Substrate cutting apparatus, substrate cutting method of substrate cutting apparatus, and control method

Abstract

The present invention relates to a substrate cutting apparatus, a substrate cutting method of the substrate cutting apparatus, and a control method, the substrate cutting apparatus comprising: a cutting unit having a blade that rotates to cut a substrate; the rotating part is used for supporting the cutting part; and a base part which supports the rotating part, and the rotating part rotates with the base part as a reference.

Description

Technical Field

[0001] The present invention relates to a substrate cutting device, a substrate cutting method of the substrate cutting device, and a control method. Background Art

[0002] A substrate for semiconductor processes is cut by a substrate cutting device and separated in chip units.

[0003] Examples of such substrates include wafers, sapphires, and glass.

[0004] Conventional substrate cutting devices can only cut the cutting surface of a substrate (the slope of the side surface separated in chip units) vertically, so there are limitations in the technology of separating in chip units.

[0005] Recently, in the technology of separating in chip units, a technology for cutting the cutting surface of a substrate to be inclined is required.

[0006] In particular, in the MLA (Micro Lens Array) technology, a technology for cutting the cutting surface of a lens to be inclined is required. Summary of the Invention

[0007] An object of the present invention is to provide a substrate cutting device that cuts the cutting surface of a substrate to be inclined.

[0008] A substrate cutting device according to an embodiment of the present invention includes: a cutting unit having a blade that rotates to cut a substrate; a rotating unit that supports the cutting unit; and a base unit that supports the rotating unit.

[0009] According to an embodiment, the rotating unit rotates with respect to the base unit as a reference.

[0010] According to an embodiment, the rotation plane of the rotating unit and the rotation plane of the blade are perpendicular.

[0011] According to an embodiment, the rotating unit is rotated by a rotation actuator fixed to the base unit.

[0012] According to an embodiment, the rotation actuator includes: a gear unit fixed to the rotating unit; and a driven gear unit fixed to the rotation actuator.

[0013] According to an embodiment, the gear unit and the driven gear unit work by meshing to cause the rotation actuator to rotate the rotating unit.

[0014] According to an embodiment, the position rotated by the rotating unit is measured by an encoding unit.

[0015] According to an embodiment, the position rotated by the rotating unit is fixed by a jig.

[0016] According to an embodiment, the fixture includes: a first fixture that is fixed to the rotating part and applies a force to pull the base part toward the rotating part to fix the position where the rotating part rotates.

[0017] According to an embodiment, a first support part is formed above the base part, and the first fixture presses the first support part.

[0018] According to an embodiment, the fixture includes: a second fixture that is fixed to the base part and applies a force to push the rotating part away from the base part to fix the position where the rotating part rotates.

[0019] According to an embodiment, a second support part is formed on the side of the rotating part, and the second fixture presses the second support part.

[0020] According to an embodiment, the cutting part is moved up and down by an upper and lower actuator fixed to the rotating part.

[0021] According to an embodiment, the substrate cutting device further includes: a bridge part that provides a passage for moving the substrate below and is fixed with a left and right actuator for moving the base part left and right; a chuck part that moves the substrate below the bridge part; and a platform part that supports the bridge part and the chuck part.

[0022] The substrate cutting device according to an embodiment of the present invention includes: a first cutting part and a second cutting part, each having a first blade and a second blade that rotate to cut the substrate; a first base part and a second base part that respectively support the first cutting part and the second cutting part; a bridge part that provides a passage for moving the substrate below and supports the first base part and the second base part in a manner that allows the first base part and the second base part to move left and right; a chuck part that moves the substrate below the bridge part; and a platform part that supports the bridge part and the chuck part.

[0023] According to an embodiment, one or more of the first cutting part and the second cutting part are rotated by being supported by the first base part and the second base part through a rotating part.

[0024] According to an embodiment, the first cutting part rotates with the first base part as a reference through a rotating part, and the second cutting part is fixed to the base part and does not rotate with the second base part as a reference.

