Earphone ear hook preparation method and OWS ear hook

Abstract

The invention provides an earphone ear hook preparation method and an OWS ear hook, and relates to the technical field of open type wearable stereo headsets. The earphone ear hook preparation method comprises the following steps: respectively forming a first joint and a second joint at two ends of a memory material with a preset radian based on a plastic molding technology to obtain a primary molded part; the core wire sequentially penetrates through the first connector and the second connector in the extending direction of the memory material, and the core wire is attached to the memory material; dispensing glue in the second joint to fix the core wire in the second joint on the inner wall of the second joint to obtain a secondary forming part; coating the memory material and the core wire with silica gel based on a solid / liquid silica gel molding technology to obtain a tertiary molded part; and coating the memory material and the core wire with the silica gel again based on a liquid silica gel molding technology to obtain the earphone ear hook. Therefore, the preparation process of the earphone ear hook (such as an OWS ear hook) is simplified, the manpower, material and time cost is reduced, and the quality of the earphone ear hook is improved.

Description

Technical Field

[0001] The present application relates to the technical field of open wearable stereo headphones, and in particular, to a method for manufacturing a headphone earhook and an OWS earhook. Background Art

[0002] Compared with TWS (True Wireless Stereo) headphones, OWS (Open Wearable Stereo) headphones usually adopt a non-in-ear design, which is more comfortable to wear. Although the sound quality performance is slightly inferior, its open design enables users to naturally perceive the surrounding environment, making it more suitable for scenarios such as leisure entertainment, sports, and fitness. This is why OWS headphones are highly favored by the majority of young people. As one of the core components of OWS headphones, the earhook of OWS headphones (abbreviated as OWS earhook) is closely related to the performance, quality, and production cost of OWS headphones.

[0003] In related technologies, the preparation of OWS earhooks often adopts a post-threading process, that is, a false titanium wire is made in the core wire hole in advance, and the false titanium wire is drawn out after the silicone is formed, and then the core wire is inserted and welded by means of a jig. This preparation scheme has extremely complex later operation processes, and also puts forward more stringent requirements for the fineness of the process. At the same time, the situation of poor welding between the core wire and the main board frequently occurs, resulting in a significant increase in the defective rate of OWS earhooks. Due to the complexity of this process, more human, material, and time costs need to be invested. In addition, the preparation of OWS earhooks can also follow a complete set of process flows including injection molding → cleaning and baking of plastic parts → threading and gluing → applying UV glue → sleeving heat shrinkable tubes and baking → sleeving the first jig → spraying glue and baking → liquid molding → grinding → cleaning glue → initial inspection → first cleaning → first vulcanization → sleeving the second jig → second cleaning → oil spraying → second vulcanization → removing the jig → final inspection. Although this preparation scheme seems complete in terms of process architecture, this preparation scheme not only requires the use of multiple jigs, but also requires multiple times of dispensing and baking irradiation, resulting in abnormal noises when the OWS earhook is bent, and even phenomena such as bulging and wire leakage, reducing the quality of the OWS earhook. Summary of the Invention

[0004] The present application provides a method for manufacturing a headphone earhook and an OWS earhook, aiming to solve the problems of high cost in manufacturing headphone earhooks and poor quality of headphone earhooks in related technologies.

[0005] To solve the above-mentioned drawbacks existing in the related art, the first aspect of the present application provides a method for manufacturing an earhook of an earphone. The method for manufacturing the earhook of the earphone includes: implanting a memory material with a preset curvature into a plastic molding die for plastic molding, so that two ends of the memory material respectively form a hollow first joint and a second joint, obtaining a primary molded part; along the extending direction of the memory material, sequentially passing a core wire through the first joint and the second joint, and making the core wire adhere to the memory material; applying glue at a point inside the second joint to fix the core wire inside the second joint on the inner wall of the second joint, obtaining a secondary molded part; implanting the secondary molded part into a first silicone molding die for solid silicone molding or liquid silicone molding, so that the silicone coats the memory material and the core wire, obtaining a tertiary molded part; implanting the tertiary molded part into a second silicone molding die for liquid silicone molding, and again making the silicone coat the memory material and the core wire, obtaining the earhook of the earphone.

[0006] In some implementation solutions, the step of implanting a memory material with a preset curvature into a plastic molding die for plastic molding includes: implanting a memory material with a preset curvature into the plastic molding die; positioning the memory material by using the plastic molding die; and performing plastic molding by using the plastic molding die. In one or more of the implementation solutions, the step of positioning the memory material by using the plastic molding die includes: first roughly positioning multiple positions on the memory material that are spaced apart from each other by using each first positioning structure inside the plastic molding die, and then precisely positioning the middle part and both ends of the memory material by using each second positioning structure inside the plastic molding die; and precisely positioning the memory material in a direction perpendicular to the parting surface of the plastic molding die by using each third positioning structure inside the plastic molding die.

[0007] In some implementation solutions, the step of implanting a memory material with a preset curvature into a plastic molding die for plastic molding includes: implanting a memory material with a preset curvature into an insert; precisely positioning the memory material by using the insert; implanting the insert into the plastic molding die; precisely positioning the insert by using the plastic molding die; and performing plastic molding by using the plastic molding die.

[0008] In some implementation solutions, the step of applying glue at a point inside the second joint includes: applying glue at a point at one end of the second joint where the core wire passes through.

