Display device

Abstract

A display device is divided into a deformable portion that is foldable or rollable and a non-deformable portion disposed adjacent to the deformable portion. The display device may include a support layer including a polymer resin, a lower conductive layer disposed on the support layer and having a first metal layer, a second metal layer, and a third metal layer stacked in this order, and a display panel disposed on the lower conductive layer. The first metal layer may include nickel (Ni) and vanadium (V), the second metal layer may include silver (Ag), and the third metal layer may include nickel (Ni).

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0166294, filed on November 27, 2023, and all benefits derived therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present invention relates to a display device, and more particularly to a display device that can be folded or rolled. Background Art

[0004] Various display devices such as televisions, mobile phones, tablet computers, and game consoles are being developed. Recently, flexible display devices including flexible display panels that can slide or fold are being developed. Unlike rigid display devices, flexible display devices may be foldable or bendable. A flexible display device whose shape can be deformed in various ways may be portable regardless of the existing screen size, thereby improving user convenience. Summary of the invention

[0005] The present invention provides a display device that exhibits excellent reliability in a high temperature and high humidity environment.

[0006] According to an embodiment, the present invention provides a display device, which is divided into a foldable or rollable deformable part and a non-deformable part arranged adjacent to the deformable part, the display device including a supporting layer containing a polymer resin, a lower conductive layer arranged on the supporting layer and having a first metal layer, a second metal layer and a third metal layer stacked in sequence, and a display panel arranged on the lower conductive layer, wherein the first metal layer contains nickel (Ni) and vanadium (V), the second metal layer contains silver (Ag), and the third metal layer contains nickel (Ni).

[0007] In an embodiment, the first metal layer may be disposed directly on the support layer.

[0008] In an embodiment, the atomic content of vanadium may be about 1 at % to about 10 at % based on the atomic content of the first metal layer of about 100 at %.

[0009] In an embodiment, the first metal layer may further include niobium (Nb), tantalum (Ta) and At least one of (Db).

[0010] In an embodiment, the lower conductive layer may have an average surface roughness of about 1500 nm to about 3000 nm.

[0011] In an embodiment, the first metal layer may have a thickness of about 60 nm to about 120 nm.

[0012] In an embodiment, the third metal layer may further include vanadium.

[0013] In an embodiment, the third metal layer may have a thickness of about 60 nm to about 120 nm.

[0014] In an embodiment, the third metal layer may further include niobium (Nb), tantalum (Ta) and At least one of (Db).

[0015] In an embodiment, the support layer may include any one of carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), and aramid fiber reinforced plastic (AFRP).

[0016] In an embodiment, the thickness of the second metal layer may be greater than the thickness of the first metal layer and the thickness of the third metal layer.

[0017] In an embodiment, the second metal layer may be disposed directly between the first metal layer and the third metal layer.

[0018] In an embodiment, a display device is provided, which is divided into a foldable or rollable deformable part and a non-deformable part arranged adjacent to the deformable part, wherein the display device includes a supporting layer containing a polymer resin, a lower conductive layer arranged on the supporting layer and having a first metal layer, a second metal layer and a third metal layer stacked in sequence, and a display panel arranged on the lower conductive layer, wherein each of the first metal layer and the third metal layer contains nickel (Ni) and vanadium (V), wherein the atomic content of vanadium is approximately 1 at % to approximately 10 at % based on an atomic content of approximately 100 at % of each of the first metal layer and the third metal layer.

[0019] In an embodiment, the second metal layer may include silver (Ag).

[0020] In an embodiment, the thickness of the second metal layer may be greater than the thickness of the first metal layer and the thickness of the third metal layer.

[0021] In an embodiment, each of the first metal layer and the third metal layer may further include niobium (Nb), tantalum (Ta), and At least one of (Db).

[0022] In an embodiment, the lower conductive layer may have an average surface roughness of about 1500 nm to about 3000 nm.

[0023] In an embodiment, each of the first metal layer and the third metal layer may have a thickness of about 60 nm to about 120 nm.

[0024] In an embodiment, the first metal layer may be disposed directly on the support layer.

[0025] In an embodiment, the support layer may include any one of carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), and aramid fiber reinforced plastic (AFRP). BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principles of the present invention. In the drawings:

[0027] Figure 1A is a perspective view of an unfolded display device according to an embodiment;

[0028] Figure 1B is a perspective view showing a folding operation of the display device according to the embodiment;

[0029] Figure 1C is a plan view of a foldable display device according to an embodiment;

[0030] Figure 1D is a perspective view showing a folding operation of the display device according to the embodiment;

[0031] Figure 2A is a perspective view of a display device in an unfolded state according to another embodiment;

[0032] Figure 2B According to the embodiment Figure 2A A perspective view of the display device shown in FIG. 1 in a rolled-up state;

[0033] Figure 3 yes Figure 1A An exploded perspective view of the display device shown in ;

[0034] Figure 4 is a diagram showing a display device according to an embodiment Figure 3 A cross-sectional view of a portion corresponding to line II';

[0035] Figure 5 is a diagram showing a method according to an embodiment of the present invention. Figure 4 An enlarged cross-sectional view of region AA';

[0036] Fig. 6A is an image showing a portion of a display device according to a comparative example;

[0037] Figure 6B is an image showing a portion of a display device according to an example of the embodiment; and

[0038] Figure 7 is a cross-sectional view of a display module according to an embodiment. DETAILED DESCRIPTION

[0039] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. However, the present invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be comprehensive and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0040] In this specification, it will be understood that when an element (or region, layer, part, etc.) is referred to as being "on", "connected to" or "coupled to" another element, the element can be directly set on, directly connected to or coupled to the other element, or an intervening element may be set between the element and the other element.

[0041] The same reference numerals or symbols always refer to the same elements. In the accompanying drawings, the thickness, proportion and size of the elements are exaggerated in order to effectively describe the technical content. As used in this article, the term "and / or" includes any combination and all combinations of one or more of the associated listed items.

[0042] It will be understood that, although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or intervals, these elements, components, regions, layers and / or intervals should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or interval from another element, component, region, layer or interval. Therefore, without departing from the scope of the present invention, the first element, first component, first region, first layer or first interval discussed below can be referred to as the second element, second component, second region, second layer or second interval. Similarly, the second element, second component, second region, second layer or second interval can be referred to as the first element, first component, first region, first layer or first interval. Unless the context clearly indicates otherwise, as used in this article, the singular form "one / person", "a kind of" and "the (described)" are intended to also include plural forms.

