Optionally, the heat dissipation housing 20 further includes a first magnetic member 27, which can be embedded in the back plate 210, and the protective housing 21 is provided with a positioning groove 2104. In this embodiment, the positioning groove 2104 is provided on the inner surface of the back plate 210, and the first magnetic member 27 is positioned in the positioning groove 2104. Specifically, the positioning groove 2104 is provided on the outer periphery of the surface of the support portion 2103. In this embodiment, the first magnetic member 27 is a first magnetic ring, and the positioning groove 2104 is an annular groove. The first magnetic ring can be positioned in the annular groove, and the first wireless charging coil 26 is located in the inner cavity of the first magnetic ring. The inner circumference of the first magnetic ring is spaced from the outer circumference of the first wireless charging coil 26, and the surface of the first magnetic member 27, the surface of the first wireless charging coil 26 and the bottom surface of the receiving groove 2102 are coplanar. The phase-change thermal storage film 23 is provided with a first avoidance hole 232 . When the phase-change thermal storage film 23 is accommodated in the receiving groove 2102 , the support portion 2103 and the first magnetic attraction member 27 are accommodated in the first avoidance hole 232 .

[0046] In other embodiments, the support portion 2103 on the heat dissipation housing 20 can be omitted, the first magnetic member 27 is directly attached to the bottom surface of the receiving groove 2102, the first wireless charging coil 26 is accommodated in the inner cavity of the first magnetic member 27, the first wireless charging coil 26 is fixedly connected to the bottom surface of the receiving groove 2102, and the inner circumference of the first magnetic member 27 is spaced from the outer circumference of the first wireless charging coil 26. Optionally, an isolation ring is provided between the inner circumference of the first magnetic member 27 and the outer circumference of the first wireless charging coil 26. When the first magnetic member 27 and the first wireless charging coil 26 are positioned on the back plate 210, the surface of the first magnetic member 27, the surface of the first wireless charging coil 26 and the bottom surface of the receiving groove 2102 are coplanar.

[0047] Optionally, the heat dissipation housing 20 further includes a first circuit board 262 and a flexible circuit board 264, the first circuit board 262 is connected to the first wireless charging coil 26 through the flexible circuit board 264, and an avoidance groove is provided on the inner surface of the heat dissipation housing 20, and the first circuit board 262 and the flexible circuit board 264 are accommodated in the avoidance groove. In this embodiment, the back plate 210 is provided with an avoidance groove on the bottom surface of the receiving groove 2102, and the avoidance groove includes a first groove 2106 and a second groove 2107 connected to the first groove 2106, and the second groove 2107 extends to the support portion 2103 away from one end of the first groove 2106, and the first circuit board 262 is accommodated in the first groove 2106, and the flexible circuit board 264 is accommodated in the second groove 2107. A second avoidance hole 234 is also provided on the phase change thermal storage film 23, and when the phase change thermal storage film 23 is accommodated in the receiving groove 2102, the first circuit board 262 is directly opposite to the second avoidance hole 234.

[0048] In this embodiment, the heat spreader 24 is a liquid-cooled membrane cold conduction plate, which includes an intermediate plate, a first coating 242 covering one side of the intermediate plate, a second coating 244 covering the other side of the intermediate plate, and a circulating pump 245; the intermediate plate has a flow channel, the flow channel is filled with a heat transfer liquid, and the circulating pump 245 is operated to drive the heat transfer liquid to flow in the flow channel, so as to transfer heat evenly and quickly to the entire heat spreader 24. When the first coating 242 of the heat spreader 24 is attached to the phase change thermal storage film 23, the circulating pump 245 passes through the second avoidance hole 234 and is accommodated in the first groove 2106, and the circulating pump 245 is electrically connected to the first circuit board 262. When the circulating pump 245 is running, it can drive the heat transfer liquid in the flow channel to flow in the flow channel, and the flow rate is quickly transferred to the entire heat spreader 24 along with the heat transfer liquid in the flow channel, which quickly improves the conduction capacity of the heat spreader 24 of the heat dissipation housing 20 in the thickness direction and the plane direction, reduces the conduction impedance, and improves the heat dissipation effect.

[0049] like Figure 5-Figure 8 As shown, when assembling the heat dissipation housing 20, the first magnetic member 27 is installed in the positioning groove 2104 of the protective housing 21, and the first wireless charging coil 26 is placed on the support portion 2103, and the first wireless charging coil 26 is located in the inner cavity of the first magnetic member 27; the first circuit board 262 is positioned in the first groove 2106 of the protective housing 21, and the flexible circuit board 264 is accommodated in the second groove 2107; the phase change thermal storage film 23 is positioned in the receiving groove 2102 of the protective housing 21, The support portion 2103 is accommodated in the first avoidance hole 232, and the first circuit board 262 is opposite to the second avoidance hole 234; the first coating 242 of the heat spreader 24 is adhered to the surface of the phase change thermal storage film 23, so that the circulation pump 245 of the heat spreader 24 is electrically connected to the first circuit board 262, and the heat spreader 24 is accommodated in the receiving groove 2102; the thermal conductive adhesive film 25 is accommodated in the first receiving space 2101, so that the thermal conductive adhesive film 25 is adhered to the second coating 244 of the heat spreader 24.

