Silicon wafer conveying production line and unloading and carrying device thereof

Abstract

The invention relates to a silicon wafer conveying production line and an unloading and carrying device thereof. The unloading and carrying device comprises a rack, a material basket, a wafer unloading mechanism and a carrying mechanism. The two bearing plates in the carrying module are driven to move in a non-synchronous mode, so that the lifting rod on one side of the two rows of lifting rods used for lifting the silicon wafers reaches the limit in advance, the lifting rod on the other side lags behind to reach the limit, and the lifting rod in the row reaching in advance can serve as an alignment stop plate; the inclined silicon wafers are adjusted in the process that the next row of lifting rods arrive at the limiting position, so that the problem that the silicon wafers are clamped and broken due to the fact that the horizontal distance after inclination is lengthened in a synchronous moving mode is solved, and alignment adjustment of the silicon wafers is carried out through single-side external force. The gap between the two rows of lifting rods used for clamping can be adjusted to be slightly larger than the width of the silicon wafer, the centering problem in the silicon wafer transferring process can be solved, and the problem that the silicon wafer is clamped and broken in the diagonal direction when the small gap is synchronously moved can also be prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor preparation, and in particular to a silicon wafer conveying production line and a material unloading and handling device thereof. Background Art

[0002] Solar silicon wafers (PECVD) are extremely thin and brittle. When they are automatically distributed from the basket to the subsequent processes such as screen printing and welding, it is necessary to avoid excessive contact with the etched silicon wafer surface, which would cause surface damage and affect the quality of processes such as screen printing. It is also necessary to avoid deviation and tilting. Misalignment of the silicon wafer will not only affect the quality of subsequent welding, but also often cause breakage due to clamping and contact on both sides during transportation, resulting in a decrease in yield.

[0003] For example, the Chinese invention patent with the patent publication number CN109292452A discloses a silicon wafer unloading device, including a basket, the basket is configured to receive silicon wafers from the front-end production line, a basket fixing device, the basket fixing device is configured to fix the basket, a basket conveying device, the basket conveying device is configured to convey the basket to the basket fixing device, a silicon wafer out-basket device, the silicon wafer out-basket device is configured to separate the silicon wafers from the basket, a silicon wafer storage device, the silicon wafer storage device is configured to store silicon wafers, and a silicon wafer conveying device, the silicon wafer conveying device receives the silicon wafers separated by the silicon wafer out-basket device and moves the silicon wafers into the silicon wafer storage device. Through the arrangement of the basket conveying device and the silicon wafer conveying device, the conveying action of the basket and the silicon wafer is realized, and the manual conveying of the basket and the silicon wafer is avoided. The patent technology discloses an integrated silicon wafer out-basket device. Although it realizes automatic unloading, it has problems such as poor efficiency and a large contact area with the silicon wafer resulting in a large damage area.

[0004] For another example, the Chinese invention patent with the patent publication number CN102244144A discloses an automatic silicon wafer correction device. It includes a frame, a silicon wafer conveying mechanism and a silicon wafer correction mechanism; the left and right vertical plates of the frame are respectively fixed vertically at the two ends of the rear part of the frame table, the middle vertical plate is vertically fixed in the middle of the rear part of the frame table, and the rear end of the connecting plate is fixed on the middle vertical plate; the silicon wafer conveying mechanism includes an electric cylinder, an air cylinder, a connecting block and a vacuum suction cup, the electric cylinder is horizontally arranged, and its two ends are respectively fixed on the left and right vertical plates, the electric cylinder has a sliding block that can move horizontally and reciprocatingly, the air cylinder is fixed on the sliding block, the connecting block is fixed on the piston rod end of the air cylinder, and a vacuum suction cup for sucking silicon wafers is fixed on the connecting block; the silicon wafer correction mechanism is installed on the frame and is located on the moving path of the silicon wafer conveying mechanism. This invention patent adjusts and corrects the silicon wafer through the silicon wafer fine-tuning sub-mechanism and the camera, and the setting is relatively complex and costly. Summary of the invention

[0005] In view of the defects in the prior art, an object of the present invention is to provide a silicon wafer conveying production line and a material unloading and handling device thereof.

