Display device

Abstract

The display device comprises a protective cover plate, a display module, a chip on film, a driving chip and a bending gasket.

Description

[0001] This application is a divisional application. The original application has the application number 202010883550.8 and the original application date is August 28, 2020. The original application is entitled "Display device, bending gasket module and assembly method thereof". The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and more particularly to a display device. Background Technology

[0003] With the increasing popularity of smartphones and wearable electronic products, people have higher and higher requirements for screen ratio. Under the trend of full screen, the border of display module (MDL) is getting narrower and narrower. In particular, the requirements for the border of display module and COF bonding are particularly high and the control is particularly strict. Summary of the Invention

[0004] In one aspect, embodiments of this disclosure provide a display device, including:

[0005] Protective cover plate;

[0006] The display module includes a display surface facing the protective cover and a back surface facing away from the protective cover.

[0007] A flip-chip film, at least partially located on the back side and bonded to one side of the display module;

[0008] The driver chip is located on the side of the flip-chip film on the back side facing the display module and is bonded to the flip-chip film;

[0009] A bent gasket is located between the driver chip and the back surface, and the thickness of the portion of the bent gasket that contacts the driver chip is greater than the thickness of the rest of the portion.

[0010] Optionally, in the display device provided in the embodiments of this disclosure, the bending pad includes: a first film layer and a second film layer stacked together; wherein the second film layer is in contact with the driving chip, and the area of ​​the second film layer is smaller than the area of ​​the first film layer.

[0011] Optionally, in the display device provided in the embodiments of this disclosure, the first film layer and the second film layer are an integral structure.

[0012] Optionally, in the display device provided in the embodiments of this disclosure, the orthographic projection of the second film layer on the plane where the driving chip is located completely covers the driving chip. Optionally, in the display device provided in the embodiments of this disclosure, in the vertical direction of the plane where the bending pad is located, the sum of the thickness of the first film layer and the thickness of the second film layer is greater than or equal to 0.2 mm.

[0013] Optionally, in the display device provided in the embodiments of this disclosure, the side of the display module bound to the flip-chip film is bent toward the back side, and all of the flip-chip film is located on the back side.

[0014] Optionally, in the display device provided in the embodiments of this disclosure, one side of the flip-chip film is bonded to one side of the display surface and the display module, and the other side of the flip-chip film is bent from the display surface toward the back surface.

[0015] Optionally, in the display device provided in the embodiments of this disclosure, the width of the first film layer is the same as the width of the second film layer in the bending axis direction.

[0016] Optionally, in the display device provided in the embodiments of this disclosure, the width of the first film layer and the width of the second film layer are greater than or equal to 7 mm and less than or equal to 12 mm.

[0017] Optionally, in the display device provided in the embodiments of this disclosure, the cross-section of the bending pad on the side away from the bending axis is a vertical plane.

[0018] Optionally, in the display device provided in the embodiments of this disclosure, in the vertical direction of the vertical plane, the length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and the length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

[0019] Optionally, the display device provided in the embodiments of this disclosure further includes: a first back film and a heat dissipation film located sequentially on the side of the back facing the bending pad, and a second back film located on the side of the bending pad away from the back.

[0020] In the direction perpendicular to the plane of the bent pad, the thickness of the first film layer is less than or equal to the difference between the bending diameter and the sum of the thickness of the first back film, the thickness of the heat dissipation film, and the thickness of the second back film.

[0021] Optionally, the display device provided in the embodiments of this disclosure further includes: a flexible circuit board bonded to the flip-chip film;

[0022] The flip-chip film includes: a first terminal bonded to the display module, and a second terminal bonded to the flexible circuit board; wherein the first terminal and the second terminal are located on the side of the flip-chip film bonded to the driver chip.

[0023] On the other hand, embodiments of this disclosure provide a bending gasket module, including:

[0024] The bending gasket is the bending gasket in the aforementioned display device;

[0025] The first release film is located on the side of the back of the bent gasket and the display module to be bonded.