[0050] like Figure 7-Figure 9As shown, when the heat dissipation shell 20 is used, the heat dissipation shell 20 is sleeved on the back of the electronic device 300. The electronic device 300 includes a shell, a main board 320, a battery 330, a display screen and a wireless charging coil 350. The display screen is arranged on the front of the shell and is electrically connected to the main board 320. The main board 320, the battery 330 and the wireless charging coil 350 are accommodated in the shell. The wireless charging coil 350 is close to the back of the shell. The main board 320 is also electrically connected to the battery 330 and the wireless charging coil 350. The battery 330 is used to supply power to the main board 320, the display screen and the wireless charging coil 350. A heat source 322 is provided on the main board 320. When the heat dissipation housing 20 is sleeved on the back of the electronic device 300, the first wireless charging coil 26 is directly opposite to the wireless charging coil 350. The heat generated by the heat source 322 of the electronic device 300 during operation is contacted and conducted to the heat spreader 24 through the thermal conductive adhesive film 25. At the same time, the electronic device 300 turns on the wireless reverse charging function to make the wireless charging coil 350 generate a changing magnetic field. The first wireless charging coil 26 senses the change in the magnetic field and generates a current to power the circulation pump of the heat spreader 24. The circulation pump operates to drive the heat-conducting liquid in the heat spreader 24 to flow in the flow channel, thereby quickly conducting heat from the hot zone to the cold zone, so that the heat is quickly evenly distributed to the entire heat spreader 24, and fast even temperature is achieved, so that the heat on the heat spreader 24 is efficiently conducted to the phase change thermal storage film 23. The phase change thermal storage film 23 can absorb a large amount of heat, thereby improving the heat storage capacity of the phase change thermal storage film 23, reducing the heating rate of the heat dissipation housing 20, extending the time that the electronic device 300 is in a low-temperature working environment, and improving the thermal experience of users using electronic devices. Secondly, compared with the prior art, the heat sink of the heat dissipation shell 20 needs to be powered by an external power supply, which is inconvenient for users to use the heat dissipation shell outdoors to dissipate heat for electronic devices; the heat dissipation shell 20 of the present invention cooperates with the wireless charging coil 350 of the electronic device 300 and the first wireless charging coil 26 in the heat dissipation shell 20 to generate current to power the heat sink 24, that is, the electronic device acts as a power source to power the heat dissipation shell 20 through wireless charging, which solves the problem of the need for an external power supply when the heat dissipation shell 20 is in operation, and realizes the effect of users using the portable heat dissipation shell 20 outdoors, which is easy to use.

[0051] like Figure 10-Figure 15As shown, the present invention further provides a heat dissipation back clip 40, which can be connected to the heat dissipation housing 20 of any of the above embodiments to dissipate heat for the electronic device together; or the heat dissipation back clip 40 is directly connected to the back of the electronic device to dissipate heat for the electronic device; the heat dissipation back clip 40 includes a connection seat 41, a semiconductor cooling plate 42, a second wireless charging coil 43 and a second circuit board 44; the semiconductor cooling plate 42 is arranged on the connection seat 41, the second wireless charging coil 43 is arranged on one side of the connection seat 41, the second circuit board 44 is arranged on the other side of the connection seat 41, the second circuit board 44 is electrically connected to the second wireless charging coil 43, and the second wireless charging coil 43 can sense the change of the magnetic field generated by the wireless charging coil of the electronic device to generate a second current, and the second current is used to power the semiconductor cooling plate 42. When the heat dissipation back clip 40 is connected to the back of the electronic device, the second wireless charging coil 43 of the heat dissipation back clip 40 is directly opposite to the wireless charging coil of the electronic device, that is, the orthographic projection of the second wireless charging coil 43 along its axial direction on the surface of the wireless charging coil of the electronic device is located within the range of the surface. When the heat dissipation back clip 40 is needed for heat dissipation, the mainboard of the electronic device controls the battery to power the wireless charging coil so that the wireless charging coil generates a changing magnetic field. The second wireless charging coil 43 senses the change in the magnetic field and generates a second current to power the semiconductor refrigeration chip 42, so that the semiconductor refrigeration chip 42 runs and cools, thereby dissipating the heat of the electronic device.

[0052] Compared with the semiconductor cooling plate of the heat dissipation back clip in the prior art, which needs to be powered by an external power supply, it is not convenient for users to use the heat dissipation back clip outdoors to dissipate heat for electronic devices; the heat dissipation back clip 40 of the present invention cooperates with the wireless charging coil of the electronic device 300 and the second wireless charging coil 43 in the heat dissipation back clip 40 to generate power for the semiconductor cooling plate 42, which solves the problem of the heat dissipation back clip 40 requiring an external power supply when running, realizes the outdoor portable use effect, and allows users to carry the heat dissipation back clip 40 outdoors to dissipate heat for electronic devices.