[0006] A silicon wafer unloading and conveying device provided in accordance with the present invention comprises a frame, a material basket, a wafer unloading mechanism and a conveying mechanism arranged on the frame; The basket moves to the unloading station after receiving the silicon wafers from the front-end production line, and the unloading mechanism is configured to transport the silicon wafers stacked in the basket layer by layer; The transport mechanism includes a load-bearing frame, a lifting drive cylinder, a loading platform, a transport module and a horizontal drive cylinder, the lifting drive cylinder is fixedly connected to the load-bearing frame, the loading platform is drivingly connected to the lifting drive cylinder, a slide is provided on the loading platform, the transport module includes a lifting rod, a left load plate and a right load plate, the lifting rod is an L-shaped structure, the left load plate and the right load plate are respectively connected to the lifting rod, and the left load plate and the right load plate are slidably connected to the slide through the horizontal drive cylinder; The unloading mechanism transports the silicon wafer from the material basket to the bottom of the loading platform, the horizontal driving cylinder drives the left loading plate and the right loading plate to approach each other to a predetermined distance in an asynchronous manner, the lifting driving cylinder drives the loading platform to rise, and the lifting rods connected to the left loading plate and the right loading plate lift the silicon wafer on the unloading mechanism, and the distance between the lifting rods located on both sides of the silicon wafer is greater than the width of the silicon wafer.

[0007] In some embodiments, the horizontal drive cylinder is a one-way drive cylinder, which includes a drive rod and a cylinder body, the end of the drive rod is connected to the left load-bearing plate, the end of the cylinder body is connected to the right load-bearing plate, and a left limit block, a middle limit block and a right limit block are provided on the loading platform. The left limit block is used to limit the left position of the left load-bearing plate, the right limit block is used to limit the right position of the right load-bearing plate, and the middle limit block is used to limit the middle position of the left load-bearing plate and the right load-bearing plate approaching each other. The left load-bearing plate and the right load-bearing plate are driven by the horizontal drive cylinder to reach the predetermined limit positions one after another.

[0008] In some embodiments, the left bearing plate and the right bearing plate are both H-shaped plates, the left bearing plate is respectively connected to the lifting rods at the four corners, the right bearing plate is respectively connected to the lifting rods at the four corners, the left bearing plate and the right bearing plate are staggered, the lifting rods located at the two corners on the left side of the left bearing plate and the lifting rods located at the two corners on the left side of the right bearing plate form a group of carrying rods, and the lifting rods located at the two corners on the right side of the left bearing plate and the lifting rods located at the two corners on the right side of the right bearing plate form a group of carrying rods.

[0009] In some embodiments, the material basket includes a top plate, a material rod and a bottom plate, and the material rod is provided with support plates for carrying the silicon wafers in sequence from top to bottom. A plurality of the material rods are clamped and connected between the top plate and the bottom plate to form a three-row structure with intervals, and the silicon wafers stacked in the material basket are in two parallel rows.

[0010] In some embodiments, the sheet unloading mechanism includes a pull-out platform and a pull-out drive cylinder, the pull-out drive cylinder is driven to connect the pull-out platform, a pull hook is arranged side by side at the front end of the pull-out platform, and a wedge block is arranged side by side at a predetermined distance from the pull hook; The pull-out drive cylinder drives the pull-out table to the bottom of the material basket. After the material basket drops to a predetermined height, the silicon wafer is located between the hook and the wedge block. The pull-out drive cylinder drives the pull-out table to move out, and the silicon wafer moves with the pull-out table to the bottom of the loading platform.

[0011] In some embodiments, the hook is composed of a connecting portion, an inclined portion, and a bending portion from the rear end to the front end, wherein the connecting portion is connected to the pulling table, the inclined portion is used to contact and support the silicon wafer, and the bending portion is used to pull out the silicon wafer.

[0012] In some implementations, the pull-out tables are provided in two groups, and the pull-out drive cylinder drives the two groups of pull-out tables to move synchronously.