[0026] The second release film is located on the side where the bent gasket and the driver chip are to be bonded.

[0027] Optionally, in the bending gasket module provided in the embodiments of this disclosure, the second release film includes: a third film layer and a fourth film layer stacked together; wherein, the fourth film layer is in contact with the first film layer, and the area of ​​the fourth film layer is smaller than the area of ​​the third film layer;

[0028] In the direction perpendicular to the plane where the bending gasket is located, the thickness of the fourth film layer is the same as the thickness of the second film layer; and the orthographic projection of the fourth film layer on the plane where the bending gasket is located does not overlap with the second film layer.

[0029] Optionally, in the bending gasket module provided in the embodiments of this disclosure, the third film layer and the fourth film layer are an integral structure.

[0030] On the other hand, this disclosure provides a method for assembling the above-mentioned bent gasket module, including:

[0031] Remove the first release film;

[0032] The side of the bent pad that is detached from the first release film is attached to the back of the display module;

[0033] Remove the second release film;

[0034] The side of the bent pad that is detached from the second release film is attached to the driving chip. Attached Figure Description

[0035] Figure 1 A cross-sectional structural schematic diagram of a display device provided in an embodiment of this disclosure;

[0036] Figure 2 This is another cross-sectional structural schematic diagram of the display device provided in the embodiments of this disclosure;

[0037] Figure 3A front view of a bent gasket provided in an embodiment of this disclosure;

[0038] Figure 4 A side view of a bent gasket provided in an embodiment of this disclosure;

[0039] Figure 5 A bottom view of the display device provided in an embodiment of this disclosure;

[0040] Figure 6 For along Figure 5 Cross-sectional view of line I-II in the middle;

[0041] Figure 7 This is a side view of the bending gasket module provided in an embodiment of the present disclosure;

[0042] Figure 8 A top view of the second release film provided in an embodiment of this disclosure;

[0043] Figure 9 This is a top view of the bending gasket module provided in an embodiment of this disclosure. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the dimensions and shapes of the figures in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. Obviously, the described embodiments are only some embodiments of this disclosure, not all embodiments. Based on the described embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0045] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0046] In related technologies, to ensure a narrow bezel between the display module and the chip-on-film, a bending scheme is generally used. This includes two bending schemes: first, bending the bezel of the display module bound to the chip-on-film towards its back; second, binding the chip-on-film to the display surface of the display module and bending the chip-on-film towards the back of the display module. After bending using either of these schemes, bending spacers are needed to adhere the bent chip-on-film or display module to the heat dissipation film (SCF) on the back of the display module. Generally, the area near the bending zone is where the driver chip (D-IC) is placed. In actual products, the driver chip bound to the chip-on-film is also adhered to the bending spacer to utilize the cushioning effect of the bending spacer to prevent damage to the driver chip during strength tests such as drops, rollers, and compression. However, with the trend of increasingly narrow bezels for bonding display modules and flip-chip films, the bending radius is getting smaller and smaller. This results in a smaller and smaller space between the bent flip-chip film or display module and the heat dissipation film. Consequently, the bending pads placed between the bent flip-chip film or display module and the heat dissipation film are becoming thinner and thinner. Thinner bending pads cannot provide buffer protection for the driver chip.

[0047] To address the aforementioned problems in related technologies, this disclosure provides a display device, such as... Figure 1 and Figure 2 As shown, it includes:

[0048] Protective cover 1;

[0049] The display module 2 includes a display surface A facing the protective cover 1 and a back surface facing away from the protective cover 1;

[0050] The flip-chip film 3 is at least partially located on the back side and is bonded to one side of the display module 2;

[0051] The driver chip 4 is located on the side of the flip-chip film 3 facing the display module 2 on the back side, and is bonded to the flip-chip film 3.

[0052] The bent pad 5 is located between the driver chip 4 and the back side, and the thickness of the part of the bent pad 5 that contacts the driver chip 4 is greater than the thickness of the rest.