[0025] According to an embodiment, the first cutting part cuts the substrate such that the cutting surface is inclined, and the second cutting part cuts the substrate such that the cutting surface is not inclined.

[0026] The substrate cutting method of the substrate cutting device according to an embodiment of the present invention is such that the cutting surface of the substrate is formed to be inclined. The substrate cutting method of the substrate cutting device includes: a step of tilting the blade; a step of lowering the blade; a step of bringing the blade and the substrate into contact at a first point; and a step of moving the substrate so that the blade and the substrate are in contact at a second point to cut the substrate from the first point to the second point.

[0027] The control method of the substrate cutting device according to an embodiment of the present invention, the substrate cutting device includes: a cutting unit having a blade that rotates to cut a substrate; a rotating unit that supports the cutting unit; a base unit that supports the rotating unit; and a control unit that controls the rotating unit to rotate the rotating unit with respect to the base unit as a reference. The control of the control unit includes: Step S1, based on the rotation working value of the rotating unit, operating a rotation actuator to rotate the rotating unit; Step S2, a coding unit measures the position where the rotating unit rotates; and Step S3, comparing the measured position with the rotation working value.

[0028] According to an embodiment, it is characterized in that the control of the control unit further includes: Step S4, when there is a difference between the measured position and the rotation working value, making the rotation actuator additionally operate.

[0029] According to an embodiment, it is characterized in that the control of the control unit further includes: Step S5, when the measured position and the rotation working value are the same, fixing the position where the rotating unit rotates with a clamp.

[0030] The present invention has the effect that the cutting surface of the substrate is formed to be inclined. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings, and although similar reference numerals denote similar components, the present invention is not limited thereto.

[0032] Figure 1 It is a diagram related to a substrate cutting device according to an embodiment of the present invention.

[0033] Figure 2 It is a diagram showing before the rotating unit rotates according to an embodiment of the present invention.

[0034] Figure 3 It is a diagram showing after the rotating unit rotates according to an embodiment of the present invention.

[0035] Figure 4 It is a diagram in which a partial structure is omitted to show gears and the like according to an embodiment of the present invention.

[0036] Figure 5 It is a diagram of observing the base unit according to an embodiment of the present invention from another direction.

[0037] Figure 6It is a diagram showing that the cut surface of the substrate cut according to an embodiment of the present invention is inclined.

[0038] Figure 7 (a) thereof shows a diagram before the blade is inclined according to an embodiment of the present invention.

[0039] Figure 7 (b) thereof shows a diagram after the blade is inclined according to an embodiment of the present invention.

[0040] Figure 7 (c) thereof shows a diagram of the blade descending according to an embodiment of the present invention.

[0041] Figure 8 (a) thereof shows a diagram of the blade and the substrate in contact at the first point according to an embodiment of the present invention.

[0042] Figure 8 (b) thereof shows a diagram of the substrate moving and the blade and the substrate in contact at the second point according to an embodiment of the present invention.

[0043] Figure 9 It is a diagram showing the flow of a control method of a substrate cutting device according to an embodiment of the present invention.

[0044] (Explanation of reference numerals)

[0045] S: Substrate B: Blade

[0046] 10: Bridge part 20: Chuck part

[0047] 30: Platform part 100: Cutting part

[0048] 200: Rotating part 300: Base part Detailed description of the specific embodiment

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings so that those with ordinary knowledge in the technical field to which the present invention pertains can easily implement it.

[0050] The present invention can be implemented in various different forms and is not limited to the embodiments described herein.

[0051] As Figures 1 to 3 shown, the substrate cutting device according to an embodiment of the present invention may include a cutting part 100, a rotating part 200, and a base part 300.

[0052] The cutting part 100 may include a blade B that rotates to cut the substrate S. For example, the blade B may be a circular cutting edge.

[0053] The rotating part 200 may support the cutting part 100.

[0054] The base portion 300 can support the rotating portion 200.