[0053] like Figure 16-17As shown, a first mounting groove 410 is provided on one side of the connection base 41, and the second wireless charging coil 43 is installed in the first mounting groove 410. A second mounting groove 411 is provided on the other side of the connection base 41, and the semiconductor cooling plate 42 is installed in the second mounting groove 411. Specifically, the connection base 41 is disc-shaped, and the second mounting groove 411 is located in the middle of the surface of the connection base 41 facing the second circuit board 44. In this embodiment, the second mounting groove 411 is a rectangular groove. In other embodiments, the second mounting groove 411 can also be but not limited to a circular groove, a polygonal groove, an elliptical groove, etc. A plurality of first positioning pieces 412 are protruding from the edge of the second mounting groove 411 on the surface of the connection base 41 facing the second circuit board 44, and the semiconductor cooling plate 42 is accommodated in the second mounting groove 411, and a plurality of first positioning pieces 412 are arranged around the outer peripheral surface of the semiconductor cooling plate 42. A plurality of positioning posts 413 are provided around the second mounting groove 411 on the surface of the connection base 41 facing the second circuit board 44. The plurality of positioning posts 413 are respectively close to the outer periphery of the connection base 41. Each positioning post 413 is provided with a positioning hole 414 along its axial direction. In this embodiment, four positioning posts 413 are provided around the second mounting groove 411 on the surface of the connection base 41 facing the second circuit board 44. The four positioning posts 413 are respectively close to the outer periphery of the connection base 41. A positioning flange 415 is provided on the surface of the connection base 41 facing the second circuit board 44. The positioning flange 415 is close to the periphery of the connection base 41 and is arranged in a circle around the circumference of the connection base 41. A plurality of card slots 416 are provided on the positioning flange 415. The plurality of card slots 416 are arranged in a circle along the circumference of the positioning flange 415 at intervals. In this embodiment, eight card slots 416 are provided on the positioning flange 415. The eight card slots 416 are evenly arranged in a circle along the circumference of the positioning flange 415.

[0054] Specifically, the first mounting groove 410 is located in the middle of the surface of the connection base 41 away from the second circuit board 44, the first mounting groove 410 is connected to the second mounting groove 411, the first mounting groove 410 is a circular groove, and the second wireless charging coil 43 is accommodated in the first mounting groove 410. The connection base 41 is provided with a heat-conducting connecting plate 417 between the first mounting groove 410 and the second mounting groove 411, that is, the heat-conducting connecting plate 417 is located between the first mounting groove 410 and the second mounting groove 411. The heat dissipation back clip 40 also includes a second magnetic suction member 45, which is arranged on a side of the connection base 41 close to the second wireless charging coil 43, and the second magnetic suction member 45 and the second wireless charging coil 43 are spaced apart from each other. Specifically, the surface of the connection base 41 away from the second circuit board 44 is provided with a fixing groove 418 on the outer periphery of the first mounting groove 410, and the second magnetic suction member 45 is positioned in the fixing groove 418; the connection base 41 forms an isolation ring between the first mounting groove 410 and the fixing groove 418. The connection base 41 is provided with a plurality of connection holes 4182 on the bottom surface of the fixing groove 418, and the plurality of connection holes 4182 are arranged in a circle around the circumference of the fixing groove 418. In this embodiment, the bottom surface of the fixing groove 418 is provided with four connection holes 4182, and the four connection holes 4182 are respectively opposite to the positioning holes 414 of the plurality of positioning pillars 413. In this embodiment, the second magnetic member 45 is an annular magnetic sheet, and the fixing groove 418 is an annular groove. The annular magnetic sheet can be positioned in the annular groove, and the isolation ring can isolate the second magnetic member 45 from the second wireless charging coil 43.

[0055] In other embodiments, the first mounting groove 410 may also be but not limited to a rectangular groove, a polygonal groove or an elliptical groove, etc., and the second wireless charging coil 43 may be but not limited to a rectangular wireless charging coil, a polygonal wireless charging coil or an elliptical wireless charging coil; the fixing groove 418 may also be but not limited to a rectangular groove, a polygonal groove or an elliptical groove, etc., and the second magnetic attraction member 45 may be but not limited to a rectangular magnetic ring, a polygonal magnetic ring or an elliptical magnetic ring, etc.

[0056] Optionally, the heat dissipation back clip 40 further includes a thermal pad 46, which is disposed on the side of the connection seat 41 away from the semiconductor cooling sheet 42, and the thermal pad 46 contacts the semiconductor cooling sheet 42. Specifically, a clamping groove 419 is provided on the surface of the connection seat 41 away from the second circuit board 44, the clamping groove 419 is connected to the fixing groove 418 and the first mounting groove 410, and the thermal pad 46 is positioned in the clamping groove 419. In this embodiment, the clamping groove 419 is a circular groove, and the thermal pad 46 is a circular thermally conductive silicone pad, which is positioned in the clamping groove 419; the axis of the clamping groove 419, the axis of the fixing groove 418 and the axis of the first mounting groove 410 are collinear, the diameter of the clamping groove 419 is greater than the diameter of the fixing groove 418, and the diameter of the fixing groove 418 is greater than the diameter of the first mounting groove 410.

[0057] like Fig.16 and Fig.17 As shown, a through slot 442 is provided in the middle of the second circuit board 44, and the semiconductor cooling sheet 42 is accommodated in the through slot 442; in this embodiment, the through slot 442 is a rectangular slot, and the opening area of ​​the rectangular slot is larger than the opening area of ​​the second mounting slot 411. When the second circuit board 44 is placed on the surface of the connecting seat 41 provided with the second mounting slot 411, the four first positioning pieces 412 are respectively accommodated in the through slot 442, and the first positioning pieces 412 are attached to the inner circumference of the through slot 442. A plurality of mounting holes 443 are provided on the second circuit board 44, and the plurality of mounting holes 443 are located around the through slot 442, and the plurality of mounting holes 443 are respectively opposite to the positioning holes 414 of the plurality of positioning columns 413. Specifically, the second circuit board 44 is a circular circuit board, and the diameter of the second circuit board 44 is less than or equal to the inner diameter of the positioning flange 415, so that the second circuit board 44 can be accommodated in the inner cavity of the positioning flange 415. A plurality of electronic devices are provided on the second circuit board 44.