[0053] In the display device provided in this embodiment, by making the thickness of the contact portion between the bending pad 5 and the driver chip 4 greater than the thickness of the remaining portion, the thinner remaining portion can achieve the bonding effect on the bent display module 2 or the flip-chip film 3, while the thicker contact portion can provide buffer protection for the driver chip 4. Therefore, while ensuring the original bonding function of the bending pad 5, the technical problem in the related art that the bending pad 5 is too thin to protect the driver chip 4 is effectively solved. In addition, since the bending pad 5 has both bonding and buffering functions, it avoids the need to use two bonding equipment and two bonding processes to achieve bonding of the bent display module 2 or the flip-chip film 3 and buffer protection of the driver chip 4, thereby ensuring production line efficiency without the need for additional bonding equipment.

[0054] Optionally, in the display device provided in the embodiments of this disclosure, such as Figures 1 to 4 As shown, the bending pad 5 includes a first film layer 501 and a second film layer 502 stacked together; wherein the second film layer 502 contacts the driver chip 4, and the area of ​​the second film layer 502 is smaller than the area of ​​the first film layer 501. It can be understood that the first film layer 501 in this disclosure can be equivalent to the bending pad in related technologies. Specifically, in this disclosure, a second film layer 502 is added to the area of ​​the first film layer 501 corresponding to the driver chip 4 to achieve a buffering and protective function for the driver chip 4. Optionally, the shape of the second film layer 502 can be a cuboid, prism, cylinder, trapezoidal frustum, etc.

[0055] Optionally, in the display device provided in the embodiments of this disclosure, the first film layer 501 and the second film layer 502 can be an integral structure, or they can be two independent film layers, which is not limited here. It is easy to understand that when the first film layer 501 and the second film layer 502 are an integral structure, the bending pad 5 formed by the first film layer 501 and the second film layer 502 can be an organic double-sided adhesive or an inorganic double-sided adhesive; while when the first film layer 501 and the second film layer 502 are two independent film layers, the first film layer 501 is preferably an organic double-sided adhesive or an inorganic double-sided adhesive, and the second film layer 502 can have a single-sided adhesive (e.g., mesh adhesive, Foam) on the side that contacts the driving chip 4.

[0056] Optionally, in the display device provided in the embodiments of this disclosure, such as Figure 1 , Figure 2 and Figure 5 As shown, the orthographic projection of the second film layer 502 onto the plane where the driver chip 4 is located completely covers the driver chip 4, thereby achieving effective protection for the driver chip 4. Optionally, as... Figure 5 As shown, the difference in lateral dimension between the second film layer 502 and the driving chip 4 is Δd ≥ 1 mm.

[0057] Optionally, in the display device provided in the embodiments of this disclosure, to better protect the driver chip 4 and make the overall product thinner, such as... Figure 1 and Figure 2 As shown, in the direction perpendicular to the plane where the bent gasket 5 is located, the thickness d of the first film layer 501 is... 11 With the thickness d of the second film layer 502 12 The sum of d1 is greater than or equal to 0.2mm. The upper limit of d1 can be adjusted according to the reserved space of the whole machine. For example, when the reserved space of the whole machine is 0.1mm, d1 can be less than or equal to 0.3mm. Of course, if the reserved space of the whole machine at the location of the driver chip 4 is large, the value of d1 can be increased appropriately, so as to more fully protect the driver chip 4.

[0058] Optionally, in the display device provided in the embodiments of this disclosure, to ensure a narrow binding bezel, such as... Figure 1 As shown, the display module 2 can be bent towards the back side with one side of the flip-chip film 3 bonded to it, so that the entire flip-chip film 3 is located on the back side. Alternatively, as... Figure 2 As shown, one side of the flip-chip film 3 is bonded to one side of the display surface A and the display module 2, and the other side of the flip-chip film 3 is bent from the display surface A toward the back side.