[0009] In some implementation solutions, the steps of implanting a secondary formed part into a first silicone molding die for solid silicone molding or liquid silicone molding include: implanting the secondary formed part into the first silicone molding die; precisely positioning the secondary formed part by using the first silicone molding die; and performing solid silicone molding or liquid silicone molding by using the first silicone molding die. In one or more of these implementation solutions, the step of precisely positioning the secondary formed part by using the first silicone molding die includes: respectively using two stop surfaces in the first silicone molding die to clamp the side of the second joint facing the first joint and the side of the first joint facing the second joint; and fixing the memory material and the core wire between a plurality of positioning blocks in the first silicone molding die, where the plurality of positioning blocks are spaced apart and staggeredly arranged along the extending direction of the memory material.

[0010] In another one or more of these implementation solutions, the step of precisely positioning the secondary formed part by using the first silicone molding die includes: respectively using two stop surfaces in the first silicone molding die to clamp the side of the second joint facing the first joint and the side of the first joint facing the second joint; and using a plurality of positioning rings spaced apart along the extending direction of the memory material in the first silicone molding die to fix both the memory material and the core wire for each positioning ring. Specifically, when the secondary formed part is inside the first silicone molding die, the core wire is located directly above the memory material, the outer surface of the memory material away from the core wire abuts against the positioning ring, and gaps are formed between the remaining outer surface of the memory material and the outer surface of the core wire and the positioning ring.

[0011] In some implementation solutions, the steps of implanting a tertiary formed part into a second silicone molding die for liquid silicone molding include: clamping the tertiary formed part on a jig; precisely positioning the tertiary formed part by using the jig; implanting the jig into the second silicone molding die; precisely positioning the jig by using the second silicone molding die; and performing liquid silicone molding by using the second silicone molding die. In one or more of these implementation solutions, one end of the first joint through which the core wire penetrates has two first jacks opposite to each other in a preset direction, the preset direction is perpendicular to the extending direction of the memory material, and one end of the second joint through which the core wire exits has two second jacks opposite to each other in the preset direction. Based on this, the step of precisely positioning the tertiary formed part by using the jig includes: sequentially inserting a first positioning post into the two first jacks and fixing it on the jig; and sequentially inserting a second positioning post into the two second jacks and fixing it on the jig.

[0012] In some implementation solutions, before the step of implanting a memory material with a preset curvature into a plastic molding die for plastic molding, it further includes: obtaining a memory material with a preset curvature and detecting the degree of deformation of the memory material; determining whether the degree of deformation of the memory material exceeds a first deformation range; and when the degree of deformation of the memory material exceeds the first deformation range, replacing the memory material until the degree of deformation of the memory material is within the first deformation range.

[0013] In some implementation solutions, before the step of sequentially passing the core wire through the first joint and the second joint, it further includes: detecting the degree of deformation of the one-time formed part; determining whether the degree of deformation of the one-time formed part exceeds the second deformation range; when the degree of deformation of the one-time formed part exceeds the second deformation range, re-preparing the one-time formed part until the degree of deformation of the one-time formed part is within the second deformation range.

[0014] In some implementation solutions, before the step of implanting the three-time formed part into the second silicone molding die for liquid silicone molding, it further includes: detecting the degree of deformation of the three-time formed part; determining whether the degree of deformation of the three-time formed part exceeds the third deformation range; when the degree of deformation of the three-time formed part exceeds the third deformation range, re-preparing the three-time formed part until the degree of deformation of the three-time formed part is within the third deformation range.

[0015] The second aspect of the present application provides an OWS earhook, which is prepared by the earhook preparation method provided in the first aspect of the present application. The OWS earhook includes a memory material and a core wire. Hollow first joints and second joints are respectively formed at opposite ends of the memory material. The core wire sequentially passes through the first joint and the second joint along the extension direction of the memory material. The core wire is in contact with the memory material. Both the core wire and the memory material have a preset curvature. The core wire in the second joint is fixed to the inner wall of the second joint. The outer surfaces of the core wire and the memory material are coated with a silicone layer.

[0016] For the earhook preparation method provided in the first aspect of the present application, its process is as follows: implanting a memory material with a preset curvature into a plastic molding die for plastic molding, so that hollow first joints and second joints are respectively formed at both ends of the memory material to obtain a one-time formed part; along the extension direction of the memory material, sequentially passing the core wire through the first joint and the second joint and making the core wire in contact with the memory material; applying glue in the second joint to fix the core wire in the second joint to the inner wall of the second joint to obtain a two-time formed part; implanting the two-time formed part into the first silicone molding die for solid silicone molding or liquid silicone molding, so that the silicone coats the memory material and the core wire and correspondingly forms a silicone layer to obtain a three-time formed part; implanting the three-time formed part into the second silicone molding die for liquid silicone molding to coat the memory material and the core wire with silicone again (i.e., thickening the silicone layer) to obtain an earhook. It can be seen that in the process of preparing the earhook of the present application, on the one hand, there is no need to make a false memory material like in the traditional solution, simplifying the preparation process of the earhook, reducing the input of manpower, material resources and time costs, and on the other hand, there is no need to perform multiple glue application and baking irradiation like in the traditional solution, reducing the use of jigs, avoiding abnormal sounds, bulges and wire leakage when the earhook is bent, and ultimately improving the quality of the earhook.