[0043] In addition, the terms "below", "on the lower side", "above", or "on the upper side" etc. may be used to describe the relationship of elements shown in the drawings. These terms have relative concepts and are described based on the directions indicated in the drawings.

[0044] It will be further understood that when the terms “include” and / or “have” are used in this specification, it indicates the presence of stated features, integers, steps, operations, elements, components and / or groups thereof, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0045] Unless otherwise defined, all terms (including technical and scientific terms) used in this article have the same meaning as those commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that, unless explicitly defined as such in this article, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense.

[0046] Hereinafter, a display device according to an embodiment will be described with reference to the accompanying drawings. Figure 1A is a perspective view of a unfolded display device DD according to an embodiment.

[0047] The display device DD according to the embodiment may be activated in response to an electrical signal. For example, the display device DD may be a mobile phone, a tablet computer, a car navigation, a game console, or a wearable device, but the present invention is not limited thereto. Figure 1A An embodiment in which the display device DD is a mobile phone is shown by way of example.

[0048] In an embodiment, the display device DD may include a first display surface FS defined by a first direction axis DR1 and a second direction axis DR2 crossing the first direction axis DR1. The display device DD may provide an image IM to a user through the first display surface FS. The display device DD may display an image IM toward a third direction axis DR3 on the first display surface FS oriented parallel to each of the first direction axis DR1 and the second direction axis DR2.

[0049] In the present specification, the first direction axis DR1 and the second direction axis DR2 may intersect at a right angle, and the third direction axis DR3 may be a normal direction of a plane defined by the first direction axis DR1 and the second direction axis DR2. In an embodiment, the thickness direction of the display device DD may be a direction parallel to the third direction axis DR3. In this article, the third direction DR3 may also be referred to as the thickness direction DR3. The front surface (or upper surface) and the rear surface (or lower surface) may be opposite to each other on the third direction axis DR3, and the normal direction of each of the front surface (or upper surface) and the rear surface (lower surface) may be parallel to the third direction axis DR3. The front surface (or upper surface) refers to a surface close to the first display surface FS, and the rear surface (or lower surface) refers to a surface spaced apart from the first display surface FS. In addition, the rear surface (or lower surface) refers to a surface close to the second display surface RS described later. The upper side (or upper portion) refers to a direction close to the first display surface FS, and the lower side (or lower portion) refers to a direction away from the first display surface FS.

[0050] The cross section refers to a surface parallel to the thickness direction DR3, and the plane refers to a plane perpendicular to the thickness direction DR3. The plane refers to a plane defined by the first direction axis DR1 and the second direction axis DR2.

[0051] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 described in this specification may be relative concepts and thus may be changed to other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be described as the first direction DR1, the second direction DR2, and the third direction DR3, and are represented by the same reference numerals or numbers.

[0052] In an embodiment, the display device DD may detect an external input applied from the outside. The external input may include various forms of input provided from the outside of the display device DD. For example, the external input may include not only an external input applied by contact with a part of the user's body (such as a hand), but also an external input applied in close proximity to the display device DD, or an external input applied adjacent to the display device DD at a predetermined distance (e.g., suspended). In addition, the external input may have various forms such as electricity, pressure, temperature, and light.

[0053] In an embodiment, the display device DD may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as a surface opposite to at least a portion of the first display surface FS. That is, the second display surface RS may be defined as a portion of the rear surface of the display device DD.

[0054] In an embodiment, the first active area F-AA may be activated in response to an electrical signal. The first active area F-AA may be an area that displays an image IM and detects various forms of external inputs.

[0055] In an embodiment, the first peripheral area F-NAA may be disposed adjacent to the first active area F-AA. The first peripheral area F-NAA may have a predetermined color. The first peripheral area F-NAA may surround the first active area F-AA. Therefore, the shape of the first active area F-AA may be substantially defined by the first peripheral area F-NAA. However, this is an example, and in another embodiment, the first peripheral area F-NAA may also be disposed adjacent to only one side of the first active area F-AA, or may also be omitted.

[0056] In an embodiment, various electronic modules may be arranged in the electronic module area EMA. For example, the electronic module may include at least any one of a camera, a speaker, a light detection sensor, and a heat detection sensor. The electronic module area EMA may detect an external object received through the display surfaces FS and RS, or provide a sound signal such as a voice to the outside through the display surfaces FS and RS. The electronic module may also include a plurality of components, and is not limited to any one embodiment of the present invention.

[0057] In an embodiment, the electronic module area EMA may be surrounded by the first peripheral area F-NAA. However, this is an example and is not limited to one embodiment. For example, in another embodiment, the electronic module area EMA may be surrounded by the first active area F-AA and the first peripheral area F-NAA, and the electronic module area EMA may be disposed in the first active area F-AA.

[0058] In an embodiment, the display device DD may be a flexible device. The display device DD according to an embodiment may be divided into a deformable portion that may be foldable or rollable and a non-deformable portion disposed adjacent to the deformable portion. Figure 1A The display device DD is shown to include a foldable folding area FA and non-folding areas NFA1 and NFA2 disposed adjacent to the folding area. The folding area FA may correspond to a foldable deformable portion, and the non-folding areas NFA1 and NFA2 may correspond to a non-deformable portion.

[0059] In an embodiment, the non-folding areas NFA1 and NFA2 may extend from the folding area FA. For example, the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2 may be defined along the second direction DR2. The display device DD may be divided into the first non-folding area NFA1 and the second non-folding area NFA2 spaced apart from each other in the second direction DR2, with the folding area FA being interposed between the first non-folding area NFA1 and the second non-folding area NFA2. For example, the first non-folding area NFA1 may be disposed on one side of the folding area FA in the second direction DR2, and the second non-folding area NFA2 may be disposed on the other side of the folding area FA in the second direction DR2.

[0060] Figure 1A , etc. show an embodiment of a display device DD including one folding area FA, but the present invention is not limited thereto, and a plurality of folding areas may be defined in the display device DD. For example, the display device according to the embodiment may include at least two folding areas, and in addition, the display device may include at least three non-folding areas, each of the folding areas being disposed between the non-folding areas.

[0061] Figure 1B and Figure 1D is a perspective view illustrating a folding operation of the display device DD according to the embodiment. Figure 1C is a plan view of a foldable display device DD according to an embodiment.

[0062] Figure 1B is a perspective view showing the inward folding operation of the display device DD. Figure 1B , the display device DD may be folded relative to a first folding axis FX1 extending in a first direction DR1. When the display device DD is folded, the folding area FA may have a predetermined curvature and a radius of curvature. The display device DD may be folded relative to the first folding axis FX1 to be deformed into an inwardly folded state so that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display surface FS is not exposed to the outside.

