Front light display and indicator with uniform brightness

Abstract

Systems, methods, and devices are disclosed for front-light displays with uniform brightness. In one embodiment, an example display may include an electrophoretic display, a light guide configured to guide light from one or more light emitting diodes, and a cover lens assembly. The cover lens assembly may include a cover glass layer, an anti-glare film coupled to the cover glass layer, and a hot melt adhesive disposed around side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a perimeter of the cover lens assembly.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application is an international application of U.S. application No. 17 / 935,758, filed on September 27, 2022, and claims the benefit of that application, the entire contents of which are incorporated herein by reference. Background Art

[0003] An electronic device may include a display that presents information to a user. The thickness of the display may affect the overall thickness of the electronic device, and thus a thinner display may be used to form a thinner electronic device. In addition, an electronic device may have different display types, such as a backlit display, a front-lit display, etc. Different types of displays provide different user experiences, such as the ability to use the device in direct sunlight. As the size of the display increases, problems may arise, such as uniformity of brightness on the display, providing touch functionality along the edges and / or corners of the display, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a schematic illustration of a top view and a cross-sectional view of an electronic device with a display stack according to one or more embodiments of the present disclosure.

[0005] Figure 2 is a schematic illustration of a cross-sectional view of a front-light display stack according to one or more embodiments of the present disclosure.

[0006] Figure 3 is a schematic illustration of a cross-sectional view of an edge portion of a cover lens assembly according to one or more embodiments of the present disclosure.

[0007] Figure 4 According to one or more embodiments of the present disclosure Figures 1 to 3 Schematic illustration of an example light extraction feature / surface feature arrangement for a light guide of a display stack.

[0008] Figure 5 is a schematic illustration of a light emitting diode (LED) arrangement and an example light output illustration for a display stack according to one or more embodiments of the present disclosure.

[0009] Figure 6 is a schematic illustration of a charging indicator according to one or more embodiments of the present disclosure.

[0010] Figure 7 An example architecture of an electronic device according to one or more embodiments of the present disclosure is schematically shown.

[0011] Specific embodiments are described with reference to the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and depict only example embodiments of the present disclosure. The accompanying drawings are provided to facilitate understanding of the present disclosure and should not be considered to limit the breadth, scope or applicability of the present disclosure. The same reference numerals are used to represent similar but not necessarily identical or the same parts. Different reference numerals may be used to identify similar parts. Various embodiments may utilize elements or components that are not shown in the accompanying drawings, and some elements and / or components may not be present in various embodiments. Depending on the context, the use of singular terms to describe a component or element may cover multiple such components or elements, and vice versa. DETAILED DESCRIPTION

[0012] Overview

[0013] Multimedia devices can be used to output digital content, and in some cases, to present the content on one or more display devices for user consumption. For example, a multimedia device can be a content streaming device that streams digital content, and can be configured to read one or more data storage devices to achieve the presentation of content stored on the data storage device. Multimedia devices can include a variety of devices, such as electronic readers ("e-readers") devices, desktop computers, portable computers, smart phones, tablet computers, televisions, wearable devices, speaker devices, etc., which can be used to access various forms of content and other information. Such a device may include a display for presenting information or content to a user.

[0014] Certain electronic devices may be configured for use in specific environments, such as in direct sunlight. In order to allow the display of the device to be visible in such an environment, a front-lit display may be used instead of a backlit display or other type of display. However, as the display size of the front-lit display increases, certain problems may occur or be exacerbated, such as uneven display brightness, poor light emission along the edge, insensitive touch sensing along the edge of the display, etc. Therefore, the user experience of the device may be negatively affected. Embodiments of the present disclosure include a front-lit display with uniform brightness, regardless of the size of the display. Some embodiments provide the ability to use a non-black mask, allowing the use of a device housing and / or mask of a different color, such as gray, for the device color, thereby providing additional customization options. In some embodiments, the display may be flush with the front or top of the device, and the ability to produce a borderless device may be provided. Some embodiments include LED driving technology that reduces the power consumption of devices with large front-lit displays (e.g., displays greater than 9 inches in size, etc.). In addition, due to the improved cover lens assembly, some embodiments may include a relatively thinner display, which may be conducive to a thinner device profile. A thinner device profile can improve the portability and / or functionality of the device by creating additional space for other components. In addition, some devices may have light leakage issues around the device display, where light may cause problems such as a glow around the active display, leakage of visible light at the edge of the device, and / or a halo effect around the perimeter of the display surface of the device. The color of the device housing may exacerbate the light leakage problem. For example, a device with a white or relatively light-colored housing may be more susceptible to light leakage issues than, for example, a device with a darker or black housing.

[0015] Embodiments of the present disclosure include front-lit displays with uniform brightness. The display stack of the present disclosure can be thinner than other displays and can reduce or prevent light leakage around the sides of the device. An electronic device including a display stack of the present disclosure can have a thinner profile, improved functionality, and can avoid light leakage issues that may have a negative impact on the visibility or readability of the display due to the increase in internal space. In some example embodiments, the display stack described herein can be a flat and / or planar display stack, while in other example embodiments, one or more components of the display stack can be curved or partially curved. By eliminating light leakage and / or halo effects caused by luminous issues of electronic devices and / or displays, certain embodiments of the present disclosure can be aesthetically pleasing to users. Although described in the context of electrophoretic displays and display stacks, aspects of the present disclosure are more broadly applicable to other forms of display stacks and / or displays.

[0016] The present disclosure relates particularly to systems, methods, computer readable media, techniques, and methodologies for front-lit displays with uniform brightness. As described herein, display stacks can be used to provide devices with large front-lit displays and avoid light leakage issues associated with device housing color.

[0017] Reference Figure 1 , according to one or more embodiments of the present disclosure, an example electronic device 100 with a display stack 110 is depicted. Figure 1 1 and 2. The display stack 110 is depicted in a top view and a cross-sectional view. The display stack 110 may be a front-lit display for use with an electronic reader device or other display device. The electronic device 100 may include a housing 102, within which a portion of the display stack 110 or the entire display stack 110 may be positioned. In some embodiments, the display stack 110 may form some or all of the device housing, such as a portion of an outer display layer. The device 100 may be an electronic reader device, a computer display, a portable computer, a smart phone, a tablet computer, a game console, a television, a car display, or the like. The display stack 110 may form a display of the electronic device 100 and may be configured to present information to a user of the electronic device 100 and / or receive input from a user of the electronic device 100. In one example, the display stack 110 may form a touch screen of the electronic device 100, wherein the user may touch or press a portion of the display stack 110 to make a selection or another input. The device 100 may include one or more circuits, such as a driver integrated circuit 112, a flexible printed circuit 114, and other circuitry.

[0018] Portion 120 of display stack 110 is shown in a cross-sectional view along line AA. In the illustrated embodiment, display stack 110 may include multiple layers. These layers may have different thicknesses and may not be shown to scale and may not be shown to scale relative to other layers or other figures.

[0019] exist Figure 1 In the embodiment of the present invention, the portion 120 of the display stack 110 may include a cover lens assembly 122. The cover lens assembly 122 may include an anti-glare material layer 142 disposed on an upper side of the cover lens assembly 122. The anti-glare material layer 142 may be an anti-glare film. Figure 2, the anti-glare material layer 142 may include particles dispersed on the anti-glare film, where such particles provide surface roughness to improve the user experience when writing on the display stack 110 (e.g., with an electronic pen, stylus, etc.). The particles may be configured to reduce the glare of the display stack 110, especially in an environment with direct lighting. The cover lens assembly 122 may form the outer surface of the display stack 110 and, in some cases, may form the outer surface of the device 100. The cover lens assembly 122 may protect the display stack 110 from scratches, abrasion, and other damage. In some embodiments, the cover lens assembly 122 may be a multi-layer structure or a composite material and may include one or more layers or coatings. For example, the cover lens assembly 122 may include a cover glass layer 146 and an optically clear adhesive layer 144, which is disposed between the anti-glare material layer 142 and the cover glass layer 146. In some embodiments, the anti-glare material layer 142 may be laminated to the cover glass layer 146. In other embodiments, plastic may be used instead of glass for the cover layer 146.