[0017] Regarding the OWS ear hook provided in the second aspect of the present application, since the OWS ear hook is prepared by the ear hook preparation method provided in the first aspect of the present application, the OWS ear hook has all the advantages of the ear hook preparation method provided in the first aspect of the present application. Description of the Drawings

[0018] In order to more clearly illustrate the related art or the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required to be used in the description of the related art or the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application, rather than all embodiments. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0019] Figure 1 Flow chart of the ear hook preparation method provided in the embodiment of the present application;

[0020] Figure 2 Structure diagram of the memory material provided in the embodiment of the present application;

[0021] Figure 3 Structure diagram of the one-time formed part provided in the embodiment of the present application;

[0022] Figure 4 Structure diagram of the secondary formed part from one perspective provided in the embodiment of the present application;

[0023] Figure 5 Structure diagram of the secondary formed part from another perspective provided in the embodiment of the present application;

[0024] Figure 6 Structure diagram of the tertiary formed part provided in the embodiment of the present application;

[0025] Figure 7 Structure diagram of the ear hook provided in the embodiment of the present application;

[0026] Figure 8 Exploded view of the OWS ear hook provided in the embodiment of the present application.

[0027] The labels in each of the above drawings represent: 1 - memory material, 2 - first connector, 3 - second connector, 4 - core wire, 5 - silicone layer, 21 - first jack, 31 - second jack. Detailed Embodiments

[0028] In the related art, the preparation of OWS earhooks often adopts the process of threading from the back, that is, a dummy titanium wire is pre-made in the core wire hole, and the dummy titanium wire is drawn out after the silicone is formed. Then, the core wire is inserted and welded with the aid of a jig. The later operation process of this preparation scheme is extremely complicated, requiring more manpower, material resources and time costs, and also putting forward more stringent requirements for the fineness of the process. At the same time, the situation of poor welding between the core wire and the main board frequently occurs, resulting in a significant increase in the defective rate of OWS earhooks; in addition, the preparation of OWS earhooks can also follow the whole set of process flows of injection molding → plastic part cleaning and baking → wire installation and gluing → UV glue coating → heat shrinkable tube sleeving and baking → first jig sleeving → glue spraying and baking → liquid molding → grinding → glue cleaning → initial inspection → first cleaning → first vulcanization → second jig sleeving → second cleaning → oil spraying → second vulcanization → jig removal → final inspection. Although this preparation scheme seems complete in terms of process structure, it not only requires the use of multiple jigs, but also requires multiple glue dispensing and baking irradiations, resulting in abnormal noises when the OWS earhooks are bent, and even there are phenomena such as bulging and wire leakage, seriously reducing the quality of OWS earhooks. In view of this, the present application proposes a method for preparing a headphone earhook and an OWS earhook in the following embodiments to solve the above-mentioned drawbacks existing in the related art.

[0029] In order to make the purpose, technical solution and advantages of the present application more obvious and understandable, the present application will be clearly and completely described below in conjunction with the embodiments of the present application and the corresponding drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. It should be understood that the various embodiments of the present application described below are only used to explain the present application, and are not used to limit the present application. That is, based on the various embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present application. In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0030] Please refer to Figure 1 , Figure 1 is a schematic flow chart of a method for preparing a headphone earhook. The present embodiment provides a method for preparing a headphone earhook, which is used to prepare earhooks such as OWS headphones. The method for preparing the headphone earhook includes the following steps 101 to 104 (abbreviated as S101 to S104).

[0031] S101, implant a memory material with a preset curvature into a plastic molding die for plastic molding, so that both ends of the memory material respectively form a hollow first joint and a second joint, and obtain a first molded part.

[0032] In some embodiments, when preparing earhooks such as OWS headphones, first obtain a memory material 1 with a preset curvature (such asFigure 2 as shown), and then implant the memory material 1 into the plastic molding die, so as to perform plastic molding using the plastic molding die, and then form a hollow first joint 2 and a second joint 3 (both made of plastic) at the opposite ends of the memory material 1 respectively, thus obtaining a one-time molded part (such as Figure 3 as shown); among them, for the injection of plastic during the plastic molding process, the injection direction should be parallel to the extension direction of the memory material 1 to avoid deflecting the memory material 1 and thus affecting the quality of plastic molding. It should be noted that the memory material 1 has a preset arc-shaped bend because this part needs to be used as the earhook of the earphone to facilitate the user's wearing. It should also be noted that both the first joint 2 and the second joint 3 are hollow, which means that both the first joint 2 and the second joint 3 have a channel that runs through from one end to the other. On the one hand, this channel is used to accommodate and fix the ends of the memory material 1, and on the other hand, it facilitates the passing of the core wire 4 in S102 later. In addition, the memory material 1 can be any metal wire with shape memory function in the field and suitable for OWS earhooks, such as memory titanium wire, nickel-titanium alloy wire, copper-based memory alloy wire, iron-based memory alloy wire, etc. And which memory material 1 is specifically used when preparing the earhook of the earphone is selected according to actual needs, and the present application does not make a unique limitation on this.

[0033] As one of the embodiments, before implanting the memory material 1 with a preset arc into the plastic molding die for plastic molding, the deformation degree of the memory material 1 can also be detected, and it is judged whether the deformation degree of the memory material 1 exceeds the first deformation degree range (such as 0.2 - 0.3 mm). When the deformation degree of the memory material 1 exceeds the first deformation degree range, it indicates that the memory material 1 is unqualified, then the memory material 1 needs to be replaced until the deformation degree of the memory material 1 is within the first deformation degree range, and then the memory material 1 with qualified deformation degree detection is implanted into the plastic molding die for plastic molding, so as to ensure the quality of plastic molding.