[0063] In the examples and with reference to Figure 1C , when the display device DD is folded inward, the second display surface RS may be visible to the user. At this time, the second display surface RS may include a second active area R-AA displaying an image. The second active area R-AA may be activated in response to an electrical signal. The second active area R-AA may be an area in which an image is displayed and various forms of external input are detected.

[0064] In an embodiment, the second display surface RS may include a second peripheral area R-NAA. The second peripheral area R-NAA may be disposed adjacent to the second active area R-AA. The second peripheral area R-NAA may have a predetermined color. The second peripheral area R-NAA may surround the second active area R-AA. In addition, although not shown in the drawings, the display device DD may further include an electronic module area in which an electronic module having various components is disposed, also in the second display surface RS, and is not limited to any one embodiment.

[0065] Figure 1D is a perspective view showing an outward folding operation of the display device DD according to the embodiment. Figure 1D , the display device DD according to the embodiment can be folded with respect to the second folding axis FX2 extending in the first direction DR1. The display device DD can be folded with respect to the second folding axis FX2 to be deformed into an outward folded state so that the first display surface FS is exposed to the outside. The display device DD can be provided to repeat the inward folding or outward folding operation and the unfolding operation, but the present invention is not limited thereto.

[0066] According to an embodiment, Figures 1A to 1D The display device DD is folded relative to one folding axis FX1 or FX2, but the number of folding axes and the number of corresponding non-folding areas are not limited thereto. For example, the display device DD may be folded relative to a plurality of folding axes so that corresponding portions of the first display surface FS and the second display surface RS face each other. In addition, it is shown that the first folding axis FX1 and the second folding axis FX2 are oriented parallel to the long side of the display device DD, but the present invention is not limited thereto, and the first folding axis FX1 and the second folding axis FX2 may be oriented parallel to the short side of the display device DD.

[0067] In an embodiment, when the display device DD is in a state such as Figure 1C In the folded state shown in , the first non-folding area NFA1 and the second non-folding area NFA2 may be defined as portions having display surfaces FS and RS oriented parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2, and the folding area FA may be defined as an area disposed between the first non-folding area NFA1 and the second non-folding area NFA2. The folding area FA may include a curved surface portion that is bent to have a predetermined curvature in the folded state.

[0068] Figure 2A is a perspective view of a display device DD-a according to another embodiment in an unfolded state. Figure 2B According to the embodiment Figure 2A 0 is a perspective view of a display device DD-a shown in FIG.

[0069] In the examples and with reference to Figure 2A , the display device DD-a may include a display surface FS-a defined by a first direction axis DR1 and a second direction axis DR2 intersecting the first direction axis DR1. The display device DD-a may provide an image IM-a to a user through the display surface FS-a. The display device DD-a may display the image IM-a toward a third direction DR3.

[0070] In an embodiment, the display surface FS-a may include an active area F-AAa and a peripheral area F-NAAa. The active area F-AAa may be activated in response to an electrical signal. The active area F-AAa may be an area in which an image IM-a is displayed, and various forms of external inputs are detected.

[0071] In an embodiment, the peripheral region F-NAAa may be disposed adjacent to the active region F-AAa. The peripheral region F-NAAa may have a predetermined color. The peripheral region F-NAAa may surround the active region F-AAa. However, this is an example, and in another embodiment, the peripheral region F-NAAa may be disposed adjacent to only one side of the active region F-AAa, or may also be omitted.

[0072] In an embodiment, the display device DD-a may be divided into a deformable portion that may be folded or rolled and a non-deformable portion disposed adjacent to the deformable portion. Figure 2A The display device DD-a is shown to include a rollable curling area RA and a non-curling area NRA disposed adjacent to the curling area. The curling area RA may correspond to a rollable deformable portion, and the non-curling area NRA may correspond to a non-deformable portion.

[0073] In another embodiment, unlike what is shown in the drawings, the active area F-AAa may not overlap with the non-curling area NRA. The active area F-AAa in which the image IM-a is displayed may overlap only with the curling area RA. When the display device DD-a is curled, only the peripheral area F-NAAa may be visible to the user.

[0074] In the examples and with reference to Figure 2B , the curling area RA may be curled with respect to a curling axis RX extending along the first direction DR1. Figure 2B The curling axis RX is shown to be oriented parallel to the short side of the display device DD-a, but the present invention is not limited thereto. In another embodiment, the curling axis RX may be oriented parallel to the long side of the display device DD-a.

[0075] Figure 3 yes Figure 1A An exploded perspective view of a display device DD shown in FIG. Figure 3The display device DD may include a lower module LM, a display module DM disposed on the lower module LM, and a window WM disposed on the display module DM. In addition, the display device DD may further include a housing HAU and a protective layer PL. In the following, the description of the display device DD may also be applied to Figure 2A The display device DD-a shown in .

[0076] In an embodiment, the housing HAU may include a material having relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or plates made of glass, plastic, or metal. The housing HAU may provide a predetermined accommodation space. The display module DM may be accommodated in the accommodation space and thus may be protected from external impacts.

[0077] In an embodiment, the lower module LM may include a support layer SP (see Figure 4 ) and the lower conductive layer CTL (see Figure 4 ). The lower module LM will be described in more detail later.

[0078] In an embodiment, the display module DM may be a component that generates an image and detects an external input applied from the outside. Display areas AA-DM and non-display areas NAA-DM may be defined in the display module DM. The display areas AA-DM may correspond to Figure 1A The first active area F-AA shown in FIG. 1 and the non-display area NAA-DM may correspond to Figure 1A The first peripheral area F-NAA is shown in FIG.

[0079] In an embodiment, the display area AA-DM may be activated in response to an electrical signal. The non-display area NAA-DM may be an area positioned adjacent to at least one side of the display area AA-DM. The non-display area NAA-DM may be disposed to surround the display area AA-DM. However, the present invention is not limited thereto, and unlike what is shown in the accompanying drawings, in another embodiment, a portion of the non-display area NAA-DM may be omitted. A driving circuit or driving line, etc. for driving the display area AA-DM may be disposed in the non-display area NAA-DM.

[0080] In an embodiment, the image IM (see Figure 1A) can pass through the window WM to be provided to the user. The window WM may include an optically transparent insulating material. The window WM may include a polymer substrate or a glass substrate. The window WM may be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or a combination thereof. However, this is an example, and the materials included in the window WM are not limited thereto. For example, in another embodiment, the window WM may be a reinforced glass substrate that has been reinforced. The window WM may include ultra-thin glass (UTG).

