Passive chip temperature measurement method and system for extra-high voltage environment

Abstract

The invention discloses a passive chip temperature measurement method and system for an extra-high voltage environment. The method comprises the following steps: determining a temperature measurement distance between a reader and a temperature measurement passive tag in real time and acquiring environment sensing data of the extra-high voltage environment; the temperature measurement passive tag is arranged on a temperature measurement object in the extra-high voltage environment; the reader is arranged on the movable temperature measurement execution main body; determining a corresponding temperature measurement opportunity parameter according to the temperature measurement distance and a preset distance judgment algorithm; according to the environment sensing data and a preset data prediction algorithm, determining corresponding environment danger parameters; determining a working instruction of at least one circuit component in the reader or the temperature measurement passive tag according to the temperature measurement opportunity parameter and the environmental danger parameter; the work instruction is used for controlling the work of the corresponding circuit component so as to enable the reader or the temperature measurement passive tag to smoothly execute a temperature measurement task. Therefore, the temperature measurement distance and the environmental factors can be fully combined to control the work of the temperature measurement component, so that the temperature measurement task in the extra-high voltage environment can be smoothly executed, and the temperature measurement stability and the temperature measurement accuracy are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of data processing, and in particular to a passive chip temperature measurement method and system for use in an ultra-high voltage environment. Background Art

[0002] In order to monitor the safe operation of some UHV equipment or components, it is necessary to monitor the heating conditions of the equipment in the UHV environment. However, since the specific monitoring position may cause electric shock, non-contact temperature measurement methods are generally used. The general temperature measurement methods are divided into manual inspection and online monitoring. Both have high deployment and maintenance costs, low temperature measurement accuracy, and poor timeliness. The existing technology began to introduce electronic tag technology when dealing with temperature measurement needs. However, when solving the temperature measurement needs in the UHV environment, the existing electronic tag technology does not consider the real-time judgment of the temperature measurement distance and scene pressure to determine the working parameters of the temperature measurement components. Therefore, it can only perform temperature measurement tasks mechanically, and its temperature measurement accuracy is easily affected by the harsh UHV environment. Therefore, its temperature measurement stability and temperature measurement accuracy are both lacking. It can be seen that the existing technology has defects that need to be solved urgently. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a passive chip temperature measurement method and system for ultra-high voltage environment, which can fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement task in the ultra-high voltage environment can be smoothly executed and the temperature measurement stability and accuracy can be improved.

[0004] In order to solve the above technical problems, the first aspect of the present invention discloses a passive chip temperature measurement method for an ultra-high voltage environment, the method comprising: Determine the temperature measurement distance between the reader and the temperature measurement passive tag in real time and obtain the environmental sensing data of the UHV environment; the temperature measurement passive tag is set on the temperature measurement object in the UHV environment; the reader is set on a movable temperature measurement execution body; Determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm; Determine corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm; According to the temperature measurement timing parameter and the environmental hazard parameter, a working instruction of at least one circuit component in the reader or the temperature measurement passive tag is determined; the working instruction is used to control the operation of the corresponding circuit component so that the reader or the temperature measurement passive tag can smoothly perform the temperature measurement task.

[0005] As an optional implementation, in the first aspect of the present invention, the real-time determination of the temperature measurement distance between the reader and the temperature measurement passive tag includes: Get the reader position of the reader in real time; Obtain the chip position of the temperature measurement passive tag in real time; The temperature measurement distance is calculated according to the reader position and the chip position.

[0006] As an optional implementation, in the first aspect of the present invention, the calculating the temperature measurement distance according to the reader position and the chip position includes: Determine the device area where the temperature measuring passive tag is located according to the chip position; Obtaining a regional map corresponding to the device area in a preset regional map library; According to the reader position and the chip position, as well as the area map, the temperature measurement distance is determined based on a route planning algorithm.

[0007] As an optional implementation, in the first aspect of the present invention, determining the temperature measurement distance based on the reader position, the chip position, and the area map based on a route planning algorithm includes: According to the route planning algorithm, a plurality of candidate temperature measurement routes including the reader location are determined in the area map; Calculating the shortest distance between each of the candidate temperature measurement routes and the chip position; Determine the candidate temperature measurement route with the smallest shortest distance as the target temperature measurement route; The length of the route that the reader position needs to travel along the target temperature measurement route to reach the chip position is determined as the temperature measurement distance.

[0008] As an optional implementation, in the first aspect of the present invention, determining the corresponding temperature measurement timing parameter according to the temperature measurement distance and a preset distance judgment algorithm includes: Calculating the distance difference between the temperature measurement distance and a preset distance threshold; When the distance difference is greater than a first difference threshold, determining the temperature measurement timing parameter to be a first value inversely proportional to the distance difference; When the distance difference is less than the first difference threshold, determining the temperature measurement timing parameter as the product of the first value and a first weight; the first weight is greater than 1 and is proportional to the difference between the distance difference and the first difference threshold; When the distance difference is greater than a second difference threshold, the temperature measurement timing parameter is determined to be the product of the first value and a second weight; the second weight is less than 1 and is inversely proportional to the difference between the distance difference and the second difference threshold; the second difference threshold is greater than the first difference threshold.

[0009] As an optional implementation, in the first aspect of the present invention, determining the corresponding environmental hazard parameter according to the environmental sensor data and a preset data prediction algorithm includes: Calculating the difference between the environmental sensor data and a reference value of sensor data of a corresponding data type to obtain a corresponding environmental hazard parameter; and / or, The environmental sensor data is input into a trained high-voltage hazard prediction neural network to obtain output environmental hazard parameters; the high-voltage hazard prediction neural network is trained by a training data set including multiple training environmental sensor data and corresponding high-voltage hazard annotations; the environmental sensor data includes at least one of temperature data, humidity data, sound data, image data and ranging data.