[0034] As one of the embodiments, the process of implanting the memory material 1 with a preset arc into the plastic molding die for plastic molding in S101 is: implant the memory material 1 with a preset arc into the plastic molding die; use the plastic molding die to position the memory material 1 so that the memory material 1 remains stationary in the plastic molding die; use the plastic molding die to perform plastic molding. It can be understood that before using the plastic molding die to perform plastic molding, it is necessary to first use the plastic molding die to position the memory material 1 so that the memory material 1 remains stationary in the plastic molding die, so as to ensure that during the entire plastic molding process, the position of the memory material 1 in the plastic molding die remains unchanged, and at the same time, the memory material 1 always maintains a preset arc-shaped bend, thereby realizing high-quality plastic molding.

[0035] In some implementation manners of this embodiment, the process of positioning the memory material 1 by using a plastic molding die is as follows: First, use each first positioning structure in the plastic molding die to roughly position multiple positions on the memory material 1 that are spaced apart from each other, and then use each second positioning structure in the plastic molding die to precisely position the middle part and both ends of the memory material 1; use each third positioning structure in the plastic molding die to precisely position the memory material 1 in the direction perpendicular to the parting surface of the plastic molding die (which can also be referred to as the z-direction). It can be understood that when using the plastic molding die to position the memory material 1, it is necessary to first use each first positioning structure to roughly position multiple positions on the memory material 1 that are spaced apart from each other. This is only a preliminary positioning, and then use each second positioning structure to precisely position the middle part of the memory material 1 (such as Figure 3 at location A in Figure 3 and both ends (such as at locations B and C in

[0036] ), and finally use each third positioning structure to precisely position the memory material 1 in the z-direction to prevent the memory material 1 from shifting in the z-direction and ensure that the curvature of the memory material 1 remains unchanged after plastic molding; in this way, a full-range restriction on the memory material 1 can be achieved, ensuring that it is fixed in the plastic molding die. Preferably, the precise positioning of the middle part and both ends of the memory material 1 can be: precisely position the exact middle (or near it) of the memory material 1 and the one-tenth positions (or near them) at both ends.

[0037] As another embodiment, the process of implanting the memory material 1 with a preset curvature into the plastic molding die for plastic molding in S101 includes: implanting the memory material 1 with a preset curvature into the insert, and using the insert to precisely position the memory material 1 so that the memory material 1 is fixed in the insert; implanting the insert into the plastic molding die; using the plastic molding die to precisely position the insert so that the insert is fixed in the plastic molding die; and using the plastic molding die for plastic molding. It can be understood that compared with the previous embodiment, in this embodiment, when performing plastic molding, the memory material 1 is not directly implanted into the plastic molding die. Instead, the memory material 1 is first implanted into the insert and the insert is used to precisely position the memory material 1 so that the memory material 1 is fixed in the insert. Then, the insert is implanted into the plastic molding die and the plastic molding die is used to precisely position the insert so that the insert is fixed in the plastic molding die. Finally, the plastic molding die is used for plastic molding to obtain a one-time molded part, which can also achieve the same high-quality plastic molding as the previous embodiment. In addition, it should be noted that in actual applications, for the process of preparing a one-time molded part, whether to use the plastic molding method of the previous embodiment or the plastic molding method of this embodiment is selected according to actual needs, and the present application does not make a unique limitation on this.

[0037] S102. Along the extending direction of the memory material, thread the core wire through the first joint and the second joint in sequence and make the core wire adhere to the memory material. Then, apply glue inside the second joint to fix the core wire inside the second joint to the inner wall of the second joint, obtaining a secondary formed part.

[0038] In some embodiments, after obtaining the primary formed part through S101, first thread the core wire 4 through the first joint 2 and the second joint 3 in sequence along the extending direction of the memory material 1, and make the core wire 4 adhere to the memory material 1. In this case, the core wire 4 and the memory material 1 have the same extending direction and both present a bend with a preset curvature. Then, apply glue inside the second joint 3 to fix the core wire 4 inside the second joint 3 to the inner wall of the second joint 3. In this way, a secondary formed part can be obtained (as shown in Figure 4 and Figure 5 ). It should be noted that the core wire 4 and the memory material 1 have the same extending direction and both present a bend with a preset curvature because this part needs to be used as the earhook of the earphone to facilitate the user to wear. It should also be noted that the process of threading the core wire 4 through the first joint 2 and the second joint 3 in sequence along the extending direction of the memory material 1 includes: threading the core wire 4 into the first joint 2 from the far wire end (referring to the end farther from the memory material 1) of the first joint 2 → threading the core wire 4 out from the near wire end (referring to the end closer to the memory material 1) of the first joint 2 → extending the core wire 4 along the memory material 1 to the near wire end of the second joint 3 → threading the core wire 4 into the second joint 3 from the near wire end of the second joint 3 → threading the core wire 4 out from the far wire end of the second joint 3. Preferably, the position where glue is applied in S102 is the end of the second joint 3 where the core wire 4 is threaded in, that is, the position near the near wire end inside the second joint 3 (such as the D position in Figure 5 ). In addition, in practical applications, it is also feasible to thread the core wire 4 through the second joint 3 and the first joint 2 in sequence along the extending direction of the memory material 1, and the present application does not make a unique limitation on this.

[0039] As one of the embodiments, before threading the core wire 4 through the first joint 2 and the second joint 3 in sequence, the deformation degree of the primary formed part can also be detected, and it is judged whether the deformation degree of the primary formed part exceeds the second deformation degree range (such as 0.2 - 0.3 mm). When the deformation degree of the primary formed part exceeds the second deformation degree range, it indicates that the primary formed part is unqualified, and then the primary formed part needs to be prepared again until the deformation degree of the primary formed part is within the second deformation degree range, and then threading (that is, threading the core wire 4 through the first joint 2 and the second joint 3 in sequence) is carried out on the primary formed part with qualified deformation degree detection.