[0020] The first optically clear adhesive layer 124 may be at least partially positioned between the cover lens assembly 122 and the touch sensor layer 126 and may couple the touch sensor layer 126 to the cover lens assembly 122. The first optically clear adhesive layer 124 may be formed of an optically clear adhesive and may be in liquid or solid form. In some embodiments, the optically clear adhesive may be a tape. In some embodiments, the optically clear adhesive may be an acrylic adhesive.

[0021] The touch sensor layer 126 may include one or more capacitive touch sensors or other touch sensors and may be at least partially formed of indium tin oxide and / or a uniform transparent electrode.

[0022] The second optically clear adhesive layer 128 may be positioned between the touch sensor layer 126 and the light guide 130 and may couple the light guide 130 to the touch sensor layer 126. The light guide 130 may be configured to guide light from one or more light-emitting diodes (LEDs) or other light sources through some or all of the display stack 110. The light guide 130 may be formed of plastic or another material. For example, the light guide 130 may be used to illuminate the display stack 110 in a dark environment and may provide light that does not directly shine into the viewer's eyes to reduce eye fatigue.

[0023] A third optically transparent adhesive layer 132 can be positioned between the light guide 130 and the electrophoretic display 134, and can couple the electrophoretic display 134 to the light guide 130. Each of the optically transparent adhesive layers can be formed of the same or different materials or adhesives. The electrophoretic display 134 can be an electronic ink ("e-ink") layer and can include multiple different layers. Some embodiments may include an electrode layer, a touch layer, a microcapsule layer, a thin film transistor (TFT) layer, a backplane substrate or back protective sheet layer, and / or other or different components or layers. One or more color-adjustable light emitting diodes (LEDs) 158 can be positioned adjacent to one or more surfaces of the light guide 130.

[0024] Pressure sensitive adhesive layer 136 may be positioned between electrophoretic display 134 and electromagnetic resonance layer 138. Pressure sensitive adhesive layer 136 may be an adhesive that activates bonding under pressure. In other embodiments, different types of adhesives may be used. Electromagnetic resonance layer 138 may provide reduced latency when rendering a response to the written input, such as when a user writes on display stack 110 using a stylus.

[0025] One or more flexible printed circuits (FPCs) may be coupled to various components of the display stack. For example, touch layer FPC 160 may be coupled to the underside or surface of touch sensor layer 126. Touch layer FPC 160 may be positioned between touch sensor layer 126 and second optically transparent adhesive layer 128. LED FPC 162 may be coupled to one or more of LEDs 158 and may be coupled to the lower surface of light guide 130, for example, with the aid of an adhesive. LED FPC 162 may be positioned between light guide 130 and EPD 134. EPD FPC may be coupled to EPD 134 and may be positioned adjacent to third optically transparent adhesive layer 132. Both EPD FPC and LED FPC 162 may be positioned between light guide 130 and EPD 134, with LED FPC 162 adjacent to light guide 130 and EPD FPC adjacent to EPD 134. Other configurations may be used.

[0026] The device housing 102 can be any suitable color, such as white, gray, pink, etc., and can be formed from a variety of different materials, such as plastic, aluminum, etc. In some embodiments, the device housing 102 can be a color other than black. The device housing color and / or material can affect light leakage issues caused by light leakage around portions of the display stack 110. For example, a display area glow 104 can be a glow visible next to an active area of ​​the display stack 110, edge light leakage 106 can be visible light that leaks through the edge of a cover lens of the display stack 110 and can be visible behind device components, and / or a halo effect 108 can be visible light that is reflected back into the cover lens and can appear as a narrow glow around the edge of the cover lens of the display stack 110, etc. Embodiments of the present disclosure can mitigate one or more light leakage issues regardless of the color and / or material of the device housing.

[0027] Portion 140 of device 100 is shown in a cross-sectional view along line BB. In the illustrated embodiment, device 100 and / or display stack 110 may include multiple layers. These layers may have different thicknesses and may not be shown to scale and may not be shown to scale relative to other layers or other figures.

[0028] The bottom portion of the layers shown in portion 140 may be the layers of display stack 110 shown in portion 120. "Bottom" and "top" as used herein are relative positions, not absolute positions. For example, electromagnetic resonance layer 138 may form the bottom of portion 140 as shown, and may be stacked in the display stack with pressure sensitive adhesive layer 136, electrophoretic display 134, third optically transparent adhesive layer 132, light guide 130, second optically transparent adhesive layer 128, touch sensor layer 126, first optically transparent adhesive layer 124, and cover lens assembly 122.

[0029] As shown in more detail in section 140, in some embodiments, the cover lens assembly 122 can include one or more components. For example, the cover lens assembly 122 can include an anti-glare material layer 142, an optically clear adhesive layer 144, and a cover glass layer 146, the anti-glare material layer being configured to reduce glare on the display, the cover glass layer being configured to support the anti-glare material layer 142 and protect the display stack 110. The first optically clear adhesive layer 124 can couple the cover lens assembly 122 to the touch sensor layer 126. The anti-glare material layer 142 can have other properties, such as UV blocking, anti-reflective properties, and other properties. The anti-glare material layer 142 can have a color, such as the same color as a mask or housing of the device, which can be gray. The cover lens assembly 122 can include a hot melt adhesive 156 disposed around edge surfaces of the anti-glare material layer 142 and the cover glass layer 146, such that the hot melt adhesive 156 forms a perimeter of the cover lens assembly 122. For example, the hot melt adhesive 156 can be reflowed around the cover lens assembly 122 and allowed to cure. The hot melt adhesive 156 can be a dark color, such as black, and can prevent light leakage around the edge of the display stack 110. Therefore, the cover lens assembly 122 can include a cover glass layer 146 and an anti-glare material layer 142, which can be an anti-glare film, coupled to the cover glass layer 142 (e.g., via an optically clear adhesive layer 144, etc.). The cover lens assembly 122 can include a hot melt adhesive 156 disposed around the side edge surfaces of the cover glass layer 146 and the anti-glare film 142, so that the hot melt adhesive 156 forms the perimeter of the cover lens assembly 122.

[0030] Since the display stack 110, and at least Figure 5 The LED arrangement described and at least Figure 4 The light guide features described, since the display stack is thinner, the device can be thinner. The light leakage problem can be solved or alleviated by the display stack and structure of the present disclosure.

[0031] The example embodiments of the present disclosure provide a plurality of technical features or technical effects. For example, according to the example embodiments of the present disclosure, certain embodiments of the present disclosure can alleviate light leakage problems, reduce display stack thickness, reduce device thickness, and improve brightness uniformity. The above examples of technical features and / or technical effects of the example embodiments of the present disclosure are merely illustrative and not exhaustive.

[0032] One or more illustrative embodiments of the present disclosure have been described above. The above embodiments are merely illustrative of the scope of the present disclosure and are not intended to be limiting in any way. Therefore, variations, modifications, and equivalents of the embodiments disclosed herein are also within the scope of the present disclosure. The above embodiments and additional embodiments and / or alternative embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0033] Illustrative embodiments and use cases

[0034] Figure 2 is a schematic illustration of a cross-sectional view of a front-light display stack 200 according to one or more embodiments of the present disclosure. The display stack 200 may be about Figure 1 The same display stack discussed. Other embodiments may have additional components, fewer components, or different components. Figure 2 The illustrations may not be to scale and the components may not be drawn to scale relative to each other.

