Shell embossing device for electronic product production

Abstract

The invention belongs to the field of electronic product production, and particularly relates to a shell embossing device for electronic product production. The invention discloses a shell embossing device for electronic product production. The shell embossing device for electronic product production can be used for rapidly placing and fixing a shell and carrying out overturning printing. The shell embossing device comprises a base and the like; placing mechanisms are symmetrically arranged on the table top of the base, an embossing mechanism is arranged on the base above the placing mechanisms, and a turn-over mechanism is connected between the embossing mechanism and the placing mechanisms. According to the device, through the placement mechanism, a shell can be accurately placed and fixed, so that the shell can be embossed more stably; the shell can be turned over through the turn-over mechanism, so that the turn-over operation of the shell can be completed without manual operation, the equipment is more convenient to use, the printed shell can be quickly taken out through the pushing mechanism, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the field of electronic product production, and particularly relates to an outer shell embossing device for electronic product production. Background Art

[0002] An outer shell embossing device is a device used to press specific patterns or textures on the outer shells of electronic products, and is widely used in the manufacturing of products such as mobile phones, computers, and household appliances. The core function of the outer shell embossing device is to press the designed patterns or textures onto the surfaces of the outer shells made of plastics, metals, or other materials through mechanical pressure, so as to enhance the aesthetics and recognition of the products. At present, when embossing the outer shells of electronic products such as mobile phones and computers, the existing outer shell embossing machines usually use a workbench in cooperation with a clamping device to fix the outer shell, and then the embossing device contacts the outer shell to complete the embossing.

[0003] When a general embossing device embosses the outer shell of an electronic product, it is necessary to manually place and fix the outer shell, and then start the embossing device. After the embossing is completed, it is also necessary to manually remove the outer shell. The manual fixing and removing processes are time-consuming and affect the efficiency; when both sides of the outer shell need to be embossed, it is necessary to complete the double-sided embossing in two times, and the outer shell needs to be manually taken out and flipped and re-placed after each pressing, which increases the operation time.

[0004] Therefore, there is an urgent need to develop an outer shell embossing device for electronic product production that can quickly place and fix the outer shell and can perform flipping and printing. Summary of the Invention

[0005] In order to overcome the above-mentioned disadvantages of the prior art, the present invention provides an outer shell embossing device for electronic product production that can quickly place and fix the outer shell and can perform flipping and printing.

[0006] The technical solution is as follows: An outer shell embossing device for electronic product production includes a base, a placement mechanism, an embossing mechanism, and a turning-over mechanism. The placement mechanisms are symmetrically arranged on the tabletop of the base. The embossing mechanism is arranged on the base above the placement mechanism. A turning-over mechanism is connected between the embossing mechanism and the placement mechanism; the turning-over mechanism includes a guide rail, a connecting shaft, a gear, a spring II, a track, a sliding sleeve, a concave rod, a top rod, and a rack. Guide rails are fixedly connected to both the left and right sides of the placement mechanism. A connecting shaft is fixedly connected to the middle of the outer side of the placement mechanism. Gears are connected to the connecting shafts through overrunning clutches. The connecting shafts are rotatably connected to the sliders on the guide rails. Springs II are connected between the sliders on the guide rails and the guide rails. Tracks are fixedly connected to the bases on both the left and right sides of the embossing mechanism. Sliding sleeves are slidably connected to the tracks. Concave rods are arranged on the front sides of the sliding sleeves. Top rods are fixedly connected to both the left and right sides of the embossing mechanism. The top rods are between the concave parts of the concave rods. A rack is fixedly connected to the base above the gears. A limiting groove is opened in the lower part of the front side of the concave rod.

[0007] Optionally, the placement mechanism includes a Y-axis module, a placement frame, concave guide rods, clamping plates, and spring I. On the tabletop of the base, Y-axis modules are symmetrically and fixedly connected on the left and right. A placement frame is fixedly connected to the slider of the Y-axis module. Concave guide rods are slidably connected to both the left and right walls of the placement frame. A spring I is connected between the concave guide rod and the outer wall of the placement frame. The inner end of the concave guide rod is connected to a clamping plate.