[0040] S103. Implant the secondary formed part into the first silicone molding die for solid silicone molding or liquid silicone molding, so that the silicone coats the memory material and the core wire, obtaining a tertiary formed part.

[0041] In some embodiments, after obtaining the secondary formed part through S102, the secondary formed part is implanted into the first silicone molding die, so as to perform solid silicone molding or liquid silicone molding by using the first silicone molding die, and further make the silicone coat the memory material 1 and the core wire 4 and correspondingly form a silicone layer 5, thus obtaining a tertiary formed part (such as Figure 6 as shown). It should be noted that although the formation of the silicone layer 5 can be achieved by either solid silicone molding or liquid silicone molding, solid silicone molding is preferably used because, compared with liquid silicone molding, solid silicone molding has higher efficiency, more cavities, and lower cost. It should also be noted that the purpose of S103 is to coat a relatively thin silicone layer 5 on the outer surfaces of the memory material 1 and the core wire 4, so as to position the positional accuracy of the core wire 4 and the memory material 1 and ensure no deviation. Exemplarily, the thickness of the silicone coated on the outer surface of the memory material 1 is 0.1 mm, the thickness of the silicone coated on the outer surface of the core wire 4 away from the memory material 1 is 0.05 mm, and the thickness of the silicone coated on the remaining outer surface of the core wire 4 is 0.2 mm; it can be understood that 0.1 mm, 0.05 mm, 0.2 mm, etc. are only examples given in this application, and the specific thickness values can be set according to actual requirements, and this application does not make a unique limitation thereto. In addition, when performing solid / liquid silicone molding by using the first silicone molding die, the first silicone molding die can obtain multiple tertiary formed parts in one solid / liquid silicone molding, such as 1 out of 8 (i.e., obtaining 8 tertiary formed parts in one solid / liquid silicone molding), 1 out of 16 (i.e., obtaining 16 tertiary formed parts in one solid / liquid silicone molding), etc.

[0042] As one of the embodiments, the process of implanting the secondary formed part into the first silicone molding die for solid silicone molding or liquid silicone molding in S103 includes: implanting the secondary formed part into the first silicone molding die; using the first silicone molding die to perform precise positioning on the secondary formed part so that the secondary formed part remains stationary within the first silicone molding die; and using the first silicone molding die to perform solid silicone molding or liquid silicone molding. It can be understood that before performing solid silicone molding or liquid silicone molding by using the first silicone molding die, it is necessary to first use the first silicone molding die to perform precise positioning on the secondary formed part so that the secondary formed part remains stationary inside the first silicone molding die, thereby ensuring that during the entire solid silicone molding or liquid silicone molding process, the position of the secondary formed part within the first silicone molding die remains unchanged, and at the same time, the memory material 1 and the core wire 4 always maintain a curved shape with a preset curvature, and further realizing high-quality solid silicone molding or liquid silicone molding.

[0043] In some implementation manners of this embodiment, the process of precisely positioning the secondary formed part by using the first silicone molding die includes: respectively using two positioning surfaces in the first silicone molding die to tightly hold one side of the second joint 3 facing the first joint 2 and one side of the first joint 2 facing the second joint 3; using a plurality of positioning rings spaced along the extension direction of the memory material 1 in the first silicone molding die, so that each positioning ring simultaneously fixes the memory material 1 and the core wire 4. It can be understood that when precisely positioning the secondary formed part by using the first silicone molding die, it is necessary to first use two positioning surfaces to tightly hold one side of the second joint 3 facing the first joint 2 and one side of the first joint 2 facing the second joint 3, and then use a plurality of positioning rings spaced along the extension direction of the memory material 1, and make each positioning ring simultaneously sleeve the memory material 1 and the core wire 4, so as to ensure the deformation degree of the product; in this way, it is possible to achieve a full range of restrictions on the secondary formed part, ensure that it is fixed in the first silicone molding die, and improve the quality of solid silicone molding or liquid silicone molding by using the first silicone molding die.

[0044] Specifically, when the secondary formed part is in the first silicone molding die, through the two positioning surfaces and the plurality of positioning rings in the first silicone molding die, a full range of restrictions on the secondary formed part can be achieved. The purpose is to ensure that the core wire 4 is always directly above the memory material 1 without deviation and is consistent with the overall shape of the product, and to ensure that there is no wire leakage in the subsequent second silicone molding (i.e., S104) on the premise that the secondary formed part in the first silicone molding die is fixed; moreover, the outer surface of the memory material 1 away from the core wire 4 abuts against the positioning ring, and gaps are formed between the remaining outer surface of the memory material 1 and the outer surface of the core wire 4 and the positioning ring. Exemplarily, the distance between the outer surface of the core wire 4 away from the memory material 1 and the positioning ring is 0.05 mm, the distance between the remaining outer surface of the core wire 4 and the positioning ring is 0.03 mm, and the distance between the remaining outer surface of the memory material 1 and the positioning ring except for the outer surface of the memory material 1 away from the core wire 4 is also 0.03 mm. It can be understood that 0.05 mm, 0.03 mm, etc. are only examples given in this application, and the specific distance values can be set according to actual needs, and this application does not make a unique limitation on this.