[0013] In some embodiments, the unloading station is provided with a displacement mechanism, which includes a horizontal displacement machine and a vertical displacement machine. The vertical displacement machine is driven and connected to the horizontal displacement machine. The horizontal displacement machine is used to adjust the horizontal position of the material basket, and the vertical displacement machine realizes the vertical displacement of the material basket by driving the horizontal displacement machine to move up and down.

[0014] The present invention also provides a silicon wafer conveying production line, which adopts the silicon wafer unloading and conveying device and also includes a conveying mechanism; The conveying mechanism comprises a conveying drive motor, a conveying belt, a support block and a limit hook, wherein the conveying drive motor drives the conveying belt to rotate, the support blocks are arranged on the conveying belt in an array, the limit hook is connected to the side of the conveying belt, the limit hook has the same structure as the pull hook, and the support block is provided with an inclined surface; After the transport module descends to a predetermined height, the silicon wafer is placed on the support block and the limit hook, with both ends of the silicon wafer supported on the inclined surface of the support block and both sides of the silicon wafer supported on the inclined surface of the limit hook.

[0015] In some implementations, the conveyor belts are divided into two groups, and the conveyor drive motor drives the two groups of conveyor belts to rotate synchronously.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The silicon wafer unloading and handling device provided in the present embodiment drives the two carrying plates in the handling module to move in an asynchronous manner, so that one side of the two rows of lifting rods used to lift the silicon wafers reaches the limit first, and the lifting rod on the other side reaches the limit later. The lifting rods in the row that arrive first can act as an alignment stop plate, and the lifting rods in the row that arrive later adjust the tilted silicon wafers during reaching the limit, thereby avoiding the problem of being clamped and broken due to the lengthened horizontal distance after tilting in the synchronous movement mode. The alignment adjustment of the silicon wafers is implemented by a unilateral external force, so that the gap between the two rows of lifting rods used for clamping can be adjusted to be slightly larger than the width of the silicon wafer, which can solve the centering problem in the silicon wafer transportation process, and can also prevent the problem of silicon wafers being clamped and broken in the diagonal direction when the synchronous movement has a small gap, thereby solving the centering requirement in the later process of silicon wafer preparation, and improving the yield rate and production efficiency of silicon wafer production.

[0017] 2. The silicon wafer unloading and handling device provided in the present application removes the silicon wafers from the material basket through a pull-out structure, which greatly reduces the contact area with the silicon wafers, effectively improves the material distribution rate, and further improves the production efficiency.

[0018] 3. The silicon wafer unloading and handling device provided in the present application realizes that the handling module can simultaneously handle two silicon wafers by changing the single-side single-row lifting rod structure connected to the carrying plate in the handling module into a two-side two-row structure, thereby doubling the handling efficiency and further improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings: Figure 1 This is a schematic diagram of the overall structure of the silicon wafer unloading and handling device of the present invention; Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle part A; Figure 3 for Figure 1 A magnified schematic diagram of the structure of the middle B section; Figure 4 This is a structural schematic diagram of the material basket of the present invention located at the unloading station; Figure 5 It is a schematic diagram of the film unloading mechanism of the present invention; Figure 6 It is a structural schematic diagram of the drag hook of the present invention; Figure 7 It is a schematic diagram of the transport mechanism of the present invention; Figure 8 It is a structural schematic diagram of the installation of the handling module and the loading platform of the present invention; Fig. 9 It is a structural schematic diagram of the handling module of the present invention; Fig.10 It is a schematic diagram of the installation structure of the load-bearing frame and the loading platform of the present invention. DETAILED DESCRIPTION

[0020] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0021] This embodiment provides a silicon wafer unloading and transporting device, such as Figure 1-10 As shown, it mainly includes a frame 100, a material basket 200, a film unloading mechanism 300 and a conveying mechanism 400. The frame 100 is a frame structure, which is L-shaped as a main body for carrying the material basket 200, the film unloading mechanism 300 and the conveying mechanism 400.