[0055] The rotating portion 200 can rotate with respect to the base portion 300. For example, the rotating portion 200 can be connected to the base portion 300 by a rotating shaft and rotate with respect to the base portion 300 with the rotating shaft as a reference.

[0056] The cutting portion 100 can rotate together with the rotation of the rotating portion 200. At this time, the blade B can be tilted together with the rotation of the cutting portion 100.

[0057] The rotating surface RS of the rotating portion and the rotating surface BS of the blade can be perpendicular. That is, the rotating portion 200 and the blade B of the cutting portion 100 can be perpendicularly arranged. Thus, when the rotating portion 200 rotates, the upper side of the blade B is tilted more inward (toward the direction of the rotating portion) than the lower side. If the substrate S is cut with the tilted blade B, the cutting surface of the substrate S can be tilted. At this time, the rotation angle of the rotating portion 200 and the slope of the tilt of the blade B can correspond.

[0058] The rotation actuator 400 fixed to the base portion 300 can rotate the rotating portion 200. At this time, the rotation actuator 400 can directly rotate the rotating portion 200 or indirectly rotate the rotating portion 200. For example, in order to directly rotate the rotating portion 200, the rotating portion 200 can be directly connected to the shaft rod operating in the rotation actuator 400 and rotate, or in order to indirectly rotate the rotating portion 200, the rotating portion 200 can be connected to the rotation actuator 400 through a gear and rotate. For example, the rotation actuator 400 can be a servo motor.

[0059] As Figure 4 shown, the method of indirectly rotating the rotating portion 200 through a gear can be such that the rotation actuator 400 includes a gear portion 410 and a driven gear portion 420. For example, the gear portion 410 and the driven gear portion 420 can be helical gears.

[0060] It can be that the gear portion 410 is fixed to the rotating portion 200, the driven gear portion 420 is fixed to the rotation actuator 400, and through the meshing operation of the gear portion 410 and the driven gear portion 420, the rotation actuator 400 rotates the rotating portion 200.

[0061] As Figure 5 shown, if the rotating portion 200 rotates through the rotation actuator 400, the rotation position of the rotating portion 200 can be measured by the encoding portion 500. After that, it can be confirmed whether the position measured in the encoding portion 500 and the rotation angle intended to rotate the rotating portion 200, that is, the rotation operation value, are consistent. If there is a difference between the measured position and the rotation operation value, the rotation actuator 400 can be additionally operated to rotate the rotating portion 200 and corrected to be consistent with the rotation operation value.

[0062] If the rotating part 200 rotates, the rotating position of the rotating part 200 can be fixed by a jig. The jig can be fixed to either the rotating part 200 or the base part 300 and apply a pushing or pulling force to the other to fix the rotating position of the rotating part 200.

[0063] If the rotating position of the rotating part 200 is fixed by a jig, it is possible to prevent the rotating position of the rotating part 200 from changing due to the vibration generated while the blade B cuts the substrate S.

[0064] As Figure 4 and Figure 5 shown, the jig may include a first jig 610 and a second jig 620. At this time, the jig may also include only either the first jig 610 and the second jig 620, or include both the first jig 610 and the second jig 620.

[0065] The first jig 610 can be fixed to the rotating part 200 to rotate together with the rotating part 200 and apply a force to pull the base part 300 toward the rotating part 200 to fix the rotating position of the rotating part 200.

[0066] The first jig 610 can press a first support part 710 formed above the base part 300 to fix the rotating position of the rotating part 200. For example, the first jig 610 can be a link-type jig cylinder that is pulled and fixed by an opening and closing rod.

[0067] The second jig 620 can be fixed to the base part 300 and apply a force to push the rotating part 200 away from the base part 300 to fix the rotating position of the rotating part 200.