[0058] Optionally, the heat dissipation back clip 40 further includes a heat sink 47, a fan assembly 48 and a cover assembly 49. The heat sink 47 can be connected to the connection seat 41 so that the heat sink 47 contacts the semiconductor cooling sheet 42. The semiconductor cooling sheet 42 conducts heat to the heat sink 47. The cold air generated by the fan 482 exchanges heat with the heat sink 47 and then is discharged from the heat dissipation back clip 40. The cold air generated by the semiconductor cooling sheet 42 is conducted to the heat dissipation housing 20 or the back of the electronic device. Specifically, the heat sink 47 includes a heat conductive substrate 470, a plurality of heat dissipation fins 472 and two heat conductive wind shields 473. The plurality of heat dissipation fins 472 are respectively disposed at opposite ends of one surface of the heat conductive substrate 470, and the two heat conductive wind shields 473 are respectively disposed at opposite sides of the heat conductive substrate 470. A second receiving space 474 is provided on the side of the radiator 47 facing away from the semiconductor refrigeration plate 42, and the fan assembly 48 is accommodated in the second receiving space 474; two heat-conducting wind shields 473 and heat dissipation fins 472 surround the second receiving space 474, and a ventilation groove 4720 is provided between each two adjacent heat dissipation fins 472, and the ventilation groove 4720 is connected to the second receiving space 474; the fan assembly 48 is accommodated in the second receiving space 474 to reduce the overlapping thickness of the fan assembly 48 and the radiator 47. In this embodiment, the heat-conducting substrate 470 is a rectangular plate, wherein a portion of the heat-dissipating fins 472 are disposed at one end of one surface of the heat-conducting substrate 470 at intervals, and another portion of the heat-dissipating fins 472 are disposed at the other end of one surface of the heat-conducting substrate 470 at intervals, and two heat-conducting wind shields 473 are disposed at opposite side edges of the heat-conducting substrate 470, respectively; each heat-dissipating fin 472 is parallel to the length direction of the heat-conducting substrate 470, and the length direction of the ventilation slot 4720 between each two adjacent heat-dissipating fins 472 is parallel to the length direction of the heat-conducting substrate 470. A plurality of first fixing holes 4702 are disposed on the surface of the heat-conducting substrate 470 away from the heat-dissipating fins 472, and the plurality of first fixing holes 4702 are respectively opposite to the plurality of mounting holes 443 on the second circuit board 44. In this embodiment, four first fixing holes 4702 are disposed on the surface of the heat-conducting substrate 470 away from the heat-dissipating fins 472, and the four first fixing holes 4702 are respectively located at the four corners of the heat-conducting substrate 470. One of the heat conduction wind shielding plates 473 of the heat sink 47 is provided with a threading slot 4732 communicating with the second receiving space 474. Optionally, opposite ends of the plurality of heat dissipation fins 472 at the same end of the heat conduction substrate 470 are respectively formed into arc shapes.

[0059] It is understandable that the heat sink 47 can be made of heat dissipation materials such as but not limited to aluminum, copper, and high thermal conductivity polymers; the heat sink 47 can be a heat sink of aluminum extrusion, die casting, shovel teeth, slotted teeth, etc., which is thinned by the thermal conductive substrate 470, or a lighter buckled thin metal sheet heat sink, or a heat sink made of a high thermal conductivity polymer material. In other embodiments, the thermal conductive substrate 470 can be but not limited to a circular sheet, an elliptical sheet, a polygonal sheet, etc., and a plurality of heat dissipation fins are arranged around the thermal conductive substrate 470 at intervals, and these heat dissipation fins enclose a receiving space.

[0060] The fan assembly 48 includes a fan 482 and a support frame 485, the fan 482 is connected to the support frame 485, and the support frame 485 and the fan 482 are accommodated in the second receiving space 474. The support frame 485 includes a positioning portion 4850 and a support tube 4855 connected to the positioning portion 4850, and one end of the support tube 4855 away from the positioning portion 4850 is connected to the fan 482. Since the support frame 485 and the fan 482 are both accommodated in the second receiving space 474, the support frame 485 and the fan 482 will not increase the thickness of the radiator 47. Specifically, the positioning portion 4850 includes a second positioning piece 4851 and a connecting piece 4852, the connecting piece 4852 is connected to the edge of the second positioning piece 4851, the connecting piece 4852 is parallel to the second positioning piece 4851, and the support tube 4855 is connected to the middle part of the second positioning piece 4851; in this embodiment, the second positioning piece 4851 is a circular piece, and the outer peripheral surface of the circular piece is connected to a plurality of connecting pieces 4852, and the plurality of connecting pieces 4852 are evenly spaced and arranged in a circle around the circumference of the circular piece; the support tube 4855 is a support tube, one end of which supports the fan 482, and the other end of the support tube is connected to the middle part of the second positioning piece 4851, and the axis of the support tube is collinear with the axis of the second positioning piece 4851; a second fixing hole 4857 is provided at one end of each connecting piece 4852 away from the second positioning piece 4851.

