Server memory impact force testing device

Abstract

The invention discloses a server memory impact force testing device, and relates to the technical field of terminal equipment. The memory is arranged on the main board; the memory simulation module is arranged on the main board; and the pressure detection element is arranged at the upper end of the memory simulation module, the upper surface of the pressure detection element is flush with the upper surface of the memory, and the pressure detection element is electrically connected with the mainboard. The testing device is simple in structure, can simulate the possible impact condition of the server in the transportation process, and verifies the reliability of the server in the use process. Research and development personnel are helped to understand the performance of the memory module when the memory module is subjected to impact force, data support is provided for improving the design and structure of the memory module, and the method has important significance for improving the stability and prolonging the service life of a server.

Description

Technical Field

[0001] This application relates to the technical field of terminal devices, and particularly to a server memory impact force testing device. Background Art

[0002] During the operation of a server, as a key component for data access, the stability and reliability of the memory are crucial. However, in some extreme cases, such as jolts or accidental impacts during transportation, the server memory may be subjected to varying degrees of impact force, which may affect its performance or even cause damage. Therefore, it is of great significance to conduct impact force tests on the server memory to evaluate its stability and durability under force.

[0003] The biggest drawback of the commonly used impact force signal measurement and acquisition systems on the market currently is their large size. The gap between the server memory and the upper cover is extremely small, only about 1 mm, and it is difficult for conventional impact force testing devices to be applied to the server to accurately measure the impact force on the memory. Summary of the Invention

[0004] This application provides a server memory impact force testing device to at least solve the problem in the related art that the gap between the server memory and the upper cover is small, and it is difficult for conventional impact force testing devices to accurately measure the impact force on the memory.

[0005] This application provides a server memory impact force testing device, including:

[0006] Motherboard;

[0007] Memory, which is arranged on the motherboard;

[0008] Memory simulation module, which is arranged on the motherboard;

[0009] Pressure detection element, which is arranged at the upper end of the memory simulation module, and the upper surface of the pressure detection element is flush with the upper surface of the memory. The pressure detection element is electrically connected to the motherboard.

[0010] Through this application, the upper surface of the pressure detection element is flush with the upper surface of the memory, enabling the pressure detection element and the memory simulation module to simulate the real distance between the memory in the server and the upper cover when the server encounters an impact. The memory simulation module is used to replace the memory in the server, expanding the installation space of the pressure detection element and simulating the real stress state of the memory in the server when the server is impacted. The actual impact force suffered by the memory can be measured in real time through the pressure detection element. The test device has a simple structure, can simulate the impact conditions that the server may encounter during transportation, and verify its reliability during use. It helps R & D personnel understand the performance of the memory module when subjected to an impact force, provides data support for improving the design and structure of the memory module, and is of great significance for improving the stability and service life of the server.

[0011] In some embodiments, at least two first slots are provided on the motherboard, and the memory and the memory simulation module are correspondingly inserted into different first slots. This facilitates the quick installation and disassembly of the memory and the memory simulation module, and the connection methods of the memory simulation module and the memory to the motherboard are the same, avoiding measurement errors caused by different installation methods of the memory and the memory simulation module.

[0012] In some embodiments, the memory simulation module is arranged in parallel with the memory, and the length and width of the memory simulation module are equal to the length and width of the memory. By simulating the real state of the memory, the stability of the real memory can be tested.

[0013] In some embodiments, a power supply module, a filtering module, and a signal amplification module are provided on the motherboard, and the power supply module, the filtering module, and the signal amplification module are all electrically connected to the pressure detection element. The power supply, signal amplification function, and filtering function of the pressure detection element are integrated onto the motherboard, reducing the volume of the test device and also saving the cost of the test device.

[0014] In some embodiments, a slider is further included. The pressure detection element is fixed on the memory simulation module, and the slider is slidably arranged at the upper end of the memory simulation module. By sliding, the pressure detection element can be moved to different positions to detect the impact forces at different positions in the server.

[0015] In some embodiments, a plurality of first fixing holes are arranged at intervals along the length direction of the memory simulation module. Second fixing holes are provided on the slider, and the second fixing holes cooperate with different first fixing holes to fix the slider at different positions.

[0016] In some embodiments, a chute is formed on the slider, and the chute is slidably clamped at the upper end of the memory simulation module. The second fixing holes are formed on the wall of the chute.