[0022] The basket 200 is used as a carrier for carrying the silicon wafer 600. Figure 1 and 4 As shown, the silicon wafer 600 is received from the front link of the production line and moved to the unloading station of the silicon wafer 600. The material basket 200 mainly includes a top plate 210, a material rod 220 and a bottom plate 230. The top end of the material rod 220 is connected to the top plate 220, and the bottom end is connected to the bottom plate 230. The material rod 220 is connected with support sheets 221 at equal intervals from top to bottom. There are at least four material rods 220 fixedly connected between the top plate 210 and the bottom plate 230. The four material rods 220 are divided into two rows on the left and right, and two rods in each row are arranged side by side. The support sheets 221 of the two rows of material rods 220 are arranged oppositely, so that the silicon wafer 600 is stably supported on the four support sheets 221 on the same layer. In this embodiment, there are five material rods 220 located between the top plate 210 and the bottom plate 230. After the four material rods 220 are divided into two rows, the remaining one is arranged at the front end between the two rows to ensure that when the material basket 200 receives and transports the silicon wafers 600, the silicon wafers 600 do not slide out of the material basket 200 due to inertia. After the material basket 200 carrying the silicon wafers 600 moves to the unloading station, the horizontal and vertical positions of the material basket 200 are adjusted by the displacement mechanism 500 of the unloading station. The displacement mechanism 500 includes a horizontal displacement machine 510 and a vertical displacement machine 520. The horizontal displacement machine 510 is a conveyor belt structure. The material basket 200 moves to the horizontal displacement machine 510, and the material basket 200 is driven to move horizontally by the reciprocating rotation of the driving belt. The horizontal displacement machine 510 is connected to the vertical displacement machine 520, and the vertical displacement machine 520 drives the horizontal displacement machine 510 to move up and down, thereby driving the material basket 200 to move vertically.

[0023] The sheet unloading mechanism 300 mainly includes a pull-out platform 310 and a pull-out drive cylinder 320 for driving the pull-out platform 310 to move horizontally. In this embodiment, the pull-out platform 310 is in an L-shape after being rotated 90°. Figure 5-6 As shown, two hooks 311 are installed at the front end of the horizontal plate of the pull-out platform 310, and the two hooks 311 are arranged side by side. Two wedge blocks 312 are arranged at a predetermined distance from the hooks 311 in the axial direction of the horizontal plate of the pull-out platform 310, and the two wedge blocks 312 are arranged side by side and arranged in a row with the hooks 311 at the front ends respectively. The structure of the hook 311 in this embodiment is a connecting portion 3111, an inclined portion 3112 and a bending portion 3113 from the rear end to the front end. The connecting portion 3111 is connected and fixed to the plate of the pull-out platform 310, the inclined portion 3112 is used to make line contact with the end of the silicon wafer 600, and jointly support the silicon wafer 600 with the inclined surface of the wedge block 312, and the bending portion 3113 is used to hook and pull the silicon wafer 600 located in the basket 200 through the bending surface. The pull-out table 310 is installed on the drive shaft of the pull-out drive cylinder 320 through its vertical plate. In this embodiment, the vertical plate of the pull-out table 310 is connected to the drive shaft of the pull-out drive cylinder 320 through a support plate, and the pull-out table 310 is driven to move horizontally by the pull-out drive cylinder 320. After the material basket 200 is moved to the unloading station, the pull-out drive cylinder 320 drives the pull-out table 310 to move below the silicon wafer 600 at the bottom layer of the material basket 200, and the vertical displacement machine 520 drives the horizontal displacement machine 510 to make the material basket 200 drop a predetermined distance, and the silicon wafer 600 at the bottom layer of the material basket 200 falls on the hook 311 and the wedge block 312 of the pull-out table 310, and then the pull-out drive cylinder 320 drives the pull-out table 310 to move out, and the silicon wafer 600 is pulled out by the bending portion 3113 at the front end of the hook 311 during the moving out process.

