Open type earphone
By partially cutting into multiple chambers in the case of the open headset, and using the Helmholtz resonance effect to absorb resonant sound waves, combined with the application of the damping net in the leak hole, the sound leakage problem of open headsets is solved, ensuring call privacy and taking into account the tone and sound leakage performance, while maintaining the compact appearance and wearable comfort of the headset.
Patent Information
- Application Number
- CN202510177289.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2025-05-27
AI Technical Summary
The existing open headphones have serious sound leakage problems in the acoustic design, which makes it difficult to guarantee the privacy of users' calls. The addition of sound insulation structure to suppress sound leakage will lead to an increase in the size of the headphones, affecting the appearance and wear comfort.
By partially cutting the front cavity and the rear cavity into the headphone housing, and a circuit board is provided in the rear cavity to separate the first rear cavity and the second rear cavity, resonant sound waves are absorbed using the Helmholtz resonance effect to reduce sound leakage. At the same time, a damping net is set in the leak hole to adjust the tone and leak performance.
Effectively suppress sound leakage, ensure call privacy, avoid sound leakage and interference to others, while taking into account the tone and sound leakage resistance, and maintain the compact appearance of the headphones and the user's wear comfort.
Smart Images

Figure CN120050565A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of earphones, and particularly to open earphones. Background Art
[0002] Common earphones on the market currently can be classified according to the way of contacting the human ear into: open earphones, flat non-in-ear earphones, semi-in-ear earphones, in-ear earphones, ear-hugging earphones, and earcup earphones, etc. These earphones have different shapes and have different characteristics in terms of comfort, sound quality, and privacy.
[0003] With the development of products such as smart glasses, AR, and VR, and the current users' requirements for their own ear canal health, hearing protection, and comfort, open earphones are becoming more and more popular among users.
[0004] Due to the acoustic design of open earphones, there is usually a relatively serious sound leakage problem, so that the privacy of users' calls is often not guaranteed; in addition, it will also cause interference to others in relatively quiet places.
[0005] In view of the above problems, current open earphones usually add a sound insulation structure to suppress the sound leakage problem. However, the method of suppressing sound leakage by adding a sound insulation structure will increase the overall volume of the earphone, thus affecting the appearance of the earphone and the comfort of users wearing it; in addition, there are also some that adjust the tone and sound leakage by adjusting the leakage of the front and rear cavities of the open earphone. This method often cannot take into account both the tone and the sound leakage prevention performance, so the existing open earphones all perform poorly in terms of sound leakage prevention performance. Summary of the Invention
[0006] The purpose of the present invention is to provide an open earphone that can suppress sound leakage, take into account both tone and sound leakage prevention performance, and also ensure the small size of the open earphone and the comfort of users wearing it.
[0007] To achieve this purpose, the present invention adopts the following technical solutions:
[0008] An open earphone, comprising:
[0009] A housing, on which a guiding portion for facing the user's ear canal is provided, and sound waves are projected into the ear canal through the guiding portion; the interior of the housing is divided to form a front cavity close to the guiding portion and a rear cavity far from the guiding portion;
[0010] A circuit board, located in the rear cavity and dividing the rear cavity into a first rear cavity and a second rear cavity. The first rear cavity is close to the front cavity. A through hole for communicating the first rear cavity and the second rear cavity is provided on the circuit board, and the through hole and the second rear cavity form a Helmholtz resonance effect to absorb the resonance sound waves generated from the first rear cavity.
[0011] As an alternative to an open - type earphone, a first leakage hole is provided on the housing, the first leakage hole communicates with the first rear cavity, and a damping net is disposed inside the first leakage hole.
[0012] As an alternative to an open - type earphone, the number of the first leakage holes is N, N≥2, and the plurality of first leakage holes are spaced apart from each other.
[0013] As an alternative to an open - type earphone, two first leakage holes are provided on the housing. When the open - type earphone is in a worn state, one of the two first leakage holes is arranged upward and the other is arranged downward.
[0014] As an alternative to an open - type earphone, the housing includes a top wall and a bottom wall, the guiding portion is disposed on the bottom wall, and the first leakage hole is disposed on the top wall.
[0015] As an alternative to an open - type earphone, a second leakage hole is provided on the housing, the second leakage hole communicates with the second rear cavity, and a damping net is disposed inside the second leakage hole.
[0016] As an alternative to an open - type earphone, when the open - type earphone is in a worn state, the second leakage hole faces forward of the user.
