Display device

Abstract

The invention provides a display device. The display device comprises a protective cover plate; the display module comprises a display surface facing one side of the protective cover plate and a back surface deviating from one side of the protective cover plate; at least part of the chip on film is located on the back surface and is in binding connection with one side of the display module; the driving chip is located on one side, facing the display module, of the chip-on-film on the back surface and is connected with the chip-on-film in a binding manner; the bending gasket is located between the driving chip and the back face, and the bending gasket comprises a first film layer and a second film layer which are arranged in a stacked mode; wherein the second film layer is in contact with the driving chip, and the area of the second film layer is smaller than that of the first film layer; the part, exceeding the second film layer, of the surface of the side, facing the driving chip, of the first film layer is bonded with the display module or the chip-on-film.

Description

[0001] This application is a divisional application. The application number of the original application is 202010883550.8, the filing date of the original application is August 28, 2020, and the title of the original application is "Display Device, Bending Gasket Module and Assembly Method Thereof". The entire content of the original application is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of display technologies, and in particular, to a display device. Background Art

[0003] With the increasing popularity of smart phones and wearable electronic products, people have higher and higher requirements for the screen-to-body ratio. In the trend of full screens, the border of the display module (MDL) is getting narrower and narrower. In particular, the border where the display module is bonded to the chip on film (COF) has particularly high requirements and strict control. Summary of the Invention

[0004] On the one hand, an embodiment of the present disclosure provides a display device, including:

[0005] A protective cover plate;

[0006] A display module, including a display surface facing the protective cover plate side and a back surface facing away from the protective cover plate side;

[0007] A chip on film, at least partially located on the back surface and bonded to one side of the display module;

[0008] A driving chip, located on the side of the chip on film facing the display module on the back surface and bonded to the chip on film;

[0009] A bending gasket, located between the driving chip and the back surface, and the thickness of the part of the bending gasket in contact with the driving chip is greater than the thickness of the remaining part.

[0010] Optionally, in the above display device provided by the embodiment of the present disclosure, the bending gasket includes: a first film layer and a second film layer stacked; wherein, the second film layer is in contact with the driving chip, and the area of the second film layer is smaller than the area of the first film layer.

[0011] Optionally, in the above display device provided by the embodiment of the present disclosure, the first film layer and the second film layer are of an integral structure.

[0012] Optionally, in the above display device provided by the embodiments of the present disclosure, the positive projection of the second film layer on the plane where the driving chip is located completely covers the driving chip. Optionally, in the above display device provided by the embodiments of the present disclosure, in the vertical direction of the plane where the bending gasket is located, the sum of the thicknesses of the first film layer and the second film layer is greater than or equal to 0.2 mm.

[0013] Optionally, in the above display device provided by the embodiments of the present disclosure, the side of the display module where the COF is bonded faces the back surface for bending, and all the COFs are located on the back surface.

[0014] Optionally, in the above display device provided by the embodiments of the present disclosure, one side of the COF is bonded and connected to one side of the display module on the display surface, and the other side of the COF bends from the display surface towards the back surface.

[0015] Optionally, in the above display device provided by the embodiments of the present disclosure, in the bending axis direction, the widths of the first film layer and the second film layer are the same.

[0016] Optionally, in the above display device provided by the embodiments of the present disclosure, the widths of the first film layer and the second film layer are greater than or equal to 7 mm and less than or equal to 12 mm.

[0017] Optionally, in the above display device provided by the embodiments of the present disclosure, the cross-section of the bending gasket on the side away from the bending axis is a vertical plane.

[0018] Optionally, in the above display device provided by the embodiments of the present disclosure, in the vertical direction of the vertical plane, the length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and the length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

[0019] Optionally, in the above display device provided by the embodiments of the present disclosure, it further includes: a first back film and a heat dissipation film that are sequentially located on the side of the back surface facing the bending gasket, and a second back film located on the side of the bending gasket facing away from the back surface;

[0020] In the vertical direction of the plane where the bending gasket is located, the thickness of the first film layer is less than or equal to the difference between the bending diameter and the sum of the thicknesses of the first back film, the heat dissipation film, and the second back film.