[0061] The cover assembly 49 includes a cover shell 490 and a protection frame 496. The cover shell 490 is connected to the side of the connection seat 41 away from the thermal pad 46. The heat sink 47 is accommodated in the inner cavity of the cover shell 490. The cover shell 490 includes an outer peripheral wall 491 and a cover plate 492. The cover plate 492 is connected to one end of the outer peripheral wall 491 away from the connection seat 41. The outer peripheral wall 491 and the cover plate 492 surround the inner cavity of the cover shell 490. The cover plate 492 is provided with an air inlet 4922, and the air inlet 4922 is connected to the inner cavity of the cover shell 490. In this embodiment, the air inlet 4922 is a circular opening located in the middle of the cover plate 492; the outer peripheral wall 491 is provided with an air outlet 4912, and the air outlet 4912 is connected to the inner cavity of the cover shell 490. In this embodiment, the outer peripheral wall 491 is a cylinder, and the cover plate 492 is a circular plate, and the outer peripheral edge of the circular plate is connected to the edge of one end of the cylinder. Two air outlets 4912 are provided on the peripheral wall 491, and the two air outlets 4912 are located at opposite ends of the radial direction of the peripheral wall 491. When the cover shell 490 covers the radiator 47, the two air outlets 4912 are respectively opposite to the ventilation slots 4720 of the heat dissipation fins 472, and the cover shell 490 covers the fan 482 and the radiator 47 to play a protective role. Since the air inlet 4922 is located in the middle of the cover plate 492, and the air outlet 4912 is located on the peripheral wall 491, the air inlet 4922 and the air outlet 4912 are respectively located at different positions of the cover shell 490, and the interval between the air inlet 4922 and the air outlet 4912 is large, which can prevent the hot air discharged from the air outlet 4912 from flowing back to the air inlet 4922, thereby improving the heat dissipation effect.

[0062] In other embodiments, more than three air outlets 4912 are formed on the outer peripheral wall 491 , and the more than three air outlets 4912 are evenly spaced and arranged in a circle around the circumference of the outer peripheral wall 491 .

[0063] The inner surface of the cover plate 492 is provided with a circle of connecting ring grooves 4924 around the air inlet 4922, and the outer peripheral edge of the protection frame 496 is snap-fitted to the connecting ring grooves 4924; the cover plate 492 is provided with a clamping column 4921 on the inner bottom surface of the connecting ring groove 4924, and the clamping column 4921 can be snap-fitted to the protection frame 496. In this embodiment, the cover plate 492 is provided with a plurality of clamping columns 4921 on the inner bottom surface of the connecting ring groove 4924, and the plurality of clamping columns 4921 are arranged in a circle around the circumference of the connecting ring groove 4924. The inner surface of the cover plate 492 is provided with a connecting arc piece 4925 around the air inlet 4922, and the connecting arc piece 4925 is used to connect to the support frame 485; in this embodiment, the inner surface of the cover plate 492 is provided with two connecting arc pieces 4925 around the air inlet 4922, and the two connecting arc pieces 4925 are located at opposite ends of the radial direction of the air inlet 4922; each connecting arc piece 4925 is provided with a locking hole 4926. A plurality of clamping blocks 4914 are provided on the side of the inner circumference of the outer peripheral wall 491 away from the cover plate 492, and the plurality of clamping blocks 4914 are arranged in a circle at intervals around the circumference of the outer peripheral wall 491; in this embodiment, eight clamping blocks 4914 are provided on the side of the inner circumference of the outer peripheral wall 491 away from the cover plate 492, and the eight clamping blocks 4914 are evenly arranged in a circle around the circumference of the outer peripheral wall 491.

[0064] The protection frame 496 faces the fan 482 to protect the fan 482. Specifically, the protection frame 496 includes a positioning ring 4961 and a baffle 4963 connected to the positioning ring 4961. The positioning ring 4961 can be snapped into the connecting ring groove 4924 of the cover plate 492. The baffle 4963 is provided with a plurality of ventilation holes 4965, which are arranged at intervals around the circumference of the positioning ring 4961. In this embodiment, the baffle 4963 is provided with four ventilation holes 4965, which are evenly spaced and arranged in a circle around the circumference of the positioning ring 4961. The positioning ring 4961 is provided with a clamping hole 4966, and the clamping column 4921 of the cover shell 490 can be snapped into the clamping hole 4966. In this embodiment, the positioning ring 4961 is provided with a plurality of latching holes 4966 , and the plurality of latching holes 4966 are arranged in a circle around the circumference of the positioning ring 4961 , and the plurality of latching columns 4921 can be respectively latched in the plurality of latching holes 4966 .

[0065] When assembling the heat dissipation back clip 40, place the semiconductor cooling sheet 42 in the second mounting groove 411 of the connection seat 41, so that the semiconductor cooling sheet 42 contacts the heat-conducting connection plate 417; place the second circuit board 44 on the connection seat 41, so that the first positioning sheet 412 is inserted into the through groove 442 and the first positioning sheet 412 abuts against the inner circumference of the through groove 442, and the four mounting holes 443 of the second circuit board 44 are respectively opposite to the positioning holes 414 of the four positioning columns 413 of the connection seat 41; place the heat sink 47 on the side of the second circuit board 44 away from the connection seat 41, so that the semiconductor cooling sheet 42 is attached to the back of the heat-conducting substrate 470. The surface of the heat sink 472 is separated from the heat sink 472, so that the four first fixing holes 4702 of the heat sink 47 are respectively opposite to the four mounting holes 443 of the second circuit board 44; four locking members such as screws are respectively passed through the four connecting holes 4182 of the connecting seat 41 and the four mounting holes 443 of the second circuit board 44 and are respectively locked in the four first fixing holes 4702 of the heat sink 47, so that the semiconductor cooling sheet 42, the second circuit board 44 and the heat sink 47 are fixedly connected to the connecting seat, the cold side of the semiconductor cooling sheet 42 contacts the heat-conducting connecting plate 417, and the hot side of the semiconductor cooling sheet 42 contacts the heat sink 47; the second magnetic attraction member 45 is fixed The second wireless charging coil 43 is positioned in the fixing groove 418 of the connecting base 41, and the thermal pad 46 is positioned in the clamping groove 419 of the connecting base 41; the positioning ring 4961 of the protection frame 496 is clamped in the connecting ring groove 4924 of the covering shell 490, so that the multiple clamping columns 4921 of the covering shell 490 are respectively clamped in the multiple clamping holes 4966 of the protection frame 496; the fan 482 is connected to the support tube 4855 of the support frame 485, and the fan 482 is placed between the two connecting arc pieces 4925 of the covering shell 490, and the support frame 485 is placed between the two connecting arc pieces 4925. On the arc piece 4925, a locking piece such as a screw passes through the second fixing hole 4857 and is connected to the locking hole 4926, so that the fan assembly 48 is connected to the covering shell 490; the covering assembly 49 is covered on the radiator 47, so that the positioning flange 415 is against the inner circumference of the outer wall 491 of the covering shell 490, so that the eight clamping blocks 4914 are respectively clamped in the eight clamping grooves 416 of the connecting seat 41, so that the fan assembly 48 and the covering assembly 49 are connected to the connecting seat 41, and the fan assembly 48 is accommodated in the second receiving space 474 of the radiator 47, and the air outlet 4912 is opposite to the ventilation slot 4720 of the radiator 47.