[0045] Of course, the structure for precisely positioning the secondary formed part in the first silicone molding die is not limited to a plurality of positioning rings. In other implementation manners of this embodiment, the plurality of positioning rings can be replaced with a plurality of positioning blocks that are spaced apart and staggeredly arranged along the extending direction of the memory material 1. That is to say, the process of precisely positioning the secondary formed part by using the first silicone molding die includes: respectively using two stop surfaces in the first silicone molding die to clamp the side of the second joint 3 facing the first joint 2 and the side of the first joint 2 facing the second joint 3; fixing the memory material 1 and the core wire 4 between the plurality of positioning blocks in the first silicone molding die. In addition, it should be noted that in actual applications, whether to use positioning rings or positioning blocks for the structure of precisely positioning the secondary formed part in the first silicone molding die is selected according to actual needs, and the present application does not make a unique limitation on this.

[0046] S104, implant the tertiary formed part into the second silicone molding die for liquid silicone molding, and again make the silicone coat the memory material and the core wire to obtain the earphone earhook.

[0047] In some embodiments, after obtaining the tertiary formed part through S103, it is also necessary to implant the tertiary formed part into the second silicone molding die, so as to use the second silicone molding die for liquid silicone molding, thereby increasing the thickness of the silicone layer 5. That is to say, continue to coat the silicone on the outer surface of the silicone layer 5, and thus the earphone earhook can be obtained (as Figure 7 shown). It should be noted that when using the second silicone molding die for liquid silicone molding, the second silicone molding die can obtain a plurality of earphone earhooks in one liquid silicone molding, such as 1 out of 4 (that is, obtaining 4 earphone earhooks in one liquid silicone molding), 1 out of 8 (that is, obtaining 8 earphone earhooks in one liquid silicone molding), etc.

[0048] As one of the embodiments, before implanting the tertiary formed part into the second silicone molding die, the deformation degree of the tertiary formed part can also be detected, and it is judged whether the deformation degree of the tertiary formed part exceeds the third deformation degree range (such as 0.2 - 0.3 mm). When the deformation degree of the tertiary formed part exceeds the third deformation degree range, it indicates that the tertiary formed part is unqualified, and then the tertiary formed part needs to be prepared again until the deformation degree of the tertiary formed part is within the third deformation degree range, and then implant the tertiary formed part with qualified deformation degree detection into the second silicone molding die for liquid silicone molding to ensure the quality of the liquid silicone molding.

[0049] As one of the embodiments, the process of implanting the triple-formed part into the second silicone molding die for liquid silicone molding in S104 is as follows: Clamp the triple-formed part on the fixture, and use the fixture to precisely position the triple-formed part so that the triple-formed part is fixed on the fixture without moving; implant the fixture into the second silicone molding die, and use the second silicone molding die to precisely position the fixture so that the fixture is fixed within the second silicone molding die without moving; use the second silicone molding die to perform liquid silicone molding. It can be understood that before using the second silicone molding die to perform liquid silicone molding, it is necessary to first clamp the triple-formed part on the fixture and use the fixture to precisely position the triple-formed part so that the triple-formed part is fixed on the fixture without moving, and then implant the fixture into the second silicone molding die and use the second silicone molding die to precisely position the fixture so that the fixture is fixed within the second silicone molding die without moving, thereby ensuring that during the entire liquid silicone molding process, the position of the triple-formed part within the second silicone molding die remains unchanged all the time, and at the same time, the memory material 1 and the core wire 4 always maintain a bend with a preset curvature, and further realizing high-quality liquid silicone molding and ensuring the quality of the finally prepared earphone earhook.

[0050] In some implementation manners of this embodiment, one end of the first joint 2 for the core wire 4 to pass through (i.e., the far wire end) has two first jacks 21 opposite to each other in a preset direction, and one end of the second joint 3 for the core wire 4 to pass out (i.e., the far wire end) has two second jacks 31 opposite to each other in the preset direction, and this preset direction is perpendicular to the extending direction of the memory material 1. Based on this, the process of using the fixture to precisely position the triple-formed part includes: sequentially inserting the first positioning posts into the two first jacks 21 and fixing them on the fixture, and sequentially inserting the second positioning posts into the two second jacks 31 and fixing them on the fixture. It can be understood that when using the fixture to precisely position the triple-formed part, it is necessary to first sequentially insert the first positioning posts into the two first jacks 21 at the far wire end of the first joint 2 and fix the first positioning posts on the fixture, and then sequentially insert the second positioning posts into the two second jacks 31 at the far wire end of the second joint 3 and fix the second positioning posts on the fixture, so as to achieve all-round restriction of the triple-formed part and ensure that it is fixed on the fixture without moving, and improve the quality of subsequent liquid silicone molding using the second silicone molding die.

[0051] As can be seen from the above, the preparation of the earhook of the earphone (such as the OWS earhook) can be achieved through S101 to S104. For this preparation process, on the one hand, there is no need to make false memory materials as in the traditional solution, which simplifies the preparation process of the earhook of the earphone, reduces the input of manpower, material resources and time costs. On the other hand, there is no need to perform multiple dispensing and baking irradiation as in the traditional solution, avoiding excessive glue allergen testing, reducing the use of jigs, preventing abnormal noises, bulges and wire leakage when the earhook of the earphone is bent, and ultimately improving the quality of the earhook of the earphone. In addition, the earhook of the earphone in this application has a simple molding, is very suitable for mass production, and has higher efficiency and better stability compared with the traditional solution.