[0021] Optionally, in the above display device provided by the embodiments of the present disclosure, it further includes: a flexible circuit board bonded to the COF;

[0022] The flip-chip film includes: a first terminal bonded to the display module, and a second terminal bonded to the flexible circuit board; wherein the first terminal and the second terminal are located on the side of the flip-chip film where the driving chip is bonded.

[0023] On the other hand, an embodiment of the present disclosure provides a bending gasket module, including:

[0024] A bending gasket, which is the bending gasket in the above display device;

[0025] A first release film, located on the side of the bending gasket to be bonded to the back surface of the display module;

[0026] A second release film, located on the side of the bending gasket to be bonded to the driving chip.

[0027] Optionally, in the above bending gasket module provided by the embodiment of the present disclosure, the second release film includes: a third film layer and a fourth film layer stacked; wherein, the fourth film layer contacts the first film layer, and the area of the fourth film layer is smaller than the area of the third film layer;

[0028] In the vertical direction of the plane where the bending gasket is located, the thickness of the fourth film layer is the same as the thickness of the second film layer; and the orthographic projection of the fourth film layer on the plane where the bending gasket is located does not overlap with the second film layer.

[0029] Optionally, in the above bending gasket module provided by the embodiment of the present disclosure, the third film layer and the fourth film layer are of an integral structure.

[0030] On the other hand, an embodiment of the present disclosure provides an assembly method of the above bending gasket module, including:

[0031] Tear off the first release film;

[0032] Bond the side of the bending gasket separated from the first release film to the back surface of the display module;

[0033] Tear off the second release film;

[0034] Bond the side of the bending gasket separated from the second release film to the driving chip. Description of the Drawings

[0035] Figure 1 It is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present disclosure;

[0036] Figure 2 It is another schematic cross-sectional structure diagram of a display device provided by an embodiment of the present disclosure;

[0037] Figure 3The front view of the bending gasket provided by the embodiment of the present disclosure;

[0038] Figure 4 The side view of the bending gasket provided by the embodiment of the present disclosure;

[0039] Figure 5 The bottom view of the display device provided by the embodiment of the present disclosure;

[0040] Figure 6 Is the sectional view along Figure 5 Line I-II in

[0041] Figure 7 The side view of the bending gasket module provided by the embodiment of the present disclosure;

[0042] Figure 8 The top view of the second release film provided by the embodiment of the present disclosure;

[0043] Figure 9 The top view of the bending gasket module provided by the embodiment of the present disclosure. Detailed implementation manners

[0044] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It should be noted that the sizes and shapes of the various figures in the drawings do not reflect the actual proportions, and the purpose is only to schematically illustrate the content of the present disclosure. Also, the same or similar reference numerals throughout indicate the same or similar elements or elements having the same or similar functions. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts fall within the scope of protection of the present disclosure.

[0045] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The "first", "second" and similar terms used in the specification and claims of the present disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms such as "inside", "outside", "above", "below", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0046] In the related art, in order to ensure that the border where the display module is bonded to the COF film is narrow, a (bending) bending solution is generally adopted. Specifically, there are two bending solutions: First, the border of the display module for bonding the COF film is bent towards its back; Second, the COF film is bonded to the display surface of the display module, and the COF film is bent towards the back of the display module. After bending using the above two bending solutions, a bending spacer is also required to paste the bent COF film or display module to the heat dissipation film (SCF) on the back of the display module. Generally, the placement area of the driving chip (D-IC) is near the bending area, and in actual products, the driving chip bonded to the COF film is also pasted together with the bending spacer to utilize the buffering effect of the bending spacer to prevent the driving chip from being damaged during strength tests such as the whole machine falling / tumbling / squeezing. However, with the development trend of the border where the display module is bonded to the COF film becoming narrower and narrower, the bending radius becomes smaller and smaller, resulting in the space between the bent COF film or display module and the heat dissipation film becoming smaller and smaller. Thus, the bending spacer provided between the bent COF film or display module and the heat dissipation film becomes thinner and thinner, and the thinner bending spacer cannot play a buffering and protecting role for the driving chip.