[0068] The second jig 620 can be formed on the side of the rotating part 200 to press a second support part 720 that rotates together with the rotating part 200 to fix the rotating position of the rotating part 200. The second jig 620 can be fixed to the base part 300 through a support beam 621 that provides a channel for the second support part 720 to move below, and press the second support part 720 that moves below the support beam 621. For example, the second jig 620 can be a cylinder that is pushed and fixed by a telescopic rod.

[0069] The vertical actuator 800 fixed to the rotating part 200 can move the cutting part 100 up and down. For example, the vertical actuator 800 can be a ball screw motor.

[0070] The cutting part 100 can be fixed to a nut whose position moves as the screw rotates, and move up and down with reference to the rotating part 200 through the movement of the nut.

[0071] As Figure 1As shown, the substrate cutting device according to an embodiment of the present invention may further include a bridge portion 10, a chuck portion 20, and a platform portion 30.

[0072] The bridge portion 10 may provide a passage SW for moving the substrate S therebelow and is fixed with a left-right actuator 900 for moving the base portion 300 left and right. For example, the left-right actuator 900 may be a ball screw motor.

[0073] The base portion 300 may be fixed to a nut whose position moves as the screw rotates and move left and right with reference to the bridge portion 10 by the movement of the nut.

[0074] The chuck portion 20 may support the placed substrate S. The chuck portion 20 may move the substrate S below the bridge portion 10.

[0075] The platform portion 30 may support the bridge portion 10 and the chuck portion 20.

[0076] A moving actuator for moving the chuck portion 20 supporting the substrate S may be fixed to the platform portion 30. For example, the moving actuator may be a ball screw motor.

[0077] It may be that the bridge portion 10 includes columns 11 supported by the platform portion 30 on both sides in the moving direction of the chuck portion 20 and an upper frame 12 supported by the columns 11, a passage for moving the chuck portion 20 is provided between the columns 11, and the base portion 300 is supported by the upper frame 12 and moves left and right.

[0078] For the substrate cutting device according to an embodiment of the present invention described above, two or more base portions 300 may be supported by the bridge portion 10 and move left and right, and its structure will be described as follows.

[0079] As Figure 1 As shown, the substrate cutting device according to an embodiment of the present invention may include a first cutting portion 110 and a second cutting portion 120, a first base portion 310 and a second base portion 320, a bridge portion 10, a chuck portion 20, and a platform portion 30.

[0080] The first cutting portion 110 and the second cutting portion 120 may respectively include a first blade B1 and a second blade B2 that rotate to cut the substrate S.

[0081] The first base portion 310 and the second base portion 320 may respectively support the first cutting portion 110 and the second cutting portion 120.

[0082] It may be that the bridge portion 10 provides a passage SW for moving the substrate S therebelow, and the first base portion 310 and the second base portion 320 are supported to move left and right.

[0083] The chuck portion 20 may move the substrate S below the bridge portion 10.

[0084] The platform unit 30 can support the bridge unit 10 and the chuck unit 20.

[0085] One or more of the first cutting unit 110 and the second cutting unit 120 can be supported by the rotating unit 200 on the first and second base units 310, 320 and rotate.

[0086] As Figure 6 shown, it can be that the first cutting unit 110 rotates with respect to the first base unit 310 by the rotating unit 200, and the second cutting unit 120 is fixed to the base unit 300 and does not rotate with respect to the second base unit 320. Thus, it can be that the first cutting unit 110 cuts the substrate S such that the cutting surface is inclined, and the second cutting unit 120 cuts the substrate S such that the cutting surface is not inclined.

[0087] In addition, the first cutting unit 110 and the second cutting unit 120 can rotate with respect to the first base unit 310 and the second base unit 320 by the rotating unit 200, respectively. Thus, the first cutting unit 110 and the second cutting unit 120 can cut the substrate S such that the cutting surface is inclined.

[0088] As Figure 7 and Figure 8 shown, the method of cutting the substrate S such that the cutting surface is inclined in the substrate cutting device according to an embodiment of the present invention can include the following steps.