[0052] Please refer to Figure 7 and Figure 8 , Figure 7 which is a schematic structural diagram of the earhook of the earphone, Figure 8 and which is an exploded schematic diagram of the OWS earhook. This embodiment provides an OWS earhook, which is prepared by the earhook preparation method described above, and includes a memory material 1 and a core wire 4. Hollow first connectors 2 and second connectors 3 are respectively formed at both ends of the memory material 1. The core wire 4 sequentially passes through the first connector 2 and the second connector 3 along the extending direction of the memory material 1. The core wire 4 is attached to the memory material 1. Both the core wire 4 and the memory material 1 have a preset curvature. The core wire 4 in the second connector 3 is fixed to the inner wall of the second connector 3. A silicone layer 5 is coated on the outer surfaces of the core wire 4 and the memory material 1.

[0053] In actual applications, the OWS earhook of this embodiment can be used to assemble an OWS earphone. Specifically, the OWS earphone includes a front shell, a rear shell and the OWS earhook of this embodiment. The front shell is provided on and communicates with the first connector 2. The rear shell is provided on and communicates with the second connector 3. A PCB (i.e., printed circuit board), an FPC (i.e., flexible printed circuit), a microphone, a sensor, a sound generating unit, etc. are provided in the front shell. A battery is provided in the rear shell. One end of the core wire 4 is electrically connected to the battery, and the other end is electrically connected to the PCB, that is, an electrical connection between the battery and the PCB is established through the core wire 4. The PCB is electrically connected to the FPC. As for the microphone, sensor, sound generating unit, etc. in the front shell, they can be directly electrically connected to the PCB or indirectly electrically connected to the PCB through the FPC. It should be noted that since the technology of OWS earphones in this field is relatively mature, this embodiment will not elaborate on OWS earphones too much.

[0054] The above embodiments are only the preferred implementations of the present application, and they are not the only limitations on the preparation method of the earphone earhook and the OWS earhook. In this regard, those skilled in the art can flexibly set according to the actual application scenarios on the basis of the above embodiments. It can be understood that through the implementation of the above embodiments of the present application, the earphone earhook can be prepared through the following process (taking the OWS earhook as an example): implant the memory material 1 with a preset radian into the plastic molding die, so as to perform plastic molding by using the plastic molding die, and form a hollow first joint 2 and a second joint 3 at both ends of the memory material 1 respectively to obtain a primary molded part; along the extension direction of the memory material 1, pass the core wire 4 through the first joint 2 and the second joint 3 in sequence, and make the core wire 4 adhere to the memory material 1; apply glue in the second joint 3 to fix the core wire 4 in the second joint 3 on the inner wall of the second joint 3 to obtain a secondary molded part; implant the secondary molded part into the first silicone molding die, and perform solid / liquid silicone molding through the first silicone molding die to coat the memory material 1 and the core wire 4 with silicone and form a silicone layer 5 accordingly to obtain a tertiary molded part; implant the tertiary molded part into the second silicone molding die, and perform liquid silicone molding by using the second silicone molding die to thicken the silicone layer 5 to obtain the OWS earhook. It can be seen that in the process of preparing the OWS earhook in the present application, on the one hand, there is no need to make fake memory materials as in the traditional solution, which simplifies the preparation process of the OWS earhook, reduces the input of manpower, material resources and time costs. On the other hand, there is no need to perform multiple glue application and baking irradiation as in the traditional solution, reduces the use of jigs, and avoids abnormal sounds, bulges and wire leakage when the OWS earhook is bent, and finally improves the quality of the OWS earhook.

[0055] It should be noted that several embodiments shown above in the present application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the various embodiments, reference can be made to each other. It should also be noted that in the text description of the present application, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is such an actual relationship or order between these entities or operations. Further, the terms "comprising", "including" or any other corresponding variants are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes these elements, but may also include other elements not expressly listed, or may also include elements inherent to this process, method, article or device; and, without more limitations, the element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article or device including the said element.

[0056] In addition, by implementing several embodiments shown above in the present application, those skilled in the art can implement or use the present application. For the several embodiments shown above in the present application, various modifications will be obvious to those skilled in the art. The general principles defined in the present application can be implemented in other embodiments not shown without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the several embodiments shown above, but rather will conform to the broadest scope consistent with the principles and novel features disclosed in the present application.

Claims

1. A method for preparing an earphone ear hook, characterized in that: include: Implanting a memory material with a preset curvature into a plastic molding mold for plastic molding, so that two ends of the memory material form a hollow first joint and a second joint, respectively, to obtain a primary molded part; Along the extension direction of the memory material, the core wire is passed through the first joint and the second joint in sequence, and the core wire is attached to the memory material; Dispensing glue in the second joint to fix the core wire in the second joint to the inner wall of the second joint to obtain a secondary molded part; Implanting the secondary molded part into a first silicone molding mold for solid silicone molding or liquid silicone molding, so that the silicone covers the memory material and the core wire to obtain a tertiary molded part; The tertiary molded part is implanted into a second silicone molding mold for liquid silicone molding, and the silicone is again used to cover the memory material and the core wire to obtain an earphone ear hook.

2. The method for preparing an earphone ear hook according to claim 1, characterized in that: The step of implanting the memory material with a preset curvature into a plastic molding mold for plastic molding comprises: Implanting memory material with a preset curvature into a plastic molding mold; Positioning the memory material using the plastic molding die; The plastic molding die is used to perform plastic molding.