[0047] In view of the above problems existing in the related art, an embodiment of the present disclosure provides a display device, as Figure 1 and Figure 2 shown, including:

[0048] A protection cover plate 1;

[0049] A display module 2, including a display surface A facing the protection cover plate 1 and a back surface facing away from the protection cover plate 1;

[0050] A COF film 3, at least partially located on the back surface and bonded to one side of the display module 2;

[0051] A driving chip 4, located on the side of the COF film 3 on the back surface facing the display module 2 and bonded to the COF film 3;

[0052] A bending spacer 5, located between the driving chip 4 and the back surface, and the thickness of the part of the bending spacer 5 in contact with the driving chip 4 is greater than the thickness of the remaining part.

[0053] In the above display device provided by the embodiments of the present disclosure, by making the thickness of the contact part between the bending gasket 5 and the driving chip 4 greater than the thickness of the remaining part, the thinner remaining part can realize the bonding effect on the bent display module 2 or the flip-chip film 3, while the thicker contact part can play a buffering and protecting role for the driving chip 4. Therefore, while ensuring the original bonding function of the bending gasket 5, the technical problem that the bending gasket 5 is too thin to protect the driving chip 4 in the related art is effectively solved. In addition, since the bending gasket 5 takes into account both the pasting and buffering functions, it is avoided to use two bonding devices and two bonding processes to respectively realize the bonding of the bent display module 2 or the flip-chip film 3 and the buffering and protection of the driving chip 4. Thus, both the production line efficiency is ensured and no additional bonding device needs to be added.

[0054] Optionally, in the above display device provided by the embodiments of the present disclosure, as Figures 1 to 4 shown, the bending gasket 5 includes a first film layer 501 and a second film layer 502 which are stacked; wherein, the second film layer 502 is in contact with the driving chip 4, and the area of the second film layer 502 is smaller than the area of the first film layer 501. It can be understood that the first film layer 501 in the present disclosure can be equivalent to the bending gasket in the related art, and in the present disclosure, a second film layer 502 is specifically added in the area of the first film layer 501 corresponding to the driving chip 4 to realize the buffering and protecting effect on the driving chip 4. Optionally, the shape of the second film layer 502 can be a cuboid, a prism, a cylinder, a frustum of a pyramid, etc.

[0055] Optionally, in the above display device provided by the embodiments of the present disclosure, the first film layer 501 and the second film layer 502 can be an integral structure, and of course, they can also be two independent film layers, which is not limited herein. It is easy to understand that when the first film layer 501 and the second film layer 502 are an integral structure, the bending gasket 5 formed by the first film layer 501 and the second film layer 502 can be an organic double-sided adhesive or an inorganic double-sided adhesive; when the first film layer 501 and the second film layer 502 are two independent film layers, the first film layer 501 is preferably an organic double-sided adhesive or an inorganic double-sided adhesive, and the second film layer 502 only needs to have a single-sided adhesive (such as a grid adhesive, Foam) on the side in contact with the driving chip 4.

[0056] Optionally, in the above display device provided by the embodiments of the present disclosure, as Figure 1 、 Figure 2 and Figure 5 shown, the orthographic projection of the second film layer 502 on the plane where the driving chip 4 is located completely covers the driving chip 4 to realize effective protection of the driving chip 4. Optionally, as Figure 5 shown, the lateral dimension difference △d between the second film layer 502 and the driving chip 4 is ≥ 1 mm.

[0057] Optionally, in the above display device provided by the embodiments of the present disclosure, to better protect the driving chip 4 and make the overall product thinner, as Figure 1 and Figure 2 shown, in the direction perpendicular to the plane where the bending gasket 5 is located, the thickness d 11 of the first film layer 501 and the thickness d 12 of the second film layer 502 1 sum d 1 is greater than or equal to 0.2 mm. The upper limit value of d 1 can be specifically adjusted according to the reserved space of the whole machine. For example, when the reserved space of the whole machine is 0.1 mm, d 1 can be less than or equal to 0.3 mm. Of course, if the reserved space of the whole machine at the location of the driving chip 4 is large, the value of d 1 can also be appropriately increased, so as to more fully protect the driving chip 4.

[0058] Optionally, in the above display device provided by the embodiments of the present disclosure, to ensure that the bonding border is narrow, as Figure 1 shown, the side of the display module 2 where the COF film 3 is bonded can be bent toward the back surface, and the entire COF film 3 is located on the back surface. Or, as Figure 2 shown, one side of the COF film 3 is bonded and connected to one side of the display module 2 on the display surface A, and the other side of the COF film 3 is bent from the display surface A toward the back surface.