[0059] Optionally, in the display device provided in the embodiments of this disclosure, to facilitate the cutting and shaping of the bending pad 5, such as... Figures 1 to 3 As shown, in the direction of the bending axis (i.e. Figure 1 and Figure 2 In the direction perpendicular to the paper surface, the width W of the first film layer 501 11 The width W of the second film layer 502 12 Same, optional W 11 and W 12 All are greater than or equal to 7mm and less than or equal to 12mm. Preferably, to further facilitate the cutting and shaping of the bending gasket 5, such as... Figure 1 and Figure 2 As shown, the cross-section of the bent pad 5 away from the bending axis (i.e., the right-side cross-section) is a vertical plane. Optionally, in the vertical direction of this vertical plane, the length L of the first film layer 501 is... 11 The length L of the second film layer 502 is greater than or equal to 8 mm and less than or equal to 15 mm. 12 Greater than or equal to 3mm and less than or equal to 7mm.

[0060] Optionally, in the display device provided in the embodiments of this disclosure, such as Figure 1 and Figure 2 As shown, it may also include: a first back film 6 and a heat dissipation film 7 located sequentially on the side of the back facing the bent pad 5, and a second back film 8 located on the side of the bent pad 5 away from the back.

[0061] In the direction perpendicular to the plane where the bent pad 5 is located, the thickness d of the first film layer 501 is... 11 Less than or equal to the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, and the thickness d4 of the second back film 8. Specifically, in Figure 1 In the middle, the thickness d of the first film layer 501 11 The difference between the bending diameter 2R and the sum of the thicknesses d2, d3, d4, d5 of the first back film 6, d5, the heat dissipation film 7, the second back film 8, and the display module 2 is equal to the d of the thickness of the first film layer 501. 11 The difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, and the thickness d4 of the second back film 8; in Figure 2 In the middle, the thickness d of the first film layer 501 11 It is equal to the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, and the thickness d4 of the second back film 8.

[0062] Optionally, in the display device provided in the embodiments of this disclosure, such as Figure 1 , Figure 2 and Figure 6 As shown, it may also include: a flexible circuit board 9 bonded to the flip-chip film 3;

[0063] The flip-chip film 3 includes: a first terminal 301 bonded to the display module 2, and a second terminal 302 bonded to the flexible circuit board 9; wherein the first terminal 301 and the second terminal 302 are located on the side of the flip-chip film 3 where the driver chip 4 is bonded. Generally, as Figure 6 As shown, the display module 2 is provided with display terminals 301' that correspond one-to-one with the first terminal 301, and the flexible circuit board 9 is provided with connection terminals 302' that correspond one-to-one with the second terminal 302.

[0064] Since the first terminal 301, the second terminal 302, and the driver chip 4 are located on different sides, the flip-chip film 3 needs to be fabricated as a double-layer board, which increases the cost. In this disclosure, by setting the first terminal 301 and the second terminal 302 on the side of the flip-chip film 3 where the driver chip 4 is bonded, the flip-chip film 3 can be fabricated as a single-layer board, thereby reducing the cost.

[0065] Generally, in the display device provided in the embodiments of this disclosure, such as Figure 1 and Figure 2 As shown, it may also include: a polarizer 10 located on the side where the display surface A of the display module 2 is located, a first optical adhesive (OCA) layer 11 located between the display module 2 and the polarizer 10, and a second optical adhesive layer 12 located between the polarizer 10 and the protective cover plate 10.

[0066] Based on the same inventive concept, this disclosure provides a bending gasket module. Since the principle of the bending gasket module in solving the problem is similar to that of the display device described above, the implementation of the bending gasket module provided in this disclosure can refer to the implementation of the display device described above in this disclosure, and the repeated parts will not be described again.

[0067] Specifically, the present disclosure provides a bending gasket module, such as... Figure 7 As shown, it includes:

[0068] Bending gasket 5, which is the bending gasket 5 in the above-mentioned display device;

[0069] The first release film 13 is located on the side of the back of the bent pad 5 and the display module 2 that is to be bonded.

[0070] The second release film 14 is located on the side where the bent gasket 5 and the driver chip 4 are to be bonded.

