A mechanical and photochemical fluid polishing integrated auxiliary machining platform and combined polishing method

Abstract

The application discloses a kind of mechanical and photochemical fluid polishing integrated auxiliary processing platform and combined polishing method;The platform includes rack, workpiece transfer mechanism for clamping and moving workpiece, mechanical fluid polishing module and photocatalytic detection feedback module.Mechanical fluid polishing module includes dual-purpose polishing tank body, mechanical polishing assembly and photocatalytic fluid polishing assembly.The application is provided in photocatalytic fluid polishing chamber Light shielding area, and the oxidation-reduction potential in and outside light shielding area is detected respectively, the photoexcitation ORP value is obtained by difference, and according to the adjustment ultraviolet light intensity, so that photoexcitation ORP value is maintained in ideal interval, keep the whole photocatalytic fluid polishing process High efficiency and reliability;Since photoexcitation ORP excludes the influence of original material oxidation of workpiece surface oxidation in polishing liquid, so it can accurately measure the increment of hydroxyl radical generated by photocatalysis, improve the control accuracy of photocatalytic fluid polishing process in the application.

Description

Technical Field

[0001] This invention belongs to the field of composite polishing technology, specifically relating to an integrated auxiliary processing platform and combined polishing method of mechanical and photochemical fluid polishing. Background Technology

[0002] Photochemical polishing is a high-precision surface treatment technology that softens surface materials through photochemical reactions, improving surface processing efficiency. Traditional photochemical polishing platforms typically consist of a separate light source, polishing slurry, and mechanical polishing device, which presents the following problems: 1. Materials requiring photochemical-assisted processing often possess characteristics such as high hardness and corrosion resistance; relying solely on a single polishing method is insufficient to improve processing efficiency. 2. During photochemical-assisted processing, the consumption of electron scavengers (such as H₂O₂) or the attenuation of the light source intensity can weaken the softening effect of the photochemical process on the metal surface, affecting the processing results. Furthermore, there is a lack of a method for real-time monitoring of the oxidation intensity on the metal surface during processing.

[0003] Therefore, there is an urgent need for a processing platform that integrates mechanical and fluid polishing functions, which can perform roughing through mechanical material removal, followed by photochemical-assisted fluid finishing, to achieve precise control of the degree of photochemical corrosion on the metal surface during the processing. Summary of the Invention

[0004] This invention aims to solve the problems of low processing efficiency and inability to achieve real-time detection of photochemical corrosion effects in existing photochemical polishing technologies, and provides an integrated auxiliary processing platform for mechanical and photochemical fluid polishing and its specific implementation method.

[0005] In a first aspect, the present invention provides an integrated auxiliary processing platform for mechanical and photochemical fluid polishing, which includes a frame, a workpiece transfer mechanism for clamping and moving workpieces, a mechanical fluid polishing module, and a photocatalytic detection and feedback module.

[0006] The mechanical-fluid polishing module includes a dual-purpose polishing tank, a mechanical polishing assembly, and a photocatalytic fluid polishing assembly. The dual-purpose polishing tank is installed in the middle of the frame and has two independent chambers: a mechanical polishing chamber and a photocatalytic fluid polishing chamber. The mechanical polishing assembly is used to mechanically polish the workpiece in the mechanical polishing chamber.

[0007] The photocatalytic fluid polishing assembly includes a jet nozzle and an ultraviolet light source installed in a photocatalytic fluid polishing chamber. The ultraviolet light source, with adjustable intensity, is installed at the bottom of the photocatalytic fluid polishing chamber. The jet nozzle is used to spray a polishing solution containing TiO2 particles and hydrogen peroxide onto the surface of a workpiece immersed in the polishing solution within the photocatalytic fluid polishing chamber.