[0059] Optionally, in the above display device provided by the embodiments of the present disclosure, to facilitate the cutting and forming of the bending gasket 5, as Figures 1 to 3 shown, in the bending axis direction (i.e., the direction perpendicular to the paper surface in Figure 1 and Figure 2 ), the width W 11 of the first film layer 501 and the width W 12 of the second film layer 502 are the same. Optionally, both W 11 and W 12 are greater than or equal to 7 mm and less than or equal to 12 mm. Preferably, to further facilitate the cutting and forming of the bending gasket 5, as Figure 1 and Figure 2 shown, the cross-section of the bending gasket 5 on the side away from the bending axis (i.e., the right cross-section) is a vertical plane. Optionally, in the direction perpendicular to this vertical plane, the length L 11 of the first film layer 501 is greater than or equal to 8 mm and less than or equal to 15 mm, and the length L 12 of the second film layer 502 is greater than or equal to 3 mm and less than or equal to 7 mm.

[0060] Optionally, in the above display device provided by the embodiments of the present disclosure, as Figure 1 and Figure 2As shown, it generally may further include: a first back film 6 and a heat dissipation film 7 that are sequentially located on one side of the back surface facing the bending gasket 5, and a second back film 8 that is located on the side of the bending gasket 5 away from the back surface;

[0061] In the vertical direction of the plane where the bending gasket 5 is located, the thickness d of the first film layer 501 11 is less than or equal to the difference between the bending diameter 2R and the sum of the thickness d of the first back film 6 2 , the thickness d of the heat dissipation film 7 3 , and the thickness d of the second back film 8 4 . Specifically, in Figure 1 , the thickness d of the first film layer 501 11 is equal to the difference between the bending diameter 2R and the sum of the thickness d of the first back film 6 2 , the thickness d of the heat dissipation film 7 3 , the thickness d of the second back film 8 4 , and the thickness d of the display module 2 5 , that is, the thickness d of the first film layer 501 11 is less than the difference between the bending diameter 2R and the sum of the thickness d of the first back film 6 2 , the thickness d of the heat dissipation film 7 3 , and the thickness d of the second back film 8 4 ; in Figure 2 , the thickness d of the first film layer 501 11 is equal to the difference between the bending diameter 2R and the sum of the thickness d of the first back film 6 2 , the thickness d of the heat dissipation film 7 3 , and the thickness d of the second back film 8 4 .

[0062] Optionally, in the above display device provided by the embodiments of the present disclosure, as Figure 1 , Figure 2 and Figure 6 shown, it may further include: a flexible circuit board 9 that is bonded and connected to the flip chip film 3;

[0063] The flip chip film 3 includes: a first terminal 301 that is bonded and connected to the display module 2, and a second terminal 302 that is bonded and connected to the flexible circuit board 9; wherein the first terminal 301 and the second terminal 302 are located on the side of the flip chip film 3 where the driving chip 4 is bonded. Generally, as Figure 6 shown, display terminals 301' that correspond one-to-one with the first terminal 301 are provided on the display module 2, and connection terminals 302' that correspond one-to-one with the second terminal 302 are provided on the flexible circuit board 9.

[0064] When the first terminal 301, the second terminal 302 and the driving chip 4 are on different sides, the COF 3 needs to be made into a double-layer board, resulting in a high cost. In the present disclosure, by arranging the first terminal 301 and the second terminal 302 on the side of the COF 3 where the driving chip 4 is bonded, the COF 3 can be made into a single-layer board, thus reducing the cost.

[0065] Generally, in the above display device provided by the embodiments of the present disclosure, as Figure 1 and Figure 2 shown, it may further include: a polarizer 10 located on the side where the display surface A of the display module 2 is located, a first optical adhesive (OCA) layer 11 located between the display module 2 and the polarizer 10, and a second optical adhesive layer 12 located between the polarizer 10 and the protective cover plate 10.

[0066] Based on the same inventive concept, the embodiments of the present disclosure provide a bending gasket module. Since the principle of solving problems by this bending gasket module is similar to that of the above display device, therefore, for the implementation of the bending gasket module provided by the embodiments of the present disclosure, reference may be made to the implementation of the above display device provided by the embodiments of the present disclosure, and the repeated parts will not be elaborated.