[0071] Film bonding manufacturers typically use roller bonding to attach the bending pad 5 to the back of the display module 2. Therefore, it is required that the bending pad 5 has no breaks on the surface of the second release film 14 during roller bonding. However, the bending pad 5 itself has breaks. If a conventional equal-thickness release film is used for the second release film 14, breaks will inevitably exist on its surface, which is detrimental to roller bonding. Therefore, this disclosure proposes a new structural design for the second release film 14. Specifically, as follows... Figure 7 As shown, the thickness of the portion of the second release film 14 that contacts the first film layer 501 is greater than the thickness of the other portions, thereby weakening the surface discontinuity phenomenon of the second release film 14.

[0072] Optionally, in the bending gasket module provided in the embodiments of this disclosure, such as Figure 7 and Figure 8 As shown, the second release film 14 includes a third film layer 1401 and a fourth film layer 1402 stacked together; wherein the fourth film layer 1402 is in contact with the first film layer 501, and the area of ​​the fourth film layer 1402 is smaller than the area of ​​the third film layer 1401. It can be understood that the third film layer 1401 in this disclosure can be equivalent to a conventional equal-thickness release film in related technologies. Specifically, in this disclosure, the fourth film layer 1402 is disposed in the area of ​​the third film layer 1401 corresponding to the first film layer 501 and not overlapping with the second film layer 502, to cooperate with the irregularly shaped bending pad 5, so as to facilitate the use of rollers to attach the bending pad module to the back of the display module 2.

[0073] Optionally, in the bending gasket module provided in the embodiments of this disclosure, such as Figure 7As shown, in the direction perpendicular to the plane where the bent gasket 5 is located, the thickness d6 of the fourth film layer 1402 is different from the thickness d of the second film layer 502. 12 The same principle applies to minimize discontinuity.

[0074] Optionally, in the bending gasket module provided in the embodiments of this disclosure, such as Figure 7 As shown, the orthographic projection of the fourth film layer 1402 onto the plane of the bending gasket 5 does not overlap with the second film layer 502. This is primarily because if there is no gap between the fourth film layer 1402 and the second film layer 502 when the second release film 14 is attached to the bending gasket 5, the side of the fourth film layer 1402 will adhere to the side of the second film layer 502, making the surface of the third film layer 1401 appear uneven and preventing the roller from adhering. Optionally, the distance S between the fourth film layer 1402 and the second film layer 502 can be greater than or equal to 0.3 mm and less than or equal to 0.8 mm, preferably 0.5 mm.

[0075] Optionally, in the bending gasket module provided in the embodiments of this disclosure, such as Figure 7 and Figure 9 As shown, the area where the orthographic projection of the fourth film layer 1402 on the plane of the bending pad 5 does not overlap with the area where the first film layer 501 and the area where the orthographic projection of the third film layer 1401 on the plane of the bending pad 5 do not overlap with the area where the first film layer 501 and the first film layer 501 completely overlap. The purpose of this is to use the additional third film layer 1401 and fourth film layer 1402 relative to the first film layer 501 as tear handles, ensuring that when tearing off the first film layer 501, the third film layer 1401, which fills the gap in the bending pad 5, is also torn off and not left on the product. Alternatively, the adhesion between the third film layer 1401 and the fourth film layer 1402 could be adjusted to ensure they can be torn off together. However, in practice, the adhesion between the third film layer 1401 and the fourth film layer 1402 is unstable, sometimes they can be torn off together and sometimes they cannot, causing the equipment to work normally and sometimes alarm, which is detrimental to mass production.

[0076] Optionally, in the bending gasket module provided in the embodiments of this disclosure, the third film layer 1401 and the fourth film layer 1402 can be an integral structure or two independent film layers, which is not limited here.

[0077] Optionally, in the bending gasket module provided in the embodiments of this disclosure, since the first release film 13 is in contact and bonded to the first film layer 501 with equal thickness design, the first release film 13 can be an equal thickness film without special design.