[0081] In an embodiment, the protection layer PL may be a functional layer that protects one surface of the window WM. The protection layer PL may include a polymer film. The protection layer PL may include an anti-fingerprint coating material, a hard coating material, an antistatic material, and the like.

[0082] In an embodiment, the display device DD may include a first adhesive layer AP1 disposed between the display module DM and the window WM and a second adhesive layer AP2 disposed between the window WM and the protective layer PL. The display module DM and the window WM may be bonded to each other through the first adhesive layer AP1. The window WM and the protective layer PL may be bonded to each other through the second adhesive layer AP2. The first adhesive layer AP1 and the second adhesive layer AP2 may each include a general adhesive or an adhesive. For example, the first adhesive layer AP1 and the second adhesive layer AP2 may each include a general adhesive (such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), and an optically clear resin (OCR)), and the type is not limited to any one embodiment. Unlike what is shown in the drawings, in another embodiment, at least one of the first adhesive layer AP1 and the second adhesive layer AP2 may be omitted.

[0083] Figure 4 FIG. 2 is a diagram showing a display device DD according to an embodiment. Figure 3 A cross-sectional view of the portion corresponding to line II'. Figure 4 is a cross-sectional view showing a display device DD according to an embodiment. Figure 4 Not shown Figure 3 Shell HAU.

[0084] In the examples and with reference to Figure 4 The display device DD may further include an optical layer RPL and a lower film LF. The optical layer RPL may be disposed between the display module DM and the window WM. The lower film LF may be disposed between the display module DM and the lower module LM.

[0085] In an embodiment, an optical layer RPL may be disposed on a display panel DP included in a display module DM. The optical layer RPL may control reflected light of external light on the display panel DP. The optical layer RPL may include, for example, a polarizing layer, or include a color filter layer. Meanwhile, unlike what is shown in the drawings, in another embodiment, the optical layer RPL may be omitted.

[0086] In an embodiment, a lower film LF may be disposed under the display panel DP. The lower film LF may protect a lower portion of the display panel DP. The lower film LF may include a flexible plastic material. For example, the lower film LF may include polyethylene terephthalate.

[0087] In an embodiment, the display module DM may include a display panel DP and an input sensing layer ISP disposed on the display panel DP. The display panel DP may be a component that basically generates an image. The display panel DP may be an emissive display panel, and for example, the display panel DP may be an organic light emitting display panel, an inorganic light emitting display panel, a quantum dot display panel, a micro light emitting diode (LED) display panel, or a nano LED display panel. The display panel DP may also be referred to as a display layer. The display panel DP may include a base layer BS (see Figure 7 ), circuit layer DP-CL (see Figure 7 ), display element layer DP-ED (see Figure 7 ) and encapsulation layer TFE (see Figure 7 ).

[0088] In an embodiment, the input sensing layer ISP may detect an external input, convert the external input into a predetermined input signal, and provide the input signal to the display panel DP. For example, the input sensing layer ISP may be a touch sensing portion that detects a touch. The input sensing layer ISP may recognize a user's direct touch, a user's indirect touch, an object's direct touch, or an object's indirect touch, etc.

[0089] In an embodiment, the input sensing layer ISP may detect at least any one of the position and strength (pressure) of a touch applied from the outside. The display panel DP may receive an input signal from the input sensing layer ISP and generate an image corresponding to the input signal. For example, the input sensing layer ISP may detect an external input in a capacitive manner. However, this is an example, and the operation mode of the input sensing layer ISP is not limited to any one embodiment.

[0090] In an embodiment, the input sensing layer ISP may be formed on the display panel DP through a continuous process. In this case, the input sensing layer ISP may be directly disposed on the display panel DP. That is, a separate adhesive member may not be disposed between the input sensing layer ISP and the display panel DP. In another embodiment, the input sensing layer ISP may also be bonded to the display panel DP through an adhesive member. The adhesive member may include a general adhesive or an adhesive.

[0091] In this specification, one component being directly disposed on another component means that no intervening component is disposed between the one component and the other component. That is, one component being directly disposed on another component means that the one component is in contact with the other component.

[0092] In an embodiment, the display device DD may include a third adhesive layer AP3 disposed between the lower film LF and the display panel DP, and a fourth adhesive layer AP4 disposed between the lower module LM and the lower film LF. The lower film LF and the display panel DP may be bonded to each other through the third adhesive layer AP3. The lower module LM and the lower film LF may be bonded to each other through the fourth adhesive layer AP4. The third adhesive layer AP3 and the fourth adhesive layer AP4 may each include a general adhesive or an adhesive. For example, the third adhesive layer AP3 and the fourth adhesive layer AP4 may each include a general adhesive (such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), and an optically clear resin (OCR)), and the type is not limited to any one embodiment of the present invention. Different from what is shown in the drawings, in another embodiment, at least one of the third adhesive layer AP3 and the fourth adhesive layer AP4 may be omitted.

[0093] In an embodiment, the lower module LM may include a support plate MP, a lower conductive layer CTL, and a lower support member BSM. The lower conductive layer CTL may be disposed between the lower support member BSM and the support plate MP.

[0094] In an embodiment, the support plate MP may be disposed below the display module DM. The support plate MP may include a metal material or a polymer material. For example, the support plate MP may be formed of a polymer material. Different from this, the support plate MP may be formed by including stainless steel, aluminum, or an alloy thereof. A plurality of openings OP may be defined in the support plate MP. A plurality of openings OP may be formed in the folding area FA.

[0095] In an embodiment, the lower support member BSM may include a support member SPM and a filling portion SAP. The support member SPM may be a component overlapping a majority of the display module DM. The filling portion SAP may be a component disposed outside the support member SPM and overlapping an outer portion of the display module DM.

[0096] In an embodiment, the filling portion SAP may be disposed outside the support layer SP and the cushion layer CP. The filling portion SAP may be disposed outside the support plate MP and the housing HAU (see Figure 3 ). The filling part SAP can fill the support plate MP and the shell HAU (see Figure 3 ) and fix the support plate MP.

[0097] In an embodiment, the support member SPM may include a support layer SP, a cushion layer CP, and a shielding layer EMP. The support layer SP may be disposed below the support plate MP. The cushion layer CP may be disposed below the support layer SP. The shielding layer EMP may be disposed below the cushion layer CP. The composition of the support member SPM is not limited to Figure 4 The components shown in the figure may vary according to the size or shape of the display device DD or the operating characteristics of the display device DD. For example, in another embodiment, a portion of the pad layer CP and the shielding layer EMP may be omitted, or additional components other than those shown may be included.