[0010] As an optional embodiment, in the first aspect of the present invention, the circuit component is a working component of the reader, a controller component of the temperature measuring passive tag, a temperature sensor component, a receiver component or a transmitter component; the receiver component includes at least one of a filter, an envelope detector, an analog-to-digital converter and a decoder; the transmitter component includes at least one of an encoder and an amplifier; the working instruction is to start, shut down, sleep, increase power or reduce power.

[0011] As an optional implementation, in the first aspect of the present invention, determining the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measurement opportunity parameter and the environmental hazard parameter includes: The temperature measurement timing parameter and the environmental hazard parameter are input into an influencing component prediction model to obtain at least one corresponding influencing component; the influencing component is a circuit component in the reader or the temperature measuring passive tag; the influencing component prediction model is obtained by training a training data set including a plurality of training temperature measurement timing parameters, training environmental hazard parameters and corresponding influencing component annotations; For each of the influencing components, a first relationship model and a second relationship model corresponding to the influencing component are determined; the first relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the temperature measurement timing parameters; the second relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the environmental hazard parameters; Determining a first operating parameter corresponding to the influencing component according to the temperature measurement timing parameter and the first relationship model; Determining a second operating parameter corresponding to the influencing component according to the environmental hazard parameter and the second relationship model; Generate a work instruction including the first work parameter and the second work parameter, and determine it as the work instruction corresponding to the influencing component; the work parameter is the startup time, shutdown time, sleep time, increase power value or decrease power value.

[0012] A second aspect of an embodiment of the present invention discloses a passive chip temperature measurement system for an ultra-high voltage environment, the system comprising: A data determination module is used to determine the temperature measurement distance between the reader and the temperature measurement passive tag in real time and to obtain environmental sensing data of the UHV environment; the temperature measurement passive tag is arranged on a temperature measurement object in the UHV environment; the reader is arranged on a movable temperature measurement execution body; A timing determination module, used to determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm; A hazard determination module, used to determine corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm; An instruction determination module is used to determine the working instructions of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measurement opportunity parameter and the environmental hazard parameter; the working instruction is used to control the operation of the corresponding circuit component so that the reader or the temperature measuring passive tag can smoothly perform the temperature measurement task.

[0013] As an optional implementation, in the second aspect of the present invention, the specific manner in which the data determination module determines in real time the temperature measurement distance between the reader and the temperature measurement passive tag includes: Get the reader position of the reader in real time; Obtain the chip position of the temperature measurement passive tag in real time; The temperature measurement distance is calculated according to the reader position and the chip position.

[0014] As an optional implementation, in the second aspect of the present invention, the specific manner in which the data determination module calculates the temperature measurement distance according to the reader position and the chip position includes: Determine the device area where the temperature measuring passive tag is located according to the chip position; Obtaining a regional map corresponding to the device area in a preset regional map library; According to the reader position and the chip position, as well as the area map, the temperature measurement distance is determined based on a route planning algorithm.

[0015] As an optional implementation, in the second aspect of the present invention, the data determination module determines the specific manner of the temperature measurement distance based on the route planning algorithm according to the reader position and the chip position, and the area map, including: According to the route planning algorithm, a plurality of candidate temperature measurement routes including the reader location are determined in the area map; Calculating the shortest distance between each of the candidate temperature measurement routes and the chip position; Determine the candidate temperature measurement route with the smallest shortest distance as the target temperature measurement route; The length of the route that the reader position needs to travel along the target temperature measurement route to reach the chip position is determined as the temperature measurement distance.

[0016] As an optional implementation, in the second aspect of the present invention, the timing determination module determines the specific manner of the corresponding temperature measurement timing parameter according to the temperature measurement distance and a preset distance judgment algorithm, including: Calculating the distance difference between the temperature measurement distance and a preset distance threshold; When the distance difference is greater than a first difference threshold, determining the temperature measurement timing parameter to be a first value inversely proportional to the distance difference; When the distance difference is less than the first difference threshold, determining the temperature measurement timing parameter as the product of the first value and a first weight; the first weight is greater than 1 and is proportional to the difference between the distance difference and the first difference threshold; When the distance difference is greater than a second difference threshold, the temperature measurement timing parameter is determined to be the product of the first value and a second weight; the second weight is less than 1 and is inversely proportional to the difference between the distance difference and the second difference threshold; the second difference threshold is greater than the first difference threshold.

[0017] As an optional implementation, in the second aspect of the present invention, the specific manner in which the hazard determination module determines the corresponding environmental hazard parameter according to the environmental sensor data and a preset data prediction algorithm includes: Calculating the difference between the environmental sensor data and a reference value of sensor data of a corresponding data type to obtain a corresponding environmental hazard parameter; and / or, The environmental sensor data is input into a trained high-voltage hazard prediction neural network to obtain output environmental hazard parameters; the high-voltage hazard prediction neural network is trained by a training data set including multiple training environmental sensor data and corresponding high-voltage hazard annotations; the environmental sensor data includes at least one of temperature data, humidity data, sound data, image data and ranging data.

[0018] As an optional embodiment, in the second aspect of the present invention, the circuit component is a working component of the reader, a controller component of the temperature measuring passive tag, a temperature sensor component, a receiver component or a transmitter component; the receiver component includes at least one of a filter, an envelope detector, an analog-to-digital converter and a decoder; the transmitter component includes at least one of an encoder and an amplifier; the working instruction is to start, shut down, sleep, increase power or reduce power.