[0008] The photocatalytic detection feedback module includes a photocatalytic ORP sensor, a light shield, a reference ORP sensor, and a light intensity sensor. The light intensity sensor detects the ultraviolet light intensity within the photocatalytic fluid polishing chamber. The light shield is installed within the photocatalytic fluid polishing chamber, forming a light-shielding area that is blocked by ultraviolet light. This light-shielding area is connected to other areas within the photocatalytic fluid polishing chamber. The detection unit of the reference ORP sensor is located within the light-shielding area; the detection unit of the photocatalytic ORP sensor is located outside the light-shielding area of ​​the photocatalytic fluid polishing chamber. During photocatalytic fluid polishing, the intensity of the ultraviolet light emitted by the ultraviolet light source is adjusted based on the redox potential difference measured by the photocatalytic ORP sensor and the reference ORP sensor.

[0009] Preferably, the detection units of the photocatalytic ORP sensor and the light intensity sensor are at the same height as the polished surface of the workpiece during the fluid polishing process.

[0010] Preferably, the photocatalytic fluid polishing assembly further includes a polishing slurry circulation assembly; the jet nozzle is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is inclined upwards. The polishing slurry circulation assembly includes a fluid-driven pump and pipes. The fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid-driven pump, and the jet nozzle are connected in sequence.

[0011] Preferably, the mechanical polishing assembly includes a grinding and polishing disc and a mechanical polishing drive structure. The grinding and polishing disc is rotatably mounted at the bottom of the mechanical polishing chamber and is driven to rotate by the mechanical polishing drive structure.

[0012] Preferably, the photocatalytic detection feedback module further includes a pH sensor for detecting the pH value of the polishing solution within the photocatalytic fluid polishing chamber. The photocatalytic fluid polishing assembly also includes a pH adjustment component. The pH adjustment component includes an acidic adjustment release device and an alkaline adjustment release device, both connected to the photocatalytic fluid polishing chamber.

[0013] Preferably, the bottom surface of the photocatalytic fluid polishing chamber has a recessed light source mounting area in the center. A protective mesh is installed at the top opening of the light source mounting area. The ultraviolet light source is installed in the light source mounting area.

[0014] Preferably, the workpiece transfer mechanism includes a three-axis moving module, a pressure module, and a clamping structure. The clamping structure is mounted on the three-axis moving module via the pressure module. The pressure module is used to apply pressure to the workpiece during mechanical polishing.

[0015] Secondly, the present invention provides a combined mechanical and photochemical fluid polishing method, which utilizes the aforementioned integrated auxiliary processing platform for combined mechanical and photochemical fluid polishing; the combined mechanical and photochemical fluid polishing method includes the following steps:

[0016] Step 1: Move the workpiece and immerse it in the polishing fluid in the mechanical polishing chamber, and then perform mechanical polishing on the workpiece using the mechanical polishing components.

[0017] Step 2: Move the workpiece and immerse it in the polishing slurry within the photocatalytic fluid polishing chamber. Detect the redox potential of the polishing slurry in the absence of ultraviolet light using a reference ORP sensor; record this as the background ORP value. b The oxidation-reduction potential of the polishing solution containing the workpiece under ultraviolet light was detected by a photocatalytic ORP sensor and recorded as the comprehensive ORP value. c Calculate the photoexcitation ORP value. By dynamically adjusting the luminous intensity of the ultraviolet light source, the photoexcitation ORP value is increased. It is controlled within the photoexcitation range.

[0018] Fluid polishing is performed by spraying a polishing slurry containing TiO2 particles and hydrogen peroxide onto the workpiece through a jet nozzle, thereby achieving a photocatalytic oxidation reaction.

[0019] Preferably, the workpiece is made of a nickel-based alloy; the polished surface of the workpiece is laser-clad.

[0020] Preferably, in step two, after immersing the workpiece in the polishing liquid of the photocatalytic fluid polishing chamber, the ultraviolet light intensity in the polishing liquid where the workpiece is located is first detected by a light intensity sensor; the luminous intensity of the ultraviolet light source is adjusted according to the measured ultraviolet light intensity so that the ultraviolet light intensity measured by the light intensity sensor reaches the preset reference light intensity value.