[0098] In an embodiment, the shielding layer EMP may be an electromagnetic wave shielding layer or a heat dissipation layer. In addition, the shielding layer EMP may be used as a junction layer.

[0099] In an embodiment, the cushion layer CP can prevent compression and plastic deformation of the support plate MP due to external impact and force. The cushion layer CP can improve the impact resistance of the display device DD. The cushion layer CP may include an elastomer, such as a sponge, foam, or polyurethane resin. In addition, the cushion layer CP may be formed by including at least one of an acrylate polymer, a carbamate polymer, a silicon polymer, and an imide polymer. However, this is an example, and the present invention is not limited thereto.

[0100] In an embodiment, the pad layer CP may include a first subpad layer CP1 and a second subpad layer CP2 spaced apart from each other in the second direction DR2. The first subpad layer CP1 and the second subpad layer CP2 may be spaced apart from each other in the second direction DR2. Figure 1B Since the pad layer CP is provided as the first subpad layer CP1 and the second subpad layer CP2 which are spaced apart from each other in the folding area FA, the folding characteristics of the display device DD may be improved.

[0101] In an embodiment, the supporting layer SP may include a first sub-supporting layer SP1 and a second sub-supporting layer SP2 spaced apart from each other in the second direction DR2. The first sub-supporting layer SP1 and the second sub-supporting layer SP2 may be spaced apart from each other in the first folding axis FX1 (see FIG. 2 ). Figure 1BSince the supporting layer SP is provided as the first sub-supporting layer SP1 and the second sub-supporting layer SP2 which are spaced apart from each other in the folding area FA, the folding characteristics of the display device DD may be improved.

[0102] In an embodiment, the support layer SP may include a polymer resin. The support layer SP may include any one of carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastic (GFRP), and aramid fiber reinforced plastic (AFRP). The support layer SP including a polymer resin such as carbon fiber reinforced plastic, glass fiber reinforced plastic, and aramid fiber reinforced plastic has a high modulus and is light, so that it is possible to improve the folding characteristics of the display device DD.

[0103] In an embodiment, the lower conductive layer CTL may be disposed on the support layer SP. The lower conductive layer CTL may include a first portion C-R1 overlapping the folding area FA and a second portion C-R2 overlapping the non-folding areas NFA1 and NFA2. The first portion C-R1 and the second portion C-R2 may be integrally formed. A thickness TH1 of the first portion C-R1 may be smaller than a thickness TH2 of the second portion C-R2. Since the first portion C-R1 overlapping the folding area FA is provided with a relatively small thickness, the folding characteristics of the display device DD may be improved.

[0104] Figure 5 is a diagram showing a method according to an embodiment of the present invention. Figure 4 In the embodiment and with reference to Figure 5 The lower conductive layer CTL may include a first metal layer CT1, a second metal layer CT2, and a third metal layer CT3 stacked in sequence. Figure 4 ) is operated to charge the lower conductive layer CTL, the lower conductive layer CTL can discharge the generated charges.

[0105] In an embodiment, the first metal layer CT1 may be directly disposed on the support layer SP (see Figure 4). The first metal layer CT1 may include nickel (Ni) and vanadium (V). Based on the atomic content of about 100at% of the first metal layer CT1, the atomic content of vanadium may be about 1at% to about 10at%. Compared with a metal layer containing nickel but not containing vanadium, the first metal layer CT1 containing nickel and vanadium may have a relatively large surface roughness. The average surface roughness of the lower conductive layer composed of the first metal layer containing nickel but not containing vanadium is about 300nm to about 500nm. In an embodiment, the average surface roughness of the lower conductive layer CTL including the first metal layer CT1 containing nickel and vanadium may be about 1500nm to about 3000nm. The first metal layer CT1 containing nickel and vanadium may have an improved bonding force with the second metal layer CT2 disposed on the first metal layer CT1. In this specification, the average surface roughness may refer to the surface roughness of the lower conductive layer CTL disposed on the support layer SP measured by using an atomic force microscope (AFM).

[0106] In a typical display device, due to organic contaminants of a support layer including a polymer resin, separation of the film occurs in a lower conductive layer disposed on the support layer in a high temperature and high humidity environment. In a high temperature and high humidity environment, separation of the film occurs at the interface of the first metal layer and the second metal layer, thereby deteriorating the reliability of the display device. In addition, separation of the film occurs at the interface of the second metal layer and the third metal layer. The first metal layer does not contain vanadium but contains nickel. The high temperature and high humidity environment may refer to an environment having a temperature of about 80° C. or higher and having a relative humidity of about 80% or higher.

[0107] Unlike this, since the first metal layer CT1 according to the embodiment includes nickel and vanadium, the surface roughness can be increased and the bonding force between the first metal layer CT1 and the second metal layer CT2 can be improved. The display device DD including the first metal layer CT1 including nickel and vanadium can exhibit excellent reliability in a high temperature and high humidity environment.

[0108] In an embodiment, the first metal layer CT1 may further include an element in the same group as vanadium. In this specification, "group" means a group in the IUPAC periodic table. The first metal layer CT1 may further include niobium (Nb), tantalum (Ta) and At least one of niobium (Nb), tantalum (Ta) and (Db) is an element in the same group as vanadium. The first metal layer CT1 further including an element in the same group as vanadium may have improved bonding force with the second metal layer CT2 and exhibit excellent reliability in a high temperature and high humidity environment.

[0109] In an embodiment, the first metal layer CT1 may have a thickness T1 of about 60 nm to about 120 nm. In a first metal layer having a thickness less than about 60 nm, the bonding force with the second metal layer may not be improved, and separation of the film occurs in a high temperature and high humidity environment. In a first metal layer having a thickness greater than about 120 nm, the thickness of the display device is increased. In contrast, in an embodiment, the first metal layer CT1 having a thickness T1 of about 60 nm to about 120 nm may have an improved bonding force with the second metal layer CT2, thereby exhibiting excellent reliability in a high temperature and high humidity environment, and making it possible to maintain the thickness of the display device DD at a good level.