[0019] As an optional implementation, in the second aspect of the present invention, the instruction determination module determines the specific manner of the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measurement opportunity parameter and the environmental hazard parameter, including: The temperature measurement timing parameter and the environmental hazard parameter are input into an influencing component prediction model to obtain at least one corresponding influencing component; the influencing component is a circuit component in the reader or the temperature measuring passive tag; the influencing component prediction model is obtained by training a training data set including a plurality of training temperature measurement timing parameters, training environmental hazard parameters and corresponding influencing component annotations; For each of the influencing components, a first relationship model and a second relationship model corresponding to the influencing component are determined; the first relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the temperature measurement timing parameters; the second relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the environmental hazard parameters; Determining a first operating parameter corresponding to the influencing component according to the temperature measurement timing parameter and the first relationship model; Determining a second operating parameter corresponding to the influencing component according to the environmental hazard parameter and the second relationship model; Generate a work instruction including the first work parameter and the second work parameter, and determine it as the work instruction corresponding to the influencing component; the work parameter is the startup time, shutdown time, sleep time, increase power value or decrease power value.

[0020] The third aspect of the present invention discloses another passive chip temperature measurement system for ultra-high voltage environment, the system comprising: Reader; Temperature measurement passive tag; A memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute part or all of the steps in the passive chip temperature measurement method for ultra-high voltage environment disclosed in the first aspect of the present invention.

[0021] The fourth aspect of the present invention discloses a computer storage medium, which stores computer instructions. When the computer instructions are called, they are used to execute some or all of the steps in the passive chip temperature measurement method for ultra-high voltage environment disclosed in the first aspect of the present invention.

[0022] Compared with the prior art, the embodiments of the present invention have the following beneficial effects: The present invention can determine the temperature measurement timing based on the temperature measurement distance between the reader and the temperature measuring passive tag, and then determine the environmental hazard parameters according to the environmental sensor data of the ultra-high voltage environment, so as to comprehensively determine the working instructions of the circuit components in the temperature measurement system to smoothly perform the temperature measurement task, thereby being able to fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement task in the ultra-high voltage environment can be smoothly performed, and the temperature measurement stability and temperature measurement accuracy can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a flow chart of a passive chip temperature measurement method for an ultra-high voltage environment disclosed in an embodiment of the present invention.

[0025] Figure 2 It is a structural schematic diagram of a passive chip temperature measurement system for an ultra-high voltage environment disclosed in an embodiment of the present invention.

[0026] Figure 3 It is a structural schematic diagram of another passive chip temperature measurement system for ultra-high voltage environment disclosed in an embodiment of the present invention.

[0027] Figure 4 It is a structural schematic diagram of a temperature measurement system disclosed in an embodiment of the present invention.

[0028] Figure 5 It is a structural schematic diagram of an envelope detector disclosed in an embodiment of the present invention.

[0029] Figure 6 It is a structural schematic diagram of a BPSK modulation and amplifier disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or equipment.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] The present invention discloses a passive chip temperature measurement method and system for ultra-high voltage environment, which can determine the temperature measurement time based on the temperature measurement distance between the reader and the temperature measurement passive tag, and then determine the environmental hazard parameters according to the environmental sensor data of the ultra-high voltage environment, so as to comprehensively determine the working instructions of the circuit components in the temperature measurement system to smoothly perform the temperature measurement task, so as to fully combine the temperature measurement distance and environmental factors to control the work of the temperature measurement components, so that the temperature measurement task in the ultra-high voltage environment is smoothly performed, and the temperature measurement stability and temperature measurement accuracy are improved. The following are detailed descriptions.

[0034] Embodiment 1 See also Figure 1 , Figure 1 1 is a flow chart of a passive chip temperature measurement method for ultra-high voltage environment disclosed in an embodiment of the present invention. Figure 1 The passive chip temperature measurement method for ultra-high voltage environment described can be applied to a data processing system / data processing device / data processing server (wherein the server includes a local processing server or a cloud processing server). Figure 1 As shown, the passive chip temperature measurement method for ultra-high voltage environment may include the following operations: 101. Determine the temperature measurement distance between the reader and the temperature measuring passive tag in real time and obtain environmental sensing data in the UHV environment.

[0035] Optionally, the reader is arranged on a movable temperature measurement execution body.

[0036] 102. Determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm. 103. Determine the corresponding environmental hazard parameters based on the environmental sensor data and the preset data prediction algorithm. 104. Determine a working instruction of at least one circuit component in a reader or a temperature measuring passive tag according to the temperature measuring opportunity parameter and the environmental hazard parameter.

[0037] Optionally, the working instruction is used to control the operation of the corresponding circuit components so that the reader or the temperature measuring passive tag can smoothly perform the temperature measurement task.

[0038] It can be seen that the above-mentioned embodiment of the invention can determine the temperature measurement timing based on the temperature measurement distance between the reader and the temperature measuring passive tag, and then determine the environmental hazard parameters according to the environmental sensor data of the UHV environment, so as to comprehensively determine the working instructions of the circuit components in the temperature measurement system to smoothly perform the temperature measurement task, thereby being able to fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement task in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0039] As an optional embodiment, in the above step, determining the temperature measurement distance between the reader and the temperature measurement passive tag in real time includes: Get the reader position of the reader in real time; Obtain the chip position of the temperature measurement passive tag in real time; Calculate the temperature measurement distance based on the reader position and chip position.

[0040] It can be seen that through the above-mentioned optional embodiments, the temperature measurement distance can be accurately calculated based on the reader position and the chip position, which is convenient for the subsequent accurate control of the temperature measurement components, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0041] As an optional embodiment, in the above steps, calculating the temperature measurement distance according to the reader position and the chip position includes: Determine the device area where the temperature measurement passive tag is located based on the chip location; Obtain the area map corresponding to the device area in the preset area map library; According to the reader location and chip location, as well as the area map, the temperature measurement distance is determined based on the route planning algorithm.