[0035] The display stack 200 may include an electromagnetic resonance layer 210. The electromagnetic resonance layer 210 may include one or more sensors that emit electromagnetic signals that form a magnetic field around the upper side of the display stack 200. The magnetic field can be used to determine a user's writing action on the display stack 200, which is a result of the interruption of the magnetic field and has reduced latency relative to other types of display stack input detection. The thickness of the electromagnetic resonance layer 210 may be about 0.25 to about 0.30 millimeters.

[0036] The pressure sensitive adhesive layer 220 may be disposed adjacent to the electromagnetic resonance layer 210. The pressure sensitive adhesive layer 220 may couple the electromagnetic resonance layer 210 to the electrophoretic display 230. The thickness of the pressure sensitive adhesive layer 220 may be about 0.05 mm, and the thickness of the electrophoretic display 230 may be about 0.7 mm.

[0037] In some embodiments, the electrophoretic display 230 may include a plastic TFT backplane (e.g., a polyimide backplane, etc.) having a first width. The electrophoretic layer may be coupled to the flexible TFT backplane, and the electrode layer may be coupled to the electrophoretic layer. The electrophoretic layer may be a microcapsule layer and may be part of a front plane laminate structure. The integrated circuit may be disposed on the flexible plastic TFT backplane, and the protective sheet may have a second width greater than or equal to the first width. The protective sheet may be disposed around a side of the electrophoretic display opposite to the flexible TFT backplane. The flexible plastic TFT backplane may be formed of a polyimide material.

[0038] The first optically transparent adhesive layer 240 may be disposed adjacent to the electrophoretic display 230 .

[0039] First optically clear adhesive layer 240 may couple electrophoretic display 230 to light guide 250 .

[0040] The thickness of the first optically clear adhesive layer 240 may be about 0.25 mm.

[0041] The light guide 250 may be configured to guide light from one or more LEDs 290. The LEDs 290 may be positioned adjacent to an edge surface of the light guide 250. Light output from the LEDs 290 may be propagated through the light guide 250 and used to render content on the display stack 200. The light guide 250 may include one or more surface features, such as protrusions that form light extraction features / surface features in a particular arrangement, such as with respect to Figure 4 As discussed. The surface features can improve brightness uniformity across the display stack 200. The thickness of the light guide 250 can be about 0.4 mm.

[0042] The LED FPC 294 may be coupled to the underside of the light guide 250 and may support the LED 290. The LED FPC 294 may be coupled to the underside of the light guide 250 via an optically clear adhesive 296. Figure 5 The LED FPC 294 is discussed in more detail.

[0043] A light shielding material 292, such as tape or other adhesive, can be coupled to the upper side of the light guide 250 and can be disposed on the upper side of the LED 290. The light shielding material 292 can be a light color, such as white, and can prevent light from the LED 290 from escaping upward through the display stack 200 and / or the device housing. The light shielding material 292 can be vertically aligned or aligned with the LED 290.

[0044] The second optically transparent adhesive layer 252 can be disposed adjacent to the light guide 250. The second optically transparent adhesive layer 252 can couple the light guide 250 to the first layer 260 of the touch sensor. The thickness of the second optically transparent adhesive layer 252 can be about 0.18 mm. The touch sensor can include a second layer 264 coupled to the first layer 260 via a third optically transparent adhesive layer 262. The thickness of the first layer 260, the third optically transparent adhesive layer 262, and the second layer 264 can be about 0.05 mm, so that the total thickness of the touch sensor is about 0.15 mm. The first layer 260 and / or the second layer 264 of the touch sensor can be formed of indium tin oxide and can be an electrode layer, which can facilitate touch detection for the display stack 200.

[0045] The touch sensor can be bonded to the touch sensor FPC with an anisotropic conductive film (ACF). The ACF bonding can include forming a conductive adhesive bond between the flexible component and the rigid component, and the thickness can be about 30 microns or less. For example, a first ACF bond 266 can be formed on a first side of the touch sensor, and a second ACF bond 266 can be formed on a second side of the touch sensor. In some embodiments, the ACF bond 266 can bond the touch sensor layer to the flexible printed circuit.

[0046] A fourth optically clear adhesive layer 234 having a thickness of approximately 0.18 mm can couple the touch sensor to the cover lens assembly 270. The cover lens assembly 270 can include a cover glass layer, an anti-glare film, and / or an optically clear adhesive layer, such as described with respect to Figure 1 As discussed. The anti-glare film of the cover lens assembly 270 may include one or more particles 282 disposed thereon, which may increase surface roughness and reduce glare. The size of the particles 282 may be non-uniform and may have a non-uniform dispersion on the anti-glare film. The anti-glare film may include a base film and a plurality of particles 282 disposed on the base film, wherein the size of the plurality of particles is non-uniform, and wherein the combined base film and the plurality of particles 282 have a first refractive index value that matches a second refractive index value of the base film. The anti-glare film may have one or more gray mask layers disposed thereon, such as one or more gray mask layers disposed along one or more edges.

[0047] The hot melt adhesive 280 may be disposed around the outer edge surface or periphery of the cover lens assembly 270. In some embodiments, the hot melt adhesive 280 may be applied in a liquid or semi-liquid form. The thickness of the hot melt adhesive 280 may be equal to or greater than the layer of the cover lens assembly 270. In some embodiments, the hot melt adhesive 280 may be at least partially disposed on the upper surface and / or lower surface of the cover lens assembly 270, such as Figure 2 In other embodiments, the hot melt adhesive 280 may not be disposed on the upper and / or lower surfaces of the cover lens assembly 270 (e.g., as shown in FIG. Figure 1 etc.).

[0048] Thus, display stack 200 may include an electrophoretic display, a light guide configured to guide light from one or more light emitting diodes, and a cover lens assembly having a cover glass layer, an anti-glare film, and a hot melt adhesive, the anti-glare film coupled to the cover glass layer, the hot melt adhesive disposed around side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a perimeter of the cover lens assembly. Figure 2As depicted in , hot melt adhesive 280 can be at least partially disposed on an upper surface of the cover lens assembly and / or on a lower surface on the cover lens assembly. Hot melt adhesive 280 can be a dark hot melt adhesive, such as black in color. Light guide 250 can be disposed on a first side of the electrophoretic display, and display stack 200 can include an electromagnetic resonance layer disposed on a second side of the electrophoretic display. The display stack can include a touch sensor disposed between the cover lens and the light guide, wherein the touch sensor includes an indium tin oxide film, and the device can include a touch sensor FPC disposed vertically adjacent to the LED FPC.

[0049] The device may include an LED FPC and a light-colored strip, wherein the LED FPC is coupled to a first side of the light guide, wherein the LED FPC can be at least partially disposed between the light guide and the electrophoretic display, and the light-colored strip is coupled to a second side of the light guide, wherein the light-colored strip can be at least partially disposed between the light guide and the cover lens assembly.

[0050] Figure 3 A schematic diagram depicts a cross-sectional view of an edge portion of a cover lens assembly 300 according to one or more embodiments of the present disclosure. The cover lens assembly 300 may be about Figure 1 to Figure 2 The same cover lens assembly discussed above. Other embodiments may have additional components, fewer components, or different components. Figure 3 The illustrations may not be to scale and the components may not be drawn to scale relative to each other.

[0051] The cover lens assembly 300 may not have a black mask, but may have a gray or other colored mask. In some embodiments, a device using the cover lens assembly 300 may have a non-black mask disposed around the cover lens assembly. The anti-glare film or anti-glare layer of the cover lens assembly 300 may be the same color as the non-black mask, such as gray or another color.

[0052] The cover lens assembly 300 may include a cover glass layer 310. A reflowed optically clear adhesive 320 may be disposed on an upper side of the cover glass layer 310. An anti-glare film 370 may be disposed on the optically clear adhesive 320 and may form an outer portion of the cover lens assembly 300. A hot melt adhesive 380 may be disposed around an edge surface of the cover lens assembly 300, as described with respect to FIG. Figure 1 to Figure 2 discussed.