[0021] In step two, the photoexcitation ORP value is... The process of controlling the ORP value within the photoexcitation range is as follows: when the photoexcitation ORP value is... When the light intensity is below the preset lower limit of the photoexcitation range, the intensity of the ultraviolet light source is increased until the photoexcitation ORP value is reached. Greater than or equal to the target value for photoexcitation. When the photoexcitation ORP value... When the light intensity exceeds the preset upper limit of the photoexcitation range, the intensity of the ultraviolet light source is reduced until the photoexcitation ORP value is reached. The photoexcitation range is less than or equal to the target photoexcitation value. The preferred photoexcitation range is 4.9 to 5.1; the target photoexcitation value is 5.0.

[0022] The beneficial effects of this invention are:

[0023] 1. This invention enables the laser cladding surface of nickel-based alloy workpieces to undergo mechanical polishing and photocatalytic fluid polishing sequentially in a dual-purpose polishing tank. Furthermore, the polishing type is automatically switched by moving the workpiece through a workpiece transfer mechanism, which significantly improves the processing efficiency of integrated polishing.

[0024] 2. In this invention, a light-shielding area is set in the photocatalytic fluid polishing chamber, and the redox potential inside and outside the light-shielding area is detected respectively. The photo-excited ORP value is obtained by subtracting the two values. By adjusting the intensity of ultraviolet light, the photo-excited ORP value is maintained within the ideal range, thus ensuring the high efficiency and reliability of the entire photocatalytic fluid polishing process. Since the photo-excited ORP eliminates the influence of the oxidizing properties of the original substances in the polishing solution that contribute little to the oxidation of the workpiece surface, it can accurately measure the increase of hydroxyl radicals generated by photocatalysis, thereby improving the control precision of the photocatalytic fluid polishing process in this invention. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0026] Figure 2 This is a schematic diagram of the mechanical fluid polishing module in Embodiment 1 of the present invention.

[0027] Figure 3 This is a schematic diagram showing the relative positions of the photocatalytic detection feedback module and the mechanical fluid polishing module in Embodiment 1 of the present invention.

[0028] Figure 4 This is a schematic diagram showing the relative position of the jet nozzle and the workpiece during photocatalytic fluid polishing in Embodiment 1 of the present invention.

[0029] Reference numerals: 1. Frame; 2. Mechanical-fluid polishing module; 2-1. Dual-purpose polishing tank; 2-2. Grinding and polishing disc; 2-3. Mechanical polishing drive structure; 2-4. Jet nozzle; 2-5. Ultraviolet light source; 2-6. pH adjustment component; 3. Photocatalysis detection and feedback module; 3-1. pH sensor; 3-2. Photocatalysis ORP sensor; 3-3. Light shield; 3-4. Reference ORP sensor; 3-5. Light intensity sensor; 4. Workpiece transfer mechanism; 4-1. Three-axis movement module; 4-2. Pressurization module; 4-3. Clamping structure; 5. Control module; 6. Workpiece. Detailed Implementation

[0030] The present invention will be further described below.

[0031] Example 1

[0032] like Figure 1 As shown, an integrated auxiliary processing platform for mechanical and photochemical fluid polishing includes a frame 1, and a mechanical fluid polishing module 2, a photocatalytic detection and feedback module 3, a workpiece transfer mechanism 4, and a control module 5 mounted on the frame 1. The workpiece transfer mechanism 4 is located above the mechanical fluid polishing module 2 and is used to clamp and move the workpiece 6, thereby automatically completing the mechanical polishing and photocatalytic fluid polishing of the workpiece 6.

[0033] like Figure 1 , Figure 2 and Figure 3 As shown, the mechanical-fluid polishing module 2 includes a dual-purpose polishing tank 2-1, a mechanical polishing assembly, and a photocatalytic fluid polishing assembly. The dual-purpose polishing tank 2-1 is fixed in the middle of the frame 1. The dual-purpose polishing tank 2-1 has two independent chambers, both open at the top, which are a mechanical polishing chamber and a photocatalytic fluid polishing chamber, respectively.