[0042] It can be seen that through the above-mentioned optional embodiments, the area map corresponding to the equipment area can be determined based on the chip position, so as to accurately determine the temperature measurement distance based on the route planning algorithm, and assist in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0043] As an optional embodiment, in the above steps, determining the temperature measurement distance based on the reader position and the chip position, as well as the area map, based on a route planning algorithm, includes: According to the route planning algorithm, a plurality of candidate temperature measurement routes including the reader locations are determined in the regional map; Calculate the shortest distance between each candidate temperature measurement route and the chip location; Determine the candidate temperature measurement route with the shortest distance as the target temperature measurement route; The length of the route that the reader position needs to travel along the target temperature measurement route to reach the chip position is determined as the temperature measurement distance.

[0044] It can be seen that through the above-mentioned optional embodiments, the target temperature measurement route can be screened out through the planning of the route planning algorithm in the regional map and the shortest distance between different routes and the chip position, and then a more accurate temperature measurement distance can be determined based on the target temperature measurement route, which is convenient for the subsequent accurate control of the temperature measurement components, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0045] As an optional embodiment, in the above steps, determining the corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm includes: Calculate the distance difference between the temperature measurement distance and the preset distance threshold; When the distance difference is greater than a first difference threshold, determining the temperature measurement timing parameter to be a first value inversely proportional to the distance difference; When the distance difference is less than the first difference threshold, determining the temperature measurement timing parameter as the product of the first value and the first weight; optionally, the first weight is greater than 1 and is proportional to the difference between the distance difference and the first difference threshold; When the distance difference is greater than the second difference threshold, the temperature measurement timing parameter is determined as the product of the first value and the second weight; optionally, the second weight is less than 1 and is inversely proportional to the difference between the distance difference and the second difference threshold; the second difference threshold is greater than the first difference threshold.

[0046] It can be seen that through the above optional embodiments, a piecewise function is set to determine the temperature measurement timing parameter, so that the temperature measurement timing parameter is very high when the temperature measurement distance is very small, and very small when the temperature measurement distance is very large, so as to effectively characterize the possibility that the temperature measurement system needs to perform temperature measurement, facilitate the subsequent accurate control of the temperature measurement components, and assist in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0047] As an optional embodiment, in the above steps, determining the corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm includes: Calculate the difference between the environmental sensor data and the reference value of the sensor data of the corresponding data type to obtain the corresponding environmental hazard parameter; and / or, The environmental sensor data is input into a trained high-voltage hazard prediction neural network to obtain output environmental hazard parameters; optionally, the high-voltage hazard prediction neural network is trained by a training data set including multiple training environmental sensor data and corresponding high-voltage hazard annotations; the environmental sensor data includes at least one of temperature data, humidity data, sound data, image data and ranging data.

[0048] It can be seen that through the above-mentioned optional embodiments, dangerous situations in UHV environments can be accurately determined based on difference calculations of reference values ​​or trained predictive neural networks, which facilitates the accurate control of subsequent temperature measuring components and assists in fully combining temperature measurement distance and environmental factors to control the operation of temperature measuring components, so that temperature measurement tasks in UHV environments can be smoothly executed and temperature measurement stability and accuracy can be improved.

[0049] As an optional embodiment, in the above steps, the circuit components are the working components of the reader, the controller components of the temperature measuring passive tag, the temperature sensor components, the receiver components or the transmitter components; the receiver components include at least one of a filter, an envelope detector, an analog-to-digital converter and a decoder; the transmitter components include at least one of an encoder and an amplifier; and the working instructions are start, shut down, sleep, increase power or reduce power.

[0050] It can be seen that through the above-mentioned optional embodiments, the details of the circuit components and the content of the working instructions are defined, which facilitates the present scheme to more accurately control the operation of the temperature measurement system, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so as to smoothly execute the temperature measurement tasks in the UHV environment and improve the temperature measurement stability and accuracy.

[0051] As an optional embodiment, in the above steps, determining the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measuring opportunity parameter and the environmental hazard parameter includes: Inputting the temperature measurement timing parameter and the environmental hazard parameter into the influencing component prediction model to obtain at least one corresponding influencing component; optionally, the influencing component is a circuit component in a reader or a temperature measuring passive tag; the influencing component prediction model is obtained by training a training data set including a plurality of training temperature measurement timing parameters, training environmental hazard parameters and corresponding influencing component annotations; For each influencing component, determine a first relationship model and a second relationship model corresponding to the influencing component; optionally, the first relationship model is used to define a mathematical relationship between an operating parameter of the influencing component and a temperature measurement timing parameter; the second relationship model is used to define a mathematical relationship between an operating parameter of the influencing component and an environmental hazard parameter; Determine a first operating parameter corresponding to the influencing component according to the temperature measurement timing parameter and the first relationship model; Determine a second operating parameter corresponding to the influencing component according to the environmental hazard parameter and the second relationship model; A working instruction including a first working parameter and a second working parameter is generated and determined as the working instruction corresponding to the influencing component; the working parameters are a startup time, a shutdown time, a sleep time, an increase in power value, or a decrease in power value.

[0052] It can be seen that through the above-mentioned optional embodiments, the influencing components can be determined based on the temperature measurement timing parameters, environmental hazard parameters and the prediction model, and then the corresponding working parameters can be determined based on the working parameters of the influencing components and the mathematical relationship between the temperature measurement timing parameters and the environmental hazard parameters, so as to fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed and the temperature measurement stability and accuracy can be improved.

[0053] In one embodiment, the temperature measurement system of the present invention is implemented as a passive electronic tag used in an ultra-high voltage environment. Its application scenario is that in order to monitor the safe operation of 800kV ultra-high voltage equipment, it is necessary to monitor the heating conditions of the primary equipment in the ultra-high voltage converter station. The monitoring locations of these primary equipment, such as the converter equipment terminal board and the transformer insulating bushing, are prone to electric shock.