[0066] like Figure 16-18As shown, when the heat dissipation back clip 40 is used, the heat dissipation back clip 40 is connected to the back of the electronic device 300. The heat dissipation back clip 40 and the electronic device 300 can be connected by, but not limited to, magnetic connection, adhesive connection, etc.; the second wireless charging coil 43 is facing the wireless charging coil 350, and the electronic device 300 turns on the wireless reverse charging function so that the wireless charging coil 350 generates a changing magnetic field. The second wireless charging coil 43 senses the change in the magnetic field and generates a second current. The second current supplies power to the semiconductor cooling sheet 42, the fan 482 and the second circuit board 44, thereby realizing wireless charging. The electric coil supplies power to the heat dissipation back clip; the second circuit board 44 controls the cold energy generated by the semiconductor refrigeration plate 42 to be transferred to the back of the electronic device 300 via the thermal pad 46, thereby cooling the electronic device 300; the heat generated by the semiconductor refrigeration plate 42 is transferred to the radiator 47 via the thermal connection plate 417. At the same time, the second circuit board 44 controls the fan 482 to draw outside air from the ventilation holes 4965 through the ventilation slots 4720 of the radiator 47. The outside air is discharged from the air outlet 4912 after heat exchange with the heat dissipation fins 472 of the radiator 47.

[0067] The semiconductor cooling plate 42 of the heat dissipation back clip 40 of the present invention can quickly cool down the back of the electronic device 300. At the same time, the heat generated by the semiconductor cooling plate 42 can be quickly and efficiently dissipated to the external environment through the cooperation of the radiator 47 and the fan 482, thereby improving the heat dissipation efficiency. Secondly, compared with the heat dissipation back clip in the prior art, which needs to be powered by an external power supply, it is inconvenient for users to use the heat dissipation back clip outdoors to dissipate heat for electronic devices. The heat dissipation back clip 40 of the present invention cooperates with the wireless charging coil 350 of the electronic device 300 and the second wireless charging coil 43 in the heat dissipation back clip 40 to generate power for the semiconductor cooling plate 42, the fan 482 and the second circuit board 44, thereby solving the problem of the need for an external power supply when the heat dissipation back clip 40 is in operation, and the effect of the user using the portable heat dissipation back clip 40 outdoors is achieved, which is convenient to use.

[0068] like Figure 5 and Figure 16-Figure 24As shown, the present invention also provides a heat dissipation system 100, which is used to dissipate heat for an electronic device 300. The heat dissipation system 100 includes a heat dissipation shell 20 as described in any one of the above embodiments and a heat dissipation back clip 40 as described in any one of the above embodiments. The heat dissipation shell 20 is sleeved on the back of the electronic device 300, and the heat dissipation back clip 40 is connected to the heat dissipation shell 20. When the heat dissipation system 100 is used to dissipate heat for the electronic device 300, the heat dissipation shell 20 is mounted on the back of the electronic device 300. The heat generated by the operation of the electronic device 300 is transferred to the phase change thermal storage film 23 via the thermal conductive adhesive film 25 and the heat spreader 24. The phase change thermal storage film 23 can absorb a large amount of heat. The heat on the phase change thermal storage film 23 is transferred to the protective shell 21. Therefore, the heat dissipation shell 20 plays a role in temperature equalization and heat storage. At the same time, the cold energy generated by the semiconductor refrigeration plate 42 of the heat dissipation back clip 40 is transferred to the protective shell 21 via the thermal conductive pad 46, thereby cooling the electronic device 300. The heat dissipation back clip 40 plays a role in rapid cooling through the semiconductor refrigeration plate 42. The heat generated by the operation of the semiconductor refrigeration plate 42 is transferred to the radiator 47, and the heat on the radiator 47 is discharged to the external environment through the fan 482, thereby quickly and efficiently dissipating heat for the electronic device 300.