[0067] Specifically, a bending gasket module provided by the embodiments of the present disclosure, as Figure 7 shown, includes:

[0068] a bending gasket 5, which is the bending gasket 5 in the above display device;

[0069] a first release film 13, located on the side of the bending gasket 5 to be bonded to the back surface of the display module 2;

[0070] a second release film 14, located on the side of the bending gasket 5 to be bonded to the driving chip 4.

[0071] The film material attaching factory generally uses a roller attaching method to attach the bending gasket 5 to the back surface of the display module 2. Therefore, it is required that there should be no step difference on the surface of the second release film 14 during roller attachment of the bending gasket 5. However, there is a step difference in the bending gasket 5 itself. If the second release film 14 uses a conventional equal-thickness release film, there will inevitably be a step difference on the surface of the second release film 14, which is not conducive to roller attachment. Therefore, the present disclosure proposes a new structural design for the second release film 14. Specifically, as Figure 7 shown, the thickness of the part where the second release film 14 contacts the first film layer 501 is greater than that of other parts, thereby weakening the surface step difference phenomenon of the second release film 14.

[0072] Optionally, in the above bending gasket module provided by the embodiments of the present disclosure, as Figure 7 and Figure 8As shown, the second release film 14 includes a third film layer 1401 and a fourth film layer 1402 which are stacked; wherein, the fourth film layer 1402 is in contact with the first film layer 501, and the area of the fourth film layer 1402 is smaller than that of the third film layer 1401. It can be understood that the third film layer 1401 in the present disclosure can be equivalent to the conventional equal-thickness release film in the related art. Specifically in the present disclosure, the fourth film layer 1402 is provided in the area where the third film layer 1401 corresponds to the first film layer 501 and does not overlap with the second film layer 502, so as to cooperate with the bent gasket 5 of the special-shaped structure, which is beneficial to attaching the bent gasket module to the back surface of the display module 2 by using a roller.

[0073] Optionally, in the above-mentioned bent gasket module provided by the embodiment of the present disclosure, as Figure 7 shown, in the vertical direction of the plane where the bent gasket 5 is located, the thickness d of the fourth film layer 1402 6 is the same as the thickness d of the second film layer 502 12 to minimize the step difference to the greatest extent.

[0074] Optionally, in the above-mentioned bent gasket module provided by the embodiment of the present disclosure, as Figure 7 shown, the orthographic projection of the fourth film layer 1402 on the plane where the bent gasket 5 is located does not overlap with the second film layer 502. Here, it is mainly considered that when the second release film 14 is attached to the bent gasket 5, if there is no gap between the fourth film layer 1402 and the second film layer 502, the side surface of the fourth film layer 1402 will stick to the side surface of the second film layer 502, making the surface of the third film layer 1401 look convex and uneven, resulting in the roller being unable to attach. Optionally, the distance S between the fourth film layer 1402 and the second film layer 502 can be greater than or equal to 0.3 mm and less than or equal to 0.8 mm, preferably 0.5 mm.

[0075] Optionally, in the above-mentioned bent gasket module provided by the embodiment of the present disclosure, as Figure 7 and Figure 9As shown, the region where the orthographic projection of the fourth film layer 1402 on the plane where the bending gasket 5 is located does not overlap with the first film layer 501 completely overlaps with the region where the orthographic projection of the third film layer 1401 on the plane where the bending gasket 5 is located does not overlap with the first film layer 501. The purpose of this is to use the third film layer 1401 and the fourth film layer 1402 that are extra relative to the first film layer 501 as a tearing handle, and when tearing off the first film layer 501, it can ensure that the third film layer 1401 that fills the step difference of the bending gasket 5 is also torn off together and will not remain on the product. Here, the adhesion between the third film layer 1401 and the fourth film layer 1402 can also be adjusted to ensure that the two can be torn off together. However, in actual situations, the adhesion between the third film layer 1401 and the fourth film layer 1402 is unstable, sometimes allowing the two to be torn off together and sometimes not, resulting in the device working normally sometimes and alarming sometimes, which is not conducive to mass production.

[0076] Optionally, in the above-mentioned bending gasket module provided by the embodiments of the present disclosure, the third film layer 1401 and the fourth film layer 1402 can be an integral structure or two independent film layers, which is not limited herein.