[0053] The cover lens assembly 300 may include one or more black mask layers, such as a first black mask layer 330 and a second black mask layer 340. The cover lens assembly 300 may include at least one non-black mask layer, such as a first gray mask layer 350 and a second gray mask layer 360. The mask layers may be disposed along the edge of the cover lens assembly 300, wherein the width of the mask layer closer to the top of the cover lens assembly 300 is greater than the width of the mask layer closer to the bottom of the cover lens assembly 300. The width of the cover glass layer 310 may be greater than the width of the anti-glare film 370. The mask layer may be a dried ink layer. Any number of mask layers may be included. In one embodiment, the display stack may include both a black mask layer and a gray mask layer, which are at least partially disposed in an overlapping vertical alignment.

[0054] The thickness of the cover glass layer 310 may be about 0.4 mm, and the thickness of the anti-glare film 370 may be about 0.1 mm. The total thickness of the cover lens assembly 300 may be about 0.55 mm.

[0055] Figure 4 A schematic illustration of an example light extraction feature / surface feature arrangement of a portion of a light guide 400 is depicted in accordance with one or more embodiments of the present disclosure. Figure 4 The arrangement depicted in the example of Figures 1 to 3 Any of the light guides discussed can be used together. Other embodiments can have different configurations.

[0056] exist Figure 4 , a portion of a light guide 400 is depicted. This portion is further from the LED 402 than other portions of the light guide 400. This portion of the light guide 400 may have a first side portion 410, a middle portion 420, and a second side portion 430, wherein the middle portion 420 is between the first side portion 410 and the second side portion 430. Figure 4 The above figure depicts a portion of the light guide 400, but in Figure 4 The entire light guide and the corresponding light extraction feature distribution are shown in the figure below.

[0057] This portion of the light guide 400 may have one or more surface features / light extraction features that may be raised rectangular protrusions. The surface features may be arranged at an angle relative to the horizontal (eg, flat, etc.), where the horizontal is determined by Figure 4 The Y axis is represented by Figure 4, represented by the X-axis in . Horizontal features are aligned with the Y-axis, and inclined features are set at a non-zero angle relative to the Y-axis. The size of each surface feature or each segment of a surface feature can be based at least in part on the spatial positioning of the binary element and / or segment. For example, a surface feature (or segment of a surface feature) disposed between light patterns emitted by two different colors of LEDs can be relatively larger in one or more sizes than a surface feature (or segment of a surface feature) disposed closer to an LED of one color than to an LED of another color. Therefore, light extraction in an area of ​​overlapping LED emission patterns may be more uniform than light extraction near a particular LED, which may facilitate greater sensitivity to light extraction from that particular LED.

[0058] The angles and / or orientations of surface features (such as surface features or segments of surface features) can be determined at least in part based on the angle of light emission or light emitted from an LED, and the spatial positioning or distance between the LED and the surface features, and the surface features are configured to extract light from the LED or are more inclined to extract light from the LED. A first set of surface features or segments of surface features can be set at a specific orientation or angle corresponding to light emitted from a first LED, while a second set of surface features or segments of surface features can be set at a specific orientation or angle corresponding to light emitted from a second LED. At portions where the first set of surface features and the second set of surface features overlap (e.g., where portions or regions (such as side portions and middle portions) overlap, etc.), the positioning and / or size of the surface features can be modified to accommodate light extraction from both the first LED and the second LED.

[0059] This portion of the light guide 400 may include horizontally arranged elements 440 disposed around the middle portion 420 of the light guide 400. In some embodiments, the features 440 may be arranged parallel to the Y axis, such as Figure 4 As shown. In contrast, elements disposed along the first side portion 410 and / or the second side portion 430 may be disposed at an angle relative to the Y-axis. For example, as depicted in the angle map 450, some of the light extraction features / surface features disposed around the middle portion 420 of the light guide 400 may be arranged in a horizontal orientation, while the light extraction features / surface features disposed around the side portions may be arranged in an upwardly tilted orientation 442 (relative to horizontal) and / or a downwardly tilted orientation 444 (relative to horizontal). Such an arrangement of light extraction features / surface features may improve light distribution and propagation, as well as light extraction from the light guide 400. In some embodiments, a first set of surface features of the light guide 400 may be disposed along a side portion of the light guide in a non-horizontally tilted orientation (where horizontal is relative to the width of the device and / or light guide), and a second set of surface features may be disposed on the light guide 400 along the middle portion of the light guide in a horizontal orientation (relative to the width of the device and / or display stack).

[0060] Thus, the light guide 400 may include a first set of surface features disposed in an oblique orientation 442, 444 along side portions of the light guide and a second set of surface features disposed in a horizontal orientation 440 along a middle portion of the light guide. In one embodiment, some of the light extraction features / surface features may be arranged in an oblique orientation so as to be sensitive to white LED light output, while the light extraction features / surface features may be arranged in a horizontal orientation so as to be sensitive to non-white LED output.

[0061] Figure 5 Depicted are schematic diagrams of light emitting diode (LED) arrangements and example light output diagrams for display stacks according to one or more embodiments of the present disclosure. The LED arrangements may be used with respect to Figures 1 to 4 Any of the display stacks discussed may be used together. Other embodiments may have additional components, fewer components, or different components. Figure 5 The illustrations may not be to scale and the components may not be drawn to scale relative to each other.

[0062] exist Figure 5 In the embodiment, device 500 may include a light guide 510 and one or more LEDs disposed adjacent to an edge surface of light guide 510. For example, device 500 may include a housing and a display stack coupled to the housing. Device 500 may include

[0063] The first LED 530 is disposed adjacent to an edge surface of the light guide 510, wherein the first LED 530 is separated from the edge surface by a first distance X1. The device 500 may include a second LED 520, which is disposed adjacent to the first LED 530, wherein the second LED 520 is separated from the edge surface by a second distance X2. The second distance X2 may be greater than the first distance X1. For example, the second distance X2 may be 0.4 mm, and the first distance X1 may be 0.3 mm. The second LED 520 may be disposed adjacent to a corner of the light guide 510. The first LED 530 may be a non-white LED (e.g., outputting non-white light), such as an amber LED, and the second LED 520 may be a white LED (e.g., outputting white light). Additional LEDs may be included in alternative arrangements, such as a third LED 540 as a white LED, a fourth LED 550 as a non-white LED, and the like.

[0064] As depicted in light output graph 560, the brightness measurements at various distances from the edge of the light guide 510 are uniform (e.g., consistent 2 lm, etc.), which provides the user with the appearance of uniform brightness on the display. The light guide 510 features and LED FPC allow for rapid cross-mixing of light adjacent to the edge of the light guide 510, thereby eliminating the need for thick bezels and / or increased device size.

[0065] The corner LED can be driven in series with the 0.4 LED, which means that the power control scheme is simple, while the brightness of the corner LED is 100% lower than that of the 0.4 distance LED. An embodiment of the corner LED can have 50% brightness relative to the other white LEDs, so that the luminous flux from the LED is balanced between the white LEDs and the amber LEDs over the entire length of the LED FPC. The light from the white LED is shown as two equal beams: one beam to the left and the other beam to the right. The physical die-cut edge of the light guide acts as a reflector and performs total internal reflection of the light at the light guide-air interface. The luminous flux near the corner looks like it comes from two LEDs of the same color close to each other (e.g., from the corner LED and its reflected copy, etc.).

[0066] Figure 6 600 is a schematic diagram of a charging indicator 600 according to one or more embodiments of the present disclosure. The charging indicator 600 may be Figure 1-Figure 5 Other embodiments may have additional components, fewer components, or different components. Figure 5 The illustrations may not be to scale and the components may not be drawn to scale relative to each other.