[0008] Optionally, the placement mechanism further includes inclined block I. Inclined block I is symmetrically arranged at the front and rear of the top of the clamping plate, and the inclined surface of inclined block I faces inwards.

[0009] Optionally, the placement mechanism further includes a stop block. Stop blocks are fixedly connected to the middle of the front and rear walls of the placement frame.

[0010] Optionally, the embossing mechanism includes a cylinder and a pressing plate. A cylinder is vertically installed on the base above the Y-axis module, and a pressing plate is fixedly connected to the bottom end of the cylinder.

[0011] Optionally, a pushing mechanism is further included. A pushing mechanism is arranged at the front of the placement frame. The pushing mechanism includes a pull rod, inclined block II, and spring III. An inclined block II is slidably arranged at the bottom inside the placement frame, and the inclined surface of the inclined block II faces downwards. A pull rod is slidably connected inside the placement frame in front of the inclined block II. The rear part of the pull rod is below the inclined block II, and a spring III is connected between the pull rod and the placement frame.

[0012] Optionally, a positioning mechanism is further included. A positioning mechanism is arranged at the bottom end of the concave rod. The positioning mechanism includes a spring IV and a triangular block. Triangular blocks are symmetrically slidably arranged up and down in the limiting groove at the bottom end of the concave rod, and a spring IV is connected between the triangular block and the concave rod.

[0013] Optionally, a heat dissipation mechanism is further included. A heat dissipation mechanism is fixedly connected to the base above the placement frame, and the heat dissipation mechanism is a heat dissipation fan.

[0014] The beneficial effects of the present invention are as follows: Through the placement mechanism of the present invention, the outer shell can be accurately placed and fixed, enabling the outer shell to be embossed more stably; through the turning mechanism, the outer shell can be turned over, enabling the outer shell to complete the turning operation without manual intervention, making the equipment more convenient to use. Through the pushing mechanism, the embossed outer shell can be quickly taken out, improving work efficiency. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1Schematic three - dimensional structure diagram of the present invention.

[0017] Figure 2 Schematic three - dimensional structure diagram of the components on the base of the present invention.

[0018] Figure 3 Schematic three - dimensional structure diagram of the present invention during embossing.

[0019] Figure 4 Schematic three - dimensional structure diagram of the placement mechanism and the components of the turning - over mechanism on the Y - axis module of the present invention.

[0020] Figure 5 Schematic three - dimensional structure diagram of the placement mechanism of the present invention.

[0021] Figure 6 Schematic three - dimensional structure diagram of the material - pushing mechanism of the present invention.

[0022] Figure 7 Schematic three - dimensional structure diagram of the turning - over mechanism of the present invention.

[0023] Figure 8 Schematic three - dimensional structure diagram of the positioning mechanism of the present invention.

[0024] Figure 9 For the present invention Figure 8 Enlarged view of A in

[0025] Reference numerals in the drawings: 1 - base, 2 - placement mechanism, 21 - Y - axis module, 22 - placement frame, 23 - concave guide rod, 24 - clamping plate, 25 - spring I, 26 - inclined block I, 27 - stop block, 3 - embossing mechanism, 31 - cylinder, 32 - pressing plate, 4 - turning - over mechanism, 41 - guide rail, 42 - connecting shaft, 43 - gear, 44 - spring II, 45 - track, 46 - sliding sleeve, 47 - concave rod, 48 - ejector rod, 49 - rack, 5 - material - pushing mechanism, 51 - pull rod, 52 - inclined block II, 53 - spring III, 6 - positioning mechanism, 61 - spring IV, 62 - triangular block, 7 - heat - dissipation mechanism. Detailed implementation manners

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0027] Accordingly, a feature pointed out in this specification is used to illustrate one of the features of an embodiment of the present invention, rather than implying that each embodiment of the present invention must have the illustrated feature. In addition, it should be noted that this specification describes many features. Although some features may be combined to show possible system designs, these features can also be used in other combinations not explicitly described. Accordingly, unless otherwise stated, the illustrated combinations are not intended to be limiting.