[0017] In some embodiments, the pressure detection element is a micro pressure sensor.

[0018] In some embodiments, it further includes a first connector, a second connector and a sensor terminal. The first connector and the second connector are both formed on the main board. The first connector is plugged into the sensor terminal. The sensor terminal is connected to the pressure detection element through a cable. The second connector is used to connect a signal acquisition device.

[0019] In some embodiments, a main control board is further provided on the main board. The main control board is used to control the power supply module, the filtering module and the function amplification module. The main control board is used to control the working states of the power supply module, the filtering module and the function amplification module to ensure the smooth progress of the entire testing process. Description of the Drawings

[0020] To more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic structural diagram of a server memory impact force testing device according to some embodiments of the present application;

[0022] Figure 2 It is a partial view of a server memory installation and immediate testing device according to some embodiments of the present application.

[0023] Among them, the above-mentioned drawings include the following reference numerals:

[0024] 1. Main board; 2. Memory; 3. Memory simulation module; 4. Pressure detection element; 5. Main control board; 6. First connector; 7. Second connector; 8. Sensor terminal; 9. Cable; 10. Slide block. Detailed Embodiments

[0025] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0026] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0027] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0028] In the current server models that are cooled by liquid cooling plates, since the height of the memory is higher than that of the liquid cooling plate radiator and there is a lack of the supporting effect of the radiator fins, the impact force of the upper cover hitting the memory is relatively large. Through simulation analysis, it is found that the maximum impact force of the upper cover hitting the memory can reach 500 N, which exceeds more than twice the assembly pressing force of the memory. This poses a great potential safety hazard to the memory module and the motherboard memory area. However, there are problems with the simplification of the memory body and the motherboard memory area in the current simulation modeling technology, and it is impossible to accurately simulate the interference fit relationship between the memory and the slot spring pieces, and it is impossible to accurately obtain the contact force between the memory gold fingers and the memory slot and the peak impact force during the impact process, so as to conduct a risk assessment on the strain of the electronic components in the memory module and the motherboard area. It is necessary to design a set of impact force test devices and systems to monitor the impact force during the impact test in real time.

[0029] To this end, the embodiments of the present application provide a server memory impact force testing device. The memory simulation module simulates the installation state of the real memory on the motherboard. The height of the memory simulation module can be appropriately reduced so that the pressure detection element can be installed in the server, and the upper surface of the pressure detection element is flush with the upper surface of the real memory. The impact force detected by the pressure detection element is equivalent to the impact force received by the real memory, and the testing of the server memory impact force can be realized.

[0030] Specifically, as Figure 1 and Figure 2 shown, the server memory impact force testing device provided by the embodiments of the present application includes:

[0031] The motherboard 1, which serves as the core carrier of the entire testing device. The motherboard 1 is the motherboard 1 that already exists in the server itself;

[0032] The memory 2, which is installed on the motherboard 1 and is used to actually store data and is the main object of the test. The installation relationship between the memory 2 and the motherboard 1 can be the same as or different from the installation relationship between the memory 2 and the motherboard 1 in a conventional server;

[0033] The memory simulation module 3, which is arranged on the motherboard 1. The memory simulation module 3 does not have any functions of the memory 2, that is to say, the memory simulation module 3 is a module without functions;

[0034] The pressure detection element 4, which is arranged at the upper end of the memory simulation module 3. The upper surface of the pressure detection element 4 is flush with the upper surface of the memory 2, and the pressure detection element 4 is electrically connected to the motherboard 1. Since the upper surface of the pressure detection element 4 is flush with the upper surface of the memory 2, the pressure detection element 4 and the memory simulation module 3 simulate the real distance between the server memory 2 and the upper cover when encountering an impact, ensuring that the force of the upper cover impact will not deviate due to the distance change. Using the memory simulation module 3 to replace the memory 2 in the server expands the installation space of the pressure detection element 4, and also simulates the real stress state of the memory 2 in the server when the server is impacted. The actual impact force suffered by the memory 2 can be measured in real time through the pressure detection element 4. The testing device has a simple structure, can simulate the impact situation that the server may encounter during transportation, and verify its reliability during use. It helps the R & D personnel understand the performance of the memory 2 module when receiving an impact force, provides data support for improving the design and structure of the memory 2 module, and is of great significance for improving the stability and service life of the server.