[0067] exist Figure 6 In the embodiment of the present invention, the charging indicator 600 can be coupled to the device housing 610. The charging indicator 600 can have an inner support 620 having a white color. The charging indicator 600 can include an LED 630 coupled to a circuit board 640. The charging indicator 600 can have an outer support 650 having a black color. In some embodiments, the inner support 620 and the outer support 650 can be an integrated component with a white inner portion and a black outer portion.

[0068] The outer support 650 of the charging indicator 600 can be bent to push up and seal the inner support 620. Thus, the outer support 650 can wrap around the LED 630 and seal the auxiliary circuit board 640. The outer support 650 can be set around the charging indicator LED 630. In one embodiment, the outer support 650 can be a hard, white, highly reflective, low-transmittance, injection moldable rubber. The top of the outer support 650 can be painted black to make it less visible through the gap between the housing 610 and the display cover lens and more opaque to transmitted light. The outer support 650 can snap onto the auxiliary circuit board 640, snap around the LED 630, and seal the tabs on the housing 610. This seals the charging LED 630 in the chamber and prevents light leakage. The inner wall of the inner support 620 facing the LED 630 can be highly reflective white and help redirect the LED light toward the indicator exit hole and homogenize the light from the indicator to improve uniformity.

[0069] Figures 1 to 6 One or more operations of the method, process flow or use case may have been described above as being performed by a user device, or more specifically, by one or more program modules, applications, etc. executed on the device. However, it should be understood that Figures 1 to 6 The operations of any of the methods, process flows, or use cases of the present invention may be performed at least in part by one or more other devices in a distributed manner, or more specifically, by one or more program modules, applications, etc., executed on such devices. Furthermore, it should be understood that the processing performed in response to the execution of computer-executable instructions provided as part of an application, program module, etc. may be interchangeably described herein as being performed by the application or program module itself or by the device on which the application, program module, etc. is executed. Although it may be described in the context of an illustrative device, Figures 1 to 6 The methods, process flows, or use cases described herein are described, but it should be understood that these operations can be implemented in combination with many other device configurations.

[0070] exist Figures 1 to 6 The operations described and depicted in the illustrative methods, process flows, and use cases of the present disclosure may be performed or executed in any suitable order as desired in the various example embodiments of the present disclosure, such as the order depicted. Furthermore, in some example embodiments, at least some of the operations may be performed in parallel. Furthermore, in some example embodiments, more than one operation may be performed. Figures 1 to 6 Fewer, more, or different operations than those depicted in .

[0071] Although specific embodiments of the present disclosure have been described, those of ordinary skill in the art will recognize that many other modifications and alternative embodiments are also within the scope of the present disclosure. For example, any function and / or processing capability described with respect to a particular device or component can be performed by any other device or component. In addition, although various illustrative implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will understand that many other modifications to the illustrative implementations and architectures described herein are also within the scope of the present disclosure.

[0072] Certain aspects of the present disclosure are described above with reference to the block diagrams and flow charts of the systems, methods, devices and / or computer program products according to example embodiments. It should be understood that the combination of one or more frames of the block diagram and flow chart, and the frames in the block diagram and the flow can be realized by the execution of computer executable program instructions. Similarly, according to some embodiments, some frames of the block diagram and flow chart may not necessarily need to be executed in the order presented, or may not need to be executed at all. In addition, in some embodiments, there may be additional components and / or operations other than those components and / or operations depicted in the frames of the block diagram and / or flow chart.

[0073] Therefore, the blocks of the block diagrams and flow charts support a combination of means for performing specified functions, a combination of elements or steps for performing specified functions, and program instruction means for performing specific functions. It should also be understood that each block of the block diagrams and flow charts, and the combination of blocks in the block diagrams and flow charts can be implemented by a dedicated, hardware-based computer system that performs the specified functions, elements or steps, or a combination of dedicated hardware and computer instructions.

[0074] Illustrative Computer Architecture

[0075] Figure 7 1 is a schematic block diagram of one or more illustrative (multiple) electronic devices 700 according to one or more example embodiments of the present disclosure. (Multiple) electronic devices 700 may include any suitable computing device, including but not limited to server systems, mobile devices such as smart phones, tablet computers, e-readers, wearable devices, etc.; desktop computers; laptop computers; content streaming devices; set-top boxes; scanning devices; barcode scanning sticks; etc. (Multiple) electronic devices 700 may correspond to devices for use Figures 1 to 6 An illustrative device configuration for a device.

[0076] The electronic device(s) 700 may be configured to communicate with one or more servers, user devices, etc. The electronic device(s) 700 may be configured to determine voice commands, determine wake word utterances, present digital content, determine and / or control other devices, and other operations.

[0077] (Multiple) electronic devices 700 can be configured to communicate via one or more networks.Such (multiple) networks can include but are not limited to any one or more different types of communication networks, such as, for example, wired networks, public networks (such as the Internet), private networks (such as frame relay networks), wireless networks, cellular networks, telephone networks (such as public switched telephone networks), or any other suitable private or public packet switching or circuit switching networks. In addition, such a network can have any suitable communication range associated therewith, and can include, for example, a global network (such as the Internet), a metropolitan area network (MAN), a wide area network (WAN), a local area network (LAN), or a personal area network (PAN). In addition, such a network can include communication links and associated networking equipment (such as, link layer switches, routers, etc.), for transmitting network services through the medium of any suitable type, the medium including but not limited to coaxial cables, twisted pairs (such as, twisted pair copper wires), optical fibers, hybrid fiber coaxial (HFC) media, microwave media, radio frequency communication media, satellite communication media, or any combination thereof.

[0078] In an illustrative configuration, the electronic device(s) 700 may include one or more processor(s) 702, one or more memory devices 704 (also referred to herein as memory 704), one or more input / output (I / O) interfaces 706, one or more network interfaces 708, one or more sensors or sensor interfaces 710, one or more transceivers 712, one or more display stacks 714, one or more optional microphones 716, and data storage 720. The electronic device(s) 700 may also include one or more buses 718 that functionally couple the various components of the electronic device(s) 700. The electronic device(s) 700 may also include one or more antenna(s) 726, which may include, but are not limited to, a cellular antenna for transmitting / receiving signals to / from a cellular network infrastructure, an antenna for transmitting / receiving Wi-Fi signals to / from an access point (AP), a GNSS antenna for receiving GNSS signals from a GNSS satellite, a Bluetooth antenna for transmitting or receiving Bluetooth signals, a near field communication (NFC) antenna for transmitting or receiving NFC signals, and the like. These various components are described in more detail below.

[0079] The bus(es) 718 may include at least one of a system bus, a memory bus, an address bus, or a message bus, and may permit the exchange of information (e.g., data (including computer executable code), signaling, etc.) between the various components of the electronic device(s) 700. The bus(es) 718 may include, but are not limited to, a memory bus or memory controller, a peripheral bus, an accelerated graphics port, etc. The bus(es) 718 may be associated with any suitable bus architecture, including, but not limited to, an Industry Standard Architecture (ISA), a Micro Channel Architecture (MCA), an Enhanced ISA (EISA), a Video Electronics Standards Association (VESA) architecture, an Accelerated Graphics Port (AGP) architecture, a Peripheral Component Interconnect (PCI) architecture, a PCI-Express architecture, a Personal Computer Memory Card International Association (PCMCIA) architecture, a Universal Serial Bus (USB) architecture, etc.

[0080] The memory 704 of the (multiple) electronic devices 700 may include volatile memory (memory that maintains its state when powered) such as random access memory (RAM), and / or non-volatile storage (memory that maintains its state even when not powered) such as read-only memory (ROM), flash memory, ferroelectric RAM (FRAM), etc. As the term is used herein, a persistent data storage device may include non-volatile memory. In some example embodiments, volatile memory can achieve faster read / write access than non-volatile memory. However, in some other example embodiments, certain types of non-volatile memory (e.g., FRAM) can achieve faster read / write access than certain types of volatile memory.