[0069] The power supply of the heat dissipation shell 20 and the heat dissipation back clip 40 of the heat dissipation system 100 of the present application is all realized through the wireless reverse charging function of the electronic device 300. Specifically, when the wireless reverse charging function of the electronic device 300 is turned on, the wireless charging coil 350 of the electronic device 300 generates a changing magnetic field, and the first wireless charging coil 26 senses the change in the magnetic field to generate a first current to power the heat spreader 24. At the same time, the second wireless charging coil 43 senses the change in the magnetic field to generate a second current to power the semiconductor refrigeration plate 42. Therefore, the problem of requiring an external power supply when using the heat dissipation system 100 is solved, which makes it convenient for users to carry the heat dissipation system 100 with them outdoors to dissipate heat for the electronic device 300, thereby achieving the outdoor portable use effect, further improving the temperature uniformity and heat dissipation efficiency of the electronic device 300 during use, and enhancing the thermal experience of users.

[0070] like Fig.24As shown, the area of ​​the wireless charging coil 350 of the electronic device 300 is larger than the area of ​​the first wireless charging coil 26 and the area of ​​the second wireless charging coil 43, and the wireless charging coil 26 can completely cover the first wireless charging coil 26 and the second wireless charging coil 43; specifically, the orthographic projection of the first wireless charging coil 26 along its axial direction on one of the surfaces of the wireless charging coil 350 of the electronic device 300 forms a first projection area, and the orthographic projection of the second wireless charging coil 43 along its axial direction on the one of the surfaces of the wireless charging coil 26 of the electronic device 300 forms a second projection area, and the first projection area and the second projection area are staggered with each other. That is, the first projection area is formed by the orthographic projection of the first wireless charging coil 26 on the surface of the wireless charging coil 350 along its axial direction, and the second projection area is formed by the orthographic projection of the second wireless charging coil 43 on the surface of the wireless charging coil 350 along its axial direction. The first projection area and the second projection area are located on the same surface of the wireless charging coil 350, and the first projection area and the second projection area are staggered with each other, so that the wireless charging coil 350 of the electronic device 300 can simultaneously power the first wireless charging coil 26 and the second wireless charging coil 43. Therefore, the power supply of the heat dissipation housing 20 and the heat dissipation back clip 40 of the heat dissipation system 100 is realized by wireless reverse charging of the wireless charging coil 350 of the electronic device 300, without the need for an external power supply, which is convenient for users to use outdoors.

[0071] Optionally, the first magnetic attraction member 27 of the heat dissipation housing 20 and the second magnetic attraction member 45 of the heat dissipation back clip 40 are mutually attracted to position the heat dissipation back clip 40 at the back of the heat dissipation housing 20. The heat dissipation back clip 40 is detachably connected to the heat dissipation housing 20. According to the heat generation of the electronic device 300, the user can select only the heat dissipation housing 20 to dissipate heat for the electronic device 300, select only the heat dissipation back clip 40 to dissipate heat for the electronic device 300, or select a combination of the heat dissipation housing 20 and the heat dissipation back clip 40 to dissipate heat for the electronic device 300, which is convenient to use and simple to operate.

[0072] like Fig.25As shown, the structure of the heat dissipation system in another embodiment of the present application is similar to the structure of the heat dissipation system in any of the above embodiments, except that the heat dissipation back clip 40a of the heat dissipation system in another embodiment omits the second wireless charging coil 43 on the basis of the heat dissipation back clip 40 of the above heat dissipation system 100, and a feeding point is provided between the heat dissipation housing 20a and the heat dissipation back clip 40a, so that the first circuit board 262 of the heat dissipation housing 20a is electrically connected to the second circuit board 44 of the heat dissipation back clip 40a. When the heat dissipation system is used to dissipate heat from electronic equipment, the wireless charging coil 350 generates a changing magnetic field, and the first wireless charging coil 26 senses the change in the magnetic field and generates power to the heat spreader 24 to drive the heat transfer liquid in the heat spreader 24 to flow in the flow channel; at the same time, the current generated by the first wireless charging coil 26 supplies power to the second circuit board 44, the semiconductor cooling plate 42 and the fan 482 through the feeding point, and the second circuit board 44 controls the operation of the semiconductor cooling plate 42 and the fan 482.

[0073] The heat dissipation system in this embodiment omits the second wireless charging coil, reduces the number of wireless coils, saves manufacturing costs, and avoids the second wireless charging coil from occupying space, which is not only beneficial to the layout of other electronic devices, but also beneficial to the miniaturization of the heat dissipation system. The heat dissipation path and heat dissipation effect of the heat dissipation system in this embodiment are the same as those of the heat dissipation system in any of the above embodiments, and will not be repeated here.

[0074] like Fig.26 As shown, the structure of the heat dissipation system in another embodiment of the present application is similar to the structure of the heat dissipation system in any of the above embodiments, except that the heat dissipation housing 20b of the heat dissipation system in another embodiment omits the first wireless charging coil 26 on the basis of the heat dissipation housing 20 of the above heat dissipation system 100, and a feeding point is provided between the heat dissipation housing 20b and the heat dissipation back clip 40b, so that the first circuit board 262 of the heat dissipation housing 20b is electrically connected to the second circuit board 44 of the heat dissipation back clip 40b. When the heat dissipation system is used to dissipate heat for electronic equipment, the wireless charging coil 350 generates a changing magnetic field, and the second wireless charging coil 43 senses the change in the magnetic field to generate power for the second circuit board 44, the semiconductor cooling plate 42 and the fan 482, and the second circuit board 44 controls the operation of the semiconductor cooling plate 42 and the fan 482; so as to drive the heat transfer liquid in the heat spreader 24 to flow in the flow channel; at the same time, the current generated by the second wireless charging coil 43 supplies power to the first circuit board and the heat spreader 24 through the feeding point, and the first circuit board controls the operation of the heat spreader 24.