[0034] The mechanical polishing assembly is used to mechanically polish the workpiece 6 in a mechanical polishing chamber, and includes a grinding and polishing disc 2-2 and a mechanical polishing drive structure 2-3. The grinding and polishing disc 2-2 is rotatably mounted at the bottom of the inner cavity of the mechanical polishing chamber. The mechanical polishing drive structure 2-3 is used to drive the grinding and polishing disc 2-2 to rotate, thereby performing polishing operations on the workpiece 6 immersed in the mechanical polishing chamber and pressed against the grinding and polishing disc 2-2. In this embodiment, the mechanical polishing drive structure 2-3 is a motor-driven structure.

[0035] The photocatalytic fluid polishing assembly is used to irradiate the surface of the workpiece 6 with ultraviolet light in the photocatalytic fluid polishing chamber and to rinse it with a polishing liquid containing hydrogen peroxide, thereby achieving photocatalytic fluid polishing.

[0036] The photocatalytic fluid polishing assembly includes a jet nozzle 2-4, an ultraviolet light source 2-5, a polishing fluid circulation assembly, and a pH adjustment assembly 2-6.

[0037] A recessed light source mounting area is located in the center of the bottom surface of the photocatalytic fluid polishing chamber. The light source mounting area is integrated with the photocatalytic fluid polishing chamber, allowing the polishing fluid to enter the light source mounting area. A protective mesh is installed at the top opening of the light source mounting area. The ultraviolet light source 2-5 is installed in the light source mounting area to emit ultraviolet light upwards, photocatalyzing the reaction between hydrogen peroxide in the polishing fluid and the surface of the metal workpiece 6 being processed.

[0038] In this embodiment, the ultraviolet light source 2-5 is an ultraviolet lamp tube with adjustable light intensity, thereby adjusting the ultraviolet light intensity irradiated on the surface of the workpiece 6 and adjusting the reaction and corrosion rate of the surface of the workpiece 6 during the photocatalytic fluid polishing process.

[0039] The jet nozzle 2-4 is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is inclined upwards. The polishing fluid circulation assembly includes a fluid-driven pump and pipes. The fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid-driven pump, and the jet nozzle 2-4 are connected in sequence; the continuous fluid polishing operation on the workpiece 6 is achieved by driving the polishing fluid in the photocatalytic fluid polishing chamber through the fluid-driven pump. During the polishing process, the jet nozzle 2-4 continuously releases polishing fluid at a pressure of 600 kPa, eroding the metal surface of the workpiece 6, and at the same time, it stirs the polishing fluid to make it as uniform as possible.

[0040] pH adjustment components 2-6 are used to adjust the pH value of the polishing solution by injecting an acidic or alkaline solution into the photocatalytic fluid polishing chamber. They include an acidic adjustment release device and an alkaline adjustment release device. The acidic adjustment release device stores an acidic solution and is connected to the photocatalytic fluid polishing chamber via a regulating valve; the alkaline adjustment release device stores an alkaline solution and is connected to the photocatalytic fluid polishing chamber via a regulating valve.

[0041] The photocatalytic detection feedback module 3 includes a pH sensor 3-1, a photocatalytic ORP sensor 3-2, a light shield 3-3, a reference ORP sensor 3-4, and a light intensity sensor 3-5, all mounted on the rack 1.

[0042] A light shield 3-3 is installed on the side wall of the photocatalytic fluid polishing chamber. The light shield 3-3 forms a light-shielding area inside the photocatalytic fluid polishing chamber that cannot be reached by ultraviolet light. The light-shielding area is connected to other areas inside the photocatalytic fluid polishing chamber, allowing the polishing fluid to freely enter and exit the light-shielding area.