[0035] In some embodiments of the present application, at least two first slots are provided on the mainboard 1, and the memory 2 and the memory simulation module 3 are correspondingly inserted in different first slots. Specifically, in some embodiments of the present application, the number of first slots is equal to the total number of memories 2 and memory simulation modules 3, and each first slot is correspondingly inserted with a memory 2 or a memory simulation module 3, and the first slot is a slot that comes with the server mainboard 1 itself, and the memory 2 is installed on the mainboard 1 through the slot. In the embodiment of the present application, the memory simulation module 3 is installed on the mainboard 1 instead of one of the memories 2 in the server, and the installation method of the memory simulation module 3 is exactly the same as that of the memory 2, and both are tightly inserted into the first slot and can be locked through the first slot, avoiding the problem of inaccurate detection results due to the different installation methods of the memory simulation module 3 and the memory 2.

[0036] Furthermore, in some embodiments, the memory simulation module 3 is located between two adjacent memories 2, so that the pressure signal detected by the pressure detection element 4 on the memory simulation module 3 is as close as possible to the impact force suffered by the real memory 2, thereby further improving the accuracy of the test results.

[0037] In some embodiments of the present application, the memory simulation module 3 is arranged in parallel with the memory 2, and the length and width of the memory simulation module 3 are equal to the length and width of the memory 2. Specifically, the length and width are the dimensions in the plane parallel to the motherboard 1, and the height is the dimension perpendicular to the motherboard 1. The memory simulation module 3 is set to be equal to the memory 2 in length and width, so that the memory simulation module 3 is as close to the real memory 2 as possible in size, ensuring the consistency of the physical dimensions of the two, thereby more accurately simulating the actual impact situation, and the impact force seen by the pressure detection element 4 on the memory simulation module 3 is the impact force suffered by the real memory 2.

[0038] In the related technology, the traditional pressure type sensor and measurement system need to be powered separately and use a signal amplifier, which results in a large volume and is not suitable for measuring the impact force in a small space. Although the fiber-optic Fabry-Perot sensor can be used to measure the impact force in a small space, this detection method is based on homogeneous materials and infers the impact force through the bending strain generated by the impact. For non-homogeneous materials such as memory 2, this method is difficult to implement.

[0039] To this end, in some embodiments of the present application, the pressure detection element 4 adopts a micro force sensor, and a power supply module, a filtering module, and a signal amplification module are provided on the main board 1. The power supply module, the filtering module, and the signal amplification module are all electrically connected to the pressure detection element 4. The power supply module provides the power required for the operation of the pressure detection element 4, and the filtering module is used to filter out the clutter interference in the power supply to ensure the stable operation of the pressure detection element 4. The signal amplification module is used to amplify the weak signal output by the pressure detection element 4 for subsequent processing and analysis.

[0040] The adoption of the micro force sensor has the following advantages:

[0041] 1. High precision: Due to miniaturization, the micro force sensor has higher precision and can measure the change of tiny impact force more accurately, which is crucial for accurately evaluating the impact force on the server memory 2.

[0042] 2. Space saving: The micro force sensor is small in size, which can save a large amount of space, making the test device more compact and convenient for carrying and installation.

[0043] 3. Fast response speed: Miniaturization brings a faster response speed, enabling the sensor to quickly capture the change of impact force and improving the real-time performance and accuracy of the test.

[0044] 4. Low power consumption: The micro force sensor usually has low power consumption, which helps to extend the overall battery life of the test device and reduce the operating cost.

[0045] 5. Strong adaptability: Due to its miniaturization characteristics, the micro force sensor is more easily adapted to different test environments and conditions to meet diverse test requirements.

[0046] Integrating the power supply circuit of the micro force sensor, the amplification function and the filtering function of the signal amplifier onto the main board 1 reduces the volume of the test device and also saves the cost of the test device.