[0081] In various implementations, the memory 704 may include a variety of different types of memory, such as various types of static random access memory (SRAM), various types of dynamic random access memory (DRAM), various types of unalterable ROM, and / or writable variants of ROM, such as electrically erasable programmable read-only memory (EEPROM), flash memory, etc. The memory 704 may include main memory as well as various forms of cache memory, such as instruction cache, data cache, translation lookaside buffer (TLB), etc. In addition, cache memory, such as a data cache, may be a multi-level cache organized as a hierarchy of one or more cache levels (L1, L2, etc.).

[0082] The data storage device 720 may include removable storage devices and / or non-removable storage devices, including but not limited to magnetic storage devices, optical disk storage devices, and / or tape storage devices. The data storage device 720 may provide non-volatile storage of computer executable instructions and other data. The removable and / or non-removable memory 704 and the data storage device 720 are examples of computer readable storage media (CRSM) as the term is used herein.

[0083] The data storage device 720 may store computer executable code, instructions, etc., which may be loadable into the memory 704 and executable by the processor 702 to cause the processor 702 to perform or initiate various operations. The data storage device 720 may additionally store data, which may be copied to the memory 704 for use by the processor 702 during execution of the computer executable instructions. In addition, output data generated as a result of the processor 702 executing the computer executable instructions may initially be stored in the memory 704 and may ultimately be copied to the data storage device 720 for non-volatile storage.

[0084] More specifically, the data storage device 720 may store one or more operating systems (O / S) 722; one or more database management systems (DBMS) 724; and one or more program modules, applications, engines, computer executable codes, scripts, etc. Some or all of these modules may be sub-modules. Any of the components described as being stored in the data storage device 720 may include any combination of software, firmware, and / or hardware. The software and / or firmware may include computer executable codes, instructions, etc., which may be loaded into the memory 704 for execution by one or more processors 702. Any component described as being stored in the data storage device 720 may support the functions described with reference to the corresponding components mentioned above in the present disclosure.

[0085] The data storage device 720 may further store various types of data used by the components of the electronic device(s) 700. Any data stored in the data storage device 720 may be loaded into the memory 704 for use by the processor 702 when executing the computer executable code. In addition, any data described as being stored in the data storage device 720 may potentially be stored in one or more data repositories, and may be accessed via the DBMS 724 and loaded into the memory 704 for use by the processor 702 when executing the computer executable code. The data repository may include, but is not limited to, a database (e.g., relational, object-oriented, etc.), a file system, a flat file, a distributed data repository in which data is stored on more than one node of a computer network, a peer-to-peer network data repository, etc.

[0086] The processor 702 may be configured to access the memory 704 and execute computer executable instructions loaded therein. For example, the processor 702 may be configured to execute computer executable instructions of various program modules, applications, engines, etc. of (multiple) electronic devices 700 to enable or facilitate the execution of various operations according to one or more embodiments of the present disclosure. The processor 702 may include any suitable processing unit that can accept data as input, process input data according to stored computer executable instructions, and generate output data. The processor 702 may include any type of suitable processing unit, including but not limited to a central processing unit, a microprocessor, a reduced instruction set computer (RISC) microprocessor, a complex instruction set computer (CISC) microprocessor, a microcontroller, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a system on a chip (SoC), a digital signal processor (DSP), etc. In addition, the processor 702 may have any suitable micro-architecture design, which includes any number of components, such as, for example, registers, multiplexers, arithmetic logic units, cache controllers for controlling read / write operations of cached memory, branch predictors, etc. The microarchitectural design of processor 702 may be capable of supporting any of a variety of instruction sets.

[0087] Referring now to other illustrative components described as being stored in the data storage device 720, the O / S 722 can be loaded from the data storage device 720 into the memory 704 and can provide an interface between other application software executed on the (multiple) electronic device 700 and the hardware resources of the (multiple) electronic device 700. More specifically, the O / S 722 may include a computer executable instruction set for managing the hardware resources of the (multiple) electronic device 700 and for providing public services to other applications (e.g., managing memory allocation between various applications). In certain example embodiments, the O / S 722 may control the execution of other program modules. The O / S 722 may include any operating system now known or that may be developed in the future, including but not limited to any server operating system, any mainframe operating system, or any other proprietary or non-proprietary operating system.

[0088] The DBMS 724 may be loaded into the memory 704 and may support functions for accessing, retrieving, storing and / or manipulating data stored in the memory 704 and / or data stored in the data storage device 720. The DBMS 724 may use any of a variety of database models (e.g., relational model, object model, etc.) and may support any of a variety of query languages. The DBMS 724 may access data represented in one or more data schemas and stored in any suitable data repository, including but not limited to databases (e.g., relational, object-oriented, etc.), file systems, flat files, distributed data repositories in which data is stored on more than one node of a computer network, peer-to-peer network data repositories, etc. In those example embodiments in which the electronic device(s) 700 are mobile devices, the DBMS 724 may be any suitable lightweight DBMS optimized for performance on mobile devices.

[0089] Referring now to other illustrative components of the electronic device(s) 700, the input / output (I / O) interface(s) 706 can facilitate the electronic device(s) 700 to receive input information from one or more I / O devices, and to output information from the electronic device(s) 700 to one or more I / O devices. The I / O devices can include any of a variety of components, such as a display or screen having a touch surface or touch screen; an audio output device for producing sound, such as a speaker; an audio capture device, such as a microphone; an image and / or video capture device, such as a camera; a haptic unit; etc. Any of these components can be integrated into the electronic device(s) 700, or can be separate. The I / O devices can also include, for example, any number of peripheral devices, such as data storage devices, printing devices, etc.

[0090] The I / O interface(s) 706 may also include interfaces for external peripheral device connections, such as a Universal Serial Bus (USB), FireWire, Thunderbolt, Ethernet port, or other connection protocols that can connect to one or more networks. The I / O interface(s) 706 may also include connections to one or more of the antenna(s) 726 to connect to one or more networks via a wireless local area network (WLAN) such as a Wi-Fi radio, Bluetooth, ZigBee, and / or a wireless network radio, such as a radio capable of communicating with a wireless communication network such as a Long Term Evolution (LTE) network, a WiMAX network, a 3G network, a ZigBee network, etc.

[0091] The electronic device(s) 700 may also include one or more network interfaces 708, via which the electronic device(s) 700 may communicate with any of a variety of other systems, platforms, networks, devices, etc. The network interface(s) 708 may enable communication with, for example, one or more wireless routers, one or more host servers, one or more network servers, etc., via one or more networks.

[0092] The antenna(s) 726 may include any suitable type of antenna, e.g., depending on the communication protocol used to transmit or receive signals via the antenna(s) 726. Non-limiting examples of suitable antennas may include directional antennas, non-directional antennas, dipole antennas, folded dipole antennas, patch antennas, multiple-input multiple-output (MIMO) antennas, etc. The antenna(s) 726 may be communicatively coupled to one or more transceivers 712 or radios to which signals may be transmitted or from which signals may be received.

[0093] As previously described, the antenna(s) 726 may include a cellular antenna configured to transmit or receive signals according to established standards and protocols, such as Global System for Mobile Communications (GSM), 3G standards (e.g., Universal Mobile Telecommunications System (UMTS), Wideband Code Division Multiple Access (W-CDMA), CDMA2000, etc.), 4G standards (e.g., Long Term Evolution (LTE), WiMax, etc.), direct satellite communications, etc.