[0110] In an embodiment, the third metal layer CT3 may include nickel (Ni). In addition, the third metal layer CT3 may include vanadium (V). That is, the third metal layer CT3 may include nickel (Ni) and vanadium (V). Based on an atomic content of about 100at% of the third metal layer CT3, the atomic content of vanadium may be about 1at% to about 10at%. The third metal layer CT3 including nickel and vanadium may have a relatively large surface roughness. In an embodiment, the average surface roughness of the lower conductive layer CTL including the third metal layer CT3 including nickel and vanadium may be about 1500nm to about 3000nm. The third metal layer CT3 including nickel and vanadium may have an improved bonding force with the second metal layer CT2 disposed adjacent to the third metal layer CT3.

[0111] In an embodiment, the third metal layer CT3 may have a thickness T3 of about 60nm to about 120nm. A third metal layer having a thickness less than about 60nm may not have an improved bonding force with the second metal layer. In the third metal layer, having a thickness greater than about 120nm causes an increase in the thickness of the display device. In contrast, in an embodiment, a third metal layer CT3 having a thickness T3 of about 60nm to about 120nm may have a bonding force with the second metal layer CT2, thereby exhibiting excellent reliability in a high temperature and high humidity environment, making it possible to maintain the thickness of the display device DD at a good level.

[0112] In an embodiment, the third metal layer CT3 may further include an element in the same group as vanadium. The third metal layer CT3 may further include niobium (Nb), tantalum (Ta) and The third metal layer CT3 further including an element in the same group as vanadium may have improved bonding force with the second metal layer CT2 and exhibit excellent reliability in a high temperature and high humidity environment.

[0113] In an embodiment, the second metal layer CT2 may include silver (Ag). The second metal layer CT2 may be disposed directly between the first metal layer CT1 and the third metal layer CT3. The thickness T2 of the second metal layer CT2 may be greater than the thickness T1 of the first metal layer CT1 and the thickness T3 of the third metal layer CT3. For example, the thickness T2 of the second metal layer CT2 may be about 0.3 μm.

[0114] Fig. 6A is an image showing a portion of a display device according to a comparative example, and, Figure 6B is an image showing a portion of a display device according to an example of an embodiment. Specifically, Fig. 6A is an image obtained from a microscope when measuring the surface roughness of the display device according to the comparative example. Figure 6B is an image obtained from a microscope when measuring the surface roughness of the display device according to the example of the embodiment. Fig. 6A and Figure 6B is an image obtained from an atomic force microscope (AFM) when measuring the surface roughness of a display device.

[0115] The display device of each of the comparative examples and the examples includes a first metal layer to a third metal layer stacked in sequence on a support layer including carbon fiber reinforced plastic, and the second metal layer includes silver. The display device of the comparative example differs from the display device of the example in whether they include vanadium. In the display device of the comparative example, each of the first metal layer and the third metal layer includes nickel and does not include vanadium. In the display device of the example according to the embodiment, each of the first metal layer and the third metal layer includes nickel and vanadium. In each of the first metal layer and the third metal layer, the atomic content of vanadium is approximately 5.1 at% based on an atomic content of approximately 100 at%.

[0116] exist Fig. 6A In the display device of the comparative example in , the average surface roughness of the lower conductive layer was measured to be about 307 nm. Figure 6B In the display device of the example in , the average surface roughness of the lower conductive layer was measured to be about 2694 nm. Fig. 6A and Figure 6B, it can be seen that the lower conductive layer in the display device of the example has an average surface roughness much greater than the average surface roughness of the lower conductive layer in the display device of the comparative example. Unlike the display device of the comparative example, the display device of the example (which is a display device according to the embodiment) has a lower conductive layer containing vanadium. Therefore, in the embodiment, it can be seen that the lower conductive layer including the first metal layer and the third metal layer including nickel and vanadium has a large average surface roughness of about 1500nm to about 3000nm. The display device including the lower conductive layer having a large average surface roughness according to the embodiment can exhibit excellent reliability in a high temperature and high humidity environment.

[0117] Table 1 below shows the results of reliability tests of the display device according to the comparative example and the display device according to the example of the embodiment in a high temperature and high humidity environment. Fig. 6A and Figure 6B The display device of the comparative example is described as the same display device as the display device according to the example of the embodiment.

[0118] The reliability of the display device of the comparative example was tested in an environment of a temperature of about 80° C. and a relative humidity of about 80% for about 240 hours, and the reliability of the display device according to the example of the embodiment was tested in an environment of a temperature of about 85° C. and a relative humidity of about 85% for about 360 hours. In the display device of the comparative example, defects occurred in a relatively short period of time and in an environment with a lower temperature and a lower humidity than in the display device according to the example of the embodiment, and therefore, the display device of the comparative example was not tested in an environment of the same temperature and the same humidity as the display device according to the example of the embodiment.

[0119] In Table 1, "NG" means that separation of the film occurs at the interface between the metal layers, and "OK" means that there is no defect (such as separation of the film). Specifically, in the display device of the comparative example, separation of the film occurs at the interface between the first metal layer containing nickel and the second metal layer containing silver.

[0120] Table 1

[0121]

[0122]

[0123] Referring to Table 1, it can be seen that, in the display device according to the example of the embodiment, no defects occurred for a long time in an environment with relatively high temperature and high humidity, compared with the display device of the comparative example. In the display device of the comparative example including the metal layer containing nickel but not containing vanadium, separation of the film occurred at the interface between the metal layers.

[0124] The display device of the example (which is a display device according to the embodiment) includes a first metal layer containing nickel and vanadium. In addition, the display device of the example (which is a display device according to the embodiment) includes a third metal layer containing nickel and vanadium. It can be seen that the display device of the example including the metal layer containing nickel and vanadium has an improved bonding force between the metal layers, thereby showing excellent reliability. Therefore, the display device according to the embodiment including the metal layer containing nickel and vanadium can have excellent reliability in a high temperature and high humidity environment.

[0125] Figure 7 is a cross-sectional view of a display module DM according to an embodiment. Figure 7 It may be specifically shown that according to the embodiment Figure 4 sectional view of the components of the display module DM shown in FIG.

[0126] In an embodiment, the display panel DP may include a transistor TR and a light emitting element ED. The transistor TR and the light emitting element ED may be disposed on the base layer BS. Figure 7 One transistor TR is shown in FIG. 1 , but basically, the display panel DP may include a plurality of transistors for driving the light emitting element ED and at least one capacitor.

[0127] In an embodiment, the base layer BS may provide a base surface on which the circuit layer DP-CL is disposed. The base layer BS may be a flexible substrate that can be bent, folded, curled, etc. The base layer BS may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the present invention is not limited thereto, and the base layer BS may include an inorganic layer, an organic layer, or a composite material layer.