[0043] The pH sensor 3-1 is used to detect the pH value of the polishing fluid in the photocatalytic fluid polishing chamber; the reference ORP sensor 3-4 is used to detect the redox potential of the light-shielded area in the photocatalytic fluid polishing chamber; the photocatalytic ORP sensor 3-2 is used to detect the redox potential of the area outside the light-shielded area in the photocatalytic fluid polishing chamber; and the light intensity sensor 3-5 is used to detect the ultraviolet light intensity in the photocatalytic fluid polishing chamber. The detection parts of the photocatalytic ORP sensor 3-2 and the light intensity sensor 3-5 are at the same height as the polished surface of the workpiece 6 during the fluid polishing process.

[0044] Based on the pH value measured by the pH sensor 3-1, and in conjunction with the acidic and alkaline adjustment and release devices, the pH value of the polishing solution can be precisely adjusted.

[0045] The workpiece transfer mechanism 4 includes a three-axis moving module 4-1, a pressurizing module 4-2, and a clamping structure 4-3. The three-axis moving module 4-1 includes an X-axis moving platform, a Y-axis moving platform, and a Z-axis moving platform connected in sequence, as well as a mounting base block mounted on a slider structure of the Z-axis moving platform. The clamping structure 4-3 is mounted on the mounting base block via the pressurizing module 4-2 and is used to clamp the workpiece 6. The pressurizing module 4-2 uses a cylinder to apply pressure to the workpiece 6 on the clamping structure 4-3.

[0046] The control module 5 is used to control the workpiece transfer mechanism 4, the mechanical fluid polishing module 2, and the photocatalytic detection feedback module 3 to perform mechanical and photocatalytic fluid polishing.

[0047] In this embodiment, workpiece 6 is made of Inconel 718 nickel-based alloy. The surface to be polished is laser clad with metal powder of the same material, and the thickness of the cladding layer is about 0.5 mm.

[0048] In this embodiment, the polishing slurry is a mixed solution of TiO2 anatase, H2O2 (hydrogen peroxide), and water in a certain proportion. The preferred mass ratio of TiO2 anatase, H2O2, and water in the polishing slurry is 2:5:93.

[0049] In some preferred embodiments, the mechanical fluid polishing module 2 further includes a hydrogen peroxide replenishment device; the hydrogen peroxide outlet of the hydrogen peroxide replenishment device is located above the photocatalytic fluid polishing chamber, and is used to replenish H2O2 as needed during the photochemical fluid polishing process, so that the H2O2 concentration in the polishing liquid is maintained within the target range.

[0050] Example 2

[0051] A combined mechanical and photochemical fluid polishing method, utilizing the integrated auxiliary processing platform for mechanical and photochemical fluid polishing described in Example 1, includes the following steps:

[0052] Step 1: The workpiece 6 is clamped and fixed by the clamping structure 4-3 in the workpiece transfer mechanism 4. In this embodiment, the workpiece 6 is a nickel-based alloy.

[0053] Step 2: Send control commands through control module 5 to control the X-axis moving platform, Y-axis moving platform and Z-axis moving platform in the three-axis moving module 4-1 to move and immerse the workpiece 6 into the mechanical polishing chamber, so that the machined surface of the bottom of the workpiece 6 comes into contact with the grinding and polishing disc 2-2.

[0054] Step 3: The mechanical polishing drive structure 2-3 drives the grinding and polishing disc 2-2 to rotate, performing mechanical grinding (roughing) on ​​the bottom surface of the workpiece 6. cj seconds, where t cj This refers to the mechanical grinding time. Since mechanical polishing is more efficient than photocatalytic fluid polishing, performing this step before photocatalytic fluid polishing can significantly reduce the overall processing time and improve processing efficiency.

[0055] Step 4: Send control commands through control module 5 to control the X-axis moving platform, Y-axis moving platform and Z-axis moving platform in the three-axis moving module 4-1 to move and move the workpiece 6 to the designated position in the photocatalytic fluid polishing chamber.