[0028] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0030] The principle and structure of the present invention will be described in detail below in conjunction with the drawings and embodiments.

[0031] Embodiment: An outer shell embossing device for electronic product production, as Figures 1-8 shown, includes a base 1, a placement mechanism 2, an embossing mechanism 3, and a turning mechanism 4. The placement mechanism 2 is symmetrically arranged on the tabletop of the base 1 for placing the outer shell to be embossed. The embossing mechanism 3 is arranged on the base 1 above the placement mechanism 2, and the embossing mechanism 3 embosses the outer shell by lifting and lowering. A turning mechanism 4 is connected between the embossing mechanism 3 and the placement mechanism 2 to turn the outer shell over and achieve double-sided embossing.

[0032] As Figure 4 and Figure 5 shown, the placement mechanism 2 includes a Y-axis module 21, a placement frame 22, a concave guide rod 23, a clamping plate 24, a spring I 25, an inclined block I 26, and a stop block 27. The Y-axis module 21 is symmetrically and fixedly connected to the tabletop of the base 1 by bolts on the left and right. The slider of the Y-axis module 21 is fixedly connected to the placement frame 22 by bolts. The Y-axis module 21 drives the placement frame 22 to move back and forth. The left and right walls of the placement frame 22 are both slidably connected to the concave guide rod 23. A spring I 25 is connected between the concave guide rod 23 and the outer side wall of the placement frame 22. The inner end of the concave guide rod 23 is connected to the clamping plate 24. The inner side surface of the clamping plate 24 is provided with anti-slip lines. The inclined block I 26 is symmetrically arranged at the front and rear of the top of the clamping plate 24, and the inclined surface of the inclined block I 26 faces inward. The stop block 27 is fixedly connected to the middle of the front and rear walls of the placement frame 22 by bolts to prevent the outer shell from damaging the placement frame 22.

[0033] As Figure 3 shown, the embossing mechanism 3 includes a cylinder 31 and a pressing plate 32. The cylinder 31 is vertically installed on the base 1 above the Y-axis module 21 by bolts, and the bottom end of the cylinder 31 is fixedly connected to the pressing plate 32 by bolts. The pressing plate 32 is driven by the cylinder 31 to move up and down for embossing.

[0034] As Figure 4 、 Figure 7 and Figure 8 shown, the turning-over mechanism 4 includes a guide rail 41, a connecting shaft 42, a gear 43, a spring II 44, a track 45, a sliding sleeve 46, a concave rod 47, a ejector rod 48 and a rack 49. Guide rails 41 are fixedly connected to both the left and right sides of the slider on the Y-axis module 21 by bolts. A connecting shaft 42 is fixedly connected to the middle of the outer side of the concave guide rod 23 by bolts. Gears 43 are connected to the connecting shaft 42 through overrunning clutches. The connecting shaft 42 is rotatably connected to the slider on the guide rail 41. A spring II 44 is connected between the slider on the guide rail 41 and the guide rail 41. Tracks 45 are fixedly connected to the base 1 on both the left and right sides of the cylinder 31 by bolts. A sliding sleeve 46 is slidably connected to the track 45. A concave rod 47 is arranged on the front side of the sliding sleeve 46. Ejector rods 48 are fixedly connected to both the left and right sides of the pressing plate 32 by bolts. The ejector rods 48 are between the concave parts of the concave rod 47. A rack 49 is fixedly connected to the base 1 above the gear 43 by bolts. The gear 43 can be meshed with the rack 49. A limiting groove is formed in the lower part of the front side of the concave rod 47.