[0128] In an embodiment, the base layer BS may include a single layer or multiple layers. For example, the base layer BS may include a first synthetic resin layer, a multi-layer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multi-layer or single-layer inorganic layer. The first synthetic resin layer and the second synthetic resin layer may each include a polyimide resin. In addition, the first synthetic resin layer and the second synthetic resin layer may each include at least one of an acrylate resin, a methacrylate resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a carbamate resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. In this specification, the term "~~" resin refers to a functional group including "~~".

[0129] In an embodiment, the circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connection electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first to sixth insulating layers INS1 to INS6, respectively. However, Figure 7 The stacking structure of the circuit layer DP-CL shown in FIG. 1 is an example, and in another embodiment, the stacking structure of the circuit layer DP-CL may be changed according to the process of the circuit layer DP-CL, etc.

[0130] In an embodiment, the shielding electrode BML may be disposed on the base layer BS. The shielding electrode BML may overlap the transistor TR. The shielding electrode BML may block light incident on the transistor TR from the lower portion of the display panel DP, thereby protecting the transistor TR. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, a threshold voltage of the transistor TR disposed on the shielding electrode BML may be maintained. However, the present invention is not limited thereto, and the shielding electrode BML may be a floating electrode. In another embodiment, unlike that shown in the drawings, the shielding electrode BML may be omitted.

[0131] In an embodiment, the buffer layer BFL may be disposed on the base layer BS and cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve a bonding force between the base layer BS and a semiconductor pattern or a conductive pattern disposed on the buffer layer BFL.

[0132] In an embodiment, the transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, the channel C1, and the drain D1 of the transistor TR may be formed from a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or metal oxide, and any material may be applied without limitation as long as it has semiconductor characteristics. The semiconductor pattern is not limited to any one embodiment.

[0133] In an embodiment, the semiconductor pattern may include a plurality of regions divided according to the level of conductivity. The region of the semiconductor pattern doped with a dopant or where the metal oxide is reduced may have a high conductivity and may be substantially used as a source electrode and a drain electrode of the transistor TR. The region of the semiconductor pattern having a high conductivity may correspond to the source S1 and the drain D1 of the transistor TR. The region of the semiconductor pattern that is not doped or doped at a low concentration or where the metal oxide is not reduced may have a low conductivity, and the region may correspond to the channel C1 (or active region) of the transistor TR.

[0134] In an embodiment, the first insulating layer INS1 may be disposed on the buffer layer BFL by covering the semiconductor pattern of the transistor TR. The gate G1 of the transistor TR may be disposed on the first insulating layer INS1. The gate G1 may overlap the channel C1 of the transistor TR. The gate G1 may be used as a mask in a process of doping the semiconductor pattern of the transistor TR.

[0135] In an embodiment, the second insulating layer INS2 may be disposed on the first insulating layer INS1 by covering the gate G1. The third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0136] In an embodiment, the connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2 to electrically connect the transistor TR and the light emitting element ED. However, the composition of the connection electrode CNE electrically connecting the transistor TR and the light emitting element ED is not limited thereto, and one of the first connection electrode CNE1 and the second connection electrode CNE2 may be omitted, or an additional connection electrode may be further included.

[0137] In an embodiment, the first connection electrode CNE1 may be disposed on the third insulating layer INS3. The first connection electrode CNE1 may be connected to the drain electrode D1 through a first contact hole CH1 passing through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 may be disposed on the third insulating layer INS3 by covering the first connection electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0138] In an embodiment, the second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a second contact hole CH2 passing through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may be disposed on the fifth insulating layer INS5 by covering the second connection electrode CNE2.

[0139] In an embodiment, the insulating layers INS1 to INS6 may each include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylate resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin.

[0140] In an embodiment, the display element layer DP-ED may be disposed on the circuit layer DP-CL. The display element layer DP-ED may include a pixel definition film PDL and a light emitting element ED. The light emitting element ED may include a first electrode AE, a hole control layer HCL, a light emitting layer EML, an electron control layer TCL and a second electrode CE.

[0141] In an embodiment, the first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connection electrode CNE2 through the third contact hole CH3 passing through the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR through the first connection electrode CNE1 and the second connection electrode CNE2.

[0142] In an embodiment, the first electrode AE ​​may be formed of a metal material, a metal alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. However, the present invention is not limited thereto. In addition, the first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive semi-reflective electrode, or a reflective electrode. The first electrode AE ​​may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound selected from at least two of them, a mixture selected from at least two of them, or an oxide thereof.

[0143] In an embodiment, if the first electrode AE ​​is a transmissive electrode, the first electrode AE ​​may include a transparent metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. In an embodiment, if the first electrode AE ​​is a semi-transmissive and semi-reflective electrode or a reflective electrode, the first electrode AE ​​may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, or a compound or mixture thereof (e.g., a mixture of Ag and Mg), or a material having a multilayer structure such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al). In another embodiment, the first electrode AE ​​may have a structure including a reflective film or a semi-transmissive and semi-reflective film formed of the above materials and a plurality of layers of a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, in an embodiment, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but the embodiments of the present inventive concept are not limited thereto. In addition, the present invention is not limited thereto, and in an embodiment, the first electrode AE ​​may include the above-mentioned metal material, a combination of at least two metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal material, etc.

[0144] In an embodiment, a pixel defining film PDL may be disposed on the sixth insulating layer INS6. A light emitting opening PX_OP exposing a portion of the first electrode AE ​​may be defined in the pixel defining film PDL. The portion of the first electrode AE ​​exposed by the light emitting opening PX_OP may be defined as a light emitting area LA. The area in which the pixel defining film PDL is disposed may correspond to a light blocking area NLA. The light blocking area NLA may surround the light emitting area LA in the display area AA-DM.

[0145] In an embodiment, the hole control layer HCL may be disposed on the first electrode AE ​​and the pixel definition film PDL. The hole control layer HCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The hole control layer HCL may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL may include a known hole injection material and / or a known hole transport material.

[0146] In an embodiment, the light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in a region corresponding to the light emitting opening PX_OP. Different from this, the light emitting layer EML may also be provided as a common layer. The light emitting layer EML may include an organic light emitting material and / or an inorganic light emitting material. The light emitting layer EML may emit light of any color among red, green and blue.

[0147] In an embodiment, the electron control layer TCL may be disposed on the light emitting layer EML. The electron control layer TCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The electron control layer TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electron control layer TCL may include a known electron injection material and / or a known electron transport material.

[0148] In an embodiment, the second electrode CE may be disposed on the electronic control layer TCL. The second electrode CE may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the present invention is not limited thereto. For example, in an embodiment, when the first electrode AE ​​is an anode, the second electrode CE may be a cathode, and when the first electrode AE ​​is a cathode, the second electrode CE may be an anode.