[0047] Further, in some embodiments of the present application, a main control board 5 is also provided on the main board 1. The main control board 5 contains a control program, which controls the power supply module, the signal method module, and the filtering module, and is used to control the working states of the power supply module, the filtering module, and the signal amplification module to ensure the smooth progress of the test process. The control program in the main control board 5 includes a sampling program, a filtering program, and determines the sampling interval, and regularly delivers the filtered signal to the BNC connector. Specifically, in some embodiments of the present application, the main control board 5 is a BMC main control board (Baseboard Management Controller), that is, the baseboard management controller and the intelligent platform management interface, which is the basic core function subsystem of the server and is responsible for the core functions such as the hardware status management, the operating system management, the health status management, and the power consumption management of the server. BMC is a small operating system independent of the server system and is a chip integrated on the main board. There are also products that are inserted on the main board in the form of PCIE, etc. The external manifestation is only a standard RJ45 network port, and it has a firmware system with an independent IP. Server clusters generally use BMC instructions for large-scale unattended operations, including the remote management, monitoring, installation, restart, etc. of the servers.

[0048] Further, in some embodiments of the present application, the server memory 2 impact test device further includes a slider 10, and the pressure detection element 4 is fixed on the slider 10, and the slider 10 is slidably disposed on the upper end of the memory simulation module 3.

[0049] Exemplarily, in some embodiments of the present application, the lower end of the pressure detection element 4 is adhesively bonded to the upper surface of the slider 10, and the slider 10 also moves along the length direction of the memory simulation module 3 to any position of the memory simulation module 3 to detect the impact force at different positions inside the server. By adjusting the position of the slider 10, the impact conditions at different positions of the memory 2 can be simulated, improving the flexibility and comprehensiveness of the test.

[0050] Further, in some embodiments of the present application, a plurality of first fixing holes are arranged at intervals along the length direction of the memory simulation module 3, and the slider 10 is provided with second fixing holes. The slider 10 is fixed at different positions by cooperating with different first fixing holes during the movement process.

[0051] Specifically, when the second fixing hole on the slider 10 is aligned with the first fixing hole on the memory simulation module 3, fasteners such as screws, positioning pins or bolts are sequentially passed through the second fixing hole and the first fixing hole to lock the slider 10 on the memory simulation module 3. When the slider 10 moves along the length direction of the memory simulation module 3, the second fixing hole on the slider 10 can be aligned with different first fixing holes on the memory simulation module 3. When they are aligned, a positioning pin can be used for fixation to prevent the slider 10 from moving or shaking during the impact process. By matching the second fixing hole with different first fixing holes, the slider 10 can be fixed at different positions, ensuring the stability and accuracy during the test process.

[0052] Further, in some embodiments of the present application, a chute is formed on the slider 10. The chute is slidably clamped on the upper end of the memory simulation module 3, and the second fixing hole is formed on the wall of the chute. Specifically, the chute straddles the width direction of the memory simulation module 3. The two walls of the chute are respectively attached to the two side walls on both sides of the width direction of the memory simulation module 3. Second fixing holes are provided on both walls of the chute, and the second fixing holes on the two walls are arranged in one-to-one correspondence to ensure that the second fixing holes on the two walls can be aligned with the first fixing holes simultaneously, improving the convenience of the installation process and the stability of the installation structure.

[0053] Exemplarily, in some embodiments of the present application, the slider 10 is formed by bending or stamping a rectangular plate. The two ends of the plate are bent in the same direction to form two walls, and the middle part forms the bottom of the chute. The walls and the bottom are in a state close to perpendicularity.

[0054] In some embodiments of the present application, the server memory 2 impact force testing device further includes a first connector 6, a second connector 7 and a sensor terminal 8. The first connector 6 and the second connector 7 are both arranged on the main board 1. The first connector 6 is plugged into the sensor terminal 8. The sensor terminal 8 is connected to the pressure detection element 4 through a cable 9. The second connector 7 is used to connect a signal acquisition device. Specifically, both the first connector 6 and the second connector 7 are customized connectors. The first connector 6 and the sensor terminal 8 are electrically connected by plugging a male connector and a female connector. The connector terminal is connected to the pressure detection element 4 through a cable 9, finally realizing the connection between the main board 1 and the pressure detection element 4, thereby realizing the power supply to the pressure detection element 4, receiving the weak electrical signal of the pressure detection element 4, and amplifying it through the signal amplification module on the main board 1.