[0035] When using this device to emboss the outer shell, the outer shell to be embossed is placed down from above the placement frame 22. The edge of the outer shell contacts the inclined block I 26, pushing the inclined block I 26 to move downward, and the spring I 25 stretches. After the outer shell is placed, the clamping plate 24 clamps the outer shell to fix it. Subsequently, the Y-axis module 21 drives the placement frame 22 and the outer shell inside it to move backward to the lower side of the pressing plate 32. Then, the cylinder 31 is controlled to extend, driving the pressing plate 32 to move downward to emboss the outer shell. After the embossing of the outer shell below the pressing plate 32 is completed, the pressing plate 32 is driven by the cylinder 31 to move upward to reset. If the outer shell needs to be embossed on both sides, the cylinder 31 continues to drive the pressing plate 32 to move upward. When the pressing plate 32 moves upward to drive the ejector rod 48 to move upward, when the ejector rod 48 moves upward to contact the upper part of the concave rod 47, it drives the concave rod 47 to move upward, and then drives the connecting shaft 42 and the gear 43 to move upward, causing the placement frame 22 to move upward, and the spring II 44 stretches. When the gear 43 moves upward to engage with the rack 49, the gear 43 rotates counterclockwise by 180 degrees, driving the connecting shaft 42 to rotate counterclockwise by 180 degrees, and then driving the placement frame 22 to rotate by 180 degrees, so that the outer shell in the placement frame 22 is turned over. Then, the cylinder 31 is controlled to extend downward. At this time, the gear 43 idles and does not drive the placement frame 22 to rotate. After the placement frame 22 is reset, the cylinder 31 drives the pressing plate 32 to move downward to emboss the other side of the outer shell. After the embossing of the outer shell is completed, the cylinder 31 drives the pressing plate 32 to move upward to reset, and at the same time, the Y-axis module 21 drives the placement frame 22 to reset. Then, the embossed outer shell in the placement frame 22 is taken out.

[0036] As Figure 6 shown, it further includes a pushing mechanism 5. A pushing mechanism 5 is arranged at the front part of the placement frame 22. The pushing mechanism 5 includes a pull rod 51, an inclined block II 52 and a spring III 53. The inclined block II 52 is slidably arranged at the bottom inside the placement frame 22, and the inclined surface of the inclined block II 52 faces downward. The pull rod 51 is slidably connected inside the placement frame 22 in front of the inclined block II 52. The rear part of the pull rod 51 is below the inclined block II 52, and a spring III 53 is connected between the pull rod 51 and the placement frame 22.

[0037] When it is necessary to take out the embossed outer shell, the pull rod 51 is moved backward, and the spring III 53 is compressed. The pull rod 51 moves backward to push the inclined block II 52 to move upward. The inclined block II 52 moves upward to push the embossed outer shell upward, so that the embossed outer shell can be taken out more conveniently. Then, the pull rod 51 is released, and the spring III 53 resets to drive the pull rod 51 to reset. Under the action of gravity, the inclined block II 52 moves downward to reset.

[0038] As Figure 8 and Figure 9As shown, it further includes a positioning mechanism 6. The positioning mechanism 6 is provided at the bottom end of the concave rod 47. The positioning mechanism 6 includes a spring IV 61 and a triangular block 62. The triangular blocks 62 are symmetrically arranged up and down and slidably provided in the limiting grooves at the bottom end of the concave rod 47. A spring IV 61 is connected between the triangular block 62 and the concave rod 47. When the connecting shaft 42 is inserted into the limiting groove of the concave rod 47, the triangular blocks 62 are pushed apart and the spring III 53 is compressed. After the connecting shaft 42 is inserted into the limiting groove of the concave rod 47, the spring III 53 resets to drive the triangular block 62 to reset, clamping the connecting shaft 42. In this way, when the connecting shaft 42 moves upward, it can be more stable.

[0039] As Figure 2 and Figure 3 shown, it further includes a heat dissipation mechanism 7. The heat dissipation mechanism 7 is fixedly connected to the base 1 above the placement frame 22 by bolts. The heat dissipation mechanism 7 is a heat dissipation fan, and the heat dissipation fan is used to dissipate heat from the embossed outer shell.