[0094] The antenna(s) 726 may additionally or alternatively include a Wi-Fi antenna configured to transmit or receive signals in accordance with established standards and protocols, such as the IEEE 802.11 family of standards, including via a 2.4 GHz channel (e.g., 802.11b, 802.11g, 802.11n), a 5 GHz channel (e.g., 802.11n, 802.11ac), or a 60 GHz channel (e.g., 802.11ad). In alternative example embodiments, the antenna(s) 726 may be configured to transmit or receive radio frequency signals within any suitable frequency range forming part of the unlicensed portion of the radio spectrum.

[0095] The antenna(s) 726 may additionally or alternatively include a GNSS antenna configured to receive GNSS signals from three or more GNSS satellites, the GNSS signals carrying temporal position information to triangulate the position therefrom. Such a GNSS antenna may be configured to receive GNSS signals from any current or planned GNSS, such as, for example, the Global Positioning System (GPS), the GLONASS system, the Compass Navigation System, the Galileo system, or the Indian Regional Navigation System.

[0096] The transceiver(s) 712 may include any suitable radio components for cooperating with the antenna(s) 726 to transmit or receive radio frequency (RF) signals in a bandwidth and / or channel corresponding to the communication protocol used by the electronic device(s) 700 to communicate with other devices. The transceiver(s) 712 may include hardware, software, and / or firmware for modulating, transmitting, or receiving communication signals according to any communication protocol discussed above, potentially cooperating with any antenna(s) 726, including but not limited to one or more Wi-Fi and / or Wi-Fi Direct protocols standardized by the IEEE 802.11 standard, one or more non-Wi-Fi protocols, or one or more cellular communication protocols or standards. The transceiver(s) 712 may also include hardware, firmware, or software for receiving GNSS signals. The transceiver(s) 712 may include any known receiver and baseband suitable for communicating via the communication protocol used by the electronic device(s) 700. The transceiver 712 may also include a low noise amplifier (LNA), additional signal amplifiers, an analog-to-digital (A / D) converter, one or more buffers, a digital baseband, and the like.

[0097] Sensor(s) / sensor interface(s) 710 may include or may be capable of interfacing with any suitable type of sensing device such as, for example, an inertial sensor, a force sensor, a thermal sensor, a photocell, etc. Example types of inertial sensors may include accelerometers (e.g., MEMS-based accelerometers), gyroscopes, etc.

[0098] Display stack(s) 714 may be a front-lit display stack, such as in combination with any Figures 1 to 6 Those described. Microphone(s) 716 may be any device configured to receive analog sound input or voice data.

[0099] It should be understood that Figure 7 The program modules, applications, computer executable instructions, codes, etc., depicted as being stored in the data storage device 720 are merely illustrative and not exhaustive, and the processing described as being supported by any particular module may alternatively be distributed over multiple modules or performed by different modules. In addition, various (multiple) program modules, (multiple) scripts, (multiple) plug-ins, (multiple) application programming interfaces (APIs), or any other suitable computer executable code hosted locally on (multiple) electronic devices 700 and / or hosted on other computing devices accessible via one or more networks may be provided to support the processing by Figure 7 The functions provided by the program modules, applications, or computer executable codes described in the embodiment, and / or additional or alternative functions. In addition, the functions can be modularized in different ways, so that the functions described as being composed of Figure 7 The processing collectively supported by the set of program modules depicted in the description may be performed by a fewer or greater number of modules, or the functionality described as supported by any particular module may be supported at least in part by another module. In addition, the program modules supporting the functionality described herein may form part of one or more applications that may be executed on any number of systems or devices according to any suitable computing model (such as, for example, a client-server model, a peer-to-peer model, etc.). In addition, the functions described as being supported by Figure 7 Any functionality supported by any program module(s) depicted in the may be implemented, at least in part, in hardware and / or firmware on any number of devices.

[0100] It should be further understood that (multiple) electronic devices 700 may include alternative and / or additional hardware, software, or firmware components other than those described or depicted without departing from the scope of the present disclosure. More specifically, it should be understood that the software, firmware, or hardware components depicted as forming a part of (multiple) electronic devices 700 are only illustrative, and in various embodiments, some components may not exist, or additional components may be provided. Although various illustrative program modules have been depicted and described as software modules stored in data storage devices 720, it should be understood that the functions described as supported by program modules can be implemented by any combination of hardware, software, and / or firmware. It should be further understood that in various embodiments, each module in the (multiple) modules mentioned above can represent the logical partitioning of the supported functions. For the convenience of explaining the functions, such logical partitioning is depicted, and such logical partitioning may not represent the structure of the software, hardware, and / or firmware used to implement the functions. Therefore, it should be understood that in various embodiments, the functions described as provided by a specific module can be provided at least in part by one or more other modules. Furthermore, in some embodiments, one or more of the depicted modules may not be present, while in other embodiments, additional modules that are not depicted may be present and may support at least a portion of the described functionality and / or additional functionality. Furthermore, while some (multiple) modules may be depicted and described as submodules of another module, in some embodiments, such modules may be provided as (multiple) independent modules or (multiple) submodules of (multiple) other modules.

[0101] The program modules, applications, etc. disclosed herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0102] The software component may be encoded in any of a variety of programming languages. The declarative programming language may be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. A software component comprising assembly language instructions may need to be converted into executable machine code by an assembler before being executed by the hardware architecture and / or platform.

[0103] Another example programming language may be a high-level programming language that is portable across multiple architectures. Software components that include high-level programming language instructions may need to be converted to an intermediate representation by an interpreter or compiler before execution.

[0104] Other examples of programming languages ​​include, but are not limited to, macro languages, shell languages ​​or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more example embodiments, a software component including instructions in one of the foregoing programming language examples may be executed directly by an operating system or other software component without having to first be converted into another form.

[0105] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, for example, in a particular directory, folder, or library. Software components may be static (e.g., pre-established or fixed) or dynamic (e.g., created or modified at execution time).

[0106] Software components can call or be called by other software components through any of a variety of mechanisms. The software components that are called or invoked may include other custom-developed application software, operating system functions (e.g., device drivers, data storage devices (e.g., file management) routines, other general routines and services, etc.), or third-party software components (e.g., middleware, encryption, or other security software, database management software, file transfer or other network communication software, mathematical software or statistical software, image processing software, and format conversion software).

[0107] The software components associated with a particular solution or system may reside on a single platform and execute on multiple platforms, or may be distributed across multiple platforms. Multiple platforms may be associated with more than one hardware vendor, underlying chip technology, or operating system. In addition, the software components associated with a particular solution or system may be initially written in one or more programming languages, but may call software components written in another programming language.

[0108] Computer executable program instructions may be loaded onto a special purpose computer or other specific machine, processor, or other programmable data processing device to produce a specific machine, so that the execution of the instructions on the computer, processor, or other programmable data processing device causes one or more functions or operations specified in the flowchart to be performed. These computer program instructions may also be stored in a computer readable storage medium (CRSM), which, when executed, may instruct the computer or other programmable data processing device to operate in a specific manner so that the instructions stored in the computer readable storage medium produce an article including instruction means, which implements one or more functions or operations specified in the flowchart. The computer program instructions may also be loaded onto a computer or other programmable data processing device so that a series of operating elements or steps are executed on the computer or other programmable device, thereby producing a computer-implemented process.

[0109] Other types of CRSMs that may be present in any device described herein may include, but are not limited to, programmable random access memory (PRAM), SRAM, DRAM, RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage device, cassette, magnetic tape, magnetic disk storage device or other magnetic storage device, or any other medium that can be used to store information and is accessible. Any combination of the above is also included within the scope of the CRSM. Alternatively, a computer-readable communication medium (CRCM) may include computer-readable instructions, program modules, or other data transmitted within a data signal, such as a carrier wave, or other transmission. However, as used herein, the CRSM does not include a CRCM.