[0017] As an alternative to an open - type earphone, the housing includes a top wall and a bottom wall, the guiding portion is disposed on the bottom wall, and the second leakage hole is disposed on the top wall.
[0018] As an alternative to an open - type earphone, the second leakage hole is a strip - shaped hole adapted to the streamline shape of the top wall.
[0019] As an alternative to an open - type earphone, one of the top wall and the bottom wall is provided with a plug - in plate along the edge, and the other is provided with a slot along the edge, and the plug - in plate is inserted into the slot.
[0020] Beneficial effects:
[0021] In the present invention, the space inside the housing is divided into a front cavity and a rear cavity. Further, a circuit board is placed inside the rear cavity, and the rear cavity is further divided to form a first rear cavity and a second rear cavity. Among them, a cylindrical through-hole is provided on the circuit board, so that a Helmholtz resonance cavity can be formed in combination with the second rear cavity, thereby effectively absorbing the resonance sound waves generated from the first rear cavity, thus eliminating the sound leakage peak in a specific frequency band of the rear cavity, reducing the volume of sound leakage, effectively suppressing sound leakage, ensuring the privacy of using this earphone for calls, avoiding sound leakage and disturbing others; at the same time, this earphone can also balance the performance of tone quality and sound leakage prevention; in addition, the first rear cavity and the second rear cavity formed only by dividing the rear cavity by the circuit board do not introduce other active sound insulation or sound cancellation structures, so it is not necessary to increase the thickness and volume of the earphone, thus ensuring the compact appearance of the earphone and the wearing comfort of users. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 FIG. is a schematic structural diagram of a first perspective of an open earphone provided by an embodiment of the present invention;
[0023] Figure 2 FIG. is a schematic structural diagram of a second perspective of an open earphone provided by an embodiment of the present invention;
[0024] Figure 3 FIG. is an exploded view of an open earphone provided by an embodiment of the present invention;
[0025] Figure 4 FIG. is a cross-sectional view of an open earphone provided by an embodiment of the present invention;
[0026] Figure 5 FIG. is a comparative curve graph of the sound intensity vs. the resonant frequency of an open earphone with a second rear cavity added and an open earphone having only a first rear cavity provided by an embodiment of the present invention.
[0027] In the figure:
[0028] 1. Housing; 11. Guide portion; 12. Front cavity; 13. Rear cavity; 131. First rear cavity; 132. Second rear cavity; 14. First leakage hole; 15. Top wall; 151. Insertion plate; 16. Bottom wall; 161. Slot; 17. Second leakage hole;
[0029] 2. Circuit board; 21. Through-hole. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0030] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, rather than all the structures.
[0031] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0032] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.
[0033] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] Please refer to the attached Figure 1 - attached Figure 4 This embodiment relates to an open earphone, which includes a housing 1 and a circuit board 2. Among them, a guiding part 11 for facing the user's ear canal is provided on the housing 1, and sound waves are projected into the ear canal through the guiding part 11; the inside of the housing 1 is divided to form a front cavity 12 close to the guiding part 11 and a rear cavity 13 far from the guiding part 11; the circuit board 2 is located in the rear cavity 13 and divides the rear cavity 13 into a first rear cavity 131 and a second rear cavity 132. The first rear cavity 131 is close to the front cavity 12, and a through hole 21 for communicating the first rear cavity 131 and the second rear cavity 132 is provided on the circuit board 2. The through hole 21 and the second rear cavity 132 form a Helmholtz resonance effect to absorb the resonance sound waves generated from the first rear cavity 131.
[0035] In this embodiment, the housing 1 can be formed by an injection molding process using a non-metallic material. The outer surface of the housing 1 is smooth and presents a streamlined arc-shaped outer wall surface. The housing 1 is a split structure, and the housing 1 includes a top wall 15 and a bottom wall 16. The top wall 15 and the bottom wall 16 are buckled with each other to form an installation space inside the housing 1 for installing various components. The internal components include a speaker, a circuit board 2, etc. The guiding portion 11 is arranged on the sound wave path of the speaker to transmit the sound waves generated by the speaker to the inner part of the user's ear canal, so as to be recognized by the auditory system. The guiding portion 11 is arranged on the bottom wall 16, and the guiding portion 11 includes a sound outlet hole arranged on the bottom wall 16 and a separation net placed inside the sound outlet hole.