[0054] This specific implementation scheme provides a UHF band temperature measurement electronic tag with low power consumption, low cost and safety features that can communicate over long distances based on UHF RFID technology. The temperature measurement passive tag is based on improved RFID technology and does not contain a high power consumption and expensive frequency conversion module. Compared with other short-range wireless communication technologies, it has lower cost and power consumption. A high-sensitivity envelope detection receiver is used to improve the downlink receiving sensitivity of the tag. The tag integrates a reflection enhancement circuit to improve the uplink signal power strength of the tag. Relying on the improvement of transceiver technology, the communication distance between the tag and the reader can be greatly increased.

[0055] Specifically, the temperature measurement system in this embodiment is as follows Figure 4 As shown, it includes a reader and a tag. The reader and the tag communicate through a wireless communication link. The wireless communication link refers to the propagation path formed by the electromagnetic wave emitted by the tag or reader in the air. The wireless communication link will cause the transmitted electromagnetic wave signal to attenuate by tens of dB.

[0056] Specifically, the tag contains a low-power enhanced backscatter transceiver.

[0057] Specifically, the tag does not contain high-power radio frequency modules such as phase-locked loop frequency synthesizers, up-conversion and down-conversion. Compared with short-range wireless communication systems such as UWB and NB-IOT that use frequency conversion technology, this implementation scheme has lower power consumption and cost.

[0058] Specifically, the transceiver includes a receiver and a transmitter, which are used to realize the functions of receiving, modulating and reverse transmitting. It includes a directional coupler, a filter, a single-pole double-throw (SPDT) RF switch, an envelope detector, an analog-to-digital converter, a decoder, an encoder, an amplifier, etc.

[0059] Specifically, in the receiver, the through input and directional output of the directional coupler form a low-loss path connecting the antenna and the filter. The filter is a bandpass filter, which is implemented using a surface acoustic wave (SAW) filter. The surface acoustic wave filter can achieve a narrow bandwidth and a steep transition band, and the manufacturing cost is relatively low. The center frequency of the bandpass filter is the RF operating frequency of the tag, which can attenuate the out-of-band interference and noise received by the antenna, and prevent the out-of-band interference and noise from causing performance degradation to the receiver demodulation. For example, the SAW filter can also suppress the high-frequency interference pulses generated by corona discharge to a large extent. The single-pole double-throw (SPDT) RF switch is used to switch between reception and transmission.

[0060] Specifically, the receiver includes a high-sensitivity envelope detector, such as Figure 5As shown, it is used to demodulate the ASK signal sent by the reader. Two detector diodes are used to form a voltage doubler rectifier topology. The detector diode uses a low-barrier Schottky diode, which has an extremely low turn-on voltage and a small junction capacitance (on the order of 0.1pF), and can be used at an operating frequency of more than 2GHz. The voltage doubler rectifier uses two diodes for rectification, making full use of the received signals of the positive half-cycle and the negative half-cycle. Compared with a single diode, the detection output amplitude will increase by 1 times. The matching circuit before the voltage doubler diode is matched at a received power of -50dBm. Although the input impedance of the detection circuit will change when the received power increases, and there will be a mismatch between the matching circuit and the detection tube, the detection output amplitude is still greater than the output amplitude at -50dBm. Therefore, when this matching method is used, the detection output amplitude is increased when a weak signal is input.

[0061] Specifically, the receiver includes an analog-to-digital converter and a decoder. The analog-to-digital converter is used to convert the detection output signal into a binary bit signal, and the decoder is used to decode the binary bit signal output by the analog-to-digital converter, extract the data information, and send the received data information to the codec controller.

[0062] Specifically, the transmitter includes an encoder for encoding the data signal to be reported to the reader to improve the anti-interference and error correction capabilities. The encoder outputs a binary bit signal (MOD) to the bias end of the amplifier. By controlling the bias of the amplifier, BPSK modulation can be achieved. Compared with the ASK reflection modulation used by conventional RFID tags, the modulation loss is smaller, which is conducive to increasing the link margin and communication distance between the reader and the tag.

[0063] Specifically, the internal structure of the amplifier is as follows Figure 6 As shown, it includes three sub-amplifiers PA1, PA2, and PA3, among which PA2 and PA3 are the same sub-amplifiers. The input ends of PA2 and PA3 are connected to the output ends of the balun, and the balun is a device for converting single-ended to balanced. The signal input to the single-ended balun will obtain two signals of the same amplitude at the balanced end, with a phase difference of 180°, that is, one port outputs 90° and the other port outputs -90°. The control signal MOD passes through the inverter, and the input and output of the inverter are respectively connected to the bias control ends of PA2 and PA3. When MOD is high, PA2 works and PA3 is turned off; when MOD is low, PA2 is turned off and PA3 works. With the help of the conversion of the MOD level, the output of the entire amplifier can achieve a phase shift change of about 180°, thereby realizing BPSK modulation.

[0064] Specifically, the output signal of the amplifier passes through a filter, the through-branch of a directional coupler, and is transmitted to the antenna. The input end of the amplifier is connected to the coupled end of the directional coupler, and a part of the signal received by the antenna can be coupled and output to the input end of the amplifier. When the gain of the amplifier is greater than the insertion loss of the filter, the coupling loss of the directional coupler, the insertion loss of the filter, and the insertion loss of the RF switch, the reflected signal will be enhanced. Since the return loss of the antenna reflection is a finite value, when the signal output by the amplifier passes through the antenna, a part of it will be reflected back. If the reflected signal is in phase with the signal received by the antenna and the ratio of the amplitude of the reflected signal to the amplitude of the signal received by the antenna is greater than a certain value, the entire transmitter will oscillate. Therefore, generally, it is required that the reflection enhancement degree (unit: dB) is less than the absolute value of the antenna return loss (unit: dB), that is, RLgain < RLantenna. Here, RLgain is the reflection enhancement degree of the transmitter, and RLantenna is the absolute value of the antenna return loss.