[0055] In some embodiments of the present application, a signal acquisition device is also connected to the second connector 7 to collect the measured impact force into the signal acquisition device. The signal acquisition device is a noise and vibration performance test and analysis system, which has the characteristics of high sampling accuracy and high system integration. Its highest sampling accuracy can reach 204.8 kHz, which is very suitable for measuring instantaneous impact signals. In addition, its measurement and analysis software and hardware front-end both come from Siemens Industry Software Company, so the system software and hardware are perfectly matched.

[0056] A laptop computer installed with measurement and analysis software is connected to the acquisition device through a network cable, and the acquisition device is connected to the second connector 7 on the server motherboard 1 through an adapter cable (the second connector 7 uses a BNC connector. The BNC connector is a connector used for connecting wires and cameras when video equipment outputs in monitoring projects. It is a special display interface different from the ordinary 15-pin D-SUB standard connector. It consists of five independent signal connectors for RGB primary color signals and horizontal and vertical synchronization. It is mainly used to connect systems with high requirements for scanning frequency such as workstations. The BNC connector can isolate the video input signal, reduce the interference between signals, and has a larger signal bandwidth than ordinary D-SUB, and can achieve the best signal response effect.). After setting parameters such as sampling time and sampling interval in the measurement and analysis software, the measurement can start.

[0057] During the test, the server memory 2 to be tested and the memory simulation module 3 are installed in the first slot on the motherboard 1, and then the position of the slider 10 is adjusted and fixed to simulate the impact conditions at different positions. The test device is turned on, an impact force is applied to the memory simulation module 3, and the pressure detection element 4 transmits the detected impact force signal to the motherboard 1 for processing and analysis. The test data is collected and recorded in real time through the signal acquisition device connected to the second connector 7.

[0058] The embodiment of the present application provides a server memory 2 impact force test device with a simple structure, convenient operation and accurate test, which can simulate the impact conditions in actual use, perform impact force tests on the server memory 2 to evaluate its stability and durability under force. Through the design of the slider 10 and multiple first fixing holes, it is also possible to simulate the impact conditions at different positions, improving the comprehensiveness and accuracy of the test.

[0059] The above has introduced in detail a server memory impact force test device provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server memory impact force testing device, characterized in that: include: Motherboard; A memory, wherein the memory is arranged on the mainboard; A memory simulation module, wherein the memory simulation module is arranged on the main board; A pressure detection element is arranged at the upper end of the memory simulation module, and the upper surface of the pressure detection element is flush with the upper surface of the memory, and the pressure detection element is electrically connected to the mainboard.

2. The server memory impact force testing device according to claim 1, characterized in that: At least two first slots are arranged on the mainboard, and the memory and the memory simulation module are correspondingly inserted into different first slots.

3. The server memory impact force testing device according to claim 1, characterized in that: The memory simulation module is arranged in parallel with the memory, and the length and width of the memory simulation module are equal to the length and width of the memory.

4. The server memory impact force testing device according to claim 1, characterized in that: The mainboard is provided with a power supply module, a filter module and a signal amplification module, and the power supply module, the filter module and the signal amplification module are all electrically connected to the pressure detection element.

5. The server memory impact force testing device according to claim 1, characterized in that: It also includes a slider, the pressure detection element is fixed on the slider, and the slider is slidably arranged on the upper end of the memory simulation module.

6. The server memory impact force testing device according to claim 5, characterized in that: The memory simulation module is provided with a plurality of first fixing holes at intervals along the length direction, and the slider is provided with second fixing holes, which cooperate with different first fixing holes to fix the slider at different positions.

7. The server memory impact force testing device according to claim 6, characterized in that: The slide block is provided with a slide groove, the slide groove is slidably clamped on the upper end of the memory simulation module, and the second fixing hole is provided on the groove wall of the slide groove.

8. The server memory impact force testing device according to claim 1, characterized in that: The pressure detection element is a micro pressure sensor.

9. The server memory impact force testing device according to claim 1, characterized in that: It also includes a first connector, a second connector and a sensor terminal. The first connector and the second connector are both arranged on the main board. The first connector is plugged into the sensor terminal. The sensor terminal is connected to the pressure detection element through a cable. The second connector is used to connect to a signal acquisition device.

10. The server memory impact force testing device according to claim 1, characterized in that: The main board is also provided with a main control board, and the main control board is used to control the power supply module, the filter module and the function amplification module.

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