[0036] Inside the earphone, the installation space is divided into a front cavity 12 and a rear cavity 13 by the speaker. The front cavity 12 is used to carry and install the basic structures for sound production such as the speaker, and the rear cavity 13 provides a certain resonance space for the earphone to ensure the sound quality. Especially for the low-frequency sound of an open earphone, the structure of the rear cavity 13 will significantly affect the resonance effect. Further, the circuit board 2 is placed inside the rear cavity 13, dividing the rear cavity 13 into two parts, namely a first rear cavity 131 and a second rear cavity 132. A cylindrical through hole 21 is arranged on the circuit board 2, so that a Helmholtz resonance cavity can be formed in combination with the second rear cavity 132. Based on the Helmholtz sound absorption resonance principle, the resonance sound waves generated from the first rear cavity 131 can be effectively absorbed, the leakage sound peak at a specific frequency band of the rear cavity 13 can be eliminated, the volume of the leakage sound can be reduced, and the leakage sound can be effectively suppressed, thereby ensuring the privacy of using this earphone for calls and avoiding sound leakage and disturbing others. Please further refer to the appendix Figure 5 When only the first rear cavity 131 is retained in the earphone, a relatively high leakage sound peak will be formed at 5 - 7 kHz. When the second rear cavity 132 is added, and further combined with the adjustment of damping, the resonance frequency of the second rear cavity 132 can be adjusted to about 6 kHz, so as to specifically absorb the leakage sound peak at 5 - 7 kHz, obtaining a maximum suppression of about 8 dB, ensuring the tone quality and also taking into account the performance of preventing leakage sound. On the other hand, only by dividing the rear cavity 13 by the circuit board 2 to form the first rear cavity 131 and the second rear cavity 132, no other active sound insulation structures or sound absorption structures are introduced. Therefore, it is not necessary to increase the thickness and overall volume of the open earphone, which can further ensure the compact appearance of the earphone and the wearing comfort of the user.
[0037] It should be noted that the contour of the circuit board 2 needs to be adapted to the structure of the installation space of the housing 1. In this embodiment, the edge of the circuit board 2 is in an irregular arc shape.
[0038] Optionally, a first leakage hole 14 is provided on the housing 1. The first leakage hole 14 is communicated with the first rear cavity 131, and a damping net is arranged inside the first leakage hole 14.
[0039] Specifically, the first leakage hole 14 is provided on the top wall 15. By providing the first leakage hole 14 and arranging a damping mesh in the first leakage hole 14, it can be used to adjust the Q value of the frequency response at the user's ear entrance. Exemplarily, by reducing the damping of the first leakage hole 14 and appropriately enhancing the leakage ability of the rear cavity 13, that is, by adjusting the structure and damping value of the first leakage hole 14, the Q value can be maintained at around 0.7, so as to combine the first rear cavity 131 and the first leakage hole 14 to ensure the low-frequency performance of the entire earphone.
[0040] In this embodiment, a damping adjustment member can be placed inside or attached outside the first leakage hole 14 to achieve the adjustment of the damping value. Exemplarily, a corresponding damping mesh is attached to the first leakage hole 14.
[0041] Optionally, the number of the first leakage holes 14 is N, N≥2, and the multiple first leakage holes 14 are arranged at intervals of each other.
[0042] In this embodiment, those skilled in the art can reasonably set the number, shape and size of the first leakage holes 14 according to the low-frequency performance of the open earphone to optimize the tone color. In addition, keeping the multiple first leakage holes 14 spaced apart from each other can prevent the sound waves projected through the first leakage holes 14 from interfering with each other and being weakened in intensity.
[0043] Further, two first leakage holes 14 are provided on the housing 1. When the open earphone is in the wearing state, one of the two first leakage holes 14 is arranged upward and the other is arranged downward.
[0044] In this embodiment, a total of two first leakage holes 14 are provided on the top wall 15, and the two first leakage holes 14 are symmetrically arranged. When the earphone is in the wearing state, one of the two first leakage holes 14 is arranged upward and the other is arranged downward, so as to avoid the horizontal direction, enabling the earphone to avoid leaking high-frequency sound to the crowd to the greatest extent, preventing the high-frequency sound waves from directly passing out along the horizontal path, thereby ensuring the privacy during the use of the earphone and avoiding interference to others.
[0045] Optionally, a second leakage hole 17 is provided on the housing 1, and the second leakage hole 17 communicates with the second rear cavity 132, and a damping mesh is provided inside the second leakage hole 17.