[0065] Specifically, the tag includes an encoding and decoding controller for data transfer between the master controller, encoder, and decoder.

[0066] Specifically, the tag contains a low-power digital temperature sensor, which can be used to measure the ambient temperature around the tag and specifically measure the temperature of the temperature measurement object.

[0067] Specifically, both the reader or the tag include a master controller for controlling the working state and reading temperature sensing information. Specifically, the master controller can also be used to communicate with the server and transmit data or receive working instructions.

[0068] Specifically, a sensor group is also provided in the high-voltage environment to be monitored for obtaining various sensing data. Specifically, positioning devices are provided near the reader and the tag. Specifically, both the sensor group and the positioning device can communicate with the server to facilitate the implementation of the temperature measurement method disclosed in the present invention by the algorithm in the server.

[0069] Embodiment 2 Please refer to Figure 2 , Figure 2 which is a schematic structural diagram of a passive chip temperature measurement system for ultra-high voltage environment disclosed in an embodiment of the present invention. Among them, Figure 2 The passive chip temperature measurement system for ultra-high voltage environment described can be applied to a data processing system / data processing device / data processing server (wherein, the server includes a local processing server or a cloud processing server). As Figure 2 shown, the passive chip temperature measurement system for ultra-high voltage environment can include: The data determination module 201 is used to determine the temperature measurement distance between the reader and the temperature measurement passive tag in real time and to obtain environmental sensing data of the UHV environment.

[0070] Optionally, the reader is arranged on a movable temperature measurement execution body.

[0071] The timing determination module 202 is used to determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm. The hazard determination module 203 is used to determine corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm. The instruction determination module 204 is used to determine the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measuring opportunity parameter and the environmental hazard parameter.

[0072] Optionally, the working instruction is used to control the operation of the corresponding circuit components so that the reader or the temperature measuring passive tag can smoothly perform the temperature measurement task.

[0073] It can be seen that the above-mentioned embodiment of the invention can determine the temperature measurement timing based on the temperature measurement distance between the reader and the temperature measuring passive tag, and then determine the environmental hazard parameters according to the environmental sensor data of the UHV environment, so as to comprehensively determine the working instructions of the circuit components in the temperature measurement system to smoothly perform the temperature measurement task, thereby being able to fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement task in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0074] As an optional embodiment, the specific manner in which the data determination module determines the temperature measurement distance between the reader and the temperature measurement passive tag in real time includes: Get the reader position of the reader in real time; Obtain the chip position of the temperature measurement passive tag in real time; Calculate the temperature measurement distance based on the reader position and chip position.

[0075] It can be seen that through the above-mentioned optional embodiments, the temperature measurement distance can be accurately calculated based on the reader position and the chip position, which is convenient for the subsequent accurate control of the temperature measurement components, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0076] As an optional embodiment, the data determination module calculates the specific manner of the temperature measurement distance according to the reader position and the chip position, including: Determine the device area where the temperature measurement passive tag is located based on the chip location; Obtain the area map corresponding to the device area in the preset area map library; According to the reader location and chip location, as well as the area map, the temperature measurement distance is determined based on the route planning algorithm.

[0077] It can be seen that through the above-mentioned optional embodiments, the area map corresponding to the equipment area can be determined based on the chip position, so as to accurately determine the temperature measurement distance based on the route planning algorithm, and assist in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0078] As an optional embodiment, the data determination module determines the specific method of the temperature measurement distance based on the reader position and the chip position, as well as the area map and the route planning algorithm, including: According to the route planning algorithm, a plurality of candidate temperature measurement routes including the reader locations are determined in the regional map; Calculate the shortest distance between each candidate temperature measurement route and the chip location; Determine the candidate temperature measurement route with the shortest distance as the target temperature measurement route; The length of the route that the reader position needs to travel along the target temperature measurement route to reach the chip position is determined as the temperature measurement distance.

[0079] It can be seen that through the above-mentioned optional embodiments, the target temperature measurement route can be screened out through the planning of the route planning algorithm in the regional map and the shortest distance between different routes and the chip position, and then a more accurate temperature measurement distance can be determined based on the target temperature measurement route, which is convenient for the subsequent accurate control of the temperature measurement components, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0080] As an optional embodiment, the timing determination module determines the specific manner of the corresponding temperature measurement timing parameter according to the temperature measurement distance and a preset distance judgment algorithm, including: Calculate the distance difference between the temperature measurement distance and the preset distance threshold; When the distance difference is greater than a first difference threshold, determining the temperature measurement timing parameter to be a first value inversely proportional to the distance difference; When the distance difference is less than the first difference threshold, determining the temperature measurement timing parameter as the product of the first value and the first weight; optionally, the first weight is greater than 1 and is proportional to the difference between the distance difference and the first difference threshold; When the distance difference is greater than the second difference threshold, the temperature measurement timing parameter is determined as the product of the first value and the second weight; optionally, the second weight is less than 1 and is inversely proportional to the difference between the distance difference and the second difference threshold; the second difference threshold is greater than the first difference threshold.

[0081] It can be seen that through the above optional embodiments, a piecewise function is set to determine the temperature measurement timing parameter, so that the temperature measurement timing parameter is very high when the temperature measurement distance is very small, and very small when the temperature measurement distance is very large, so as to effectively characterize the possibility that the temperature measurement system needs to perform temperature measurement, facilitate the subsequent accurate control of the temperature measurement components, and assist in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed, and the temperature measurement stability and accuracy can be improved.