[0056] Step 5: Detect the ultraviolet light intensity I at the same height position on the machined surface of workpiece 6 using light intensity sensors 3-5; control the ultraviolet light source 2-5, combined with light intensity I, to maintain light intensity I at 120mW / cm².2 The above. The pH value V of the polishing solution was detected by pH sensor 3-1. ph By controlling the acid-regulating release device and the alkaline-regulating release device, combined with the real-time updated pH value V... ph The pH value (Vph) of the polishing solution should be controlled between 7.5 and 8.

[0057] Step Six: Block ultraviolet light irradiation with a light shield 3-3. Detect the redox potential of the polishing solution containing hydrogen peroxide in the absence of ultraviolet light using a reference ORP sensor 3-4, and record it as the background ORP value. b The oxidation-reduction potential of the polishing slurry at the same height position on the machined surface of workpiece 6 was detected by photocatalytic ORP sensor 3-2 and recorded as the comprehensive ORP value. c .

[0058] Step 7. Refer to Equations (1), (2) and (3) below. Under ultraviolet light irradiation, ultraviolet light can excite TiO2 to generate electron-hole pairs, which eventually generate hydroxyl radicals. Hydroxyl radicals can rapidly oxidize the surface of nickel-based alloys.

[0059] Equation (1)

[0060] Equation (2)

[0061] Equation (3)

[0062] In the absence of ultraviolet light, hydroxyl radicals The amount produced is extremely small and disappears quickly; the oxidizing power of hydrogen peroxide in the polishing solution is insufficient to rapidly oxidize the surface of nickel-based alloys.

[0063] Because the overall ORP value measured in step six is ​​O c The overall redox capability of the reactive polishing slurry includes the oxidizing properties of substances such as hydrogen peroxide. However, this oxidizing property contributes very little to the oxidation rate of the workpiece; therefore, the overall ORP value is used. c Quantitative analysis of the corrosion effect of polishing slurry on workpieces is inaccurate. Instead, the increase in redox potential before and after ultraviolet irradiation should be used to measure the corrosion effect of the polishing slurry on the workpiece surface.

[0064] Considering that hydroxyl radicals disappear rapidly without ultraviolet light irradiation, the background ORP value was obtained by measuring the redox potential of the shaded area. b Based on this, a differential measurement is introduced to represent the increment of oxidation intensity experienced by the metal surface (i.e., Photoexcited ORP value (concentration increment) This eliminates the influence of changes in the bulk solution composition in the quantitative analysis of corrosion on the workpiece surface, thus achieving accurate characterization of interfacial oxidation.

[0065] Due to photoexcitation ORP value and The concentration of free radicals is positively correlated and can be used as a direct indicator of photocatalytic oxidation efficiency. Therefore, this embodiment can realize real-time detection and control of the oxidation intensity of the metal surface during processing.

[0066] In this embodiment, the comprehensive ORP value O c ORP value with background b The photoexcitation ORP value is obtained by subtraction calculation. The expression is shown in equation (4):

[0067] Equation (4)

[0068] When light excitation ORP value When the light intensity is below the preset lower limit of the photoexcitation range, the intensity of the ultraviolet light source is increased until the photoexcitation ORP value is reached. Greater than or equal to the target value for photoexcitation. When the photoexcitation ORP value... When the light intensity exceeds the preset upper limit of the photoexcitation range, the intensity of the ultraviolet light source is reduced until the photoexcitation ORP value is reached. The photoexcitation value is less than or equal to the target value, thereby achieving precise control over the degree of corrosion on the metal surface. In this embodiment, the photoexcitation range is 4.9–5.1; the target value is 5.0.