[0046] Specifically, the second leakage hole 17 is also provided on the top wall 15. The second leakage hole 17 combined with the damping mesh of the second leakage hole 17 can realize the adjustment of the absorption frequency and frequency bandwidth of the second rear cavity 132. By appropriately adjusting the damping value of the second leakage hole 17, the absorption frequency and frequency bandwidth of the second rear cavity 132 can be adjusted to enable the earphone to achieve the optimal leakage sound suppression effect.
[0047] Optionally, the second leakage hole 17 is a strip-shaped hole adapted to the streamline shape of the top wall 15.
[0048] In this embodiment, the top wall 15 is a streamline structure, and the second leakage hole 17 is a strip-shaped hole adapted to this streamline structure. Of course, those skilled in the art can optimize the structure and size of the second leakage hole 17 according to the adjustment requirements of the absorption frequency and bandwidth of the second rear cavity 132. Further, the second leakage hole 17 faces the front of the user to avoid the two first leakage holes 14 arranged in the vertical direction as much as possible.
[0049] Optionally, one of the top wall 15 and the bottom wall 16 is provided with a slot 161 along the edge, and the other is provided with a plug 151 along the edge, and the plug 151 is inserted into the slot 161.
[0050] In this embodiment, through the cooperation of the plug 151 and the slot 161, the sealing performance of the earphone housing 1 can be ensured, preventing dust or other impurities from entering the open earphone and affecting the service life of the open earphone. On the other hand, it can also prevent sound from leaking through the gap between the top wall 15 and the bottom wall 16 to a certain extent.
[0051] Further, an anti-static coating is convexly provided on the outer wall of the housing 1, or the housing 1 is made of an anti-static material. The surface of the housing 1 can be made of a material with infiltration or super-infiltration, which is convenient for cleaning and the discharge of sweat. At the same time, by directly manufacturing the housing 1 with an anti-static material or coating an anti-static coating on the housing 1, pollutants can be prevented from adhering to the outer wall of the housing 1, thereby preventing the open earphone from being blocked and ensuring the cleanliness of the open earphone.
[0052] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.
Claims
1. Open-back headphones, characterized in that include: A shell (1), wherein the shell (1) is provided with a guide portion (11) for facing the ear canal of a user, and sound waves are projected into the ear canal through the guide portion (11); the interior of the shell (1) is divided into a front cavity (12) close to the guide portion (11) and a rear cavity (13) away from the guide portion (11); A circuit board (2) is located in the rear cavity (13) and divides the rear cavity (13) into a first rear cavity (131) and a second rear cavity (132), wherein the first rear cavity (131) is close to the front cavity (12), and a through hole (21) is provided on the circuit board (2) for connecting the first rear cavity (131) and the second rear cavity (132), wherein the through hole (21) and the second rear cavity (132) form a Helmholtz resonance effect to absorb the resonant sound waves generated by the first rear cavity (131).
2. The open earphone according to claim 1, characterized in that The housing (1) is provided with a first leakage hole (14), the first leakage hole (14) being in communication with the first rear cavity (131), and a damping net being built into the first leakage hole (14).
3. The open-ear headphone according to claim 2, characterized in that: The number of the first leakage holes (14) is N, where N≥2, and the plurality of first leakage holes (14) are arranged spaced apart from each other.
4. The open earphone according to claim 3, characterized in that The housing (1) is provided with two first leakage holes (14); when the open-type earphone is in a wearing state, one of the two first leakage holes (14) is arranged upwards and the other is arranged downwards.
5. The open earphone according to claim 2, characterized in that: The housing (1) comprises a top wall (15) and a bottom wall (16); the guide portion (11) is arranged on the bottom wall (16); and the first leakage hole (14) is arranged on the top wall (15).
6. The open earphone according to claim 1, characterized in that: The housing (1) is provided with a second leakage hole (17), the second leakage hole (17) being in communication with the second rear cavity (132), and a damping net is built into the second leakage hole (17).
7. The open earphone according to claim 6, characterized in that When the open-type earphone is in a wearing state, the second leakage hole (17) faces the front of the user.
8. The open earphone according to claim 6, characterized in that The housing (1) comprises a top wall (15) and a bottom wall (16); the guide portion (11) is arranged on the bottom wall (16); and the second leakage hole (17) is arranged on the top wall (15).
9. The open earphone according to claim 8, characterized in that The second leakage hole (17) is a strip-shaped hole adapted to the streamline shape of the top wall (15).
10. The open earphone according to any one of claims 5 or 8, characterized in that: One of the top wall (15) and the bottom wall (16) is provided with a slot (161) along the edge, and the other is provided with an inserting plate (151) along the edge, and the inserting plate (151) is inserted into the slot (161).