[0082] As an optional embodiment, the specific manner in which the danger determination module determines the corresponding environmental danger parameter according to the environmental sensor data and a preset data prediction algorithm includes: Calculate the difference between the environmental sensor data and the reference value of the sensor data of the corresponding data type to obtain the corresponding environmental hazard parameter; and / or, The environmental sensor data is input into a trained high-voltage hazard prediction neural network to obtain output environmental hazard parameters; optionally, the high-voltage hazard prediction neural network is trained by a training data set including multiple training environmental sensor data and corresponding high-voltage hazard annotations; the environmental sensor data includes at least one of temperature data, humidity data, sound data, image data and ranging data.

[0083] It can be seen that through the above-mentioned optional embodiments, dangerous situations in UHV environments can be accurately determined based on difference calculations of reference values ​​or trained predictive neural networks, which facilitates the accurate control of subsequent temperature measuring components and assists in fully combining temperature measurement distance and environmental factors to control the operation of temperature measuring components, so that temperature measurement tasks in UHV environments can be smoothly executed and temperature measurement stability and accuracy can be improved.

[0084] As an optional embodiment, the circuit component is a working component of a reader, a controller component of a temperature measuring passive tag, a temperature sensor component, a receiver component or a transmitter component; the receiver component includes at least one of a filter, an envelope detector, an analog-to-digital converter and a decoder; the transmitter component includes at least one of an encoder and an amplifier; the working instructions are start, shut down, sleep, increase power or reduce power.

[0085] It can be seen that through the above-mentioned optional embodiments, the details of the circuit components and the content of the working instructions are defined, which facilitates the present scheme to more accurately control the operation of the temperature measurement system, and assists in fully combining the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so as to smoothly execute the temperature measurement tasks in the UHV environment and improve the temperature measurement stability and accuracy.

[0086] As an optional embodiment, the instruction determination module determines the specific manner of the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measuring opportunity parameter and the environmental hazard parameter, including: Inputting the temperature measurement timing parameter and the environmental hazard parameter into the influencing component prediction model to obtain at least one corresponding influencing component; optionally, the influencing component is a circuit component in a reader or a temperature measuring passive tag; the influencing component prediction model is obtained by training a training data set including a plurality of training temperature measurement timing parameters, training environmental hazard parameters and corresponding influencing component annotations; For each influencing component, determine a first relationship model and a second relationship model corresponding to the influencing component; optionally, the first relationship model is used to define a mathematical relationship between an operating parameter of the influencing component and a temperature measurement timing parameter; the second relationship model is used to define a mathematical relationship between an operating parameter of the influencing component and an environmental hazard parameter; Determine a first operating parameter corresponding to the influencing component according to the temperature measurement timing parameter and the first relationship model; Determine a second operating parameter corresponding to the influencing component according to the environmental hazard parameter and the second relationship model; A working instruction including a first working parameter and a second working parameter is generated and determined as the working instruction corresponding to the influencing component; the working parameters are a startup time, a shutdown time, a sleep time, an increase in power value, or a decrease in power value.

[0087] It can be seen that through the above-mentioned optional embodiments, the influencing components can be determined based on the temperature measurement timing parameters, environmental hazard parameters and the prediction model, and then the corresponding working parameters can be determined based on the working parameters of the influencing components and the mathematical relationship between the temperature measurement timing parameters and the environmental hazard parameters, so as to fully combine the temperature measurement distance and environmental factors to control the operation of the temperature measurement components, so that the temperature measurement tasks in the UHV environment can be smoothly executed and the temperature measurement stability and accuracy can be improved.

[0088] Embodiment 3 See also Figure 3 , Figure 3 This is another passive chip temperature measurement system for ultra-high voltage environment disclosed in an embodiment of the present invention. Figure 3 The passive chip temperature measurement system for ultra-high voltage environment described is applied to a data processing system / data processing device / data processing server (wherein the server includes a local processing server or a cloud processing server). Figure 3 As shown, the passive chip temperature measurement system for ultra-high voltage environment may include: Reader (not in Figure 3 ); Temperature measuring passive tag (not in Figure 3 ); A memory 301 storing executable program codes; a processor 302 coupled to the memory 301; The processor 302 calls the executable program code stored in the memory 301 to execute the steps of the passive chip temperature measurement method for an ultra-high voltage environment described in the first embodiment.

[0089] Embodiment 4 An embodiment of the present invention discloses a computer-readable storage medium storing a computer program for electronic data exchange, wherein the computer program enables a computer to execute the steps of the passive chip temperature measurement method for an ultra-high voltage environment described in the first embodiment.

[0090] Embodiment 5 An embodiment of the present invention discloses a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to enable a computer to execute the steps of the passive chip temperature measurement method for an ultra-high voltage environment described in Example 1.

[0091] The above describes specific embodiments of the present specification, and other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily have to be performed in the specific order or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0092] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0093] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0094] Those skilled in the art will appreciate that the embodiments of this specification may be provided as methods, systems, or computer program products. Therefore, the embodiments of this specification may be in the form of complete hardware embodiments, complete software embodiments, or embodiments in combination with software and hardware. Moreover, the embodiments of this specification may be in the form of a computer program product implemented in one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0095] This specification is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of this specification. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0096] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0097] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0098] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0099] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.

[0100] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0101] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0102] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0103] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0104] Finally, it should be noted that the passive chip temperature measurement method and system for ultra-high voltage environment disclosed in the embodiment of the present invention discloses only the preferred embodiment of the present invention, which is only used to illustrate the technical solution of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that it is still possible to modify the technical solutions recorded in the aforementioned embodiments, or to replace some of the technical features therein by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A passive chip temperature measurement method for ultra-high voltage environment, characterized in that: The method comprises: Determine the temperature measurement distance between the reader and the temperature measurement passive tag in real time and obtain the environmental sensing data of the UHV environment; the temperature measurement passive tag is set on the temperature measurement object in the UHV environment; the reader is set on a movable temperature measurement execution body; Determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm; Determine corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm; According to the temperature measurement timing parameter and the environmental hazard parameter, a working instruction of at least one circuit component in the reader or the temperature measurement passive tag is determined; the working instruction is used to control the operation of the corresponding circuit component so that the reader or the temperature measurement passive tag can smoothly perform the temperature measurement task.