[0077] Optionally, in the above-mentioned bending gasket module provided by the embodiments of the present disclosure, since the first release film 13 is in contact and fit with the first film layer 501 with an equal thickness design, the first release film 13 can be an equal-thickness film without special design.

[0078] Correspondingly, the embodiments of the present disclosure provide an assembly method for the above-mentioned bending gasket module, including:

[0079] Tear off the first release film;

[0080] Attach the side of the bending gasket that is separated from the first release film to the back surface of the display module; specifically, the first film layer of the bending gasket can be attached to the heat dissipation film on the back surface of the display module by means of roller attachment;

[0081] Tear off the second release film;

[0082] Attach the side of the bending gasket that is separated from the second release film to the driving chip.

[0083] In the display device, the flexible gasket module and the assembly method thereof provided by the embodiments of the present disclosure, the display device includes: a protective cover plate; a display module including a display surface facing the protective cover plate and a back surface facing away from the protective cover plate; a flip chip film at least partially located on the back surface and bonded to one side of the display module; a driving chip located on the side of the flip chip film on the back surface facing the display module and bonded to the flip chip film; and a flexible gasket located between the driving chip and the back surface, and the thickness of the portion of the flexible gasket in contact with the driving chip is greater than the thickness of the remaining portion. By making the thickness of the portion of the flexible gasket in contact with the driving chip greater than the thickness of the remaining portion, the thinner remaining portion can achieve the bonding effect on the bent display module or flip chip film, while the thicker contact portion can buffer and protect the driving chip. Therefore, while ensuring the original bonding function of the flexible gasket, the technical problem in the related art that the flexible gasket is too thin to protect the driving chip is effectively solved.

[0084] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure is also intended to include these changes and modifications.

Claims

1. A display device, wherein, comprising: a protective cover plate; a display module, including a display surface on a side facing the protective cover plate and a back surface on a side facing away from the protective cover plate; a flip chip film, at least partially located on the back surface and bonded to one side of the display module; a driving chip, located on a side of the flip chip film on the back surface facing the display module and bonded to the flip chip film; a bending gasket, located between the driving chip and the back surface, the bending gasket including: a first film layer and a second film layer stacked; wherein, the second film layer contacts the driving chip, and the area of the second film layer is smaller than the area of the first film layer; a part of the surface of the first film layer facing the driving chip exceeding the second film layer is bonded to the display module or the flip chip film.

2. The display device according to claim 1, wherein, the first film layer and the second film layer are of an integral structure.

3. The display device according to claim 2, wherein, a positive projection of the second film layer on a plane where the driving chip is located completely covers the driving chip.

4. The display device according to claim 2, wherein, in a direction perpendicular to a plane where the bending gasket is located, a sum of thicknesses of the first film layer and the second film layer is greater than or equal to 0.2 mm.

5. The display device according to claim 2, wherein, a side of the display module bonded to the flip chip film is bent toward the back surface, and all of the flip chip film is located on the back surface.

6. The display device according to claim 2, wherein, one side of the flip chip film is bonded to one side of the display module on the display surface, and the other side of the flip chip film is bent from the display surface toward the back surface.

7. The display device according to claim 5 or 6, wherein, in a bending axis direction, a width of the first film layer is the same as a width of the second film layer.

8. The display device according to claim 7, wherein, the width of the first film layer and the width of the second film layer are greater than or equal to 7 mm and less than or equal to 12 mm.

9. The display device according to claim 5 or 6, wherein, a cross section of the bending gasket on a side away from the bending axis is a vertical surface.

10. The display device according to claim 9, wherein, in a direction perpendicular to the vertical surface, a length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and a length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

11. The display device according to claim 5 or 6, wherein, further comprising: a first back film and a heat dissipation layer sequentially located on a side of the back surface facing the bending gasket, and a second back film located on a side of the bending gasket facing away from the back surface; in a direction perpendicular to a plane where the bending gasket is located, a thickness of the first film layer is less than or equal to a difference between a bending diameter and a sum of thicknesses of the first back film, the heat dissipation layer, and the second back film.

12. The display device according to claim 1, wherein, further comprising: a flexible circuit board bonded to the flip chip film; The flip-chip film includes: a first terminal bonded to the display module, and a second terminal bonded to the flexible circuit board; wherein the first terminal and the second terminal are located on the side of the flip-chip film where the driving chip is bonded.

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