[0149] In an embodiment, the second electrode CE may be a transmissive electrode, a semi-transmissive and semi-reflective electrode, or a reflective electrode. If the second electrode CE is a transmissive electrode, the second electrode CE may be formed of a transparent metal oxide (e.g., indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.).

[0150] In an embodiment, when the second electrode CE is a semi-transmissive and semi-reflective electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, Yb, W, or a compound thereof (e.g., AgMg, AgYb, or MgYb) or a mixture thereof, or a material having a multilayer structure such as LiF / Ca or LiF / Al. In another embodiment, the second electrode CE may have a structure including a reflective film or a semi-transmissive and semi-reflective film formed of the above materials and a transparent conductive film formed of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc. For example, in an embodiment, the second electrode CE may include the above metal material, a combination of at least two metal materials selected from the above metal materials, or an oxide of the above metal material, etc.

[0151] In an embodiment, the encapsulation layer TFE may be disposed on the display element layer DP-ED. The encapsulation layer TFE may be disposed on the second electrode CE to cover the light emitting element ED. The encapsulation layer TFE may include a plurality of thin films. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film may protect the light emitting element ED from moisture / oxygen, and the organic film may protect the light emitting element ED from foreign matter (such as dust particles).

[0152] In an embodiment, the input sensing layer ISP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing layer ISP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing layer ISP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0153] In an embodiment, the first sensing insulating layer IL1 may be disposed on the encapsulation layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may be in contact with the encapsulation layer TFE. Different from this, in another embodiment, the first sensing insulating layer IL1 may also be omitted, and in this case, the first conductive layer CDL1 may be in contact with the encapsulation layer TFE.

[0154] In an embodiment, the first conductive layer CDL1 may be disposed on the first sensing insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sensing insulating layer IL1. The second sensing insulating layer IL2 may be disposed on the first sensing insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0155] In an embodiment, the second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. The plurality of second conductive patterns may be connected to the plurality of first conductive patterns respectively through contact holes formed in the second sensing insulating layer IL2.

[0156] In an embodiment, the plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each be disposed corresponding to the light blocking area NLA. The plurality of first conductive patterns of the first conductive layer CDL1 and the plurality of second conductive patterns of the second conductive layer CDL2 may each correspond to a mesh pattern.

[0157] In an embodiment, the third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. The second sensing insulating layer IL2 and the third sensing insulating layer IL3 may each include an inorganic insulating layer or an organic insulating layer.

[0158] In an embodiment, the first conductive layer CDL1 and the second conductive layer CDL2 may each have a single layer structure, or may have a structure of multiple layers stacked along the third direction DR3. The single conductive layer CDL1 or CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, a metal nanowire, graphene, etc.

[0159] In an embodiment, the multi-layer conductive layer CDL1 or CDL2 may include a metal layer. The metal layer may have a three-layer structure of, for example, titanium (Ti) / aluminum (Al) / titanium (Ti). The multi-layer conductive layer CDL1 or CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0160] In an embodiment, a display device may include a support layer including a polymer resin, a lower conductive layer disposed on the support layer, and a display panel disposed on the lower conductive layer. The lower conductive layer may include a first metal layer to a third metal layer stacked in sequence. The first metal layer may include nickel and vanadium, and thus may have an improved bonding force with the second metal layer in a high temperature and high humidity environment. Therefore, the display device according to the embodiment may exhibit excellent reliability in a high temperature and high humidity environment.

[0161] The display device according to the embodiment may include a lower conductive layer including nickel and vanadium, and thus may exhibit excellent reliability in a high temperature and high humidity environment.

[0162] Although the embodiments of the present invention have been described, it is understood that the present invention should not be limited to these embodiments, but can be variously changed and modified by those of ordinary skill in the art within the spirit and scope of the present invention. Therefore, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification. In addition, without departing from the scope of the present invention, the embodiments or parts of the embodiments can be combined in whole or in part.

Claims

1. A display device, the display device being divided into a foldable or rollable deformable portion and a non-deformable portion disposed adjacent to the deformable portion, wherein: The display device comprises: a support layer comprising a polymer resin; a lower conductive layer, disposed on the support layer and comprising a first metal layer, a second metal layer and a third metal layer stacked in sequence; and A display panel is disposed on the lower conductive layer. The first metal layer contains nickel and vanadium, the second metal layer contains silver, and the third metal layer contains nickel.

2. The display device according to claim 1, wherein: The first metal layer is disposed directly on the support layer.

3. The display device according to claim 1, wherein: The atomic content of vanadium is 1 at % to 10 at % based on 100 at % of the atomic content of the first metal layer.

4. The display device according to claim 1, wherein: The first metal layer also includes niobium, tantalum and At least one of .

5. The display device according to claim 1, wherein: The lower conductive layer has an average surface roughness of 1500 nm to 3000 nm.

6. The display device according to claim 1, wherein: The first metal layer has a thickness of 60 nm to 120 nm.

7. The display device according to claim 1, wherein: The third metal layer also includes vanadium.

8. The display device according to claim 1, wherein: The third metal layer has a thickness of 60 nm to 120 nm.

9. The display device according to claim 1, wherein: The third metal layer also includes niobium, tantalum and At least one of .

10. The display device according to claim 1, wherein: The support layer includes any one of carbon fiber reinforced plastic, glass fiber reinforced plastic and aramid fiber reinforced plastic.

11. The display device according to claim 1, wherein: The thickness of the second metal layer is greater than the thickness of the first metal layer and the thickness of the third metal layer.

12. The display device according to claim 1, wherein: The second metal layer is disposed directly between the first metal layer and the third metal layer.

13. A display device, the display device being divided into a foldable or rollable deformable portion and a non-deformable portion disposed adjacent to the deformable portion, the display device comprising: a support layer comprising a polymer resin; a lower conductive layer, disposed on the support layer and comprising a first metal layer, a second metal layer and a third metal layer stacked in sequence; as well as A display panel is disposed on the lower conductive layer. wherein each of the first metal layer and the third metal layer comprises nickel and vanadium, and Wherein, based on 100 at % of the atomic content of each of the first metal layer and the third metal layer, the atomic content of vanadium is 1 at % to 10 at %.

14. The display device according to claim 13, wherein: The second metal layer includes silver.

15. The display device according to claim 13, wherein: Each of the first metal layer and the third metal layer further includes niobium, tantalum and At least one of .

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