2. The passive chip temperature measurement method for ultra-high voltage environment according to claim 1, characterized in that: The real-time determination of the temperature measurement distance between the reader and the temperature measurement passive tag includes: Get the reader position of the reader in real time; Obtain the chip position of the temperature measurement passive tag in real time; The temperature measurement distance is calculated according to the reader position and the chip position.

3. The passive chip temperature measurement method for ultra-high voltage environment according to claim 2, characterized in that: The step of calculating the temperature measurement distance according to the reader position and the chip position includes: Determine the device area where the temperature measuring passive tag is located according to the chip position; Obtaining a regional map corresponding to the device area in a preset regional map library; According to the reader position and the chip position, as well as the area map, the temperature measurement distance is determined based on a route planning algorithm.

4. The passive chip temperature measurement method for ultra-high voltage environment according to claim 3, characterized in that: Determining the temperature measurement distance based on the reader position, the chip position, and the area map and a route planning algorithm includes: According to the route planning algorithm, a plurality of candidate temperature measurement routes including the reader location are determined in the area map; Calculating the shortest distance between each of the candidate temperature measurement routes and the chip position; Determine the candidate temperature measurement route with the smallest shortest distance as the target temperature measurement route; The length of the route that the reader position needs to travel along the target temperature measurement route to reach the chip position is determined as the temperature measurement distance.

5. The passive chip temperature measurement method for ultra-high voltage environment according to claim 1, characterized in that: Determining corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm includes: Calculating the distance difference between the temperature measurement distance and a preset distance threshold; When the distance difference is greater than a first difference threshold, determining the temperature measurement timing parameter to be a first value inversely proportional to the distance difference; When the distance difference is less than the first difference threshold, determining the temperature measurement timing parameter as the product of the first value and a first weight; the first weight is greater than 1 and is proportional to the difference between the distance difference and the first difference threshold; When the distance difference is greater than a second difference threshold, the temperature measurement timing parameter is determined to be the product of the first value and a second weight; the second weight is less than 1 and is inversely proportional to the difference between the distance difference and the second difference threshold; the second difference threshold is greater than the first difference threshold.

6. The passive chip temperature measurement method for ultra-high voltage environment according to claim 1, characterized in that: Determining corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm includes: Calculating the difference between the environmental sensor data and a reference value of sensor data of a corresponding data type to obtain a corresponding environmental hazard parameter; and / or, The environmental sensor data is input into a trained high-voltage hazard prediction neural network to obtain output environmental hazard parameters; the high-voltage hazard prediction neural network is trained by a training data set including multiple training environmental sensor data and corresponding high-voltage hazard annotations; the environmental sensor data includes at least one of temperature data, humidity data, sound data, image data and ranging data.

7. The passive chip temperature measurement method for ultra-high voltage environment according to claim 1, characterized in that: The circuit components are the working components of the reader, the controller components of the temperature measuring passive tag, the temperature sensor components, the receiver components or the transmitter components; the receiver components include at least one of a filter, an envelope detector, an analog-to-digital converter and a decoder; the transmitter components include at least one of an encoder and an amplifier; the working instructions are start, shut down, sleep, increase power or reduce power.

8. The passive chip temperature measurement method for ultra-high voltage environment according to claim 7, characterized in that: The step of determining the working instruction of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measuring opportunity parameter and the environmental hazard parameter comprises: The temperature measurement timing parameter and the environmental hazard parameter are input into an influencing component prediction model to obtain at least one corresponding influencing component; the influencing component is a circuit component in the reader or the temperature measuring passive tag; the influencing component prediction model is obtained by training a training data set including a plurality of training temperature measurement timing parameters, training environmental hazard parameters and corresponding influencing component annotations; For each of the influencing components, a first relationship model and a second relationship model corresponding to the influencing component are determined; the first relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the temperature measurement timing parameters; the second relationship model is used to define the mathematical relationship between the working parameters of the influencing component and the environmental hazard parameters; Determining a first operating parameter corresponding to the influencing component according to the temperature measurement timing parameter and the first relationship model; Determining a second operating parameter corresponding to the influencing component according to the environmental hazard parameter and the second relationship model; Generate a work instruction including the first work parameter and the second work parameter, and determine it as the work instruction corresponding to the influencing component; the work parameter is the startup time, shutdown time, sleep time, increase power value or decrease power value.

9. A passive chip temperature measurement system for ultra-high voltage environment, characterized in that: The system comprises: A data determination module is used to determine the temperature measurement distance between the reader and the temperature measurement passive tag in real time and to obtain environmental sensing data of the UHV environment; the temperature measurement passive tag is arranged on a temperature measurement object in the UHV environment; the reader is arranged on a movable temperature measurement execution body; A timing determination module, used to determine corresponding temperature measurement timing parameters according to the temperature measurement distance and a preset distance judgment algorithm; A hazard determination module, used to determine corresponding environmental hazard parameters according to the environmental sensor data and a preset data prediction algorithm; An instruction determination module is used to determine the working instructions of at least one circuit component in the reader or the temperature measuring passive tag according to the temperature measurement opportunity parameter and the environmental hazard parameter; the working instruction is used to control the operation of the corresponding circuit component so that the reader or the temperature measuring passive tag can smoothly perform the temperature measurement task.

10. A passive chip temperature measurement system for ultra-high voltage environment, characterized in that: The system comprises: Reader; Temperature measurement passive tag; A memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the passive chip temperature measurement method for ultra-high voltage environment as described in any one of claims 1-8.

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