[0024] The transport mechanism 400 mainly includes a load-bearing frame 410, a lifting drive cylinder 420, a loading platform 430, a transport module 440 and a horizontal drive cylinder 450. Figure 7-9As shown, the load-bearing frame 410 is mainly composed of four columns 411 and a load-bearing plate 412 connected to the top of the column 411, and the bottom of the column 411 is fixedly connected to the frame structure of the frame 100. A mounting hole is provided in the middle of the load-bearing plate 412, and the end of the lifting drive cylinder 420 passes through the mounting hole and is fastened to the load-bearing plate 412. The loading platform 430 is located below the load-bearing plate 412, and the driving end of the lifting drive cylinder 420 is connected to the middle position of the loading platform 430 to drive the loading platform 430 to move up and down in the vertical direction. In this embodiment, the four corners of the loading platform 430 are connected to the load-bearing plate 412 through telescopic rods, so that the lifting drive cylinder 420 drives the loading platform 430 to move up and down more smoothly. A slide 431 is provided on the loading platform 430, and the handling module 440 is slidably connected to the slide 431. The transport module 440 mainly includes a lifting rod 441, a left carrying plate 442 and a right carrying plate 443. The lifting rod 441 is L-shaped, and the horizontal portion at the bottom is used to lift and carry the silicon wafer 600. Fig.10 As shown, rectangular slots 435 are provided at the four corners of the stage 430, and the lifting rods 441 pass through the rectangular slots 435. The lifting rods 441 can move freely in the rectangular slots 435. The length of the rectangular slots 435 is adapted to the moving distance of the lifting rods 441, and the width of the rectangular slots 435 is sufficient to allow the lifting rods 441 to move freely. In this embodiment, two lifting rods 441 are connected to the left and right bearing plates 442 and 443, respectively, and the four lifting rods 441 on the left and right sides are used to lift the silicon wafer 600. The left and right bearing plates 442 and 443 are slidably connected to the slideway 431 through a slider. The horizontal drive cylinder 450 is a one-way cylinder. The drive shaft of the horizontal drive cylinder 450 is tightly connected to the left bearing plate 442. The tail end of the horizontal drive cylinder 450 is located and connected to the right bearing plate 443. The horizontal drive cylinder 450 drives the left bearing plate 442 and the right bearing plate 443 to approach or move away from each other in an asynchronous manner. The so-called asynchronous manner means that the left bearing plate 442 and the right bearing plate 443 move in sequence and at different speeds, and arrive at the predetermined position at different times. In this embodiment, a left limit block 432, a middle limit block 433 and a right limit block 434 are provided on the loading platform 430. The left limit block 432 is located at the left end of the slide 431, and is used to limit the left position of the left bearing plate 442. The right limit block 434 is located at the right end of the slide 431, and is used to limit the right position of the right bearing plate 443. The middle limit block 433 is fixed on the slideway 431 and is used to limit the right end displacement position of the left bearing plate 442 and the left end displacement position of the right bearing plate 443 , that is, to limit the shortest distance between the two when they are close to each other.

[0025] The pull-out drive cylinder 320 drives the pull-out platform 310 to move out. During the moving process, the bent portion 3113 at the front end of the hook 311 pulls out the silicon wafer 600 and moves it to the bottom of the loading platform 430 along with the pull-out platform 310. One implementation method of transporting the silicon wafer 600 on the pull-out platform 310 through the transport module 440 is as follows: first, the horizontal drive cylinder 450 is operated to drive the left load plate 442 and the right load plate 443 to move away from each other to the left and right limit positions. During the moving process, the left load plate 442 under the action of the one-way cylinder moves first and contacts the left limit block 432 to reach the limit position first, and then the right load plate 443 continues to move until it contacts the right limit block 434 to reach the limit position. At this time, the distance between the two lifting rods 441 on the left load plate 442 and the two lifting rods 441 on the right load plate 443 reaches the maximum. Then, the lifting drive cylinder 420 drives the loading platform 430 to drive the transport module 440 to descend to a predetermined height until the horizontal support piece of the lifting rod 441 is located below the silicon wafer 600, and the silicon wafer 600 is located on the pull-out platform 310. Then, the horizontal drive cylinder 450 is driven to drive the left load plate 442 and the right load plate 443 to approach each other to the middle limit position. During the movement, the left load plate 442 still moves first and contacts the left side of the middle limit block 433 to reach the limit position, and then the right load plate 443 continues to move until it contacts the right side of the middle limit block 433 to reach the limit position. Finally, the lifting drive cylinder 420 drives the loading platform 430 to drive the transport module 440 to rise to a predetermined height, and the silicon wafer 600 located on the pull-out platform 310 is lifted by the four lifting rods 441. At this time, the distance between the inner sides of the two rows of lifting rods 441 located on the left load plate 442 and the right load plate 443 is greater than the width distance of the silicon wafer 600.