[0069] Step 8: Activate the jet nozzles 2-4 and the polishing slurry circulation assembly, allowing the jet nozzles 2-4 to continuously spray polishing slurry onto the bottom of the workpiece's surface. This, combined with the oxidation reaction of hydroxyl radicals generated under ultraviolet photocatalysis, erodes the workpiece's surface, achieving a smooth finish. Simultaneously, the continuous spraying from the jet nozzles 2-4 ensures more uniform dispersion of abrasive particles in the polishing slurry. In this embodiment, the jet nozzle's exit pressure is 600 kPa. During the fluid polishing process, a 5% (w / w) H2O2 solution is periodically dripped into the photocatalytic fluid polishing chamber via the mechanical fluid polishing module 2 to reduce H2O2 consumption during polishing.

[0070] Processing t lt After a few seconds, the ultraviolet light source 2-5 is turned off, and the jet nozzles 2-4 stop spraying polishing fluid, thus ending the photocatalytic fluid polishing process. lt For fluid polishing processing time.

[0071] Step 9: Send control commands through the control module to control the X-axis moving platform, Y-axis moving platform, and Z-axis moving platform in the three-axis moving module 4-1 to move the workpiece out of the photocatalytic fluid polishing chamber and disassemble it.

Claims

1. An integrated auxiliary processing platform for mechanical and photochemical fluid polishing, comprising a workpiece transfer mechanism (4); characterized in that: It also includes a mechanical fluid polishing module (2) and a photocatalytic detection feedback module (3); The mechanical-fluid polishing module (2) includes a dual-purpose polishing tank (2-1), a mechanical polishing component, and a photocatalytic fluid polishing component; the dual-purpose polishing tank (2-1) is provided with an independent mechanical polishing chamber and a photocatalytic fluid polishing chamber; the mechanical polishing component is used to mechanically polish the workpiece (6) in the mechanical polishing chamber; The photocatalytic fluid polishing assembly includes a jet nozzle (2-4) and an ultraviolet light source (2-5) installed in the photocatalytic fluid polishing chamber; the ultraviolet light source (2-5) with adjustable light intensity is installed at the bottom of the photocatalytic fluid polishing chamber; the jet nozzle (2-4) is used to spray a polishing liquid containing TiO2 particles and hydrogen peroxide onto the surface of the workpiece immersed in the polishing liquid in the photocatalytic fluid polishing chamber; The mechanical polishing assembly includes a grinding and polishing disc (2-2) and a mechanical polishing drive structure (2-3); the grinding and polishing disc (2-2) is rotatably mounted at the bottom of the mechanical polishing chamber and is driven to rotate by the mechanical polishing drive structure (2-3); The bottom surface of the photocatalytic fluid polishing chamber is provided with a recessed light source mounting area in the middle; a protective net is installed at the top opening of the light source mounting area; the ultraviolet light source (2-5) is installed in the light source mounting area; The photocatalytic detection feedback module (3) includes a photocatalytic ORP sensor (3-2), a light shield (3-3), a reference ORP sensor (3-4), and a light intensity sensor (3-5). The light intensity sensor (3-5) is used to detect the intensity of ultraviolet light in the photocatalytic fluid polishing chamber. The light shield (3-3) is installed in the photocatalytic fluid polishing chamber to form a light-shielding area that cannot be irradiated by ultraviolet light. The light-shielding area is connected to other areas in the photocatalytic fluid polishing chamber. The detection part of the reference ORP sensor (3-4) is located in the light-shielding area. The detection part of the photocatalytic ORP sensor (3-2) is located outside the light-shielding area of ​​the photocatalytic fluid polishing chamber. During the photocatalytic fluid polishing process, the intensity of ultraviolet light emitted by the ultraviolet light source (2-5) is adjusted by the difference in redox potential measured by the photocatalytic ORP sensor (3-2) and the reference ORP sensor (3-4). The workpiece transfer mechanism (4) includes a three-axis moving module (4-1), a pressure module (4-2), and a clamping structure (4-3); the clamping structure (4-3) is mounted on the three-axis moving module (4-1) via the pressure module (4-2); the pressure module (4-2) is used to apply extrusion force to the workpiece (6) during mechanical polishing.