[0078] Accordingly, this disclosure provides an assembly method for the above-mentioned bent gasket module, comprising:

[0079] Remove the first release film;

[0080] The side of the bent pad detached from the first release film is attached to the back of the display module; specifically, the first film layer of the bent pad can be attached to the heat dissipation film on the back of the display module by means of roller attachment.

[0081] Remove the second release film;

[0082] The side of the bent pad that is detached from the second release film is bonded to the driver chip.

[0083] In the display device, bending pad module, and assembly method thereof provided in the embodiments of this disclosure, the display device includes: a protective cover plate; a display module including a display surface facing the protective cover plate and a back surface facing away from the protective cover plate; a flip-chip film, at least partially located on the back surface and bonded to one side of the display module; a driver chip located on the side of the flip-chip film facing the display module on the back surface and bonded to the flip-chip film; and a bending pad located between the driver chip and the back surface, wherein the thickness of the portion of the bending pad in contact with the driver chip is greater than the thickness of the remaining portion. By making the thickness of the portion of the bending pad in contact with the driver chip greater than the thickness of the remaining portion, the thinner remaining portion can achieve the bonding effect on the bent display module or flip-chip film, while the thicker contact portion can provide buffer protection for the driver chip. Therefore, while ensuring the original bonding function of the bending pad, the technical problem in the related art that the bending pad is too thin to protect the driver chip is effectively solved.

[0084] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A display device, wherein, include: Protective cover plate; The display module includes a display surface facing the protective cover and a back surface facing away from the protective cover. A flip-chip film, at least partially located on the back side and bonded to one side of the display module; The driver chip is located on the side of the flip-chip film on the back side facing the display module and is bonded to the flip-chip film; A bending pad is located between the driver chip and the back surface. The bending pad includes a first film layer and a second film layer stacked together. The second film layer is in contact with the driver chip, and the area of ​​the second film layer is smaller than the area of ​​the first film layer. The orthographic projection of the second film layer on the plane where the driver chip is located completely covers the driver chip, such that the thickness of the portion of the bending pad in contact with the driver chip is greater than the thickness of the remaining portion. The portion of the surface of the first film layer facing the driver chip that extends beyond the second film layer is bonded to the display module or the flip-chip film.

2. The display device of claim 1, wherein, The first membrane layer and the second membrane layer are an integral structure.

3. The display device of claim 2, wherein, In the direction perpendicular to the plane where the bent gasket is located, the sum of the thickness of the first film layer and the thickness of the second film layer is greater than or equal to 0.2 mm.

4. The display device of claim 2, wherein, The display module is bent toward the back side on one side of the flip-chip film, with all of the flip-chip film located on the back side.

5. The display device of claim 2, wherein, One side of the flip-chip film is bonded to the display surface and one side of the display module, and the other side of the flip-chip film is bent from the display surface toward the back side.

6. A display device as claimed in claim 4 or 5, wherein, In the bending axis direction, the width of the first film layer is the same as the width of the second film layer.

7. The display device of claim 6, wherein, The width of the first film layer is greater than or equal to 7 mm and less than or equal to 12 mm compared with the width of the second film layer.

8. The display device according to claim 4 or 5, wherein The cross-section of the bending shim on the side away from the bending axis is a vertical plane.

9. The display device of claim 8, wherein, In the vertical direction of the vertical plane, the length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and the length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

10. The display device according to claim 4 or 5, wherein, It also includes: a first back film and a heat dissipation layer located sequentially on the back side facing the bent pad, and a second back film located on the side of the bent pad away from the back side; In the direction perpendicular to the plane of the bent pad, the thickness of the first film layer is less than or equal to the difference between the bending diameter and the sum of the thickness of the first back film, the thickness of the heat dissipation layer, and the thickness of the second back film.

11. The display device of claim 1, wherein, It also includes: a flexible circuit board bonded to the flip-chip film; The flip-chip film includes: a first terminal bonded to the display module, and a second terminal bonded to the flexible circuit board; wherein the first terminal and the second terminal are located on the side of the flip-chip film bonded to the driver chip.

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