[0026] The silicon wafer unloading and handling device provided in this embodiment drives the two carrying plates in the handling module to move in an asynchronous manner, so that one side of the two rows of lifting rods used to lift the silicon wafers reaches the limit first, and the lifting rod on the other side reaches the limit later. The row of lifting rods that arrive first can act as an alignment stop plate, and the row of lifting rods that arrive later adjusts the tilted silicon wafers during the limit, avoiding the problem of being clamped and broken due to the lengthened horizontal distance after tilting in the synchronous movement mode. The alignment adjustment of the silicon wafer is implemented by a unilateral external force, so that the gap between the two rows of lifting rods used for clamping can be adjusted to be slightly larger than the width of the silicon wafer, which can solve the centering problem in the silicon wafer transportation process, and can also prevent the problem of silicon wafers being clamped and broken in the diagonal direction when the synchronous movement has a small gap, solve the centering requirements in the post-process of silicon wafer preparation, and improve the yield and production efficiency of silicon wafer production. In addition, the silicon wafer is removed from the material basket through a pull-out structure, which greatly reduces the contact area with the silicon wafer, effectively improves the material distribution rate, and further improves the production efficiency. Example

[0027] This embodiment 2 is formed on the basis of embodiment 1, by changing the single-side single-row lifting rod structure connected to the carrier plate in the transport module into a two-row structure on both sides, so that the transport module can transport two silicon wafers at the same time, so that the transport efficiency is doubled, and the production efficiency is further improved. Specifically: like Figure 7-10 As shown, the left bearing plate 442 and the right bearing plate 443 are plates with basically the same structure, both of which are H-shaped structures. Four lifting rods 441 are connected to the left bearing plate 442, and the four lifting rods 441 are respectively connected to the four corners of the left bearing plate 442, and two lifting rods on the same side form a row. The support plates of the two rows of four lifting rods 441 connected to the left bearing plate 442 are oriented in the same direction, both facing right. Four lifting rods 441 are also arranged on the right bearing plate 442, and the four lifting rods 441 are also respectively connected to the four corners of the right bearing plate 442, and the two lifting rods 441 on the same side are arranged side by side. The support plates of the two rows of four lifting rods 441 connected to the right bearing plate 443 are oriented in the same direction, both facing left. The left bearing plate 442 and the right bearing plate 443 are staggered. The so-called staggered arrangement means that the right end of the left bearing plate 442 and the left end of the right bearing plate 443 are staggered with each other, that is, Fig. 9 As shown, the two lifting rods 441 on the right side of the left carrier plate 442 are spaced apart from the two lifting rods 441 on the left side of the right carrier plate 443. When the silicon wafer 600 needs to be lifted, the horizontal driving cylinder 450 drives the left carrier plate 442 and the right carrier plate 443 to approach each other until they are in contact with the left and right sides of the middle stop block 433, respectively. Then, the two lifting rods 441 on the left side of the left carrier plate 442 and the two lifting rods 441 on the left side of the right carrier plate 443 form a group to lift a silicon wafer 600 on the left side, while the two lifting rods 441 on the right side of the left carrier plate 442 and the two lifting rods 441 on the right side of the right carrier plate 443 form a group to lift a silicon wafer 600 on the right side.

[0028] Furthermore, the structure of the basket 200 is changed to carry two rows of silicon wafers 600, and its structure is formed by at least 6 material rods 220 to form a three-row structure, such as Figure 4 As shown, the opposite sides of the row of material rods 220 in the middle are provided with support sheets 221, forming a support structure of two parallel rows of support sheets 221 with the two rows of material rods 220 on both sides. In this embodiment, a material rod 220 is provided at the middle end of every two rows of material rods 220, which is used to limit the silicon wafer 600 and prevent the silicon wafer 600 from sliding out. Example