[0089] As Figure 7 in (a) of Figure 7 and (b) of

[0090] shown, perform the step of tilting the blade B. At this time, the cutting unit 100 can rotate together with the rotating unit 200 and the blade B is tilted. Figure 7 As

[0091] in (c) of Figure 8 shown, perform the step of lowering the blade B. At this time, the cutting unit 100 can lower with respect to the rotating unit 200 and the blade B is lowered.

[0092] As Figure 8 in (a) of

[0093] shown, perform the step of the blade B and the substrate S contacting at the first point P1. At this time, the first point P1 can be the starting point of the blade B cutting the substrate S. Figure 8

[0093] shown, perform the step of moving the substrate S so that the blade B and the substrate S contact at the second point P2 and cutting the substrate S from the first point P1 to the second point P2. At this time, the second point P2 is the end point of the blade B cutting the substrate S. If the substrate S is placed on the chuck unit 20 and moved, the blade B can cut the substrate S from the first point P1 to the second point P2.

[0093] After that, the cutting of the substrate S from the first point P1 to the second point P2 by the blade B can be performed multiple times. Such a method may include the following steps.

[0094] Perform the step of raising the blade B.

[0095] Perform the step of moving the substrate S so that the blade B is located at the first point P1.

[0096] Perform the step of lowering the blade B.

[0097] Perform the step of bringing the blade B into contact with the substrate S at the first point P1.

[0098] Perform the step of moving the substrate S so that the blade B and the substrate S are in contact at the second point P2, thereby cutting the substrate S from the first point P1 to the second point P2.

[0099] Repeat the above steps multiple times. At this time, the number of repetitions can be set differently according to the thickness of the substrate S.

[0100] As Figure 9 shown, in a substrate cutting apparatus including a cutting unit 100 having a blade B that rotates to cut a substrate S, a rotating unit 200 that supports the cutting unit 100, a base unit 300 that supports the rotating unit 200, and a control unit that controls the rotating unit 200 to rotate the rotating unit 200 with respect to the base unit 300 as a reference, the control of the control unit may include the following steps.

[0101] Step S1 may be to operate the rotation actuator 400 based on the rotation working value of the rotating unit 200 to rotate the rotating unit 200. At this time, the rotation working value may correspond to the rotation angle for rotating the rotating unit 200.

[0102] Step S2 may be to measure the position where the rotating unit 200 has rotated by the encoder unit 500. At this time, the position where the rotating unit 200 has rotated measured by the encoder unit 500 may be the rotation angle of the rotating unit 200.

[0103] Step S3 may be to compare the measured position with the rotation working value. At this time, the measured position may correspond to the position where the rotating unit 200 has rotated measured by the encoder unit 500.

[0104] Step S4, when there is a difference between the measured position and the rotation working value, may cause the rotation actuator 400 to perform additional operation. For example, when the rotation working value is 15 degrees and the measured position is 13 degrees, the difference between the measured position and the rotation working value is 2 degrees, and the rotation actuator 400 may be caused to perform additional operation to rotate the rotating unit 200 by an additional 2 degrees.

[0105] In step S5, when the measured position and the rotational working value are the same, the rotational position of the rotating part 200 can be fixed with a jig.

[0106] Based on the comparison result of step S3 described above, step S4 or step S5 can be selectively executed.

[0107] In addition, step S2 and step S3 can be executed after step S4.

[0108] As described above, the present invention has been described in detail through preferred embodiments. However, the present invention is not limited thereto and can be implemented in various forms within the scope of the claims.

Claims

1. A substrate cutting device, characterized in that: include: a cutting portion having a blade that rotates to cut the substrate; A rotating part, supporting the cutting part; as well as a base portion supporting the rotating portion, The rotating portion rotates with reference to the base portion.

2. The substrate cutting device according to claim 1, characterized in that: The rotating surface of the rotating part is perpendicular to the rotating surface of the blade.

3. The substrate cutting device according to claim 1, characterized in that: The rotating portion is rotated by a rotating actuator fixed to the base portion.