[0040] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A shell embossing device for electronic product production, comprising a base (1), a placement mechanism (2), an embossing mechanism (3) and a flipping mechanism (4), wherein the placement mechanism (2) is symmetrically arranged on the table of the base (1), the embossing mechanism (3) is arranged on the base (1) above the placement mechanism (2), and the flipping mechanism (4) is connected between the embossing mechanism (3) and the placement mechanism (2); characterized in that: The flipping mechanism (4) comprises a guide rail (41), a connecting shaft (42), a gear (43), a spring II (44), a track (45), a sliding sleeve (46), a concave rod (47), a push rod (48) and a rack (49). The left and right sides of the placement mechanism (2) are fixedly connected with the guide rails (41). The middle part of the outer side surface of the placement mechanism (2) is fixedly connected with a connecting shaft (42). The connecting shaft (42) is connected with a gear (43) via an overrunning clutch. The connecting shaft (42) is rotatably connected to a slider on the guide rail (41). The guide rail (41) A spring II (44) is connected between the slider and the guide rail (41). Tracks (45) are fixedly connected to the base (1) on the left and right sides of the embossing mechanism (3). Slide sleeves (46) are slidably connected to the track (45). A concave rod (47) is arranged on the front side of the slide sleeve (46). Both left and right sides of the embossing mechanism (3) are fixedly connected to push rods (48). The push rods (48) are between the concave parts of the concave rods (47). A rack (49) is fixedly connected to the base (1) above the gear (43). A limiting groove is arranged on the lower front side of the concave rod (47).

2. The housing embossing device for electronic product production according to claim 1, characterized in that: The placement mechanism (2) comprises a Y-axis module (21), a placement frame (22), a concave guide rod (23), a clamping plate (24) and a spring I (25). The Y-axis module (21) is fixedly connected to the table surface of the base (1) in a symmetrical manner on the left and right sides. The placement frame (22) is fixedly connected to the slider of the Y-axis module (21). The left and right walls of the placement frame (22) are both slidably connected to the concave guide rod (23). A spring I (25) is connected between the concave guide rod (23) and the outer wall of the placement frame (22). The inner end of the concave guide rod (23) is connected to the clamping plate (24).

3. The housing embossing device for electronic product production according to claim 2, characterized in that: The placement mechanism (2) also includes an inclined block I (26). The inclined block I (26) is symmetrically arranged on the top of the clamping plate (24) in the front and rear directions, and the inclined surface of the inclined block I (26) faces inward.

4. The housing embossing device for electronic product production according to claim 2, characterized in that: The placement mechanism (2) also includes a stopper (27), and the stopper (27) is fixedly connected to the middle of the front and rear walls of the placement frame (22).

5. The housing embossing device for electronic product production according to claim 4, characterized in that: The embossing mechanism (3) comprises a cylinder (31) and a pressing plate (32). The cylinder (31) is vertically mounted on the base (1) above the Y-axis module (21), and the pressing plate (32) is fixedly connected to the bottom end of the cylinder (31).

6. The housing embossing device for electronic product production according to claim 5, characterized in that: The invention also comprises a pushing mechanism (5), wherein the front part of the placing frame (22) is provided with the pushing mechanism (5), and the pushing mechanism (5) comprises a pull rod (51), an inclined block II (52) and a spring III (53). The bottom of the placing frame (22) is slidably provided with an inclined block II (52), and the inclined surface of the inclined block II (52) faces downward. The placing frame (22) is slidably connected with the pull rod (51) in front of the inclined block II (52), and the rear part of the pull rod (51) is below the inclined block II (52). The spring III (53) is connected between the pull rod (51) and the placing frame (22).

7. The housing embossing device for electronic product production according to claim 6, characterized in that: The invention also comprises a positioning mechanism (6), wherein the bottom end of the concave rod (47) is provided with the positioning mechanism (6), and the positioning mechanism (6) comprises a spring IV (61) and a triangular block (62), and the triangular block (62) is symmetrically slidably arranged in the limiting groove at the bottom end of the concave rod (47) up and down, and the spring IV (61) is connected between the triangular block (62) and the concave rod (47).

8. The housing embossing device for electronic product production according to claim 7, characterized in that: It also includes a heat dissipation mechanism (7), which is fixedly connected to the base (1) above the placement frame (22), and the heat dissipation mechanism (7) is a heat dissipation fan.

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