[0029] This embodiment 3 forms a silicon wafer unloading and conveying production line based on the embodiment 1 or the embodiment 2, adopts the silicon wafer unloading and conveying device described in the embodiment 1 or the embodiment 2, and adds a correspondingly configured conveying mechanism, and the silicon wafer lifted from the conveying mechanism is placed in the conveying mechanism and transported to the next production line. Specifically: like Figure 1-3 As shown, the conveying mechanism 700 includes a conveying drive motor 710, a conveyor belt 720, a support block 730 and a limit hook 740. The conveying drive motor 710 drives the conveyor belt 720 to rotate, the support block 730 is arranged in an array on the conveyor belt 720, and the limit hook 740 is connected to the side of the conveyor belt 720. The limit hook 740 has the same structure as the hook 311, and the support block 730 is provided with an inclined support surface. After the transport module 440 drops to a predetermined height, the silicon wafer 600 is placed on the support block 730 and the limit hook 740, the support block 730 is located at the front and rear ends of the silicon wafer 600, the limit hook 740 is located at the left and right sides of the silicon wafer 600, the front and rear ends of the silicon wafer 600 are placed on the inclined support surface of the support block 730, and the left and right sides of the silicon wafer 600 are placed on the inclined surface of the limit hook 740.

[0030] Furthermore, there are two groups of conveyor belts 720, and the conveying drive motor 710 drives the two groups of conveyor belts 720 to rotate synchronously. The two groups of conveyor belts 720 can better adapt to the structural design of the conveying module 440 to simultaneously convey two silicon wafers 600, and generally meet the demand for improving the material distribution efficiency.

[0031] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A silicon wafer unloading and handling device, characterized in that: It comprises a frame (100), a material basket (200) arranged on the frame (100), a film unloading mechanism (300) and a transport mechanism (400); The material basket (200) receives silicon wafers (600) from a front-end production line and moves to a material unloading station, and the wafer unloading mechanism (300) is configured to transport the silicon wafers (600) stacked in intervals in the material basket (200) layer by layer; The transport mechanism (400) comprises a load-bearing frame (410), a lifting drive cylinder (420), a loading platform (430), a transport module (440) and a horizontal drive cylinder (450); the lifting drive cylinder (420) is fixedly connected to the load-bearing frame (410); the loading platform (430) is drivingly connected to the lifting drive cylinder (420); a slideway (431) is provided on the loading platform (430); the transport module (440) comprises a lifting rod (441), a left bearing plate (442) and a right bearing plate (443); the lifting rod (441) is an L-shaped structure; the left bearing plate (442) and the right bearing plate (443) are respectively connected to the lifting rod (441); the left bearing plate (442) and the right bearing plate (443) are slidably connected to the slideway (431) via the horizontal drive cylinder (450); The unloading mechanism (300) transports the silicon wafer (600) from the material basket (200) to the bottom of the loading platform (430), the horizontal drive cylinder (450) drives the left supporting plate (442) and the right supporting plate (443) to approach each other to a predetermined distance in an asynchronous manner, the lifting drive cylinder (420) drives the loading platform (430) to rise, and the lifting rod (441) connected to the left supporting plate (442) and the right supporting plate (443) lifts the silicon wafer (600) located on the unloading mechanism (300), and the distance between the lifting rods (441) located on both sides of the silicon wafer (600) is greater than the width of the silicon wafer (600).

2. The silicon wafer unloading and handling device according to claim 1, characterized in that: The horizontal drive cylinder (450) is a one-way drive cylinder. The horizontal drive cylinder (450) comprises a drive rod (451) and a cylinder body (452). The end of the drive rod (451) is connected to the left bearing plate (442), and the end of the cylinder body (452) is connected to the right bearing plate (443). The loading platform (430) is provided with a left limit block (432), a middle limit block (433) and a right limit block (434). The block (432) is used to limit the left position of the left bearing plate (442), the right limit block (434) is used to limit the right position of the right bearing plate (443), and the middle limit block (433) is used to limit the middle position where the left bearing plate (442) and the right bearing plate (443) approach each other. The left bearing plate (442) and the right bearing plate (443) are driven by the horizontal driving cylinder (450) to reach the predetermined limit positions one after another.