4. The substrate cutting device according to claim 3, characterized in that: The rotary actuator comprises: a gear portion fixed to the rotating portion; and a driven gear portion fixed to the rotary actuator, The gear portion and the driven gear portion mesh with each other so that the rotary actuator rotates the rotary portion.

5. The substrate cutting device according to claim 4, characterized in that: The position of the rotating part is measured by the encoder part.

6. The substrate cutting device according to claim 1, characterized in that: The position of the rotating part is fixed by a clamp.

7. The substrate cutting device according to claim 6, characterized in that: The fixture comprises: The first clamp is fixed to the rotating part and applies a force to pull the base part toward the rotating part to fix the rotated position of the rotating part.

8. The substrate cutting device according to claim 7, characterized in that: A first supporting portion is formed above the base portion, The first jig presses the first support portion.

9. The substrate cutting device according to claim 7, characterized in that: The fixture comprises: The second clamp is fixed to the base portion and applies a force to push the rotating portion away from the base portion to fix the rotated position of the rotating portion.

10. The substrate cutting device according to claim 9, characterized in that: A second supporting portion is formed on the side of the rotating portion, The second jig presses the second support portion.

11. The substrate cutting device according to claim 1, characterized in that: The cutting part is moved up and down by a vertical actuator fixed to the rotating part.

12. The substrate cutting device according to claim 1, characterized in that: The substrate cutting device further comprises: A bridge portion, which provides a passage for moving the substrate at the bottom and is fixed with left and right actuators for moving the base portion left and right; a chuck portion that moves the substrate below the bridge portion; and The platform portion supports the bridge portion and the chuck portion.

13. A substrate cutting device, characterized in that: include: The first cutting part and the second cutting part are respectively provided with a first blade and a second blade which rotate to cut the substrate; A first base portion and a second base portion, supporting the first cutting portion and the second cutting portion respectively; a bridge portion, providing a passage for moving the substrate at the bottom and supporting the first base portion and the second base portion in a manner that the first base portion and the second base portion can move left and right; a chuck portion for moving the substrate below the bridge portion; as well as a platform portion, supporting the bridge portion and the chuck portion, One or more of the first cutting part and the second cutting part are supported by the first base part and the second base part via a rotating part so as to rotate.

14. The substrate cutting device according to claim 13, characterized in that: The first cutting part is rotated by the rotating part with the first base part as a reference, The second cutting portion is fixed to the base portion and does not rotate based on the second base portion.

15. The substrate cutting device according to claim 14, characterized in that: The first cutting portion cuts the substrate so that the cutting surface is inclined. A cutting surface formed by the second cutting portion cutting the substrate is not inclined.

16. A substrate cutting method of a substrate cutting device, wherein a cutting surface of the substrate is formed by tilting, the substrate cutting method comprising: Steps to tilt the blade; a step of lowering said blade; The step of contacting the blade and the substrate at a first point; as well as The step of moving the substrate so that the blade and the substrate come into contact at a second point to cut the substrate from the first point to the second point.

17. A control method for a substrate cutting device, the substrate cutting device comprising: a cutting portion having a blade that rotates to cut the substrate; A rotating part, supporting the cutting part; A base portion supporting the rotating portion; as well as a control unit that controls the rotating unit so that the rotating unit rotates with respect to the base unit, The control of the control unit includes: Step S1, operating a rotary actuator based on the rotational work value of the rotary part to rotate the rotary part; Step S2, the encoding unit determines the position of the rotating unit; and In step S3, the measured position is compared with the rotation working value.

18. The control method of the substrate cutting device according to claim 17, characterized in that: The control of the control unit also includes: In step S4, when there is a difference between the measured position and the rotational operation value, the rotation actuator is additionally operated.

19. The control method of the substrate cutting device according to claim 17, characterized in that: The control of the control unit also includes: In step S5, when the measured position is the same as the rotation working value, the position of the rotating part is fixed by a clamp.

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