2. The integrated auxiliary processing platform for mechanical and photochemical fluid polishing according to claim 1, characterized in that: The detection units of the photocatalytic ORP sensor (3-2) and the light intensity sensor (3-5) are at the same height as the polished surface of the workpiece (6) during the fluid polishing process.

3. The integrated mechanical and photochemical fluid polishing auxiliary processing platform according to claim 1, characterized in that: The photocatalytic fluid polishing assembly also includes a polishing liquid circulation assembly; the jet nozzle (2-4) is installed at the bottom edge of the inner cavity of the photocatalytic fluid polishing chamber and is inclined upward; the polishing liquid circulation assembly includes a fluid drive pump and a pipeline; the fluid outlet at the bottom of the photocatalytic fluid polishing chamber, the fluid drive pump and the jet nozzle (2-4) are connected in sequence.

4. The integrated auxiliary processing platform for mechanical and photochemical fluid polishing according to claim 1, characterized in that: The photocatalytic detection feedback module (3) further includes a pH sensor (3-1) for detecting the pH value of the polishing liquid in the photocatalytic fluid polishing chamber; the photocatalytic fluid polishing assembly further includes a pH adjustment assembly (2-6); the pH adjustment assembly (2-6) includes an acidic adjustment release device and an alkaline adjustment release device, both of which are connected to the photocatalytic fluid polishing chamber.

5. A combined mechanical and photochemical fluid polishing method, characterized in that: Using the integrated mechanical and photochemical fluid polishing auxiliary processing platform as described in claim 1; the combined mechanical and photochemical fluid polishing method includes the following steps: Step 1: Move the workpiece (6) and immerse it in the polishing liquid in the mechanical polishing chamber, and perform mechanical polishing on the workpiece (6) through the mechanical polishing assembly; Step 2: Move the workpiece (6) and immerse it in the polishing solution in the photocatalytic fluid polishing chamber; detect the redox potential of the polishing solution in the absence of ultraviolet light using the reference ORP sensor (3-4), and record it as the background ORP value. b The oxidation-reduction potential of the workpiece (6) in the polishing solution under ultraviolet light was detected by a photocatalytic ORP sensor (3-2) and recorded as the comprehensive ORP value. c ; Calculate the photoexcitation ORP value By dynamically adjusting the luminescence intensity of the ultraviolet light source (2-5), the photoexcitation ORP value is increased. Controlled within the photoexcitation range; Fluid polishing under photocatalytic oxidation reaction is carried out by spraying polishing liquid containing TiO2 particles and hydrogen peroxide onto the workpiece through jet nozzles (2-4).

6. The mechanical and photochemical fluid combined polishing method according to claim 5, characterized in that: The workpiece is made of a nickel-based alloy; the polished surface of the workpiece is laser-clad.

7. The mechanical and photochemical fluid combined polishing method according to claim 5, characterized in that: Step 2: After immersing the workpiece (6) in the polishing liquid of the photocatalytic fluid polishing chamber, the ultraviolet light intensity in the polishing liquid where the workpiece (6) is located is first detected by the light intensity sensor (3-5); the luminous intensity of the ultraviolet light source (2-5) is adjusted according to the measured ultraviolet light intensity so that the ultraviolet light intensity measured by the light intensity sensor (3-5) reaches the preset reference light intensity value. In step two, the photoexcitation ORP value is... The process of controlling the ORP value within the photoexcitation range is as follows: when the photoexcitation ORP value is... When the light intensity is below the preset lower limit of the photoexcitation range, the intensity of the ultraviolet light source is increased until the photoexcitation ORP value is reached. Greater than or equal to the photoexcitation target value; when the photoexcitation ORP value When the light intensity exceeds the preset upper limit of the photoexcitation range, the intensity of the ultraviolet light source is reduced until the photoexcitation ORP value is reached. Less than or equal to the target value for photoexcitation.

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