[0110] Although the embodiments have been described in language specific to structural features and / or method actions, it should be understood that the disclosure is not necessarily limited to the specific features or actions described. On the contrary, specific features and actions are disclosed as illustrative forms for realizing embodiments. Unless otherwise specifically stated, or understood in other ways in the context used, conditional language, such as especially "can", "may", "can" or "may" is generally intended to convey that some embodiments may include certain features, elements and / or steps, while other examples do not include certain features, elements and / or steps. Therefore, such conditional language is generally not intended to mean that one or more embodiments require features, elements and / or steps in any way, or does not mean that one or more embodiments necessarily include logic for determining whether to include or execute these features, elements or steps in any particular embodiment with or without user input or prompts.

[0111] Embodiments of the present disclosure may be described according to one or more of the following:

[0112] Embodiment 1 may include a display stack comprising: an electrophoretic display (EPD); a light guide configured to receive light from one or more light emitting diodes (LEDs); and a cover lens assembly comprising: a cover glass layer; an anti-glare film coupled to the cover glass layer; and a hot melt adhesive disposed around side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a periphery of the cover lens assembly.

[0113] Embodiment 2 may include embodiment 1, wherein the anti-glare film comprises: a base film; and a plurality of particles disposed on the base film, wherein the sizes of the plurality of particles are non-uniform, and wherein the combined base film and the plurality of particles have a first refractive index value that matches a second refractive index value of the base film.

[0114] Embodiment 3 may include any one or more of embodiments 1 to 2, wherein the anti-glare film has a gray mask layer disposed on the anti-glare film.

[0115] Embodiment 4 may include any one or more of embodiments 1 to 3, wherein the light guide is disposed on a first side of the EPD, the display stack further comprising: an electromagnetic resonance layer disposed on a second side of the EPD

[0116] Embodiment 5 may include any one or more of Embodiments 1-4, wherein the hot melt adhesive is at least partially disposed on an upper surface of the cover lens assembly and partially disposed on a lower surface of the cover lens assembly.

[0117] Embodiment 6 may include any one or more of embodiments 1 to 5, wherein the hot melt adhesive is dark in color and the display stack lacks a black masking layer.

[0118] Embodiment 7 may include any one or more of embodiments 1 to 6, and further include: a first flexible printed circuit (FPC) coupled to a first side of the light guide, the first FPC including one or more LEDs and at least partially disposed between the light guide and the EPD; and a light-colored band coupled to a second side of the light guide, the light-colored band at least partially disposed between the light guide and the cover lens assembly.

[0119] Embodiment 8 may include any one or more embodiments of Embodiments 1 to 7, and further include: a touch sensor disposed between the cover lens assembly and the light guide, the touch sensor comprising an indium tin oxide film; and a second FPC disposed vertically adjacent to the first FPC, the second FPC coupled to the touch sensor.

[0120] Embodiment 9 may include any one or more of embodiments 1 to 8, wherein the light guide comprises a first set of surface features and a second set of surface features, wherein the first set of surface features is disposed in a non-horizontal inclined orientation along a side portion of the light guide, and the second set of surface features is disposed in a horizontal orientation along a middle portion of the light guide, wherein the horizontal orientation is horizontal relative to a width of the display stack.

[0121] Embodiment 10 may include a device comprising: a housing; and a display stack coupled to the housing, the display stack comprising: an electrophoretic display (EPD); a light guide; and a cover lens assembly, the cover lens assembly comprising: a cover glass layer; an anti-glare film coupled to the cover glass layer; and a hot melt adhesive disposed around side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a periphery of the cover lens assembly.

[0122] Embodiment 11 may include embodiment 10, and further include: a first light emitting diode (LED) disposed adjacent to an edge surface of the light guide, wherein the first LED is separated from the edge surface by a first distance; and a second LED disposed adjacent to the first LED, wherein the second LED is separated from the edge surface by a second distance, the second distance being greater than the first distance.

[0123] Embodiment 12 may include any one or more of Embodiments 10-11, wherein the second LED is disposed adjacent a corner of the light guide.

[0124] Embodiment 13 may include any one or more of Embodiments 10 to 12, wherein the first LED outputs non-white light and the second LED outputs white light.

[0125] Embodiment 14 may include any one or more of embodiments 10 to 13, further comprising: at least one non-black mask layer disposed around the cover lens assembly.

[0126] Embodiment 15 may include any one or more of embodiments 10 to 14, wherein the anti-glare film has a mask layer having the same color as the at least one non-black mask layer.

Claims

1. A display stack, include: Electrophoretic display (EPD); a light guide configured to receive light from one or more light emitting diodes (LEDs); as well as Cover lens assembly, comprising: Cover glass layer; an anti-glare film coupled to the cover glass layer; and A hot melt adhesive is disposed around the side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a perimeter of the cover lens assembly.

2. The display stack according to claim 1, wherein the anti-glare film include: Basement membrane; as well as A plurality of particles are disposed on the base film, wherein the size of the plurality of particles is non-uniform, and wherein the combined base film and the plurality of particles have a first refractive index value that matches a second refractive index value of the base film. 3 . The display stack according to claim 1 , wherein the anti-glare film has a gray masking layer disposed on the anti-glare film. 4 .

4. A display stack according to any one of claims 1 to 3, wherein the light guide is arranged on a first side of the EPD, the display stack further comprising: include: The electromagnetic resonance layer is disposed on the second side of the EPD.

5. The display stack of any one of claims 1 to 4, wherein the hot melt adhesive is at least partially disposed on an upper surface of the cover lens assembly and partially disposed on a lower surface of the cover lens assembly.

6. The display stack of any one of claims 1 to 5, wherein the hot melt adhesive is dark in color and the display stack is free of a black masking layer.

7. The display stack according to any one of claims 1 to 6, further comprising: include: a first flexible printed circuit (FPC) coupled to a first side of the light guide, the first FPC including the one or more LEDs and disposed at least partially between the light guide and the EPD; as well as A light-colored strip is coupled to the second side of the light guide, the light-colored strip being at least partially disposed between the light guide and the cover lens assembly.

8. The display stack according to any one of claims 1 to 7, further comprising: include: a touch sensor disposed between the cover lens assembly and the light guide, the touch sensor comprising an indium tin oxide film; as well as A second FPC is disposed vertically adjacent to the first FPC, and the second FPC is coupled to the touch sensor.

9. A display stack according to any one of claims 1 to 8, wherein the light guide comprises a first set of surface features and a second set of surface features, wherein the first set of surface features is arranged in a non-horizontal inclined orientation along a side portion of the light guide, and the second set of surface features is arranged in a horizontal orientation along a middle portion of the light guide, wherein the horizontal orientation is horizontal relative to the width of the display stack.

10. A device, include: shell; as well as a display stack coupled to the housing, the display stack comprising: Electrophoretic display (EPD); Light guides; and Cover lens assembly, comprising: Cover glass layer; an anti-glare film coupled to the cover glass layer; and A hot melt adhesive is disposed around the side edge surfaces of the cover glass layer and the anti-glare film such that the hot melt adhesive forms a perimeter of the cover lens assembly.

11. The device according to claim 10, further comprising: include: a first light emitting diode (LED) disposed adjacent an edge surface of the light guide, wherein the first LED is spaced a first distance from the edge surface; as well as A second LED is disposed adjacent to the first LED, wherein the second LED is spaced apart from the edge surface by a second distance, the second distance being greater than the first distance.

12. An apparatus according to any one of claims 10 to 11, wherein the second LED is arranged adjacent a corner of the light guide.

13. The apparatus of any one of claims 10 to 12, wherein the first LED outputs non-white light and the second LED outputs white light.

14. The device according to any one of claims 10 to 13, further comprising: include: At least one non-black masking layer is disposed around the cover lens assembly.

15. The apparatus according to any one of claims 10 to 14, wherein the anti-glare film has a mask layer having the same color as the at least one non-black mask layer.

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