[0075] The heat dissipation system in this embodiment omits the first wireless charging coil, reduces the number of wireless coils, saves manufacturing costs, and avoids the first wireless charging coil from occupying space, which is not only beneficial to the layout of other electronic devices, but also beneficial to the miniaturization of the heat dissipation system. The heat dissipation path and heat dissipation effect of the heat dissipation system in this embodiment are the same as those of the heat dissipation system in any of the above embodiments, and will not be repeated here.

[0076] The above is an implementation of the embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A heat dissipation housing for dissipating heat from electronic equipment, characterized in that: The heat dissipation housing comprises: A protective shell, the protective shell being sleeved on the back of the electronic device; A phase-change thermal storage film, wherein the phase-change thermal storage film is disposed in the protective shell; and A vapor chamber is stacked on the phase-change thermal storage film. Heat generated by the operation of the electronic device is then transferred to the phase-change thermal storage film after being diffused by the vapor chamber.

2. The heat dissipation housing according to claim 1, characterized in that: The electronic device includes a wireless charging coil, and the heat dissipation shell also includes a first wireless charging coil, which is arranged in the protective shell. The wireless charging coil of the electronic device generates a changing magnetic field, and the first wireless charging coil senses the change of the magnetic field to generate a first current, and the first current is used to power the heat spreader.

3. The heat dissipation housing according to claim 1, characterized in that: The heat dissipation housing further includes a first magnetic attraction member, the protective housing is provided with a positioning groove, the first magnetic attraction member is positioned in the positioning groove, the phase change thermal storage film is provided with a first avoidance hole, and the first magnetic attraction member is accommodated in the first avoidance hole.

4. The heat dissipation housing according to claim 3, characterized in that: The inner surface of the heat dissipation shell is provided with a receiving groove, the phase change heat storage film and the heat spreader are accommodated in the receiving groove, the heat dissipation shell is provided with a supporting part on the bottom surface of the receiving groove, the positioning groove is provided in the supporting part, and the supporting part is accommodated in the first avoidance hole.

5. The heat dissipation housing according to claim 2, characterized in that: The heat dissipation housing further includes a first circuit board and a flexible circuit board, the first circuit board is connected to the first wireless charging coil via the flexible circuit board, an inner surface of the heat dissipation housing is provided with a avoidance groove, the first circuit board and the flexible circuit board are accommodated in the avoidance groove.

6. A heat dissipation back clip, characterized in that: The heat dissipation back clip is connected to the heat dissipation housing according to any one of claims 1 to 5, or the heat dissipation back clip is connected to the back of the electronic device, and the heat dissipation back clip includes: Connecting seat; A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet is arranged on the connecting seat; a second wireless charging coil, the second wireless charging coil being disposed on one side of the connecting base; and A second circuit board, the second circuit board is arranged on the other side of the connecting socket, the second circuit board is electrically connected to the second wireless charging coil, the second wireless charging coil can sense the change of the magnetic field generated by the wireless charging coil of the electronic device to generate a second current, and the second current is used to power the semiconductor refrigeration plate.

7. The heat dissipation back clip according to claim 6, characterized in that: A first mounting groove is provided on one side of the connection base, and the second wireless charging coil is installed in the first mounting groove. A second mounting groove is provided on the other side of the connection base, and the semiconductor cooling plate is installed in the second mounting groove.

8. The heat dissipation back clip according to claim 6, characterized in that: The heat dissipation back clip also includes a second magnetic attraction component, which is arranged on a side of the connecting base close to the second wireless charging coil, and the second magnetic attraction component and the second wireless charging coil are spaced apart from each other.

9. The heat dissipation back clip according to claim 6, characterized in that: The heat dissipation back clip also includes a heat sink and a fan. The second circuit board is located between the heat sink and the connection seat. The second circuit board is provided with a through slot, and the semiconductor cooling sheet is accommodated in the through slot. The heat sink is in contact with the semiconductor cooling sheet, and the semiconductor cooling sheet conducts heat to the heat sink. The cold air generated by the fan is discharged from the heat dissipation back clip after heat exchange with the heat sink. The cold energy generated by the semiconductor refrigeration sheet is conducted to the heat dissipation housing or the back of the electronic device.

10. The heat dissipation back clip according to claim 6, characterized in that: The heat dissipation back clamp also includes a heat-conducting connecting plate and a heat-conducting pad. The heat-conducting connecting plate contacts the surface of the semiconductor refrigeration plate facing away from the heat sink. The heat-conducting pad is arranged on the side of the connecting seat facing away from the semiconductor refrigeration plate. The semiconductor refrigeration plate contacts the heat-conducting connecting plate.

11. A heat dissipation system, which is used to dissipate heat for electronic equipment, characterized in that: The heat dissipation system includes a heat dissipation shell as described in any one of claims 1-5 and a heat dissipation back clip as described in any one of claims 6-10, wherein the heat dissipation shell is sleeved on the back of the electronic device, and the heat dissipation back clip is connected to a side of the heat dissipation shell away from the electronic device.

12. The heat dissipation system according to claim 11, characterized in that: The first magnetic attraction component of the heat dissipation shell and the second magnetic attraction component of the heat dissipation back clip are attracted to each other, so that the heat dissipation back clip is positioned on the heat dissipation shell.

13. The heat dissipation system according to claim 12, characterized in that: The first wireless charging coil forms a first projection area on one surface of the wireless charging coil of the electronic device along its axial direction, and the second wireless charging coil forms a second projection area on one surface of the wireless charging coil of the electronic device along its axial direction, and the first projection area and the second projection area are spaced apart from each other.

Images