3. The silicon wafer unloading and conveying device according to claim 2, characterized in that: The left bearing plate (442) and the right bearing plate (443) are both H-shaped plates. The left bearing plate (442) is respectively connected to the lifting rods (441) at the four corners, and the right bearing plate (443) is respectively connected to the lifting rods (441) at the four corners. The left bearing plate (442) and the right bearing plate (443) are arranged alternately. The lifting rods (441) located at the two corners on the left side of the left bearing plate (442) and the lifting rods (441) located at the two corners on the left side of the right bearing plate (443) form a group of transport rods. The lifting rods (441) located at the two corners on the right side of the left bearing plate (442) and the lifting rods (441) located at the two corners on the right side of the right bearing plate (443) form a group of transport rods.

4. The silicon wafer unloading and conveying device according to claim 3, characterized in that: The material basket (200) comprises a top plate (210), a material rod (220) and a bottom plate (230); the material rod (220) is provided with support plates (221) for carrying the silicon wafers (600) at intervals from top to bottom; a plurality of the material rods (220) are clamped and connected between the top plate (210) and the bottom plate (230) to form a three-row structure with intervals; the silicon wafers (600) stacked in the material basket (200) are arranged in two parallel rows.

5. The silicon wafer unloading and handling device according to any one of claims 1 to 4, characterized in that: The sheet unloading mechanism (300) comprises a pull-out platform (310) and a pull-out drive cylinder (320), wherein the pull-out drive cylinder (320) is driven and connected to the pull-out platform (310), and a draw hook (311) is arranged side by side at the front end of the pull-out platform (310), and a wedge block (312) is arranged side by side at a predetermined distance from the draw hook (311); The pulling drive cylinder (320) drives the pulling platform (310) to the bottom of the material basket (200). After the material basket (200) drops to a predetermined height, the silicon wafer (600) is located between the hook (311) and the wedge block (312). The pulling drive cylinder (320) drives the pulling platform (310) to move out, and the silicon wafer (600) moves with the pulling platform (310) to the bottom of the loading platform (430).

6. The silicon wafer unloading and conveying device according to claim 5, characterized in that: The pull hook (311) comprises, from the rear end to the front end, a connecting portion (3111), an inclined portion (3112) and a bending portion (3113), wherein the connecting portion (3111) is connected to the pull-out platform (310), the inclined portion (3112) is used to contact and support the silicon wafer (600), and the bending portion (3113) is used to pull out the silicon wafer (600).

7. The silicon wafer unloading and conveying device according to claim 5, characterized in that: The pull-out platforms (310) are provided in two groups, and the pull-out drive cylinder (320) drives the two groups of pull-out platforms (310) to move synchronously.

8. The silicon wafer unloading and conveying device according to claim 1, characterized in that: The unloading station is provided with a displacement mechanism (500), the displacement mechanism (500) comprising a horizontal displacement machine (510) and a vertical displacement machine (520), the vertical displacement machine (520) being drivingly connected to the horizontal displacement machine (510), the horizontal displacement machine (510) being used to adjust the horizontal position of the material basket (200), and the vertical displacement machine (520) realizing the vertical displacement of the material basket (200) by driving the horizontal displacement machine (510) to move up and down.

9. A silicon wafer conveying production line, characterized in that: The silicon wafer unloading and handling device according to any one of claims 1 to 8 further comprises a conveying mechanism (700); The conveying mechanism (700) comprises a conveying drive motor (710), a conveying belt (720), a support block (730) and a limit hook (740), wherein the conveying drive motor (710) drives the conveying belt (720) to rotate, the support blocks (730) are arranged in an array on the conveying belt (720), the limit hook (740) is connected to the side of the conveying belt (720), the limit hook (740) has the same structure as the pull hook (311), and the support block (730) is provided with an inclined surface; After the transport module (440) descends to a predetermined height, the silicon wafer (600) is placed on the support block (730) and the limiting hook (740), with both ends of the silicon wafer (600) supported on the inclined surface of the support block (730), and both sides of the silicon wafer (600) supported on the inclined surface of the limiting hook (740).

10. The silicon wafer conveying production line according to claim 9, characterized in that: The conveyor belts (720) are provided in two groups, and the conveyor drive motor (710) drives the two groups of conveyor belts (720) to rotate synchronously.

Images