3. The method for preparing an earphone ear hook according to claim 2, characterized in that: The step of positioning the memory material by using the plastic molding mold includes: Firstly, the first positioning structures in the plastic molding die are used to roughly position a plurality of mutually spaced positions on the memory material, and then the second positioning structures in the plastic molding die are used to precisely position the middle and both ends of the memory material; The memory material is precisely positioned in a direction perpendicular to the parting surface of the plastic molding mold by using the third positioning structures in the plastic molding mold.

4. The method for preparing an earphone ear hook according to claim 1, characterized in that: The step of implanting the memory material with a preset curvature into a plastic molding mold for plastic molding comprises: Implanting memory material with a preset curvature into the insert; Using the insert to precisely position the memory material; implanting the insert into a plastic molding mold; Using the plastic molding die to precisely position the insert; The plastic molding die is used to perform plastic molding.

5. The method for preparing an earphone ear hook according to claim 1, characterized in that: The step of dispensing glue in the second joint includes: An end glue for the core wire to pass through is provided in the second joint.

6. The method for preparing an earphone ear hook according to claim 1, characterized in that: The step of implanting the secondary molded part into a first silicone molding mold for solid silicone molding or liquid silicone molding comprises: implanting the secondary molded part into a first silicone molding mold; Using the first silicone molding mold to precisely position the secondary molded part; The first silicone molding mold is used to perform solid silicone molding or liquid silicone molding.

7. The method for preparing an earphone ear hook according to claim 6, characterized in that: The step of precisely positioning the secondary molded part by using the first silicone molding mold comprises: Using two stoppers in the first silicone molding mold to tighten the side of the second joint facing the first joint and the side of the first joint facing the second joint respectively; The memory material and the core wire are fixed between a plurality of positioning blocks in the first silicone molding mold, and the plurality of positioning blocks are distributed at intervals and staggered along the extension direction of the memory material.

8. The method for preparing an earphone ear hook according to claim 6, characterized in that: The step of precisely positioning the secondary molded part by using the first silicone molding mold comprises: Using two stoppers in the first silicone molding mold to tighten the side of the second joint facing the first joint and the side of the first joint facing the second joint respectively; By utilizing a plurality of positioning rings spaced apart and distributed along the extending direction of the memory material in the first silicone molding mold, each positioning ring can simultaneously fix the memory material and the core wire.

9. The method for preparing an earphone ear hook according to claim 8, characterized in that: In the first silicone molding mold, the core wire is located directly above the memory material, the outer surface of the memory material away from the core wire abuts against the positioning ring, and the remaining outer surface of the memory material and the outer surface of the core wire form a gap with the positioning ring.

10. The method for preparing an earphone ear hook according to claim 1, characterized in that: The step of implanting the tertiary molded part into a second silicone molding mold for liquid silicone molding comprises: Clamping the three-stage molded part on a fixture; Using the jig to precisely position the tertiary molded part; implanting the jig into a second silicone molding mold; Using the second silicone molding mold to precisely position the jig; The second silicone molding mold is used to perform liquid silicone molding.

11. The method for preparing an earphone ear hook according to claim 10, characterized in that: The end of the first joint for the core wire to pass through has two first plug holes opposite to each other in a preset direction, and the preset direction is perpendicular to the extension direction of the memory material, and the end of the second joint for the core wire to pass through has two second plug holes opposite to each other in the preset direction; The step of using the jig to precisely position the three-dimensional molded part includes: Inserting the first positioning column into the two first insertion holes in sequence and fixing them on the fixture; Insert the second positioning column into the two second insertion holes in sequence and fix them on the fixture.

12. The method for preparing an earphone ear hook according to claim 1, characterized in that: Before the step of implanting the memory material with a preset curvature into the plastic molding mold for plastic molding, the method further includes: Obtaining a memory material with a preset curvature, and detecting the deformation degree of the memory material; Determining whether the deformation degree of the memory material exceeds a first deformation degree range; When the deformation degree of the memory material exceeds the first deformation degree range, the memory material is replaced until the deformation degree of the memory material is within the first deformation degree range.

13. The method for preparing an earphone ear hook according to claim 1, characterized in that: Before the step of sequentially passing the core wire through the first joint and the second joint, the method further includes: detecting a degree of deformation of the primary molded part; Determining whether the deformation degree of the primary molded part exceeds a second deformation degree range; When the deformation degree of the primary molded part exceeds the second deformation degree range, the primary molded part is re-prepared until the deformation degree of the primary molded part is within the second deformation degree range.

14. The method for preparing an earphone ear hook according to claim 1, characterized in that: Before the step of implanting the tertiary molded part into the second silicone molding mold for liquid silicone molding, the method further includes: Detecting the deformation degree of the three-molded parts; Determining whether the deformation degree of the tertiary molded part exceeds a third deformation degree range; When the degree of deformation of the tertiary molded part exceeds the third range of deformation, the tertiary molded part is re-prepared until the degree of deformation of the tertiary molded part is within the third range of deformation.

15. An OWS ear hook, characterized in that: The OWS ear hook is prepared by the earphone ear hook preparation method according to any one of claims 1 to 14, and the OWS ear hook includes a memory material and a core wire, and a hollow first joint and a second joint are formed at both ends of the memory material, respectively. The core wire passes through the first joint and the second joint in sequence along the extension direction of the memory material, and the core wire is attached to the memory material, and both the core wire and the memory material have a preset curvature. The core wire in the second joint is fixed on the inner wall of the second joint, and the outer surfaces of the core wire and the memory material are covered with a silicone layer.

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